TWM657030U

TWM657030U - Circuit board

Info

Publication number: TWM657030U
Application number: TW113200645U
Authority: TW
Inventors: 王洵隆
Original assignee: 佶昇興業股份有限公司
Filing date: 2024-01-18
Publication date: 2024-06-21

Abstract

一種電路板，其主要係於絕緣基板的一側面或兩側面印刷形成圖案化的導電油墨線路層，再覆設線路保護層，當絕緣基板的兩側面皆具有導電油墨線路層時，於絕緣基板預設貫通孔中填設導電膠體電性連接兩導電油墨線路層，藉此電路板整體的組成構造，使電路板之製造時能有效地簡化製程步驟，縮短製程時間及降低製造成本，同時也能符合環境保護、節能減碳等ESG的規範。A circuit board is mainly formed by printing a patterned conductive ink circuit layer on one side or both sides of an insulating substrate, and then covering it with a circuit protection layer. When both sides of the insulating substrate have conductive ink circuit layers, a conductive gel is filled in a preset through hole of the insulating substrate to electrically connect the two conductive ink circuit layers. With this overall structure of the circuit board, the manufacturing process steps of the circuit board can be effectively simplified, the process time can be shortened, and the manufacturing cost can be reduced. At the same time, it can also meet the ESG standards such as environmental protection, energy saving and carbon reduction.

Description

電路板Circuit board

本新型係關於一種電路板，尤指一種能簡化製程步驟且能符合節能減碳規範之電路板結構。 This novel invention relates to a circuit board, in particular to a circuit board structure that can simplify the manufacturing process and meet energy-saving and carbon-reduction standards.

因應氣候變遷等問題，各國政府已將淨零碳排作為重要的施政目標，電路板產業在朝向高值化發展的同時，基於ESG(「環境保護(Environment)」、「社會責任(Social)」與「公司治理(Governance)」)的永續發展，業者必須朝綠能、循環經濟轉型，積極的導入減碳思維，方能維持產業競爭力。因此，如何面對節能減碳時可能產生的種種難題，為現階段電路板研發中重要的課題。 In response to climate change and other issues, governments around the world have made net zero carbon emissions an important policy goal. While the circuit board industry is moving towards high value development, based on the sustainable development of ESG (Environment, Social Responsibility and Governance), the industry must transform towards green energy and circular economy and actively introduce carbon reduction thinking in order to maintain industry competitiveness. Therefore, how to deal with the various difficulties that may arise when saving energy and reducing carbon emissions is an important topic in the current stage of circuit board research and development.

一般而言，現有電路板的組成構造，其係於絕緣基板一側面或兩側面設有圖案化的線路層，藉由線路層提供多個電子元件分別焊接而電性連接，以構成具有特定功能的電子裝置。 Generally speaking, the structure of existing circuit boards is to provide a patterned circuit layer on one or both sides of an insulating substrate, and to provide multiple electronic components to be soldered and electrically connected through the circuit layer to form an electronic device with specific functions.

在現有電路板製程中，為了形成圖案化線路先於絕緣基板表面壓合一銅箔，經蝕刻方式銅箔形成圖案化的線路，再進行表面清潔等繁瑣步驟。當電路板為雙側面具有線路層時，為使絕緣基板雙側面之線路層能電性連接，還需在絕緣基板的兩側面形成線路層後，以雷射或其他鑽孔機械在絕緣基板上鑽設孔洞，再以電鍍方式使孔洞中形成連接兩側面線路層的導電體，再進行表面清潔等步驟，由於壓合銅箔再於銅箔上蝕刻形成線路之製程步驟繁瑣、費時費工，且電鍍方式形成導電體之製程步驟十分費時、耗電，碳排放量大，且產生廢水量大，須使廢水處理設備去除廢水中的有害物質等，以致現有電路板存在製程時間長，製造成本高及不符合節能減碳等問題。 In the existing circuit board manufacturing process, in order to form a patterned circuit, a copper foil is first pressed on the surface of the insulating substrate, and the copper foil is etched to form a patterned circuit, and then the surface is cleaned. When the circuit board has a circuit layer on both sides, in order to make the circuit layers on both sides of the insulating substrate electrically connected, it is necessary to form holes on the insulating substrate with a laser or other drilling machine after the circuit layers are formed on both sides of the insulating substrate, and then form a conductor connecting the circuit layers on both sides in the hole by electroplating, and then perform surface cleaning and other steps. The process of etching the copper foil to form the circuit is cumbersome, time-consuming and labor-intensive, and the process of forming the conductor by electroplating is very time-consuming, power-consuming, and has a large carbon emission. It also produces a large amount of wastewater, and wastewater treatment equipment is required to remove harmful substances in the wastewater. As a result, the existing circuit boards have problems such as long process time, high manufacturing cost, and non-compliance with energy conservation and carbon reduction.

本新型之目的在於提供一種電路板，用以解決現有電路板製造流程步驟繁瑣、費時費工、成本高及不符合節能減碳等問題。 The purpose of this new model is to provide a circuit board to solve the problems of the existing circuit board manufacturing process, which is complicated, time-consuming, labor-intensive, costly, and not in line with energy conservation and carbon reduction.

為了達成前述目的，本新型提出一種電路板，其包括：一絕緣基板；一導電油墨線路層，其係以導電油墨印刷成形於該絕緣基板的一側面，並形成圖案化線路，以及形成多數個焊墊分布在該圖案化線路中之預定位置；以及一絕緣材質的線路保護層，其係形成於該絕緣基板及該導電油墨線路層的表面，所述導電油墨線路層中之所述焊墊顯露於該線路保護層外。 In order to achieve the above-mentioned purpose, the present invention proposes a circuit board, which includes: an insulating substrate; a conductive ink circuit layer, which is printed on one side of the insulating substrate with conductive ink to form a patterned circuit, and a plurality of solder pads are distributed at predetermined positions in the patterned circuit; and a circuit protection layer of insulating material, which is formed on the surface of the insulating substrate and the conductive ink circuit layer, and the solder pads in the conductive ink circuit layer are exposed outside the circuit protection layer.

為了達成前述目的，本新型提出之另一種電路板，其包括：一絕緣基板，其多個預定位置各具有一貫穿的貫通孔；多數導電膠體，其係分別填設於該絕緣基板之每一所述貫通孔中；二導電油墨線路層，其係分別以導電油墨印刷成形於該絕緣基板的相對兩側面，並形成圖案化線路，以及形成多數個焊墊分布在該圖案化線路中之預定位置，該二導電油墨線路層在對應該絕緣基板之每一所述貫通孔位置各形成一導通墊，二所述導電油墨線路層相對應位置之導通墊分別電性連接所述導電膠體的兩端，該二導電油墨線路層之間通過所述導電膠體電性連接；以及二絕緣材質的線路保護層，其係分別形成於該絕緣基板的兩側面及該二導電油墨線路層的表面，所述導電油墨線路層中之焊墊顯露於所述線路保護層外，所述導通墊被覆蓋於所述所述線路保護層。 In order to achieve the above-mentioned purpose, another circuit board proposed in the present invention comprises: an insulating substrate, each of which has a through hole at a plurality of predetermined positions; a plurality of conductive colloids, which are respectively filled in each of the through holes of the insulating substrate; two conductive ink circuit layers, which are respectively printed with conductive ink on the opposite sides of the insulating substrate to form a patterned circuit, and a plurality of solder pads are distributed at predetermined positions in the patterned circuit, and the two conductive ink circuit layers are respectively printed with conductive ink on the insulating substrate. A conductive pad is formed at each through hole position, and the conductive pads at the corresponding positions of the two conductive ink circuit layers are electrically connected to the two ends of the conductive gel respectively, and the two conductive ink circuit layers are electrically connected through the conductive gel; and two circuit protection layers of insulating materials are formed on the two side surfaces of the insulating substrate and the surfaces of the two conductive ink circuit layers respectively, the solder pads in the conductive ink circuit layers are exposed outside the circuit protection layers, and the conductive pads are covered by the circuit protection layers.

為了達成前述目的，本新型提出之另一種電路板，其包括：一絕緣基板，其多個預定位置各具有一貫穿的貫通孔；二導電油墨線路層，其係分別以導電油墨印刷成形於該絕緣基板的相對兩側面，並形成圖案化線路，以及形成多數個焊墊分布在該圖案化線路中之預定位置，並在每一所述貫通孔的周緣分別形成一導通墊；二絕緣材質的線路保護層，其係分別形成於該絕緣基板的兩側面及二所述導電油墨線路層的表面，二所述導電油墨線路層中之所述焊墊及所述導通墊皆顯露於所述線路保護層外；多數導電膠體，其係分別填設於該絕緣基板之每一所述貫通孔中，且每一所述導電膠體兩端分別連接二所述導電油墨線路層相對應位置之所述導電墊。 In order to achieve the above-mentioned purpose, the present invention proposes another circuit board, which includes: An insulating substrate, each of which has a through hole at a plurality of predetermined positions; two conductive ink circuit layers, which are respectively printed with conductive ink on the opposite sides of the insulating substrate to form a patterned circuit, and a plurality of solder pads are distributed at predetermined positions in the patterned circuit, and a conductive pad is formed around each of the through holes; two insulating The circuit protection layer of the insulating material is formed on the two side surfaces of the insulating substrate and the surface of the two conductive ink circuit layers, and the solder pads and the conductive pads in the two conductive ink circuit layers are exposed outside the circuit protection layer; a plurality of conductive gels are filled in each of the through holes of the insulating substrate, and the two ends of each conductive gel are connected to the conductive pads at the corresponding positions of the two conductive ink circuit layers.

藉由前述電路板之整體組成構造，其主要係於絕緣基板的一側面或兩側面印刷形成圖案化的導電油墨線路層，再覆設線路保護層，當絕緣基板兩側面具有導電油墨線路層時，於絕緣基板預設貫通孔中填設導電膠體，以電性連接兩導電油墨線路層，藉此使電路板之製造，能有效地簡化製程步驟，縮短製程時間及降低製造成本，同時也能符合環境保護、節能減碳等ESG的規範。 The overall structure of the circuit board is mainly to print a patterned conductive ink circuit layer on one or both sides of the insulating substrate, and then cover it with a circuit protection layer. When the insulating substrate has conductive ink circuit layers on both sides, a conductive gel is filled in the preset through hole of the insulating substrate to electrically connect the two conductive ink circuit layers. In this way, the manufacturing of the circuit board can effectively simplify the process steps, shorten the process time and reduce the manufacturing cost, and at the same time meet the ESG standards such as environmental protection, energy saving and carbon reduction.

10:絕緣基板 10: Insulating substrate

101:鎖固孔 101: Locking hole

102:貫通孔 102:Through hole

11:導電油墨線路層 11: Conductive ink circuit layer

110:圖案化線路 110: Patterned circuit

111:焊墊 111: Solder pad

11A:導電油墨線路層 11A: Conductive ink circuit layer

110A:圖案化線路 110A: Patterned circuit

111A:焊墊 111A: Solder pad

112A:導通墊 112A: Conductive pad

11B:導電油墨線路層 11B: Conductive ink circuit layer

110B:圖案化線路 110B: Patterned circuit

112B:導通墊 112B: Conductive pad

12:線路保護層 12: Circuit protection layer

12A:線路保護層 12A: Circuit protection layer

12B:線路保護層 12B: Line protection layer

13:導電膠體 13: Conductive colloid

圖1係本新型電路板呈單面線路型電路板之一實施例的平面示意圖。 Figure 1 is a schematic plan view of an embodiment of the new circuit board as a single-sided circuit board.

圖2係圖1所示電路板實施例的製造流程圖。 FIG2 is a manufacturing flow chart of the circuit board embodiment shown in FIG1.

圖3係本新型電路板呈雙面線路型電路板之一實施例的平面示意圖。 Figure 3 is a schematic plan view of an embodiment of the new circuit board as a double-sided circuit board.

圖4係圖3所示電路板實施例的製造流程圖。 FIG4 is a manufacturing flow chart of the circuit board embodiment shown in FIG3.

圖5係圖3所示電路板實施例的另一製造流程圖。 FIG5 is another manufacturing flow chart of the circuit board embodiment shown in FIG3.

圖6係本新型電路板呈雙面線路型電路板之另一實施例的平面示意圖。 Figure 6 is a schematic plan view of another embodiment of the new circuit board as a double-sided circuit board.

圖7係圖6所示電路板實施例的製造流程圖。 FIG7 is a manufacturing flow chart of the circuit board embodiment shown in FIG6.

圖8係圖6所示電路板實施例的另一製造流程圖。 FIG8 is another manufacturing flow chart of the circuit board embodiment shown in FIG6.

如圖1、圖3及圖6所示，其揭示本新型電路板之三種實施例，其中，圖1揭示的電路板為單面線路型電路板實施例，圖3、圖6揭示之電路板則為雙面線路型電路板實施例。以下分別對本新型之電路板各實施例提出說明。 As shown in Figures 1, 3 and 6, three embodiments of the new circuit board are disclosed. The circuit board disclosed in Figure 1 is a single-sided circuit board embodiment, and the circuit boards disclosed in Figures 3 and 6 are double-sided circuit board embodiments. The following describes each embodiment of the new circuit board.

如圖1所示之實施例，該電路板包括一絕緣基板10、一導電油墨線路層11以及一線路保護層12，該絕緣基板10係絕緣材質的板材製成的板體，亦即是無覆蓋銅箔的絕緣基板，並依據實際產品的需求裁切成預定的尺寸形狀。該導電油墨線路層11係導電油墨印刷成形於絕緣基板10的一側面並具有電性傳遞之性能，所述導電油墨係指包含有金粒子、銀粒子、銅粒子等導電粒子，或石墨等其他具有導電粒子的油墨，該導電油墨線路層11係形成圖案化線路110，並形成多數個焊墊111分布在圖案化線路110中之預定位置。該線路保護層12係絕緣材質形成於絕緣基板10及導電油墨線路層11的表面，所述導電油墨線路層11中之焊墊111顯露於該線路保護層12外。 As shown in the embodiment of FIG. 1 , the circuit board includes an insulating substrate 10, a conductive ink circuit layer 11, and a circuit protection layer 12. The insulating substrate 10 is a plate made of a plate material, that is, an insulating substrate without a copper foil covering, and is cut into a predetermined size and shape according to the requirements of the actual product. The conductive ink circuit layer 11 is formed by printing conductive ink on one side of the insulating substrate 10 and has the performance of electrical transmission. The conductive ink refers to conductive particles such as gold particles, silver particles, copper particles, or other conductive particles such as graphite. The conductive ink circuit layer 11 forms a patterned circuit 110 and forms a plurality of pads 111 distributed at predetermined positions in the patterned circuit 110. The circuit protection layer 12 is an insulating material formed on the surface of the insulating substrate 10 and the conductive ink circuit layer 11, and the pads 111 in the conductive ink circuit layer 11 are exposed outside the circuit protection layer 12.

如圖2所示，藉由前述電路板之整體組成構造設計，其能以如下所述製程方法予以實現，其係提供裁切成預定形狀尺寸的絕緣基板10，並在絕緣基板10中預定位置鑽設鎖固孔101，其次，以導電油墨於絕緣基板10一側面表面印刷形成具有圖案化線路110之一導電油墨線路層11，所述導電油墨線路層11中包括有多個焊墊111，之後，在印刷形成有導電油墨線路層11的絕緣基板10表面覆設一線路保護層12，再經電性測試後，即為單面線路型電路板。 As shown in FIG. 2 , the overall structure design of the aforementioned circuit board can be realized by the following process method, which is to provide an insulating substrate 10 cut into a predetermined shape and size, and drill a locking hole 101 at a predetermined position in the insulating substrate 10. Next, a conductive ink circuit layer 11 having a patterned circuit 110 is printed on one side surface of the insulating substrate 10 with conductive ink. The conductive ink circuit layer 11 includes a plurality of pads 111. After that, a circuit protection layer 12 is covered on the surface of the insulating substrate 10 on which the conductive ink circuit layer 11 is printed. After electrical testing, a single-sided circuit type circuit board is obtained.

如圖3所示之實施例，該電路板包括一絕緣基板10、多數導電膠體13、二導電油墨線路層11A、11B以及二線路保護層12A、12B，該絕緣基板10係絕緣材質的板材製成的板體，並依據實際產品的需求裁切成預定的尺寸形狀，該絕緣基板10中之多個預定位置各具有貫穿絕緣基板10的一貫通孔102，該多數導電膠體13分別印刷填設於絕緣基板10之所述貫通孔102中，所述導電膠體13係包括有多數金粒子、銀粒子、銅粒子等導電粒子，或石墨等其他具有導電粒子的膠體，該二導電油墨線路層11A、11B係以導電油墨印刷成形於絕緣基板10的相對兩側面並具有電性傳遞之性能，所述導電油墨係指包含有多數金粒子、銀粒子、銅粒子等導電粒子，或石墨等其他具有導電物質的油墨，該二導電油墨線路層11A、11B係形成圖案化線路110A、110B，並在一所述圖案化線路110A中預定位置分布形成多數個焊墊111A，並在對應絕緣基板10之每一所述貫通孔102位置各形成一導通墊112A、112B，且二所述導電油墨線路層11相對應位置之導通墊112A、112B分別電性連接所述導電膠體13兩端，使該二導電油墨線路層11A、11B之間通過所述導電膠體13電性連接。該二線路保護層12A、12B係絕緣材質形成於絕緣基板10及導電油墨線路層11A、11B的表面，所述導電油墨線路層11A、11B中之導通墊112A、112B及導電膠體13皆被覆蓋於該線路保護層12A、12B內，所述導電油墨線路層11A中之焊墊111A顯露於該線路保護層12A外。 As shown in FIG. 3 , the circuit board includes an insulating substrate 10, a plurality of conductive colloids 13, two conductive ink circuit layers 11A, 11B, and two circuit protection layers 12A, 12B. The insulating substrate 10 is a plate made of an insulating material and is cut into a predetermined size and shape according to the actual product requirements. The plurality of predetermined positions in the insulating substrate 10 each have a through hole. A through hole 102 of the insulating substrate 10, wherein a plurality of conductive colloids 13 are respectively printed and filled in the through hole 102 of the insulating substrate 10, wherein the conductive colloids 13 include a plurality of conductive particles such as gold particles, silver particles, copper particles, or other colloids having conductive particles such as graphite, and the two conductive ink circuit layers 11A and 11B are formed on the insulating substrate by printing conductive ink. The conductive ink is an ink containing a plurality of conductive particles such as gold particles, silver particles, copper particles, or other conductive materials such as graphite. The two conductive ink circuit layers 11A and 11B form patterned circuits 110A and 110B, and a plurality of pads are distributed at predetermined positions in the patterned circuit 110A. 111A, and a conductive pad 112A, 112B is formed at each through hole 102 position corresponding to the insulating substrate 10, and the conductive pads 112A, 112B at the corresponding positions of the two conductive ink circuit layers 11 are respectively electrically connected to the two ends of the conductive gel 13, so that the two conductive ink circuit layers 11A, 11B are electrically connected through the conductive gel 13. The two circuit protection layers 12A and 12B are insulating materials formed on the surface of the insulating substrate 10 and the conductive ink circuit layers 11A and 11B. The conductive pads 112A and 112B and the conductive gel 13 in the conductive ink circuit layers 11A and 11B are all covered in the circuit protection layers 12A and 12B, and the solder pads 111A in the conductive ink circuit layer 11A are exposed outside the circuit protection layer 12A.

如圖4、圖5所示，藉由前述電路板之整體組成構造設計，其能以如下所述的製程方法予以實現，其係提供裁切成預定形狀尺寸的絕緣基板10，在絕緣基板10中預定位置鑽設多個鎖固孔101，再於絕緣基板10上以雷射或其他鑽孔機械在絕緣基板上之多個預定位置各鑽設一貫通孔102，如圖4所示，以導電膠印刷填設於絕緣基板之每一所述貫通孔102中形成導電膠體13，再去除每一導電膠體13凸出絕緣基板表面的部分，或如圖5所示，以導電膠印刷填設於絕緣基板之每一所述貫通孔102中形成導電膠體13，無須再進行導電膠整平的步驟，其次，以導電油墨在絕緣基板10的兩側面表面各印刷形成具有圖案化線路110之一導電油墨線路層11，所述圖案化線路110中具有多個焊墊111以及多個連接導電膠體13的導通墊112A、112B，之後，在印刷形成有導電油墨線路層11的絕緣基板10的兩側面表面各覆設一線路保護層12，再經電性測試後，即為雙面線路型電路板。 As shown in FIG. 4 and FIG. 5, the overall structure design of the circuit board can be realized by the following process method, which is to provide an insulating substrate 10 cut into a predetermined shape and size, drill a plurality of locking holes 101 at predetermined positions in the insulating substrate 10, and then drill a through hole 102 at each of the predetermined positions on the insulating substrate by laser or other drilling machinery on the insulating substrate 10, as shown in FIG. 4, fill each of the through holes 102 of the insulating substrate with conductive glue by printing to form a conductive glue 13, and then remove the portion of each conductive glue 13 protruding from the surface of the insulating substrate, or as shown in FIG. 5, fill each of the through holes 102 of the insulating substrate with conductive glue by printing to form a conductive glue 13, and then remove the portion of each conductive glue 13 protruding from the surface of the insulating substrate, or as shown in FIG. 5, fill each of the through holes 102 of the insulating substrate with conductive glue by printing to form a conductive glue 13, and then remove the portion of each conductive glue 13 protruding from the surface of the insulating substrate, and then ... The conductive glue 13 is formed in each through hole 102 of the insulating substrate by printing, and there is no need to perform the conductive glue leveling step. Next, a conductive ink circuit layer 11 having a patterned circuit 110 is printed on each of the two side surfaces of the insulating substrate 10 with conductive ink. The patterned circuit 110 has a plurality of pads 111 and a plurality of conductive pads 112A and 112B connected to the conductive glue 13. After that, a circuit protection layer 12 is respectively covered on each of the two side surfaces of the insulating substrate 10 having the conductive ink circuit layer 11 printed thereon. After electrical testing, a double-sided circuit board is obtained.

如圖6所示之實施例，該電路板包括一絕緣基板10、二導電油墨線路層11A、11B、多數導電膠體13以及二線路保護層12A、12B，該絕緣基板10係絕緣材質的板材製成的板體，並依據實際產品的需求裁切成預定的尺寸形狀，該絕緣基板10中之多個預定位置各具有貫穿絕緣基板的一貫通孔102，該二導電油墨線路層11A、11B係以導電油墨印刷成形於絕緣基板的相對兩側面並具有電性傳遞之性能，所述導電油墨係指包含有金粒子、銀粒子、銅粒子等導電粒子，或石墨等其他具有導電物質的油墨，該二導電油墨線路層11A、11B皆形成圖案化線路110A、110B，其一所述導電油墨線路層11A在所述圖案化線路110A中預定位置分布形成多數個焊墊111A，二所述導電油墨線路層11A、11B在對應絕緣基板10之每一所述貫通孔102位置的周緣各形成一導通墊112A、112B，每一所述導電膠體13分別填設於該絕緣基板之所述貫通孔102中且連接二所述導電油墨線路層11A、11B相對應位置之導通墊112A、112B，使該二導電油墨線路層11A、11B之間通過所述導電膠體13電性連接。該二線路保護層12A、12B係絕緣材質形成於絕緣基板10及導電油墨線路層11A、11B的表面，所述導電油墨線路層11A中之焊墊111A顯露於該線路保護層12A外。前述中，每一所述導電膠體13的兩端覆設於二所述導電油墨線路層11A、11B相對應位置之導通墊112A、112B的部分表面或全部表面而電性連接。 As shown in FIG. 6 , the circuit board includes an insulating substrate 10, two conductive ink circuit layers 11A, 11B, a plurality of conductive gels 13, and two circuit protection layers 12A, 12B. The insulating substrate 10 is a plate made of an insulating material and is cut into a predetermined size and shape according to the actual product requirements. The two conductive ink circuit layers 11A and 11B are formed by printing conductive ink on opposite sides of the insulating substrate and have electrical transmission performance. The conductive ink refers to ink containing conductive particles such as gold particles, silver particles, copper particles, or other conductive materials such as graphite. The two conductive ink circuit layers 11A and 11B both form patterned circuits 110A and 110B. One of the conductive ink circuit layers 11A is distributed at predetermined positions in the patterned circuit 110A to form a plurality of pads 111A. The two conductive ink circuit layers 11A and 11B are formed at the periphery of each through hole 102 of the insulating substrate 10. The conductive gel 13 is filled in the through hole 102 of the insulating substrate and connects the conductive gel 13 and the conductive gel 13 at the corresponding positions of the two conductive ink circuit layers 11A and 11B, so that the two conductive ink circuit layers 11A and 11B are electrically connected through the conductive gel 13. The two circuit protection layers 12A and 12B are insulating materials formed on the surface of the insulating substrate 10 and the conductive ink circuit layers 11A and 11B, and the pad 111A in the conductive ink circuit layer 11A is exposed outside the circuit protection layer 12A. In the above, the two ends of each of the conductive gels 13 are covered on part or all of the surfaces of the conductive pads 112A and 112B at the corresponding positions of the two conductive ink circuit layers 11A and 11B to be electrically connected.

藉由前述電路板之整體組成構造設計，其能以如下所述的製程方法予以實現，如圖7所示，其係提供裁切成預定形狀尺寸的絕緣基板10，在絕緣基板10中預定位置鑽設多個鎖固孔101，其次，以導電油墨在絕緣基板10的兩側面表面各印刷形成具有圖案化線路110A、110B之一導電油墨線路層11A、11B，其一所述導電油墨線路層11A於其圖案化線路110A中具有多個焊墊 111A，二所述導電油墨線路層11A、11B於其圖案化線路110A、110B中形成多個導通墊112A、112B，再於印刷形成有導電油墨線路層11A、11B的絕緣基板10的兩側面表面各覆設一線路保護層12A、12B，所述焊墊111A及所述導通墊112A、112B皆顯露於線路保護層12A、12B外，再於每一導通墊112A、112B之位置以雷射或其他鑽孔機械在絕緣基板10上鑽設貫通孔102，並以導電膠印刷填入每一貫通孔102中形成連接二導電油墨線路層11A、11B相對應位置之導通墊112A、112B之導電膠體13，再電性測試後，即為雙面線路型電路板。 The overall structure design of the circuit board can be realized by the following process method, as shown in FIG. 7, which is to provide an insulating substrate 10 cut into a predetermined shape and size, and drill a plurality of locking holes 101 at predetermined positions in the insulating substrate 10. Then, a conductive ink circuit layer 11A, 11B having patterned circuits 110A, 110B is printed on the two side surfaces of the insulating substrate 10 with conductive ink, wherein the first conductive ink circuit layer 11A has a plurality of solder pads 111A in the patterned circuit 110A, and the second conductive ink circuit layer 11A, 11B forms a plurality of conductive pads 112A in the patterned circuit 110A, 110B. , 112B, and then a circuit protection layer 12A, 12B is respectively formed on the two side surfaces of the insulating substrate 10 on which the conductive ink circuit layers 11A, 11B are printed, and the solder pads 111A and the conductive pads 112A, 112B are exposed outside the circuit protection layers 12A, 12B, and then each conductive pad 112A, 112 A through hole 102 is drilled on the insulating substrate 10 at position B by laser or other drilling machinery, and a conductive glue is printed to fill each through hole 102 to form a conductive glue 13 that connects the conductive pads 112A and 112B at the corresponding positions of the two conductive ink circuit layers 11A and 11B. After electrical testing, it becomes a double-sided circuit board.

如圖8所示，前述電路板之整體組成構造設計，也能以如下所述的製程方法予以實現，其係提供裁切成預定形狀尺寸的絕緣基板10，在絕緣基板10中預定位置以雷射或其他鑽孔機械鑽設多個鎖固孔101及多個貫通孔102，其次，以導電油墨在絕緣基板10的兩側面表面各印刷形成具有圖案化線路110A、110B之一導電油墨線路層11A、11B，其一所述導電油墨線路層11A於其圖案化線路110A中具有多個焊墊111A，二所述導電油墨線路層11A、11B於其圖案化線路110A、110B中對應該多個貫通孔102的位置分別形成導通墊112A、112B，再於印刷形成有導電油墨線路層11A、11B的絕緣基板10的兩側面表面各覆設一線路保護層12A、12B，所述焊墊111A、所述導通墊112A、112B及所述貫通孔102皆顯露於線路保護層12A、12B外，再以導電膠印刷填入每一貫通孔102中形成連接二導電油墨線路層11A、11B相對應位置之導通墊112A、112B之導電膠體13，再電性測試後，即為雙面線路型電路板。 As shown in FIG8 , the overall structure design of the circuit board can also be realized by the following process method, which is to provide an insulating substrate 10 cut into a predetermined shape and size, and to drill a plurality of locking holes 101 and a plurality of through holes 102 at predetermined positions in the insulating substrate 10 by laser or other drilling machinery. Next, a conductive ink circuit layer 11A, 11B having patterned circuits 110A, 110B is printed on the two side surfaces of the insulating substrate 10 with conductive ink, wherein the first conductive ink circuit layer 11A has a plurality of pads 111A in the patterned circuit 110A, and the second conductive ink circuit layer 11A, 11B has a plurality of pads 111A in the patterned circuit 110A. Conductive pads 112A and 112B are formed at positions corresponding to the plurality of through holes 102 in 10A and 110B, and then a circuit protection layer 12A and 12B are respectively covered on both sides of the insulating substrate 10 on which the conductive ink circuit layers 11A and 11B are printed. The solder pads 111A, the conductive pads 112A and 112B and the through holes 102 are all exposed outside the circuit protection layers 12A and 12B. Then, conductive glue is printed and filled into each through hole 102 to form a conductive glue 13 connecting the conductive pads 112A and 112B at corresponding positions of the two conductive ink circuit layers 11A and 11B. After electrical testing, a double-sided circuit board is obtained.

此外，本新型電路板的組成構創作，還可進一步利用雙面線路型電路板與單面線路型電路板的組合，搭配鑽設貫通孔和以導電膠印刷填入每一貫通孔中形成連接上、下二導電油墨線路層之導電膠體等，或是雙面線路型電路板與或雙面線路型電路板的組合，搭配鑽設貫通孔和以導電膠印刷填入每一貫通孔中形成連接上、下二導電油墨線路層之導電膠體等，以製成多層線路型電路板。 In addition, the composition and creation of the new circuit board can further utilize the combination of double-sided circuit board and single-sided circuit board, with drilling through holes and filling each through hole with conductive glue to form a conductive glue connecting the upper and lower conductive ink circuit layers, or the combination of double-sided circuit board and double-sided circuit board, with drilling through holes and filling each through hole with conductive glue to form a conductive glue connecting the upper and lower conductive ink circuit layers, to make a multi-layer circuit board.

藉由前述電路板各實施例之組成構造中可知，其主要係於絕緣基板的一側面或兩側面印刷形成圖案化的導電油墨線路層，再覆設線路保護層，當絕緣基板的兩側面具有導電油墨線路層時，於絕緣基板預設貫通孔中填設導電膠體，以電性連接兩導電油墨線路層，如此，使本新型電路板於製造時，藉由簡便的印刷導電油墨線路層方式等節能步驟，免除現有電路板電鍍形成線路層之耗能步驟等，使本新型電路板之製造能有效地簡化製程步驟，縮短製程時間、降低製造成本且能有效地節能減碳等，並也能符合環境保護和ESG的規範。 It can be seen from the composition structure of each embodiment of the circuit board described above that it is mainly to print a patterned conductive ink circuit layer on one side or both sides of the insulating substrate, and then cover it with a circuit protection layer. When the two sides of the insulating substrate have conductive ink circuit layers, a conductive gel is filled in the through hole preset in the insulating substrate to electrically connect the two conductive ink circuit layers. In this way, During the manufacturing process, the new circuit board can be manufactured by using simple energy-saving steps such as printing conductive ink circuit layers, eliminating the energy-consuming steps of electroplating circuit layers in existing circuit boards. This can effectively simplify the manufacturing process steps, shorten the process time, reduce manufacturing costs, and effectively save energy and reduce carbon emissions. It can also comply with environmental protection and ESG standards.

10:絕緣基板 10: Insulating substrate

101:鎖固孔 101: Locking hole

11:導電油墨線路層 11: Conductive ink circuit layer

110:圖案化線路 110: Patterned circuit

111:焊墊 111: Solder pad

12:線路保護層 12: Circuit protection layer

Claims

一種電路板，其包括：一絕緣基板；一導電油墨線路層，其係以導電油墨印刷成形於該絕緣基板的一側面，並形成圖案化線路，以及形成多數個焊墊分布在該圖案化線路中之預定位置；以及一絕緣材質的線路保護層，其係形成於該絕緣基板及該導電油墨線路層的表面，所述導電油墨線路層中之所述焊墊顯露於該線路保護層外。 A circuit board, comprising: an insulating substrate; a conductive ink circuit layer, which is formed by printing conductive ink on one side of the insulating substrate to form a patterned circuit, and a plurality of solder pads are distributed at predetermined positions in the patterned circuit; and a circuit protection layer of insulating material, which is formed on the surface of the insulating substrate and the conductive ink circuit layer, and the solder pads in the conductive ink circuit layer are exposed outside the circuit protection layer.

如請求項1所述之電路板，其中，所述導電油墨係包含多數金粒子、或銅粒子、或銀粒子或石墨粒子之油墨。A circuit board as described in claim 1, wherein the conductive ink is an ink containing a plurality of gold particles, or copper particles, or silver particles, or graphite particles.

一種電路板，其包括：一絕緣基板，其多個預定位置各具有一貫穿的貫通孔；多數導電膠體，其係分別填設於該絕緣基板之每一所述貫通孔中；二導電油墨線路層，其係分別以導電油墨印刷成形於該絕緣基板的相對兩側面並形成圖案化線路，其一所述導電油墨線路層形成多數個焊墊分布在該圖案化線路中之預定位置，該二導電油墨線路層在對應該絕緣基板之每一所述貫通孔位置各形成一導通墊，二所述導電油墨線路層相對應位置之導通墊分別電性連接所述導電膠體的兩端，該二導電油墨線路層之間通過所述導電膠體電性連接；以及二絕緣材質的線路保護層，其係分別形成於該絕緣基板的兩側面及該二導電油墨線路層的表面，所述導電油墨線路層中之焊墊顯露於所述線路保護層外，所述導通墊被覆蓋於所述所述線路保護層。 A circuit board, comprising: An insulating substrate, each of which has a through hole at a plurality of predetermined positions; A plurality of conductive gels, which are respectively filled in each of the through holes of the insulating substrate; Two conductive ink circuit layers, which are respectively printed with conductive ink on the opposite sides of the insulating substrate to form a patterned circuit, one of the conductive ink circuit layers forms a plurality of solder pads distributed at predetermined positions in the patterned circuit, and the second conductive ink circuit layer forms a conductive pad at each through hole position corresponding to the insulating substrate, and the conductive pads at the corresponding positions of the two conductive ink circuit layers are respectively electrically connected to the two ends of the conductive gel, and the two conductive ink circuit layers are electrically connected through the conductive gel; and Two circuit protection layers of insulating materials are formed on the two side surfaces of the insulating substrate and the surface of the two conductive ink circuit layers respectively. The solder pads in the conductive ink circuit layers are exposed outside the circuit protection layers, and the conductive pads are covered on the circuit protection layers.

如請求項3所述之電路板，其中，所述導電油墨係包含多數金粒子、或銅粒子、或銀粒子或石墨粒子之油墨。A circuit board as described in claim 3, wherein the conductive ink is an ink containing a plurality of gold particles, or copper particles, or silver particles, or graphite particles.

一種電路板，其包括：一絕緣基板，其多個預定位置各具有一貫穿的貫通孔；二導電油墨線路層，其係分別以導電油墨印刷成形於該絕緣基板的相對兩側面，並形成圖案化線路，其一所述導電油墨線路層形成多數個焊墊分布在該圖案化線路中之預定位置，二所述導電油墨線路層在每一所述貫通孔的周緣分別形成一導通墊；二絕緣材質的線路保護層，其係分別形成於該絕緣基板的兩側面及二所述導電油墨線路層的表面，二所述導電油墨線路層中之所述焊墊及所述導通墊皆顯露於所述線路保護層外；以及多數導電膠體，其係分別填設於該絕緣基板之每一所述貫通孔中，且每一所述導電膠體兩端分別連接二所述導電油墨線路層相對應位置之所述導電墊。 A circuit board, comprising: an insulating substrate, each of which has a through hole at a plurality of predetermined positions; two conductive ink circuit layers, which are respectively printed with conductive ink on the opposite sides of the insulating substrate to form a patterned circuit, wherein the first conductive ink circuit layer forms a plurality of solder pads distributed at predetermined positions in the patterned circuit, and the second conductive ink circuit layer forms a conductive pad around each of the through holes; two circuit protection layers of insulating material, which are respectively formed on the two sides of the insulating substrate and the surfaces of the second conductive ink circuit layers, and the solder pads and the conductive pads in the second conductive ink circuit layers are exposed outside the circuit protection layers; and A plurality of conductive gels are respectively filled in each of the through holes of the insulating substrate, and the two ends of each conductive gel are respectively connected to the conductive pads at corresponding positions of the two conductive ink circuit layers.

如請求項5所述之電路板，其中，所述導電油墨係包含多數金粒子、或銅粒子、或銀粒子或石墨粒子之油墨。A circuit board as described in claim 5, wherein the conductive ink is an ink containing a plurality of gold particles, or copper particles, or silver particles, or graphite particles.

如請求項5或6所述之電路板，其中，所述導電膠體兩端分別覆設二所述導電油墨線路層相對應位置之導電墊的部分表面或全部表面。A circuit board as described in claim 5 or 6, wherein the two ends of the conductive gel respectively cover part of the surface or the entire surface of the conductive pad at the corresponding position of the two conductive ink circuit layers.