US20070151896A1 - Packing member for packing wafer container - Google Patents

Packing member for packing wafer container Download PDF

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Publication number
US20070151896A1
US20070151896A1 US11/324,321 US32432106A US2007151896A1 US 20070151896 A1 US20070151896 A1 US 20070151896A1 US 32432106 A US32432106 A US 32432106A US 2007151896 A1 US2007151896 A1 US 2007151896A1
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US
United States
Prior art keywords
packing member
packing
receiving space
wafer container
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/324,321
Inventor
Sheng-Feng Lu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VisEra Technologies Co Ltd
Original Assignee
VisEra Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VisEra Technologies Co Ltd filed Critical VisEra Technologies Co Ltd
Priority to US11/324,321 priority Critical patent/US20070151896A1/en
Assigned to VISERA TECHNOLOGIES, COMPANY LTD. reassignment VISERA TECHNOLOGIES, COMPANY LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LU, SHENG-FENG
Publication of US20070151896A1 publication Critical patent/US20070151896A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Definitions

  • the present invention relates to packing members and more particularly, to such a packing member, which is practical for use to pack a wafer container in a carton for transportation that effectively protects storage wafers against impact and vibrations.
  • wafer cassettes and wafer containers are commonly used for carrying wafers.
  • a wafer cassette or wafer container can hold multiple pieces of wafers at a time, keeping storage wafers in a clean environment for transportation.
  • wafers may crack or be contaminated by particles in the external environment easily. Using wafer containers to carry wafers are safer.
  • packing members of foamed polystyrene are commonly used to pack the wafer container in a carton so that the wafer container is protected against impact and vibrations.
  • the storage wafers may crack easily during transportation.
  • the present invention has been accomplished under the circumstances in view. It is therefore the main object of the present invention to provide a packing member for packing a wafer container in a carton for transportation, which well protects the wafer container against impact and vibrations, preventing damage to wafers of any different sizes stored in the wafer container.
  • the packing member comprises a frame having a receiving space, at least one recess disposed at an outer side thereof opposite to the receiving space, and a plurality of retaining portions respectively extending from an inner side surrounding the receiving chamber and projecting into the receiving space.
  • a plurality of support elements respectively are disposed at the frame in a manner that the support elements respectively protrude over at least one of top and bottom surfaces of the frame.
  • FIG. 1 is a front view of a packing member according to a preferred embodiment of the present invention.
  • FIG. 2 is a top view of the packing member according to the preferred embodiment of the present invention.
  • FIG. 3 is a side view of the packing member according to the preferred embodiment of the present invention.
  • FIG. 4 is a schematic drawing, showing a wafer container packed in between two abutted packing members.
  • FIG. 5 is a sectional view taken along line 5 - 5 of FIG. 4 .
  • a packing member in accordance with the preferred embodiment of the present invention is directly molded from anti-static expanded polyethylene (EPE) foam, comprising a rectangular open frame 11 , a plurality of retaining portions 21 , and a plurality of support elements 31 .
  • EPE anti-static expanded polyethylene
  • the rectangular open frame 11 has two opposite long sides 12 and two opposite short sides 13 connected between the two opposite long sides 12 and defining with the two opposite long sides 12 a receiving space 14 .
  • Each long side 12 has a recess 15 on the middle.
  • the recess 15 is recessed in a direction from the outer surface of the respective long side 12 toward the inner surface thereof at a predetermined distance.
  • Each long side 12 further has a column 16 at the bottom side corresponding to the respective recess 15 .
  • Two connecting bars 17 are connected between the two short sides 13 .
  • Each connecting bar 17 has six support rods 18 at the bottom side.
  • the retaining portions 21 are tapered rod members respectively formed integral with the inner surfaces of the long sides 12 and the short sides 13 and projecting from the inner surfaces of the long sides 12 and the short side 13 into the receiving space 14 .
  • the support elements 31 are rectangular posts respectively disposed at the connection areas between the long sides 12 and the short sides 13 and vertically extending over the top and bottom surfaces of the long sides 12 and the short sides 13 .
  • two packing members of the present invention are abutted against each other to hold the wafer container 41 in the receiving space 14 of each packing member, keeping the peripheral walls 42 of the wafer container 41 stopped against the retaining portions 21 and the top and bottom walls 43 , 44 of the wafer container 41 stopped against the connecting bars 17 .
  • the two packing members with the wafer container 41 are put in a carton 51 to have the outer surfaces of the long sides 12 and short sides 13 of the rectangular open frame 11 , the support elements 31 and the support rods 18 respectively stopped against the inside wall of the carton 51 .
  • the packing members and the carton 51 are kept in contact at specific points. Further, the recesses 15 at each long side 12 provide the same contact effect. Further more, because the retaining portions 21 are respectively projecting from the inner surfaces of the long sides 12 and short sides 13 of the rectangular open frame 11 and stopped against the wafer container 41 , the packing members and the wafer container 41 are kept in contact at specific points. Therefore, the water container 41 is supported on the inside wall of the carton 51 at specific points by means of the two packing members, and the two packing members well support the wafer container 41 against any impact or vibrations during transportation. Therefore, the packing members effectively lessen transmission of vibrating force from the carton 51 to the wafer container 51 during transportation. According to actual dropping and vibration tests, wafers of different sizes (including 11 mil thickness wafers) are kept intact in the wafer container.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

A packing member for packing a wafer container in a carton for transportation includes a rectangular frame which has a receiving space, at least one recess disposed at an outer side thereof opposite to the receiving space, and retaining portions respectively projecting from an inner side of the rectangular frame into the receiving space, and support elements respectively protruding over the top and bottom surfaces of the rectangular frame.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to packing members and more particularly, to such a packing member, which is practical for use to pack a wafer container in a carton for transportation that effectively protects storage wafers against impact and vibrations.
  • 2. Description of the Related Art
  • In semiconductor industry, wafer cassettes and wafer containers (carriers) are commonly used for carrying wafers. A wafer cassette or wafer container can hold multiple pieces of wafers at a time, keeping storage wafers in a clean environment for transportation. However, when loading wafers in a wafer cassette, wafers may crack or be contaminated by particles in the external environment easily. Using wafer containers to carry wafers are safer.
  • When transporting wafers in a wafer container, packing members of foamed polystyrene are commonly used to pack the wafer container in a carton so that the wafer container is protected against impact and vibrations. However, if wafers of thickness below 15 mil are carried in a wafer container for transportation, the storage wafers may crack easily during transportation.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished under the circumstances in view. It is therefore the main object of the present invention to provide a packing member for packing a wafer container in a carton for transportation, which well protects the wafer container against impact and vibrations, preventing damage to wafers of any different sizes stored in the wafer container.
  • To achieve this object of the present invention, the packing member comprises a frame having a receiving space, at least one recess disposed at an outer side thereof opposite to the receiving space, and a plurality of retaining portions respectively extending from an inner side surrounding the receiving chamber and projecting into the receiving space. A plurality of support elements respectively are disposed at the frame in a manner that the support elements respectively protrude over at least one of top and bottom surfaces of the frame.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a front view of a packing member according to a preferred embodiment of the present invention.
  • FIG. 2 is a top view of the packing member according to the preferred embodiment of the present invention.
  • FIG. 3 is a side view of the packing member according to the preferred embodiment of the present invention.
  • FIG. 4 is a schematic drawing, showing a wafer container packed in between two abutted packing members.
  • FIG. 5 is a sectional view taken along line 5-5 of FIG. 4.
    • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 1-3, a packing member in accordance with the preferred embodiment of the present invention is directly molded from anti-static expanded polyethylene (EPE) foam, comprising a rectangular open frame 11, a plurality of retaining portions 21, and a plurality of support elements 31.
  • The rectangular open frame 11 has two opposite long sides 12 and two opposite short sides 13 connected between the two opposite long sides 12 and defining with the two opposite long sides 12 a receiving space 14. Each long side 12 has a recess 15 on the middle. The recess 15 is recessed in a direction from the outer surface of the respective long side 12 toward the inner surface thereof at a predetermined distance. Each long side 12 further has a column 16 at the bottom side corresponding to the respective recess 15. Two connecting bars 17 are connected between the two short sides 13. Each connecting bar 17 has six support rods 18 at the bottom side.
  • The retaining portions 21 are tapered rod members respectively formed integral with the inner surfaces of the long sides 12 and the short sides 13 and projecting from the inner surfaces of the long sides 12 and the short side 13 into the receiving space 14. The support elements 31 are rectangular posts respectively disposed at the connection areas between the long sides 12 and the short sides 13 and vertically extending over the top and bottom surfaces of the long sides 12 and the short sides 13.
  • Referring to FIGS. 4 and 5, when packing a wafer container 41, two packing members of the present invention are abutted against each other to hold the wafer container 41 in the receiving space 14 of each packing member, keeping the peripheral walls 42 of the wafer container 41 stopped against the retaining portions 21 and the top and bottom walls 43, 44 of the wafer container 41 stopped against the connecting bars 17. Thereafter, the two packing members with the wafer container 41 are put in a carton 51 to have the outer surfaces of the long sides 12 and short sides 13 of the rectangular open frame 11, the support elements 31 and the support rods 18 respectively stopped against the inside wall of the carton 51.
  • Because the support elements 31 and the support rods 18 protrude over the top and bottom surfaces of the rectangular open frame 11 and stopped against the inside wall of the carton 51, the packing members and the carton 51 are kept in contact at specific points. Further, the recesses 15 at each long side 12 provide the same contact effect. Further more, because the retaining portions 21 are respectively projecting from the inner surfaces of the long sides 12 and short sides 13 of the rectangular open frame 11 and stopped against the wafer container 41, the packing members and the wafer container 41 are kept in contact at specific points. Therefore, the water container 41 is supported on the inside wall of the carton 51 at specific points by means of the two packing members, and the two packing members well support the wafer container 41 against any impact or vibrations during transportation. Therefore, the packing members effectively lessen transmission of vibrating force from the carton 51 to the wafer container 51 during transportation. According to actual dropping and vibration tests, wafers of different sizes (including 11 mil thickness wafers) are kept intact in the wafer container.
  • Although a particular embodiment of the invention has been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.

Claims (7)

1. A packing member for packing wafer container, said packing member comprising:
a frame having a receiving space, at least one recess disposed at an outer side opposite to said receiving space, and a plurality of retaining portions respectively extending from an inner side facing said receiving chamber and projecting into said receiving space; and
a plurality of support elements disposed respectively at said frame in a manner that said support elements protrude over at least one of top and bottom surfaces of said frame.
2. The packing member as claimed in claim 1, which is molded from anti-static expanded polyethylene foam.
3. The packing member as claimed in claim 1, wherein said frame is a rectangular frame having two opposite long sides and two opposite short sides that define said receiving space.
4. The packing member as claimed in claim 3, wherein said at least one recess is respectively formed on an outer surface of each of said long side.
5. The packing member as claimed in claim 3, wherein said retaining portions are respectively formed integral with an inner surface of each of said long sides and said short sides.
6. The packing member as claimed in claim 3, further comprising two connecting bars respectively connected between said two opposite short sides, said connecting bars each having at least one support rod at a bottom side thereof.
7. The packing member as claimed in claim 3, wherein said two opposite long sides each have a column at a bottom side thereof corresponding to one of said at least one recess.
US11/324,321 2006-01-04 2006-01-04 Packing member for packing wafer container Abandoned US20070151896A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/324,321 US20070151896A1 (en) 2006-01-04 2006-01-04 Packing member for packing wafer container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/324,321 US20070151896A1 (en) 2006-01-04 2006-01-04 Packing member for packing wafer container

Publications (1)

Publication Number Publication Date
US20070151896A1 true US20070151896A1 (en) 2007-07-05

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US11/324,321 Abandoned US20070151896A1 (en) 2006-01-04 2006-01-04 Packing member for packing wafer container

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010005202B4 (en) * 2010-01-21 2020-04-09 Q-Cells Se Magazine for a photovoltaic wafer and / or cell stack with a magazine insert for receiving the same
WO2023127332A1 (en) * 2021-12-28 2023-07-06 株式会社Sumco Cushioning material, packing body, and packing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366080A (en) * 1993-10-21 1994-11-22 Seagate Technology, Inc. Molded ridge tolerance compensator
US5706951A (en) * 1994-05-11 1998-01-13 Shin-Etsu Handotai Co., Ltd. Packing structure for container for semiconductor wafer and packing method for container
US6588595B2 (en) * 2000-09-15 2003-07-08 Maxtor Corporation Anti-motor fret package for multiple disk drives
US6705469B2 (en) * 2001-10-31 2004-03-16 Xerox Corporation One-piece foldable protective shipping container/insert
US20040226851A1 (en) * 2003-05-13 2004-11-18 Dell Products L.P. Reinforced packaging system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366080A (en) * 1993-10-21 1994-11-22 Seagate Technology, Inc. Molded ridge tolerance compensator
US5706951A (en) * 1994-05-11 1998-01-13 Shin-Etsu Handotai Co., Ltd. Packing structure for container for semiconductor wafer and packing method for container
US6588595B2 (en) * 2000-09-15 2003-07-08 Maxtor Corporation Anti-motor fret package for multiple disk drives
US6705469B2 (en) * 2001-10-31 2004-03-16 Xerox Corporation One-piece foldable protective shipping container/insert
US20040226851A1 (en) * 2003-05-13 2004-11-18 Dell Products L.P. Reinforced packaging system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010005202B4 (en) * 2010-01-21 2020-04-09 Q-Cells Se Magazine for a photovoltaic wafer and / or cell stack with a magazine insert for receiving the same
WO2023127332A1 (en) * 2021-12-28 2023-07-06 株式会社Sumco Cushioning material, packing body, and packing method

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Legal Events

Date Code Title Description
AS Assignment

Owner name: VISERA TECHNOLOGIES, COMPANY LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LU, SHENG-FENG;REEL/FRAME:017437/0840

Effective date: 20051219

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION