US1601642A - Apparatus for the electrodeposition of metals on wire or narrow strip - Google Patents

Apparatus for the electrodeposition of metals on wire or narrow strip Download PDF

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Publication number
US1601642A
US1601642A US95961A US9596126A US1601642A US 1601642 A US1601642 A US 1601642A US 95961 A US95961 A US 95961A US 9596126 A US9596126 A US 9596126A US 1601642 A US1601642 A US 1601642A
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Prior art keywords
tank
wire
convolutions
bundle
shaft
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Expired - Lifetime
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US95961A
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English (en)
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Parker Joseph Arthur
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C47/00—Winding-up, coiling or winding-off metal wire, metal band or other flexible metal material characterised by features relevant to metal processing only
    • B21C47/26—Special arrangements with regard to simultaneous or subsequent treatment of the material
    • B21C47/265—"helicofil" systems

Definitions

  • This invention relates to a-process and apparatus for the electro-depositionof metals on wire and narrow'strip, hereinafter termed wlre.
  • a coiled bundle of wire is well known in commerce and will be hereinafter referred to as a bundle, the wire being wound into a bundle as it leaves the draw plate.
  • an unplated bundle of wire while still coiled and with its convolutions spread apart is .passed through the solution contained in a plating tank from the one" end of said tank to the other and thebundle," while being so passed through the tank, is slowly revolved substantially' about its own axis, the convolutions being gathered in after lating and the plated bundle is collected eyond the other end of the tank.
  • the process therefore starts .with an unplated bundle of Wire and finishes with, a plated bundle of wire, without any uncoiling of the wire.
  • the wire treated is in continuously coiled condition; and, when one bundle has been passed through the tank, one end of a further bundle can be "connected up to the trailing end of the first bundle so as to make the two bundles a continuous coiled length, in order that the process of plating can continue in respect to bundle aften bundle; r
  • the apparatus comprises a horizontally disposed revoluble main shaft adapted to have a bundle of wire hungthereonand along which the opened out convolutions are caused to pass by the revolution; of the shaft.
  • This shaft is arranged over the plating tank, and from it hang the bundles and the separated convolutions, as Well as the bundles outside the tank and the convolutions being treated within the tank-
  • the revolution of the shaft may alone' be depended upon for causing the opened out CgggOllltlODS topass through the plating t O V ⁇ i i ass I only may be used.
  • An electro-deposition unit preferably comprises a tank containing hydrochloric acid or other cleaning liquid, a swill tank containing water, a sulphuric acid tank, a plat- 1 ing tank, a washing tank, and a drying tank, all arranged in succession below the revoluble main shaft, and the opened ,out
  • the apparatus according to the invention also contemplates a certain arrangement of anodes in the platin tank, and utilizes the main shaft as a catode connection.
  • Fig. 1 is a longitudinal section of an electroplating unit embodying the invention.
  • 1*ig. 2 isa plan View of the apparatus shown in Fig. 1.
  • Fig; 3 is a transverse section on the line A' B, Fig. l. 7
  • Figs. 4 and 5 are detail sectional views, on a larger scale, showinghow the anodes are 'appliedto the interior of the plating tank.
  • Fig. 6 is a diagrammatic view showing how the convolutions are agitated or'rocked in addition to bein revolved.
  • the tank a contains hydrochloric acid or othercleaningdiquid, the tank 0 swill water, the tank 0? sulphuricacid, the tank e electroplating solution, and the tan-kf washing liquid, while 9 is a drying tank.
  • a plating tank his a revoluble main shaft arranged above the tanks and having its ends extending .beyond the ends of the outer tanks and having atone end a spool 21 upon whicha bundle of wire to be treated may be-hung and at its other end with a spool j upon which the treated convolutions 0 wire. are collected.
  • This shaft may be revolved'from the pul l'ey 3
  • An unplated bundle of wire ishun'g upon the spool 21 between the end plates 2? and i and one of its ends is manually threaded through the machine with the convolutions spread apart, so that said convolutions successively pass into and out of the respective tanks while hanging from the shaft h, one or two of said convolutions being ultimately started to wind up into a bundle on the ,outgoing spool j, 'lhis movement or passage of the wire through the tanks is elearly indicated by dotted lines in Fig. 2.
  • That part of the shaft 71', which extends above the plating tank is formed with spaced flanges h forming grooves 72. to guide the convolutions and keep them apart, since in this tank they must be kept separate and clear of thean'odes, which are arranged within the tank as hereinafter described.
  • the revolution of the shaft h is depended upon to revolve the wire convolutions about their own axes, and also to feed thewire convolutions through the tanks.
  • the electro plating tank 6 may be provided ,with any convenient form of anodes,
  • buP preferably, and as shown in the drawings, same are in the form of plates extending transversely across the tank from side -to side of the latter, so that each convolution of wire passes between two transverse stretches of anode plates.
  • m (Fig. 3) represents a transverse stretch of anode plates built upv of four separate plates, m m mfland m, having their 0p posite vertical edges seated in grooves 00. in the sides of the tank and in grooves 0 in a central support p fixed within the tank below the shaft h.
  • the lower anode plates, m and m rest upon bearers g at the bottom of thetank, and these plates are separated from the upper plates m and m by nonconductive glass or other insulating sleeves 1'.
  • each of the upper glass tubes 8 is applied to a rod supported at one of its ends by a clip 8 carried by the upper edge of one of the anode plates and by engagement of its other end in the groove in the support 2.
  • a device '1 serves to hammer out any kinks or bends in the wire convolutions as they leave thein-going spool 11 and before they reach the tanks.
  • This device comprises a bell cranked lever 11 a stationary anvil '0 teeth 02* formed on the side plate i of the spool-z, and a lever 11 hanging from. the support Z
  • the teeth 0* will rock one arm of the bell cranked lever '0 and cause the other arm of the said lever to give a swinging blow to the lever 42 against the anvil '0 between which anvil 'v and lever '0 the convolutions are guided,
  • Fig. 6 the shaft 11. is shown as carrying Spindles are supported upon a frame '9 from a supporting bar 10, and as the shaft h revolves it causes the radial arms 7 and 8 to give intermittent blows to the convolutions of wire :0 on both sides of the shaft it, so that the convolutions, in addition to re volving, are agitated or rocked on the shaft as fulcra.
  • a device of any suitable construction may be placed in front of the in-going tank to true up said convolutions.
  • Apparatus for electro-plating" a coiled bundle of wire comprising a tank to contain plating solution, means for passin the. opened out convolutions of a bundle 0 wire through the tank from one end to the other and revolving the bundle of wire substan tially about its own axis, plate' anodes extending transversely of the plating tank and spaced apart and between which each con volution of wire passes in its travel through said tank, means for preventing the convolutions of wire touching the anode plates, anode connections to said plates and cathode connections to the wire to be treated, substantially as described.
  • Apparatus for electro-plating a coiled bundle of wire comprising a tank to contain plating solution, means for passing the opened out convolutions of the bundle through the tank from one end to the other and revolving the entire bundle substantially about its own axis, a series of spaced anode plates extending transversely of the plating tank and between which each convolutionpasses, each of'said plates comprising a plurality of members electrically connected and arranged edgewise with their ad jacent edges separated, means associated with each anode plate for preventing the convolutions of wire touching the anode plates and suitable electrical connections to said anode plates and to said wire, substantially as described.
  • Apparatus for electro-plating a coiled bundle of wire comprisi'n a tank to contain plating solution, a revolu 1e shaft arranged over the tank to extend through and sup ort' the convolutions of a bundle of wire an revolve said convolutions about the axis of the bundle, said shaft having means for feeding said convolutions through the tank, means for spreading the convolutions of the 'wire, a supportextending from one end to the other, and longitudinally of the tank below the shaft, a succession of spaced series of anode plates disposed transversely of the tank and between which eachconvolution passes, the
  • Apparatus for electro-plating a coiled bundle of wire comprising a tank to contain plating solution, means for passing the opened out convolutions of the bundle through the solution of the tank from one end to the other and revolving the entire bundle substantially about its own axis, plate anodes spaced apart and extending transversely of the tank and between which each convolution passes, means for preventing the convolutions of wire touching the anode plates, means for agitating the convolutions within the tank, and electrical connections to the anode plates and to the bundle of wire, substantially as described.
  • Apparatus for electro-plating a coiled bundle of wire comprising a tank to contain plating solution, a revoluble shaft arranged over the tank to extend through and support the convolutions of a bundle of wire, means for opening out the convolutions 'ol thebundle, means associated with said shaft for feeding the convolutions through the tank from the one end to the other, means for agitating the convolutions within the'so lution from the shaft as a fulcrum, a support extending longitudinally of the tank below the shaft, a succession of spaced se ries of anode plates-extending transversely of the tank and between which each convo lution passes in its movement through the tank, the plates of each series being removably sup orted between the longitudinal sides of t e tank and said longitudinal support, means for preventing the convolutions of wire touchingthe-anodeplates and electrical connections to the anode plates and to the shaft, substantia1l as described.
  • Apparatus for electro-plating a coiled bundle of wire comfiprising a plurality of erent solutions, means for passing the opened out convolutions of a bundle of wire through said tanks from one end to the other of said tanks, means for revolving said bundle substantially about its own axis, plate anodes spaced apart and extending transversely of one of said tanks so that each convolution passes successively between adjacent plate anodes, means for preventing the convolutions of wire touching the anode plates and suitable electrical connections to said anode plates and to the bundle of wire, substantially as described.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Wire Processing (AREA)
US95961A 1925-05-23 1926-03-19 Apparatus for the electrodeposition of metals on wire or narrow strip Expired - Lifetime US1601642A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB13490/25A GB254067A (en) 1925-05-23 1925-05-23 Improved process and apparatus for the electro-deposition of metals on wire or narrow strip

Publications (1)

Publication Number Publication Date
US1601642A true US1601642A (en) 1926-09-28

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US95961A Expired - Lifetime US1601642A (en) 1925-05-23 1926-03-19 Apparatus for the electrodeposition of metals on wire or narrow strip

Country Status (5)

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US (1) US1601642A (fr)
BE (1) BE333311A (fr)
DE (1) DE452369C (fr)
FR (1) FR615849A (fr)
GB (1) GB254067A (fr)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2495695A (en) * 1944-05-08 1950-01-31 Kenmore Metals Corp Electroplating apparatus
US2680710A (en) * 1950-09-14 1954-06-08 Kenmore Metal Corp Method and apparatus for continuously electroplating heavy wire and similar strip material
US2748784A (en) * 1952-10-29 1956-06-05 Nat Standard Co Bath structure for treating wire in the form of a helical coil
US2762763A (en) * 1951-07-13 1956-09-11 Nat Standard Co Process and apparatus for simultaneously drawing and plating wire
US3073773A (en) * 1957-12-05 1963-01-15 Nat Standard Co Electrolytic plating
US3109783A (en) * 1958-11-20 1963-11-05 Nat Standard Co Electrolytic plating
US20020119286A1 (en) * 2000-02-17 2002-08-29 Liang-Yuh Chen Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7014538B2 (en) 1999-05-03 2006-03-21 Applied Materials, Inc. Article for polishing semiconductor substrates
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20070096315A1 (en) * 2005-11-01 2007-05-03 Applied Materials, Inc. Ball contact cover for copper loss reduction and spike reduction
US7278911B2 (en) 2000-02-17 2007-10-09 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2495695A (en) * 1944-05-08 1950-01-31 Kenmore Metals Corp Electroplating apparatus
US2680710A (en) * 1950-09-14 1954-06-08 Kenmore Metal Corp Method and apparatus for continuously electroplating heavy wire and similar strip material
US2762763A (en) * 1951-07-13 1956-09-11 Nat Standard Co Process and apparatus for simultaneously drawing and plating wire
US2748784A (en) * 1952-10-29 1956-06-05 Nat Standard Co Bath structure for treating wire in the form of a helical coil
US3073773A (en) * 1957-12-05 1963-01-15 Nat Standard Co Electrolytic plating
US3109783A (en) * 1958-11-20 1963-11-05 Nat Standard Co Electrolytic plating
US7014538B2 (en) 1999-05-03 2006-03-21 Applied Materials, Inc. Article for polishing semiconductor substrates
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7344431B2 (en) 2000-02-17 2008-03-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US20060148381A1 (en) * 2000-02-17 2006-07-06 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US20020119286A1 (en) * 2000-02-17 2002-08-29 Liang-Yuh Chen Conductive polishing article for electrochemical mechanical polishing
US7137868B2 (en) 2000-02-17 2006-11-21 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7569134B2 (en) 2000-02-17 2009-08-04 Applied Materials, Inc. Contacts for electrochemical processing
US7207878B2 (en) 2000-02-17 2007-04-24 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6988942B2 (en) 2000-02-17 2006-01-24 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7278911B2 (en) 2000-02-17 2007-10-09 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7285036B2 (en) 2000-02-17 2007-10-23 Applied Materials, Inc. Pad assembly for electrochemical mechanical polishing
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7311592B2 (en) 2001-04-24 2007-12-25 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7446041B2 (en) 2004-09-14 2008-11-04 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20070096315A1 (en) * 2005-11-01 2007-05-03 Applied Materials, Inc. Ball contact cover for copper loss reduction and spike reduction

Also Published As

Publication number Publication date
FR615849A (fr) 1927-01-17
BE333311A (fr)
DE452369C (de) 1927-11-10
GB254067A (en) 1926-07-01

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