US20080081199A1 - Ceramic substrate and fabricating method thereof - Google Patents
Ceramic substrate and fabricating method thereof Download PDFInfo
- Publication number
- US20080081199A1 US20080081199A1 US11/889,132 US88913207A US2008081199A1 US 20080081199 A1 US20080081199 A1 US 20080081199A1 US 88913207 A US88913207 A US 88913207A US 2008081199 A1 US2008081199 A1 US 2008081199A1
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- Prior art keywords
- ceramic
- thin plate
- ceramic thin
- plate
- mold
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- 239000000919 ceramic Substances 0.000 title claims abstract description 186
- 238000000034 method Methods 0.000 title claims abstract description 86
- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 238000005245 sintering Methods 0.000 claims abstract description 60
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 15
- 230000000694 effects Effects 0.000 claims abstract description 7
- 239000011521 glass Substances 0.000 claims abstract description 6
- 239000002241 glass-ceramic Substances 0.000 claims abstract description 6
- 239000007791 liquid phase Substances 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical group CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000004014 plasticizer Substances 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000000462 isostatic pressing Methods 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 230000008602 contraction Effects 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000002002 slurry Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
- C04B35/645—Pressure sintering
- C04B35/6455—Hot isostatic pressing
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
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- C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
- C04B37/005—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of glass or ceramic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/10—Glass interlayers, e.g. frit or flux
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
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- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/62—Forming laminates or joined articles comprising holes, channels or other types of openings
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
Definitions
- the invention relates to a fabricating method for a ceramic substrate and, in particular to a fabricating method for a ceramic substrate without sintering contraction.
- a conventional LTCC substrate 1 applied to the high-frequency wireless communication element has a multi-layer structure formed by stacking up a plurality of ceramic thin plates 11 .
- a conductive layer 111 and an electrical element 112 are disposed on each layer or between two adjacent layers.
- the conductive layer 111 may be connected to another conductive layer 111 and another electrical element 112 via the through hole(s) 113 .
- the conductive layer 111 or the electrical element 112 is formed on a surface of the ceramic thin plate 11 by the thick-film printing technology followed by the multi-layer press-forming and the process of sintering at a temperature lower than 1000° C.
- the ceramic thin plate 11 may have the problem of deformation, such as contraction, distortion, and curved condition because the contraction amounts between the ceramic thin plates 11 in different layers may be different from each other or one another, or voids are generated due to the volatilized solvent or adhesive during the sintering process. This phenomenon becomes obvious when a thinner ceramic thin plate is being manufactured.
- the contraction of the ceramic substrate caused during the sintering process may deform the traces or the overall substrate.
- the contraction ratios of the ceramic substrates produced in different batches may also be different from one another, thereby increasing the difficulties in the circuit design and the product manufacturing process. Also, the manufacturing cost is increased, the application range is restricted, and the yield and the reliability of the LTCC substrate 1 are influenced.
- the contraction direction of the ceramic thin plate 11 is restricted by a mechanical force during the press-forming and the curved condition of the ceramic thin plate 11 is suppressed.
- this method is not suitable for the mass production.
- a pre-mold plate is adhered to a metal plate and then both of the pre-mold plate and the metal plate are proceeded by the sintering process.
- the metal plate is made of the metal having the high mechanical intensity, such as molybdenum or tungsten, so as to provide a constraining force onto the pre-mold plate of the metal sheet, whereby reducing the phenomenon of the x-y direction contraction of the pre-mold plate.
- the difference between the thermal expansion coefficients of the metal sheet and the pre-mold plate still causes the sintered LTCC substrate to be cambered and curved, even to be cracked.
- an aluminum oxide layer is separately added to the top and bottom surfaces of each pre-mold plate so that a friction force can be provided to restrict the contraction of the pre-mold plate during the sintering process.
- the ceramic substrate is obtained after removing the aluminum oxide layers, which causes the problem that the aluminum oxide layer is remained on the substrate. Also, the manufacturing flow of this method is more complicated and is not suitable for the mass production.
- the present invention is to provide a fabricating method for fabricating a ceramic substrate, in which the contraction of the ceramic substrate can be effectively suppressed, so that the ceramic substrate is flat and has no curved portion and sintering contraction, and the related art drawbacks can be eliminated. Also, the processes of the fabricating method are simple and are suitable for the mass production.
- the present invention discloses a fabricating method for a ceramic substrate.
- the method includes the steps of providing a ceramic thin plate and a pre-mold plate, stacking up the ceramic thin plate and the pre-mold plate together, and sintering the ceramic thin plate and the pre-mold plate to jointly form the ceramic substrate.
- the invention also discloses a fabricating method for a ceramic substrate.
- the method includes the steps of providing at least one first ceramic thin plate, at least one second ceramic thin plate and at least one pre-mold plate, stacking up the first ceramic thin plate, the second ceramic thin plate and the pre-mold plate.
- the pre-mold plate is disposed between the first ceramic thin plate and the second ceramic thin plate, and the first ceramic thin plate, the pre-mold plate and the second ceramic thin plate are performed by a sintering process so as to jointly form the ceramic substrate.
- the present invention discloses a ceramic substrate composed of a ceramic thin plate and a pre-mold plate.
- the ceramic substrate is an LTCC substrate
- the pre-mold plate is formed by mixing a ceramic material and an inorganic adhesive including a glass ceramic or the crystallized or non-crystallized glass.
- the inorganic adhesive has properties of a worse chemical activity than other materials, a sintering temperature lower than that of the ceramic material, and being in a liquid phase during a sintering process.
- the fabricating method for the ceramic substrate according to the present invention is to dispose a ceramic thin plate on a pre-mold plate so that the ceramic thin plate can provide a constraining force against the pre-mold plate and suppress the contraction of the pre-mold plate during the sintering process.
- the number of the ceramic thin plates may be greater than one, and those ceramic thin plates may be made of the same material or different materials.
- the ceramic thin plate and the pre-mold plate have substantially the same property, so the present invention can suppress the contraction during the sintering process and also can prevent the ceramic substrate from being curved so that the flat ceramic substrate can be obtained.
- the ceramic thin plate for providing a constraining force behaves as one part of the ceramic substrate, so that the removing step can be omitted and the worry of the remained impurity can be avoided. As the result, the yield and the reliability of the ceramic substrate can be enhanced.
- FIG. 1 is a schematic illustration showing a conventional LTCC substrate
- FIG. 2 is a flow chart showing a fabricating method for a ceramic substrate according to an embodiment of the present invention
- FIGS. 3 to 5 are schematic illustrations showing various ceramic substrates according to the fabricating method of FIG. 2 ;
- FIG. 6 is a schematically cross-sectional view showing a ceramic substrate fabricated by the fabricating method of FIG. 2 according to the embodiment of the present invention
- FIG. 7 is a flow chart showing another fabricating method for another ceramic substrate according to the embodiment of the present invention.
- FIG. 8 is schematic illustration showing a ceramic substrate according to the fabricating method of FIG. 7 .
- FIG. 2 is a flow chart showing a fabricating method for a ceramic substrate according to an embodiment of the present invention.
- FIG. 3 is a schematic illustration showing the ceramic substrate according to the fabricating method of FIG. 2 .
- the fabricating method for the ceramic substrate according to the embodiment of the present invention includes steps S 1 , S 2 , S 21 , S 3 and S 31 , which will be described in detail in the following.
- a ceramic thin plate 31 and a pre-mold plate 32 are provided.
- the pre-mold plate 32 is fabricated according to the following procedures. Firstly, at least one ceramic material is mixed with an inorganic adhesive to obtain a slurry. Then, a polymeric adhesive, a plasticizer or an organic solvent is added to the slurry to prepare another slurry with the suitable viscosity. Next, a scraper is adopted to fabricate the pre-mold plate 32 .
- the ceramic material may be selected from one of the group consisting of a ceramic powder, a metal oxide powder, a composite metal oxide powder or combinations thereof.
- the inorganic adhesive has a worse chemical activity than other materials and a sintering temperature lower than that of the ceramic material, and is in a liquid phase during a sintering process.
- the inorganic adhesive can be the crystallized or non-crystallized glass or glass ceramic.
- the polymeric adhesive can be polyethylene glycol (PEG), polyvinyl butyal (PVB) or polyvinyl alcohol (PVA).
- the plasticizer can be dibotylphthalate (DBP).
- the organic solvent can be 1-Propanol extra pure, toluene or alcohol.
- the ceramic thin plate 31 is fabricated according to the following procedures.
- a lower sintering temperature pre-mold plate (called as first pre-mold plate below) is disposed between two higher sintering temperature pre-mold plates (called as second pre-mold plate below). That is, the first pre-mold plate is sandwiched between the second pre-mold plates. Then, the first pre-mold plate and the second pre-mold plates are processed by a sintering process with a lower sintering temperature so that the first pre-mold plate with the lower sintering temperature is sintered into the ceramic thin plate 31 . However, the second pre-mold plates having the higher sintering temperature are not sintered.
- the ceramic material having the lower sintering temperature and the inorganic adhesive are mixed together to form a second slurry, and the ceramic material having the higher sintering temperature and the inorganic adhesive are mixed together to form a first slurry.
- the pre-mold plates with the lower sintering temperature and the higher sintering temperature are formed using the first slurry and the second slurry, respectively.
- the pre-mold plates are stacked up in sequence.
- the one first pre-mold plate is sandwiched between the two second pre-mold plates.
- the stacked pre-mold plates are sintered at the lower sintering temperature so that the first pre-mold plates with the lower sintering temperature are sintered into the ceramic thin plate while the second pre-mold plate having the higher sintering temperature is not sintered yet.
- the second pre-mold plates having the higher sintering temperature provide a constraining force against the first pre-mold plate having the lower sintering temperature
- the second pre-mold plates, which have the higher sintering temperature and are not sintered, are removed so that the ceramic thin plate 31 , which is thin and flat and has no curved portion, is fabricated.
- the pre-mold plate 32 or the ceramic thin plate 31 in this embodiment can be punched with holes and filled with a conductive material in advance, and the pre-mold plate 32 or the ceramic thin plate 31 is printed with conductive traces before the step of stacking up.
- the ceramic thin plate 31 and the pre-mold plate 32 are stacked up.
- the pre-mold plate 32 is disposed on the ceramic thin plate 31 .
- the pre-mold plate 32 is attached to the surface of the ceramic thin plate 31 . That is, the pre-mold plate 32 is disposed on the ceramic thin plate 31 , which is sintered to provide a constraining force to the pre-mold plate 32 that is not sintered.
- the phenomenon of contraction occurred during the subsequent sintering process can be reduced.
- the ceramic thin plate 31 is adhered to the pre-mold plate 32 by an adhesive, which is formed on the surface of the pre-mold plate 32 or the ceramic thin plate 31 by way of coating, for example. Then, the ceramic thin plate 31 is aligned with and then adhered to the pre-mold plate 32 .
- the adhesive is an inorganic adhesive, such as crystallized or non-crystallized glass or a glass ceramic. Or, the inorganic adhesive has properties of a worse chemical activity than other materials, a sintering temperature lower than that of the ceramic material, and being in a liquid phase during a sintering process
- the method further includes a step 21 after the step S 2 .
- step 21 the stacked ceramic thin plate 31 and pre-mold plate 32 are pressed by way of hot pressing and isostatic pressing so as to make the stack of the ceramic thin plate and the pre-mold plate become denser and to prevent the ceramic substrate 3 from being curved during the subsequent sintering process.
- step S 3 the ceramic thin plate 31 and the pre-mold plate 32 are sintered to jointly form the ceramic substrate 3 .
- the ceramic thin plate 31 and the pre-mold plate 32 are jointly sintered at the sintering temperature of the pre-mold plate 32 to jointly form the ceramic substrate 3 .
- the constraining force of the ceramic thin plate 31 against the pre-mold plate 32 is utilized to fabricate the ceramic substrate 3 , which is flat and has no sintering contraction and no curved portion.
- the method further includes a step S 31 of testing the property of the ceramic substrate 3 after step S 3 .
- a step S 31 of testing the property of the ceramic substrate 3 for example, an instrument is utilized to test the dielectric property and the quality property of the sintered ceramic substrate 3 , which include a dielectric constant ( ⁇ ) and a quality factor (Q), so that the ceramic substrate 3 satisfying the specification can be obtained.
- ⁇ dielectric constant
- Q quality factor
- the ceramic substrate 3 of FIG. 3 includes one ceramic thin plate 31 and one pre-mold plate 32 .
- the present invention is not particularly limited thereto.
- a ceramic substrate 4 is composed of one ceramic thin plate 31 and two pre-mold plates 32 , which are stacked up, and the ceramic thin plate is disposed between the two pre-mold plates 32 .
- the sintered ceramic thin plate 31 provides a constraining force against the two pre-mold plates 32 so as to prevent the two pre-mold plates 32 from contraction during the subsequent sintering process.
- a ceramic substrate 5 is composed of one pre-mold plate 32 and two ceramic thin plates 31 , which are stacked up, and the pre-mold plate 32 is disposed and sandwiched between the two ceramic thin plates 31 . That is, the two ceramic thin plates 31 are respectively adhered to two opposite surfaces of the pre-mold plate 32 , and the two ceramic thin plates 31 provide a constraining force against the pre-mold plate 32 to prevent the contraction of the pre-mold plate 32 during the subsequent sintering process.
- the number of the ceramic thin plate(s) 31 and the number of the pre-mold plate(s) 32 in FIG. 3 , 4 or 5 are illustrated as an example.
- the ceramic thin plates 31 and the pre-mold plates 32 may be alternately stacked up according to the actual requirements so that the ceramic substrates with the required thickness can be fabricated in a mass production manner.
- FIG. 6 is a schematically cross-sectional view showing a ceramic substrate 6 fabricated by the fabricating method of FIG. 2 according to the embodiment of the present invention.
- at least one electrical element 63 or at least one conductive layer 64 is disposed on a surface of the ceramic substrate 6 or disposed within the ceramic substrate 6 .
- the electrical element 63 includes, for example but not limited to, a capacitor, a resistor or an inductor.
- the conductive layers 64 can be electrically connected to each other or one another via a plurality of through holes 65 .
- the ceramic substrate 6 of this embodiment is, for example, a LTCC substrate, and is applied to a high precision IC carrier, a multi-chip module and a weather-resistant circuit board.
- FIG. 7 is a flow chart showing another fabricating method for another ceramic substrate according to the embodiment of the present invention.
- FIG. 8 is schematic illustration showing a ceramic substrate according to the fabricating method of FIG. 7 .
- the fabricating method includes steps S 1 ′, S 2 ′, S 21 ′, S 3 ′, S 31 ′ and S 3 ′.
- step S 1 ′ at least one first ceramic thin plate 31 , at least one second ceramic thin plate 33 and at least one pre-mold plate 32 are provided.
- step S 2 ′ the first ceramic thin plate, the pre-mold plate and the second ceramic thin plate are stacked up in sequence, and the pre-mold plate is disposed between the first ceramic thin plate and the second ceramic thin plate.
- the first ceramic thin plate 31 , the pre-mold plate 32 , the second ceramic thin plate 33 , the pre-mold plate 32 and the first ceramic thin plate 31 are stacked up in sequence.
- the method further includes step S 21 ′ after the step S 2 ′.
- step S 21 ′ the stack first ceramic thin plate 31 , pre-mold plate 32 and second ceramic thin plate 33 are pressed by way of hot pressing and isostatic pressing so as to make the stack of the first ceramic thin plate 31 , pre-mold plate 32 and second ceramic thin plate 33 denser and to prevent the ceramic substrate 8 from being curved during the subsequent sintering process.
- step S 3 ′ the stacked first ceramic thin plate 31 , pre-mold plate 32 and second ceramic thin plate 33 are sintered to form a ceramic substrate 8 .
- the method of this embodiment may further include the step S 31 ′ of testing the property of the ceramic substrate after the step S 3 ′.
- the detailed implementation and the material of fabrication are similar to those of the fabrication method of FIG. 2 and have been described in the above-mentioned embodiment, so detailed descriptions thereof will be omitted.
- the first ceramic thin plate 31 and the second ceramic thin plate 33 constraining the pre-mold plate 32 may be made of different materials as long as the effect of suppressing the contraction of the disposed pre-mold plate during the sintering process can be achieved.
- the material of the pre-mold plate 32 can be different from that of each of the first ceramic thin plate 31 and the second ceramic thin plate 33 .
- the fabricating method for the ceramic substrate according to the present invention is to dispose a ceramic thin plate on a pre-mold plate so that the ceramic thin plate can provide a constraining force against the pre-mold plate and suppress the contraction of the pre-mold plate during the sintering process.
- the number of the ceramic thin plates may be greater than one, and those ceramic thin plates may be made of the same material or different materials.
- the ceramic thin plate and the pre-mold plate have substantially the same property, so the present invention can suppress the contraction during the sintering process and also can prevent the ceramic substrate from being curved so that the flat ceramic substrate can be obtained.
- the ceramic thin plate for providing a constraining force behaves as one part of the ceramic substrate, so that the removing step can be omitted and the worry of the remained impurity can be avoided. As the result, the yield and the reliability of the ceramic substrate can be enhanced.
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Abstract
A fabricating method for a ceramic substrate includes the steps of: providing a ceramic thin plate and a pre-mold plate; stacking the ceramic thin plate and the pre-mold plate together; and sintering the ceramic thin plate and the pre-mold plate, both of which jointly form the ceramic substrate. Also, a ceramic substrate composed of a ceramic thin plate and a pre-mold plate is disclosed. The ceramic substrate is an LTCC substrate, and the pre-mold plate is formed by mixing a ceramic material and an inorganic adhesive including crystallized or non-crystallized glass or a glass ceramic, or the inorganic adhesive has properties of a worse chemical activity than other materials, a sintering temperature lower than that of the ceramic material, and being in a liquid phase during a sintering process.
Description
- This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 095136188, filed in Taiwan, Republic of China on Sep. 29, 2006, the entire contents of which are hereby incorporated by reference.
- 1. Field of Invention
- The invention relates to a fabricating method for a ceramic substrate and, in particular to a fabricating method for a ceramic substrate without sintering contraction.
- 2. Related Art
- Recently, the high element density has become a trend of developing electronic products while portable information electronic products and mobile communication products are developed toward the trends of miniaturization, multi-function, high reliability and low price. Thus, active devices and passive devices used in a circuit have been developed toward the trends of integration, system-on-chip and modularization so that the size of the circuit can be effectively reduced, the cost can be reduced, and the competition ability of the product can be enhanced.
- The development of the low temperature co-fired ceramics (LTCC) technology increases the volume availability of the electronic product by integrating the circuits of the electronic elements, including the passive devices and the active devices, in a multi-layer structure. As shown in
FIG. 1 , aconventional LTCC substrate 1 applied to the high-frequency wireless communication element has a multi-layer structure formed by stacking up a plurality of ceramicthin plates 11. Aconductive layer 111 and anelectrical element 112, such as a resistor, a capacitor or an inductor, are disposed on each layer or between two adjacent layers. Theconductive layer 111 may be connected to anotherconductive layer 111 and anotherelectrical element 112 via the through hole(s) 113. Theconductive layer 111 or theelectrical element 112 is formed on a surface of the ceramicthin plate 11 by the thick-film printing technology followed by the multi-layer press-forming and the process of sintering at a temperature lower than 1000° C. - However, the ceramic
thin plate 11 may have the problem of deformation, such as contraction, distortion, and curved condition because the contraction amounts between the ceramicthin plates 11 in different layers may be different from each other or one another, or voids are generated due to the volatilized solvent or adhesive during the sintering process. This phenomenon becomes obvious when a thinner ceramic thin plate is being manufactured. In addition, the contraction of the ceramic substrate caused during the sintering process may deform the traces or the overall substrate. In addition, the contraction ratios of the ceramic substrates produced in different batches may also be different from one another, thereby increasing the difficulties in the circuit design and the product manufacturing process. Also, the manufacturing cost is increased, the application range is restricted, and the yield and the reliability of theLTCC substrate 1 are influenced. - To solve the above-mentioned problem, several methods of preventing the contraction have been disclosed. In the first method, the contraction direction of the ceramic
thin plate 11 is restricted by a mechanical force during the press-forming and the curved condition of the ceramicthin plate 11 is suppressed. However, this method is not suitable for the mass production. In the second method, a pre-mold plate is adhered to a metal plate and then both of the pre-mold plate and the metal plate are proceeded by the sintering process. The metal plate is made of the metal having the high mechanical intensity, such as molybdenum or tungsten, so as to provide a constraining force onto the pre-mold plate of the metal sheet, whereby reducing the phenomenon of the x-y direction contraction of the pre-mold plate. However, the difference between the thermal expansion coefficients of the metal sheet and the pre-mold plate still causes the sintered LTCC substrate to be cambered and curved, even to be cracked. In the third method, an aluminum oxide layer is separately added to the top and bottom surfaces of each pre-mold plate so that a friction force can be provided to restrict the contraction of the pre-mold plate during the sintering process. However, the ceramic substrate is obtained after removing the aluminum oxide layers, which causes the problem that the aluminum oxide layer is remained on the substrate. Also, the manufacturing flow of this method is more complicated and is not suitable for the mass production. - In view of the foregoing, the present invention is to provide a fabricating method for fabricating a ceramic substrate, in which the contraction of the ceramic substrate can be effectively suppressed, so that the ceramic substrate is flat and has no curved portion and sintering contraction, and the related art drawbacks can be eliminated. Also, the processes of the fabricating method are simple and are suitable for the mass production.
- To achieve the above, the present invention discloses a fabricating method for a ceramic substrate. The method includes the steps of providing a ceramic thin plate and a pre-mold plate, stacking up the ceramic thin plate and the pre-mold plate together, and sintering the ceramic thin plate and the pre-mold plate to jointly form the ceramic substrate.
- The invention also discloses a fabricating method for a ceramic substrate. The method includes the steps of providing at least one first ceramic thin plate, at least one second ceramic thin plate and at least one pre-mold plate, stacking up the first ceramic thin plate, the second ceramic thin plate and the pre-mold plate. The pre-mold plate is disposed between the first ceramic thin plate and the second ceramic thin plate, and the first ceramic thin plate, the pre-mold plate and the second ceramic thin plate are performed by a sintering process so as to jointly form the ceramic substrate.
- Further, the present invention discloses a ceramic substrate composed of a ceramic thin plate and a pre-mold plate. The ceramic substrate is an LTCC substrate, and the pre-mold plate is formed by mixing a ceramic material and an inorganic adhesive including a glass ceramic or the crystallized or non-crystallized glass. Alternatively, the inorganic adhesive has properties of a worse chemical activity than other materials, a sintering temperature lower than that of the ceramic material, and being in a liquid phase during a sintering process.
- As mentioned above, the fabricating method for the ceramic substrate according to the present invention is to dispose a ceramic thin plate on a pre-mold plate so that the ceramic thin plate can provide a constraining force against the pre-mold plate and suppress the contraction of the pre-mold plate during the sintering process. The number of the ceramic thin plates may be greater than one, and those ceramic thin plates may be made of the same material or different materials. Compared with the prior art, the ceramic thin plate and the pre-mold plate have substantially the same property, so the present invention can suppress the contraction during the sintering process and also can prevent the ceramic substrate from being curved so that the flat ceramic substrate can be obtained. Also, the ceramic thin plate for providing a constraining force behaves as one part of the ceramic substrate, so that the removing step can be omitted and the worry of the remained impurity can be avoided. As the result, the yield and the reliability of the ceramic substrate can be enhanced.
- The invention will become more fully understood from the detailed description given herein below illustration only, and thus is not limitative of the present invention, and wherein:
-
FIG. 1 is a schematic illustration showing a conventional LTCC substrate; -
FIG. 2 is a flow chart showing a fabricating method for a ceramic substrate according to an embodiment of the present invention; -
FIGS. 3 to 5 are schematic illustrations showing various ceramic substrates according to the fabricating method ofFIG. 2 ; -
FIG. 6 is a schematically cross-sectional view showing a ceramic substrate fabricated by the fabricating method ofFIG. 2 according to the embodiment of the present invention; -
FIG. 7 is a flow chart showing another fabricating method for another ceramic substrate according to the embodiment of the present invention; and -
FIG. 8 is schematic illustration showing a ceramic substrate according to the fabricating method ofFIG. 7 . - The present invention will be apparent from the following detailed description, which proceeds with reference to the accompanying drawings, wherein the same references relate to the same elements.
-
FIG. 2 is a flow chart showing a fabricating method for a ceramic substrate according to an embodiment of the present invention.FIG. 3 is a schematic illustration showing the ceramic substrate according to the fabricating method ofFIG. 2 . Referring both toFIGS. 2 and 3 , the fabricating method for the ceramic substrate according to the embodiment of the present invention includes steps S1, S2, S21, S3 and S31, which will be described in detail in the following. - In step S1, a ceramic
thin plate 31 and apre-mold plate 32 are provided. Thepre-mold plate 32 is fabricated according to the following procedures. Firstly, at least one ceramic material is mixed with an inorganic adhesive to obtain a slurry. Then, a polymeric adhesive, a plasticizer or an organic solvent is added to the slurry to prepare another slurry with the suitable viscosity. Next, a scraper is adopted to fabricate thepre-mold plate 32. - The ceramic material may be selected from one of the group consisting of a ceramic powder, a metal oxide powder, a composite metal oxide powder or combinations thereof. The inorganic adhesive has a worse chemical activity than other materials and a sintering temperature lower than that of the ceramic material, and is in a liquid phase during a sintering process. The inorganic adhesive can be the crystallized or non-crystallized glass or glass ceramic. The polymeric adhesive can be polyethylene glycol (PEG), polyvinyl butyal (PVB) or polyvinyl alcohol (PVA). The plasticizer can be dibotylphthalate (DBP). The organic solvent can be 1-Propanol extra pure, toluene or alcohol.
- The ceramic
thin plate 31 is fabricated according to the following procedures. A lower sintering temperature pre-mold plate (called as first pre-mold plate below) is disposed between two higher sintering temperature pre-mold plates (called as second pre-mold plate below). That is, the first pre-mold plate is sandwiched between the second pre-mold plates. Then, the first pre-mold plate and the second pre-mold plates are processed by a sintering process with a lower sintering temperature so that the first pre-mold plate with the lower sintering temperature is sintered into the ceramicthin plate 31. However, the second pre-mold plates having the higher sintering temperature are not sintered. - The details will be described in the following. Firstly, the ceramic material having the lower sintering temperature and the inorganic adhesive are mixed together to form a second slurry, and the ceramic material having the higher sintering temperature and the inorganic adhesive are mixed together to form a first slurry. Next, the pre-mold plates with the lower sintering temperature and the higher sintering temperature are formed using the first slurry and the second slurry, respectively. Then, the pre-mold plates are stacked up in sequence. Herein, the one first pre-mold plate is sandwiched between the two second pre-mold plates. Next, the stacked pre-mold plates are sintered at the lower sintering temperature so that the first pre-mold plates with the lower sintering temperature are sintered into the ceramic thin plate while the second pre-mold plate having the higher sintering temperature is not sintered yet.
- During the sintering process, the second pre-mold plates having the higher sintering temperature provide a constraining force against the first pre-mold plate having the lower sintering temperature, and finally the second pre-mold plates, which have the higher sintering temperature and are not sintered, are removed so that the ceramic
thin plate 31, which is thin and flat and has no curved portion, is fabricated. - In addition, the
pre-mold plate 32 or the ceramicthin plate 31 in this embodiment can be punched with holes and filled with a conductive material in advance, and thepre-mold plate 32 or the ceramicthin plate 31 is printed with conductive traces before the step of stacking up. - So far, the ceramic
thin plate 31 and thepre-mold plate 32 are stacked up. Thepre-mold plate 32 is disposed on the ceramicthin plate 31. In more details, thepre-mold plate 32 is attached to the surface of the ceramicthin plate 31. That is, thepre-mold plate 32 is disposed on the ceramicthin plate 31, which is sintered to provide a constraining force to thepre-mold plate 32 that is not sintered. Thus, the phenomenon of contraction occurred during the subsequent sintering process can be reduced. - In addition, the ceramic
thin plate 31 is adhered to thepre-mold plate 32 by an adhesive, which is formed on the surface of thepre-mold plate 32 or the ceramicthin plate 31 by way of coating, for example. Then, the ceramicthin plate 31 is aligned with and then adhered to thepre-mold plate 32. The adhesive is an inorganic adhesive, such as crystallized or non-crystallized glass or a glass ceramic. Or, the inorganic adhesive has properties of a worse chemical activity than other materials, a sintering temperature lower than that of the ceramic material, and being in a liquid phase during a sintering process - The method further includes a step 21 after the step S2. In step 21, the stacked ceramic
thin plate 31 andpre-mold plate 32 are pressed by way of hot pressing and isostatic pressing so as to make the stack of the ceramic thin plate and the pre-mold plate become denser and to prevent theceramic substrate 3 from being curved during the subsequent sintering process. - In step S3, the ceramic
thin plate 31 and thepre-mold plate 32 are sintered to jointly form theceramic substrate 3. In step S3, the ceramicthin plate 31 and thepre-mold plate 32 are jointly sintered at the sintering temperature of thepre-mold plate 32 to jointly form theceramic substrate 3. In the sintering process, the constraining force of the ceramicthin plate 31 against thepre-mold plate 32 is utilized to fabricate theceramic substrate 3, which is flat and has no sintering contraction and no curved portion. - The method further includes a step S31 of testing the property of the
ceramic substrate 3 after step S3. For example, an instrument is utilized to test the dielectric property and the quality property of the sinteredceramic substrate 3, which include a dielectric constant (ε) and a quality factor (Q), so that theceramic substrate 3 satisfying the specification can be obtained. - The
ceramic substrate 3 ofFIG. 3 includes one ceramicthin plate 31 and onepre-mold plate 32. However, the present invention is not particularly limited thereto. For example, as shown inFIG. 4 , aceramic substrate 4 is composed of one ceramicthin plate 31 and twopre-mold plates 32, which are stacked up, and the ceramic thin plate is disposed between the twopre-mold plates 32. The sintered ceramicthin plate 31 provides a constraining force against the twopre-mold plates 32 so as to prevent the twopre-mold plates 32 from contraction during the subsequent sintering process. - Alternatively, as shown in
FIG. 5 , aceramic substrate 5 is composed of onepre-mold plate 32 and two ceramicthin plates 31, which are stacked up, and thepre-mold plate 32 is disposed and sandwiched between the two ceramicthin plates 31. That is, the two ceramicthin plates 31 are respectively adhered to two opposite surfaces of thepre-mold plate 32, and the two ceramicthin plates 31 provide a constraining force against thepre-mold plate 32 to prevent the contraction of thepre-mold plate 32 during the subsequent sintering process. - As mentioned hereinabove, the number of the ceramic thin plate(s) 31 and the number of the pre-mold plate(s) 32 in
FIG. 3 , 4 or 5 are illustrated as an example. In fact, the ceramicthin plates 31 and thepre-mold plates 32 may be alternately stacked up according to the actual requirements so that the ceramic substrates with the required thickness can be fabricated in a mass production manner. -
FIG. 6 is a schematically cross-sectional view showing aceramic substrate 6 fabricated by the fabricating method ofFIG. 2 according to the embodiment of the present invention. As shown inFIG. 6 , at least oneelectrical element 63 or at least oneconductive layer 64 is disposed on a surface of theceramic substrate 6 or disposed within theceramic substrate 6. Theelectrical element 63 includes, for example but not limited to, a capacitor, a resistor or an inductor. When severalconductive layers 64 are provided, theconductive layers 64 can be electrically connected to each other or one another via a plurality of throughholes 65. Theceramic substrate 6 of this embodiment is, for example, a LTCC substrate, and is applied to a high precision IC carrier, a multi-chip module and a weather-resistant circuit board. -
FIG. 7 is a flow chart showing another fabricating method for another ceramic substrate according to the embodiment of the present invention.FIG. 8 is schematic illustration showing a ceramic substrate according to the fabricating method ofFIG. 7 . Referring toFIGS. 7 and 8 , the fabricating method includes steps S1′, S2′, S21′, S3′, S31′ and S3′. In step S1′, at least one first ceramicthin plate 31, at least one second ceramicthin plate 33 and at least onepre-mold plate 32 are provided. - In step S2′, the first ceramic thin plate, the pre-mold plate and the second ceramic thin plate are stacked up in sequence, and the pre-mold plate is disposed between the first ceramic thin plate and the second ceramic thin plate. As shown in
FIG. 8 , the first ceramicthin plate 31, thepre-mold plate 32, the second ceramicthin plate 33, thepre-mold plate 32 and the first ceramicthin plate 31 are stacked up in sequence. The method further includes step S21′ after the step S2′. In step S21′, the stack first ceramicthin plate 31,pre-mold plate 32 and second ceramicthin plate 33 are pressed by way of hot pressing and isostatic pressing so as to make the stack of the first ceramicthin plate 31,pre-mold plate 32 and second ceramicthin plate 33 denser and to prevent theceramic substrate 8 from being curved during the subsequent sintering process. - In step S3′, the stacked first ceramic
thin plate 31,pre-mold plate 32 and second ceramicthin plate 33 are sintered to form aceramic substrate 8. The method of this embodiment may further include the step S31′ of testing the property of the ceramic substrate after the step S3′. The detailed implementation and the material of fabrication are similar to those of the fabrication method ofFIG. 2 and have been described in the above-mentioned embodiment, so detailed descriptions thereof will be omitted. It is to be noted that the first ceramicthin plate 31 and the second ceramicthin plate 33 constraining thepre-mold plate 32 may be made of different materials as long as the effect of suppressing the contraction of the disposed pre-mold plate during the sintering process can be achieved. In addition, the material of thepre-mold plate 32 can be different from that of each of the first ceramicthin plate 31 and the second ceramicthin plate 33. - In summary, the fabricating method for the ceramic substrate according to the present invention is to dispose a ceramic thin plate on a pre-mold plate so that the ceramic thin plate can provide a constraining force against the pre-mold plate and suppress the contraction of the pre-mold plate during the sintering process. The number of the ceramic thin plates may be greater than one, and those ceramic thin plates may be made of the same material or different materials. Compared with the prior art, the ceramic thin plate and the pre-mold plate have substantially the same property, so the present invention can suppress the contraction during the sintering process and also can prevent the ceramic substrate from being curved so that the flat ceramic substrate can be obtained. Also, the ceramic thin plate for providing a constraining force behaves as one part of the ceramic substrate, so that the removing step can be omitted and the worry of the remained impurity can be avoided. As the result, the yield and the reliability of the ceramic substrate can be enhanced.
- Although the present invention has been described with reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments, will be apparent to persons skilled in the art. It is, therefore, contemplated that the appended claims will cover all modifications that fall within the true scope of the present invention.
Claims (20)
1. A fabricating method for a ceramic substrate, the method comprising steps of:
providing a ceramic thin plate and a pre-mold plate;
stacking up the ceramic thin plate and the pre-mold plate; and
sintering the ceramic thin plate and the pre-mold plate, both of which jointly form the ceramic substrate.
2. The method according to claim 1 , wherein after the step of stacking up the ceramic thin plate and the pre-mold plate, the method further comprises a step of:
pressing the ceramic thin plate and the pre-mold plate.
3. The method according to claim 2 , wherein the ceramic thin plate and the pre-mold plate are pressed by way of hot pressing and isostatic pressing so that a stack of the ceramic thin plate and the pre-mold plate becomes denser.
4. The method according to claim 1 , wherein after the step of sintering the ceramic thin plate and the pre-mold plate, the method further comprises a step of:
testing a property of the ceramic substrate.
5. The method according to claim 1 , wherein the ceramic thin plate is fabricated by sandwiching a pre-mold plate with a lower sintering temperature between two pre-mold plates with a higher sintering temperature and processing a sintering process with a lower sintering temperature so as to make the pre-mold plate with the lower sintering temperature to form the ceramic thin plate.
6. The method according to claim 1 , wherein the pre-mold plate is formed by mixing a ceramic material and an inorganic adhesive.
7. The method according to claim 6 , wherein the ceramic material is selected from the group consisting of a ceramic powder, a metal oxide powder, a composite metal oxide powder and combinations thereof.
8. The method according to claim 6 , wherein the inorganic adhesive is crystallized or non-crystallized glass or a glass ceramic, or the inorganic adhesive has properties of a worse chemical activity than other materials, a sintering temperature lower than that of the ceramic material, and being in a liquid phase during a sintering process.
9. The method according to claim 6 , wherein the pre-mold plate further comprises a polymeric adhesive, a plasticizer or an organic solvent.
10. The method according to claim 9 , wherein the polymeric adhesive is polyethylene glycol (PEG), polyvinyl butyal polyvinyl butyal (PVB) or polyvinyl alcohol (PVA), the plasticizer is dibotylphthalate (DBP), and the organic solvent is 1-Propanol extra pure, toluene or alcohol.
11. The method according to claim 1 , wherein at least one electrical element or at least one conductive layer is disposed on a surface of the ceramic substrate or embedded in the ceramic substrate.
12. The method according to claim 11 , wherein the electrical element is a capacitor, a resistor or an inductor, and when a plurality of conductive layers is disposed on the surface of the ceramic substrate or within the ceramic substrate, the conductive layers are connected together via at least one through hole.
13. The method according to claim 11 , wherein the pre-mold plate or the ceramic thin plate is punched with holes and filled with a conductive material, and the pre-mold plate or the ceramic thin plate is printed with conductive traces before the step of stacking up.
14. The method according to claim 1 , wherein the ceramic thin plate is adhered to the pre-mold plate by an inorganic adhesive, and the ceramic substrate is an LTCC substrate.
15. The method according to claim 1 , wherein a material of the ceramic thin plate is different from a material of the pre-mold plate.
16. The method according to claim 1 , wherein the ceramic substrate is formed by stacking up the ceramic thin plate and two pre-mold plates, and the ceramic thin plate is sandwiched between the pre-mold plates.
17. The method according to claim 1 , wherein when there are a plurality of the ceramic thin plates and a plurality of the pre-mold plates, the ceramic thin plates and the pre-mold plates are stacked up alternately.
18. A fabricating method for a ceramic substrate, the method comprising steps of:
providing at least one first ceramic thin plate, at least one second ceramic thin plate and at least one pre-mold plate;
stacking up the first ceramic thin plate, the second ceramic thin plate and the pre-mold plate wherein the pre-mold plate is disposed between the first ceramic thin plate and the second ceramic thin plate; and
sintering the first ceramic thin plate, the pre-mold plate and the second ceramic thin plate, all of which jointly form the ceramic substrate.
19. A ceramic substrate, comprising:
a ceramic thin plate and a pre-mold plate, wherein the ceramic thin plate and the pre-mold plate are stacked up and sintered to jointly form the ceramic substrate.
20. The ceramic substrate according to claim 19 , wherein the ceramic substrate is an LTCC substrate, and the pre-mold plate is formed by mixing a ceramic material and an inorganic adhesive including crystallized or non-crystallized glass or a glass ceramic, or the inorganic adhesive has properties of a worse chemical activity than other materials, a sintering temperature lower than that of the ceramic material, and being in a liquid phase during a sintering process.
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TW095136188A TW200815309A (en) | 2006-09-29 | 2006-09-29 | Ceramic substrate and fabricating method thereof |
TW095136188 | 2006-09-29 |
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US20080081199A1 true US20080081199A1 (en) | 2008-04-03 |
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US11/889,132 Abandoned US20080081199A1 (en) | 2006-09-29 | 2007-08-09 | Ceramic substrate and fabricating method thereof |
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TW (1) | TW200815309A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100073980A1 (en) * | 2008-09-23 | 2010-03-25 | Gm Global Technology Operations, Inc. | Power converter assembly with isolated gate drive circuit |
CN114025516A (en) * | 2021-11-19 | 2022-02-08 | 深圳玛斯兰电路科技实业发展有限公司 | Method for manufacturing high-frequency mixing plate |
CN115003045A (en) * | 2022-05-30 | 2022-09-02 | 青岛理工大学 | Method for manufacturing micro-nano 3D printing high-precision ceramic-based circuit based on electric field driving jet deposition |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020025439A1 (en) * | 1999-01-26 | 2002-02-28 | Murata Manufacturing Co., Ltd. | Dielectric ceramic composition and multi layered ceramic substrate |
US20030000079A1 (en) * | 2001-06-29 | 2003-01-02 | Hideyuki Harada | Method for manufacturing multilayer ceramic substrates |
US20030100146A1 (en) * | 2001-11-22 | 2003-05-29 | Sumitomo Metal (Smi) Electronics Devices Inc. | Method of fabricating multilayer ceramic substrate |
US20050241128A1 (en) * | 2004-04-29 | 2005-11-03 | Berry Cynthia W | Method of laminating low temperature co-fired ceramic (LTCC) material and product formed thereby |
-
2006
- 2006-09-29 TW TW095136188A patent/TW200815309A/en unknown
-
2007
- 2007-08-09 US US11/889,132 patent/US20080081199A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020025439A1 (en) * | 1999-01-26 | 2002-02-28 | Murata Manufacturing Co., Ltd. | Dielectric ceramic composition and multi layered ceramic substrate |
US20030000079A1 (en) * | 2001-06-29 | 2003-01-02 | Hideyuki Harada | Method for manufacturing multilayer ceramic substrates |
US20030100146A1 (en) * | 2001-11-22 | 2003-05-29 | Sumitomo Metal (Smi) Electronics Devices Inc. | Method of fabricating multilayer ceramic substrate |
US20050241128A1 (en) * | 2004-04-29 | 2005-11-03 | Berry Cynthia W | Method of laminating low temperature co-fired ceramic (LTCC) material and product formed thereby |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100073980A1 (en) * | 2008-09-23 | 2010-03-25 | Gm Global Technology Operations, Inc. | Power converter assembly with isolated gate drive circuit |
CN114025516A (en) * | 2021-11-19 | 2022-02-08 | 深圳玛斯兰电路科技实业发展有限公司 | Method for manufacturing high-frequency mixing plate |
CN115003045A (en) * | 2022-05-30 | 2022-09-02 | 青岛理工大学 | Method for manufacturing micro-nano 3D printing high-precision ceramic-based circuit based on electric field driving jet deposition |
Also Published As
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TW200815309A (en) | 2008-04-01 |
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