US20050284611A1 - Cooling device for electric circuit - Google Patents
Cooling device for electric circuit Download PDFInfo
- Publication number
- US20050284611A1 US20050284611A1 US11/146,434 US14643405A US2005284611A1 US 20050284611 A1 US20050284611 A1 US 20050284611A1 US 14643405 A US14643405 A US 14643405A US 2005284611 A1 US2005284611 A1 US 2005284611A1
- Authority
- US
- United States
- Prior art keywords
- bores
- cooling assembly
- pair
- angled
- shaped channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to cooling devices. More specifically, the present invention is concerned with a cooling device to which an electric circuit is to be mounted.
- Cooling devices are well known in the art of electric circuits. They are usually designed to collect heat generated by one or more electronic components and dissipate this collected heat away from the electronic components to thereby improve their performance or, in some cases, allow them to function properly.
- Fluids are often used to collect the heat and to transfer it from the vicinity of the electronic components to the vicinity of the dissipating element.
- An object of the present invention is therefore to provide a cooling device for an electric circuit.
- a cooling assembly for an electric circuit; said cooling assembly comprising a generally planar body including an electric circuit receiving surface, a front edge and a rear edge; said body being provided with a cooling circuit having:
- a cooling assembly for an electric circuit; said cooling assembly comprising a generally planar body including an electric circuit receiving surface and a front edge provided with at least two pair of bores each defining V-shaped channels; said cooling assembly further comprises plugs so inserted into said bores as to close intersections of said V-shaped channels, an inlet and an outlet.
- FIG. 1 is a perspective view of a cooling device according to a first embodiment of the present invention
- FIG. 2 is a top sectional view of the cooling device of FIG. 1 ;
- FIG. 3 is an enlargement of a portion of FIG. 2 , illustrating two bores interconnected by a plug;
- FIG. 4 is a top sectional view of a cooling device according to a second embodiment of the present invention.
- FIG. 5 is a top sectional view of a cooling device according to a third embodiment of the present invention.
- FIG. 6 is a top sectional view of a cooling device according to a third embodiment of the present invention.
- FIG. 7 is an enlargement of a portion of FIG. 6 , illustrating two bores interconnected by a plug.
- the present invention proposes to use a cooling body having a circuit receiving surface and provided with a plurality of bores that interconnect to form a cooling circuit having an inlet and an outlet provided on edges of the cooling body.
- the interconnection between the various bores is done via the crossing of bores or via plugs that close selected bores and that are provided on the edges of the body.
- FIG. 1 of the appended drawings is a perspective view illustrating a cooling device 10 according to a first non-restrictive embodiment of the present invention.
- the cooling device 10 includes a generally planar cooling body 12 having a circuit receiving surface 14 .
- An electric circuit (not shown) may be mounted to the surface 14 via fasteners (not shown).
- the cooling body 12 is made of a single piece of heat conductive material, such as for example aluminum, that may be machined or otherwise formed into the desired shape.
- the cooling body 12 is formed with a plurality of V-shaped channels each defined by a straight bore 16 and an angled bore 18 ; one transversal bore 20 ; an inlet 22 and an outlet 24 .
- the straight bores 16 being aligned with an axis of the body 12 .
- the straight and angled bores 16 and 18 are made from the front edge 26 of the cooling body 12 , for example by a drilling process, to yield the V-shaped channels.
- the straight bores 16 are equally distanced and go from the front edge 26 almost to the rear edge 28 .
- the main function of the angled bores 18 is to interconnect the bottom of one straight bore 16 to the opening of an adjacent straight bore 16 .
- the angle of the angle bores 18 is therefore dictated by the length of the straight bore 16 and by the distance separating two adjacent straight bores 16 .
- a straight hole 30 is made at the junction of the opening of the straight and angled bores.
- These straight holes 30 are so configured and sized as to receive a deformable plug 32 therein.
- a deformable plug 32 is also inserted in the opening of the transversal bore 20 to properly close it.
- Deformable plugs are well known in the art and will not be described in detail herein.
- the Betapl UG manufactured by the Lee Company, Westbrook, Conn., USA has been found an adequate plug 32 .
- the dimensions of the straight holes 30 are advantageously in accord with the maker's directives.
- a cooling circuit is formed. This cooling circuit extends from the inlet 22 to the outlet 24 as can be visualized by the arrows 34 .
- connectors are mounted to the inlet 22 and outlet 24 to allow connection to a cooling fluid source (not shown).
- the manufacture of the cooling device 10 is simple.
- the main steps are the formation of the body 12 having the required dimensions; the drilling of the straight, angled and transversal bores 16 , 18 and 20 (by using a drill-press, for example); the drilling of the straight holes 30 (by using a drill-press, for example); the insertion of the deformable plugs 32 in the straight holes 30 ; the deformation of the deformable plugs 32 to seal the holes 30 ; and the installation of the connectors (not shown) to the inlet and outlet 22 and 24 .
- the insertion of the plugs 32 in the holes 30 may require the tapering of the holes 30 .
- the instructions of the plug manufacturer should be followed to insure a fluid tight closing of the holes 30 .
- the body of the cooling assembly is shown herein as having a generally rectangular circuit receiving surface 14 , other surface shapes could be used, depending on the application.
- the deformable plugs 32 are all positioned on the surface of the body 12 . Indeed, should a leak occur, it would be easy to notice and to repair.
- FIG. 4 of the appended drawings a cooling device 100 according to a second illustrative embodiment of the present invention will be described. It is to be noted that since the cooling device 100 is very similar to the cooling device 10 described hereinabove with reference to FIGS. 1 to 3 , only the main differences between these cooling devices will be described hereinbelow.
- the main difference between the cooling device 100 and the cooling device 10 is that the all the plugged bores of the cooling device 100 are provided on the front edge 102 thereof. To obtain this configuration, one of the V-shaped channels is inverted with respect to the others.
- this configuration yields a portion that is less cooled than the rest of the device 100 (see dotted portion 104 ).
- This portion 104 may be positioned anywhere on the cooling device 100 during the design, depending on the position of the heat generating components (not shown) of the electric circuit (not shown).
- FIG. 5 of the appended drawings a cooling device 200 according to a third illustrative embodiment of the present invention will be described. It is to be noted that since the cooling device 200 is very similar to the cooling device 10 described hereinabove with reference to FIGS. 1 to 3 , only the main differences between these cooling devices will be described hereinbelow.
- the cooling device 200 includes only angled bores 202 that are provided between the front edge 204 and the rear edge 206 of the body 208 . Accordingly, plugs are used on both the front and rear edges 204 and 206 to form the cooling circuit.
- the cooling device 300 has two features that are concerned with improving the flow of fluid from the inlet 302 to the outlet 304 .
- the first feature improving the flow is the removal of the pointed junction between adjacent angled bores 306 . These pointed junctions are machined once the angled bores 306 and straight holes 308 are done. The machining takes place through the straight holes 308 . As can be seen from FIG. 6 , this feature allows the cooling fluid to flow with less restriction (see arrows 310 ).
- the second feature improving the fluid flow is the concave shape of the bottom 312 of the plug 314 . Indeed, this concave bottom 312 helps reduce the turbulence of the cooling fluid (see arrow 316 ), thereby improving the flow of cooling fluid.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A cooling device to which an electric circuit may be mounted includes a cooling body provided with a front edge having bores forming V-shaped channels inside the body. Intersecting V-shaped channels are closed by plugs to thereby define a continuous cooling circuit inside the cooling body.
Description
- The present invention relates to cooling devices. More specifically, the present invention is concerned with a cooling device to which an electric circuit is to be mounted.
- Cooling devices are well known in the art of electric circuits. They are usually designed to collect heat generated by one or more electronic components and dissipate this collected heat away from the electronic components to thereby improve their performance or, in some cases, allow them to function properly.
- Fluids are often used to collect the heat and to transfer it from the vicinity of the electronic components to the vicinity of the dissipating element.
- An object of the present invention is therefore to provide a cooling device for an electric circuit.
- More specifically, in accordance with the present invention, there is provided a cooling assembly for an electric circuit; said cooling assembly comprising a generally planar body including an electric circuit receiving surface, a front edge and a rear edge; said body being provided with a cooling circuit having:
-
- an inlet;
- an outlet;
- at least two pair of bores provided on said edge; each pair of bores being so configured and sized as to define a V-shaped channel; said bores being so distanced on said edge that each said V-shaped channel intersects with at least one adjacent V-shaped channel; intersections of said V-shaped channels being closed via plugs; one of said at least two pair of bores being associated with said inlet and another of said at least two pair of bores being associated with said outlet.
- According to another aspect of the present invention, there is provided a cooling assembly for an electric circuit; said cooling assembly comprising a generally planar body including an electric circuit receiving surface and a front edge provided with at least two pair of bores each defining V-shaped channels; said cooling assembly further comprises plugs so inserted into said bores as to close intersections of said V-shaped channels, an inlet and an outlet.
- Other objects, advantages and features of the present invention will become more apparent upon reading of the following non-restrictive description of preferred embodiments thereof, given by way of example only with reference to the accompanying drawings.
- In the appended drawings:
-
FIG. 1 is a perspective view of a cooling device according to a first embodiment of the present invention; -
FIG. 2 is a top sectional view of the cooling device ofFIG. 1 ; -
FIG. 3 is an enlargement of a portion ofFIG. 2 , illustrating two bores interconnected by a plug; -
FIG. 4 is a top sectional view of a cooling device according to a second embodiment of the present invention; -
FIG. 5 is a top sectional view of a cooling device according to a third embodiment of the present invention; -
FIG. 6 is a top sectional view of a cooling device according to a third embodiment of the present invention; and -
FIG. 7 is an enlargement of a portion ofFIG. 6 , illustrating two bores interconnected by a plug. - Generally stated, the present invention proposes to use a cooling body having a circuit receiving surface and provided with a plurality of bores that interconnect to form a cooling circuit having an inlet and an outlet provided on edges of the cooling body. The interconnection between the various bores is done via the crossing of bores or via plugs that close selected bores and that are provided on the edges of the body.
-
FIG. 1 of the appended drawings is a perspective view illustrating acooling device 10 according to a first non-restrictive embodiment of the present invention. - The
cooling device 10 includes a generallyplanar cooling body 12 having acircuit receiving surface 14. An electric circuit (not shown) may be mounted to thesurface 14 via fasteners (not shown). - The
cooling body 12 is made of a single piece of heat conductive material, such as for example aluminum, that may be machined or otherwise formed into the desired shape. - As can be seen in
FIG. 2 , thecooling body 12 is formed with a plurality of V-shaped channels each defined by astraight bore 16 and anangled bore 18; onetransversal bore 20; aninlet 22 and anoutlet 24. Thestraight bores 16 being aligned with an axis of thebody 12. - The straight and
angled bores front edge 26 of thecooling body 12, for example by a drilling process, to yield the V-shaped channels. - The
straight bores 16 are equally distanced and go from thefront edge 26 almost to therear edge 28. The main function of theangled bores 18 is to interconnect the bottom of onestraight bore 16 to the opening of an adjacentstraight bore 16. The angle of theangle bores 18 is therefore dictated by the length of thestraight bore 16 and by the distance separating two adjacentstraight bores 16. - To make a cooling circuit having an
inlet 22 and anoutlet 24, the interconnections between adjacent V-shaped channels must be closed. - As can be better seen from
FIG. 3 , to close these interconnections, astraight hole 30 is made at the junction of the opening of the straight and angled bores. - These
straight holes 30 are so configured and sized as to receive adeformable plug 32 therein. - A
deformable plug 32 is also inserted in the opening of thetransversal bore 20 to properly close it. - Deformable plugs are well known in the art and will not be described in detail herein. For example, the Betapl UG manufactured by the Lee Company, Westbrook, Conn., USA, has been found an
adequate plug 32. Of course, the dimensions of thestraight holes 30 are advantageously in accord with the maker's directives. - Once the
plugs 32 are inserted and deformed in theholes 30, a cooling circuit is formed. This cooling circuit extends from theinlet 22 to theoutlet 24 as can be visualized by thearrows 34. Of course, connectors (not shown) are mounted to theinlet 22 andoutlet 24 to allow connection to a cooling fluid source (not shown). - One skilled in the art will understand that the manufacture of the
cooling device 10 is simple. The main steps are the formation of thebody 12 having the required dimensions; the drilling of the straight, angled andtransversal bores deformable plugs 32 in thestraight holes 30; the deformation of thedeformable plugs 32 to seal theholes 30; and the installation of the connectors (not shown) to the inlet andoutlet - It is to be noted that the insertion of the
plugs 32 in theholes 30 may require the tapering of theholes 30. Of course, the instructions of the plug manufacturer should be followed to insure a fluid tight closing of theholes 30. - It is to be noted that while the body of the cooling assembly is shown herein as having a generally rectangular
circuit receiving surface 14, other surface shapes could be used, depending on the application. - One of the many advantages of the
cooling device 10 is that thedeformable plugs 32 are all positioned on the surface of thebody 12. Indeed, should a leak occur, it would be easy to notice and to repair. - Turning now to
FIG. 4 of the appended drawings, acooling device 100 according to a second illustrative embodiment of the present invention will be described. It is to be noted that since thecooling device 100 is very similar to thecooling device 10 described hereinabove with reference to FIGS. 1 to 3, only the main differences between these cooling devices will be described hereinbelow. - Generally stated, the main difference between the
cooling device 100 and thecooling device 10 is that the all the plugged bores of thecooling device 100 are provided on thefront edge 102 thereof. To obtain this configuration, one of the V-shaped channels is inverted with respect to the others. - As will easily be understood by one skilled in the art, this configuration yields a portion that is less cooled than the rest of the device 100 (see dotted portion 104). This
portion 104 may be positioned anywhere on thecooling device 100 during the design, depending on the position of the heat generating components (not shown) of the electric circuit (not shown). - Turning now to
FIG. 5 of the appended drawings, acooling device 200 according to a third illustrative embodiment of the present invention will be described. It is to be noted that since thecooling device 200 is very similar to thecooling device 10 described hereinabove with reference to FIGS. 1 to 3, only the main differences between these cooling devices will be described hereinbelow. - Generally stated, the
cooling device 200 includes onlyangled bores 202 that are provided between thefront edge 204 and therear edge 206 of thebody 208. Accordingly, plugs are used on both the front andrear edges - Finally, turning to
FIGS. 6 and 7 of the appended drawings, acooling device 300 according to a third embodiment of the present invention will be described. Thecooling device 300 is very similar to the cooling device of 200 ofFIG. 5 . Accordingly, for concision purposes, only the differences between these cooling devices will be described herein. - The
cooling device 300 has two features that are concerned with improving the flow of fluid from theinlet 302 to theoutlet 304. The first feature improving the flow is the removal of the pointed junction between adjacent angled bores 306. These pointed junctions are machined once theangled bores 306 andstraight holes 308 are done. The machining takes place through thestraight holes 308. As can be seen fromFIG. 6 , this feature allows the cooling fluid to flow with less restriction (see arrows 310). - Turning now to
FIG. 7 , the second feature improving the fluid flow is the concave shape of the bottom 312 of theplug 314. Indeed, thisconcave bottom 312 helps reduce the turbulence of the cooling fluid (see arrow 316), thereby improving the flow of cooling fluid. - Although the present invention has been described hereinabove by way of preferred embodiments thereof, it can be modified, without departing from the spirit and nature of the subject invention as defined in the appended claims.
Claims (20)
1. A cooling assembly for an electric circuit; said cooling assembly comprising a generally planar body including an electric circuit receiving surface, a front edge and a rear edge; said body being provided with a cooling circuit having:
an inlet;
an outlet;
at least two pair of bores provided on said edge; each pair of bores being so configured and sized as to define a V-shaped channel; said bores being so distanced on said edge that each said V-shaped channel intersects with at least one adjacent V-shaped channel; intersections of said V-shaped channels being closed via plugs; one of said at least two pair of bores being associated with said inlet and another of said at least two pair of bores being associated with said outlet.
2. The cooling assembly of claim 1 , wherein each said at least two pair of bores include a straight bore and an angled bored so angled with respect to an axis of said body and so distanced from one another as to define said V-shaped channel.
3. The cooling assembly of claim 2 , wherein said straight bores and said angled bores alternate.
4. The cooling assembly of claim 3 , wherein said body further includes a U-shaped channel defined by two consecutive straight bores and a transversal bore done in a side edge of the body.
5. The cooling assembly of claim 1 , wherein each said at least two pair of bores include a first angled bore and a second angled bored so angled with respect to an axis of said body and so distanced as to define said V-shaped channel.
6. The cooling assembly of claim 1 , wherein said plugs used to close intersecting V-shaped channels are deformable plugs.
7. The cooling assembly of claim 1 , wherein each said bore reach said rear edge of said body; each said pair or bores including a plug provided on said rear edge of said body to close said bores and define the V-shaped channel.
8. The cooling assembly of claim 5 , wherein each said bore reach said rear edge of said body; each said pair or bores including a plug provided on said rear edge of said body to close said bores and define the V-shaped channel.
9. The cooling assembly of claim 8 , wherein a pointed junction of each of said pair of angled bores is removed.
10. The cooling assembly of claim 1 , wherein said body is made of aluminum.
11. A cooling assembly for an electric circuit; said cooling assembly comprising a generally planar body including an electric circuit receiving surface and a front edge provided with at least two pair of bores each defining V-shaped channels; said cooling assembly further comprises plugs so inserted into said bores as to close intersections of said V-shaped channels, an inlet and an outlet.
12. The cooling assembly of claim 10 , wherein each said at least two pair of bores include a straight bore and an angled bored so angled with respect to an axis of said body and so distanced from one another as to define said V-shaped channel.
13. The cooling assembly of claim 12 , wherein said straight bores and said angled bores alternate.
14. The cooling assembly of claim 13 , wherein said body further includes a U-shaped channel defined by two consecutive straight bores and a transversal bore done in a side edge of the body.
15. The cooling assembly of claim 11 , wherein each said at least two pair of bores include a first angled bore and a second angled bored so angled with respect to an axis of said body and so distanced as to define said V-shaped channel.
16. The cooling assembly of claim 11 , wherein said plugs used to close intersecting V-shaped channels are deformable plugs.
17. The cooling assembly of claim 11 , wherein each said bore reach a rear edge of said body; each said pair or bores including a plug provided on said rear edge of said body to close said bores and define the V-shaped channel.
18. The cooling assembly of claim 11 , wherein said body is made of aluminum.
19. The cooling assembly of claim 15 , wherein each said bore reach said rear edge of said body; each said pair or bores including a plug provided on said rear edge of said body to close said bores and define the V-shaped channel.
20. The cooling assembly of claim 19 , wherein a pointed junction of each of said pair of angled bores is removed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/146,434 US20050284611A1 (en) | 2004-06-15 | 2005-06-06 | Cooling device for electric circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57925004P | 2004-06-15 | 2004-06-15 | |
US11/146,434 US20050284611A1 (en) | 2004-06-15 | 2005-06-06 | Cooling device for electric circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050284611A1 true US20050284611A1 (en) | 2005-12-29 |
Family
ID=35510164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/146,434 Abandoned US20050284611A1 (en) | 2004-06-15 | 2005-06-06 | Cooling device for electric circuit |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050284611A1 (en) |
WO (1) | WO2005125296A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170064867A1 (en) * | 2015-08-25 | 2017-03-02 | Odyssey Technical Solutions, Llc | Matching network cooling block |
US20210092869A1 (en) * | 2019-09-24 | 2021-03-25 | Hewlett Packard Enterprise Development Lp | Void free injection-molded cold plates |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005042784A1 (en) * | 2005-07-26 | 2007-02-01 | Bosch Rexroth Aktiengesellschaft | Valve arrangement and cooling device |
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US1516596A (en) * | 1923-04-23 | 1924-11-25 | Goodrich Co B F | Hot plate for vulcanizing presses |
US1549464A (en) * | 1923-05-23 | 1925-08-11 | Southwark Foundry & Machine Co | Steam platen |
US1621742A (en) * | 1925-08-20 | 1927-03-22 | Farrel Foundry And Machine Co | Fluid-circulating plate |
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US4268850A (en) * | 1979-05-11 | 1981-05-19 | Electric Power Research Institute | Forced vaporization heat sink for semiconductor devices |
US4363080A (en) * | 1980-09-02 | 1982-12-07 | Dentek Systems, Inc. | Water-cooled light source |
US4712158A (en) * | 1985-03-28 | 1987-12-08 | Fujitsu Limited | Cooling system for electronic circuit components |
US6415811B1 (en) * | 1993-11-10 | 2002-07-09 | Zimmermann & Jansen Gmbh | Cooled slider plate, particularly a water-cooled hot air slider plate |
US20040190254A1 (en) * | 2003-03-31 | 2004-09-30 | Intel Corporation | Electronic assembly with fluid cooling and associated methods |
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AU2641799A (en) * | 1999-02-26 | 2000-09-21 | Nippon Thermostat Co., Ltd. | Cooling device of electronic device |
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DK176137B1 (en) * | 2003-10-27 | 2006-09-25 | Danfoss Silicon Power Gmbh | Flow distribution unit and cooling unit with bypass flow |
-
2005
- 2005-06-01 WO PCT/CA2005/000841 patent/WO2005125296A1/en active Application Filing
- 2005-06-06 US US11/146,434 patent/US20050284611A1/en not_active Abandoned
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---|---|---|---|---|
US1516596A (en) * | 1923-04-23 | 1924-11-25 | Goodrich Co B F | Hot plate for vulcanizing presses |
US1549464A (en) * | 1923-05-23 | 1925-08-11 | Southwark Foundry & Machine Co | Steam platen |
US1621742A (en) * | 1925-08-20 | 1927-03-22 | Farrel Foundry And Machine Co | Fluid-circulating plate |
US1884612A (en) * | 1930-03-14 | 1932-10-25 | Southwark Foundry & Machine Co | Steam platen |
US1905653A (en) * | 1931-05-08 | 1933-04-25 | Walter Wood | Plug for steam platens and other metallic articles |
US2955184A (en) * | 1957-02-27 | 1960-10-04 | George E Grindrod | Apparatus for precision control of the surface temperature of metallic heaters |
US4079410A (en) * | 1975-12-10 | 1978-03-14 | Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. | Semiconductor rectifier device with improved cooling arrangement |
US4268850A (en) * | 1979-05-11 | 1981-05-19 | Electric Power Research Institute | Forced vaporization heat sink for semiconductor devices |
US4363080A (en) * | 1980-09-02 | 1982-12-07 | Dentek Systems, Inc. | Water-cooled light source |
US4712158A (en) * | 1985-03-28 | 1987-12-08 | Fujitsu Limited | Cooling system for electronic circuit components |
US6415811B1 (en) * | 1993-11-10 | 2002-07-09 | Zimmermann & Jansen Gmbh | Cooled slider plate, particularly a water-cooled hot air slider plate |
US20040190254A1 (en) * | 2003-03-31 | 2004-09-30 | Intel Corporation | Electronic assembly with fluid cooling and associated methods |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170064867A1 (en) * | 2015-08-25 | 2017-03-02 | Odyssey Technical Solutions, Llc | Matching network cooling block |
US10203167B2 (en) * | 2015-08-25 | 2019-02-12 | Odyssey Technical Solutions, Llc | Matching network cooling block |
US20210092869A1 (en) * | 2019-09-24 | 2021-03-25 | Hewlett Packard Enterprise Development Lp | Void free injection-molded cold plates |
US11589477B2 (en) * | 2019-09-24 | 2023-02-21 | Hewlett Packard Enterprise Development Lp | Void free injection-molded cold plates |
Also Published As
Publication number | Publication date |
---|---|
WO2005125296A1 (en) | 2005-12-29 |
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Owner name: TM4 INC., CANADA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BIBEAU, LOUIS-PHILIPPE;LAVIGNE, JEAN-FRANCOIS;REEL/FRAME:016660/0640 Effective date: 20040614 |
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