US20110000648A1 - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

Info

Publication number
US20110000648A1
US20110000648A1 US12/801,627 US80162710A US2011000648A1 US 20110000648 A1 US20110000648 A1 US 20110000648A1 US 80162710 A US80162710 A US 80162710A US 2011000648 A1 US2011000648 A1 US 2011000648A1
Authority
US
United States
Prior art keywords
heat
heat dissipation
dissipation module
dissipating section
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/801,627
Inventor
Chao-Nan Chien
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Young Green Energy Co
Original Assignee
Young Green Energy Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Young Green Energy Co filed Critical Young Green Energy Co
Assigned to YOUNG GREEN ENERGY CO. reassignment YOUNG GREEN ENERGY CO. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIEN, CHAO-NAN
Publication of US20110000648A1 publication Critical patent/US20110000648A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00Spacing means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/02Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/04Fastening; Joining by brazing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention generally relates to a heat dissipation module, and more particularly, to a heat dissipation module having graphite fins.
  • a conventional method of removing the heat generated by the operating electrical elements is to dispose a heat dissipation module on the electrical elements, so that the heat dissipation module may dissipate the heat generated by the electrical elements to the environment.
  • TW patents Nos. 1241156, M332359, M336669, and 200815726 relate to the heat dissipation modules.
  • the invention is directed to a heat dissipation module having good heat dissipation efficiency and light weight.
  • An embodiment of the invention provides a heat dissipation module adapted for dissipating heat generated by a heat source.
  • the heat dissipation module includes at least one heat pipe and a heat dissipation fin assembly.
  • the heat pipe has a heat-absorbing section and a heat-dissipating section.
  • the heat dissipation fin assembly includes a plurality of graphite fins and a plurality of spacers, and the graphite fins and the spacers are connected to the heat-dissipating section alternately.
  • Each of the spacers has a first baffle board and a first convex part, the first baffle board is adjacent to the graphite fin, and the first convex part projects from the first baffle board along an extending direction of the heat-dissipating section.
  • the embodiment or the embodiments of the invention may have at least one of the following advantages.
  • the heat dissipation module uses graphite fins instead of the conventional metal fins, so that the heat dissipation module has light weight.
  • the spacers may keep a constant interval between the adjacent graphite fins.
  • protection components may reduce the probability of the graphite fins being broken by crashing.
  • FIG. 1 is a three dimensional diagram of a heat dissipation module according to one embodiment of the invention.
  • FIG. 2 is a partial explored diagram of the heat dissipation module in FIG. 1 .
  • FIG. 3 is a three dimensional diagram of the heat dissipation module from another view angle in FIG. 1 .
  • FIG. 4 is a partial explored diagram of the heat dissipation module in FIG. 3 .
  • FIG. 5 is a three dimensional diagram of the heat dissipation module in FIG. 3 with part of the heat dissipation removed.
  • FIG. 6 is a three dimensional diagram of a heat dissipation module according to another embodiment of the invention.
  • FIG. 7 is a partial explored diagram of the heat dissipation module in FIG. 6 .
  • FIG. 8 is a three dimensional diagram of the heat dissipation module in FIG. 6 with part of the heat dissipation removed.
  • the description of “A” component facing “B” component herein may contain the situations that “A” component directly faces “B” component or one or more additional components are between “A” component and “B” component.
  • the description of “A” component “adjacent to” “B” component herein may contain the situations that “A” component is directly “adjacent to” “B” component or one or more additional components are between “A” component and “B” component. Accordingly, the drawings and descriptions will be regarded as illustrative in nature and not as restrictive.
  • the heat dissipation module 10 is adapted for dissipating heat generated by a heat source (not shown).
  • the heat dissipation module 10 includes at least one heat pipe 100 , a heat dissipation fin assembly 200 , two protection components 300 , a jointing material 400 (shown in FIG. 5 ), and an absorbing unit 500 .
  • FIG. 2 and FIG. 4 are partial explored diagram of the heat dissipation module in FIGS. 1 and 3 to show interior structure of the heat dissipation fin assembly 200 .
  • the absorbing unit 500 is adapted to thermally conducting to the heat source to absorb the heat generated by the heat source, so as to conduct the heat to the heat dissipation fin assembly 200 through the heat pipe 100 .
  • the heat pipe 100 includes a heat-absorbing section 110 and a heat-dissipating section 120 .
  • the heat-absorbing section 110 thermally connects to the absorbing unit 500 .
  • the heat dissipation fin assembly 200 and the protection components 300 connect the heat-dissipating section 120 .
  • the heat dissipation fin assembly 200 is disposed between the protection components 300 .
  • the heat dissipation fin assembly 200 includes a plurality of graphite fins 210 and a plurality of spacers 220 , and the graphite fins 210 and the spacers 220 connect to the heat-dissipating section 120 alternately.
  • Each of the two adjacent graphite fins 210 may be separated by the spacer 220 disposed between the two adjacent graphite fins 210 . Accordingly, the spacer 220 may keep a constant interval between the two adjacent graphite fins 210 , and, for example, the interval between the two adjacent graphite fins 210 is equal to the thickness of the spacer 220 along the extending direction of the heat-dissipating section 120 .
  • the graphite fins 210 , the spacers 220 , and the protection components 300 are connected by the heat-dissipating section 120 , which is through the graphite fins 210 , the spacers 220 , and the protection components 300 .
  • the graphite fin 210 has at least one first through hole 212 .
  • the spacer 220 has at least one second through hole 222 .
  • the protection components 300 have at least one third hole 310 .
  • the heat-dissipating section 120 passes through the first through hole 212 , the second through hole 222 and the third through hole 310 to keep the graphite fins 210 , the spacers 220 , and the protection components 300 connecting with the heat-dissipating section 120 .
  • a jointing material 400 is disposed between the heat-dissipating section 120 and the heat dissipation fin assembly 200 , and between the heat-dissipating section 120 and the protection components 300 to make the heat dissipation fin assembly 200 and the protection components 300 connect to the heat dissipating section 120 closely.
  • the spacer 220 has a first baffle board 224 and a first convex part 226 .
  • the first convex part 226 surrounds at least a part of the boundary of the second through hole 222 , and projects from the first baffle board 224 along the extending direction of the heat-dissipating section 120 .
  • the first convex part 226 is away from the heat-absorbing section 110 and projects from the first baffle board 224 along the extending direction of the heat-dissipating section 120 .
  • the protection components 300 may have a second baffle board 320 and a second convex part 330 .
  • the second convex part 330 surrounds at least a part of the boundary of the third through hole 310 , and projects from the second baffle board 320 along the extending direction of the heat-dissipating section 120 .
  • the second convex part 330 is away from the heat-absorbing section 110 and projects from the second baffle board 320 along the extending direction of the heat-dissipating section 120 .
  • the spacers 220 and the protection components 300 are not only easy to be assembled to the heat-dissipating section 120 but also able to keep a constant interval between the two adjacent graphite fins 220 or between the graphite fin 220 and the protection components 300 .
  • a outline of the second baffle board 320 is substantially the same to a outline of the graphite fin 210 . Therefore, the second baffle board 320 may provide a good protection to the graphite fins 210 to reduce the probability of the graphite fins 210 being broken by crashing.
  • one of the protection components 300 may connect the heat-dissipating section 120 through the third through hole 310 , and the second convex part 330 is made to face the end of the heat-dissipating section 120 . Then a graphite fin 210 may connect the heat-dissipating section 120 through the first through hole 212 , and the graphite fin 210 is against the second convex part 330 of the protection components 300 .
  • a spacer 220 may connect the heat-dissipating section 120 through the second through hole 222 , so that the first convex part 226 faces the end of the heat-dissipating section 120 and the first baffle 224 is against the graphite fin 210 .
  • the rest graphite fins 210 and the spacers 220 are connected alternately to the heat-dissipating section 120 by the method described above.
  • the graphite fin 210 may be against the first convex part 226 of the former spacer 220 to keep a constant interval with the former graphite fin 210 .
  • the constant interval is the thickness of the first baffle 224 plus the thickness of the first convex part 226 along the extending direction of the heat-dissipating section 120 .
  • the other of protection components 300 may connect to the heat-dissipating section 120 , and the second baffle board 320 of the protection components 300 is against the first convex part 226 of the former spacer 220 to make the heat dissipation fin assembly 200 and the protection components 300 assemble on the heat-dissipating section 120 .
  • the two adjacent graphite fins 210 or the graphite fin 210 and the protection components 300 may keep a constant interval, and the heat conducted to the heat-dissipating section 120 may conduct to the environment through the graphite fin 210 , spacer 220 and the protection components 300 .
  • a jointing material 400 may be coated on the surface of the heat-dissipating section 120 .
  • the jointing material 400 is disposed between the heat-dissipating section 120 and the heat dissipation fin assembly 200 , and between the heat-dissipating section 120 and the protection components 300 .
  • each of the first through hole 212 , the second through hole 222 , and the third through hole 310 further includes a first opening 212 a , a second opening 222 a , and a third opening 312 respectively, so that the shapes of the first through hole 212 , the second through hole 222 , and the third through hole 310 are like the shape of gourd.
  • the jointing material 400 may be injected through the first opening 212 a , the second opening 222 a , and the third opening 312 to fill the gaps among the heat-dissipating section 120 and the first opening 212 a , a second opening 222 a , and a third opening 312 when the graphite fins 210 , the spacers 220 , and the protection components 300 connect to the heat-dissipating section 120 .
  • the heat dissipation module 200 and the protection components 300 may connect to the heat-dissipating section 120 firstly, and then the jointing material 400 may be respectively injected through the first opening 212 a , the second opening 222 a , and the third opening 312 to fill the gaps among the heat-dissipating section 120 , the first opening 212 a , a second opening 222 a , and a third opening 312 .
  • the jointing material 400 may be solder formed by reflowing the solder cream or other glues with good thermal conductivity.
  • the graphite fins 210 , the spacers 220 , and the protection components 300 of the heat dissipation module 10 may be respectively connected to the heat-dissipating section 120 through the jointing material 400 , and may increase the thermal conductive efficiency among the heat-dissipating section 120 , the graphite fins 210 , the spacers 220 , and the protection components 300 .
  • the difference between the heat dissipation module 10 ′ and the heat dissipation module 10 mentioned above is that the spacer 220 ′ of the heat dissipation 10 ′ may be a cylinder to keep a constant interval between the two adjacent graphite fins 210 .
  • the embodiment or the embodiments of the invention may have at least one of the following advantages.
  • the heat dissipation module of the invention uses graphite fins instead of the convention metal fins, so that the heat dissipation module has a light weight.
  • the spacers may keep a constant interval between the adjacent graphite fins.
  • protection components may reduce the probability of the graphite fins being broken by crashing.
  • the term “the invention”, “the present invention” or the like does not necessarily limit the claim scope to a specific embodiment, and the reference to particularly preferred exemplary embodiments of the invention does not imply a limitation on the invention, and no such limitation is to be inferred.
  • the invention is limited only by the spirit and scope of the appended claims.
  • the abstract of the disclosure is provided to comply with the rules requiring an abstract, which will allow a searcher to quickly ascertain the subject matter of the technical disclosure of any patent issued from this disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Any advantages and benefits described may not apply to all embodiments of the invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation module adapted for dissipating heat generated by a heat source includes at least a heat pipe and a heat dissipation fin assembly. The heat pipe has a heat-absorbing section and a heat-dissipating section. The heat dissipation fin assembly includes a plurality of graphite fins and a plurality of spacers and the graphite fins and the spacers are connected to the heat-dissipating section alternatively. Each of the spacers has a first baffle board and a first convex part, the first baffle board is adapted to be against the graphite fin, and the first convex part is adapted to project from the first baffle board along an extending direction of the heat-dissipating section.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • This application claims the priority benefit of Taiwan application serial no. 98122234, filed on Jul. 1, 2009. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
  • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The invention generally relates to a heat dissipation module, and more particularly, to a heat dissipation module having graphite fins.
  • 2. Description of Related Art
  • In recent years, with the improvement of technology, the operation efficiency of the electrical elements is getting higher, so that the heating power of the electrical elements increases as well. It is very important to provide sufficient heat dissipating ability of the electrical elements for preventing temporary or permanent failure of electronic elements caused by over heat
  • A conventional method of removing the heat generated by the operating electrical elements is to dispose a heat dissipation module on the electrical elements, so that the heat dissipation module may dissipate the heat generated by the electrical elements to the environment.
  • TW patents Nos. 1241156, M332359, M336669, and 200815726 relate to the heat dissipation modules.
  • SUMMARY OF THE INVENTION
  • Accordingly, the invention is directed to a heat dissipation module having good heat dissipation efficiency and light weight.
  • Other advantages of the invention should be further indicated by the disclosures of the invention, and omitted herein for simplicity.
  • An embodiment of the invention provides a heat dissipation module adapted for dissipating heat generated by a heat source. The heat dissipation module includes at least one heat pipe and a heat dissipation fin assembly. The heat pipe has a heat-absorbing section and a heat-dissipating section. The heat dissipation fin assembly includes a plurality of graphite fins and a plurality of spacers, and the graphite fins and the spacers are connected to the heat-dissipating section alternately. Each of the spacers has a first baffle board and a first convex part, the first baffle board is adjacent to the graphite fin, and the first convex part projects from the first baffle board along an extending direction of the heat-dissipating section.
  • In summary, the embodiment or the embodiments of the invention may have at least one of the following advantages. The heat dissipation module uses graphite fins instead of the conventional metal fins, so that the heat dissipation module has light weight. Besides, the spacers may keep a constant interval between the adjacent graphite fins. Moreover, protection components may reduce the probability of the graphite fins being broken by crashing.
  • Other objectives, features and advantages of the invention will be further understood from the further technological features disclosed by the embodiments of the invention wherein there are shown and described preferred embodiments of this invention, simply by way of illustration of modes best suited to carry out the invention.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
  • FIG. 1 is a three dimensional diagram of a heat dissipation module according to one embodiment of the invention.
  • FIG. 2 is a partial explored diagram of the heat dissipation module in FIG. 1.
  • FIG. 3 is a three dimensional diagram of the heat dissipation module from another view angle in FIG. 1.
  • FIG. 4 is a partial explored diagram of the heat dissipation module in FIG. 3.
  • FIG. 5 is a three dimensional diagram of the heat dissipation module in FIG. 3 with part of the heat dissipation removed.
  • FIG. 6 is a three dimensional diagram of a heat dissipation module according to another embodiment of the invention.
  • FIG. 7 is a partial explored diagram of the heat dissipation module in FIG. 6.
  • FIG. 8 is a three dimensional diagram of the heat dissipation module in FIG. 6 with part of the heat dissipation removed.
  • DESCRIPTION OF THE EMBODIMENTS
  • In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” etc., is used with reference to the orientation of the Figure(s) being described. The components of the invention can be positioned in a number of different orientations. As such, the directional terminology is used for purposes of illustration and is in no way limiting. On the other hand, the drawings are only schematic and the sizes of components may be exaggerated for clarity. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the invention. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless limited otherwise, the terms “connected,” “coupled,” and “mounted” and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. Similarly, the terms “facing,” “faces” and variations thereof herein are used broadly and encompass direct and indirect facing, and “adjacent to” and variations thereof herein are used broadly and encompass directly and indirectly “adjacent to”. Therefore, the description of “A” component facing “B” component herein may contain the situations that “A” component directly faces “B” component or one or more additional components are between “A” component and “B” component. Also, the description of “A” component “adjacent to” “B” component herein may contain the situations that “A” component is directly “adjacent to” “B” component or one or more additional components are between “A” component and “B” component. Accordingly, the drawings and descriptions will be regarded as illustrative in nature and not as restrictive.
  • Referring to FIG. 1 to FIG. 4, in one embodiment, the heat dissipation module 10 is adapted for dissipating heat generated by a heat source (not shown). The heat dissipation module 10 includes at least one heat pipe 100, a heat dissipation fin assembly 200, two protection components 300, a jointing material 400 (shown in FIG. 5), and an absorbing unit 500. Besides, FIG. 2 and FIG. 4 are partial explored diagram of the heat dissipation module in FIGS. 1 and 3 to show interior structure of the heat dissipation fin assembly 200.
  • The absorbing unit 500 is adapted to thermally conducting to the heat source to absorb the heat generated by the heat source, so as to conduct the heat to the heat dissipation fin assembly 200 through the heat pipe 100. The heat pipe 100 includes a heat-absorbing section 110 and a heat-dissipating section 120. The heat-absorbing section 110 thermally connects to the absorbing unit 500. The heat dissipation fin assembly 200 and the protection components 300 connect the heat-dissipating section 120. The heat dissipation fin assembly 200 is disposed between the protection components 300.
  • The heat dissipation fin assembly 200 includes a plurality of graphite fins 210 and a plurality of spacers 220, and the graphite fins 210 and the spacers 220 connect to the heat-dissipating section 120 alternately. Each of the two adjacent graphite fins 210 may be separated by the spacer 220 disposed between the two adjacent graphite fins 210. Accordingly, the spacer 220 may keep a constant interval between the two adjacent graphite fins 210, and, for example, the interval between the two adjacent graphite fins 210 is equal to the thickness of the spacer 220 along the extending direction of the heat-dissipating section 120.
  • In the embodiment, the graphite fins 210, the spacers 220, and the protection components 300 are connected by the heat-dissipating section 120, which is through the graphite fins 210, the spacers 220, and the protection components 300.
  • For example, the graphite fin 210 has at least one first through hole 212. The spacer 220 has at least one second through hole 222. And the protection components 300 have at least one third hole 310. The heat-dissipating section 120 passes through the first through hole 212, the second through hole 222 and the third through hole 310 to keep the graphite fins 210, the spacers 220, and the protection components 300 connecting with the heat-dissipating section 120.
  • Besides, a jointing material 400 is disposed between the heat-dissipating section 120 and the heat dissipation fin assembly 200, and between the heat-dissipating section 120 and the protection components 300 to make the heat dissipation fin assembly 200 and the protection components 300 connect to the heat dissipating section 120 closely.
  • Referring to FIG. 1 to FIG. 5, in the embodiment, the spacer 220 has a first baffle board 224 and a first convex part 226. The first convex part 226 surrounds at least a part of the boundary of the second through hole 222, and projects from the first baffle board 224 along the extending direction of the heat-dissipating section 120. For example, the first convex part 226 is away from the heat-absorbing section 110 and projects from the first baffle board 224 along the extending direction of the heat-dissipating section 120.
  • Similarly, in the embodiment, the protection components 300 may have a second baffle board320 and a second convex part 330. The second convex part 330 surrounds at least a part of the boundary of the third through hole 310, and projects from the second baffle board 320 along the extending direction of the heat-dissipating section 120. For example, the second convex part 330 is away from the heat-absorbing section 110 and projects from the second baffle board 320 along the extending direction of the heat-dissipating section 120.
  • In the embodiment, the spacers 220 and the protection components 300 are not only easy to be assembled to the heat-dissipating section 120 but also able to keep a constant interval between the two adjacent graphite fins 220 or between the graphite fin 220 and the protection components 300. Besides, a outline of the second baffle board 320 is substantially the same to a outline of the graphite fin 210. Therefore, the second baffle board 320 may provide a good protection to the graphite fins 210 to reduce the probability of the graphite fins 210 being broken by crashing.
  • Specifically, when the heat dissipation module 10 is assembled, one of the protection components 300 may connect the heat-dissipating section 120 through the third through hole 310, and the second convex part 330 is made to face the end of the heat-dissipating section 120. Then a graphite fin 210 may connect the heat-dissipating section 120 through the first through hole 212, and the graphite fin 210 is against the second convex part 330 of the protection components 300. Next, a spacer 220 may connect the heat-dissipating section 120 through the second through hole 222, so that the first convex part 226 faces the end of the heat-dissipating section 120 and the first baffle 224 is against the graphite fin 210.
  • Then, the rest graphite fins 210 and the spacers 220 are connected alternately to the heat-dissipating section 120 by the method described above. In this way, the graphite fin 210 may be against the first convex part 226 of the former spacer 220 to keep a constant interval with the former graphite fin 210. The constant interval is the thickness of the first baffle 224 plus the thickness of the first convex part 226 along the extending direction of the heat-dissipating section 120. At last, the other of protection components 300 may connect to the heat-dissipating section 120, and the second baffle board 320 of the protection components 300 is against the first convex part 226 of the former spacer 220 to make the heat dissipation fin assembly 200 and the protection components 300 assemble on the heat-dissipating section 120.
  • When the heat dissipation module 10 is assembled, the two adjacent graphite fins 210 or the graphite fin 210 and the protection components 300 may keep a constant interval, and the heat conducted to the heat-dissipating section 120 may conduct to the environment through the graphite fin 210, spacer 220 and the protection components 300.
  • Moreover, a jointing material 400 may be coated on the surface of the heat-dissipating section 120. When the graphite fins 210, the spacers 220, and the protection components 300 connect with the heat-dissipating section 120 through the first through hole 212, the second through hole 222, and the third through hole 310, the jointing material 400 is disposed between the heat-dissipating section 120 and the heat dissipation fin assembly 200, and between the heat-dissipating section 120 and the protection components 300.
  • Besides, in the embodiment, each of the first through hole 212, the second through hole 222, and the third through hole 310 further includes a first opening 212 a, a second opening 222 a, and a third opening 312 respectively, so that the shapes of the first through hole 212, the second through hole 222, and the third through hole 310 are like the shape of gourd. The jointing material 400 may be injected through the first opening 212 a, the second opening 222 a, and the third opening 312 to fill the gaps among the heat-dissipating section 120 and the first opening 212 a, a second opening 222 a, and a third opening 312 when the graphite fins 210, the spacers 220, and the protection components 300 connect to the heat-dissipating section 120.
  • In the other way, the heat dissipation module 200 and the protection components 300 may connect to the heat-dissipating section 120 firstly, and then the jointing material 400 may be respectively injected through the first opening 212 a, the second opening 222 a, and the third opening 312 to fill the gaps among the heat-dissipating section 120, the first opening 212 a, a second opening 222 a, and a third opening 312.
  • In the embodiment, the jointing material 400 may be solder formed by reflowing the solder cream or other glues with good thermal conductivity. The graphite fins 210, the spacers 220, and the protection components 300 of the heat dissipation module 10 may be respectively connected to the heat-dissipating section 120 through the jointing material 400, and may increase the thermal conductive efficiency among the heat-dissipating section 120, the graphite fins 210, the spacers 220, and the protection components 300.
  • Referring to FIG. 6 to FIG. 8, the difference between the heat dissipation module 10′ and the heat dissipation module 10 mentioned above is that the spacer 220′ of the heat dissipation 10′ may be a cylinder to keep a constant interval between the two adjacent graphite fins 210.
  • In summary, the embodiment or the embodiments of the invention may have at least one of the following advantages. The heat dissipation module of the invention uses graphite fins instead of the convention metal fins, so that the heat dissipation module has a light weight. Besides, the spacers may keep a constant interval between the adjacent graphite fins. Moreover, protection components may reduce the probability of the graphite fins being broken by crashing.
  • The foregoing description of the preferred embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form or to exemplary embodiments disclosed. Accordingly, the foregoing description should be regarded as illustrative rather than restrictive. Obviously, many modifications and variations will be apparent to practitioners skilled in this art. The embodiments are chosen and described in order to best explain the principles of the invention and its best mode practical application, thereby to enable persons skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use or implementation contemplated. It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents in which all terms are meant in their broadest reasonable sense unless otherwise indicated. Therefore, the term “the invention”, “the present invention” or the like does not necessarily limit the claim scope to a specific embodiment, and the reference to particularly preferred exemplary embodiments of the invention does not imply a limitation on the invention, and no such limitation is to be inferred. The invention is limited only by the spirit and scope of the appended claims. The abstract of the disclosure is provided to comply with the rules requiring an abstract, which will allow a searcher to quickly ascertain the subject matter of the technical disclosure of any patent issued from this disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Any advantages and benefits described may not apply to all embodiments of the invention. It should be appreciated that variations may be made in the embodiments described by persons skilled in the art without departing from the scope of the present invention as defined by the following claims. Moreover, no element and component in the present disclosure is intended to be dedicated to the public regardless of whether the element or component is explicitly recited in the following claims.

Claims (18)

1. A heat dissipation module, adapted for dissipating heat generated by a heat source, the heat dissipation module comprising:
at least one heat pipe, having a heat-absorbing section and a heat-dissipating section; and
a heat dissipation fin assembly comprising:
a plurality of graphite fins; and
a plurality of spacers, wherein the graphite fins and the spacers connect to the heat-dissipating section alternately and each of the spacers has a first baffle board and a first convex part, the first baffle board is adjacent to the graphite fin and the first convex part projects from the first baffle board along an extending direction of the heat-dissipating section.
2. The heat dissipation module according to claim 1, further comprising two protection components connected to the heat-dissipating section and clipped the heat-dissipating fin assembly between the protection components.
3. The heat dissipation module according to claim 2, further comprising a jointing material disposed between the heat-dissipating section and the heat-dissipating fin assembly.
4. The heat dissipation module according to claim 1, further comprising an absorbing unit adapted to be thermally conducted to the heat source and the heat-absorbing section thermally conducted to the adsorbing unit.
5. The heat dissipation module according to claim 1, wherein each of the graphite fins has at least one first through hole and the heat-dissipating section passes through the first through hole and a jointing material is disposed between the first through hole and the heat-dissipating section.
6. The heat dissipation module according to claim 5, wherein each of the first through holes has a first opening and the jointing material is disposed between the first opening and the heat-dissipating section.
7. The heat dissipation module according to claim 1, wherein each of the spacers has at least one second through hole and the heat-dissipating section passes through the second through hole and a jointing material is disposed between the second through hole and the heat-dissipating section.
8. The heat dissipation module according to claim 7, wherein each of the second through holes has a second opening and the jointing material is disposed between the second opening and the heat-dissipating section.
9. The heat dissipation module according to claim 7, wherein each of the spacers is a cylinder.
10. The heat dissipation module according to claim 7, wherein the first convex part surrounds at least a part of the edge of the second through hole.
11. The heat dissipation module according to claim 10, wherein each of the first convex part is away from the absorbing section and projects from the first baffle board along the extending direction of the heat-dissipating section.
12. The heat dissipation module according to claim 1, wherein each of the protection components has at least one third through hole and the heat-dissipating section passes through the third through hole and the jointing material is disposed between the third through hole and the heat-dissipating section.
13. The heat dissipation module according to claim 12, wherein each of the third through holes has a third opening and the jointing material is disposed between the third opening and the heat-dissipating section.
14. The heat dissipation module according to claim 12, wherein each of the protection components has a second baffle board and a second convex part and the second convex part surrounds at least a part of the edge of the third through hole and the second convex part projects from the second baffle board along the extending direction of the heat-dissipating section for being against the graphite fin or the spacer.
15. The heat dissipation module according to claim 14, wherein each of the second convex parts is away from the absorbing section and projects from the second baffle board along the extending direction of the heat-dissipating section.
16. The heat dissipation module according to claim 14, wherein an outline of the second baffle board is substantially the same as an outline of the graphite fin.
17. The heat dissipation module according to claim 3, wherein the jointing material is solder or glue.
18. The heat dissipation module according to claim 2, further comprising a jointing material disposed between the heat-dissipating section and the protection components.
US12/801,627 2009-07-01 2010-06-17 Heat dissipation module Abandoned US20110000648A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW098122234 2009-07-01
TW098122234A TW201103414A (en) 2009-07-01 2009-07-01 Heat dissipation module

Publications (1)

Publication Number Publication Date
US20110000648A1 true US20110000648A1 (en) 2011-01-06

Family

ID=43411999

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/801,627 Abandoned US20110000648A1 (en) 2009-07-01 2010-06-17 Heat dissipation module

Country Status (2)

Country Link
US (1) US20110000648A1 (en)
TW (1) TW201103414A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150008473A1 (en) * 2013-07-08 2015-01-08 Lg Electronics Inc. Led light
US9625104B2 (en) 2013-07-10 2017-04-18 Lg Electronics Inc. LED light and method of manufacturing the same

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742154A (en) * 1980-08-26 1982-03-09 Furukawa Electric Co Ltd:The Heat pipe type heat sink
US4638854A (en) * 1983-06-15 1987-01-27 Noren Don W Heat pipe assembly
US6006827A (en) * 1998-12-28 1999-12-28 Hon Hai Precision Ind. Co., Ltd. Cooling device for computer component
US6640888B1 (en) * 2002-10-16 2003-11-04 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US6712128B1 (en) * 2002-11-20 2004-03-30 Thermal Corp. Cylindrical fin tower heat sink and heat exchanger
US20060102324A1 (en) * 2004-11-12 2006-05-18 International Business Machines Corporation Cooling device using multiple fans and heat sinks
US20080035321A1 (en) * 2004-06-30 2008-02-14 Daikin Industries, Ltd. Heat Exchanger and Air Conditioner
US20090032227A1 (en) * 2002-12-23 2009-02-05 Graftech International Holdings Inc. Flexible Graphite Thermal Management Devices

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742154A (en) * 1980-08-26 1982-03-09 Furukawa Electric Co Ltd:The Heat pipe type heat sink
US4638854A (en) * 1983-06-15 1987-01-27 Noren Don W Heat pipe assembly
US6006827A (en) * 1998-12-28 1999-12-28 Hon Hai Precision Ind. Co., Ltd. Cooling device for computer component
US6640888B1 (en) * 2002-10-16 2003-11-04 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US6712128B1 (en) * 2002-11-20 2004-03-30 Thermal Corp. Cylindrical fin tower heat sink and heat exchanger
US20090032227A1 (en) * 2002-12-23 2009-02-05 Graftech International Holdings Inc. Flexible Graphite Thermal Management Devices
US20080035321A1 (en) * 2004-06-30 2008-02-14 Daikin Industries, Ltd. Heat Exchanger and Air Conditioner
US20060102324A1 (en) * 2004-11-12 2006-05-18 International Business Machines Corporation Cooling device using multiple fans and heat sinks

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150008473A1 (en) * 2013-07-08 2015-01-08 Lg Electronics Inc. Led light
EP2824389A1 (en) * 2013-07-08 2015-01-14 LG Electronics, Inc. LED Light
US9627599B2 (en) * 2013-07-08 2017-04-18 Lg Electronics Inc. LED lighting apparatus and heat dissipation module
US9625104B2 (en) 2013-07-10 2017-04-18 Lg Electronics Inc. LED light and method of manufacturing the same

Also Published As

Publication number Publication date
TW201103414A (en) 2011-01-16

Similar Documents

Publication Publication Date Title
CN100456461C (en) Heat sink of heat pipe
KR200465559Y1 (en) Heat sink
US7852630B2 (en) Heat dissipating device
US7837358B2 (en) Light-emitting diode module with heat dissipating structure
US20070115632A1 (en) Modularized redundant heat sink for dissipating heat generated from chips
US20120222839A1 (en) Heat pipe assembly
US8371700B2 (en) Heat dissipation module and projection apparatus using the same
US20120080177A1 (en) High-power finless heat dissipation module
US20080037222A1 (en) Heat dissipation assembly
JP2011091088A (en) Heat radiation structure of heating element and semiconductor device using the heat radiation structure
TWI531303B (en) Heat dissipation module
TW200836044A (en) Heat-dissipating module
US20130107547A1 (en) Heat pipe, heat dissipating module and illumination device
US20130168055A1 (en) Thermal module
US20110000648A1 (en) Heat dissipation module
US20100038064A1 (en) Reinforced Thermal Module Structure
TWM591754U (en) Fastening structure of heat dissipation module
US20050199377A1 (en) Heat dissipation module with heat pipes
US20110290450A1 (en) Heat Dissipation Module
US20110214842A1 (en) Heat sink
CN209748687U (en) TOF camera with heat radiation structure
JP2006203014A (en) Heat radiating component
JP6432295B2 (en) Waste heat device
JP3151098U (en) Heat dissipation module
JP2006203016A (en) Heat radiating component

Legal Events

Date Code Title Description
AS Assignment

Owner name: YOUNG GREEN ENERGY CO., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHIEN, CHAO-NAN;REEL/FRAME:024676/0148

Effective date: 20070504

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION