US20110000648A1 - Heat dissipation module - Google Patents
Heat dissipation module Download PDFInfo
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- US20110000648A1 US20110000648A1 US12/801,627 US80162710A US2011000648A1 US 20110000648 A1 US20110000648 A1 US 20110000648A1 US 80162710 A US80162710 A US 80162710A US 2011000648 A1 US2011000648 A1 US 2011000648A1
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- United States
- Prior art keywords
- heat
- heat dissipation
- dissipation module
- dissipating section
- module according
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2240/00—Spacing means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/04—Fastening; Joining by brazing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention generally relates to a heat dissipation module, and more particularly, to a heat dissipation module having graphite fins.
- a conventional method of removing the heat generated by the operating electrical elements is to dispose a heat dissipation module on the electrical elements, so that the heat dissipation module may dissipate the heat generated by the electrical elements to the environment.
- TW patents Nos. 1241156, M332359, M336669, and 200815726 relate to the heat dissipation modules.
- the invention is directed to a heat dissipation module having good heat dissipation efficiency and light weight.
- An embodiment of the invention provides a heat dissipation module adapted for dissipating heat generated by a heat source.
- the heat dissipation module includes at least one heat pipe and a heat dissipation fin assembly.
- the heat pipe has a heat-absorbing section and a heat-dissipating section.
- the heat dissipation fin assembly includes a plurality of graphite fins and a plurality of spacers, and the graphite fins and the spacers are connected to the heat-dissipating section alternately.
- Each of the spacers has a first baffle board and a first convex part, the first baffle board is adjacent to the graphite fin, and the first convex part projects from the first baffle board along an extending direction of the heat-dissipating section.
- the embodiment or the embodiments of the invention may have at least one of the following advantages.
- the heat dissipation module uses graphite fins instead of the conventional metal fins, so that the heat dissipation module has light weight.
- the spacers may keep a constant interval between the adjacent graphite fins.
- protection components may reduce the probability of the graphite fins being broken by crashing.
- FIG. 1 is a three dimensional diagram of a heat dissipation module according to one embodiment of the invention.
- FIG. 2 is a partial explored diagram of the heat dissipation module in FIG. 1 .
- FIG. 3 is a three dimensional diagram of the heat dissipation module from another view angle in FIG. 1 .
- FIG. 4 is a partial explored diagram of the heat dissipation module in FIG. 3 .
- FIG. 5 is a three dimensional diagram of the heat dissipation module in FIG. 3 with part of the heat dissipation removed.
- FIG. 6 is a three dimensional diagram of a heat dissipation module according to another embodiment of the invention.
- FIG. 7 is a partial explored diagram of the heat dissipation module in FIG. 6 .
- FIG. 8 is a three dimensional diagram of the heat dissipation module in FIG. 6 with part of the heat dissipation removed.
- the description of “A” component facing “B” component herein may contain the situations that “A” component directly faces “B” component or one or more additional components are between “A” component and “B” component.
- the description of “A” component “adjacent to” “B” component herein may contain the situations that “A” component is directly “adjacent to” “B” component or one or more additional components are between “A” component and “B” component. Accordingly, the drawings and descriptions will be regarded as illustrative in nature and not as restrictive.
- the heat dissipation module 10 is adapted for dissipating heat generated by a heat source (not shown).
- the heat dissipation module 10 includes at least one heat pipe 100 , a heat dissipation fin assembly 200 , two protection components 300 , a jointing material 400 (shown in FIG. 5 ), and an absorbing unit 500 .
- FIG. 2 and FIG. 4 are partial explored diagram of the heat dissipation module in FIGS. 1 and 3 to show interior structure of the heat dissipation fin assembly 200 .
- the absorbing unit 500 is adapted to thermally conducting to the heat source to absorb the heat generated by the heat source, so as to conduct the heat to the heat dissipation fin assembly 200 through the heat pipe 100 .
- the heat pipe 100 includes a heat-absorbing section 110 and a heat-dissipating section 120 .
- the heat-absorbing section 110 thermally connects to the absorbing unit 500 .
- the heat dissipation fin assembly 200 and the protection components 300 connect the heat-dissipating section 120 .
- the heat dissipation fin assembly 200 is disposed between the protection components 300 .
- the heat dissipation fin assembly 200 includes a plurality of graphite fins 210 and a plurality of spacers 220 , and the graphite fins 210 and the spacers 220 connect to the heat-dissipating section 120 alternately.
- Each of the two adjacent graphite fins 210 may be separated by the spacer 220 disposed between the two adjacent graphite fins 210 . Accordingly, the spacer 220 may keep a constant interval between the two adjacent graphite fins 210 , and, for example, the interval between the two adjacent graphite fins 210 is equal to the thickness of the spacer 220 along the extending direction of the heat-dissipating section 120 .
- the graphite fins 210 , the spacers 220 , and the protection components 300 are connected by the heat-dissipating section 120 , which is through the graphite fins 210 , the spacers 220 , and the protection components 300 .
- the graphite fin 210 has at least one first through hole 212 .
- the spacer 220 has at least one second through hole 222 .
- the protection components 300 have at least one third hole 310 .
- the heat-dissipating section 120 passes through the first through hole 212 , the second through hole 222 and the third through hole 310 to keep the graphite fins 210 , the spacers 220 , and the protection components 300 connecting with the heat-dissipating section 120 .
- a jointing material 400 is disposed between the heat-dissipating section 120 and the heat dissipation fin assembly 200 , and between the heat-dissipating section 120 and the protection components 300 to make the heat dissipation fin assembly 200 and the protection components 300 connect to the heat dissipating section 120 closely.
- the spacer 220 has a first baffle board 224 and a first convex part 226 .
- the first convex part 226 surrounds at least a part of the boundary of the second through hole 222 , and projects from the first baffle board 224 along the extending direction of the heat-dissipating section 120 .
- the first convex part 226 is away from the heat-absorbing section 110 and projects from the first baffle board 224 along the extending direction of the heat-dissipating section 120 .
- the protection components 300 may have a second baffle board 320 and a second convex part 330 .
- the second convex part 330 surrounds at least a part of the boundary of the third through hole 310 , and projects from the second baffle board 320 along the extending direction of the heat-dissipating section 120 .
- the second convex part 330 is away from the heat-absorbing section 110 and projects from the second baffle board 320 along the extending direction of the heat-dissipating section 120 .
- the spacers 220 and the protection components 300 are not only easy to be assembled to the heat-dissipating section 120 but also able to keep a constant interval between the two adjacent graphite fins 220 or between the graphite fin 220 and the protection components 300 .
- a outline of the second baffle board 320 is substantially the same to a outline of the graphite fin 210 . Therefore, the second baffle board 320 may provide a good protection to the graphite fins 210 to reduce the probability of the graphite fins 210 being broken by crashing.
- one of the protection components 300 may connect the heat-dissipating section 120 through the third through hole 310 , and the second convex part 330 is made to face the end of the heat-dissipating section 120 . Then a graphite fin 210 may connect the heat-dissipating section 120 through the first through hole 212 , and the graphite fin 210 is against the second convex part 330 of the protection components 300 .
- a spacer 220 may connect the heat-dissipating section 120 through the second through hole 222 , so that the first convex part 226 faces the end of the heat-dissipating section 120 and the first baffle 224 is against the graphite fin 210 .
- the rest graphite fins 210 and the spacers 220 are connected alternately to the heat-dissipating section 120 by the method described above.
- the graphite fin 210 may be against the first convex part 226 of the former spacer 220 to keep a constant interval with the former graphite fin 210 .
- the constant interval is the thickness of the first baffle 224 plus the thickness of the first convex part 226 along the extending direction of the heat-dissipating section 120 .
- the other of protection components 300 may connect to the heat-dissipating section 120 , and the second baffle board 320 of the protection components 300 is against the first convex part 226 of the former spacer 220 to make the heat dissipation fin assembly 200 and the protection components 300 assemble on the heat-dissipating section 120 .
- the two adjacent graphite fins 210 or the graphite fin 210 and the protection components 300 may keep a constant interval, and the heat conducted to the heat-dissipating section 120 may conduct to the environment through the graphite fin 210 , spacer 220 and the protection components 300 .
- a jointing material 400 may be coated on the surface of the heat-dissipating section 120 .
- the jointing material 400 is disposed between the heat-dissipating section 120 and the heat dissipation fin assembly 200 , and between the heat-dissipating section 120 and the protection components 300 .
- each of the first through hole 212 , the second through hole 222 , and the third through hole 310 further includes a first opening 212 a , a second opening 222 a , and a third opening 312 respectively, so that the shapes of the first through hole 212 , the second through hole 222 , and the third through hole 310 are like the shape of gourd.
- the jointing material 400 may be injected through the first opening 212 a , the second opening 222 a , and the third opening 312 to fill the gaps among the heat-dissipating section 120 and the first opening 212 a , a second opening 222 a , and a third opening 312 when the graphite fins 210 , the spacers 220 , and the protection components 300 connect to the heat-dissipating section 120 .
- the heat dissipation module 200 and the protection components 300 may connect to the heat-dissipating section 120 firstly, and then the jointing material 400 may be respectively injected through the first opening 212 a , the second opening 222 a , and the third opening 312 to fill the gaps among the heat-dissipating section 120 , the first opening 212 a , a second opening 222 a , and a third opening 312 .
- the jointing material 400 may be solder formed by reflowing the solder cream or other glues with good thermal conductivity.
- the graphite fins 210 , the spacers 220 , and the protection components 300 of the heat dissipation module 10 may be respectively connected to the heat-dissipating section 120 through the jointing material 400 , and may increase the thermal conductive efficiency among the heat-dissipating section 120 , the graphite fins 210 , the spacers 220 , and the protection components 300 .
- the difference between the heat dissipation module 10 ′ and the heat dissipation module 10 mentioned above is that the spacer 220 ′ of the heat dissipation 10 ′ may be a cylinder to keep a constant interval between the two adjacent graphite fins 210 .
- the embodiment or the embodiments of the invention may have at least one of the following advantages.
- the heat dissipation module of the invention uses graphite fins instead of the convention metal fins, so that the heat dissipation module has a light weight.
- the spacers may keep a constant interval between the adjacent graphite fins.
- protection components may reduce the probability of the graphite fins being broken by crashing.
- the term “the invention”, “the present invention” or the like does not necessarily limit the claim scope to a specific embodiment, and the reference to particularly preferred exemplary embodiments of the invention does not imply a limitation on the invention, and no such limitation is to be inferred.
- the invention is limited only by the spirit and scope of the appended claims.
- the abstract of the disclosure is provided to comply with the rules requiring an abstract, which will allow a searcher to quickly ascertain the subject matter of the technical disclosure of any patent issued from this disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Any advantages and benefits described may not apply to all embodiments of the invention.
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- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
A heat dissipation module adapted for dissipating heat generated by a heat source includes at least a heat pipe and a heat dissipation fin assembly. The heat pipe has a heat-absorbing section and a heat-dissipating section. The heat dissipation fin assembly includes a plurality of graphite fins and a plurality of spacers and the graphite fins and the spacers are connected to the heat-dissipating section alternatively. Each of the spacers has a first baffle board and a first convex part, the first baffle board is adapted to be against the graphite fin, and the first convex part is adapted to project from the first baffle board along an extending direction of the heat-dissipating section.
Description
- This application claims the priority benefit of Taiwan application serial no. 98122234, filed on Jul. 1, 2009. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
- 1. Field of the Invention
- The invention generally relates to a heat dissipation module, and more particularly, to a heat dissipation module having graphite fins.
- 2. Description of Related Art
- In recent years, with the improvement of technology, the operation efficiency of the electrical elements is getting higher, so that the heating power of the electrical elements increases as well. It is very important to provide sufficient heat dissipating ability of the electrical elements for preventing temporary or permanent failure of electronic elements caused by over heat
- A conventional method of removing the heat generated by the operating electrical elements is to dispose a heat dissipation module on the electrical elements, so that the heat dissipation module may dissipate the heat generated by the electrical elements to the environment.
- TW patents Nos. 1241156, M332359, M336669, and 200815726 relate to the heat dissipation modules.
- Accordingly, the invention is directed to a heat dissipation module having good heat dissipation efficiency and light weight.
- Other advantages of the invention should be further indicated by the disclosures of the invention, and omitted herein for simplicity.
- An embodiment of the invention provides a heat dissipation module adapted for dissipating heat generated by a heat source. The heat dissipation module includes at least one heat pipe and a heat dissipation fin assembly. The heat pipe has a heat-absorbing section and a heat-dissipating section. The heat dissipation fin assembly includes a plurality of graphite fins and a plurality of spacers, and the graphite fins and the spacers are connected to the heat-dissipating section alternately. Each of the spacers has a first baffle board and a first convex part, the first baffle board is adjacent to the graphite fin, and the first convex part projects from the first baffle board along an extending direction of the heat-dissipating section.
- In summary, the embodiment or the embodiments of the invention may have at least one of the following advantages. The heat dissipation module uses graphite fins instead of the conventional metal fins, so that the heat dissipation module has light weight. Besides, the spacers may keep a constant interval between the adjacent graphite fins. Moreover, protection components may reduce the probability of the graphite fins being broken by crashing.
- Other objectives, features and advantages of the invention will be further understood from the further technological features disclosed by the embodiments of the invention wherein there are shown and described preferred embodiments of this invention, simply by way of illustration of modes best suited to carry out the invention.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
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FIG. 1 is a three dimensional diagram of a heat dissipation module according to one embodiment of the invention. -
FIG. 2 is a partial explored diagram of the heat dissipation module inFIG. 1 . -
FIG. 3 is a three dimensional diagram of the heat dissipation module from another view angle inFIG. 1 . -
FIG. 4 is a partial explored diagram of the heat dissipation module inFIG. 3 . -
FIG. 5 is a three dimensional diagram of the heat dissipation module inFIG. 3 with part of the heat dissipation removed. -
FIG. 6 is a three dimensional diagram of a heat dissipation module according to another embodiment of the invention. -
FIG. 7 is a partial explored diagram of the heat dissipation module inFIG. 6 . -
FIG. 8 is a three dimensional diagram of the heat dissipation module inFIG. 6 with part of the heat dissipation removed. - In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” etc., is used with reference to the orientation of the Figure(s) being described. The components of the invention can be positioned in a number of different orientations. As such, the directional terminology is used for purposes of illustration and is in no way limiting. On the other hand, the drawings are only schematic and the sizes of components may be exaggerated for clarity. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the invention. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless limited otherwise, the terms “connected,” “coupled,” and “mounted” and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. Similarly, the terms “facing,” “faces” and variations thereof herein are used broadly and encompass direct and indirect facing, and “adjacent to” and variations thereof herein are used broadly and encompass directly and indirectly “adjacent to”. Therefore, the description of “A” component facing “B” component herein may contain the situations that “A” component directly faces “B” component or one or more additional components are between “A” component and “B” component. Also, the description of “A” component “adjacent to” “B” component herein may contain the situations that “A” component is directly “adjacent to” “B” component or one or more additional components are between “A” component and “B” component. Accordingly, the drawings and descriptions will be regarded as illustrative in nature and not as restrictive.
- Referring to
FIG. 1 toFIG. 4 , in one embodiment, theheat dissipation module 10 is adapted for dissipating heat generated by a heat source (not shown). Theheat dissipation module 10 includes at least oneheat pipe 100, a heatdissipation fin assembly 200, twoprotection components 300, a jointing material 400 (shown inFIG. 5 ), and an absorbingunit 500. Besides,FIG. 2 andFIG. 4 are partial explored diagram of the heat dissipation module inFIGS. 1 and 3 to show interior structure of the heatdissipation fin assembly 200. - The absorbing
unit 500 is adapted to thermally conducting to the heat source to absorb the heat generated by the heat source, so as to conduct the heat to the heatdissipation fin assembly 200 through theheat pipe 100. Theheat pipe 100 includes a heat-absorbingsection 110 and a heat-dissipating section 120. The heat-absorbingsection 110 thermally connects to the absorbingunit 500. The heatdissipation fin assembly 200 and theprotection components 300 connect the heat-dissipating section 120. The heatdissipation fin assembly 200 is disposed between theprotection components 300. - The heat
dissipation fin assembly 200 includes a plurality ofgraphite fins 210 and a plurality ofspacers 220, and thegraphite fins 210 and thespacers 220 connect to the heat-dissipating section 120 alternately. Each of the two adjacent graphite fins 210 may be separated by thespacer 220 disposed between the two adjacent graphite fins 210. Accordingly, thespacer 220 may keep a constant interval between the two adjacent graphite fins 210, and, for example, the interval between the twoadjacent graphite fins 210 is equal to the thickness of thespacer 220 along the extending direction of the heat-dissipating section 120. - In the embodiment, the
graphite fins 210, thespacers 220, and theprotection components 300 are connected by the heat-dissipatingsection 120, which is through thegraphite fins 210, thespacers 220, and theprotection components 300. - For example, the
graphite fin 210 has at least one first throughhole 212. Thespacer 220 has at least one second throughhole 222. And theprotection components 300 have at least onethird hole 310. The heat-dissipatingsection 120 passes through the first throughhole 212, the second throughhole 222 and the third throughhole 310 to keep thegraphite fins 210, thespacers 220, and theprotection components 300 connecting with the heat-dissipatingsection 120. - Besides, a
jointing material 400 is disposed between the heat-dissipatingsection 120 and the heatdissipation fin assembly 200, and between the heat-dissipatingsection 120 and theprotection components 300 to make the heatdissipation fin assembly 200 and theprotection components 300 connect to theheat dissipating section 120 closely. - Referring to
FIG. 1 toFIG. 5 , in the embodiment, thespacer 220 has afirst baffle board 224 and a firstconvex part 226. The firstconvex part 226 surrounds at least a part of the boundary of the second throughhole 222, and projects from thefirst baffle board 224 along the extending direction of the heat-dissipatingsection 120. For example, the firstconvex part 226 is away from the heat-absorbingsection 110 and projects from thefirst baffle board 224 along the extending direction of the heat-dissipatingsection 120. - Similarly, in the embodiment, the
protection components 300 may have a second baffle board320 and a secondconvex part 330. The secondconvex part 330 surrounds at least a part of the boundary of the third throughhole 310, and projects from thesecond baffle board 320 along the extending direction of the heat-dissipatingsection 120. For example, the secondconvex part 330 is away from the heat-absorbingsection 110 and projects from thesecond baffle board 320 along the extending direction of the heat-dissipatingsection 120. - In the embodiment, the
spacers 220 and theprotection components 300 are not only easy to be assembled to the heat-dissipatingsection 120 but also able to keep a constant interval between the twoadjacent graphite fins 220 or between thegraphite fin 220 and theprotection components 300. Besides, a outline of thesecond baffle board 320 is substantially the same to a outline of thegraphite fin 210. Therefore, thesecond baffle board 320 may provide a good protection to thegraphite fins 210 to reduce the probability of thegraphite fins 210 being broken by crashing. - Specifically, when the
heat dissipation module 10 is assembled, one of theprotection components 300 may connect the heat-dissipatingsection 120 through the third throughhole 310, and the secondconvex part 330 is made to face the end of the heat-dissipatingsection 120. Then agraphite fin 210 may connect the heat-dissipatingsection 120 through the first throughhole 212, and thegraphite fin 210 is against the secondconvex part 330 of theprotection components 300. Next, aspacer 220 may connect the heat-dissipatingsection 120 through the second throughhole 222, so that the firstconvex part 226 faces the end of the heat-dissipatingsection 120 and thefirst baffle 224 is against thegraphite fin 210. - Then, the
rest graphite fins 210 and thespacers 220 are connected alternately to the heat-dissipatingsection 120 by the method described above. In this way, thegraphite fin 210 may be against the firstconvex part 226 of theformer spacer 220 to keep a constant interval with theformer graphite fin 210. The constant interval is the thickness of thefirst baffle 224 plus the thickness of the firstconvex part 226 along the extending direction of the heat-dissipatingsection 120. At last, the other ofprotection components 300 may connect to the heat-dissipatingsection 120, and thesecond baffle board 320 of theprotection components 300 is against the firstconvex part 226 of theformer spacer 220 to make the heatdissipation fin assembly 200 and theprotection components 300 assemble on the heat-dissipatingsection 120. - When the
heat dissipation module 10 is assembled, the twoadjacent graphite fins 210 or thegraphite fin 210 and theprotection components 300 may keep a constant interval, and the heat conducted to the heat-dissipatingsection 120 may conduct to the environment through thegraphite fin 210,spacer 220 and theprotection components 300. - Moreover, a
jointing material 400 may be coated on the surface of the heat-dissipatingsection 120. When thegraphite fins 210, thespacers 220, and theprotection components 300 connect with the heat-dissipatingsection 120 through the first throughhole 212, the second throughhole 222, and the third throughhole 310, thejointing material 400 is disposed between the heat-dissipatingsection 120 and the heatdissipation fin assembly 200, and between the heat-dissipatingsection 120 and theprotection components 300. - Besides, in the embodiment, each of the first through
hole 212, the second throughhole 222, and the third throughhole 310 further includes afirst opening 212 a, asecond opening 222 a, and athird opening 312 respectively, so that the shapes of the first throughhole 212, the second throughhole 222, and the third throughhole 310 are like the shape of gourd. Thejointing material 400 may be injected through thefirst opening 212 a, thesecond opening 222 a, and thethird opening 312 to fill the gaps among the heat-dissipatingsection 120 and thefirst opening 212 a, asecond opening 222 a, and athird opening 312 when thegraphite fins 210, thespacers 220, and theprotection components 300 connect to the heat-dissipatingsection 120. - In the other way, the
heat dissipation module 200 and theprotection components 300 may connect to the heat-dissipatingsection 120 firstly, and then thejointing material 400 may be respectively injected through thefirst opening 212 a, thesecond opening 222 a, and thethird opening 312 to fill the gaps among the heat-dissipatingsection 120, thefirst opening 212 a, asecond opening 222 a, and athird opening 312. - In the embodiment, the
jointing material 400 may be solder formed by reflowing the solder cream or other glues with good thermal conductivity. Thegraphite fins 210, thespacers 220, and theprotection components 300 of theheat dissipation module 10 may be respectively connected to the heat-dissipatingsection 120 through thejointing material 400, and may increase the thermal conductive efficiency among the heat-dissipatingsection 120, thegraphite fins 210, thespacers 220, and theprotection components 300. - Referring to
FIG. 6 toFIG. 8 , the difference between theheat dissipation module 10′ and theheat dissipation module 10 mentioned above is that thespacer 220′ of theheat dissipation 10′ may be a cylinder to keep a constant interval between the twoadjacent graphite fins 210. - In summary, the embodiment or the embodiments of the invention may have at least one of the following advantages. The heat dissipation module of the invention uses graphite fins instead of the convention metal fins, so that the heat dissipation module has a light weight. Besides, the spacers may keep a constant interval between the adjacent graphite fins. Moreover, protection components may reduce the probability of the graphite fins being broken by crashing.
- The foregoing description of the preferred embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form or to exemplary embodiments disclosed. Accordingly, the foregoing description should be regarded as illustrative rather than restrictive. Obviously, many modifications and variations will be apparent to practitioners skilled in this art. The embodiments are chosen and described in order to best explain the principles of the invention and its best mode practical application, thereby to enable persons skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use or implementation contemplated. It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents in which all terms are meant in their broadest reasonable sense unless otherwise indicated. Therefore, the term “the invention”, “the present invention” or the like does not necessarily limit the claim scope to a specific embodiment, and the reference to particularly preferred exemplary embodiments of the invention does not imply a limitation on the invention, and no such limitation is to be inferred. The invention is limited only by the spirit and scope of the appended claims. The abstract of the disclosure is provided to comply with the rules requiring an abstract, which will allow a searcher to quickly ascertain the subject matter of the technical disclosure of any patent issued from this disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Any advantages and benefits described may not apply to all embodiments of the invention. It should be appreciated that variations may be made in the embodiments described by persons skilled in the art without departing from the scope of the present invention as defined by the following claims. Moreover, no element and component in the present disclosure is intended to be dedicated to the public regardless of whether the element or component is explicitly recited in the following claims.
Claims (18)
1. A heat dissipation module, adapted for dissipating heat generated by a heat source, the heat dissipation module comprising:
at least one heat pipe, having a heat-absorbing section and a heat-dissipating section; and
a heat dissipation fin assembly comprising:
a plurality of graphite fins; and
a plurality of spacers, wherein the graphite fins and the spacers connect to the heat-dissipating section alternately and each of the spacers has a first baffle board and a first convex part, the first baffle board is adjacent to the graphite fin and the first convex part projects from the first baffle board along an extending direction of the heat-dissipating section.
2. The heat dissipation module according to claim 1 , further comprising two protection components connected to the heat-dissipating section and clipped the heat-dissipating fin assembly between the protection components.
3. The heat dissipation module according to claim 2 , further comprising a jointing material disposed between the heat-dissipating section and the heat-dissipating fin assembly.
4. The heat dissipation module according to claim 1 , further comprising an absorbing unit adapted to be thermally conducted to the heat source and the heat-absorbing section thermally conducted to the adsorbing unit.
5. The heat dissipation module according to claim 1 , wherein each of the graphite fins has at least one first through hole and the heat-dissipating section passes through the first through hole and a jointing material is disposed between the first through hole and the heat-dissipating section.
6. The heat dissipation module according to claim 5 , wherein each of the first through holes has a first opening and the jointing material is disposed between the first opening and the heat-dissipating section.
7. The heat dissipation module according to claim 1 , wherein each of the spacers has at least one second through hole and the heat-dissipating section passes through the second through hole and a jointing material is disposed between the second through hole and the heat-dissipating section.
8. The heat dissipation module according to claim 7 , wherein each of the second through holes has a second opening and the jointing material is disposed between the second opening and the heat-dissipating section.
9. The heat dissipation module according to claim 7 , wherein each of the spacers is a cylinder.
10. The heat dissipation module according to claim 7 , wherein the first convex part surrounds at least a part of the edge of the second through hole.
11. The heat dissipation module according to claim 10 , wherein each of the first convex part is away from the absorbing section and projects from the first baffle board along the extending direction of the heat-dissipating section.
12. The heat dissipation module according to claim 1 , wherein each of the protection components has at least one third through hole and the heat-dissipating section passes through the third through hole and the jointing material is disposed between the third through hole and the heat-dissipating section.
13. The heat dissipation module according to claim 12 , wherein each of the third through holes has a third opening and the jointing material is disposed between the third opening and the heat-dissipating section.
14. The heat dissipation module according to claim 12 , wherein each of the protection components has a second baffle board and a second convex part and the second convex part surrounds at least a part of the edge of the third through hole and the second convex part projects from the second baffle board along the extending direction of the heat-dissipating section for being against the graphite fin or the spacer.
15. The heat dissipation module according to claim 14 , wherein each of the second convex parts is away from the absorbing section and projects from the second baffle board along the extending direction of the heat-dissipating section.
16. The heat dissipation module according to claim 14 , wherein an outline of the second baffle board is substantially the same as an outline of the graphite fin.
17. The heat dissipation module according to claim 3 , wherein the jointing material is solder or glue.
18. The heat dissipation module according to claim 2 , further comprising a jointing material disposed between the heat-dissipating section and the protection components.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098122234 | 2009-07-01 | ||
TW098122234A TW201103414A (en) | 2009-07-01 | 2009-07-01 | Heat dissipation module |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110000648A1 true US20110000648A1 (en) | 2011-01-06 |
Family
ID=43411999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/801,627 Abandoned US20110000648A1 (en) | 2009-07-01 | 2010-06-17 | Heat dissipation module |
Country Status (2)
Country | Link |
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US (1) | US20110000648A1 (en) |
TW (1) | TW201103414A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20150008473A1 (en) * | 2013-07-08 | 2015-01-08 | Lg Electronics Inc. | Led light |
US9625104B2 (en) | 2013-07-10 | 2017-04-18 | Lg Electronics Inc. | LED light and method of manufacturing the same |
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JPS5742154A (en) * | 1980-08-26 | 1982-03-09 | Furukawa Electric Co Ltd:The | Heat pipe type heat sink |
US4638854A (en) * | 1983-06-15 | 1987-01-27 | Noren Don W | Heat pipe assembly |
US6006827A (en) * | 1998-12-28 | 1999-12-28 | Hon Hai Precision Ind. Co., Ltd. | Cooling device for computer component |
US6640888B1 (en) * | 2002-10-16 | 2003-11-04 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat sink |
US6712128B1 (en) * | 2002-11-20 | 2004-03-30 | Thermal Corp. | Cylindrical fin tower heat sink and heat exchanger |
US20060102324A1 (en) * | 2004-11-12 | 2006-05-18 | International Business Machines Corporation | Cooling device using multiple fans and heat sinks |
US20080035321A1 (en) * | 2004-06-30 | 2008-02-14 | Daikin Industries, Ltd. | Heat Exchanger and Air Conditioner |
US20090032227A1 (en) * | 2002-12-23 | 2009-02-05 | Graftech International Holdings Inc. | Flexible Graphite Thermal Management Devices |
-
2009
- 2009-07-01 TW TW098122234A patent/TW201103414A/en unknown
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JPS5742154A (en) * | 1980-08-26 | 1982-03-09 | Furukawa Electric Co Ltd:The | Heat pipe type heat sink |
US4638854A (en) * | 1983-06-15 | 1987-01-27 | Noren Don W | Heat pipe assembly |
US6006827A (en) * | 1998-12-28 | 1999-12-28 | Hon Hai Precision Ind. Co., Ltd. | Cooling device for computer component |
US6640888B1 (en) * | 2002-10-16 | 2003-11-04 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat sink |
US6712128B1 (en) * | 2002-11-20 | 2004-03-30 | Thermal Corp. | Cylindrical fin tower heat sink and heat exchanger |
US20090032227A1 (en) * | 2002-12-23 | 2009-02-05 | Graftech International Holdings Inc. | Flexible Graphite Thermal Management Devices |
US20080035321A1 (en) * | 2004-06-30 | 2008-02-14 | Daikin Industries, Ltd. | Heat Exchanger and Air Conditioner |
US20060102324A1 (en) * | 2004-11-12 | 2006-05-18 | International Business Machines Corporation | Cooling device using multiple fans and heat sinks |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20150008473A1 (en) * | 2013-07-08 | 2015-01-08 | Lg Electronics Inc. | Led light |
EP2824389A1 (en) * | 2013-07-08 | 2015-01-14 | LG Electronics, Inc. | LED Light |
US9627599B2 (en) * | 2013-07-08 | 2017-04-18 | Lg Electronics Inc. | LED lighting apparatus and heat dissipation module |
US9625104B2 (en) | 2013-07-10 | 2017-04-18 | Lg Electronics Inc. | LED light and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TW201103414A (en) | 2011-01-16 |
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Owner name: YOUNG GREEN ENERGY CO., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHIEN, CHAO-NAN;REEL/FRAME:024676/0148 Effective date: 20070504 |
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STCB | Information on status: application discontinuation |
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