US20110024773A1 - Light emitting diode package structure and lead frame structure thereof - Google Patents
Light emitting diode package structure and lead frame structure thereof Download PDFInfo
- Publication number
- US20110024773A1 US20110024773A1 US12/606,182 US60618209A US2011024773A1 US 20110024773 A1 US20110024773 A1 US 20110024773A1 US 60618209 A US60618209 A US 60618209A US 2011024773 A1 US2011024773 A1 US 2011024773A1
- Authority
- US
- United States
- Prior art keywords
- cavity
- led
- package structure
- pins
- bonding pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000565 sealant Substances 0.000 claims description 23
- 230000001174 ascending effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000004954 Polyphthalamide Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 101001126084 Homo sapiens Piwi-like protein 2 Proteins 0.000 description 1
- 102100029365 Piwi-like protein 2 Human genes 0.000 description 1
- GYMWQLRSSDFGEQ-ADRAWKNSSA-N [(3e,8r,9s,10r,13s,14s,17r)-13-ethyl-17-ethynyl-3-hydroxyimino-1,2,6,7,8,9,10,11,12,14,15,16-dodecahydrocyclopenta[a]phenanthren-17-yl] acetate;(8r,9s,13s,14s,17r)-17-ethynyl-13-methyl-7,8,9,11,12,14,15,16-octahydro-6h-cyclopenta[a]phenanthrene-3,17-diol Chemical compound OC1=CC=C2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1.O/N=C/1CC[C@@H]2[C@H]3CC[C@](CC)([C@](CC4)(OC(C)=O)C#C)[C@@H]4[C@@H]3CCC2=C\1 GYMWQLRSSDFGEQ-ADRAWKNSSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Definitions
- the present invention relates to a light-emitting diode (LED) package structure and a frame thereof, and more particularly, to an LED package structure and a frame thereof with a high light-emitting efficiency.
- LED light-emitting diode
- LEDs As light-emitting diodes (LEDs) have advantages of low power consumption, long lifetime, small size, high responding speed, high resistance to earthquakes, and an adaptability for mass production, LEDs are widely applied to various illumination lamps as well as electronics products.
- FIG. 1 is a schematic diagram of a conventional LED package structure.
- the conventional LED package structure 10 includes a sealant 12 , a cavity 14 , a plurality of bonding pads 16 disposed in the bottom of the cavity 14 , and three low-power LEDs 20 (a red light LED, a green light LED, and a blue light LED) disposed on the plurality of bonding pads 16 and electrically connected to the plurality of bonding pads 16 .
- the conventional LED package structure 10 contains three low-power LEDs 20 and produces light white by mixing red light, green light, and blue light. However, a light-emitting efficiency of the blue light LED is low, which results in not only a decreased overall luminance but also a decreased overall color purity of the LED package structure 10 .
- an LED package structure which includes a frame, at least a first LED, and at least a second LED.
- the frame further includes a base, a plurality of first bonding pads, and a plurality of second bonding pads.
- the base has a first cavity and a second cavity, wherein the second cavity is disposed under the first cavity and the second cavity is smaller than the first cavity.
- the plurality of first bonding pads is disposed in the bottom of the first cavity while the plurality of second bonding pads is disposed in the bottom of the second cavity.
- a plurality of first pins is disposed in the base, wherein one end of each of the plurality of first pins extends into the first cavity and is electrically connected to each of the plurality of first bonding pads correspondingly while the other end of each of the plurality of first pins is exposed outside the base.
- a plurality of second pins is disposed in the base, wherein one end of each of the plurality of second pins extends into the second cavity and is electrically connected to each of the plurality of second bonding pads correspondingly while the other end of each of the plurality of second pins is exposed outside the base.
- the LED package structure of the present invention provides a first LED and a second LED exposed in different domains; thus, it will achieve a better heat-dissipation effect and further improve luminance and color purity of the LED package structure.
- FIG. 1 is a schematic diagram showing a conventional LED package structure.
- FIG. 2 is a three-dimensional diagram showing an LED package structure according to a preferred embodiment of the present invention.
- FIG. 3 is a top view showing an LED package structure according to a preferred embodiment of the present invention.
- FIG. 4 is a cross-sectional diagram showing an LED package structure according to a preferred embodiment of the present invention.
- FIG. 5 is a bottom view showing an LED package structure according to a preferred embodiment of the present invention.
- FIGS. 2 to 5 are schematic diagrams showing an LED package structure according to a preferred embodiment of the present invention.
- an LED package structure 30 of the present embodiment essentially includes a frame 40 , a plurality of first LEDs 60 , and a second LED 70 , a first sealant 50 and a second sealant 48 .
- the frame 40 includes a base 42 , a plurality of first bonding pads 44 , and a plurality of second bonding pads 46 , wherein the base 42 contains a first cavity 421 and a second cavity 422 .
- the second cavity 422 is disposed under the first cavity 421 , and the second cavity 422 is smaller than the first cavity 421 .
- the plurality of first bonding pads 44 is disposed in the bottom of the first cavity 421
- the plurality of second bonding pads 46 is disposed in the bottom of the second cavity 422 .
- the plurality of first LEDs 60 is disposed in the bottom of the first cavity 421 , wherein each of the plurality of first LEDs 60 comprises an anode 62 and a cathode 64 , and the anode 62 and the cathode 64 are electrically connected to each of the plurality of first bonding pads 44 , by wire-bonding or flip-chip, for example.
- the second LED 70 is disposed in the bottom of the second cavity 422 , wherein the second LED 70 contains an anode 72 and a cathode 74 , and the anode 72 and the cathode 74 are electrically connected to each of the plurality of second bonding pads 46 , by wire-bonding or flip-chip, for example.
- the second sealant 48 is filled in the second cavity 422 and covering the second LED 70
- the first sealant 50 is filled in the first cavity 421 and covering the plurality of first LEDs 60 .
- the frame 40 further includes a plurality of first pins 52 and a plurality of second pins 54 , wherein the plurality of first pins 52 are disposed in the base 42 and one end of each of the plurality of first pins 52 extends into the first cavity 421 and is electrically connected to each of the plurality of first bonding pads 44 correspondingly.
- the other end of each of the plurality of first pins 52 is exposed outside the base 42 for the anode 62 and the cathode 64 of each of the plurality of first LEDs 60 to be electronically connected externally via the plurality of first pins 52 .
- the plurality of second pins 54 are disposed in the base 42 and one end of each of the plurality of second pins 54 extends into the second cavity 422 and is electrically connected to each of the plurality of second bonding pads 46 correspondingly.
- the other end of each of the plurality of second pins 54 is exposed outside the base 42 for the anode 72 and the cathode 74 of the second LED 70 to be electronically connected externally via the plurality of second pins 54 .
- a refractive index of the second sealant is higher than a refractive index of the first sealant 50 .
- the light-emitting quantity of the second LED 70 will be increased according to Snell's Law, which will increase overall luminance of the LED package structure 30 accordingly.
- first cavity 421 and the second cavity 422 preferably have inner walls ascending outwardly. Therefore, the light emitted from the plurality of first LEDs 60 and the second LED 70 can be reflected by the inner walls of the first cavity 421 and the second cavity 422 to improve the light utilization.
- the base 42 is a base of the LED package structure 30
- the material of the base may be a Polyphthalamide (PPA), an epoxy, or other insulating materials.
- the second sealant 48 and the first sealant 50 may be silicon or other moist-proof materials.
- a low-power LED can be selected for the plurality of first LEDs 60 , such as the low-power LED whose electrical current is, but not limited to, substantially 20 mA (mili amper).
- the present embodiment uses a white-light LED package structure as an example so that the plurality of first LEDs 60 may include a low-power red light LED, a low-power green light LED, and a low-power blue light LED to produce white light by mixing red light, green light, and blue light, but is not limited to it.
- the plurality of first LEDs 60 may also be a blue light LED, and a yellow fluorescent sealant can be selected for the first sealant 50 in this case to produce white light when the blue light LED irradiates the yellow fluorescent sealant.
- a high-power LED can be selected for the second LED 70 , such as the high-power LED whose electrical current is, but not limited to, substantially 350 mA.
- a high-power blue light LED can be selected for the second LED 70
- a yellow fluorescent sealant can be selected for the second sealant 48 to produce white light when the blue light LED irradiates the yellow fluorescent sealant.
- the second LED 70 may include a high-power red light LED, a high-power green light LED, and a high-power blue light LED to produce white light by mixing red light, green light, and blue light.
- a low-power single-colored LED can be selected for the plurality of first LEDs 60 , including a low-power blue light LED.
- a high-power single-colored LED can be selected for the second LED 70 , such as a high-power blue light LED.
- a high-power LED is selected for the second LED 70 in order to increase luminance and color purity of the LED package structure 30 .
- the high-power LED may generate more heat compared to the low-power LED, which results in a much higher temperature of the high-power LED than the low-power LED.
- the plurality of first LEDs 60 and the second LED 70 are respectively installed in the bottoms of the first cavity 421 and the second cavity 422 , wherein the first cavity 421 and the second cavity 422 are located in different domains.
- the heat generated by the second LED 70 can be conducted downwardly via the plurality of second bonding pads 46 , which has a better thermal conductivity, rather than being conducted upwardly via the second sealant 48 , which has a worse thermal conductivity.
- the heat generated by the plurality of first LEDs 60 can be conducted outwardly via the plurality of first bonding pads 44 , which has a better thermal conductivity, rather than being conducted downwardly via the second sealant 48 , which has a worse thermal conductivity. It will therefore prevent the light-emitting efficiency of the second LED 70 from being affected by the heat generated by the plurality of first LEDs 60 .
- the LED package structure of the present invention provides a high-power LED and a low-power LED disposed in different domains.
- the heat generated by the high-power LED can be conducted downwardly via the bonding pads while the heat generated by the low-power LED can be conducted outwardly via the bonding pads to achieve a good heat-dissipation effect. Consequently, the light-emitting efficiency of the high-power LED and the low-power LED will be significantly improved due to its good heat-dissipation effect, which leads to high luminance and color purity of the LED package structure.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a light-emitting diode (LED) package structure and a frame thereof, and more particularly, to an LED package structure and a frame thereof with a high light-emitting efficiency.
- 2. Description of the Prior Art
- As light-emitting diodes (LEDs) have advantages of low power consumption, long lifetime, small size, high responding speed, high resistance to earthquakes, and an adaptability for mass production, LEDs are widely applied to various illumination lamps as well as electronics products.
-
FIG. 1 is a schematic diagram of a conventional LED package structure. As shown inFIG. 1 , the conventionalLED package structure 10 includes asealant 12, acavity 14, a plurality ofbonding pads 16 disposed in the bottom of thecavity 14, and three low-power LEDs 20 (a red light LED, a green light LED, and a blue light LED) disposed on the plurality ofbonding pads 16 and electrically connected to the plurality ofbonding pads 16. - The conventional
LED package structure 10 contains three low-power LEDs 20 and produces light white by mixing red light, green light, and blue light. However, a light-emitting efficiency of the blue light LED is low, which results in not only a decreased overall luminance but also a decreased overall color purity of theLED package structure 10. - It is therefore one of the objectives of the present invention to provide an LED package structure and a frame thereof to solve the problems of low light-emitting efficiency and low color purity in the conventional LED package structure.
- In accordance with an embodiment of the present invention, an LED package structure is provided, which includes a frame, at least a first LED, and at least a second LED. The frame further includes a base, a plurality of first bonding pads, and a plurality of second bonding pads. The base has a first cavity and a second cavity, wherein the second cavity is disposed under the first cavity and the second cavity is smaller than the first cavity. The plurality of first bonding pads is disposed in the bottom of the first cavity while the plurality of second bonding pads is disposed in the bottom of the second cavity. Additionally, a plurality of first pins is disposed in the base, wherein one end of each of the plurality of first pins extends into the first cavity and is electrically connected to each of the plurality of first bonding pads correspondingly while the other end of each of the plurality of first pins is exposed outside the base. A plurality of second pins is disposed in the base, wherein one end of each of the plurality of second pins extends into the second cavity and is electrically connected to each of the plurality of second bonding pads correspondingly while the other end of each of the plurality of second pins is exposed outside the base.
- The LED package structure of the present invention provides a first LED and a second LED exposed in different domains; thus, it will achieve a better heat-dissipation effect and further improve luminance and color purity of the LED package structure.
- These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
-
FIG. 1 is a schematic diagram showing a conventional LED package structure. -
FIG. 2 is a three-dimensional diagram showing an LED package structure according to a preferred embodiment of the present invention. -
FIG. 3 is a top view showing an LED package structure according to a preferred embodiment of the present invention. -
FIG. 4 is a cross-sectional diagram showing an LED package structure according to a preferred embodiment of the present invention. -
FIG. 5 is a bottom view showing an LED package structure according to a preferred embodiment of the present invention. - Certain terms are applied throughout the following description and claims to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This document does not intend to distinguish between components that differ in name but in function. In the following discussion and in the claims, the terms “include”, “including”, “comprise”, and “comprising” are used in an open-ended fashion, and thus should be interpreted to mean “including, but not limited to . . . ”.
-
FIGS. 2 to 5 are schematic diagrams showing an LED package structure according to a preferred embodiment of the present invention. As shown inFIG. 2 , anLED package structure 30 of the present embodiment essentially includes aframe 40, a plurality offirst LEDs 60, and asecond LED 70, afirst sealant 50 and asecond sealant 48. Referring toFIG. 3 , theframe 40 includes abase 42, a plurality offirst bonding pads 44, and a plurality ofsecond bonding pads 46, wherein thebase 42 contains afirst cavity 421 and asecond cavity 422. As shown inFIG. 4 , thesecond cavity 422 is disposed under thefirst cavity 421, and thesecond cavity 422 is smaller than thefirst cavity 421. In addition, the plurality offirst bonding pads 44 is disposed in the bottom of thefirst cavity 421, and the plurality ofsecond bonding pads 46 is disposed in the bottom of thesecond cavity 422. The plurality offirst LEDs 60 is disposed in the bottom of thefirst cavity 421, wherein each of the plurality offirst LEDs 60 comprises ananode 62 and acathode 64, and theanode 62 and thecathode 64 are electrically connected to each of the plurality offirst bonding pads 44, by wire-bonding or flip-chip, for example. Thesecond LED 70 is disposed in the bottom of thesecond cavity 422, wherein thesecond LED 70 contains ananode 72 and acathode 74, and theanode 72 and thecathode 74 are electrically connected to each of the plurality ofsecond bonding pads 46, by wire-bonding or flip-chip, for example. Moreover, thesecond sealant 48 is filled in thesecond cavity 422 and covering thesecond LED 70, and thefirst sealant 50 is filled in thefirst cavity 421 and covering the plurality offirst LEDs 60. - Referring to
FIG. 5 as well asFIG. 4 , theframe 40 further includes a plurality offirst pins 52 and a plurality ofsecond pins 54, wherein the plurality offirst pins 52 are disposed in thebase 42 and one end of each of the plurality offirst pins 52 extends into thefirst cavity 421 and is electrically connected to each of the plurality offirst bonding pads 44 correspondingly. The other end of each of the plurality offirst pins 52 is exposed outside thebase 42 for theanode 62 and thecathode 64 of each of the plurality offirst LEDs 60 to be electronically connected externally via the plurality offirst pins 52. Similarly, the plurality ofsecond pins 54 are disposed in thebase 42 and one end of each of the plurality ofsecond pins 54 extends into thesecond cavity 422 and is electrically connected to each of the plurality ofsecond bonding pads 46 correspondingly. The other end of each of the plurality ofsecond pins 54 is exposed outside thebase 42 for theanode 72 and thecathode 74 of thesecond LED 70 to be electronically connected externally via the plurality ofsecond pins 54. In the present embodiment, a refractive index of the second sealant is higher than a refractive index of thefirst sealant 50. Thus, the light-emitting quantity of thesecond LED 70 will be increased according to Snell's Law, which will increase overall luminance of theLED package structure 30 accordingly. In addition, thefirst cavity 421 and thesecond cavity 422 preferably have inner walls ascending outwardly. Therefore, the light emitted from the plurality offirst LEDs 60 and thesecond LED 70 can be reflected by the inner walls of thefirst cavity 421 and thesecond cavity 422 to improve the light utilization. - In the present embodiment, the
base 42 is a base of theLED package structure 30, the material of the base may be a Polyphthalamide (PPA), an epoxy, or other insulating materials. Thesecond sealant 48 and thefirst sealant 50 may be silicon or other moist-proof materials. A low-power LED can be selected for the plurality offirst LEDs 60, such as the low-power LED whose electrical current is, but not limited to, substantially 20 mA (mili amper). The present embodiment uses a white-light LED package structure as an example so that the plurality offirst LEDs 60 may include a low-power red light LED, a low-power green light LED, and a low-power blue light LED to produce white light by mixing red light, green light, and blue light, but is not limited to it. For example, the plurality offirst LEDs 60 may also be a blue light LED, and a yellow fluorescent sealant can be selected for thefirst sealant 50 in this case to produce white light when the blue light LED irradiates the yellow fluorescent sealant. Alternatively, a high-power LED can be selected for thesecond LED 70, such as the high-power LED whose electrical current is, but not limited to, substantially 350 mA. For instance, a high-power blue light LED can be selected for thesecond LED 70, and a yellow fluorescent sealant can be selected for thesecond sealant 48 to produce white light when the blue light LED irradiates the yellow fluorescent sealant. There may be other embodiments of the present invention. For example, thesecond LED 70 may include a high-power red light LED, a high-power green light LED, and a high-power blue light LED to produce white light by mixing red light, green light, and blue light. In another embodiment, when theLED package structure 30 is a single-colored LED package structure, a low-power single-colored LED can be selected for the plurality offirst LEDs 60, including a low-power blue light LED. In this case, a high-power single-colored LED can be selected for thesecond LED 70, such as a high-power blue light LED. - In the present embodiment, a high-power LED is selected for the
second LED 70 in order to increase luminance and color purity of theLED package structure 30. However, the high-power LED may generate more heat compared to the low-power LED, which results in a much higher temperature of the high-power LED than the low-power LED. In view of the abovementioned problem, the plurality offirst LEDs 60 and thesecond LED 70 are respectively installed in the bottoms of thefirst cavity 421 and thesecond cavity 422, wherein thefirst cavity 421 and thesecond cavity 422 are located in different domains. Thus, the heat generated by thesecond LED 70 can be conducted downwardly via the plurality ofsecond bonding pads 46, which has a better thermal conductivity, rather than being conducted upwardly via thesecond sealant 48, which has a worse thermal conductivity. As a result, it can prevent the light-emitting efficiency of the plurality offirst LEDs 60 from being affected by the heat generated by thesecond LED 70. On the other hand, the heat generated by the plurality offirst LEDs 60 can be conducted outwardly via the plurality offirst bonding pads 44, which has a better thermal conductivity, rather than being conducted downwardly via thesecond sealant 48, which has a worse thermal conductivity. It will therefore prevent the light-emitting efficiency of thesecond LED 70 from being affected by the heat generated by the plurality offirst LEDs 60. - In summary, the LED package structure of the present invention provides a high-power LED and a low-power LED disposed in different domains. As a result, the heat generated by the high-power LED can be conducted downwardly via the bonding pads while the heat generated by the low-power LED can be conducted outwardly via the bonding pads to achieve a good heat-dissipation effect. Consequently, the light-emitting efficiency of the high-power LED and the low-power LED will be significantly improved due to its good heat-dissipation effect, which leads to high luminance and color purity of the LED package structure.
- Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention.
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98126057A | 2009-08-03 | ||
TW098126057 | 2009-08-03 | ||
TW098126057A TWI440159B (en) | 2009-08-03 | 2009-08-03 | Light emitting diode package structure and lead frame structure thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
US20110024773A1 true US20110024773A1 (en) | 2011-02-03 |
US7884378B1 US7884378B1 (en) | 2011-02-08 |
Family
ID=43526153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/606,182 Expired - Fee Related US7884378B1 (en) | 2009-08-03 | 2009-10-26 | Light emitting diode package structure and lead frame structure thereof |
Country Status (2)
Country | Link |
---|---|
US (1) | US7884378B1 (en) |
TW (1) | TWI440159B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130049052A1 (en) * | 2011-08-30 | 2013-02-28 | Won Jin Son | Lighting device |
CN103811646A (en) * | 2012-11-08 | 2014-05-21 | 立碁电子工业股份有限公司 | Light-emitting diode packaging structure |
KR20140116654A (en) * | 2013-03-25 | 2014-10-06 | 엘지이노텍 주식회사 | Light emittng device package |
WO2019170214A1 (en) * | 2018-03-05 | 2019-09-12 | Osram Opto Semiconductors Gmbh | Light-emitting device and method for producing a plurality of light-emitting devices |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367570B (en) * | 2012-03-30 | 2016-01-20 | 清华大学 | White light LEDs |
TWI458138B (en) * | 2012-10-24 | 2014-10-21 | Ligitek Electronics Co Ltd | Led packaging structure |
US9064773B2 (en) * | 2012-10-26 | 2015-06-23 | Lg Innotek Co., Ltd. | Light emitting device package |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060091416A1 (en) * | 2004-10-29 | 2006-05-04 | Ledengin, Inc. (Cayman) | High power LED package with universal bonding pads and interconnect arrangement |
US20070165414A1 (en) * | 2003-12-11 | 2007-07-19 | Shih-Chang Shei | Light-emitting diode package structure |
-
2009
- 2009-08-03 TW TW098126057A patent/TWI440159B/en not_active IP Right Cessation
- 2009-10-26 US US12/606,182 patent/US7884378B1/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070165414A1 (en) * | 2003-12-11 | 2007-07-19 | Shih-Chang Shei | Light-emitting diode package structure |
US20060091416A1 (en) * | 2004-10-29 | 2006-05-04 | Ledengin, Inc. (Cayman) | High power LED package with universal bonding pads and interconnect arrangement |
US7473933B2 (en) * | 2004-10-29 | 2009-01-06 | Ledengin, Inc. (Cayman) | High power LED package with universal bonding pads and interconnect arrangement |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130049052A1 (en) * | 2011-08-30 | 2013-02-28 | Won Jin Son | Lighting device |
WO2013032177A2 (en) * | 2011-08-30 | 2013-03-07 | 엘지이노텍 주식회사 | Light-emitting device package capable of controlling color temperature |
WO2013032177A3 (en) * | 2011-08-30 | 2013-04-25 | 엘지이노텍 주식회사 | Light-emitting device package capable of controlling color temperature |
US8952407B2 (en) * | 2011-08-30 | 2015-02-10 | Lg Innotek Co., Ltd. | Lighting device |
CN103811646A (en) * | 2012-11-08 | 2014-05-21 | 立碁电子工业股份有限公司 | Light-emitting diode packaging structure |
KR20140116654A (en) * | 2013-03-25 | 2014-10-06 | 엘지이노텍 주식회사 | Light emittng device package |
JP2016516305A (en) * | 2013-03-25 | 2016-06-02 | エルジー イノテック カンパニー リミテッド | Light emitting device package |
US10177286B2 (en) | 2013-03-25 | 2019-01-08 | Lg Innotek Co., Ltd. | Light emitting element package having three regions |
KR101998765B1 (en) | 2013-03-25 | 2019-07-10 | 엘지이노텍 주식회사 | Light emittng device package |
EP2980866B1 (en) * | 2013-03-25 | 2021-05-05 | LG Innotek Co., Ltd. | Light-emitting element package |
WO2019170214A1 (en) * | 2018-03-05 | 2019-09-12 | Osram Opto Semiconductors Gmbh | Light-emitting device and method for producing a plurality of light-emitting devices |
US11424226B2 (en) | 2018-03-05 | 2022-08-23 | Osram Opto Semiconductors Gmbh | Light-emitting device and method for producing a plurality of light-emitting devices |
Also Published As
Publication number | Publication date |
---|---|
US7884378B1 (en) | 2011-02-08 |
TWI440159B (en) | 2014-06-01 |
TW201106459A (en) | 2011-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100888236B1 (en) | Light emitting device | |
US7884378B1 (en) | Light emitting diode package structure and lead frame structure thereof | |
US7781783B2 (en) | White light LED device | |
US20080170371A1 (en) | Combination assembly of led and heat sink | |
US20130194794A1 (en) | Light emitting device | |
TW201340418A (en) | Light emitting module and illuminating apparatus | |
JP2007227925A (en) | Led package, and method of manufacturing same | |
US9653434B2 (en) | LED module | |
CN103511879B (en) | Light emitting module | |
TWI496323B (en) | Light emitting module | |
TW201339494A (en) | Light emitting module and illuminating apparatus | |
TW201538887A (en) | Lighting-emitting diode assembly and LED bulb using the same | |
US20100109028A1 (en) | Vertical ACLED structure | |
US20140319565A1 (en) | Light emitting diode package | |
CN204118067U (en) | Directly be packaged in the LED chip encapsulation architecture of radiator | |
JP2007043074A (en) | Luminaire | |
US20140217451A1 (en) | Mixed light led structure | |
KR20140004351A (en) | Light emitting diode package | |
KR101872253B1 (en) | Light emitting package, light emitting device and lighting device | |
KR102057978B1 (en) | Lighting device | |
KR20120001189A (en) | Light emitting diode package | |
JP6681581B2 (en) | Light emitting device and lighting device | |
US20170077369A1 (en) | Light-emitting apparatus, illumination apparatus, and method of manufacturing light-emitting apparatus | |
JP2006286896A (en) | Light emitting diode device | |
KR20130014755A (en) | Light emitting device package and lighting system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: CHUNGHWA PICTURE TUBES, LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LU, FU-CAI;SU, CHUN-WEI;TSOU, CHIEN-LUNG;AND OTHERS;REEL/FRAME:023425/0136 Effective date: 20091015 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Expired due to failure to pay maintenance fee |
Effective date: 20190208 |