CN202948973U - Fluorescent powder layer, light emitting diode (LED) packaging unit and LED packaging system - Google Patents
Fluorescent powder layer, light emitting diode (LED) packaging unit and LED packaging system Download PDFInfo
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- CN202948973U CN202948973U CN 201220636431 CN201220636431U CN202948973U CN 202948973 U CN202948973 U CN 202948973U CN 201220636431 CN201220636431 CN 201220636431 CN 201220636431 U CN201220636431 U CN 201220636431U CN 202948973 U CN202948973 U CN 202948973U
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Abstract
The utility model provides a fluorescent powder layer, a light emitting diode (LED) packaging unit and an LED packaging system. The fluorescent powder layer comprises a carrier and one or a plurality of fluorescent powder areas, wherein the carrier is provided with a first surface, a second surface and one or a plurality of accommodating cavities, the first surface and the second surface are oppositely arranged, the accommodating cavities at least comprise first openings arranged on the first surface, and the fluorescent powder areas are arranged in the accommodating cavities. The LED packaging unit comprises the fluorescent powder layer. The LED packaging system comprises one or a plurality of LED packaging units. Fluorescent powders are arranged in the accommodating cavities of the carrier in the fluorescent powder layer so that the using amount of the fluorescent powders is greatly reduced, and the manufacturing costs of the fluorescent powder layer are saved to a large extent. Besides, the fluorescent powder layer can be manufactured by existing process devices, and equipment investments are reduced.
Description
Technical field
The utility model relates to the LED encapsulation field, in particular to a kind of phosphor powder layer, LED encapsulation unit and LED package system.
Background technology
In the LED illumination is used, usually use the form that blue-ray LED is combined with fluorescent material to form white light LEDs.The quality of fluorescent material has wherein directly affected the luminous quality of product, comprises light efficiency, color, colour temperature etc.In addition, in batch production each fluorescent material unit need the same, the same a collection of properties of product consistency that guarantee is produced.
At present, in LED encapsulation commonly used, the assemble method of fluorescent material and LED chip has following several.
Fluorescent material directly is coated in the LED chip surface, the LED encapsulation unit that the method forms, spontaneous heating density is larger, heating easy and LED interferes with each other, fluorescent material easy sedimentation when applying, skewness on LED chip, and, fluorescent material directly sticks the surface in LED chip, has a strong impact on LED and goes out light effect.
On transparent material, be installed on the outside remote fluorescence powder that forms of the light emitting module with LED chip with fluorescent powder coated.The problem that the heat generation density that the remote fluorescence powder can solve is large, free settling not, but area is larger, and the fluorescent material consumption is more, thereby cost is higher.
Flat or phosphor powder layer bending directly are covered on the LED array of a two dimension, the method can cut to form single LED encapsulation unit again, this phosphor powder layer is the uniform fluorescent material of one deck, solved the problem of fluorescent material sedimentation, but, owing to also being provided with phosphor powder layer in the zone that there is no LED chip, cause unnecessary waste.
The utility model content
The utility model aims to provide a kind of phosphor powder layer, LED encapsulation unit and LED package system, has reduced the cost of manufacture of phosphor powder layer.
To achieve these goals, according to an aspect of the present utility model, a kind of phosphor powder layer is provided, this phosphor powder layer comprises: carrier, comprise the first surface and the second surface that are oppositely arranged, and having one or more container cavities, container cavity has the first opening that is arranged on first surface at least; One or more fluorescent material district is arranged in container cavity.
Further, above-mentioned container cavity is the first surface that connects carrier and the through hole of second surface, and the fluorescent material district is filled in through hole.
Further, above-mentioned container cavity is the groove with first opening, and the bottom of groove is transparent, and the fluorescent material district is filled in groove.
Further, at least part of above-mentioned fluorescent material district towards an end of the first opening with respect to the sidewall of the container cavity formation extension that stretches out, the end face of extension is the cambered surface of evagination; Or the end face towards an end of the first opening at least part of above-mentioned fluorescent material district is scattering surface.
Further, the sidewall slope of above-mentioned container cavity, and the aperture area of the first opening of container cavity is the maximum secting area perpendicular to its bearing of trend of container cavity.
Further, above-mentioned phosphor powder layer also comprises the reflector, and the reflector comprises the internal reflection layer that arranges along the sidewall of container cavity.
Further, above-mentioned reflector also comprises outer reflective layer, and outer reflective layer is along the first surface setting of first opening with container cavity of carrier.
Further, above-mentioned phosphor powder layer also comprises the reservation through hole, reserve through hole be arranged in carrier and bearing of trend identical with the bearing of trend of container cavity.
Further, it is a plurality of that above-mentioned fluorescent material district has, and the fluorescent material at least part of fluorescent material district is different from the fluorescent material in all the other fluorescent material district.
According on the other hand of the present utility model, a kind of LED encapsulation unit is provided, this LED encapsulation unit comprises: luminescent layer has one or more LED chips that are array distribution; Phosphor powder layer is above-mentioned phosphor powder layer, the fluorescent material district of phosphor powder layer be arranged on LED chip directly over, and the first surface of the carrier of phosphor powder layer is away from the luminescent layer setting.
Further, be provided with the reservation through hole in the carrier of above-mentioned phosphor powder layer, luminescent layer also comprises: package main body, LED chip are encapsulated in package main body; Conductive layer is encapsulated in package main body, and LED chip and conductive layer electricity are interconnected, partially conductive layer and the corresponding setting of reservation through hole.
Further, above-mentioned luminescent layer also comprises circuit element, and circuit element and conductive layer electricity are interconnected, and package main body comprises: the first package main body encapsulates wherein with the corresponding setting in fluorescent material district and with LED chip; The second package main body encapsulates wherein around the first package main body setting and with circuit element.
Further, above-mentioned LED encapsulation unit also comprises transparent bonding layer, and transparent bonding layer is arranged between luminescent layer and phosphor powder layer.
Further, the refractive index of above-mentioned the first package main body is not less than the refractive index of the carrier of phosphor powder layer; The refractive index of transparent bonding layer is not more than the refractive index of the first package main body.
Further, above-mentioned package main body is the silicone encapsulation main body, and the faying face of luminescent layer and phosphor powder layer is the oxygen plasma treatment surface.
Have on the one hand according to of the present utility model, a kind of LED package system also is provided, comprise one or more LED encapsulation units, this LED encapsulation unit is above-mentioned LED encapsulation unit, and each LED encapsulation unit is two-dimensional array and arranges.
Further, above-mentioned LED encapsulation unit is a plurality of, each LED encapsulation unit be wholely set or mutually isolation arrange, between each LED encapsulation unit, electricity is interconnected or work alone.
Use the technical solution of the utility model, fluorescent material is arranged on the consumption of greatly having saved fluorescent material in the container cavity of carrier, thus the cost of manufacture of having saved to a great extent phosphor powder layer, and, this phosphor powder layer can adopt existing process equipment to make, and has reduced equipment investment.
Description of drawings
The Figure of description that consists of the application's a part is used to provide further understanding of the present utility model, and illustrative examples of the present utility model and explanation thereof are used for explaining the utility model, do not consist of improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 shows the structural representation according to the phosphor powder layer of a kind of preferred embodiment of the present utility model;
Fig. 2 shows the structural representation according to the phosphor powder layer of another kind of preferred embodiment of the present utility model;
Fig. 3 shows the structural representation according to the phosphor powder layer of another preferred embodiment of the present utility model;
Fig. 4 shows the structural representation according to the phosphor powder layer of another preferred embodiment of the present utility model;
Fig. 5 shows the structural representation according to the phosphor powder layer of another preferred embodiment of the present utility model;
Fig. 6 shows the structural representation according to the phosphor powder layer of another preferred embodiment of the present utility model;
Fig. 7 shows the structural representation according to the phosphor powder layer of another preferred embodiment of the present utility model;
Fig. 8 shows the structural representation according to the phosphor powder layer of another preferred embodiment of the present utility model;
Fig. 9 shows the structural representation according to the LED encapsulation unit of a kind of preferred embodiment of the present utility model; And
Figure 10 shows the structural representation according to the LED encapsulation unit of another kind of preferred embodiment of the present utility model.
Embodiment
Need to prove, in the situation that do not conflict, embodiment and the feature in embodiment in the application can make up mutually.Describe below with reference to the accompanying drawings and in conjunction with the embodiments the utility model in detail.
As extremely shown in Figure 8 in Fig. 1, in a kind of typical execution mode of the present utility model, a kind of phosphor powder layer is provided, phosphor powder layer comprises carrier 21 and one or more fluorescent material district 22, carrier 21 comprises first surface and the second surface that is oppositely arranged, and having one or more container cavities, this container cavity has the first opening that is arranged on first surface at least; Fluorescent material district 22 is arranged in container cavity.
Phosphor powder layer with said structure is arranged on fluorescent material the consumption of greatly having saved fluorescent material in the container cavity of carrier 21, thus the cost of manufacture of having saved to a great extent phosphor powder layer.This phosphor powder layer can adopt existing process equipment to make, reduced equipment investment, namely as adopting the method for molding, raw material makes the carrier 21 with container cavity take macromolecular material such as epoxy resin on substrate, then, the method by molding or some glue arranges fluorescent material district 22 in container cavity.
As depicted in figs. 1 and 2, above-mentioned container cavity is the first surface that connects carrier 21 and the through hole of second surface, and fluorescent material district 22 is filled in through hole.
As shown in Figure 3 and Figure 4, container cavity is the groove with first opening, and the bottom of groove is transparent, and fluorescent material district 22 is filled in groove.
No matter fluorescent material district 22 is arranged on is in the container cavity of through hole or in the container cavity of groove, can reduce the consumption of fluorescent material, and fluorescent material and LED chip isolation can be arranged the serious light scattering that has caused when effectively having avoided LED chip directly to contact with fluorescent material.
In a kind of preferred embodiment of the present utility model, as shown in Figure 5 and Figure 6, at least part of above-mentioned fluorescent material district 22 towards an end of the first opening with respect to the sidewall of the container cavity formation extension that stretches out, the end face of extension is the cambered surface of evagination; Or the end face towards an end of described the first opening at least part of fluorescent material district 22 is scattering surface.
Therefore the end face of the extension in fluorescent material district 22 is set to the cambered surface of evagination, makes the structure of extension be similar to lens, makes this phosphor powder layer not only can realize the light transformation function of fluorescent material but also can realize the optical effect of lens; Equally, one end face in fluorescent material district 22 is set to scattering surface, thereby can make through the light after the fluorescent material conversion and be evenly distributed in all angles, avoid sending stronger light in a certain angle, make the luminescent device with this phosphor powder layer can send comparatively soft light.Cambered surface and scattering surface can utilize corresponding mould to adopt the method for molding to make.
As Fig. 2, Fig. 4 and shown in Figure 7, the sidewall slope of above-mentioned container cavity, and the aperture area of the first opening of container cavity is the maximum secting area perpendicular to its bearing of trend of container cavity.Through hole and groove are set to the cup-like structure of sidewall slope, are conducive to adapt with the cup-like structure of the package main body of present LED chip, have further increased the rising angle of the LED encapsulation unit with phosphor powder layer of the present utility model.
As shown in Figure 7, above-mentioned phosphor powder layer also comprises reflector 23, and reflector 23 comprises the internal reflection layer 231 that arranges along the sidewall of container cavity.The internal reflection layer 231 that arranges on phosphor powder layer, the light that can effectively avoid seeing through fluorescent material district 22 is absorbed by the carrier 21 of phosphor powder layer, has increased the light extraction efficiency of the LED encapsulation unit with it.
As shown in Figure 7, above-mentioned reflector 23 also comprises outer reflective layer 232, and outer reflective layer 232 is along the first surface setting of first opening with container cavity of carrier 21.Reflector 23 with outer reflective layer 232 forms large-area catoptric arrangement at the encapsulation unit upper surface, reduce to use the light absorption of the luminescent device inside of this phosphor powder layer, thereby improves effective luminous quantity of whole luminescent device.
Arranging all of above-mentioned internal reflection layer 231 and outer reflective layer 232 can be adopted following methods: adopt sputtering method or evaporation plated metal reflector on the surface of carrier 21, as the aluminium reflector, and adopt photoetching and etch to remove unwanted reflector; Perhaps adopt mask plate shielding firmly not need to arrange the zone in reflector, then adopt sputtering method or evaporation in the carrier surface plated metal reflector that exposes or the spraying reflectorized material; The zone coating reflectorized material in reflector perhaps directly is set at needs.
As shown in figure 10, above-mentioned phosphor powder layer also comprises reserves through hole 24, reserve through hole 24 be arranged in carrier 21 and bearing of trend identical with the bearing of trend of container cavity.For the ease of to carry out electricity interconnected with external circuitry with being convenient to after the combination of the LED chip of phosphor powder layer, preferably arrange in the carrier 21 of phosphor powder layer and reserve through hole 24, LED chip and the lead-in wire that passes reservation through hole 24 or conductor are carried out electricity interconnected.
As shown in Figure 8, in a kind of preferred embodiment of the utility model, above-mentioned fluorescent material district 22 has a plurality of, and the fluorescent material at least part of fluorescent material district 22 is different from the fluorescent material in all the other fluorescent material district 22.22 interiorly arrange different fluorescent material in different fluorescent material districts, assemble the variation of the bright dipping that can expand the LED encapsulation unit from different LED chips.When the fluorescent material in fluorescent material district 22 not simultaneously, can adopt repeatedly the method for molding at the corresponding different fluorescent material of container cavity inner mold, or adopt the method for some glue to fill different fluorescent material in different container cavities.Can be used for fluorescent material of the present utility model and include but not limited to that red fluorescence powder, green emitting phosphor, YAG fluorescent material and above-mentioned several fluorescent material mix the mixed fluorescent powder that forms.
As shown in Figure 9 and Figure 10, in the another kind of typical execution mode of the utility model, also provide a kind of LED encapsulation unit, this LED encapsulation unit comprises luminescent layer 1 and phosphor powder layer 2, and luminescent layer 1 has one or more LED chips 11 that are array distribution; Phosphor powder layer 2 is above-mentioned phosphor powder layer, the fluorescent material district 22 of phosphor powder layer 2 be arranged on LED chip 11 directly over, and the first surface of the carrier 21 of phosphor powder layer 2 arranges away from luminescent layer 1.
LED encapsulation unit with said structure, by the luminescent layer 1 and phosphor powder layer 2 that comprise stack, when having avoided LED chip 11 and phosphor powder layer 2 successively encapsulated due to separately different adverse effects that produce of encapsulation condition, and, phosphor powder layer 2 and LED chip 11 are mutually away from setting, formed remote fluorescence powder structure, and then avoided having improved LED encapsulation unit stability and reliability due to influencing each other between fluorescent material spontaneous heating and LED chip; Simultaneously, due to only in the region division fluorescent material district corresponding with LED chip 11, thereby greatly reduced the consumption of fluorescent material, the cost of manufacture of having saved the LED encapsulation unit.
When preparing above-mentioned LED encapsulation unit, because luminescent layer 1 and phosphor powder layer 2 separate making, each layer can adopt independently that streamline carries out parallel production on the one hand, and be unaffected each other, thereby improved the make efficiency of LED encapsulation unit; On the other hand, each that completes layer can be assembled according to client's demand, and flexibility increases; In addition, each layer carries out independent detection, guarantee qualified after assembling again, the mode with respect to detecting again after the assembling of the LED encapsulation unit of traditional structure has improved the finished product yield, has reduced unnecessary waste.
As shown in figure 10, in another preferred embodiment of the present utility model, be provided with in the carrier 21 of above-mentioned phosphor powder layer 2 and reserve through hole 24, above-mentioned luminescent layer 1 also comprises package main body 12 and conductive layer 13, and LED chip 11 is encapsulated in package main body 12; Conductive layer 13 is encapsulated in package main body 12, and LED chip 11 is interconnected with conductive layer 13 electricity, partially conductive layer 13 and the corresponding setting of reservation through hole 24.Arrange on the top of the partially conductive layer 13 of luminescent layer 1 and reserve through hole 24, thereby it is interconnected to utilize lead-in wire or conductor that conductive layer 13 and external circuitry are carried out electricity, and then complete the control to LED chip.
In order further to improve the integrated level of LED encapsulation unit of the present utility model, simplify the packaging technology of LED encapsulation unit, as shown in figure 10, above-mentioned luminescent layer 1 also comprises circuit element 14, circuit element 14 is interconnected with conductive layer 13 electricity, package main body 12 comprises the first package main body 121 and the second package main body 122, with fluorescent material district's 22 corresponding settings and LED chip 11 is encapsulated in the first package main body 121; Arrange and circuit element 14 is encapsulated in the second package main body 122 around the first package main body 121.
As shown in figure 10, above-mentioned LED encapsulation unit also comprises transparent bonding layer 3, and transparent bonding layer 3 is arranged between luminescent layer 1 and phosphor powder layer 2.Adopt transparent tack coat 3 that luminescent layer 1 and phosphor powder layer 2 are bondd fixing, because transparent bonding layer 3 is transparent, the impact of the transmitance of the light that LED chip 11 is sent is less.
In order further to weaken transparent bonding layer 3 to the impact of the light transmittance of the light that sends of LED chip 11, the refractive index of preferred the first package main body 121 is not less than the refractive index of the carrier 21 of phosphor powder layer 2; The refractive index of transparent bonding layer 3 is not more than the refractive index of the first package main body 121.
When the package main body 12 of luminescent layer 1 was the silicone encapsulation main body, preferred luminescent layer 1 was the oxygen plasma treatment surface with the faying face of phosphor powder layer 2.Luminescent layer 1 after the employing oxygen gas plasma is processed can be directly bonding with the faying face of phosphor powder layer 2, therefore need between luminescent layer 1 and phosphor powder layer 2, transparent bonding layer 3 be set, and saved materials, simplified the manufacturing process of LED encapsulation unit.
In the another kind of typical execution mode of the utility model, a kind of LED package system also is provided, comprise one or more LED encapsulation units, the LED encapsulation unit is above-mentioned LED encapsulation unit, and each LED encapsulation unit is two-dimensional array and arranges.
By the LED package system that LED encapsulation unit two-dimensional array of the present utility model is arranged and formed, gathered the function of individual LED encapsulation unit, improved the integrated level of LED package system.
In another preferred embodiment of the utility model, above-mentioned LED encapsulation unit is a plurality of, each LED encapsulation unit be wholely set or mutually isolation arrange, between each LED encapsulation unit, electricity is interconnected or work alone.When each LED encapsulation unit electricity is interconnected, realized the unified purpose of controlling of each LED encapsulation unit; When each LED encapsulation unit works alone, adopt different control system to control and to realize more function.
The above is only preferred embodiment of the present utility model, is not limited to the utility model, and for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (17)
1. a phosphor powder layer, is characterized in that, described phosphor powder layer comprises:
Carrier (21) comprises the first surface and the second surface that are oppositely arranged, and has one or more container cavities, and described container cavity has the first opening that is arranged on described first surface at least;
One or more fluorescent material district (22) is arranged in described container cavity.
2. phosphor powder layer according to claim 1, is characterized in that, described container cavity is the first surface of the described carrier of perforation (21) and the through hole of second surface, and described fluorescent material district (22) is filled in described through hole.
3. phosphor powder layer according to claim 1, is characterized in that, described container cavity is the groove with described first opening, and the bottom of described groove is transparent, and described fluorescent material district (22) is filled in described groove.
4. according to claim 2 or 3 described phosphor powder layers, is characterized in that,
At least part of described fluorescent material district (22) towards an end of described the first opening with respect to the sidewall of the described container cavity formation extension that stretches out, the end face of described extension is the cambered surface of evagination; Or
The end face towards an end of described the first opening at least part of described fluorescent material district (22) is scattering surface.
5. according to claim 2 or 3 described phosphor powder layers, is characterized in that,
The sidewall slope of described container cavity, and the aperture area of the first opening of described container cavity is the maximum secting area perpendicular to its bearing of trend of described container cavity.
6. according to claim 1 and 2 or 3 described phosphor powder layers, is characterized in that, described phosphor powder layer also comprises reflector (23), and described reflector (23) comprise the internal reflection layer (231) that arranges along the sidewall of described container cavity.
7. phosphor powder layer according to claim 6, is characterized in that, described reflector (23) also comprise outer reflective layer (232), and described outer reflective layer (232) is along the first surface setting of first opening with described container cavity of described carrier (21).
8. according to claim 1 and 2 or 3 described phosphor powder layers, is characterized in that, described phosphor powder layer also comprises reserves through hole (24), described reservation through hole (24) be arranged in described carrier (21) and bearing of trend identical with the bearing of trend of described container cavity.
9. according to claim 1 and 2 or 3 described phosphor powder layers, is characterized in that, described fluorescent material district (22) has a plurality of, and the fluorescent material at least part of described fluorescent material district (22) is different from the fluorescent material in all the other described fluorescent material districts (22).
10. a LED encapsulation unit, is characterized in that, described LED encapsulation unit comprises:
Luminescent layer (1) has one or more LED chips (11) that are array distribution;
Phosphor powder layer (2), be the described phosphor powder layer of any one in claim 1 to 9, the fluorescent material district (22) of described phosphor powder layer (2) be arranged on described LED chip (11) directly over, and the first surface of the carrier (21) of described phosphor powder layer (2) arranges away from described luminescent layer (1).
11. LED encapsulation unit according to claim 10 is characterized in that, is provided with in the carrier (21) of described phosphor powder layer (2) to reserve through hole (24), described luminescent layer (1) also comprises:
Package main body (12), described LED chip (11) are encapsulated in described package main body (12);
Conductive layer (13) is encapsulated in package main body (12), and described LED chip (11) is interconnected with described conductive layer (13) electricity, the described conductive layer of part (13) and the corresponding setting of described reservation through hole (24).
12. LED encapsulation unit according to claim 11 is characterized in that, described luminescent layer (1) also comprises circuit element (14), and described circuit element (14) is interconnected with described conductive layer (13) electricity, and described package main body (12) comprising:
The first package main body (121) encapsulates wherein with the corresponding setting in described fluorescent material district (22) and with described LED chip (11);
The second package main body (122) arranges and described circuit element (14) is encapsulated wherein around described the first package main body (121).
13. LED encapsulation unit according to claim 12 is characterized in that, described LED encapsulation unit also comprises transparent bonding layer (3), and described transparent bonding layer (3) is arranged between described luminescent layer (1) and described phosphor powder layer (2).
14. LED encapsulation unit according to claim 13 is characterized in that, the refractive index of described the first package main body (121) is not less than the refractive index of the carrier (21) of described phosphor powder layer (2); The refractive index of described transparent bonding layer (3) is not more than the refractive index of described the first package main body (121).
15. LED encapsulation unit according to claim 11 is characterized in that, described package main body (12) is the silicone encapsulation main body, and described luminescent layer (1) is the oxygen plasma treatment surface with the faying face of described phosphor powder layer (2).
16. a LED package system comprises one or more LED encapsulation units, it is characterized in that, described LED encapsulation unit is the described LED encapsulation unit of any one in claim 10 to 15, and each described LED encapsulation unit is two-dimensional array and arranges.
17. LED package system according to claim 16 is characterized in that, described LED encapsulation unit is a plurality of, each described LED encapsulation unit be wholely set or mutually isolation arrange, between each described LED encapsulation unit, electricity is interconnected or work alone.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201220636431 CN202948973U (en) | 2012-11-27 | 2012-11-27 | Fluorescent powder layer, light emitting diode (LED) packaging unit and LED packaging system |
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| CN 201220636431 CN202948973U (en) | 2012-11-27 | 2012-11-27 | Fluorescent powder layer, light emitting diode (LED) packaging unit and LED packaging system |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470368A (en) * | 2014-09-30 | 2016-04-06 | 日亚化学工业株式会社 | Light emitting device and method for manufacturing thereof |
| CN107565000A (en) * | 2017-09-14 | 2018-01-09 | 海迪科（南通）光电科技有限公司 | A kind of LED encapsulation structure and its method for packing with double-deck phosphor powder layer |
| JP2019050432A (en) * | 2018-12-28 | 2019-03-28 | 日亜化学工業株式会社 | Light transmitting member, method for manufacturing the same, light emitting device, and method for manufacturing the same |
| CN109751564A (en) * | 2017-11-03 | 2019-05-14 | Lg电子株式会社 | Phosphor module |
-
2012
- 2012-11-27 CN CN 201220636431 patent/CN202948973U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470368A (en) * | 2014-09-30 | 2016-04-06 | 日亚化学工业株式会社 | Light emitting device and method for manufacturing thereof |
| US10636764B2 (en) | 2014-09-30 | 2020-04-28 | Nichia Corporation | Light emitting device |
| CN107565000A (en) * | 2017-09-14 | 2018-01-09 | 海迪科（南通）光电科技有限公司 | A kind of LED encapsulation structure and its method for packing with double-deck phosphor powder layer |
| CN109751564A (en) * | 2017-11-03 | 2019-05-14 | Lg电子株式会社 | Phosphor module |
| CN109751564B (en) * | 2017-11-03 | 2021-11-19 | Lg电子株式会社 | Phosphor module |
| JP2019050432A (en) * | 2018-12-28 | 2019-03-28 | 日亜化学工業株式会社 | Light transmitting member, method for manufacturing the same, light emitting device, and method for manufacturing the same |
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Inventor after: Wei Jia Inventor after: Huang Jieying Inventor after: Dong Mingzhi Inventor after: Wang Zhiying Inventor after: Yuan Changan Inventor after: Zhang Guoqi Inventor before: Wei Jia Inventor before: Huang Jieying Inventor before: Dong Mingzhi Inventor before: Wang Zhiying Inventor before: Yuan Changan |
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Free format text: CORRECT: INVENTOR; FROM: YUE YONGYING HUANG JIEYING DONG MINGZHI WANG ZHIYING YUAN CHANGAN TO: YUE YONGYING HUANG JIEYING DONG MINGZHI WANG ZHIYING YUAN CHANGAN ZHANG GUOQI |
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Granted publication date: 20130522 Termination date: 20201127 |