TWM647607U

TWM647607U - Fixture and one-piece ring support column structure made therefrom

Info

Publication number: TWM647607U
Application number: TW112207550U
Authority: TW
Inventors: 熊惜文; 呂星星; 戴加福
Original assignee: 大陸商深圳興奇宏科技有限公司
Priority date: 2023-07-19
Filing date: 2023-07-19
Publication date: 2023-10-21

Abstract

一種治具，其由下至上依序包括載體、上蓋及粉末漏蓋，其中載體之每一模穴係供一銅柱置入，粉末可從粉末漏蓋通過上蓋填入模穴內，進而在銅柱外表面充填有一環狀之粉末圈；並經由加熱過程使兩者一起燒結，使該環狀之粉末圈變成一燒結環體與銅柱一體成型為一未有裝配間隙的一體式環體支撐柱結構。藉此以改善因過往技術或製程使二者存在裝配間隙而產生積水問題，造成銅柱與燒結環體因積水結冰產生膨脹、崩裂脫離柱體等缺失者。A fixture, which includes a carrier, an upper cover and a powder leakage cover in order from bottom to top. Each mold cavity of the carrier is for a copper pillar to be placed. Powder can be filled into the mold cavity from the powder leakage cover through the upper cover, and then in The outer surface of the copper pillar is filled with an annular powder ring; and the two are sintered together through a heating process, so that the annular powder ring becomes a sintered ring body and the copper pillar is integrally formed into an integrated ring body without assembly gaps. Support column structure. This is used to improve the problem of water accumulation caused by the assembly gap between the two due to previous technology or manufacturing processes, causing the copper pillar and sintered ring to expand, crack and separate from the pillar due to water accumulation and freezing.

Description

治具及其所製成之一體式環體支撐柱結構Fixture and the one-piece ring support column structure made therefrom

本創作有關於一種治具及其應用領域，特別是一種治具及其所製成之一體式環體支撐柱結構。The invention relates to a fixture and its application field, in particular to a fixture and a one-piece annular support column structure made of the fixture.

隨著科技產業快速的進步，電子產品的功能日益提升，造成在操作使用時也產生更多的熱量，倘若這些熱量無法及時散逸出去而累積於該電子產品內部的電子元件(如處理器)處，勢必因溫度過高而影響電子產品整體的運作效能，或導致電子元件的損燬。一般業界針對空間較狹窄或需要較大面積進行散熱之熱源所採用的散熱裝置通常選擇以均溫板作為導熱元件用以傳導熱源或均溫之用。習知均溫板由一上板蓋合於一下板並共同界定一密閉腔室，該密閉腔室呈真空狀態其內填充有一工作液體(如純水)，且該密閉腔室內還設有毛細結構及支撐柱，該等支撐柱的兩端分別抵接該密閉腔室內的上、下板內側。然而，一般或傳統的支撐柱係為一實心銅柱，其作用係僅提供支撐及防止均溫板產生熱膨脹（上、下板受熱向外膨脹產生鼓包或鼓脹）之功能，由於銅柱之外表面平滑，因此無法提供任何毛細力作用，使該蒸發冷凝後之工作流體僅能受重力作用或由冷凝區（上板）的毛細結構再緩回流至蒸發區（下板），其回流速度及過程過慢，易使蒸發區回水太慢產生乾燒，造成熱傳效率不佳。故業者便對該支撐柱進行改良，使其除具有支撐功效外，更能具有毛細力作用。該改良後支撐柱大致可分為兩種型態；其中一種支撐柱型態是由一般粉末直接燒結成形的燒結支撐柱型態，藉由燒結支撐柱上的多孔隙結構將冷凝後的液體以毛細作用力回流到該蒸發區。雖然該燒結支撐柱具有毛細力，但卻又衍伸以下問題，首先燒結支撐柱係為多孔隙的燒結體結構，因為具有多孔隙所以其密度不如實心銅柱的密度，造成支撐強度不強，易受到外部高壓容易產生斷裂或崩壞，且其拉拔力亦顯不足易造成均溫板產生鼓包現象。另一種支撐柱型態是在一實心的銅柱之外圍再另外套接一個由粉末先燒結製成的環狀結構，利用該環狀結構的多孔隙產生毛細力將冷凝後的液體回流到蒸發區，以順利達到汽液循環效果。然而此種環狀結構的製作方式，是利用具有模穴的一石墨材質模具，該模具之模穴中設置有一中心碳棒，然後將粉末填入該模穴內形成有一環繞該碳棒的環狀結構。隨後，將模具送入燒結爐進行燒結，待冷卻再取出模穴內燒結後的環狀燒結體。由於石墨材質模具及碳棒的熔點相對高於燒結粉末的熔點，所以能夠耐燒結溫度而不會熔融與燒結後的環狀燒結體燒結一起，所以能夠讓環狀燒結體順利脫離模穴並與碳棒分離。然而，該環狀結構與銅柱二者均係是採各別分開製作，再進行套接組合，環狀結構於燒結過程中難確保品質之均一性，致使環狀結構與銅柱兩者的之結合圓心不一致易造成同心度之誤差進而產生組合公差，致使兩者在裝配時產生偏心及組合間隙問題。（即當環狀結構的內徑過度小於銅柱的外徑的，造成環狀結構無法套接銅柱。倘若該環狀結構的內徑過度大於銅柱的外徑，在環狀結構的內表面與該銅柱的外表面間產生裝配間隙無法緊密貼合，將使得在銅柱上的環狀結構產生晃動以及裝配間隙問題），該間隙會造成積水（聚水）問題，當均溫板未工作且當外在環境處於零度時，該間隙之積水會產生結冰造成環狀結構膨脹(鼓包)崩裂或崩壞，進而使均溫板熱交換效率降低或失能者。是以，要如何解決上述問題與缺失，即為本案之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 With the rapid advancement of the technology industry, the functions of electronic products are increasingly improving, resulting in more heat being generated during operation. If this heat cannot be dissipated in time and accumulates in the electronic components (such as processors) inside the electronic product, , which will inevitably affect the overall operating performance of electronic products or cause damage to electronic components due to excessive temperature. In general, heat dissipation devices used in the industry for heat sources that have a narrow space or require a large area for heat dissipation usually use a vapor chamber as a thermal conductive element to conduct the heat source or equalize temperature. A conventional vapor chamber consists of an upper plate covering a lower plate and jointly defining a sealed chamber. The sealed chamber is in a vacuum state and is filled with a working liquid (such as pure water). The sealed chamber is also provided with a capillary structure. and support columns, the two ends of which respectively abut the upper and lower plates in the sealed chamber. However, the general or traditional support column is a solid copper column. Its function is only to provide support and prevent the thermal expansion of the vapor chamber (the upper and lower plates expand outward when heated to cause bulging or bulging). The surface is smooth, so it cannot provide any capillary force, so that the evaporated and condensed working fluid can only be affected by gravity or the capillary structure of the condensation area (upper plate) and slowly flow back to the evaporation area (lower plate). The return speed is If the process is too slow, the water return to the evaporation zone will be too slow to cause dry burning, resulting in poor heat transfer efficiency. Therefore, the industry has improved the support column so that it not only has the support function, but also has capillary force effect. The improved support pillars can be roughly divided into two types; one of the support pillar types is a sintered support pillar type that is directly sintered from general powder. The porous structure on the sintered support pillar allows the condensed liquid to Capillary forces flow back into this evaporation zone. Although the sintered support pillar has capillary force, it has the following problems. First, the sintered support pillar is a porous sintered body structure. Because it is porous, its density is not as good as that of the solid copper pillar, resulting in weak support strength. It is susceptible to breakage or collapse due to external high pressure, and its pulling force is also insufficient, which can easily cause bulging in the vapor chamber. Another type of support column is to connect a solid copper column with an annular structure made of sintered powder. The porous pores of the annular structure are used to generate capillary force to reflux the condensed liquid to the evaporator. area to smoothly achieve the vapor-liquid circulation effect. However, this ring-shaped structure is made by using a graphite mold with a mold cavity. There is a central carbon rod in the mold cavity, and then the powder is filled into the mold cavity to form a ring surrounding the carbon rod. shape structure. Subsequently, the mold is sent to the sintering furnace for sintering, and after cooling, the sintered annular sintered body in the mold cavity is taken out. Since the melting point of the graphite mold and carbon rod is relatively higher than the melting point of the sintered powder, they can withstand the sintering temperature without melting and are sintered together with the sintered ring-shaped sintered body. Therefore, the ring-shaped sintered body can be smoothly separated from the mold cavity and combined with the sintered ring-shaped sintered body. Carbon rod separation. However, both the annular structure and the copper pillars are made separately and then assembled together. It is difficult to ensure the uniformity of quality during the sintering process of the annular structure, resulting in a loss of quality between the annular structure and the copper pillars. The inconsistent center of the joining circle can easily cause concentricity errors and then produce combination tolerances, causing eccentricity and combination gap problems during assembly. (That is, when the inner diameter of the annular structure is too smaller than the outer diameter of the copper pillar, the annular structure cannot fit the copper pillar. If the inner diameter of the annular structure is too larger than the outer diameter of the copper pillar, the inner diameter of the annular structure will There is an assembly gap between the surface and the outer surface of the copper pillar, which cannot fit tightly, which will cause the ring structure on the copper pillar to shake and cause assembly gap problems). This gap will cause water accumulation (water accumulation). When the vapor chamber If it is not working and when the external environment is at zero degrees, the accumulated water in the gap will freeze, causing the annular structure to expand (bulge), crack or collapse, thereby reducing the heat exchange efficiency of the vapor chamber or incapacitating it. Therefore, how to solve the above problems and deficiencies is the direction for improvement that the creators of this case and related manufacturers engaged in this industry urgently want to study.

本創作之一目的，在於提供一種能解決上述問題的治具及利用其所製成的一體式環體支撐柱結構。於是，本創作治具由下而上依序包括一載體、一上蓋及一粉末漏蓋。該載體具有一頂面及一底面，該頂面具有複數模穴。該上蓋係覆蓋在該載體的頂面，且具有一上表面及一下表面。該下表面係面對該載體的頂面，且設有複數定位凹槽分別對應每一模穴。在每一定位凹槽的外側設有一組落粉孔貫穿該上表面及下表面並連通該模穴。該粉末漏蓋係設置在該上蓋的上表面且具有一置料區。該置料區內具有複數投料口，每一投料口對應連通該上蓋的每一組落粉孔。於是，本創作一體式環體支撐柱結構係包括一銅柱及一燒結環體。該銅柱具有一上端及一下端及一外表面，該外表面包覆有該燒結環體，且該燒結環體與該銅柱二者係一起燒結而成，進而形成一沒有裝配間隙的一體式結構；此外該燒結環體具有一燒結環體上端及一燒結環體下端，該銅柱的上端與下端分別與該燒結環體上端及下端可呈平齊或具有一高度差。本創作藉由該治具製作出一體式環體支撐柱結構，可藉以改善過往習知技術或製程中柱體與環狀結構為各自分開製作後，再套接組合形成的組合公差進而產生裝配偏心及裝配間隙問題及存在裝配間隙的積水問題，造成銅柱與燒結環體因積水結冰產生膨脹(鼓包)脫離柱體的缺失者。 One of the purposes of this creation is to provide a fixture that can solve the above problems and an integrated ring support column structure made using the fixture. Therefore, the fixture of this invention includes a carrier, an upper cover and a powder leakage cover in order from bottom to top. The carrier has a top surface and a bottom surface, and the top surface has a plurality of mold cavities. The upper cover covers the top surface of the carrier and has an upper surface and a lower surface. The lower surface faces the top surface of the carrier and is provided with a plurality of positioning grooves corresponding to each mold cavity. A set of powder falling holes is provided on the outside of each positioning groove, penetrating the upper surface and the lower surface and communicating with the mold cavity. The powder leakage cover is arranged on the upper surface of the upper cover and has a material placement area. There are a plurality of feeding openings in the feeding area, and each feeding opening is connected to each group of powder falling holes of the upper cover. Therefore, the integrated ring support column structure of this invention includes a copper column and a sintered ring body. The copper pillar has an upper end, a lower end and an outer surface. The outer surface is covered with the sintered ring body, and the sintered ring body and the copper pillar are sintered together to form an integrated body without assembly gaps. formula structure; In addition, the sintered ring body has an upper end of the sintered ring body and a lower end of the sintered ring body. The upper end and lower end of the copper pillar can be flush with the upper end and lower end of the sintered ring body respectively or have a height difference. This invention uses this jig to produce an integrated ring-shaped support column structure, which can improve the assembly tolerance of the conventional technology or process in which the column and the ring-shaped structure are separately produced and then assembled together to form an assembly. Problems with eccentricity and assembly gaps, as well as water accumulation problems in the assembly gaps, cause the copper pillars and sintered rings to expand (bulge) and separate from the pillars due to the freezing of accumulated water.

本創作之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。如第1A至1D圖所示，一治具10係用來製造一體式環體支撐柱結構。該治具10由下而上包括一載體12、一上蓋13及一粉末漏蓋15。該載體12具有一頂面121及一底面122，該頂面121具有複數模穴123及至少一結合凹部125。在本實施例如但不限制表示數個結合凹部125係分別分布在頂面121的四個角落。每一模穴123具有一穴底1231，該穴底1231設有一固定部1232。該固定部1232從該穴底1231往下設置，且有一固定部深度d1界定在固定部1232的底側與穴底1231之間。另該固定部1232的底側再設有一粉末排出孔1233，該粉末排出孔1233係貫穿該固定部1232及該載體12的底面122且連通模穴123。此外，固定部1232與粉末排出孔1233之銜接處設有一斜面，用以將多餘之粉末導至粉末排出孔1233。在本實施，前述載體12較佳為石墨材質，其熔點相對比燒結粉末及銅柱的熔點高，能夠耐燒結溫度而不會與燒結後的燒結環體及銅柱結合一起，使得其容易從模穴123內脫離。該上蓋13係覆蓋在該載體12的頂面121上，且具有一上表面133及一下表面134及複數組落粉孔132。該下表面134係面對該載體12的頂面121，且在其對應每一模穴123處分別設有一定位凹槽131，該定位凹槽131具有一凹槽深度d2。每一組落粉孔132係貫穿該上表面133及該下表面134，且位於每一定位凹槽131外側(即徑向外側)連通載體12的模穴123。另外，該下表面134設有至少一結合凸部135(如第1B圖)對應結合載體12的結合凹部125(如第1A圖)，藉此構成凹凸結合。在本實施，例如但不限制的表示數個結合凸部135分布在上蓋13的四個角落，以分別對應插接該等結合凹部125，以令上蓋13能夠對準定位該載體12，進而使每一定位凹槽131及每一組落粉孔132對準每一模穴123而不會偏移錯位。再者，該上蓋13的材質較佳與載體12同樣為石墨材質，藉此能夠耐燒結溫度。該粉末漏蓋15設置在該上蓋13的上表面133上，具有一置料區151及複數漏蓋定位孔153。該等漏蓋定位孔153例如但不限制的分設於粉末漏蓋15的四個角落。該置料區151用以放置粉末（例如銅粉或鈦金屬粉或其他金屬或非金屬之粉末），且其內設有複數投料口152，且每一投料口152係對應連通上蓋13的每一組落粉孔132。藉此，連通的每一投料口152、每一組落粉孔132及每一模穴123由上而下構成一粉末填充路徑。請繼續參考第2A至2C圖所示，前述載體12可選擇的設置在一底座11上。藉此，該治具10由下而上包括底座11、載體12、上蓋13及粉末漏蓋15。該底座11具有一座落區112及複數定位銷1112。該座落區112係供前述載體12放置定位，該等定位銷1112例如但不限制分設在底座11的四個角落，用以對應定位前述粉末漏蓋15的漏蓋定位孔153。藉此，使該粉末漏蓋15的漏蓋定位孔153分別對準套接該底座11的定位銷1112，跟底座11形成一定位連接。如此，使得粉末漏蓋15能夠跟載體12及上蓋13在同一基準位置上下對應及定位。藉此，以使粉末漏蓋15固定在上蓋13上，且每一投料口152對應上蓋13的每一組落粉孔132。同時，也能夠使載體12及上蓋13設在底座11與粉末漏蓋15之間。以下將敘述利用前述治具製作一體式粉環銅柱結構的方法步驟。請繼續參考第3圖係為製作一體式環體支撐柱結構的步驟流程圖。第4至6圖則搭配第3圖的各步驟的實施示意圖。如圖所示，具粉環的支撐柱結構製作方法包含下列步驟: 步驟A(S1):將銅柱分別放入該載體的模穴內。在本步驟，如第4及5圖所示，載體12預先放置在底座11上。並在其未被上蓋13覆蓋前，將預先準備的每一銅柱21放入每一模穴123內。所述每一銅柱21具有一上端211及一下端212及一外表面213。放入模穴123內的銅柱21的下端212，暫時固定在該模穴123的穴底1231的固定部1232，該上端211則突出該載體12的頂面121。再者，固定部1232內徑大於該銅柱21外徑，藉此在固定部1232的內側與該銅柱21的下端212外表面之間形成一縫隙1234，該縫隙1234位於該模穴123之下，及該粉末排出孔1233之上以利後續從模穴123排出散落粉末(如第5圖)。步驟B(S2):在該載體的頂面由下而上依序放置該上蓋及該粉末漏蓋。在本步驟，如第5圖所示，在銅柱21置入模穴123後，將上蓋13放置在載體12的頂面121上，然後將該粉末漏蓋15放置在該上蓋13的上表面133上。該上蓋13的下表面134係覆蓋載體12的頂面121。且下表面134的定位凹槽131對準每一模穴123內的實心銅柱21的上端211，該凹槽深度d2則配合該上端211的突出長度，以提供上端211有一凸伸空間並對其定位。如此，在模穴123內的銅柱21的上、下兩端211、212分別被上蓋13的定位凹槽131與載體12的固定部1232暫時固定，以使銅柱21能居中穩固的垂直站立在模穴123內，防止其偏斜。藉此提升二者同心度(即粉末環與銅柱21為同軸，中心點無偏移)，並可保持該粉末環厚度一致不會有厚薄不均的問題產生。並且，上蓋13的每一組落粉孔132係避開該銅柱21的上端211，且直通在其下方的載體12的每一模穴123，以使後續填粉的粉末填入模穴123，而不會落至上端211形成殘粉，避免上端211與均溫板內側面結合不完全的問題。該粉末漏蓋15的漏蓋定位孔153分別對準套接底座11的定位銷1112，以使兩者形成一定位連接，並令載體12及上蓋13設在兩者之間。粉末漏蓋15的置料區151的每一投料口152對位連通其下方的上蓋13的每一組落粉孔132。如此，該投料口152、每一組落粉孔132及模穴123由上而下連通構成一粉末填充路徑。步驟C(S3):將粉末放置在該粉末漏蓋的置料區，且令該粉末從每一投料口通過該落粉孔填入該模穴，進而在該銅柱的外表面填充有一環狀之粉末圈。在本步驟，如第6圖a，將預先準備的粉末20(例如銅粉或鈦金屬粉或其他金屬或非金屬粉末)放置在粉末漏蓋15的置料區151，粉末20從每一投料口152進入該上蓋13的落粉孔132。然後通過落粉孔132的粉末再填入該模穴123。隨著粉末20持續填入模穴123內，以逐漸在該銅柱21的外表面填充成環狀之粉末圈22。在一些實施，藉由高壓氣體或震動輸送粉末20填入該模穴123，可使模穴123內的燒結粉末20緊密堆積成型，使得成型的環狀之粉末圈22不會鬆散，以提升後續燒結成功得到成品的良率。步驟D(S4):移除該粉末漏蓋，停止該粉末繼續填入該模穴。在本步驟，如第6圖b圖所示，在銅柱21的外表面填充成環狀之粉末圈22後，移除該粉末漏蓋15及其上的粉末20，以停止粉末20繼續填入該模穴123內。再者，在模穴123內一些散落的粉末20，可從該縫隙1234經過粉末排出孔1233排出模穴123外。步驟E(S5):該上蓋及該載體一起經由加熱過程，使該模穴內的銅柱及環狀之粉末圈一起燒結，該環狀之粉末圈因燒結變成一燒結環體一體成形的結合在銅柱外表面，兩者係為沒有裝配間隙的一體結構。在本步驟，如第6圖c、d所示，將上蓋13及載體12及具有環狀之粉末圈22的銅柱21送入加熱爐(例如燒結爐)內加熱處理，透過加熱使顆粒狀的粉末20相互結合。在加熱處理後，該環狀之粉末圈22變成燒結環體22直接結合在銅柱21的外表面213。藉此使二者成為沒有裝配間隙的一體式結構。然後移除上蓋13使其與載體12分開，再從該模穴123內取出形成一體式環體之支撐柱結構。由於燒結環體22為粉末20經過加熱形成，所以為一種具有多孔隙能夠產生毛細力的毛細組織(或稱毛細結構)。以下為該一體式環體支撐柱結構應用於兩相流裝置內之實施。請繼續參考第7及8圖所示，一併參考第1C、1D、5及6圖，上述一體式環體支撐柱結構，係可被應用在一均溫板30內。該燒結環體22具有一燒結環體上端221及一燒結環體下端222，該銅柱21的上端211與下端212分別與該燒結環體上端221及下端222可呈平齊或具有一高度差。在本實施例中該銅柱21的上端211係略突出燒結環體22的燒結環體上端221，且形成一上高度差h1(如第6圖d)。且藉由該固定部1232的固定部深度d1，令銅柱21的下端212略突出燒結環體22的燒結環體下端222，並形成一下高度差h2(如第6圖d)。藉由該銅柱21與燒結環體22的上、下高度差h1及h2以配合該均溫板30的一上蓋301及一下蓋302的內面的一毛細結構303的厚度。其中銅柱21的上、下兩端211、212分別連接該上蓋301及該下蓋302的內面，該燒結環體22的燒結環體上、下兩端221、222則能夠分別接觸或結合該上蓋301及該下蓋302內面的毛細結構303。藉由該銅柱21作為支撐柱，以幫助均溫板30抵抗外部壓力或耐受內部汽體壓力的結構強度，該燒結環體22作為均溫板30內的工作液體的汽液循環的回流毛細結構。如上所述，利用上述治具與步驟所完成的一體式環體支撐柱結構，其銅柱21與燒結環體22，二者間係為一體式結構，並未存在有裝配間隙，可藉此改善過往技術或製程存在裝配間隙的積水問題，造成銅柱與燒結環因積水結冰產生膨脹(鼓包)脫離柱體的缺失。 The above-mentioned purpose of this invention and its structural and functional characteristics will be explained based on the preferred embodiments of the attached drawings. As shown in Figures 1A to 1D, a jig 10 is used to manufacture an integrated ring support column structure. The fixture 10 includes a carrier 12 , an upper cover 13 and a powder leakage cover 15 from bottom to top. The carrier 12 has a top surface 121 and a bottom surface 122 . The top surface 121 has a plurality of mold cavities 123 and at least one coupling recess 125 . In this embodiment, for example but not limitation, a plurality of coupling recesses 125 are respectively distributed at four corners of the top surface 121 . Each mold cavity 123 has a cavity bottom 1231, and the cavity bottom 1231 is provided with a fixing portion 1232. The fixed portion 1232 is provided downward from the hole bottom 1231, and has a fixed portion depth d1 defined between the bottom side of the fixed portion 1232 and the hole bottom 1231. In addition, a powder discharge hole 1233 is provided on the bottom side of the fixed part 1232 . The powder discharge hole 1233 penetrates the fixed part 1232 and the bottom surface 122 of the carrier 12 and communicates with the mold cavity 123 . In addition, a slope is provided at the connection between the fixing part 1232 and the powder discharge hole 1233 to guide excess powder to the powder discharge hole 1233 . In this implementation, the aforementioned carrier 12 is preferably made of graphite material. Its melting point is relatively higher than the melting point of the sintered powder and copper pillars. It can withstand the sintering temperature without being combined with the sintered sintered ring body and copper pillars, making it easy to remove from the sintered ring body and copper pillars. Detached from the mold cavity 123. The upper cover 13 covers the top surface 121 of the carrier 12 and has an upper surface 133 and a lower surface 134 and a plurality of sets of powder falling holes 132 . The lower surface 134 faces the top surface 121 of the carrier 12 and is provided with a positioning groove 131 corresponding to each mold cavity 123. The positioning groove 131 has a groove depth d2. Each set of powder holes 132 penetrates the upper surface 133 and the lower surface 134 and is located outside each positioning groove 131 (ie, radially outside) and communicates with the mold cavity 123 of the carrier 12 . In addition, the lower surface 134 is provided with at least one coupling convex portion 135 (as shown in FIG. 1B ) corresponding to the coupling recessed portion 125 (as shown in FIG. 1A ) of the coupling carrier 12 , thereby forming a concave-convex coupling. In this embodiment, for example, but not limited to, a plurality of coupling protrusions 135 are distributed at the four corners of the upper cover 13 to respectively insert the coupling recesses 125 so that the upper cover 13 can align and position the carrier 12, thereby enabling the upper cover 13 to align and position the carrier 12. Each positioning groove 131 and each group of powder falling holes 132 are aligned with each mold cavity 123 without being displaced. Furthermore, the upper cover 13 is preferably made of the same graphite material as the carrier 12 so as to withstand the sintering temperature. The powder leakage cover 15 is disposed on the upper surface 133 of the upper cover 13 and has a material placement area 151 and a plurality of leakage cover positioning holes 153 . The leakage cap positioning holes 153 are, for example, but not limited to, located at four corners of the powder leakage cap 15 . The feeding area 151 is used to place powder (such as copper powder or titanium metal powder or other metal or non-metal powder), and is provided with a plurality of feeding openings 152 , and each feeding opening 152 corresponds to each opening of the upper cover 13 . A group of powder falling holes 132. Thereby, each connected feeding port 152 , each group of powder falling holes 132 and each mold cavity 123 form a powder filling path from top to bottom. Please continue to refer to Figures 2A to 2C. As shown in Figures 2A to 2C, the aforementioned carrier 12 is optionally disposed on a base 11. Thus, the fixture 10 includes a base 11 , a carrier 12 , an upper cover 13 and a powder leakage cover 15 from bottom to top. The base 11 has a seating area 112 and a plurality of positioning pins 1112 . The seating area 112 is for the carrier 12 to be placed and positioned. The positioning pins 1112 are, for example, but not limited to, located at four corners of the base 11 to correspond to the leakage cover positioning holes 153 of the powder leakage cover 15 . Thereby, the leakage cover positioning holes 153 of the powder leakage cover 15 are respectively aligned with the positioning pins 1112 of the base 11 to form a positioning connection with the base 11 . In this way, the powder leakage cover 15 can correspond vertically and be positioned at the same reference position with the carrier 12 and the upper cover 13 . Thereby, the powder leakage cover 15 is fixed on the upper cover 13 , and each feeding port 152 corresponds to each group of powder falling holes 132 of the upper cover 13 . At the same time, the carrier 12 and the upper cover 13 can also be provided between the base 11 and the powder leakage cover 15 . The method and steps of using the aforementioned jig to manufacture an integrated powder ring copper pillar structure will be described below. Please continue to refer to Figure 3, which is a step-by-step flow chart for making an integrated ring support column structure. Figures 4 to 6 are accompanied by schematic diagrams of the implementation of each step in Figure 3. As shown in the figure, the manufacturing method of the support column structure with pink rings includes the following steps: Step A (S1): Place the copper pillars into the mold cavities of the carrier respectively. In this step, as shown in Figures 4 and 5, the carrier 12 is placed on the base 11 in advance. And before it is not covered by the upper cover 13 , each copper pillar 21 prepared in advance is placed into each mold cavity 123 . Each copper pillar 21 has an upper end 211 and a lower end 212 and an outer surface 213 . The lower end 212 of the copper pillar 21 placed in the mold cavity 123 is temporarily fixed on the fixing portion 1232 of the bottom 1231 of the mold cavity 123 , and the upper end 211 protrudes from the top surface 121 of the carrier 12 . Furthermore, the inner diameter of the fixed portion 1232 is larger than the outer diameter of the copper pillar 21 , thereby forming a gap 1234 between the inner side of the fixed portion 1232 and the outer surface of the lower end 212 of the copper pillar 21 . The gap 1234 is located between the mold cavity 123 down, and above the powder discharge hole 1233 to facilitate subsequent discharge of scattered powder from the mold cavity 123 (as shown in Figure 5). Step B (S2): Place the upper cover and the powder leaking cover sequentially from bottom to top on the top surface of the carrier. In this step, as shown in Figure 5, after the copper pillar 21 is placed in the mold cavity 123, the upper cover 13 is placed on the top surface 121 of the carrier 12, and then the powder leakage cover 15 is placed on the upper surface of the upper cover 13 133 on. The lower surface 134 of the upper cover 13 covers the top surface 121 of the carrier 12 . The positioning groove 131 of the lower surface 134 is aligned with the upper end 211 of the solid copper pillar 21 in each mold cavity 123. The depth d2 of the groove is matched with the protruding length of the upper end 211 to provide a protruding space for the upper end 211 and to its positioning. In this way, the upper and lower ends 211 and 212 of the copper pillar 21 in the mold cavity 123 are temporarily fixed by the positioning groove 131 of the upper cover 13 and the fixing part 1232 of the carrier 12 respectively, so that the copper pillar 21 can stand firmly and vertically in the center. In the mold cavity 123, it is prevented from deflecting. This improves the concentricity between the two (that is, the powder ring and the copper pillar 21 are coaxial, and the center point is not offset), and the thickness of the powder ring can be kept consistent without causing uneven thickness problems. Moreover, each group of powder falling holes 132 of the upper cover 13 avoids the upper end 211 of the copper pillar 21 and passes directly through each mold cavity 123 of the carrier 12 below, so that the subsequent filling powder can be filled into the mold cavity 123 , without falling to the upper end 211 to form residual powder, and avoiding the problem of incomplete combination between the upper end 211 and the inner surface of the vapor chamber. The leakage cover positioning holes 153 of the powder leakage cover 15 are respectively aligned with the positioning pins 1112 of the socket base 11, so that the two form a positioning connection, and the carrier 12 and the upper cover 13 are arranged between them. Each feeding port 152 of the feeding area 151 of the powder leakage cover 15 is connected to each group of powder falling holes 132 of the upper cover 13 below it. In this way, the feeding port 152, each group of powder falling holes 132 and the mold cavity 123 are connected from top to bottom to form a powder filling path. Step C (S3): Place the powder in the feeding area of the powder leakage cover, and fill the mold cavity with the powder from each feeding port through the powder drop hole, and then fill a ring on the outer surface of the copper pillar. Shape of powder circle. In this step, as shown in Figure 6a, pre-prepared powder 20 (such as copper powder or titanium metal powder or other metal or non-metal powder) is placed in the feeding area 151 of the powder leakage cover 15, and the powder 20 is fed from each The opening 152 enters the powder falling hole 132 of the upper cover 13 . Then the powder passing through the powder falling hole 132 is filled into the mold cavity 123 . As the powder 20 continues to be filled into the mold cavity 123, an annular powder ring 22 is gradually filled on the outer surface of the copper pillar 21. In some implementations, the powder 20 is filled into the mold cavity 123 by high-pressure gas or vibration, so that the sintered powder 20 in the mold cavity 123 can be closely packed and formed, so that the formed ring-shaped powder ring 22 will not loosen, so as to improve the subsequent process. The sintering is successful and the yield of the finished product is obtained. Step D (S4): Remove the powder leakage cover to stop the powder from continuing to fill the mold cavity. In this step, as shown in Figure 6(b), after the outer surface of the copper pillar 21 is filled into a ring-shaped powder ring 22, the powder leakage cover 15 and the powder 20 on it are removed to stop the powder 20 from continuing to fill. into the mold cavity 123. Furthermore, some scattered powder 20 in the mold cavity 123 can be discharged out of the mold cavity 123 through the powder discharge hole 1233 from the gap 1234 . Step E (S5): The upper cover and the carrier undergo a heating process together, so that the copper pillars and annular powder ring in the mold cavity are sintered together. The annular powder ring becomes a sintered ring body due to sintering. On the outer surface of the copper pillar, the two are an integrated structure without assembly gaps. In this step, as shown in Figure 6 c and d, the upper cover 13 and the carrier 12 and the copper pillar 21 with the annular powder ring 22 are sent to a heating furnace (such as a sintering furnace) for heat treatment, and the granular shape is formed by heating. The powders 20 are combined with each other. After the heat treatment, the annular powder ring 22 becomes a sintered ring body 22 and is directly bonded to the outer surface 213 of the copper pillar 21 . This makes the two become an integrated structure with no assembly gaps. Then the upper cover 13 is removed to separate it from the carrier 12, and then the supporting column structure forming an integrated ring is taken out from the mold cavity 123. Since the sintered ring body 22 is formed by heating the powder 20, it is a capillary structure (or capillary structure) with porous spaces capable of generating capillary force. The following is an implementation of the integrated ring support column structure used in a two-phase flow device. Please continue to refer to Figures 7 and 8, and also refer to Figures 1C, 1D, 5 and 6. The above-mentioned integrated ring support column structure can be applied in a uniform temperature plate 30. The sintered ring body 22 has a sintered ring body upper end 221 and a sintered ring body lower end 222. The upper end 211 and lower end 212 of the copper pillar 21 can be flush with the sintered ring body upper end 221 and lower end 222 respectively or have a height difference. . In this embodiment, the upper end 211 of the copper pillar 21 slightly protrudes from the upper end 221 of the sintered ring body 22, and forms an upper height difference h1 (as shown in Figure 6d). And through the depth d1 of the fixing part 1232, the lower end 212 of the copper pillar 21 slightly protrudes from the lower end 222 of the sintered ring body 22, and a height difference h2 is formed (as shown in Figure 6d). The upper and lower height differences h1 and h2 of the copper pillar 21 and the sintered ring body 22 are used to match the thickness of a capillary structure 303 on the inner surface of an upper cover 301 and a lower cover 302 of the vapor chamber 30 . The upper and lower ends 211 and 212 of the copper pillar 21 are connected to the inner surfaces of the upper cover 301 and the lower cover 302 respectively, and the upper and lower ends 221 and 222 of the sintered ring body 22 can be contacted or combined respectively. The capillary structure 303 on the inner surface of the upper cover 301 and the lower cover 302. The copper pillar 21 is used as a supporting pillar to help the structural strength of the vapor chamber 30 to resist external pressure or internal gas pressure. The sintered ring body 22 serves as a return flow for the vapor-liquid circulation of the working liquid in the vapor chamber 30 Capillary structure. As mentioned above, the integrated ring support column structure completed by using the above jig and steps, the copper column 21 and the sintered ring body 22 are an integrated structure, and there is no assembly gap. Improve the problem of water accumulation in the assembly gap caused by previous technologies or processes, causing the copper pillar and sintered ring to expand (bulge) and separate from the cylinder due to the freezing of accumulated water.

10:治具 11:底座 1112:定位銷 112:座落區 12:載體 121:頂面 122:底面 123:模穴 1231:穴底 1232:固定部 d1:固定部深度 1233:粉末排出孔 1234:縫隙 125:結合凹部 13:上蓋 131:定位凹槽 d2:凹槽深度 132:落粉孔 133:上表面 134:下表面 135:結合凸部 15:粉末漏蓋 151:置料區 152:投料口 153:漏蓋定位孔 21:銅柱 211:上端 212:下端 h1:上高度差 h2:下高度差 20:粉末 22:環狀之粉末圈/燒結環體 221:燒結環體上端 222:燒結環體下端 30:均溫板 301:上蓋 302:下蓋 303:毛細結構 10:Jig 11: Base 1112: Positioning pin 112:Seat area 12: Carrier 121:Top surface 122: Bottom surface 123:Mold cavity 1231: bottom of hole 1232: Fixed part d1: Depth of fixed part 1233:Powder discharge hole 1234:Gap 125: Combined with the concave part 13: Upper cover 131: Positioning groove d2: Groove depth 132:Powder falling hole 133: Upper surface 134: Lower surface 135: Combined convex part 15: Powder leakage cover 151: Material storage area 152: Feeding port 153: Positioning hole for leakage cover 21: Copper pillar 211: Upper end 212:lower end h1: Upper height difference h2: lower height difference 20:Powder 22: Ring-shaped powder ring/sintered ring body 221: Upper end of sintered ring body 222: Lower end of sintered ring body 30:Vapor chamber 301: Upper cover 302: Lower cover 303: Capillary structure

第1A圖係為治具之立體分解示意圖；第1B圖係為治具之分解剖視示意圖；第1C及1D圖係為第1B圖之1C及1D的局部放大示意圖；第2A至2C圖係為治具另一實施之示意圖；第3圖係為利用治具製作一體式環體支撐柱結構的步驟流程圖；第4圖為銅柱放入模穴內前之實施示意圖；第5圖為銅柱放入模穴後之實施示意圖及局部放大圖；第6圖為填粉進入模穴形成環狀之粉末圈的連續作動示意圖；第7圖為利用治具所製成的一體式環體支撐柱結構的立體示意圖；第8圖為一體式環體支撐柱結構應用在均溫板內之局部示意圖。 Figure 1A is a three-dimensional exploded view of the fixture; Figure 1B is an exploded anatomical diagram of the fixture; Figures 1C and 1D are partial enlarged schematic views of Figure 1C and 1D of Figure 1B; Figures 2A to 2C are schematic diagrams of another implementation of the fixture; Figure 3 is a flow chart showing the steps of using a jig to make an integrated ring support column structure; Figure 4 is a schematic diagram of the implementation before the copper pillar is placed into the mold cavity; Figure 5 is a schematic and partial enlargement of the implementation after placing the copper pillars into the mold cavity; Figure 6 is a schematic diagram of the continuous action of filling powder into the mold cavity to form a ring-shaped powder ring; Figure 7 is a three-dimensional schematic diagram of the integrated ring support column structure made by using a jig; Figure 8 is a partial schematic diagram of the integrated ring support column structure used in the vapor chamber.

10:治具 10:Jig

12:載體 12: Carrier

121:頂面 121:Top surface

122:底面 122: Bottom surface

123:模穴 123:Mold cavity

125:結合凹部 125: Combined with the concave part

13:上蓋 13: Upper cover

132:落粉孔 132:Powder falling hole

133:上表面 133: Upper surface

134:下表面 134: Lower surface

15:粉末漏蓋 15: Powder leakage cover

151:置料區 151: Material storage area

152:投料口 152: Feeding port

153:漏蓋定位孔 153: Positioning hole for leakage cover

Claims

一種治具，包括：一載體，具有一頂面及一底面，該頂面具有複數模穴；一上蓋，係覆蓋在該載體的頂面，且具有一上表面及一下表面，該下表面係面對該載體的頂面且設有複數定位凹槽分別對應每一模穴，在每一定位凹槽的外側設有一組落粉孔貫穿該上表面及下表面並連通該模穴；一粉末漏蓋，係設置在該上蓋的上表面，且具有一置料區，該置料區內具有複數投料口，每一投料口對應連通該上蓋的每一組落粉孔。 A fixture including: A carrier has a top surface and a bottom surface, and the top surface has a plurality of mold cavities; An upper cover covers the top surface of the carrier and has an upper surface and a lower surface. The lower surface faces the top surface of the carrier and is provided with a plurality of positioning grooves corresponding to each mold cavity. A set of powder falling holes is provided on the outside of the groove, penetrating the upper surface and the lower surface and communicating with the mold cavity; A powder leakage cover is arranged on the upper surface of the upper cover and has a material placement area. The material placement area has a plurality of feeding openings, and each feeding opening is connected to each group of powder falling holes of the upper cover.

如請求項1所述之治具，其中粉末漏蓋設有複數漏蓋定位孔，該載體位於一底座上，該底座具有一座落區及複數定位銷，該座落區係供該載體放置，該等定位銷對應定位該粉末漏蓋的該等漏蓋定位孔。The fixture as described in claim 1, wherein the powder leakage cover is provided with a plurality of leakage cover positioning holes, the carrier is located on a base, the base has a landing area and a plurality of positioning pins, and the seating area is for the carrier to be placed, The positioning pins correspond to the leakage cover positioning holes for positioning the powder leakage cover.

如請求項1所述之治具，其中每一模穴具有一穴底，該穴底設有一固定部，該固定部係連通一粉末排出孔，該粉末排出孔係貫穿該固定部及該載體的底面且連通該模穴。The jig as claimed in claim 1, wherein each mold cavity has a cavity bottom, the cavity bottom is provided with a fixed part, the fixed part is connected to a powder discharge hole, and the powder discharge hole penetrates the fixed part and the carrier The bottom surface is connected to the mold cavity.

如請求項1所述之治具，其中該載體的頂面設有至少一結合凹部，該上蓋的下表面設有至少一結合凸部對應該載體的結合凹部。The fixture according to claim 1, wherein the top surface of the carrier is provided with at least one coupling recess, and the lower surface of the upper cover is provided with at least one coupling convex portion corresponding to the coupling recess of the carrier.

一種利用請求項1至4其中任一項的治具製成的一體式環體支撐柱結構，包含: 一銅柱，具有一上端及一下端及一外表面，該外表面形成有一燒結環體，該燒結環體與該銅柱係一起燒結成為沒有裝配間隙的一體結構。 An integrated ring support column structure made using the fixture of any one of claims 1 to 4, including: A copper pillar has an upper end, a lower end and an outer surface. The outer surface forms a sintered ring body. The sintered ring body and the copper pillar are sintered together to form an integrated structure without assembly gaps.

如請求項5所述之一體式環體支撐柱結構，其中該燒結環體具有一燒結環體上端及一燒結環體下端，該銅柱的上端與下端分別與該燒結環體上端及下端具有一高度差。The one-piece ring support column structure as described in claim 5, wherein the sintered ring body has an upper end of the sintered ring body and a lower end of the sintered ring body, and the upper end and lower end of the copper column are respectively connected with the upper end and lower end of the sintered ring body. A height difference.