US20010021102A1 - Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof - Google Patents
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof Download PDFInfo
- Publication number
- US20010021102A1 US20010021102A1 US20879098A US2001021102A1 US 20010021102 A1 US20010021102 A1 US 20010021102A1 US 20879098 A US20879098 A US 20879098A US 2001021102 A1 US2001021102 A1 US 2001021102A1
- Authority
- US
- United States
- Prior art keywords
- chip
- transfer media
- thermal paste
- heat transfer
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/208,790 US6275381B1 (en) | 1998-12-10 | 1998-12-10 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
US09/619,886 US6444496B1 (en) | 1998-12-10 | 2000-07-20 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/208,790 US6275381B1 (en) | 1998-12-10 | 1998-12-10 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/619,886 Division US6444496B1 (en) | 1998-12-10 | 2000-07-20 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
US6275381B1 US6275381B1 (en) | 2001-08-14 |
US20010021102A1 true US20010021102A1 (en) | 2001-09-13 |
Family
ID=22776077
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/208,790 Expired - Lifetime US6275381B1 (en) | 1998-12-10 | 1998-12-10 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
US09/619,886 Expired - Fee Related US6444496B1 (en) | 1998-12-10 | 2000-07-20 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/619,886 Expired - Fee Related US6444496B1 (en) | 1998-12-10 | 2000-07-20 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
Country Status (1)
Country | Link |
---|---|
US (2) | US6275381B1 (en) |
Cited By (3)
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US20040123981A1 (en) * | 2002-12-31 | 2004-07-01 | Frank Wang | Heat-dissicipating substrate |
US20050099778A1 (en) * | 2003-11-11 | 2005-05-12 | Sumitomo Wiring Systems, Ltd. | Circuit assembly and method for producing the same |
US20100117222A1 (en) * | 2006-06-07 | 2010-05-13 | Seah Sun Too | Void Reduction in Indium Thermal Interface Material |
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US6461891B1 (en) | 1999-09-13 | 2002-10-08 | Intel Corporation | Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple |
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1998
- 1998-12-10 US US09/208,790 patent/US6275381B1/en not_active Expired - Lifetime
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2000
- 2000-07-20 US US09/619,886 patent/US6444496B1/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040123981A1 (en) * | 2002-12-31 | 2004-07-01 | Frank Wang | Heat-dissicipating substrate |
US20050099778A1 (en) * | 2003-11-11 | 2005-05-12 | Sumitomo Wiring Systems, Ltd. | Circuit assembly and method for producing the same |
US20100117222A1 (en) * | 2006-06-07 | 2010-05-13 | Seah Sun Too | Void Reduction in Indium Thermal Interface Material |
US7999394B2 (en) * | 2006-06-07 | 2011-08-16 | Advanced Micro Devices, Inc. | Void reduction in indium thermal interface material |
Also Published As
Publication number | Publication date |
---|---|
US6444496B1 (en) | 2002-09-03 |
US6275381B1 (en) | 2001-08-14 |
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