US20050039884A1 - Conformal heat sink - Google Patents
Conformal heat sink Download PDFInfo
- Publication number
- US20050039884A1 US20050039884A1 US10/644,375 US64437503A US2005039884A1 US 20050039884 A1 US20050039884 A1 US 20050039884A1 US 64437503 A US64437503 A US 64437503A US 2005039884 A1 US2005039884 A1 US 2005039884A1
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- United States
- Prior art keywords
- membrane
- heat sink
- enclosed volume
- heat
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4332—Bellows
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Definitions
- the present invention relates to cooling heat-generating electronic devices.
- PCB printed circuit board
- FIG. 1 shows a three-dimensional perspective view of an electronic module 100 having attached three prior-art heat sinks 110 a - c .
- module 100 includes a plurality of electronic devices, e.g., integrated circuits, mounted on a PCB 102 .
- Each heat sink 110 is attached to a corresponding group of devices, with all devices within the group preferably having similar shapes and dimensions.
- heat sink 110 a is attached to a group having nine devices 104
- heat sink 110 b is attached to a group having nine devices 106
- heat sink 110 c is attached to a group having six devices 108 .
- a heat sink similar to heat sink 110 may be attached to each individual heat-generating device, e.g., circuit 112 .
- Each heat sink 110 is fabricated of a material having good thermal conductivity, e.g., aluminum or copper, and has the shape of a plate with fins extending from one side of the plate to increase the effective surface area for heat dissipation.
- the opposite side of the plate is appropriately profiled to match the geometric shape of the group being cooled.
- heat sinks similar to heat sink 110 are tedious and expensive to design, fabricate, and install individual heat sinks for different individual heat-generating devices or groups of such devices, which are typically diverse in placement and shape.
- a heat sink of the invention includes a corrugated plate and a deformable membrane, attached to each other at the periphery to define an enclosed volume.
- the membrane has a metal foil layer, due to which it can be deformed to conform to a complicated surface geometry of the electronic module to be cooled.
- air pressure is applied to the enclosed volume through a fitting to force the membrane into close contact with heat generating components of the module.
- the membrane retains its shape due to the malleability of the foil layer.
- the enclosed volume is then filled with an appropriate heat-conducting fluid, which may optionally be circulated to facilitate heat removal from the module.
- the present invention is a heat sink for cooling heat-generating electrical equipment having a surface profile
- the heat sink comprising a plate and a deformable membrane attached to the plate to define an enclosed volume, wherein, when the heat sink is positioned in proximity to the equipment and a deformation force is applied to the membrane, the membrane conforms to the surface profile.
- the present invention is a method of cooling heat-generating electrical equipment having a surface profile, the method comprising: (A) positioning a heat sink in proximity to the equipment, wherein the heat sink comprises a plate and a deformable membrane attached to the plate to define an enclosed volume; and (B) applying a deformation force to conform the membrane to the surface profile.
- FIG. 1 shows a three-dimensional perspective view of an electronic module having attached three prior-art heat sinks
- FIGS. 2 A-B show three-dimensional perspective and cross-sectional views, respectively, of a heat sink according to one embodiment of the present invention.
- FIG. 3 shows a cross-sectional view of an electronic module having attached the heat sink shown in FIG. 2 according to one embodiment of the present invention.
- FIGS. 2 A-B show three-dimensional perspective and cross-sectional views, respectively, of a heat sink 210 according to one embodiment of the present invention.
- Heat sink 210 includes a top panel 212 and a deformable membrane 214 , both mounted on a support frame 216 .
- Panel 212 and membrane 214 are attached to each other at the periphery to define an enclosed volume 220 .
- volume 220 is an airtight volume accessible through a pair of fittings 222 a - b .
- Each fitting 222 is adapted to be connected to an external supply line, e.g., a compressed air line. When necessary, each fitting 222 may be plugged using an appropriate fitting cap.
- Panel 212 has the shape of a corrugated plate to increase both the surface area of volume 220 and the effective external area of heat sink 210 for heat dissipation.
- membrane 214 has at least two layers, a metal foil layer and a thin dielectric layer (not shown).
- the foil layer provides malleability to membrane 214 , due to which it can be deformed into a desired shape and then retain that shape after the deformation force is removed.
- the dielectric layer is deposited onto the outer (i.e., corresponding to the exterior of heat sink 210 ) surface of membrane 214 to provide electrical insulation, e.g., between the heat sink and any electronic devices it is in contact with. Conformational freedom of membrane 214 is enabled by the appropriate selection of membrane's size.
- the area covered by membrane 214 exceeds by a selected amount (e.g., 30%) that of the planar cross-section of frame 216 .
- membrane material in excess of the planar cross-section area is used to conform the shape of heat sink 210 to a complicated surface geometry of the electronic module to be cooled.
- FIG. 3 shows a cross-sectional view of an electronic module 300 having attached heat sink 210 ( FIG. 2 ) according to one embodiment of the present invention.
- Module 300 is similar to module 100 ( FIG. 1 ) and includes a plurality of irregularly shaped electronic devices 304 - 314 mounted on a PCB 302 .
- Heat sink 210 is mounted on PCB 302 using screws 316 , each attached between support frame 216 and the PCB.
- the membrane is molded to adapt to the shape of devices 304 - 314 and to provide good thermal contact between those devices and the membrane.
- the shape of heat sink 210 is conformed to that of module 300 as follows. First, empty heat sink 210 is mounted over the corresponding area of module 300 using screws 316 . Then, one of fittings 222 a - b is plugged and the other one is connected to a compressed air source. Air pressure is applied to volume 220 to push membrane 214 toward devices 304 - 314 and PCB 302 . The pressure value is selected such that membrane wraps over each device and is forced into the spaces between different devices thereby adapting to the shape of module 300 . When the air pressure is removed, membrane 214 retains its shape due to the malleability of its foil layer.
- a layer of thermally conducting grease may be placed between membrane 214 and devices 304 - 314 to further improve the thermal contact. Then, volume 220 is filled with an appropriate heat-conducting fluid, which facilitates heat flow from membrane 214 to panel 212 .
- the grease and/or fluid are selected from an assortment of thermally conductive gels commercially available from Gel Sciences, Inc., of Bedford, Mass.
- the heat-conducting fluid may be circulated through heat sink 210 using an external circulation device (e.g., a pump) connected to fittings 222 a - b ( FIG. 2 ).
- the circulation may be either continuous or intermittent.
- intermittent circulation may be implemented as follows. Volume 220 is filled with a first portion of relatively cool fluid from an external reservoir. This portion is allowed to remain in heat sink 210 , e.g., until the fluid temperature rises, due to the heat generated in module 300 , to a certain selected value. Then, the first portion is pumped out of heat sink 210 and a next portion of relatively cool fluid is transferred into volume 220 .
- the heat sink is assembled in situ over the module, e.g., as follows.
- a sheet of membrane material is applied to module 300 to cover the selected area to be cooled.
- the sheet is then (i) creased to adapt to the shape of devices 304 - 314 and PCB 302 and (ii) cut around the periphery of the area to be cooled.
- Support frame 216 is then mounted on PCB 302 and the edge of the membrane is attached to the frame without disturbing the creased portion of the membrane covering devices 304 - 314 .
- Panel 212 is mounted onto frame 216 and the assembly is sealed around the periphery to form volume 220 .
- frame 216 may incorporate suitable gaskets for the attachment of membrane 214 and panel 212 .
- a glue or heat treatment may also be used to seal volume 220 . Since the shape of so assembled heat sink 210 is already adapted to the shape of module 300 , the step of applying air pressure, as described above, is no longer required.
- volume 220 of heat sink 210 is filled with a heat-conducting fluid prior to the heat sink attachment to module 300 .
- the amount of fluid transferred into volume 220 is chosen such that the volume is in a floppy state, e.g., similar to that of a partially filled sandbag.
- Heat sink 210 so filled, is then pressed against the surface of module 300 and secured thereon to produce the assembly shown in FIG. 3 .
- heat sink 210 may be appropriately designed, for example, to have (i) relatively high turbulence of air and fluid flow around panel 212 for improved heat circulation and exchange, (ii) clips, springs, clamps, or other fasteners for ease of attachment to module 300 and/or (iii) a relatively large size to cover the entire PCB or circuit card. Due to the small thickness of membrane 214 , relatively expensive materials, e.g., gold, may be utilized in the membrane without prohibitively increasing the cost of the heat sink. Gases, liquids, gels, fine powders, or various mixtures thereof can be used to fill volume 220 . An active or passive heat-exchange device may be used, as known in the art, to cool the fluid circulated through volume 220 .
- heat sinks of the invention are relatively easy to mate to different irregularly shaped heat-generating devices and/or modules.
Abstract
In one embodiment, a heat sink of the invention includes a corrugated plate and a deformable membrane, attached to each other at the periphery to define an enclosed volume. The membrane has a metal foil layer, due to which it can be deformed to conform to a complicated surface geometry of the electronic module to be cooled. To mate the heat sink with the module, air pressure is applied to the enclosed volume through a fitting to force the membrane into close contact with heat generating components of the module. When the air supply is disconnected, the membrane retains its shape due to the malleability of the foil layer. The enclosed volume is then filled with an appropriate heat-conducting fluid, which may optionally be circulated to facilitate heat removal from the module.
Description
- 1. Field of the Invention
- The present invention relates to cooling heat-generating electronic devices.
- 2. Description of the Related Art
- Many electronic devices and/or components generate heat during operation. Unless heat is removed to maintain a device within the appropriate operating temperature range, the speed, power, and useful lifespan of the device may be adversely affected. The problem of heat removal is often exacerbated when the device is mounted on a thermally non-conductive substrate, such as an epoxy-composite printed circuit board (PCB). In a typical electronic module, electronic devices are densely packed on a PCB resulting in a complicated surface topology of varying heights, shapes, and profiles.
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FIG. 1 shows a three-dimensional perspective view of anelectronic module 100 having attached three prior-art heat sinks 110 a-c. More specifically,module 100 includes a plurality of electronic devices, e.g., integrated circuits, mounted on aPCB 102. Each heat sink 110 is attached to a corresponding group of devices, with all devices within the group preferably having similar shapes and dimensions. For example,heat sink 110 a is attached to a group having nine devices 104,heat sink 110 b is attached to a group having nine devices 106, andheat sink 110 c is attached to a group having six devices 108. In addition, a heat sink similar to heat sink 110 may be attached to each individual heat-generating device, e.g., circuit 112. Each heat sink 110 is fabricated of a material having good thermal conductivity, e.g., aluminum or copper, and has the shape of a plate with fins extending from one side of the plate to increase the effective surface area for heat dissipation. The opposite side of the plate is appropriately profiled to match the geometric shape of the group being cooled. - One problem with heat sinks similar to heat sink 110 is that it is tedious and expensive to design, fabricate, and install individual heat sinks for different individual heat-generating devices or groups of such devices, which are typically diverse in placement and shape.
- Problems in the prior art are addressed, in accordance with the principles of the present invention, by a conformal heat sink. In one embodiment, a heat sink of the invention includes a corrugated plate and a deformable membrane, attached to each other at the periphery to define an enclosed volume. The membrane has a metal foil layer, due to which it can be deformed to conform to a complicated surface geometry of the electronic module to be cooled. To mate the heat sink with the module, air pressure is applied to the enclosed volume through a fitting to force the membrane into close contact with heat generating components of the module. When the air supply is disconnected, the membrane retains its shape due to the malleability of the foil layer. The enclosed volume is then filled with an appropriate heat-conducting fluid, which may optionally be circulated to facilitate heat removal from the module.
- According to one embodiment, the present invention is a heat sink for cooling heat-generating electrical equipment having a surface profile, the heat sink comprising a plate and a deformable membrane attached to the plate to define an enclosed volume, wherein, when the heat sink is positioned in proximity to the equipment and a deformation force is applied to the membrane, the membrane conforms to the surface profile.
- According to another embodiment, the present invention is a method of cooling heat-generating electrical equipment having a surface profile, the method comprising: (A) positioning a heat sink in proximity to the equipment, wherein the heat sink comprises a plate and a deformable membrane attached to the plate to define an enclosed volume; and (B) applying a deformation force to conform the membrane to the surface profile.
- Other aspects, features, and benefits of the present invention will become more fully apparent from the following detailed description, the appended claims, and the accompanying drawings in which:
-
FIG. 1 shows a three-dimensional perspective view of an electronic module having attached three prior-art heat sinks; - FIGS. 2A-B show three-dimensional perspective and cross-sectional views, respectively, of a heat sink according to one embodiment of the present invention; and
-
FIG. 3 shows a cross-sectional view of an electronic module having attached the heat sink shown inFIG. 2 according to one embodiment of the present invention. - Reference herein to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
- FIGS. 2A-B show three-dimensional perspective and cross-sectional views, respectively, of a
heat sink 210 according to one embodiment of the present invention.Heat sink 210 includes atop panel 212 and adeformable membrane 214, both mounted on asupport frame 216.Panel 212 andmembrane 214 are attached to each other at the periphery to define an enclosedvolume 220. In a preferred implementation,volume 220 is an airtight volume accessible through a pair of fittings 222 a-b. Each fitting 222 is adapted to be connected to an external supply line, e.g., a compressed air line. When necessary, each fitting 222 may be plugged using an appropriate fitting cap. -
Panel 212 has the shape of a corrugated plate to increase both the surface area ofvolume 220 and the effective external area ofheat sink 210 for heat dissipation. In one implementation,membrane 214 has at least two layers, a metal foil layer and a thin dielectric layer (not shown). The foil layer provides malleability tomembrane 214, due to which it can be deformed into a desired shape and then retain that shape after the deformation force is removed. The dielectric layer is deposited onto the outer (i.e., corresponding to the exterior of heat sink 210) surface ofmembrane 214 to provide electrical insulation, e.g., between the heat sink and any electronic devices it is in contact with. Conformational freedom ofmembrane 214 is enabled by the appropriate selection of membrane's size. More specifically, in a fully extended (unfolded) state, the area covered bymembrane 214 exceeds by a selected amount (e.g., 30%) that of the planar cross-section offrame 216. As will be further explained below, membrane material in excess of the planar cross-section area is used to conform the shape ofheat sink 210 to a complicated surface geometry of the electronic module to be cooled. -
FIG. 3 shows a cross-sectional view of anelectronic module 300 having attached heat sink 210 (FIG. 2 ) according to one embodiment of the present invention.Module 300 is similar to module 100 (FIG. 1 ) and includes a plurality of irregularly shaped electronic devices 304-314 mounted on a PCB 302.Heat sink 210 is mounted on PCB 302 usingscrews 316, each attached betweensupport frame 216 and the PCB. Using the pliability ofmembrane 214, the membrane is molded to adapt to the shape of devices 304-314 and to provide good thermal contact between those devices and the membrane. - In one embodiment, the shape of
heat sink 210 is conformed to that ofmodule 300 as follows. First,empty heat sink 210 is mounted over the corresponding area ofmodule 300 usingscrews 316. Then, one of fittings 222 a-b is plugged and the other one is connected to a compressed air source. Air pressure is applied tovolume 220 to pushmembrane 214 toward devices 304-314 and PCB 302. The pressure value is selected such that membrane wraps over each device and is forced into the spaces between different devices thereby adapting to the shape ofmodule 300. When the air pressure is removed,membrane 214 retains its shape due to the malleability of its foil layer. A layer of thermally conducting grease may be placed betweenmembrane 214 and devices 304-314 to further improve the thermal contact. Then,volume 220 is filled with an appropriate heat-conducting fluid, which facilitates heat flow frommembrane 214 topanel 212. In one embodiment, the grease and/or fluid are selected from an assortment of thermally conductive gels commercially available from Gel Sciences, Inc., of Bedford, Mass. - Optionally, the heat-conducting fluid may be circulated through
heat sink 210 using an external circulation device (e.g., a pump) connected to fittings 222 a-b (FIG. 2 ). The circulation may be either continuous or intermittent. For example, intermittent circulation may be implemented as follows.Volume 220 is filled with a first portion of relatively cool fluid from an external reservoir. This portion is allowed to remain inheat sink 210, e.g., until the fluid temperature rises, due to the heat generated inmodule 300, to a certain selected value. Then, the first portion is pumped out ofheat sink 210 and a next portion of relatively cool fluid is transferred intovolume 220. - In another embodiment, to conform the shape of
heat sink 210 to that ofmodule 300, the heat sink is assembled in situ over the module, e.g., as follows. A sheet of membrane material is applied tomodule 300 to cover the selected area to be cooled. The sheet is then (i) creased to adapt to the shape of devices 304-314 andPCB 302 and (ii) cut around the periphery of the area to be cooled.Support frame 216 is then mounted onPCB 302 and the edge of the membrane is attached to the frame without disturbing the creased portion of the membrane covering devices 304-314.Panel 212 is mounted ontoframe 216 and the assembly is sealed around the periphery to formvolume 220. To obtain an airtight seal,frame 216 may incorporate suitable gaskets for the attachment ofmembrane 214 andpanel 212. Optionally, a glue or heat treatment may also be used to sealvolume 220. Since the shape of so assembledheat sink 210 is already adapted to the shape ofmodule 300, the step of applying air pressure, as described above, is no longer required. - In yet another embodiment,
volume 220 ofheat sink 210 is filled with a heat-conducting fluid prior to the heat sink attachment tomodule 300. Preferably, the amount of fluid transferred intovolume 220 is chosen such that the volume is in a floppy state, e.g., similar to that of a partially filled sandbag.Heat sink 210, so filled, is then pressed against the surface ofmodule 300 and secured thereon to produce the assembly shown inFIG. 3 . - In various embodiments,
heat sink 210 may be appropriately designed, for example, to have (i) relatively high turbulence of air and fluid flow aroundpanel 212 for improved heat circulation and exchange, (ii) clips, springs, clamps, or other fasteners for ease of attachment tomodule 300 and/or (iii) a relatively large size to cover the entire PCB or circuit card. Due to the small thickness ofmembrane 214, relatively expensive materials, e.g., gold, may be utilized in the membrane without prohibitively increasing the cost of the heat sink. Gases, liquids, gels, fine powders, or various mixtures thereof can be used to fillvolume 220. An active or passive heat-exchange device may be used, as known in the art, to cool the fluid circulated throughvolume 220. More specifically, in an active heat-exchange device, a refrigerant or a thermo-electric cooler is brought into thermal contact with the circulating fluid. In a passive heat-exchange device, the fluid is cooled down via passive dissipation of heat into the (cooler) environment. Advantageously, heat sinks of the invention are relatively easy to mate to different irregularly shaped heat-generating devices and/or modules. - While this invention has been described with reference to illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications of the described embodiments, as well as other embodiments of the invention, which are apparent to persons skilled in the art to which the invention pertains are deemed to lie within the principle and scope of the invention as expressed in the following claims.
- Although the steps in the following method claims, if any, are recited in a particular sequence with corresponding labeling, unless the claim recitations otherwise imply a particular sequence for implementing some or all of those steps, those steps are not necessarily intended to be limited to being implemented in that particular sequence.
Claims (20)
1. A heat sink for cooling heat-generating electrical equipment having a surface profile, the heat sink comprising a plate and a deformable membrane attached to the plate to define an enclosed volume, wherein, when the heat sink is positioned in proximity to the equipment and a deformation force is applied to the membrane, the membrane conforms to the surface profile.
2. The invention of claim 1 , wherein, when the deformation force is removed, the membrane retains a conformed shape.
3. The invention of claim 1 , further comprising a support frame, wherein:
the plate and the deformable membrane are mounted on the frame; and
the frame is adapted to be mounted on the equipment.
4. The invention of claim 3 , wherein:
the support frame has a planar cross-section area; and
the deformable membrane has a surface area greater than the planar cross-section area.
5. The invention of claim 1 , wherein the membrane comprises a metal foil layer.
6. The invention of claim 5 , wherein the membrane conforms to the surface profile by forming a pattern of creases.
7. The invention of claim 5 , wherein the membrane further comprises a dielectric layer located at an outer surface of the membrane with respect to the enclosed volume.
8. The invention of claim 1 , wherein the plate has a corrugated shape.
9. The invention of claim 1 , wherein the enclosed volume is a sealed volume provided with one or more fittings, which allow the enclosed volume to be filled with an externally supplied substance.
10. The invention of claim 9 , wherein the heat sink is configured for fluid circulation through the enclosed volume.
11. The invention of claim 1 , wherein the enclosed volume contains a heat conducting fluid having thermal conductivity greater than air.
12. A method of cooling heat-generating electrical equipment having a surface profile, the method comprising:
(A) positioning a heat sink in proximity to the equipment, wherein the heat sink comprises a plate and a deformable membrane attached to the plate to define an enclosed volume; and
(B) applying a deformation force to conform the membrane to the surface profile.
13. The invention of claim 12 , wherein, when the deformation force is removed, the membrane retains a conformed shape.
14. The invention of claim 12 , wherein:
the heat sink further comprises a support frame;
the plate and the deformable membrane are mounted on the frame; and
the frame is mounted on the equipment.
15. The invention of claim 14 , wherein:
the support frame has a planar cross-section area; and
the deformable membrane has a surface area greater than the planar cross-section area.
16. The invention of claim 12 , wherein the membrane comprises a metal foil layer and a dielectric layer adapted to provide electrical insulation between the heat sink and the equipment.
17. The invention of claim 12 , wherein the enclosed volume is a sealed volume provided with one or more fittings, which allow the enclosed volume to be filled with an externally supplied substance.
18. The invention of claim 17 , wherein step (B) comprises applying air pressure to the enclosed volume.
19. The invention of claim 12 , further comprising transferring a heat-conducting fluid into the enclosed volume, wherein the fluid has thermal conductivity greater than air.
20. The invention of claim 19 , further comprising circulating the fluid through the enclosed volume.
Priority Applications (1)
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US10/644,375 US20050039884A1 (en) | 2003-08-20 | 2003-08-20 | Conformal heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US10/644,375 US20050039884A1 (en) | 2003-08-20 | 2003-08-20 | Conformal heat sink |
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US20050039884A1 true US20050039884A1 (en) | 2005-02-24 |
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US10/644,375 Abandoned US20050039884A1 (en) | 2003-08-20 | 2003-08-20 | Conformal heat sink |
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Cited By (13)
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WO2005112533A2 (en) * | 2004-05-03 | 2005-11-24 | Parker-Hannifin Corporation | Lightweight heat sink |
EP1853099A1 (en) * | 2006-05-04 | 2007-11-07 | Bombardier Transportation GmbH | A cooling device and use thereof |
US20080049384A1 (en) * | 2006-08-25 | 2008-02-28 | Abb Research Ltd | Cooling device for an electrical operating means |
US20090045505A1 (en) * | 2007-08-15 | 2009-02-19 | Via Technologies, Inc. | Electronic device with package module |
US20100200197A1 (en) * | 2009-02-09 | 2010-08-12 | International Business Machines Corporation | Liquid cooled compliant heat sink and related method |
WO2010127340A1 (en) * | 2009-05-01 | 2010-11-04 | Billboard Video, Inc. | Electronic display panel |
US20110048672A1 (en) * | 2009-08-28 | 2011-03-03 | International Business Machines Corporation | Thermal ground plane for cooling a computer |
US20150129174A1 (en) * | 2013-11-11 | 2015-05-14 | Robert J. Monson | Component reachable expandable heat plate |
US20150369545A1 (en) * | 2013-01-18 | 2015-12-24 | Taisei Plas Co., Ltd. | Heat exchanger and method for manufacturing same |
US20160278237A1 (en) * | 2013-10-29 | 2016-09-22 | Polymatech Japan Co., Ltd. | Liquid-Encapsulation Heat Dissipation Member |
CN106684057A (en) * | 2016-12-30 | 2017-05-17 | 华为技术有限公司 | Chip packaging structure and manufacturing method therefor |
US20210168965A1 (en) * | 2019-12-03 | 2021-06-03 | The Florida State University Research Foundation, Inc. | Integrated thermal-electrical component for power electronics converters |
US20230239993A1 (en) * | 2022-01-26 | 2023-07-27 | Microsoft Technology Licensing, Llc | Cooling systems for a circuit board |
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