US20040094424A1 - Graphite metal coating - Google Patents
Graphite metal coating Download PDFInfo
- Publication number
- US20040094424A1 US20040094424A1 US10/712,458 US71245803A US2004094424A1 US 20040094424 A1 US20040094424 A1 US 20040094424A1 US 71245803 A US71245803 A US 71245803A US 2004094424 A1 US2004094424 A1 US 2004094424A1
- Authority
- US
- United States
- Prior art keywords
- graphite
- set forth
- electroplating
- anodic etching
- range
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 41
- 239000010439 graphite Substances 0.000 title claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 30
- 239000002184 metal Substances 0.000 title claims abstract description 30
- 238000000576 coating method Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims description 18
- 238000009713 electroplating Methods 0.000 claims description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000000243 solution Substances 0.000 claims description 8
- 238000009210 therapy by ultrasound Methods 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 6
- 238000010899 nucleation Methods 0.000 claims description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Substances [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000005299 abrasion Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1896—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by electrochemical pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Definitions
- the present invention involves a method for applying a metal coating to graphite.
- Graphite is used as a material in a huge variety of applications.
- graphite members have to be used for electrically conductive connections, where one often only uses clamp connections or creates a contact by pressing on other electrically conductive parts (in particular by pressing on metal contacts).
- a connection created by soldering or other connecting techniques is required, thus making a metallic surface of the graphite member mandatory.
- One object of the invention is to provide an improved method for applying a metal coating to graphite.
- Another object of the invention is to ensure a good adhesion between the applied metal layers and the graphite surface itself.
- One aim of the invention is to ensure a good adhesion between the metal layers to be applied and the graphite surface itself.
- the inventor has discovered, that a good adhesion can be accomplished when the graphite structural member is first pretreated and activated by anodic etching in an alkaline etchant, and is subsequently electroplated.
- Anodic etching is done with an applied electrical potential, the grapite being the anode.
- the graphite surface is not only thoroughly cleansed but also slightly etched, whereby the subsequent electroplating is accomplished on a surface which is mainly free of foreign impurities and graphite dust, and which is slightly roughened. Accordingly, the metal layer can effectively interlock with the graphite surface, thereby providing significant adhesive properties.
- the alkaline etchant thus creates the condition for such metal coatings to have a high adhesive strength and temperature stability.
- the graphite surface can be Pd seeded prior to electroplating.
- a so-called chemical metal layer This refers to a metal deposition by means of a reducing agent without applying current (electroless plating).
- This electroless plating is optional, but is preferably based on the Pd seeding.
- the electroless plating preferably deposits Ni or Cu. These two metals may also be present together or in a combination with other metals.
- the cleansing effect of the alkaline etchant may additionally be enhanced by an ultrasound treatment.
- This ultrasound treatment helps to detach particles adhering to the surface and, furthermore, it is effective to mix thoroughly and to equalise the concentrations in the surface surroundings.
- This ultrasound treatment has several disadvantages. In some structural members it is undesirable due to the mechanical stress exerted on sensitive parts. Furthermore, it requires the incorporation of the members into a device suitable for the ultrasound treatment. In order to optimise the uniformity of the ultrasound treatment, one can select in particular annular configurations of the batches of structural members to be treated, which however is rather complicated with respect to the machinery.
- the described ultrasound treatment is completely omitted and the temporal and technical effort is, thus, significantly reduced.
- the treated graphite members taken out of the alkaline etchant are directly (i.e. in a direct succession without any further intermediate treatment) dipped into a weak aqueous solution or into water.
- a weak aqueous solution or into water thereby, at the surfaces of the members, strong gradients of concentration are produced due to the residual portions of the solution employed for the etchant.
- These residual parts of the etchant show a short and rather intensive reaction with the water or the weak aqueous solution, which becomes obvious by the temporary sparkling in the water or in the aqueous solution near the surface.
- This sparkling effect according to the inventor's observation, has a cleansing effect similar to the ultrasound bath, and effectively and easily removes from the surface those impurities already being etched off or being loosened by the etchant.
- the described electroplating of graphite may be accomplished on a mounting apparatus and, in case of a specific geometry or shape of the members, in drums.
- the electroplating can preferably employ Ag, Cu, Ni or Sn, or a mixture of these metals, or a mixture of one or several of these metals with other metals.
- Sn and Sn-alloys have good soldering characteristics, so that the galvanic layer provides a good basis for a subsequent (optional) soldering step.
- Preferred parameter ranges for the electroplating are a current density in the range 0.1 to 10 A/dm 2 , and a duration of treatment, i.e. bath and current duration, in the range 5 to 90 minutes.
- the anodic etching can preferably be performed in a sodium hydroxide solution (solution of NaOH) or in a potassium hydroxide solution (solution of KOH) or in a mixture of both lyes, for example in range of concentration of 10 to 70% by weight, with a particularly preferred range of 20 to 50% by weight.
- concentration of 10 to 70% by weight with a particularly preferred range of 20 to 50% by weight.
- temperatures of 20° to 70° C. have achieved good results, with temperatures in the range of 30° C. to 40° C. being preferable.
- graphite in this invention refers to all materials in which graphite is contained in such a degree and is present on the relevant surface, that applying a metal coating of the graphite surfaces themselves is essential to attain the desired technical result.
- This includes all pure graphite materials as well as those containing minor additives.
- the invention is also directed to plastic-bound graphite materials in which graphite particles are contained within a plastic matrix. Such material serves various technical applications, in which the method according to the invention can be of great advantage.
- the invention can be realised according to the following example, the characteristics of which, however, are not to be regarded as limiting the scope of protection in any way.
- a structural member of an electrical device with such member being formed of a graphite bound by plastics, is produced in a conventional way so that it acquires its final shape. Then, a batch including a large number of the structural members is cleansed and etched by anodic etching in a commercially available device for electrolytic etching in a solution of NaOH having a concentration of 50% by weight and at a temperature of 30° to 40° C., followed by a direct transfer to a simple water bath at room temperature. There, the solution displays a transient sparkling around the structural members in the batch. The batch is then rinsed and Pd seeded in a known fashion. For this aim, commercial ionogenic or colloidal Pd-solutions are available. The Pd-seeds serve as a catalyst for the subsequent steps of metallization.
- the anodic etching is performed with an applied electrical potential in the range of 4V to 20V.
- the preferred range is 9V to 10V.
- the duration of the anodic etching is between 5 and 90 minutes, with the actual time being inversely proportional to the strength of the applied electrical potential.
- the preferred range of 9V to 10V 30 to 40 mins. are used.
- an approximate preferred range is 300 to 400 V min.
- a Ni-layer having a thickness of 0.1 to 2 ⁇ m is chemically deposited (by electroless plating) on the Pd-seeded graphite members. Because the Ni layer is very thin, it may be reinforced by chemical Ni, chemical Cu, galvanic Ni and/or galvanic Cu.
- An electrolytic Sn-alloy may then be applied to the reinforced chemical metal layer to form a layer thickness between 5 and 10 ⁇ m so that the solder pads can be directly placed thereupon.
- a galvanic reinforcement is preferred to a chemical reinforcement.
- the soldering process itself is completely conventional, since only the surface of the Sn-alloy is essential for it.
- the solder pad offers not only excellent electrical contact with the graphite structural member, but it has such a good adhesion to the graphite structural member, that it may also be employed for mechanical fixation. This avoids fixing the graphite structural member by clamping or by screwing on via a tapped hole or by other interlocking or frictional connections.
- the invention is advantageous in that by applying a metal coating to graphite, i.e. the deposition of adhering, and not just surface-mounted, metal layers, such metal layers will provide a valuable contribution for creating electrical contacts on and/or for mechanically fixing graphite structural members.
- a metal coating i.e. the deposition of adhering, and not just surface-mounted, metal layers
- other metallic contact elements can be pressed on these deposited metal layers, so that only comparatively low transition resistances occur.
- the metal layers can be used as a basis for solder connections or other methods for creating a firm connection to the structural member, which require a metallic surface.
Abstract
A method for applying a metal coating to graphite structural members, in which a galvanic metal layer is deposited after said graphite structural members have been anodically etched in an alkaline etchant. The metal coating can serve as a basis for solder connections and can be employed for creating electrical contacts or for mechanically fixing the graphite structural member or it can fulfil other demands on the surface (e.g. abrasion resistance).
Description
- This application is a Continuation-in-Part of PCT/EP02/03116, filed on 20 Mar. 2002.
- The present invention involves a method for applying a metal coating to graphite.
- Graphite is used as a material in a huge variety of applications. In many cases, graphite members have to be used for electrically conductive connections, where one often only uses clamp connections or creates a contact by pressing on other electrically conductive parts (in particular by pressing on metal contacts). In order to address many technical problems, however, a connection created by soldering or other connecting techniques is required, thus making a metallic surface of the graphite member mandatory.
- One object of the invention is to provide an improved method for applying a metal coating to graphite.
- Another object of the invention is to ensure a good adhesion between the applied metal layers and the graphite surface itself.
- These and other objects are attained in accordance with one aspect of the invention directed to a method for applying a metal coating to graphite that includes the steps of anodic etching the graphite in an alkaline etchant, and then electroplating the graphite.
- One aim of the invention is to ensure a good adhesion between the metal layers to be applied and the graphite surface itself. The inventor has discovered, that a good adhesion can be accomplished when the graphite structural member is first pretreated and activated by anodic etching in an alkaline etchant, and is subsequently electroplated. Anodic etching is done with an applied electrical potential, the grapite being the anode. By means of the anodic etching in the alkaline etchant, the graphite surface is not only thoroughly cleansed but also slightly etched, whereby the subsequent electroplating is accomplished on a surface which is mainly free of foreign impurities and graphite dust, and which is slightly roughened. Accordingly, the metal layer can effectively interlock with the graphite surface, thereby providing significant adhesive properties. The alkaline etchant thus creates the condition for such metal coatings to have a high adhesive strength and temperature stability.
- Optionally, the graphite surface can be Pd seeded prior to electroplating. In addition, subsequently to this Pd seeding one may deposit a so-called chemical metal layer. This refers to a metal deposition by means of a reducing agent without applying current (electroless plating). This electroless plating is optional, but is preferably based on the Pd seeding. The electroless plating preferably deposits Ni or Cu. These two metals may also be present together or in a combination with other metals.
- The cleansing effect of the alkaline etchant may additionally be enhanced by an ultrasound treatment. This helps to detach particles adhering to the surface and, furthermore, it is effective to mix thoroughly and to equalise the concentrations in the surface surroundings. This ultrasound treatment, however, has several disadvantages. In some structural members it is undesirable due to the mechanical stress exerted on sensitive parts. Furthermore, it requires the incorporation of the members into a device suitable for the ultrasound treatment. In order to optimise the uniformity of the ultrasound treatment, one can select in particular annular configurations of the batches of structural members to be treated, which however is rather complicated with respect to the machinery.
- According to a particularly preferred feature of the invention, the described ultrasound treatment is completely omitted and the temporal and technical effort is, thus, significantly reduced. Instead of this, the treated graphite members taken out of the alkaline etchant are directly (i.e. in a direct succession without any further intermediate treatment) dipped into a weak aqueous solution or into water. Thereby, at the surfaces of the members, strong gradients of concentration are produced due to the residual portions of the solution employed for the etchant. These residual parts of the etchant show a short and rather intensive reaction with the water or the weak aqueous solution, which becomes obvious by the temporary sparkling in the water or in the aqueous solution near the surface. This sparkling effect, according to the inventor's observation, has a cleansing effect similar to the ultrasound bath, and effectively and easily removes from the surface those impurities already being etched off or being loosened by the etchant.
- The process just being described is thus preferably to be used to completely omit an ultrasound treatment at least in this field of the method.
- The described electroplating of graphite may be accomplished on a mounting apparatus and, in case of a specific geometry or shape of the members, in drums. The electroplating can preferably employ Ag, Cu, Ni or Sn, or a mixture of these metals, or a mixture of one or several of these metals with other metals. In particular Sn and Sn-alloys have good soldering characteristics, so that the galvanic layer provides a good basis for a subsequent (optional) soldering step.
- Thus, after the etching process, one can preferably apply either
- a Pd seeding+chemical Ni+Cu (or Ni)
- or galvanic Ni directly after the rinsing
- or galvanic Cu directly after the rinsing.
- These layers are then used as a basis for the deposition of further layers (Sn or other metals).
- Preferred parameter ranges for the electroplating are a current density in the range 0.1 to 10 A/dm2, and a duration of treatment, i.e. bath and current duration, in the range 5 to 90 minutes.
- The anodic etching can preferably be performed in a sodium hydroxide solution (solution of NaOH) or in a potassium hydroxide solution (solution of KOH) or in a mixture of both lyes, for example in range of concentration of 10 to 70% by weight, with a particularly preferred range of 20 to 50% by weight. For this aim, temperatures of 20° to 70° C. have achieved good results, with temperatures in the range of 30° C. to 40° C. being preferable.
- The term “graphite” in this invention refers to all materials in which graphite is contained in such a degree and is present on the relevant surface, that applying a metal coating of the graphite surfaces themselves is essential to attain the desired technical result. This, of course, includes all pure graphite materials as well as those containing minor additives. Preferably, however, the invention is also directed to plastic-bound graphite materials in which graphite particles are contained within a plastic matrix. Such material serves various technical applications, in which the method according to the invention can be of great advantage.
- Concretely, the invention can be realised according to the following example, the characteristics of which, however, are not to be regarded as limiting the scope of protection in any way.
- A structural member of an electrical device, with such member being formed of a graphite bound by plastics, is produced in a conventional way so that it acquires its final shape. Then, a batch including a large number of the structural members is cleansed and etched by anodic etching in a commercially available device for electrolytic etching in a solution of NaOH having a concentration of 50% by weight and at a temperature of 30° to 40° C., followed by a direct transfer to a simple water bath at room temperature. There, the solution displays a transient sparkling around the structural members in the batch. The batch is then rinsed and Pd seeded in a known fashion. For this aim, commercial ionogenic or colloidal Pd-solutions are available. The Pd-seeds serve as a catalyst for the subsequent steps of metallization.
- The anodic etching is performed with an applied electrical potential in the range of 4V to 20V. The preferred range is 9V to 10V. The duration of the anodic etching is between 5 and 90 minutes, with the actual time being inversely proportional to the strength of the applied electrical potential. For example, for the preferred range of 9V to 10V, 30 to 40 mins. are used. For the resultant range of 200 to 500 V min, an approximate preferred range is 300 to 400 V min.
- A Ni-layer having a thickness of 0.1 to 2 μm is chemically deposited (by electroless plating) on the Pd-seeded graphite members. Because the Ni layer is very thin, it may be reinforced by chemical Ni, chemical Cu, galvanic Ni and/or galvanic Cu.
- An electrolytic Sn-alloy may then be applied to the reinforced chemical metal layer to form a layer thickness between 5 and 10 μm so that the solder pads can be directly placed thereupon. A galvanic reinforcement is preferred to a chemical reinforcement. The soldering process itself is completely conventional, since only the surface of the Sn-alloy is essential for it.
- The solder pad offers not only excellent electrical contact with the graphite structural member, but it has such a good adhesion to the graphite structural member, that it may also be employed for mechanical fixation. This avoids fixing the graphite structural member by clamping or by screwing on via a tapped hole or by other interlocking or frictional connections. One can simply employ a suitable metal stripe as a mounting device.
- The invention is advantageous in that by applying a metal coating to graphite, i.e. the deposition of adhering, and not just surface-mounted, metal layers, such metal layers will provide a valuable contribution for creating electrical contacts on and/or for mechanically fixing graphite structural members. On the one hand, other metallic contact elements can be pressed on these deposited metal layers, so that only comparatively low transition resistances occur. On the other hand, the metal layers can be used as a basis for solder connections or other methods for creating a firm connection to the structural member, which require a metallic surface.
Claims (15)
1. A method of applying a metal coating to graphite comprising:
anodic etching said graphite in an alkaline etchant, and then electroplating said graphite.
2. The method as set forth in claim 1 , comprising the following step between said anodic etching and said electroplating:
Pd seeding said graphite.
3. The method as set forth in claim 2 , comprising the following step between said Pd seeding and said electroplating:
electroless plating to reinforce said Pd coating.
4. The method as set forth in claim 3 , wherein at least Ni or Cu is deposited in said electroless plating step.
5. The method as set forth in claim 1 , comprising the following step between said anodic etching and a subsequent step:
directly transferring said graphite, obtained with said anodic etching step, into water or a weak aqueous solution.
6. The method as set forth in claim 5 , wherein between said anodic etching and said electroplating no ultrasound treatment is implemented.
7. The method as set forth in claim 1 , wherein said electroplating involves at least one of the following group: Ag, Cu, Ni and Sn.
8. The method as set forth in claim 1 , wherein said electroplating utilizes a current density in the range 0.1 to 10 A/dm2.
9. The method as set forth in claim 1 , wherein the current duration in said electroplating is in the range of 5 to 90 minutes.
10. The method as set forth in claim 1 , wherein said anodic etching is done in a solution of NaOH and/or KOH having a concentration in the range 10 to 70% by weight.
11. The method as set forth in claim 10 , wherein said anodic etching is done at a temperature in the range 20° C. to 70° C.
12. The method as set forth in claim 1 , wherein said graphite comprises graphite particles bound by plastics.
13. A method of fabricating a solder connection to a graphite component wherein, by a method as set forth in claim 1 , a metal coating is deposited on said graphite component, after which a solder pad is applied to said metal coating as thus produced.
14. A method as set forth in claim 1 , wherein said anodic etching is performed with an applied electrical potential in the range of 4V to 20V.
15. A method as set forth in claim 14 , wherein said anodic etching has a duration in the range of 5 to 90 minutes, with the actual duration being inversely proportional to the applied electrical potential.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01111708.2 | 2001-05-14 | ||
EP20010111708 EP1260615B1 (en) | 2001-05-14 | 2001-05-14 | Metal coating of graphite |
PCT/EP2002/003116 WO2002092884A1 (en) | 2001-05-14 | 2002-03-20 | Graphite metal coating |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2002/003116 Continuation-In-Part WO2002092884A1 (en) | 2001-05-14 | 2002-03-20 | Graphite metal coating |
Publications (1)
Publication Number | Publication Date |
---|---|
US20040094424A1 true US20040094424A1 (en) | 2004-05-20 |
Family
ID=8177428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/712,458 Abandoned US20040094424A1 (en) | 2001-05-14 | 2003-11-13 | Graphite metal coating |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040094424A1 (en) |
EP (1) | EP1260615B1 (en) |
AT (1) | ATE234950T1 (en) |
DE (1) | DE50100123D1 (en) |
SI (1) | SI1260615T1 (en) |
WO (1) | WO2002092884A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040134646A1 (en) * | 2003-01-10 | 2004-07-15 | International Business Machines Corporation | Graphite-based heat sinks and method and apparatus for the manufacture thereof |
US20100243230A1 (en) * | 2009-03-25 | 2010-09-30 | Wah Hong Industrial Corp. | Heat-dissipating device including a plating metal layer |
US20110214851A1 (en) * | 2009-08-14 | 2011-09-08 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
TWI391537B (en) * | 2009-08-13 | 2013-04-01 | ||
CN103469182A (en) * | 2013-08-30 | 2013-12-25 | 西北工业大学 | Palladium-free chemical copper-plating method on graphite nanosheet surface |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2547120A (en) * | 1945-10-23 | 1951-04-03 | Bendix Aviat Corp | Process for plating a carbon or graphite part with chromium |
US3547692A (en) * | 1968-10-17 | 1970-12-15 | Engelhard Min & Chem | Metal coating carbon substrates |
US3550247A (en) * | 1967-02-02 | 1970-12-29 | Courtaulds Ltd | Method for producing a metal composite |
US5591565A (en) * | 1992-03-20 | 1997-01-07 | Siemens Solar Gmbh | Solar cell with combined metallization and process for producing the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1283916A (en) * | 1968-09-28 | 1972-08-02 | Plessey Co Ltd | Improvements relating to electro-deposition |
JPS60208495A (en) * | 1984-04-02 | 1985-10-21 | Okuno Seiyaku Kogyo Kk | Pretreatment for electroplating to carbon material |
JPH0327175A (en) * | 1989-06-17 | 1991-02-05 | Kobe Steel Ltd | Production of carbon fiber |
-
2001
- 2001-05-14 AT AT01111708T patent/ATE234950T1/en active
- 2001-05-14 DE DE50100123T patent/DE50100123D1/en not_active Expired - Lifetime
- 2001-05-14 SI SI200130012T patent/SI1260615T1/en unknown
- 2001-05-14 EP EP20010111708 patent/EP1260615B1/en not_active Expired - Lifetime
-
2002
- 2002-03-20 WO PCT/EP2002/003116 patent/WO2002092884A1/en not_active Application Discontinuation
-
2003
- 2003-11-13 US US10/712,458 patent/US20040094424A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2547120A (en) * | 1945-10-23 | 1951-04-03 | Bendix Aviat Corp | Process for plating a carbon or graphite part with chromium |
US3550247A (en) * | 1967-02-02 | 1970-12-29 | Courtaulds Ltd | Method for producing a metal composite |
US3547692A (en) * | 1968-10-17 | 1970-12-15 | Engelhard Min & Chem | Metal coating carbon substrates |
US5591565A (en) * | 1992-03-20 | 1997-01-07 | Siemens Solar Gmbh | Solar cell with combined metallization and process for producing the same |
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US20040134646A1 (en) * | 2003-01-10 | 2004-07-15 | International Business Machines Corporation | Graphite-based heat sinks and method and apparatus for the manufacture thereof |
US6907917B2 (en) * | 2003-01-10 | 2005-06-21 | International Business Machines Corporation | Graphite-based heat sinks and method and apparatus for the manufacture thereof |
US7254888B2 (en) | 2003-01-10 | 2007-08-14 | International Business Machines Corporation | Method for manufacturing graphite-base heat sinks |
US20100243230A1 (en) * | 2009-03-25 | 2010-09-30 | Wah Hong Industrial Corp. | Heat-dissipating device including a plating metal layer |
US20120132404A1 (en) * | 2009-03-25 | 2012-05-31 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
US9097468B2 (en) * | 2009-03-25 | 2015-08-04 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
TWI391537B (en) * | 2009-08-13 | 2013-04-01 | ||
US20110214851A1 (en) * | 2009-08-14 | 2011-09-08 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
US8955580B2 (en) * | 2009-08-14 | 2015-02-17 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
CN103469182A (en) * | 2013-08-30 | 2013-12-25 | 西北工业大学 | Palladium-free chemical copper-plating method on graphite nanosheet surface |
Also Published As
Publication number | Publication date |
---|---|
DE50100123D1 (en) | 2003-04-24 |
SI1260615T1 (en) | 2003-12-31 |
EP1260615A1 (en) | 2002-11-27 |
EP1260615B1 (en) | 2003-03-19 |
ATE234950T1 (en) | 2003-04-15 |
WO2002092884A1 (en) | 2002-11-21 |
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