US20100006880A1 - Led chip package structure using sedimentation and method for making the same - Google Patents
Led chip package structure using sedimentation and method for making the same Download PDFInfo
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- US20100006880A1 US20100006880A1 US12/457,222 US45722209A US2010006880A1 US 20100006880 A1 US20100006880 A1 US 20100006880A1 US 45722209 A US45722209 A US 45722209A US 2010006880 A1 US2010006880 A1 US 2010006880A1
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- Prior art keywords
- package
- colloid layer
- powder
- receiving space
- light
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- 238000004062 sedimentation Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims description 38
- 239000000084 colloidal system Substances 0.000 claims abstract description 161
- 239000000843 powder Substances 0.000 claims abstract description 118
- 238000010438 heat treatment Methods 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000000151 deposition Methods 0.000 claims description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 121
- 230000008021 deposition Effects 0.000 description 8
- 239000002355 dual-layer Substances 0.000 description 6
- 230000003247 decreasing effect Effects 0.000 description 4
- 239000002932 luster Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Definitions
- the present invention relates to an LED chip package structure and a method for making the same, and particularly relates to an LED chip package structure using sedimentation and a method for making the same.
- a known LED package structure includes a substrate 1 , an LED 2 disposed on the substrate 1 , two wires 3 , and a colloid layer 4 with phosphor powder 40 .
- the LED 2 has a light-emitting surface 20 opposite to the substrate 1 .
- the LED 2 has a positive electrode area 21 and a negative electrode area 22 electrically connected to two corresponding positive and negative electrode areas 11 , 12 of the substrate 1 via the two 3 respectively.
- the colloid layer 4 with the phosphor powder 40 covers the LED 2 and the two wires 3 for protecting the LED 2 . Therefore, when the LED 2 is a blue LED, the blue light generated by the blue LED can pass through the colloid layer 4 with the phosphor powder 40 to generate white light.
- the phosphor powder 40 does not be uniformly mixed into the colloid layer 4 .
- the blue light generated by the blue LED can pass through the colloid layer 4 with the phosphor powder 40 to generate white light, “the condensing capability” and “the color and luster” of the white light are bad and non-uniform.
- One particular aspect of the present invention is to provide an LED chip package structure using sedimentation and a method for making the same. Because the powder of the present invention can be fully deposited on the inner surface of the package body, “the condensing capability” and “the color and luster” of the present invention are good and uniform. In other words, the powder of the present invention can be fully deposited on the inner surface of the package body, so that light generated by the light-emitting elements can pass through the uniform package colloid layer to project uniform light beams out. Hence, the present invention can generate a best light-projecting quality.
- the present invention provides an LED chip package structure using sedimentation, including: a package body, at least two conductive substrates, at least one light-emitting element, and a package unit.
- the package body has a receiving space.
- the two conductive substrates are received in the receiving space.
- the light-emitting element is received in the receiving space and electrically connected to the two conductive substrates.
- the powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
- the package unit has the following three aspects:
- the package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space.
- the package unit has a package colloid layer with powder and a transparent colloid layer received in the receiving space.
- the light-emitting element is covered by the package colloid layer with the powder, and the transparent colloid layer is disposed on the package colloid layer in order to protect the package colloid layer.
- the package unit has a package colloid layer with powder and a transparent colloid layer received in the receiving space.
- the light-emitting element is covered by the transparent colloid layer, and the package colloid layer is disposed on the transparent colloid layer in order to prevent the quality of the package colloid layer from being affected by heat generated by the light-emitting element.
- the present invention provides a method for making an LED chip package structure using sedimentation, including: receiving at least one light-emitting element in a receiving space of a package body; electrically connecting the light-emitting element with two conductive substrates that are received in the receiving space; filling a package colloid layer with powder into the receiving space; and maintaining the package colloid layer with the powder at room temperature in order to uniformly depositing the powder in the receiving space.
- the method further includes heating the package colloid layer with the powder in order to solidify the package colloid layer with the powder in the receiving space.
- the step of heating the package colloid layer is a one-step heating process that includes a heating temperature of 80 ⁇ 150° C. and a heating time of 1 ⁇ 6 hours;
- the step of heating the package colloid layer is a two-step heating process that includes a first-step heating process and a second-step heating process, the first-step heating process has a heating temperature of 30 ⁇ 100° C. and a heating time of 10 ⁇ 120 minutes, and the second-step heating process has a heating temperature of 80 ⁇ 150° C. and a heating time of 1 ⁇ 6 hours.
- the method further includes: filling a transparent colloid layer in the receiving space of the package body in order to form the transparent colloid layer on the package colloid layer with the powder; and heating the transparent colloid layer to 80-150° C. during 1-6 hours in order to solidify the transparent colloid layer.
- the method before the step of filling the package colloid layer with the powder into the receiving space, the method further includes: filling a transparent colloid layer in the receiving space of the package body in order to cover the light-emitting element; and heating the transparent colloid layer to 80-150° C. during 1-6 hours in order to solidify the transparent colloid layer, wherein the package colloid layer is disposed on the transparent colloid layer.
- the package colloid layer with the powder is fully deposited firstly, and then the package colloid layer with the powder is heated, in order to make the powder be fully deposited in the receiving space of the package body.
- the present invention can prevent non-deposited powder from be solidified in the receiving space of the package body.
- the curing time can be decreased, so that the usage life of the package colloid layer with the powder is increased.
- the present invention has the following three deposition types according to different light-projecting properties and package structures
- First type is a single deposition as the first embodiment.
- the advantage is: the manufacture process is simple.
- Second type is a dual-layer structure with an inner deposition as the second embodiment.
- the advantage is: the dual-layer structure has two colloid layers that have the same or different physical property and chemical property such as adhesiveness, hardness or refractive index etc.
- the optical quality and the package structure of the second type are good.
- Third type is a dual-layer structure with an outer deposition as the third embodiment.
- the advantage is: the package colloid layer is disposed on the transparent colloid layer in order to prevent the quality and the usage life of the package colloid layer from being affected (decreased) by heat generated by the light-emitting element.
- FIG. 1 is a lateral, schematic view of an LED package structure by wire-bounding according to the prior art
- FIG. 2 is a flowchart of a method for making an LED chip package structure using sedimentation according to the first embodiment of the present invention
- FIGS. 2A to 2C are cross-sectional views of an LED chip package structure using sedimentation according to the first embodiment of the present invention, at different stages of the packaging processes, respectively;
- FIG. 3 is a flowchart of a method for making an LED chip package structure using sedimentation according to the second embodiment of the present invention
- FIGS. 3A to 3C are cross-sectional views of an LED chip package structure using sedimentation according to the second embodiment of the present invention, at different stages of the packaging processes, respectively;
- FIG. 4 is a flowchart of a method for making an LED chip package structure using sedimentation according to the third embodiment of the present invention.
- FIGS. 4A to 4C are cross-sectional views of an LED chip package structure using sedimentation according to the third embodiment of the present invention, at different stages of the packaging processes, respectively;
- FIGS. 5A and 5B are schematic views of a first method for depositing the powder according to the present invention, respectively;
- FIGS. 6A and 6B are schematic views of a second method for depositing the powder according to the present invention, respectively.
- FIGS. 7A and 7B are schematic views of a third method for depositing the powder according to the present invention, respectively.
- the first embodiment of the present invention provides a method for making an LED chip package structure using sedimentation, including the following steps:
- Step S 100 is: referring to FIGS. 2 and 2A , receiving at least one light-emitting element la in a receiving space 20 a of a package body 2 a.
- the light-emitting element la can be a blue LED
- the package body 2 a has a bowl shape.
- the light-emitting element 1 a is firmly fixed on the inner surface of the bowl-shaped package body 2 a via a chip-positioning layer 3 a formed between the light-emitting element 1 a and the package body 2 a.
- the chip-positioning layer 3 a is solidified by curing to 155° C. during 3 hours in order to firmly fix the light-emitting element 1 a on the inner surface of the bowl-shaped package body 2 a.
- Step S 102 is: referring to FIGS. 2 and 2A , electrically connecting the light-emitting element 1 a with two conductive substrates ( 40 a, 41 a ) that are received in the receiving space 20 a.
- at least two lead wires 5 a are electrically connected between the light-emitting element 1 a and one conductive substrate (positive electrode) 40 a and between the light-emitting element 1 a and one conductive substrate (negative electrode) 41 a.
- the positive electrode (not shown) and the negative electrode (not shown) of the light-emitting element 1 a are respectively electrically connected with the two conductive substrates ( 40 a, 41 a ) by wire-bonding.
- Step S 104 is: referring to FIGS. 2 and 2B , filling a package colloid layer 6 a with powder 60 a (the package unit) into the receiving space 20 a.
- the powder 60 a can be phosphor powder
- the package colloid layer 6 a can be silicone or epoxy.
- the package colloid layer 6 a with the powder 60 a can be filled into the receiving space 20 a by dropping, press molding or spraying according to different requirements.
- Step S 106 is: referring to FIGS. 2 and 2C , maintaining the package colloid layer 6 a with the powder 60 a at room temperature in order to uniformly depositing the powder 60 a ′ in the receiving space 20 a.
- the powder 60 a ′ can be deposited on the light-emitting element 1 a, the two conductive substrates ( 40 a, 41 a ) and an inner surface of the package body 2 a.
- the room temperature is defined as 13-25° C.
- the package colloid layer 6 a is maintained at 1-168 hours according the properties of the package colloid layer 6 a.
- Step S 108 is: heating the package colloid layer 6 a ′ with the powder 60 a ′ in order to solidify the package colloid layer 6 a ′ with the powder 60 a ′ in the receiving space 20 a.
- the heating step includes the following two methods according to different manufacturing requirements:
- the step of heating the package colloid layer 6 a ′ is a one-step heating process that includes a heating temperature of 80 ⁇ 150° C. and a heating time of 1 ⁇ 6 hours.
- the step of heating the package colloid layer 6 a ′ is a two-step heating process that includes a first-step heating process and a second-step heating process, the first-step heating process has a heating temperature of 30 ⁇ 100° C. and a heating time of 10 ⁇ 120 minutes, and the second-step heating process has a heating temperature of 80 ⁇ 150° C. and a heating time of 1 ⁇ 6 hours.
- the package colloid layer 6 a with the powder 60 a is fully deposited firstly as shown in FIG. 2B , and then the package colloid layer 6 a ′ with the powder 60 a ′ is heated as shown in FIG. 2C , in order to make the powder 60 a be fully deposited as the powder 60 a ′ on the inner surface of the package body 2 a.
- the present invention can prevent non-deposited powder from be solidified in the inner surface of the package body 2 a.
- the first embodiment of the present invention provides an LED chip package structure using sedimentation, including: at least one light-emitting element 1 a, a package body 2 a, at least two conductive substrates ( 40 a, 41 a ), and a package unit.
- the package body 2 a has a receiving space 20 a.
- the two conductive substrates ( 40 a, 41 a ) are received in the receiving space 20 a.
- the light-emitting element 1 a is received in the receiving space 20 a and electrically connected to the two conductive substrates ( 40 a, 41 a ).
- the package unit has a package colloid layer 6 a ′ and a powder 60 a ′ mixed into the package colloid layer 6 a ′.
- the package unit is filled into the receiving space 20 a, and the powder 60 a ′ are uniformly deposited in the receiving space 20 a by maintaining the package unit at room temperature firstly and the powder 60 a ′ are solidified in the receiving space 20 a by heating to a predetermined temperature.
- the steps of S 200 to S 202 in the second embodiment are the same as the steps of S 100 to S 102 in the first embodiment.
- the second embodiment of the present invention further includes the following steps:
- Step S 204 is: referring to FIGS. 3 and 3A , filling a package colloid layer 6 b with powder 60 b into one part of a receiving space 20 b of a package body 2 b.
- Step S 206 is: referring to FIGS. 3 and 3B , maintaining the package colloid layer 6 b with the powder 60 b at room temperature in order to uniformly depositing the powder 60 b ′ in one part of the receiving space 20 b.
- the powder 60 b ′ can be deposited on a light-emitting element 1 b, two conductive substrates ( 40 b, 41 b ) and an inner surface of the package body 2 b.
- the room temperature is defined as 13-25° C.
- the package colloid layer 6 b is maintained at 1-168 hours according the properties of the package colloid layer 6 b.
- Step S 208 is: heating the package colloid layer 6 b ′ with the powder 60 b ′ in order to solidify the package colloid layer 6 b ′ with the powder 60 b ′.
- the package colloid layer 6 b with the powder 60 b is fully deposited firstly as shown in FIG. 3A , and then the package colloid layer 6 b ′ with the powder 60 b ′ is heated as shown in FIG. 3B , in order to make the powder 60 b be fully deposited as the powder 60 b ′ on one part of the inner surface of the package body 2 b.
- the present invention can prevent non-deposited powder from be solidified in the inner surface of the package body 2 b.
- Step S 210 is: referring to FIGS. 3 and 3C , filling a transparent colloid layer 7 b in the other part of the receiving space 20 b of the package body 2 b in order to form the transparent colloid layer 7 b on the package colloid layer 6 b ′ with the powder 60 b′.
- Step S 212 is: heating the transparent colloid layer 7 b to 80-150° C. during 1-6 hours in order to solidify the transparent colloid layer 7 b.
- the second embodiment of the present invention provides an LED chip package structure using sedimentation, including: at least one light-emitting element 1 b, a package body 2 b, at least two conductive substrates ( 40 b, 41 b ), and a package unit.
- the package body 2 b has a receiving space 20 b.
- the two conductive substrates ( 40 b, 41 b ) are received in the receiving space 20 b.
- the light-emitting element 1 b is received in the receiving space 20 b and electrically connected to the two conductive substrates ( 40 b, 41 b ).
- the package unit has a package colloid layer 6 b ′ and a powder 60 b ′ mixed into the package colloid layer 6 b ′.
- the package unit is filled into the receiving space 20 b, and the powder 60 b ′ are uniformly deposited in the receiving space 20 b by maintaining the package unit at room temperature firstly and the powder 60 b ′ are solidified in the receiving space 20 b by heating to a predetermined temperature.
- the package unit has a transparent colloid layer 7 b received in the receiving space 20 b, the light-emitting element 1 b is covered by the package colloid layer 6 b ′ with the powder 60 b ′, and the transparent colloid layer 7 b is disposed on the package colloid layer 6 b ′ in order to protect the package colloid layer 6 b′.
- the steps of S 300 to S 302 in the third embodiment are the same as the steps of S 100 to S 102 in the first embodiment.
- the third embodiment of the present invention further includes the following steps:
- Step S 304 is: referring to FIGS. 4 and 4A , filling a transparent colloid layer 7 c into one part of a receiving space 20 c of a package body 2 c in order to cover at least one light-emitting element 1 c.
- Step S 306 is: heating the transparent colloid layer 7 c to 80-150° C. during 1-6 hours in order to solidify the transparent colloid layer 7 c.
- Step S 308 is: referring to FIGS. 4 and 4B , filling a package colloid layer 6 c with powder 60 c in the other part of the receiving space 20 c of the package body 2 c in order to form the package colloid layer 6 c with the powder 60 c on the transparent colloid layer 7 c.
- Step S 310 is: referring to FIGS. 4 and 4C , maintaining the package colloid layer 6 c with the powder 60 c at room temperature in order to uniformly depositing the powder 60 c ′ on the transparent colloid layer 7 c.
- the room temperature is defined as 13-25° C.
- the package colloid layer 6 c is maintained at 1-168 hours according the properties of the package colloid layer 6 c.
- Step S 312 is: heating the package colloid layer 6 c ′ with the powder 60 c ′ in order to solidify the package colloid layer 6 c ′ with the powder 60 c ′ on the transparent colloid layer 7 c.
- the package colloid layer 6 c with the powder 60 c is fully deposited firstly as shown in FIG. 4C , and then the package colloid layer 6 c ′ with the powder 60 c ′ is heated as shown in FIG. 4C , in order to make the powder 60 c be fully deposited as the powder 60 c ′ on the transparent colloid layer 7 c and on the other part of the inner surface of the package body 2 c.
- the present invention can prevent non-deposited powder from be solidified on the transparent colloid layer 7 c and on the other part of the inner surface of the package body 2 c.
- the third embodiment of the present invention provides an LED chip package structure using sedimentation, including: at least one light-emitting element 1 c, a package body 2 c, at least two conductive substrates ( 40 c, 41 c ), and a package unit.
- the package body 2 c has a receiving space 20 c.
- the two conductive substrates ( 40 c, 41 c ) are received in the receiving space 20 c.
- the light-emitting element 1 c is received in the receiving space 20 c and electrically connected to the two conductive substrates ( 40 c, 41 c ).
- the package unit is filled into the receiving space 20 c, and the package unit has a transparent colloid layer 7 c received in the receiving space 20 c.
- the light-emitting element 1 c is covered by the transparent colloid layer 7 c.
- the package unit has a package colloid layer 6 c ′ and a powder 60 c ′ mixed into the package colloid layer 6 c ′, and the package colloid layer 6 c ′ with the powder 60 c ′ is disposed on the transparent colloid layer 7 c in order to prevent the quality of the package colloid layer 6 c ′ from being affected by heat generated by the light-emitting element 1 c.
- the powder 60 c ′ are uniformly deposited in the receiving space 20 c by maintaining the package unit at room temperature firstly and the powder 60 c ′ are solidified in the receiving space 20 c and on the transparent colloid layer 7 c by heating to a predetermined temperature.
- the step of maintaining the package colloid layer with the powder in the room temperature further includes: the powder 60 a of the package colloid layer 6 a are deposited quickly by using a gravity device G (as shown in FIG. 5A ) to move upwards the package body 2 a quickly.
- the step of maintaining the package colloid layer with the powder in the room temperature further includes: the powder 60 a of the package colloid layer 6 a is deposited quickly by using a centrifugal device C to rotate the package body quickly.
- the step of maintaining the package colloid layer with the powder in the room temperature further includes: the powder 60 a are deposited quickly by adding surface-action agents S into the package colloid layer 6 a in order to drag downwards the powder 60 a quickly.
- the powder of the present invention can be fully deposited on the inner surface of the package body, “the condensing capability” and “the color and luster” of the present invention are good and uniform.
- the powder of the present invention can be fully deposited on the inner surface of the package body, so that light generated by the light-emitting elements can pass through the uniform package colloid layer to project uniform light beams out.
- the present invention can generate a best light-projecting quality.
- the package colloid layer with the powder is fully deposited firstly, and then the package colloid layer with the powder is heated, in order to make the powder be fully deposited in the receiving space of the package body.
- the present invention can prevent non-deposited powder from be solidified in the receiving space of the package body.
- the curing time can be decreased, so that the usage life of the package colloid layer with the powder is increased.
- the present invention has the following three deposition types according to different light-projecting properties and package structures
- First type is a single deposition as the first embodiment.
- the advantage is: the manufacture process is simple.
- Second type is a dual-layer structure with an inner deposition as the second embodiment.
- the advantage is: the dual-layer structure has two colloid layers that have the same or different physical property and chemical property such as adhesiveness, hardness or refractive index etc.
- the optical quality and the package structure of the second type are good.
- Third type is a dual-layer structure with an outer deposition as the third embodiment.
- the advantage is: the package colloid layer is disposed on the transparent colloid layer in order to prevent the quality and the usage life of the package colloid layer from being affected (decreased) by heat generated by the light-emitting element.
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Abstract
An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
Description
- 1. Field of the Invention
- The present invention relates to an LED chip package structure and a method for making the same, and particularly relates to an LED chip package structure using sedimentation and a method for making the same.
- 2. Description of Related Art
- Referring to
FIG. 1 , a known LED package structure includes asubstrate 1, anLED 2 disposed on thesubstrate 1, twowires 3, and a colloid layer 4 withphosphor powder 40. - The
LED 2 has a light-emittingsurface 20 opposite to thesubstrate 1. TheLED 2 has apositive electrode area 21 and anegative electrode area 22 electrically connected to two corresponding positive andnegative electrode areas substrate 1 via the two 3 respectively. Moreover, the colloid layer 4 with thephosphor powder 40 covers theLED 2 and the twowires 3 for protecting theLED 2. Therefore, when theLED 2 is a blue LED, the blue light generated by the blue LED can pass through the colloid layer 4 with thephosphor powder 40 to generate white light. - However, the
phosphor powder 40 does not be uniformly mixed into the colloid layer 4. Hence, when the blue light generated by the blue LED can pass through the colloid layer 4 with thephosphor powder 40 to generate white light, “the condensing capability” and “the color and luster” of the white light are bad and non-uniform. - One particular aspect of the present invention is to provide an LED chip package structure using sedimentation and a method for making the same. Because the powder of the present invention can be fully deposited on the inner surface of the package body, “the condensing capability” and “the color and luster” of the present invention are good and uniform. In other words, the powder of the present invention can be fully deposited on the inner surface of the package body, so that light generated by the light-emitting elements can pass through the uniform package colloid layer to project uniform light beams out. Hence, the present invention can generate a best light-projecting quality.
- In order to achieve the above-mentioned aspects, the present invention provides an LED chip package structure using sedimentation, including: a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
- Moreover, the package unit has the following three aspects:
- 1. First aspect: The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space.
- 2. Second aspect: The package unit has a package colloid layer with powder and a transparent colloid layer received in the receiving space. The light-emitting element is covered by the package colloid layer with the powder, and the transparent colloid layer is disposed on the package colloid layer in order to protect the package colloid layer.
- 3. Third aspect: The package unit has a package colloid layer with powder and a transparent colloid layer received in the receiving space. The light-emitting element is covered by the transparent colloid layer, and the package colloid layer is disposed on the transparent colloid layer in order to prevent the quality of the package colloid layer from being affected by heat generated by the light-emitting element.
- In order to achieve the above-mentioned aspects, the present invention provides a method for making an LED chip package structure using sedimentation, including: receiving at least one light-emitting element in a receiving space of a package body; electrically connecting the light-emitting element with two conductive substrates that are received in the receiving space; filling a package colloid layer with powder into the receiving space; and maintaining the package colloid layer with the powder at room temperature in order to uniformly depositing the powder in the receiving space.
- Moreover, after the step of maintaining the package colloid layer, the method further includes heating the package colloid layer with the powder in order to solidify the package colloid layer with the powder in the receiving space. In addition, the step of heating the package colloid layer is a one-step heating process that includes a heating temperature of 80˜150° C. and a heating time of 1˜6 hours; Alternatively, the step of heating the package colloid layer is a two-step heating process that includes a first-step heating process and a second-step heating process, the first-step heating process has a heating temperature of 30˜100° C. and a heating time of 10˜120 minutes, and the second-step heating process has a heating temperature of 80˜150° C. and a heating time of 1˜6 hours.
- Furthermore, after the step of heating the package colloid layer, the method further includes: filling a transparent colloid layer in the receiving space of the package body in order to form the transparent colloid layer on the package colloid layer with the powder; and heating the transparent colloid layer to 80-150° C. during 1-6 hours in order to solidify the transparent colloid layer.
- In addition, in another embodiment, before the step of filling the package colloid layer with the powder into the receiving space, the method further includes: filling a transparent colloid layer in the receiving space of the package body in order to cover the light-emitting element; and heating the transparent colloid layer to 80-150° C. during 1-6 hours in order to solidify the transparent colloid layer, wherein the package colloid layer is disposed on the transparent colloid layer.
- Therefore, the package colloid layer with the powder is fully deposited firstly, and then the package colloid layer with the powder is heated, in order to make the powder be fully deposited in the receiving space of the package body. Hence, the present invention can prevent non-deposited powder from be solidified in the receiving space of the package body. In addition, the curing time can be decreased, so that the usage life of the package colloid layer with the powder is increased.
- Furthermore, the present invention has the following three deposition types according to different light-projecting properties and package structures
- 1. First type is a single deposition as the first embodiment. The advantage is: the manufacture process is simple.
- 2. Second type is a dual-layer structure with an inner deposition as the second embodiment. The advantage is: the dual-layer structure has two colloid layers that have the same or different physical property and chemical property such as adhesiveness, hardness or refractive index etc. In addition, the optical quality and the package structure of the second type are good.
- 3. Third type is a dual-layer structure with an outer deposition as the third embodiment. The advantage is: the package colloid layer is disposed on the transparent colloid layer in order to prevent the quality and the usage life of the package colloid layer from being affected (decreased) by heat generated by the light-emitting element.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed. Other advantages and features of the invention will be apparent from the following description, drawings and claims.
- The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawings, in which:
-
FIG. 1 is a lateral, schematic view of an LED package structure by wire-bounding according to the prior art; -
FIG. 2 is a flowchart of a method for making an LED chip package structure using sedimentation according to the first embodiment of the present invention; -
FIGS. 2A to 2C are cross-sectional views of an LED chip package structure using sedimentation according to the first embodiment of the present invention, at different stages of the packaging processes, respectively; -
FIG. 3 is a flowchart of a method for making an LED chip package structure using sedimentation according to the second embodiment of the present invention; -
FIGS. 3A to 3C are cross-sectional views of an LED chip package structure using sedimentation according to the second embodiment of the present invention, at different stages of the packaging processes, respectively; -
FIG. 4 is a flowchart of a method for making an LED chip package structure using sedimentation according to the third embodiment of the present invention; -
FIGS. 4A to 4C are cross-sectional views of an LED chip package structure using sedimentation according to the third embodiment of the present invention, at different stages of the packaging processes, respectively; -
FIGS. 5A and 5B are schematic views of a first method for depositing the powder according to the present invention, respectively; -
FIGS. 6A and 6B are schematic views of a second method for depositing the powder according to the present invention, respectively; and -
FIGS. 7A and 7B are schematic views of a third method for depositing the powder according to the present invention, respectively. - Referring to
FIGS. 2 and 2A to 2C, the first embodiment of the present invention provides a method for making an LED chip package structure using sedimentation, including the following steps: - Step S100 is: referring to
FIGS. 2 and 2A , receiving at least one light-emitting element la in a receivingspace 20 a of apackage body 2 a. In the first embodiment, the light-emitting element la can be a blue LED, and thepackage body 2 a has a bowl shape. In addition, the light-emitting element 1 a is firmly fixed on the inner surface of the bowl-shapedpackage body 2 a via a chip-positioning layer 3 a formed between the light-emitting element 1 a and thepackage body 2 a. Moreover, the chip-positioning layer 3 a is solidified by curing to 155° C. during 3 hours in order to firmly fix the light-emitting element 1 a on the inner surface of the bowl-shapedpackage body 2 a. - Step S102 is: referring to
FIGS. 2 and 2A , electrically connecting the light-emitting element 1 a with two conductive substrates (40 a, 41 a) that are received in the receivingspace 20 a. In the first embodiment, at least twolead wires 5 a are electrically connected between the light-emitting element 1 a and one conductive substrate (positive electrode) 40 a and between the light-emitting element 1 a and one conductive substrate (negative electrode) 41 a. Hence, the positive electrode (not shown) and the negative electrode (not shown) of the light-emitting element 1 a are respectively electrically connected with the two conductive substrates (40 a, 41 a) by wire-bonding. - Step S104 is: referring to
FIGS. 2 and 2B , filling apackage colloid layer 6 a withpowder 60 a (the package unit) into the receivingspace 20 a. In the first embodiment, thepowder 60 a can be phosphor powder, and thepackage colloid layer 6 a can be silicone or epoxy. In addition, thepackage colloid layer 6 a with thepowder 60 a can be filled into the receivingspace 20 a by dropping, press molding or spraying according to different requirements. - Step S106 is: referring to
FIGS. 2 and 2C , maintaining thepackage colloid layer 6 a with thepowder 60 a at room temperature in order to uniformly depositing thepowder 60 a′ in the receivingspace 20 a. In other words, thepowder 60 a′ can be deposited on the light-emitting element 1 a, the two conductive substrates (40 a, 41 a) and an inner surface of thepackage body 2 a. In addition, the room temperature is defined as 13-25° C., and thepackage colloid layer 6 a is maintained at 1-168 hours according the properties of thepackage colloid layer 6 a. - Step S108 is: heating the
package colloid layer 6 a′ with thepowder 60 a′ in order to solidify thepackage colloid layer 6 a′ with thepowder 60 a′ in the receivingspace 20 a. The heating step includes the following two methods according to different manufacturing requirements: - 1. The step of heating the
package colloid layer 6 a′ is a one-step heating process that includes a heating temperature of 80˜150° C. and a heating time of 1˜6 hours. - 2. The step of heating the
package colloid layer 6 a′ is a two-step heating process that includes a first-step heating process and a second-step heating process, the first-step heating process has a heating temperature of 30˜100° C. and a heating time of 10˜120 minutes, and the second-step heating process has a heating temperature of 80˜150° C. and a heating time of 1˜6 hours. - In other words, the
package colloid layer 6 a with thepowder 60 a is fully deposited firstly as shown inFIG. 2B , and then thepackage colloid layer 6 a′ with thepowder 60 a′ is heated as shown inFIG. 2C , in order to make thepowder 60 a be fully deposited as thepowder 60 a′ on the inner surface of thepackage body 2 a. Hence, the present invention can prevent non-deposited powder from be solidified in the inner surface of thepackage body 2 a. - Referring to
FIG. 2C , the first embodiment of the present invention provides an LED chip package structure using sedimentation, including: at least one light-emitting element 1 a, apackage body 2 a, at least two conductive substrates (40 a, 41 a), and a package unit. Thepackage body 2 a has a receivingspace 20 a. The two conductive substrates (40 a, 41 a) are received in the receivingspace 20 a. The light-emitting element 1 a is received in the receivingspace 20 a and electrically connected to the two conductive substrates (40 a, 41 a). The package unit has apackage colloid layer 6 a′ and apowder 60 a′ mixed into thepackage colloid layer 6 a′. The package unit is filled into the receivingspace 20 a, and thepowder 60 a′ are uniformly deposited in the receivingspace 20 a by maintaining the package unit at room temperature firstly and thepowder 60 a′ are solidified in the receivingspace 20 a by heating to a predetermined temperature. - Referring to
FIGS. 3 and 3A to 3C, the steps of S200 to S202 in the second embodiment are the same as the steps of S100 to S102 in the first embodiment. - Moreover, after the step of S202, the second embodiment of the present invention further includes the following steps:
- Step S204 is: referring to
FIGS. 3 and 3A , filling apackage colloid layer 6 b withpowder 60 b into one part of a receivingspace 20 b of apackage body 2 b. - Step S206 is: referring to
FIGS. 3 and 3B , maintaining thepackage colloid layer 6 b with thepowder 60 b at room temperature in order to uniformly depositing thepowder 60 b′ in one part of the receivingspace 20 b. In other words, thepowder 60 b′ can be deposited on a light-emittingelement 1 b, two conductive substrates (40 b, 41 b) and an inner surface of thepackage body 2 b. In addition, the room temperature is defined as 13-25° C., and thepackage colloid layer 6 b is maintained at 1-168 hours according the properties of thepackage colloid layer 6 b. - Step S208 is: heating the
package colloid layer 6 b′ with thepowder 60 b′ in order to solidify thepackage colloid layer 6 b′ with thepowder 60 b′. In other words, thepackage colloid layer 6 b with thepowder 60 b is fully deposited firstly as shown inFIG. 3A , and then thepackage colloid layer 6 b′ with thepowder 60 b′ is heated as shown inFIG. 3B , in order to make thepowder 60 b be fully deposited as thepowder 60 b′ on one part of the inner surface of thepackage body 2 b. Hence, the present invention can prevent non-deposited powder from be solidified in the inner surface of thepackage body 2 b. - Step S210 is: referring to
FIGS. 3 and 3C , filling atransparent colloid layer 7 b in the other part of the receivingspace 20 b of thepackage body 2 b in order to form thetransparent colloid layer 7 b on thepackage colloid layer 6 b′ with thepowder 60 b′. - Step S212 is: heating the
transparent colloid layer 7 b to 80-150° C. during 1-6 hours in order to solidify thetransparent colloid layer 7 b. - Referring to
FIG. 3C , the second embodiment of the present invention provides an LED chip package structure using sedimentation, including: at least one light-emittingelement 1 b, apackage body 2 b, at least two conductive substrates (40 b, 41 b), and a package unit. Thepackage body 2 b has a receivingspace 20 b. The two conductive substrates (40 b, 41 b) are received in the receivingspace 20 b. The light-emittingelement 1 b is received in the receivingspace 20 b and electrically connected to the two conductive substrates (40 b, 41 b). The package unit has apackage colloid layer 6 b′ and apowder 60 b′ mixed into thepackage colloid layer 6 b′. The package unit is filled into the receivingspace 20 b, and thepowder 60 b′ are uniformly deposited in the receivingspace 20 b by maintaining the package unit at room temperature firstly and thepowder 60 b′ are solidified in the receivingspace 20 b by heating to a predetermined temperature. In addition, the package unit has atransparent colloid layer 7 b received in the receivingspace 20 b, the light-emittingelement 1 b is covered by thepackage colloid layer 6 b′ with thepowder 60 b′, and thetransparent colloid layer 7 b is disposed on thepackage colloid layer 6 b′ in order to protect thepackage colloid layer 6 b′. - Referring to
FIGS. 4 and 4A to 4C, the steps of S300 to S302 in the third embodiment are the same as the steps of S100 to S102 in the first embodiment. - Moreover, after the step of S302, the third embodiment of the present invention further includes the following steps:
- Step S304 is: referring to
FIGS. 4 and 4A , filling atransparent colloid layer 7 c into one part of a receivingspace 20 c of apackage body 2 c in order to cover at least one light-emitting element 1 c. - Step S306 is: heating the
transparent colloid layer 7 c to 80-150° C. during 1-6 hours in order to solidify thetransparent colloid layer 7 c. - Step S308 is: referring to
FIGS. 4 and 4B , filling apackage colloid layer 6 c withpowder 60 c in the other part of the receivingspace 20 c of thepackage body 2 c in order to form thepackage colloid layer 6 c with thepowder 60 c on thetransparent colloid layer 7 c. - Step S310 is: referring to
FIGS. 4 and 4C , maintaining thepackage colloid layer 6 c with thepowder 60 c at room temperature in order to uniformly depositing thepowder 60 c′ on thetransparent colloid layer 7 c. In addition, the room temperature is defined as 13-25° C., and thepackage colloid layer 6 c is maintained at 1-168 hours according the properties of thepackage colloid layer 6 c. - Step S312 is: heating the
package colloid layer 6 c′ with thepowder 60 c′ in order to solidify thepackage colloid layer 6 c′ with thepowder 60 c′ on thetransparent colloid layer 7 c. In other words, thepackage colloid layer 6 c with thepowder 60 c is fully deposited firstly as shown inFIG. 4C , and then thepackage colloid layer 6 c′ with thepowder 60 c′ is heated as shown inFIG. 4C , in order to make thepowder 60 c be fully deposited as thepowder 60 c′ on thetransparent colloid layer 7 c and on the other part of the inner surface of thepackage body 2 c. Hence, the present invention can prevent non-deposited powder from be solidified on thetransparent colloid layer 7 c and on the other part of the inner surface of thepackage body 2 c. - Referring to
FIG. 4C , the third embodiment of the present invention provides an LED chip package structure using sedimentation, including: at least one light-emitting element 1 c, apackage body 2 c, at least two conductive substrates (40 c, 41 c), and a package unit. Thepackage body 2 c has a receivingspace 20 c. The two conductive substrates (40 c, 41 c) are received in the receivingspace 20 c. The light-emitting element 1 c is received in the receivingspace 20 c and electrically connected to the two conductive substrates (40 c, 41 c). The package unit is filled into the receivingspace 20 c, and the package unit has atransparent colloid layer 7 c received in the receivingspace 20 c. The light-emitting element 1 c is covered by thetransparent colloid layer 7 c. In addition, the package unit has apackage colloid layer 6 c′ and apowder 60 c′ mixed into thepackage colloid layer 6 c′, and thepackage colloid layer 6 c′ with thepowder 60 c′ is disposed on thetransparent colloid layer 7 c in order to prevent the quality of thepackage colloid layer 6 c′ from being affected by heat generated by the light-emitting element 1 c. Furthermore, thepowder 60 c′ are uniformly deposited in the receivingspace 20 c by maintaining the package unit at room temperature firstly and thepowder 60 c′ are solidified in the receivingspace 20 c and on thetransparent colloid layer 7 c by heating to a predetermined temperature. - Referring to
FIGS. 5A and 5B , for example in the first embodiment, the step of maintaining the package colloid layer with the powder in the room temperature further includes: thepowder 60 a of thepackage colloid layer 6 a are deposited quickly by using a gravity device G (as shown inFIG. 5A ) to move upwards thepackage body 2 a quickly. - Referring to
FIGS. 6A and 6B , for example in the first embodiment, the step of maintaining the package colloid layer with the powder in the room temperature further includes: thepowder 60 a of thepackage colloid layer 6 a is deposited quickly by using a centrifugal device C to rotate the package body quickly. - Referring to
FIGS. 7A and 7B , for example in the first embodiment, the step of maintaining the package colloid layer with the powder in the room temperature further includes: thepowder 60 a are deposited quickly by adding surface-action agents S into thepackage colloid layer 6 a in order to drag downwards thepowder 60 a quickly. - In conclusion, because the powder of the present invention can be fully deposited on the inner surface of the package body, “the condensing capability” and “the color and luster” of the present invention are good and uniform. In other words, the powder of the present invention can be fully deposited on the inner surface of the package body, so that light generated by the light-emitting elements can pass through the uniform package colloid layer to project uniform light beams out. Hence, the present invention can generate a best light-projecting quality.
- Therefore, the package colloid layer with the powder is fully deposited firstly, and then the package colloid layer with the powder is heated, in order to make the powder be fully deposited in the receiving space of the package body. Hence, the present invention can prevent non-deposited powder from be solidified in the receiving space of the package body. In addition, the curing time can be decreased, so that the usage life of the package colloid layer with the powder is increased.
- Furthermore, the present invention has the following three deposition types according to different light-projecting properties and package structures
- 1. First type is a single deposition as the first embodiment. The advantage is: the manufacture process is simple.
- 2. Second type is a dual-layer structure with an inner deposition as the second embodiment. The advantage is: the dual-layer structure has two colloid layers that have the same or different physical property and chemical property such as adhesiveness, hardness or refractive index etc. In addition, the optical quality and the package structure of the second type are good.
- 3. Third type is a dual-layer structure with an outer deposition as the third embodiment. The advantage is: the package colloid layer is disposed on the transparent colloid layer in order to prevent the quality and the usage life of the package colloid layer from being affected (decreased) by heat generated by the light-emitting element.
- Although the present invention has been described with reference to the preferred best molds thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Claims (25)
1. An LED chip package structure using sedimentation, comprising:
a package body having a receiving space;
at least two conductive substrates received in the receiving space;
at least one light-emitting element received in the receiving space and electrically connected to the two conductive substrates; and
a package unit having a package colloid layer and a powder mixed into the package colloid layer, wherein the package unit is filled into the receiving space, and the powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
2. The LED chip package structure as claimed in claim 1 , wherein the light-emitting element is a blue LED (Light-Emitting Diode), and the package body has a bowl shape.
3. The. LED chip package structure as claimed in claim 2 , further comprising: a chip-positioning layer formed between the light-emitting element and the package body in order to firmly fix the light-emitting element on the inner surface of the bowl-shaped package body via the chip-positioning layer.
4. The LED chip package structure as claimed in claim 1 , further comprising: at least two lead wires electrically connected between the light-emitting element and the conductive substrates.
5. The LED chip package structure as claimed in claim 1 , wherein the powder is phosphor powder, and the package colloid layer is silicone or epoxy.
6. The LED chip package structure as claimed in claim 1 , wherein the powder is deposited on the light-emitting element, the two conductive substrates and an inner surface of the package body.
7. The LED chip package structure as claimed in claim 1 , wherein the package unit has a transparent colloid layer received in the receiving space, the light-emitting element is covered by the package colloid layer with the powder, and the transparent colloid layer is disposed on the package colloid layer in order to protect the package colloid layer.
8. The LED chip package structure as claimed in claim 1 , wherein the package unit has a transparent colloid layer received in the receiving space, the light-emitting element is covered by the transparent colloid layer, and the package colloid layer is disposed on the transparent colloid layer in order to prevent the quality of the package colloid layer from being affected by heat generated by the light-emitting element.
9. A method for making an LED chip package structure using sedimentation, comprising:
receiving at least one light-emitting element in a receiving space of a package body;
electrically connecting the light-emitting element with two conductive substrates that are received in the receiving space;
filling a package colloid layer with powder into the receiving space; and
maintaining the package colloid layer with the powder at room temperature in order to uniformly depositing the powder in the receiving space.
10. The method as claimed in claim 9 , wherein the light-emitting element is a blue LED, and the package body has a bowl shape.
11. The method as claimed in claim 10 , wherein the light-emitting element is firmly fixed on the inner surface of the bowl-shaped package body via a chip-positioning layer formed between the light-emitting element and the package body.
12. The method as claimed in claim 11 , wherein the chip-positioning layer is solidified by curing to 155° C. during 3 hours in order to firmly fix the light-emitting element on the inner surface of the bowl-shaped package body.
13. The method as claimed in claim 9 , wherein the light-emitting element is electrically connected with the two conductive substrates by wire-bonding.
14. The method as claimed in claim 9 , wherein the package colloid layer with the powder is filled into the receiving space by dropping, press molding or spraying.
15. The method as claimed in claim 9 , wherein the powder is phosphor powder, and the package colloid layer is silicone or epoxy.
16. The method as claimed in claim 9 , wherein the room temperature is defined as 13-25° C., and the package colloid layer is maintained at 1-168 hours according the properties of the package colloid layer.
17. The method as claimed in claim 9 , wherein the powder is deposited on the light-emitting element, the two conductive substrates and an inner surface of the package body.
18. The method as claimed in claim 9 , wherein after the step of maintaining the package colloid layer, the method further comprises heating the package colloid layer with the powder in order to solidify the package colloid layer with the powder in the receiving space.
19. The method as claimed in claim 18 , wherein the step of heating the package colloid layer is a one-step heating process that includes a heating temperature of 80˜150° C. and a heating time of 1˜6 hours.
20. The method as claimed in claim 18 , wherein the step of heating the package colloid layer is a two-step heating process that includes a first-step heating process and a second-step heating process, the first-step heating process has a heating temperature of 30˜100° C. and a heating time of 10˜120 minutes, and the second-step heating process has a heating temperature of 80˜150° C. and a heating time of 1˜6 hours.
21. The method as claimed in claim 18 , wherein after the step of heating the package colloid layer, the method further comprises:
filling a transparent colloid layer in the receiving space of the package body in order to form the transparent colloid layer on the package colloid layer with the powder; and
heating the transparent colloid layer to 80-150° C. during 1-6 hours in order to solidify the transparent colloid layer.
22. The method as claimed in claim 18 , wherein before the step of filling the package colloid layer with the powder into the receiving space, the method further comprises:
filling a transparent colloid layer in the receiving space of the package body in order to cover the light-emitting element; and
heating the transparent colloid layer to 80-150° C. during 1-6 hours in order to solidify the transparent colloid layer, wherein the package colloid layer is disposed on the transparent colloid layer.
23. The method as claimed in claim 9 , wherein the step of maintaining the package colloid layer with the powder in the room temperature further comprises: depositing the powder quickly by using a gravity device to quickly move upwards the package body.
24. The method as claimed in claim 9 , wherein the step of maintaining the package colloid layer with the powder in the room temperature further comprises: depositing the powder quickly by using a centrifugal device to quickly rotate the package body.
25. The method as claimed in claim 9 , wherein the step of maintaining the package colloid layer with the powder in the room temperature further comprises: depositing the powder quickly by adding surface-action agents into the package colloid layer in order to drag downwards the powder quickly.
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010054280A1 (en) * | 2010-12-13 | 2012-06-14 | Osram Opto Semiconductors Gmbh | A method of producing a luminescent conversion material layer, composition therefor and device comprising such a luminescence conversion material layer |
DE102011104302A1 (en) * | 2011-06-16 | 2012-12-20 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and use of such a semiconductor device |
WO2013081968A1 (en) * | 2011-11-30 | 2013-06-06 | Micron Technology, Inc. | Coated color-converting particles and associated devices, systems, and methods |
CN103178188A (en) * | 2011-12-21 | 2013-06-26 | 四川柏狮光电技术有限公司 | Packaging process of white light light-emitting diode (LED) |
JP2013232484A (en) * | 2012-04-27 | 2013-11-14 | Nichia Chem Ind Ltd | Light-emitting device and method for manufacturing the same |
CN103647013A (en) * | 2013-10-28 | 2014-03-19 | 吴震 | Wavelength conversion device manufacturing method and light-emitting device |
CN103682042A (en) * | 2013-10-17 | 2014-03-26 | 吴震 | Preparation method for light emitting device and light source |
CN103746060A (en) * | 2013-09-21 | 2014-04-23 | 吴震 | Manufacturing method of wavelength conversion device and light-emitting device |
US8890199B2 (en) * | 2013-03-05 | 2014-11-18 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and method for manufacturing the same |
US11996502B2 (en) * | 2019-03-15 | 2024-05-28 | Nichia Corporation | Method of manufacturing light-emitting device including step of curing sealing member while applying centrifugal force |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI425658B (en) * | 2010-05-17 | 2014-02-01 | Advanced Optoelectronic Tech | Led package and method for manufacturing the same |
KR101958418B1 (en) | 2013-02-22 | 2019-03-14 | 삼성전자 주식회사 | Light emitting device package |
JP6615557B2 (en) * | 2015-09-30 | 2019-12-04 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
KR102352901B1 (en) * | 2016-08-01 | 2022-01-19 | 닝보 써니 오포테크 코., 엘티디. | Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080149960A1 (en) * | 2006-12-26 | 2008-06-26 | Nichia Corporation | Light-emitting apparatus and method of producing the same |
US20080157113A1 (en) * | 2006-12-28 | 2008-07-03 | Nichia Corporation | Surface mount lateral light emitting apparatus and fabrication method thereof |
US20080218072A1 (en) * | 2007-02-28 | 2008-09-11 | Toyoda Gosei Co., Ltd. | Semiconductor light-emitting device and method for manufacturing semiconductor light-emitting device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090026470A1 (en) * | 2007-07-23 | 2009-01-29 | Novalite Optronics Corp. | Super thin side-view light-emitting diode (led) package and fabrication method thereof |
CN102456813A (en) * | 2010-10-29 | 2012-05-16 | 展晶科技(深圳)有限公司 | LED (light emitting diode) and manufacturing method thereof |
-
2008
- 2008-07-11 TW TW097126479A patent/TW201003979A/en unknown
-
2009
- 2009-06-04 US US12/457,222 patent/US20100006880A1/en not_active Abandoned
-
2011
- 2011-09-14 US US13/232,391 patent/US8623680B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080149960A1 (en) * | 2006-12-26 | 2008-06-26 | Nichia Corporation | Light-emitting apparatus and method of producing the same |
US20080157113A1 (en) * | 2006-12-28 | 2008-07-03 | Nichia Corporation | Surface mount lateral light emitting apparatus and fabrication method thereof |
US20080218072A1 (en) * | 2007-02-28 | 2008-09-11 | Toyoda Gosei Co., Ltd. | Semiconductor light-emitting device and method for manufacturing semiconductor light-emitting device |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
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Also Published As
Publication number | Publication date |
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US20120003765A1 (en) | 2012-01-05 |
US8623680B2 (en) | 2014-01-07 |
TW201003979A (en) | 2010-01-16 |
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