GB254067A - Improved process and apparatus for the electro-deposition of metals on wire or narrow strip - Google Patents
Improved process and apparatus for the electro-deposition of metals on wire or narrow stripInfo
- Publication number
- GB254067A GB254067A GB13490/25A GB1349025A GB254067A GB 254067 A GB254067 A GB 254067A GB 13490/25 A GB13490/25 A GB 13490/25A GB 1349025 A GB1349025 A GB 1349025A GB 254067 A GB254067 A GB 254067A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wire
- electro
- metals
- deposition
- improved process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C47/00—Winding-up, coiling or winding-off metal wire, metal band or other flexible metal material characterised by features relevant to metal processing only
- B21C47/26—Special arrangements with regard to simultaneous or subsequent treatment of the material
- B21C47/265—"helicofil" systems
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Wire Processing (AREA)
Abstract
254,067. Parker, J. A. May 23,1925. Straightening. - A device for straightening kinks in the convolutions of a coil of wire before they enter an electroplating tank comprises teeth v<4> on one side plate i<3> of a spool i on which the coil is mounted. As the shaft h rotates to feed the wire, the teeth v<4> actuate a bell-crank lever v<2> so as to give a swinging blow to a lever v<5> against an anvil v<3> over which the wire passes.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE333311D BE333311A (en) | 1925-05-23 | ||
GB13490/25A GB254067A (en) | 1925-05-23 | 1925-05-23 | Improved process and apparatus for the electro-deposition of metals on wire or narrow strip |
US95961A US1601642A (en) | 1925-05-23 | 1926-03-19 | Apparatus for the electrodeposition of metals on wire or narrow strip |
DEP52516D DE452369C (en) | 1925-05-23 | 1926-03-24 | Device for the production of a metallic coating of wires |
FR615849D FR615849A (en) | 1925-05-23 | 1926-05-10 | Improved method and apparatus for electroplating metals on narrow metal wires or strips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB13490/25A GB254067A (en) | 1925-05-23 | 1925-05-23 | Improved process and apparatus for the electro-deposition of metals on wire or narrow strip |
Publications (1)
Publication Number | Publication Date |
---|---|
GB254067A true GB254067A (en) | 1926-07-01 |
Family
ID=10023901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB13490/25A Expired GB254067A (en) | 1925-05-23 | 1925-05-23 | Improved process and apparatus for the electro-deposition of metals on wire or narrow strip |
Country Status (5)
Country | Link |
---|---|
US (1) | US1601642A (en) |
BE (1) | BE333311A (en) |
DE (1) | DE452369C (en) |
FR (1) | FR615849A (en) |
GB (1) | GB254067A (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2495695A (en) * | 1944-05-08 | 1950-01-31 | Kenmore Metals Corp | Electroplating apparatus |
US2680710A (en) * | 1950-09-14 | 1954-06-08 | Kenmore Metal Corp | Method and apparatus for continuously electroplating heavy wire and similar strip material |
BE512758A (en) * | 1951-07-13 | |||
BE523457A (en) * | 1952-10-29 | |||
US3073773A (en) * | 1957-12-05 | 1963-01-15 | Nat Standard Co | Electrolytic plating |
US3109783A (en) * | 1958-11-20 | 1963-11-05 | Nat Standard Co | Electrolytic plating |
KR20010020807A (en) | 1999-05-03 | 2001-03-15 | 조셉 제이. 스위니 | Pre-conditioning fixed abrasive articles |
US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
US7066800B2 (en) * | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
US6962524B2 (en) | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6991528B2 (en) | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7029365B2 (en) | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7303662B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7344432B2 (en) | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
US7137879B2 (en) | 2001-04-24 | 2006-11-21 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7084064B2 (en) | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
US20070096315A1 (en) * | 2005-11-01 | 2007-05-03 | Applied Materials, Inc. | Ball contact cover for copper loss reduction and spike reduction |
-
0
- BE BE333311D patent/BE333311A/xx unknown
-
1925
- 1925-05-23 GB GB13490/25A patent/GB254067A/en not_active Expired
-
1926
- 1926-03-19 US US95961A patent/US1601642A/en not_active Expired - Lifetime
- 1926-03-24 DE DEP52516D patent/DE452369C/en not_active Expired
- 1926-05-10 FR FR615849D patent/FR615849A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR615849A (en) | 1927-01-17 |
BE333311A (en) | |
DE452369C (en) | 1927-11-10 |
US1601642A (en) | 1926-09-28 |
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