AU3181999A - Fiber heat sink and fiber heat exchanger - Google Patents

Fiber heat sink and fiber heat exchanger

Info

Publication number
AU3181999A
AU3181999A AU31819/99A AU3181999A AU3181999A AU 3181999 A AU3181999 A AU 3181999A AU 31819/99 A AU31819/99 A AU 31819/99A AU 3181999 A AU3181999 A AU 3181999A AU 3181999 A AU3181999 A AU 3181999A
Authority
AU
Australia
Prior art keywords
fiber heat
heat exchanger
heat sink
sink
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU31819/99A
Inventor
Serguei V. Dessiatoun
Igor Ivakhnenko
Michael M. Ohadi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Maryland at Baltimore
Original Assignee
University of Maryland at Baltimore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Maryland at Baltimore filed Critical University of Maryland at Baltimore
Publication of AU3181999A publication Critical patent/AU3181999A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3677Wire-like or pin-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU31819/99A 1998-03-30 1999-03-30 Fiber heat sink and fiber heat exchanger Abandoned AU3181999A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US7997798P 1998-03-30 1998-03-30
US60079977 1998-03-30
US9866998P 1998-09-01 1998-09-01
US60098669 1998-09-01
PCT/US1999/004282 WO1999051069A2 (en) 1998-03-30 1999-03-30 Fiber heat sink and fiber heat exchanger

Publications (1)

Publication Number Publication Date
AU3181999A true AU3181999A (en) 1999-10-18

Family

ID=26762644

Family Applications (1)

Application Number Title Priority Date Filing Date
AU31819/99A Abandoned AU3181999A (en) 1998-03-30 1999-03-30 Fiber heat sink and fiber heat exchanger

Country Status (2)

Country Link
AU (1) AU3181999A (en)
WO (1) WO1999051069A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0008897D0 (en) 2000-04-12 2000-05-31 Cheiros Technology Ltd Improvements relating to heat transfer
DE10212754B4 (en) * 2002-03-20 2004-04-08 Krause, Günter Heat exchanger
WO2006041325A1 (en) * 2004-10-08 2006-04-20 Verteletsky, Pavel Vasilievich Multi-filament heat sink
JP5519788B2 (en) 2009-07-10 2014-06-11 エタリム インコーポレイテッド Stirling cycle converter for conversion between thermal energy and mechanical energy
WO2012065245A1 (en) 2010-11-18 2012-05-24 Etalim Inc. Stirling cycle transducer apparatus
SE541352C2 (en) * 2015-06-03 2019-08-13 Apr Tech Ab Microfluidic array
SE543734C2 (en) * 2019-03-11 2021-07-06 Apr Tech Ab Cooling of electronic components with an electrohydrodynamic flow unit
SE543441C2 (en) * 2019-03-26 2021-02-16 Centropy Ab Heat transfer device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4485429A (en) * 1982-06-09 1984-11-27 Sperry Corporation Apparatus for cooling integrated circuit chips
US5077637A (en) * 1989-09-25 1991-12-31 The Charles Stark Draper Lab., Inc. Solid state directional thermal cable
US5150748A (en) * 1990-06-18 1992-09-29 Mcdonnell Douglas Corporation Advanced survivable radiator
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
US5542471A (en) * 1993-11-16 1996-08-06 Loral Vought System Corporation Heat transfer element having the thermally conductive fibers
US5852548A (en) * 1994-09-09 1998-12-22 Northrop Grumman Corporation Enhanced heat transfer in printed circuit boards and electronic components thereof
US5566752A (en) * 1994-10-20 1996-10-22 Lockheed Fort Worth Company High heat density transfer device
US5655600A (en) * 1995-06-05 1997-08-12 Alliedsignal Inc. Composite plate pin or ribbon heat exchanger
JPH09262917A (en) * 1996-03-28 1997-10-07 Mitsubishi Electric Corp Heat transfer element

Also Published As

Publication number Publication date
WO1999051069A2 (en) 1999-10-07
WO1999051069A3 (en) 1999-12-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase