US20100221412A1 - Method for manufacturing a substrate - Google Patents
Method for manufacturing a substrate Download PDFInfo
- Publication number
- US20100221412A1 US20100221412A1 US12/577,827 US57782709A US2010221412A1 US 20100221412 A1 US20100221412 A1 US 20100221412A1 US 57782709 A US57782709 A US 57782709A US 2010221412 A1 US2010221412 A1 US 2010221412A1
- Authority
- US
- United States
- Prior art keywords
- substrate
- copper
- traces
- manufacturing
- dry film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Definitions
- Embodiments of the present disclosure relate to substrate manufacturing, and especially to a method for manufacturing a substrate having a substantially even surface.
- FIG. 2 is a schematic diagram of a commonly manufactured substrate 10 .
- At least one electronic component 11 is disposed on a first surface of the substrate 10 .
- a second surface of the substrate 10 opposite to the first surface receives circuit traces.
- copper is coated on the second surface of the substrate 10 , and a plurality of circuit traces 12 are designed on the copper layer.
- Liquid solder mask 14 is coated on part of and around the circuit traces 12 , providing protection thereof and exposing other parts of the circuit traces 12 .
- the bare circuit traces 12 are plated.
- the method described can result in a surface that is uneven due to unstable distribution of liquid solder mask 14 . Accordingly, the substrate 10 is easily deformed during a subsequent process, and solder between the electronic components 11 and the substrate 10 may be easily cracked.
- FIG. 1A is a schematic diagram of a substrate manufactured by a method for manufacturing a substrate according to the present disclosure, after applying copper on one surface of the substrate.
- FIG. 1B is a schematic diagram of a substrate manufactured by a method for manufacturing a substrate according to the present disclosure, after coating and flattening dry films thereon.
- FIG. 1C is a schematic diagram of a substrate manufactured by a method for manufacturing a substrate according to the present disclosure, after plating.
- FIG. 2 is a schematic diagram of a commonly manufactured substrate.
- At least one electronic component 21 is soldered or surface mounted on a first surface of a substrate 20 .
- a second surface of the substrate 20 opposite to the first surface, receives circuit traces to electrically connect the at least one electronic component 21 .
- the substrate 20 may be an organic substrate used in an exemplary Land Grid Array (LGA) module.
- LGA Land Grid Array
- the second surface of the substrate 20 is coated with copper to form a plurality of copper traces 22 .
- the plurality of copper traces 22 define one or more copper clearance areas 23 therebetween on the second surface.
- one portion of the plurality of copper traces 22 and the copper clearance areas 23 are coated with dry film 24 , and the other portion of the plurality of copper traces 22 remain uncoated.
- the dry film on the substrate 20 is flattened to form a dry film layer 24 .
- the dry film layer 24 has an even surface, as shown in FIG. 1B .
- the other partial portion of the copper traces 22 are plated with a inductive material to form a plating layer 26 .
- the material may be gold and/or nickel.
- a surface of the plating layer 26 is secured to be substantially coplanar with a surface of the dry film layer 24 so as to obtain a substantially even surface.
- the substrate 20 manufactured via the method disclosed has an even second surface, and is thus able to maintain its shape during manufacture and solder between the electronic component 21 , and is not easily cracked.
Abstract
In a method for manufacturing a substrate, copper is applied to one surface of the substrate to form a plurality of circuit traces, defining one or more copper clearance areas therebetween. Dry film is coated on one portion of the circuit traces and the one or more copper clearance areas, and another portion of the plurality of copper traces remains uncoated. The dry film on the substrate is flattened to form a dry film layer. The other portion of the plurality of circuit traces is plated to form a plating layer. A surface of the plating layer is substantially coplanar with a surface of the dry film layer.
Description
- 1. Technical Field
- Embodiments of the present disclosure relate to substrate manufacturing, and especially to a method for manufacturing a substrate having a substantially even surface.
- 2. Description of Related Art
-
FIG. 2 is a schematic diagram of a commonly manufacturedsubstrate 10. At least oneelectronic component 11 is disposed on a first surface of thesubstrate 10. A second surface of thesubstrate 10 opposite to the first surface receives circuit traces. During manufacture of the second surface of thesubstrate 10, copper is coated on the second surface of thesubstrate 10, and a plurality ofcircuit traces 12 are designed on the copper layer.Liquid solder mask 14 is coated on part of and around thecircuit traces 12, providing protection thereof and exposing other parts of thecircuit traces 12. Thebare circuit traces 12 are plated. However, the method described can result in a surface that is uneven due to unstable distribution ofliquid solder mask 14. Accordingly, thesubstrate 10 is easily deformed during a subsequent process, and solder between theelectronic components 11 and thesubstrate 10 may be easily cracked. - Therefore, a need exists in the industry to overcome the described limitations.
-
FIG. 1A is a schematic diagram of a substrate manufactured by a method for manufacturing a substrate according to the present disclosure, after applying copper on one surface of the substrate. -
FIG. 1B is a schematic diagram of a substrate manufactured by a method for manufacturing a substrate according to the present disclosure, after coating and flattening dry films thereon. -
FIG. 1C is a schematic diagram of a substrate manufactured by a method for manufacturing a substrate according to the present disclosure, after plating. -
FIG. 2 is a schematic diagram of a commonly manufactured substrate. - Referring
FIG. 1A-FIG . 1C, in a method for manufacturing a substrate according to the present disclosure, at least oneelectronic component 21 is soldered or surface mounted on a first surface of asubstrate 20. A second surface of thesubstrate 20, opposite to the first surface, receives circuit traces to electrically connect the at least oneelectronic component 21. In one embodiment, thesubstrate 20 may be an organic substrate used in an exemplary Land Grid Array (LGA) module. - A method for manufacturing the
substrate 20 to obtain a substantially even surface of the substrate, such as the second surface, according to the present disclosure, follows. - Referring to
FIG. 1A , the second surface of thesubstrate 20 is coated with copper to form a plurality ofcopper traces 22. The plurality ofcopper traces 22 define one or morecopper clearance areas 23 therebetween on the second surface. - Referring to
FIG. 1B , one portion of the plurality ofcopper traces 22 and thecopper clearance areas 23 are coated withdry film 24, and the other portion of the plurality ofcopper traces 22 remain uncoated. - The dry film on the
substrate 20 is flattened to form adry film layer 24. Thedry film layer 24 has an even surface, as shown inFIG. 1B . - Finally, referring to
FIG. 1C , the other partial portion of thecopper traces 22 are plated with a inductive material to form aplating layer 26. In one embodiment, the material may be gold and/or nickel. - In the manufacturing process, a surface of the
plating layer 26 is secured to be substantially coplanar with a surface of thedry film layer 24 so as to obtain a substantially even surface. Thesubstrate 20 manufactured via the method disclosed has an even second surface, and is thus able to maintain its shape during manufacture and solder between theelectronic component 21, and is not easily cracked. - Although the features and elements of the present disclosure are described as embodiments in particular combinations, each feature or element can be used alone or in other various combinations within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (3)
1. A method for manufacturing a substrate to obtain an even surface thereof, the method comprising:
applying copper to one surface of the substrate to form a plurality of copper traces, wherein the plurality of cooper traces defines one or more copper clearance areas therebetween;
coating dry film on one portion of the plurality of copper traces and the one or more copper clearance areas, wherein another portion of the plurality of copper traces remain uncoated;
flattening the dry films to form a dry film layer; and
plating the other portion of the plurality of copper traces to form a plating layer;
2. The method for manufacturing a substrate as claimed in claim 1 , wherein gold and/or nickel is during plated on the other partial portion of the plurality of copper traces.
3. The method for manufacturing a substrate as claimed in claim 1 , wherein the substrate comprises at least one electronic component on a first surface thereof, and the plurality of copper traces are designed on a second surface opposite to the first surface of the substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098106506A TW201032687A (en) | 2009-02-27 | 2009-02-27 | Method for leveling surface of LGA substrate |
TW98106506 | 2009-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100221412A1 true US20100221412A1 (en) | 2010-09-02 |
Family
ID=42667247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/577,827 Abandoned US20100221412A1 (en) | 2009-02-27 | 2009-10-13 | Method for manufacturing a substrate |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100221412A1 (en) |
TW (1) | TW201032687A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111372390A (en) * | 2020-03-16 | 2020-07-03 | 信泰电子(西安)有限公司 | Gold plating process |
CN112770541A (en) * | 2020-12-07 | 2021-05-07 | 深圳市隆利科技股份有限公司 | Processing method for improving surface roughness of flexible circuit board and flexible circuit board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060079127A1 (en) * | 2004-10-01 | 2006-04-13 | Socketstrate, Inc. | Structure and method of making interconnect element, and multilayer wiring board including the interconnect element |
US20070096285A1 (en) * | 2005-11-02 | 2007-05-03 | Chin-Tien Chiu | Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die |
-
2009
- 2009-02-27 TW TW098106506A patent/TW201032687A/en unknown
- 2009-10-13 US US12/577,827 patent/US20100221412A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060079127A1 (en) * | 2004-10-01 | 2006-04-13 | Socketstrate, Inc. | Structure and method of making interconnect element, and multilayer wiring board including the interconnect element |
US20070096285A1 (en) * | 2005-11-02 | 2007-05-03 | Chin-Tien Chiu | Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111372390A (en) * | 2020-03-16 | 2020-07-03 | 信泰电子(西安)有限公司 | Gold plating process |
CN112770541A (en) * | 2020-12-07 | 2021-05-07 | 深圳市隆利科技股份有限公司 | Processing method for improving surface roughness of flexible circuit board and flexible circuit board |
Also Published As
Publication number | Publication date |
---|---|
TW201032687A (en) | 2010-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10791625B2 (en) | Method for manufacturing flexible printed circuit board | |
US20110108983A1 (en) | Integrated Circuit | |
WO2017071394A1 (en) | Printed circuit board and fabrication method therefor | |
US20180332714A1 (en) | Printed circuit board and method of fabricating the same | |
US20100295168A1 (en) | Semiconductor package using conductive plug to replace solder ball | |
KR100915277B1 (en) | Process for producing wiring circuit board | |
JP6109078B2 (en) | Electronic device tape with enhanced lead cracks | |
US20110123930A1 (en) | Ceramic substrate preparation process | |
US20100221412A1 (en) | Method for manufacturing a substrate | |
US9474162B2 (en) | Circuit substrate and method of manufacturing same | |
US20210375729A1 (en) | Multi-pitch leads | |
US20120049363A1 (en) | Package structure | |
US20030164303A1 (en) | Method of metal electro-plating for IC package substrate | |
TWI507108B (en) | Flexible circuit board and method for manufacturing same | |
TW201728238A (en) | Substrate structure and manufacturing method thereof | |
TWI657552B (en) | Chip packaging and composite system board | |
TWI625799B (en) | Manufacturing method of lead frame structure | |
JP2006253574A (en) | Manufacturing method of wiring board | |
JP2016536566A (en) | Semiconductor inspection pad in which thin metal plates are laminated and manufacturing method | |
US10461004B2 (en) | Integrated circuit substrate and method of producing thereof | |
US20090294971A1 (en) | Electroless nickel leveling of lga pad sites for high performance organic lga | |
US20230397337A1 (en) | Method for manufacturing substrate with built-in components, and substrate with built-in components | |
CN101834168B (en) | Combined type circuit substrate structure | |
JP2008084928A (en) | Method of manufacturing tab tape for semiconductor device | |
KR101600202B1 (en) | Structure of the circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FU, CHING-YAO;REEL/FRAME:023360/0871 Effective date: 20090916 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |