CN116871519A - Jig and integrated ring copper column structure manufactured by using same - Google Patents

Abstract

The invention discloses a jig and an integrated ring copper column structure manufactured by using the same, wherein the jig comprises a carrier, a movable metal sheet and a powder leakage cover from bottom to top, wherein each mold cavity of the carrier is provided for a copper column to be placed in, powder can be filled into the mold cavity from the powder leakage cover through the movable metal sheet, and then annular powder is filled on the outer surface of the copper column; then sintering the two materials together through a heating process, and changing the annular powder into a sintered ring body and a copper column to form an integrated ring body copper column structure without assembly gaps. Therefore, the combination tolerance of the copper column and the sintered ring body is reduced, so that the defects of expansion, cracking, column separation and the like of the copper column and the sintered ring body caused by water accumulation and icing due to the water accumulation problem caused by the assembly clearance of the copper column and the sintered ring body in the prior art or the prior process are overcome.

Description

Jig and integrated ring copper column structure manufactured by using same

Technical Field

The present invention relates to a jig and an application field thereof, and more particularly to a jig and an integrated ring copper pillar structure manufactured by the same.

Background

With rapid progress of the technology industry, the functions of electronic products are increasingly improved, so that more heat is generated during operation and use, and if the heat cannot be timely dissipated and accumulated at electronic components (such as a processor) in the electronic products, the overall operation performance of the electronic products is affected or the electronic components are damaged due to over-high temperature.

Generally, a heat dissipation device for a heat source with a narrow space or a large area is usually selected to use a temperature equalization plate as a heat conducting element for conducting heat source or equalizing temperature.

The well-known temperature equalization plate is covered on a lower plate by an upper plate and jointly defines a closed cavity, the closed cavity is in a vacuum state and is filled with a working liquid (such as pure water), a capillary structure and supporting columns are also arranged in the closed cavity, and two ends of the supporting columns are respectively abutted against the inner sides of the upper plate and the lower plate in the closed cavity.

However, the general support column is a solid copper column, which only provides the function of supporting and preventing the temperature equalization plate from thermal expansion (the upper and lower plates are heated to expand outwards to generate bulge or bulge), and since the outer surface of the copper column is smooth, no capillary force can be provided, so that the evaporated and condensed working fluid can only be acted by gravity or slowly flow back to the evaporation area (lower plate) from the capillary structure of the condensation area (upper plate), the backflow speed and the process are too slow, and the water return in the evaporation area is easy to generate dry burning too slowly, which results in poor heat transfer efficiency.

Therefore, the manufacturer can improve the support column to have capillary force in addition to the support function. The improved support column can be divided into two types; one of the support column types is a sintered support column type formed by directly sintering common powder, and condensed liquid is returned to the evaporation zone by capillary force through a porous structure on the sintered support column. Although the sintered support column has capillary force, the problems are derived that the sintered support column is a porous sintered body structure, and the density of the sintered support column is lower than that of a solid copper column because of porous holes, so that the support strength is not strong, the sintered support column is easy to break or collapse due to external high pressure, the drawing force of the sintered support column is also insufficient, and the expansion phenomenon of the temperature equalizing plate is easy to occur.

The other support column type is that a ring structure made of powder by sintering is sleeved on the periphery of a solid copper column, and the condensed liquid is returned to the evaporation area by utilizing capillary force generated by the porous holes of the ring structure so as to smoothly achieve the vapor-liquid circulation effect. However, the manufacturing method of the annular structure is to use a graphite mold with a mold cavity, wherein a central carbon rod is arranged in the mold cavity of the mold, and then powder is filled into the mold cavity to form an annular powder ring structure surrounding the carbon rod. And then, sending the die into a sintering furnace for sintering, cooling, and taking out the annular sintered body sintered in the die cavity. Since the melting point of the graphite mold and the carbon rod is relatively higher than that of the sintering powder, the graphite mold and the carbon rod can resist the sintering temperature without melting together with the sintered annular sintered body, and the annular sintered body can be smoothly separated from the mold cavity and separated from the carbon rod.

However, the annular structure and the copper column are manufactured separately and then are sleeved and combined, so that the uniformity of quality of the annular structure is difficult to ensure in the sintering process, and the combination circle centers of the annular structure and the copper column are inconsistent, so that the concentricity error is easily caused, the combination tolerance is further generated, and the eccentric and combination clearance problems are caused during the assembly of the annular structure and the copper column. If the inner diameter of the annular structure is excessively larger than the outer diameter of the copper column, an assembly gap is generated between the inner surface of the annular structure and the outer surface of the copper column, so that the annular structure on the copper column can shake and the assembly gap is caused, the gap can cause the problem of water accumulation (water accumulation), and when the temperature equalization plate is not in operation and the external environment is at zero degree, the water accumulation in the gap can generate freezing to cause the expansion (bulge) collapse or collapse of the annular structure, so that the heat exchange efficiency of the temperature equalization plate is reduced or disabled.

Therefore, how to solve the above problems and disadvantages is the direction of research and improvement for the present inventors and the related manufacturers in the industry.

Disclosure of Invention

The invention aims to provide a jig capable of solving the problems and an integrated ring copper column structure manufactured by using the jig.

In one aspect, the present invention provides a fixture, which comprises a carrier, a movable metal sheet and a powder leaking cover from top to bottom. The carrier has a plurality of mold cavities. The movable metal sheet is arranged on the carrier and can reciprocate relative to the carrier. The movable metal sheet has an upper surface and a lower surface and a plurality of powder inlets. Each group of powder inlet holes penetrates through the upper surface and the lower surface of the powder inlet holes and is communicated with the mold cavity. The powder leakage cover is arranged on the movable metal sheet and is provided with a material placing area with a plurality of material inlets, and each material inlet corresponds to each group of powder inlet of the movable metal sheet.

In one embodiment of the jig of the present invention, the carrier is located on a base, the movable metal sheet has a plurality of movable holes, the powder drain cover has a plurality of first positioning holes, and the base has a seating area and a plurality of positioning pins, the seating area is used for placing the carrier, and the plurality of positioning pins are correspondingly used for positioning the plurality of movable holes of the movable metal sheet and the plurality of first positioning holes of the powder drain cover.

In a further embodiment of the jig of the invention, at least one fixed metal sheet is arranged between the top surface of the carrier and the lower surface of the movable metal sheet, a through hole is respectively arranged on the fixed metal sheet corresponding to each mold cavity, a group of powder falling holes are arranged on the outer side of each through hole and communicated with the mold cavity, and the movable metal sheet can reciprocate relative to the fixed metal sheet so that each group of powder inlet holes of the movable metal sheet and each group of powder falling holes of the fixed metal sheet form alignment or dislocation.

In a still further embodiment of the fixture of the present invention, the fixing metal sheet is provided with a plurality of second positioning holes correspondingly positioned by the plurality of positioning pins.

In one embodiment of the jig of the invention, each mold cavity is provided with a cavity bottom, the cavity bottom is provided with a fixing part, the fixing part is communicated with a powder discharge hole, and the powder discharge hole is positioned below the fixing part and penetrates through the bottom surface of the carrier; a protruding part is protruded from one edge of the movable metal sheet.

In another aspect, the present invention provides an integrated ring copper pillar structure, which includes a copper pillar and a sintered ring. The copper column is provided with an upper end, a lower end and an outer surface, wherein the outer surface is coated with the sintering ring body, and the sintering ring body and the copper column are sintered together to form an integrated structure without an assembly gap between the sintering ring body and the copper column.

In one embodiment of the integrated ring copper pillar structure of the present invention, the upper end of the copper pillar is flush with or protrudes from an upper end of the sintered ring, and the lower end of the copper pillar is protrudes from a lower end of the sintered ring.

The invention can manufacture an integrated ring copper column structure by the fixture, thereby overcoming the defects that after the column body and the ring structure are manufactured separately in the prior art or the manufacturing process, the assembly tolerance formed by sleeving and combining further generates the problems of assembly eccentricity and assembly clearance and the ponding problem of assembly clearance, and the copper column and the sintered ring body expand (bulge) to be separated from the column body due to the water accumulation and icing.

Drawings

FIG. 1A is a schematic perspective exploded view of a fixture;

FIG. 1B is an exploded cross-sectional view of the jig;

FIG. 1C is an enlarged schematic view of a portion of FIG. 1C;

fig. 2A to 2C are schematic views of another implementation of the jig;

FIG. 3 is a schematic flow chart of the steps for fabricating an integrated ring copper pillar structure;

FIG. 4 is a schematic diagram of an embodiment of the copper pillar before being placed in the mold cavity;

FIG. 5 is a schematic illustration of an embodiment and a partial enlarged view of a copper pillar after being placed into a mold cavity;

FIG. 6 is a schematic top view of the movable metal sheet of the fixture before moving;

FIGS. 7 (a) to 7 (d) are schematic views showing the continuous operation of filling powder into a mold cavity;

FIG. 8 is a schematic top view of the movable metal sheet of the fixture after movement;

FIG. 9 is a flow chart of steps for fabricating an integrated ring copper pillar structure using another embodiment of the fixture;

fig. 10, 11, 12 (a) to 12 (d) are schematic views illustrating another implementation of the steps of the implementation jig with fig. 9;

FIG. 13 is a perspective view of an integrated ring copper pillar structure;

FIG. 14 is a partial schematic view of an integrated ring and cylinder structure applied in a temperature equalization plate.

Reference numerals illustrate:

a jig 10; a base 11; a positioning pin 1112; a seating area 112; a carrier 12; a top surface 121; a bottom surface 122; a mold cavity 123; a cavity bottom 1231; a fixing part 1232; a fixed portion depth d; a powder discharge hole 1233; a slit 1234; a fixed metal sheet 13; a through hole 131; powder falling hole 132; a second positioning hole 134; a thickness t; reserving a gap 135; a movable metal sheet 14; an upper surface 141; a lower surface 142; powder inlet hole 143; a movable hole 144; a convex portion 145; a powder drain cover 15; a material placement area 151; a feed port 152; a first positioning hole 153; copper pillars 21; an upper end 211; a lower end 212; an upper height difference h1; a lower height difference h2; a powder 20; an annular powder/sintered ring body 22; an upper end 221; a lower end 222; a temperature equalizing plate 30; an upper cover 301; a lower cover 302; a capillary structure 303; steps S1 to S5 and S2a to S5a.

Detailed Description

The above objects of the present invention, as well as the structural and functional characteristics thereof, will be described in terms of the preferred embodiments of the present invention as illustrated in the accompanying drawings.

As shown in fig. 1A to 1C, a jig 10 is used for manufacturing an integral ring copper pillar structure. The jig 10 includes a carrier 12, a movable metal sheet 14 and a powder drain cover 15 from bottom to top.

The carrier 12 has a top surface 121 and a bottom surface 122, the top surface 121 having a plurality of cavities 123. Each mold cavity 123 has a cavity bottom 1231, and the cavity bottom 1231 is provided with a fixing portion 1232. The securing portion 1232 is downwardly disposed from the cavity bottom 1231 and has a securing portion depth d defined between the bottom side of the securing portion 1232 and the cavity bottom 1231. The bottom side of the fixing portion 1232 is further provided with a powder discharge hole 1233, and the powder discharge hole 1233 penetrates through the fixing portion 1232 and the bottom surface 122 of the carrier 12 and is communicated with the mold cavity 123.

In addition, a slope is provided at the junction of the fixing portion 1232 and the powder discharge hole 1233, which is used to guide the excessive powder to the powder discharge hole 1233. In this embodiment, the carrier 12 is preferably made of graphite, which has a melting point relatively higher than that of the sintered powder and the copper pillars, and is resistant to sintering temperatures without being bonded to the sintered ring body and the copper pillars, so that it is easily separated from the mold cavity 123.

The movable metal sheet 14, such as a steel sheet, is disposed on the top surface 121 of the carrier 12 and is reciprocally movable with respect to the carrier 12. The movable metal sheet 14 has an upper surface 141 and a lower surface 142, and a plurality of powder inlet holes 143 and a plurality of movable holes 144. The lower surface 142 faces the top surface 121 of the carrier 12, and each of the powder inlets 14 extends through the upper surface 141 and the lower surface 142. As the movable sheet metal 14 reciprocates (e.g., is pulled or pushed back) relative to the carrier 12, each set of powder feed holes 143 is either aligned or offset from communication with the mold cavities 123 of the carrier 12. The movable hole 144 is disposed at four corners of the movable metal sheet 14, and a protrusion 145 is protruded at an edge of the movable metal sheet 14 for applying a reciprocating motion force thereto.

The powder drain cover 15 is disposed on the movable metal sheet 14 and has a material placement area 151 and a plurality of first positioning holes 153. The first positioning holes 153 are, for example and without limitation, provided at four corners of the powder leakage cover 15. The loading area 151 is used for loading powder (such as copper powder or titanium powder or other metal or nonmetal powder), and is provided with a plurality of loading ports 152 therein. And each feed port 152 is in alignment with each group of powder inlet 143 or is offset in misalignment without being in communication with each group of powder inlet 143 when the movable metal sheet 14 reciprocates relative to the carrier 12. When the alignment is performed, each feeding port 152, each group of powder inlet 143 and the mold cavity 123 form a powder filling path from top to bottom.

In addition, as shown in fig. 2A to 2C, the carrier 12 may be optionally placed on a base 11, and a fixed metal sheet 13 is optionally disposed between the top surface 121 of the carrier 12 and the lower surface 142 of the movable metal sheet 14. Therefore, the jig 10 comprises a base 11, a carrier 12, a fixed metal sheet 13, a movable metal sheet 14 and a powder leakage cover 15 from bottom to top.

The base 11 has a seating area 112 and a plurality of positioning pins 1112. The seating area 112 is for the carrier 12 to be placed, and a plurality of positioning pins 1112 are, for example, but not limited to, disposed at four corners of the base 11, for correspondingly positioning the plurality of movable holes 144 of the movable metal sheet 14 and the first positioning holes 153 of the powder drain cover 15.

The fixed metal sheet 13, such as a steel sheet, is covered on the top surface 121 of the carrier 12, and a through hole 131 is respectively disposed at a position corresponding to each mold cavity 123, and a set of powder falling holes 132 are disposed outside each through hole 131. Each group of powder falling holes 132 is correspondingly communicated with the mold cavity 123 of the carrier 12. And a plurality of second positioning holes 134 are provided at the positioning pins 1112 corresponding to the base 11. The second positioning holes 134 are respectively formed at four corners of the fixed metal sheet 13 and match with the positioning pins 1112. The second positioning holes 134 are respectively aligned with the positioning pins 1112, so that each positioning hole 131 and each group of powder falling holes 132 of the fixed metal sheet 13 can be aligned with each mold cavity 123 of the carrier 12.

The movable holes 144 (such as but not limited to elongated holes) of the movable metal sheet 14 are aligned with the socket positioning pins 1112, respectively, and are reciprocally movable on the fixed metal sheet 13. And as the movable metal sheet 14 reciprocates (e.g., moves in a drawing and pushing manner) with respect to the fixed metal sheet 13, each group of powder inlet holes 14 is aligned with or not aligned with each group of powder outlet holes 132 of the fixed metal sheet 13. When the alignment is performed, each feeding hole 152 of the powder leakage cover 15, each group of powder feeding holes 143 of the movable metal sheet 14, each group of powder falling holes 132 of the fixed metal sheet 13, and the mold cavity 123 form a powder filling path from top to bottom.

The second positioning holes 153 of the powder leakage cover 15 are aligned with the socket positioning pins 1112, respectively, so as to fix the powder leakage cover 15 on the movable metal sheet 14. Thus, the fixed metal sheet 13, the movable metal sheet 14 and the powder leakage cover 15 which are sequentially placed on the carrier 12 can be vertically corresponding to the carrier 12 at the same reference position.

The method steps for manufacturing the integrated powder ring copper pillar structure by using the jig will be described below.

Please continue to refer to fig. 3, which is a flowchart illustrating steps for fabricating an integrated powder ring copper pillar structure. Fig. 4 to 8 are schematic views of the implementation of the steps of fig. 3. As shown in the figure, the manufacturing method of the integrated powder ring copper column structure comprises the following steps:

step A (S1), each copper column is placed into each mold cavity of the carrier;

in this step, as shown in fig. 4 and 5, each copper pillar 21 prepared in advance is placed in each mold cavity 123. Each copper pillar 21 has an upper end 211 and a lower end 212 and an outer surface 213. The lower end 212 of the copper pillar 21 placed in the mold cavity 123 is temporarily fixed to the fixing portion 1232 of the cavity bottom 1231 of the mold cavity 123, and the upper end 211 of the copper pillar 21 is not protruded or flush with the top surface 121 of the carrier 12. Furthermore, the inner diameter of the fixing portion 1232 is larger than the outer diameter of the copper pillar 21, thereby forming a gap 1234 between the inner side of the fixing portion 1232 and the outer surface of the lower end 212 of the copper pillar 21, the gap 1234 being located below the die cavity 123 and above the powder discharge hole 1233 for facilitating the subsequent discharge of scattered powder from the die cavity 123.

And B (S2) placing the movable metal sheet and the powder leakage cover on the top surface of the carrier in sequence from bottom to top.

In this step, as shown in fig. 5 and 6, after the copper pillars 21 are placed in the mold cavities 123, the movable metal sheet 14 is placed on the top surface 121 of the carrier 12, so that the powder inlet holes 143 thereof are communicated with each mold cavity 123 of the carrier 12 below, and avoid the copper pillars 21 in the mold cavities 123. The powder leaking cover 15 is placed on the upper surface 141 (fig. 4) of the movable metal sheet 14, so that the feeding holes 152 thereof are aligned and communicated with each group of powder feeding holes 143 of the movable metal sheet 14 before being moved, and each group of powder feeding holes 143 is located in the lower range of each feeding hole 152 (fig. 6).

And C (S3) placing powder in a material placing area of the powder leakage cover, enabling the powder to enter the powder inlet hole through each material feeding hole, filling the powder inlet hole into the mold cavity, and further filling annular powder on the outer surface of the copper column.

In this step, as shown in fig. 7 (a), a powder 20 (for example, copper powder or titanium powder or other metal or nonmetal powder) prepared in advance is placed in a material placing area 151 of the powder leakage cover 15, and the powder 20 enters a powder inlet 143 of the movable metal sheet 14 through each material inlet 152. Then, the powder passing through the powder inlet hole 143 is refilled into the mold cavity 123. As the powder 20 continues to be filled into the mold cavity 123, the outer surface of the copper pillar 21 is gradually filled with the annular powder 22. In some implementations, the powder in the mold cavity 123 is tightly packed and formed by filling the powder into the mold cavity 123 with high-pressure gas or vibration, so that the formed annular powder 22 is not loosened, and the yield of the finished product obtained by the subsequent sintering is improved.

And D (S4) moving the movable metal sheet relative to the carrier, and enabling the powder inlet to be offset with the feeding port and the die cavity in a dislocation way so as to stop the powder from continuously filling the die cavity.

In this step, as shown in fig. 7 (b) and 8, after the outer surface of the copper pillar 21 is filled with the annular powder 22, the movable metal sheet 14 is moved relative to the carrier 12 (for example, the movable metal sheet 14 is pulled), so that the powder inlet 143 is moved in a direction avoiding the cavity 123 of the carrier 12 (as indicated by an arrow in fig. 8), and is offset from the upper feed port 152 and the lower cavity 123 so as not to communicate with each other (as shown in fig. 7 (b)). And the upper surface 141 and the lower surface 142 of the movable metal sheet 14 respectively close the feed opening 152 and the mold cavity 123, thereby stopping the powder 20 from continuously filling into the mold cavity 123 (as shown in fig. 7 (b)). Further, some of the scattered powder 20 in the cavity 123 can be discharged from the slit 1234 through the powder discharge hole 1233 to the outside of the cavity 123.

And E (S5) sintering the copper column and the annular powder in the mold cavity together through a heating process to change the annular powder into a sintered ring body which is combined with the outer surface of the copper column, wherein the copper column and the annular powder are of an integral structure without an assembly gap.

In this step, as shown in fig. 7 (c) and 7 (d), the movable metal sheet 14 and the powder leakage cover 15 are removed. Then, the carrier 12 and the copper pillar 21 having the annular powder 22 are fed into a heating furnace (for example, a sintering furnace) to be heated, and the granular powder 20 is bonded to each other by heating. After the heat treatment, the annular powder 22 becomes a sintered ring body 22, which is directly bonded to the outer surface 213 of the copper pillar 21. Then the copper pillar 21 and the sintered ring body 22 are taken out from the mold cavity 123. Therefore, the copper pillar 21 and the sintered ring 22 are an integral structure without assembly gaps. Since the sintered ring body 22 is formed by heating powder, it is a capillary structure (or called capillary structure) having a plurality of pores and capable of generating capillary force.

Please continue to refer to fig. 9, which is a flowchart illustrating steps for fabricating an integrated powder ring copper pillar structure using the jig of fig. 2A-2C. Fig. 10, 11, 12 (a) to 12 (d) are schematic views of the implementation of the steps of fig. 9. Most of the elements and steps in this embodiment are the same as those in the previous embodiment, and the same symbols are used for the same elements and steps, however, the difference between this embodiment and the previous embodiment is that:

and B (S2 a), placing the fixed metal sheet, the movable metal sheet and the powder leakage cover on the top surface of the carrier in sequence from bottom to top.

In this step, as shown in fig. 10 and 11, after the copper pillar 21 is placed in the mold cavity 123, the fixed metal sheet 13 is covered on the top surface 121 of the carrier 12, so that each group of powder falling holes 132 of the fixed metal sheet 13 is directly connected to each mold cavity 123 of the carrier 12 below. And the through holes 131 of the fixed metal sheet 13 are aligned with the copper pillars 21 in each mold cavity 123 to locate the upper ends 211 thereof. Therefore, the upper end 211 and the lower end 212 of the copper pillar 21 are temporarily fixed by the through hole 131 of the fixed metal sheet 13 and the fixing portion 1232 of the cavity bottom 1231, so that the copper pillar can be stably and vertically standing in the mold cavity 123 in a centered manner, the deflection is prevented to reduce the combination tolerance of the annular powder 22 and the copper pillar 21 which are subsequently filled on the outer surface of the copper pillar 21, the concentricity of the two is further improved (namely, the annular powder 22 and the copper pillar 21 are coaxial, the center point is not offset), and the thickness of the annular powder 22 is kept consistent without the problem of uneven thickness. The movable metal sheet 14 is placed on the fixed metal sheet 13, and before the movable metal sheet 14 is moved, each group of powder inlet holes 143 is aligned and communicated with each group of powder falling holes 132, and the copper pillars 21 in the mold cavity 123 are avoided, so that the powder filled with powder subsequently falls to the upper end 211 to form residual powder, and the problem that the powder cannot be completely combined with the inner side surface of the temperature equalizing plate is caused.

And C (S3 a), placing powder in a material placing area of the powder leakage cover, enabling the powder to enter the powder inlet hole through each material feeding hole, filling the powder inlet hole into the mold cavity through the powder falling hole, and further filling annular powder on the outer surface of the copper column.

In this step, as shown in fig. 12 (a), the powder 20 enters the powder inlet hole 143 of the movable metal sheet 14 through each of the feed ports 152. Then, the powder 20 passing through the powder inlet 143 continues to pass through the powder outlet 132 of the fixed metal sheet 13, and then fills the die cavity 123 from the powder outlet 132, and fills the outer surface of the copper pillar 21 with the annular powder 22.

D (S4 a) moving the movable metal sheet relative to the fixed metal sheet to enable the powder inlet, the feeding hole and the powder falling hole to shift in a dislocation way so as to prevent powder in the material placing area from scattering on the fixed metal sheet, and stopping the powder from continuously filling into the mold cavity;

in this step, as shown in fig. 12 b, after the outer surface of the copper pillar 21 is filled with the annular powder 22, the movable metal sheet 14 is moved relative to the fixed metal sheet 13 (as shown in fig. 8), and the powder inlet 143 is moved in a direction avoiding the fixed hole 13 of the fixed metal sheet 13, and is offset so as not to communicate with the upper feed port 152 and the lower powder outlet 13. And the upper surface 141 and the lower surface 142 of the movable metal sheet 14 respectively close the feed opening 152 and the powder falling hole 132, so as to prevent the powder 20 in the feed opening 152 of the material placing area 151 from scattering onto the fixed metal sheet 13, and further stop the powder 20 from continuing to fill the mold cavity 123 (as shown in fig. 12 (b)).

Further, as shown in fig. 10, 11, 12 (a) to 12 (b), the fixing metal sheet 13 has a thickness t that can be adjusted according to a height of the copper pillar 21 so that the upper end 211 of the copper pillar 21 protruding into the positioning hole 131 does not exceed the thickness t of the fixing metal sheet 13. For example, the thickness t of the fixed metal sheet 13 is thicker when the height of the copper pillar 21 is higher (i.e., axially longer), and the thickness t of the fixed metal sheet 13 is thinner when the height of the copper pillar 21 is lower (i.e., axially shorter). In some implementations, the thickness t can be adjusted by a single fixed metal sheet 13 of different thickness, or by stacking multiple fixed metal sheets 13 of the same or different thickness together, depending on the height of the copper pillar 21. And by virtue of the thickness t of the fixed metal sheet 13 being greater than the length of the upper end 211 of the copper pillar 21 protruding from the upper surface 121 of the carrier 12, a clearance 135 (as shown in enlarged schematic view in fig. 11) is formed between the upper end 211 of the copper pillar 21 and the lower surface 142 of the movable metal sheet 14. The upper end 211 of the copper pillar 21 does not touch the lower surface 142 of the movable metal sheet 14 by the clearance 135. Therefore, the movable metal sheet 14 does not touch the upper end 211 of the copper pillar 21 when moving, so that it can be stably and straightly arranged in the mold cavity 123.

And E (S5 a) sintering the copper column and the annular powder in the mold cavity together through a heating process to change the annular powder into a sintered ring body to be combined on the outer surface of the copper column, so that the copper column and the annular powder form an integrated structure without an assembly gap.

In this step, as shown in fig. 12 (c) and 12 (d), the fixed metal sheet 13 and the movable metal sheet 14 and the powder leakage cover 15 are removed. Then, the carrier 12 and the copper pillar 21 having the annular powder 22 are heated in a heating furnace (e.g., a sintering furnace), and the annular powder 22 is bonded to the outer surface 213 of the copper pillar 21 by the sintering ring 22, so that the carrier and the copper pillar have an integrated structure without a fitting gap. In other embodiments, the carrier 12 and the base 11 may be heated in a furnace, and the base 11 may be made of the same material as the carrier 12 to withstand the sintering temperature.

The following is the implementation of the integrated ring copper pillar structure applied to the two-phase flow device.

With continued reference to fig. 13 and 14, and with reference to fig. 12 (a) to 12 (d), the integrated ring copper pillar structure can be applied in a temperature equalization plate 30. The upper end 211 of the copper pillar 21 protrudes flush or slightly beyond an upper end 221 of the sintered ring body 22, in this embodiment, the upper end 211 of the copper pillar 21 protrudes beyond the upper end 221 of the sintered ring body 22 and forms an upper level difference h1 (as shown in fig. 12 (d)). And the lower end 212 of the copper pillar 21 protrudes slightly beyond the lower end 222 of the sintered ring body 22 by the depth d of the fixing portion 1232 to form a lower height difference h2 (as shown in fig. 12 (d)). By means of the upper and lower height differences h1 and h2 between the two ends of the copper pillar 21 and the two ends of the sintering ring 22, the thickness of a capillary structure 303 on the inner surfaces of an upper cover 301 and a lower cover 302 of the temperature equalizing plate 30 can be matched. The upper ends 211 and the lower ends 212 of the copper pillars 21 are respectively connected to the inner surfaces of the upper cover 301 and the lower cover 302, and the upper ends 221 and the lower ends 222 of the sintered ring body 22 can respectively contact or combine with the capillary structures 303 on the inner surfaces of the upper cover 301 and the lower cover 302. By using the copper pillars 21 as support pillars, the structural strength of the temperature uniformity plate 30 against external pressure or internal vapor pressure is assisted, and the sintered ring 22 is used as a back flow capillary structure for vapor-liquid circulation of the working liquid in the temperature uniformity plate 30.

As described above, the copper pillar 21 and the sintered ring 22 of the integrated ring copper pillar structure completed by the above-mentioned jig and steps have no assembly gap, so as to solve the problem of water accumulation in the assembly gap in the prior art or process, and cause the defect that the copper pillar and the sintered ring expand (bulge) and separate from the pillar due to water accumulation and icing.

While the invention has been described in detail in the foregoing description, the same is to be considered as illustrative and not restrictive in character, for the invention to be limited to the preferred embodiments shown and described. All such equivalent changes and modifications as set forth in the claims should be construed to fall within the scope of the present invention.

Claims (7)

1. A jig is characterized in that: comprising the following steps:

a carrier having a top surface and a bottom surface, the top surface having a plurality of mold cavities;

the movable metal sheet is provided with an upper surface, a lower surface and a plurality of groups of powder inlet holes, each group of powder inlet holes penetrates through the upper surface and the lower surface, and the movable metal sheet is arranged above the carrier and can reciprocate relative to the carrier so that each group of powder inlet holes and the mold cavity of the carrier form alignment or dislocation due to the reciprocating movement;

the powder leakage cover is arranged above the movable metal sheet and is provided with a material placing area, a plurality of material feeding openings are arranged in the material placing area, and each material feeding opening forms alignment or dislocation with each group of powder feeding holes when the movable metal sheet moves back and forth.

2. The jig of claim 1, wherein: the carrier is positioned on a base, the movable metal sheet is provided with a plurality of movable holes, the powder leakage cover is provided with a plurality of first positioning holes, the base is provided with a seating area and a plurality of positioning pins, the seating area is used for placing the carrier, and the plurality of positioning pins are correspondingly used for positioning the plurality of movable holes of the movable metal sheet and the plurality of first positioning holes of the powder leakage cover.

3. The jig of claim 2, wherein: at least one fixed metal sheet is arranged between the top surface of the carrier and the lower surface of the movable metal sheet, a through hole is respectively arranged on the fixed metal sheet corresponding to each mold cavity, a group of powder falling holes are arranged on the outer side of each through hole and are communicated with the mold cavity, and the movable metal sheet can reciprocate relative to the fixed metal sheet so that each group of powder inlet holes of the movable metal sheet and each group of powder falling holes of the fixed metal sheet form alignment or dislocation.

4. A jig according to claim 3, wherein: the fixed metal sheet is provided with a plurality of second positioning holes which are correspondingly positioned by the plurality of positioning pins.

5. The jig of claim 1, wherein: each mold cavity is provided with a cavity bottom, the cavity bottom is provided with a fixing part, the fixing part is communicated with a powder discharge hole, and the powder discharge hole is positioned below the fixing part and penetrates through the bottom surface of the carrier; a protruding part is protruded from one edge of the movable metal sheet.

6. An integrated ring copper pillar structure manufactured by the jig of any one of claims 1 to 5, characterized in that: comprising:

a copper pillar having an upper end and a lower end and an outer surface, the outer surface being formed with a sintered ring body, the sintered ring body and the copper pillar being sintered together into an integral structure without assembly gaps.

7. The integrated ring copper pillar structure of claim 6, wherein: the upper end of the copper column is flush with or protrudes out of an upper end of the sintering ring body, and the lower end of the copper column protrudes out of a lower end of the sintering ring body.