US20080078202A1 - Heat dissipating system and method - Google Patents

Heat dissipating system and method Download PDF

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Publication number
US20080078202A1
US20080078202A1 US11/798,434 US79843407A US2008078202A1 US 20080078202 A1 US20080078202 A1 US 20080078202A1 US 79843407 A US79843407 A US 79843407A US 2008078202 A1 US2008078202 A1 US 2008078202A1
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US
United States
Prior art keywords
condenser
heat
working fluid
cavity body
receiving part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/798,434
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English (en)
Inventor
Chin-Kuang Luo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of US20080078202A1 publication Critical patent/US20080078202A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to heat dissipation, more particularly to a heat dissipating system and method.
  • the aforementioned working fluid is water
  • the water will freeze when the system is used in a cold area with a temperature lower than 0° C., thereby rendering the system useless. Further, if there is water leakage in the system, circuitry in the heat source 2 and/or elements of the system itself may be destroyed.
  • the working fluid flows through the tubing unit to circulate from the condenser to the heat-absorbing unit by gravity and from the heat-absorbing unit to the condenser by natural convection.
  • the tubing unit forms a closed circulating loop with the heat-absorbing unit and the condenser.
  • a computer module comprises a housing, at least one chip disposed in the housing, a heat-absorbing unit, a condenser, and a tubing unit.
  • the heat-absorbing unit has at least one cavity body contacting the chip, and a working fluid received in the cavity body.
  • the condenser is disposed in the housing to condense the working fluid.
  • the tubing unit is connected fluidly to the condenser and the heat-absorbing unit.
  • the working fluid flows through the tubing unit to circulate from the condenser to the heat-absorbing unit by gravity and from the heat-absorbing unit to the condenser by natural convection.
  • the tubing unit forms a closed circulating loop with the heat-absorbing unit and the condenser.
  • FIG. 1 is a perspective view of a conventional liquid-cooling heat dissipating system disclosed in Taiwanese Publication No. M295424;
  • FIG. 2 is a perspective view of the first preferred embodiment of a heat dissipating system and method according to the present invention
  • FIG. 4 illustrates the first preferred embodiment installed in a computer module
  • FIG. 5 is a schematic side view of FIG. 4 ;
  • FIG. 7 is a schematic view of the second preferred embodiment of a heat dissipating system and method according to the present invention.
  • FIG. 8 is a schematic view of the third preferred embodiment of a heat dissipating system and method according to the present invention.
  • the condenser 4 is disposed in the upper chamber 31 of the computer module 3 , and includes a vapor-receiving part 411 formed on a top end thereof, an inlet 414 connected fluidly to the vapor-receiving part 411 , a liquid-receiving part 412 formed on a bottom end thereof, an outlet 415 connected fluidly to the liquid-receiving part 412 , a plurality of channels 413 connected between the vapor-receiving and liquid-receiving parts 411 , 412 , and a thermoelectric cooler 42 .
  • the thermoelectric cooler 42 is controlled through a circuit, and has a cold side 421 in contact with the liquid-receiving part 412 , and a hot side 422 opposite to the cold side 421 .
  • the cold side 421 has a cooling function so as to keep the liquid-receiving part 412 at a constant temperature.
  • the heat dissipating system of the present invention further comprises a heat sink 43 and a fan 44 .
  • the heat sink 43 is disposed adjacent to the condenser 4 , and has an L-shaped configuration.
  • the heat sink 43 includes a horizontal plate 431 having a contact portion 4311 in contact with the hot side 422 of the thermoelectric cooler 42 , a vertical plate 432 extending upwardly from an end periphery of the horizontal plate 431 and parallel to the condenser 4 , and a plurality of fins 433 provided on the vertical plate 432 .
  • the fan 44 is disposed proximate to the condenser 4 and the heat sink 43 , and directs a current of cold air toward the condenser 4 and the heat sink 43 , as best shown in FIG. 5 .
  • the tubing unit 6 includes first, second, third, and fourth tubes 61 , 62 , 63 , 64 .
  • the first tube 61 is connected to the outlet 415 of the condenser 4 and to the inlet 511 of the first cavity body 51 .
  • the second tube 62 is connected to the outlet 512 of the first cavity body 51 and to the inlet 521 of the second cavity body 52 .
  • the third tube 63 is connected to the outlet 522 of the second cavity body 52 and to the inlet 531 of the third cavity body 53 .
  • the fourth tube 64 is connected to the outlet 532 of the third cavity body 53 and to the inlet 414 of the condenser 4 .
  • the first to fourth tubes 61 , 62 , 63 , 64 , the condenser 4 , and the first to third cavity bodies 51 , 52 , 53 form a closed circulating loop, as best shown in FIG. 4 .
  • a working fluid 30 is injected into the system of the present invention after the first to fourth tubes 61 , 62 , 63 , 64 , the first to third cavity bodies 51 , 52 , 53 , and the condenser 4 are evacuated, so that the working fluid 30 circulates in a vacuum environment.
  • the working fluid 30 is a coolant that is in a liquid state at room temperature.
  • the working fluid 30 may be a super-thermal-conductive liquid.
  • step 71 the first, second, and third cavity bodies 51 , 52 , 53 are placed in contact with the respective chips 35 , which have the lowest, medium, and highest temperatures, respectively.
  • the working fluid 30 is in a liquid state and is in the first and second cavity bodies 51 , 52 .
  • the liquid-state working fluid 30 in the first and second cavity bodies 51 , 52 is vaporized.
  • the working fluid 30 in a vaporized state flows into the second cavity body 52 through the second tube 62 .
  • the number of tubes of the tubing unit 6 can be set according to the number of the module chips 35 . As such, the working fluid 30 can flow successively from the lowest- to the highest-temperature module chips 35 through the cavity bodies 51 , 52 , 53 .
  • step 75 the cooled condensed working fluid 30 in the liquid-receiving part 412 then flows back into the first cavity body 51 through the first tube 61 by gravity so as to repeat the aforementioned steps.
  • the working fluid 30 through the condenser 4 , the first to third cavity bodies 51 , 52 , 53 , and the first to fourth tubes 61 - 64 , heat is effectively dissipated.
  • the heat dissipating system and method according to the third preferred embodiment of the present invention is shown to be similar to the second preferred embodiment.
  • the heat-absorbing unit 5 includes five cavity bodies 54 connected in parallel to each other using the first and second manifolds 65 , 67 of the tubing unit 6 .
  • Each cavity body 54 is in contact with an electronic component 7 that can generate heat.
  • the arrangement of the tubing unit 6 is as illustrated in FIG. 8 .
  • the heat dissipating system and method of the present invention may also be applicable to dissipating heat of an engine or a machine of a car, or any other article that needs heat dissipation.
  • the working fluid 30 can undergo a self-circulating effect.
  • the system of the present invention not only utilizes simple components, and reduces cost and noise to a minimum, but also minimizes self-generated heat.
  • the working fluid 30 of the present invention while in a liquid state, can effectively absorb heat from the module chips 35 through heat conduction, and is then vaporized so as to exchange heat with the condenser 4 .
  • the present invention can also cooperate with the thermoelectric cooler 42 to control the temperature through an electric-controlled process, so that the condensed working fluid 30 can be maintained in a particular temperature range for any length of time, thereby ensuring a favorable heat dissipation effect.
  • the working fluid 30 of the present invention makes use of a coolant or a super-thermal-conductive liquid, so that no freezing of the working fluid 30 is likely to occur when the working fluid 30 is used at a temperature below 0° C. Hence, the heat dissipation process can be carried out smoothly. Further, even if there is a leak in the system, the working fluid 30 will turn immediately into vapor so as not to damage electronic circuitry and/or elements of the heat dissipating system.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US11/798,434 2006-09-28 2007-05-14 Heat dissipating system and method Abandoned US20080078202A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW095136005 2006-09-28
TW095136005A TW200815968A (en) 2006-09-28 2006-09-28 Phase change heat dissipation device and method

Publications (1)

Publication Number Publication Date
US20080078202A1 true US20080078202A1 (en) 2008-04-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
US11/798,434 Abandoned US20080078202A1 (en) 2006-09-28 2007-05-14 Heat dissipating system and method

Country Status (5)

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US (1) US20080078202A1 (ja)
JP (1) JP2008082694A (ja)
KR (1) KR20080029756A (ja)
BR (1) BRPI0702368A (ja)
TW (1) TW200815968A (ja)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070211428A1 (en) * 2006-03-08 2007-09-13 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US20070279861A1 (en) * 2006-06-05 2007-12-06 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
US20090154091A1 (en) * 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US20090244826A1 (en) * 2008-04-01 2009-10-01 Doll Wade J Airflow management apparatus for computer cabinets and associated methods
GB2462098A (en) * 2008-07-23 2010-01-27 Ryan James Mcglen Thermal management device comprising heat pipes
US20100097752A1 (en) * 2008-10-17 2010-04-22 Doll Wade J Airflow intake systems and associated methods for use with computer cabinets
US20100097751A1 (en) * 2008-10-17 2010-04-22 Doll Wade J Air conditioning systems for computer systems and associated methods
CN102097403A (zh) * 2010-11-25 2011-06-15 昆明理工大学 芯片热沉及带芯片热沉的芯片冷却装置
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
CN104329828A (zh) * 2014-03-28 2015-02-04 海尔集团公司 半导体制冷冰箱及其热端换热装置
WO2016069354A1 (en) * 2014-10-27 2016-05-06 Ebullient, Llc Heat exchanger with helical passageways
US20160325657A1 (en) * 2013-12-31 2016-11-10 Gentherm Automotive Systems (China) Ltd. Ventilation system
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US9891002B2 (en) 2014-10-27 2018-02-13 Ebullient, Llc Heat exchanger with interconnected fluid transfer members
CN108644731A (zh) * 2018-05-14 2018-10-12 安徽卡澜特车灯科技有限公司 一种双光灯具散热装置
EP3421918A1 (en) * 2017-06-30 2019-01-02 General Electric Company A heat dissipation system and an associated method thereof
US10391831B2 (en) * 2015-07-23 2019-08-27 Hyundai Motor Company Combined heat exchanger module
US10451355B2 (en) * 2016-05-27 2019-10-22 Asia Vital Components Co., Ltd. Heat dissipation element
CN112954965A (zh) * 2021-02-01 2021-06-11 中国科学院电工研究所 用于高性能计算机的模块化冷却***
US11906218B2 (en) 2014-10-27 2024-02-20 Ebullient, Inc. Redundant heat sink module

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411390B (zh) * 2010-07-26 2013-10-01 I-Ming Lin 串聯型連續降溫及升溫裝置
CN102917570A (zh) * 2011-08-05 2013-02-06 仪信股份有限公司 液态冷却***
KR102228042B1 (ko) * 2019-03-22 2021-03-15 주식회사 에이프로템 열전소자를 이용한 다지점 접촉형 냉각 및 가열 장치
CN117293104B (zh) * 2023-11-27 2024-03-22 贵州芯际探索科技有限公司 一种sic器件散热封装结构及封装方法

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US6845622B2 (en) * 2003-03-27 2005-01-25 Intel Corporation Phase-change refrigeration apparatus with thermoelectric cooling element and methods
US6853554B2 (en) * 2001-02-22 2005-02-08 Hewlett-Packard Development Company, L.P. Thermal connection layer

Patent Citations (2)

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US6853554B2 (en) * 2001-02-22 2005-02-08 Hewlett-Packard Development Company, L.P. Thermal connection layer
US6845622B2 (en) * 2003-03-27 2005-01-25 Intel Corporation Phase-change refrigeration apparatus with thermoelectric cooling element and methods

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070211428A1 (en) * 2006-03-08 2007-09-13 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US20070279861A1 (en) * 2006-06-05 2007-12-06 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
US20090154091A1 (en) * 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US9288935B2 (en) 2007-12-17 2016-03-15 Cray Inc. Cooling systems and heat exchangers for cooling computer components
US9596789B2 (en) 2007-12-17 2017-03-14 Cray Inc. Cooling systems and heat exchangers for cooling computer components
US8820395B2 (en) 2007-12-17 2014-09-02 Cray Inc. Cooling systems and heat exchangers for cooling computer components
US10082845B2 (en) 2007-12-17 2018-09-25 Cray, Inc. Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US9420729B2 (en) 2008-02-11 2016-08-16 Cray Inc. Systems and associated methods for controllably cooling computer components
US10588246B2 (en) 2008-02-11 2020-03-10 Cray, Inc. Systems and associated methods for controllably cooling computer components
US20090244826A1 (en) * 2008-04-01 2009-10-01 Doll Wade J Airflow management apparatus for computer cabinets and associated methods
US7898799B2 (en) 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
GB2462098A (en) * 2008-07-23 2010-01-27 Ryan James Mcglen Thermal management device comprising heat pipes
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US7903403B2 (en) 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8537539B2 (en) 2008-10-17 2013-09-17 Cray Inc. Air conditioning systems for computer systems and associated methods
US20100097751A1 (en) * 2008-10-17 2010-04-22 Doll Wade J Air conditioning systems for computer systems and associated methods
US20100097752A1 (en) * 2008-10-17 2010-04-22 Doll Wade J Airflow intake systems and associated methods for use with computer cabinets
US9310856B2 (en) 2010-04-20 2016-04-12 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
CN102097403A (zh) * 2010-11-25 2011-06-15 昆明理工大学 芯片热沉及带芯片热沉的芯片冷却装置
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
US20160325657A1 (en) * 2013-12-31 2016-11-10 Gentherm Automotive Systems (China) Ltd. Ventilation system
CN104329828A (zh) * 2014-03-28 2015-02-04 海尔集团公司 半导体制冷冰箱及其热端换热装置
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US9891002B2 (en) 2014-10-27 2018-02-13 Ebullient, Llc Heat exchanger with interconnected fluid transfer members
US11906218B2 (en) 2014-10-27 2024-02-20 Ebullient, Inc. Redundant heat sink module
WO2016069354A1 (en) * 2014-10-27 2016-05-06 Ebullient, Llc Heat exchanger with helical passageways
US11167618B2 (en) * 2015-07-23 2021-11-09 Hyundai Motor Company Combined heat exchanger module
US10391831B2 (en) * 2015-07-23 2019-08-27 Hyundai Motor Company Combined heat exchanger module
US10451355B2 (en) * 2016-05-27 2019-10-22 Asia Vital Components Co., Ltd. Heat dissipation element
EP3421918A1 (en) * 2017-06-30 2019-01-02 General Electric Company A heat dissipation system and an associated method thereof
US11252847B2 (en) 2017-06-30 2022-02-15 General Electric Company Heat dissipation system and an associated method thereof
US11997839B2 (en) 2017-06-30 2024-05-28 Ge Grid Solutions Llc Heat dissipation system and an associated method thereof
CN108644731A (zh) * 2018-05-14 2018-10-12 安徽卡澜特车灯科技有限公司 一种双光灯具散热装置
CN112954965A (zh) * 2021-02-01 2021-06-11 中国科学院电工研究所 用于高性能计算机的模块化冷却***

Also Published As

Publication number Publication date
JP2008082694A (ja) 2008-04-10
TW200815968A (en) 2008-04-01
KR20080029756A (ko) 2008-04-03
BRPI0702368A (pt) 2008-05-13

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