TWM622381U - Transducer - Google Patents

Abstract

A transducer is provided. The transducer has two portions. First portion includes a first substrate and a first element. Second portion includes a second substrate having an aperture, a carrier formed on the aperture and fixed to second substrate with its edge, a second element formed on the carrier. With a magnetic element as an example, when a current is inputted to the second element, a magnetic field is induced and interacted with the first element. The carrier is such as a diaphragm that can be vibrated as the current changes. The transducer is formed with combining the first portion and the second portion. The first element or the second element can be a microcoil element or an array-type microcoil element that is formed by multiple turns of continuous metal line segments.

Description

換能元件Transducing element

說明書提出一種換能元件，特別是一種具有多圈金屬線段形成的微線圈元件的換能元件。 The specification proposes a transducer element, especially a transducer element with a micro-coil element formed by multiple turns of metal wire segments.

常見可以形成磁場的磁性元件如磁鐵或金屬繞線形成的線圈等都具有一定的體積與重量，若應用於電子裝置中，常會使得電子裝置變重，或是需要有一定安裝這些磁性元件的容置空間。 Common magnetic components that can form a magnetic field, such as magnets or coils formed by metal windings, have a certain volume and weight. If they are used in electronic devices, they will often make the electronic device heavier, or require a certain capacity to install these magnetic components. set space.

傳統需要微型化的電子裝置例如耳機、助聽器或小型揚聲器，其中採用的磁性元件一般需要特殊材料或設計才能安裝在裝置中，但是卻有形成特定磁場強度的需求以及相關物理限制而限制微型化的問題，特別是在微型化的需求下而要刻意減少磁性元件的體積與重量，也因此減損了磁性元件的效果。 Traditional electronic devices that require miniaturization, such as earphones, hearing aids or small speakers, generally use magnetic components that require special materials or designs to be installed in the device, but there are requirements to form a specific magnetic field strength and related physical constraints that limit miniaturization. The problem is that the volume and weight of the magnetic element must be deliberately reduced under the requirement of miniaturization, and thus the effect of the magnetic element is detracted.

雖然有習知技術在能產生磁場的磁性元件的材料上有顯著的進步，但仍有物理上的限制，以及成本較高的問題。 Although there are significant advances in the materials of magnetic elements capable of generating magnetic fields in the prior art, there are still physical limitations and high costs.

揭露書提出一種換能元件，換能元件主要有兩部份，形成換能元件的第一部份的步驟包括先備置第一基材，再於第一基材上形成一乘載件，接著於承載件上結合第一元件，使得第一元件連接第一基材；形成換能 元件的第二部份的步驟包括備置第二基材，再於第二基材上形成一孔洞，接著在此孔洞上形成一載體，載體之邊緣可固定至第二基材上，之後，使得載體結合第二元件。經結合第一部份與第二部份後形成換能元件。 The disclosure proposes a transducer element. The transducer element mainly has two parts. The step of forming the first part of the transducer element includes firstly disposing a first substrate, then forming a carrier on the first substrate, and then Combining the first element on the carrier so that the first element is connected to the first substrate; forming a transduction The step of the second part of the device includes preparing a second substrate, forming a hole on the second substrate, then forming a carrier on the hole, the edge of the carrier can be fixed on the second substrate, and then making The carrier binds the second element. The transducer element is formed by combining the first part and the second part.

進一步地，所述第二部份的第二基材可為一電路板，用於支撐載體，第二元件可通過打線或覆晶方式電連接至此電路板，並結合至第二基材，即第二電路板。當通過此第二電路板導入電流至第二元件時，產生的磁場可與第一基材上的第一元件交互作用，使得載體隨著電流改變而振動。 Further, the second substrate of the second part can be a circuit board for supporting the carrier, and the second element can be electrically connected to the circuit board by wire bonding or flip chip, and bonded to the second substrate, namely second circuit board. When a current is introduced to the second element through this second circuit board, the magnetic field generated can interact with the first element on the first substrate, causing the carrier to vibrate as the current changes.

在一實施例中，所述換能元件可以實現一個將電氣信號轉為音波信號的揚聲元件，其中載體則實現其中的音膜；更者，換能元件將電氣信號轉換為振動信號時，可以實現形式的馬達中的驅動元件。 In one embodiment, the transducer element can realize a speaker element that converts an electrical signal into a sound wave signal, and the carrier realizes the sound membrane therein; moreover, when the transducer element converts the electrical signal into a vibration signal, The drive element in the motor can be realized in the form.

進一步地，第一基材可為第一電路板，第一元件通過打線或覆晶方式電連接至此第一電路板，第一電路板通過一導電材料連接第二部份的第二基材，即第二電路板，之後可再以一封裝體保護第一元件。 Further, the first substrate may be a first circuit board, the first element is electrically connected to the first circuit board by wire bonding or flip chip, and the first circuit board is connected to the second substrate of the second part through a conductive material, That is, the second circuit board, and then a package body can be used to protect the first element.

當結合第一部份與第二部份之後，並置入一殼體內，殼體上也可形成一或多處空氣流通的結構，形成一換能裝置。 After the first part and the second part are combined and placed in a casing, one or more air-flowing structures can also be formed on the casing to form a transducer device.

進一步地，所述第一元件或第二元件可為一種由多圈金屬線段形成的微線圈元件，或由多個微線圈元件形成的陣列式微線圈元件。每個微線圈元件包括有一佈線層，其中設有多段由一起始點開始並環繞起始點形成多圈連續佈線的金屬線段，每個金屬線段的兩端為第一電極端與第二電極端，其中起始點為微線圈元件的第一電極，多段連續佈線的金屬線段的末端為此微線圈元件的第二電極；每個微線圈元件包括一電極層，設有第一電極區與第二電極區，第一電極區用以匯集多段金屬線段中各金屬線段的第一電極端，以及第二電極區用以匯集多段金屬線段中各金屬線段的第二電極端。 Further, the first element or the second element may be a micro-coil element formed by multiple turns of metal wire segments, or an array-type micro-coil element formed by a plurality of micro-coil elements. Each micro-coil element includes a wiring layer, in which there are multiple metal wire segments starting from a starting point and surrounding the starting point to form multiple continuous wirings. The two ends of each metal wire segment are the first electrode terminal and the second electrode terminal. , wherein the starting point is the first electrode of the micro-coil element, and the end of the metal wire segment of the multi-segment continuous wiring is the second electrode of the micro-coil element; each micro-coil element includes an electrode layer, which is provided with a first electrode area and a second electrode Two electrode regions, the first electrode region is used for collecting the first electrode ends of each metal line segment in the multi-segment metal line segment, and the second electrode region is used for collecting the second electrode end of each metal line segment in the multi-segment metal line segment.

為使能更進一步瞭解本新型的特徵及技術內容，請參閱以下有 關本新型的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本新型加以限制。 In order to further understand the features and technical content of the new model, please refer to the following Regarding the detailed description and drawings of the present invention, the drawings provided are only for reference and description, and are not intended to limit the present invention.

101:載體 101: Carrier

102:懸邊 102: Overhang

103:第二磁性元件 103: Second magnetic element

105:定芯支片 105: Fixed core support

107:墊圈 107: Gasket

109:第一磁性元件 109: The first magnetic element

111:導磁元件 111: Magnetic components

113:殼體 113: Shell

20:金屬線 20: Metal Wire

21:第一電極 21: The first electrode

22:第二電極 22: Second electrode

30:微線圈單元 30: Micro coil unit

31:第一電極 31: The first electrode

32:第二電極 32: Second electrode

301,302,303,304,305,306,307,308,309,310:金屬線段 301, 302, 303, 304, 305, 306, 307, 308, 309, 310: Metal segments

40:接點單元 40: Contact unit

31’:第一電極接點 31': The first electrode contact

32’:第二電極接點 32': The second electrode contact

41:接點 41: Contact

50:陣列式微線圈元件 50: Arrayed Microcoil Elements

60:換能元件 60: Transducer element

601:載體 601: Carrier

603:第二基材 603: Second substrate

605:第二元件 605: Second element

607:側面牆 607: Side Wall

608:第一基材 608: First Substrate

609:第一元件 609: The first element

611:承載片 611: Carrier sheet

613:第二元件打線 613: The second component is wired

615:第一元件打線 615: The first component is wired

701:第一基材 701: First Substrate

701’:具有空氣閥的第一基材 701': First substrate with air valve

703:承載件 703: Carrier

705:第一晶片 705: First wafer

707:打線 707: Wire

709:封裝體 709: Package body

801:第二基材 801: Second Substrate

801’:具有孔洞的第二基材 801': Second substrate with holes

803:孔洞 803: Hole

805:載體 805: Carrier

807:電路板 807: circuit board

809:第二晶片 809: Second wafer

811:打線 811: Wire

90:導電膠 90: Conductive glue

10:側面牆 10: Side Walls

11:側面牆 11: Side Walls

12a,12b,12c,12d:側面牆 12a, 12b, 12c, 12d: Side Walls

110:電路板 110: circuit board

112:導磁金屬 112: Magnetically conductive metal

121:電路板 121: circuit board

123:導磁金屬 123: Magnetically conductive metal

125:磁性元件 125: Magnetic Components

127:打線 127: Wire

131:電路板 131: circuit board

133:導磁金屬 133: Magnetically conductive metal

135:磁性元件 135: Magnetic Components

137:焊接點 137: Welding point

141:電路板 141: circuit board

143:磁性元件 143: Magnetic Components

145:焊接點 145: Welding point

151:載體 151: Carrier

153:懸邊 153: Overhang

155:第二磁性元件 155: second magnetic element

157:側面牆 157: Side Wall

158:第一磁性元件 158: The first magnetic element

159:電路板 159: circuit board

171:音膜 171: Sound film

173:懸邊 173: Overhang

175:第二磁性元件 175: Second Magnetic Element

177:第一磁性元件 177: First Magnetic Element

179:電路板 179: circuit board

176,178:氣孔 176, 178: Stomata

181:音膜 181: Sound film

182,189:懸邊 182, 189: Overhang

183:第二磁性元件 183: Second Magnetic Element

185:金屬結構 185: Metal Structure

187:第一磁性元件 187: First Magnetic Element

186,188:氣孔 186, 188: Stomata

步驟S171~S193製作換能元件的流程 Steps S171~S193 The process of making the transducer element

圖1顯示換能元件的內部構造實施例示意圖；圖2顯示微線圈元件的實施例圖；圖3顯示微線圈元件上佈線的實施例之一示意圖；圖4顯示微線圈元件上另一接點面的實施例之一示意圖；圖5顯示以微線圈元件形成陣列式微線圈元件的多個實施例示意圖；圖6顯示換能元件的實施例示意圖；圖7(A)(B)(C)(D)(E)顯示製作換能元件之第一部份的實施例示意圖；圖8(A)(B)(C)(D)(E)顯示製作換能元件之第二部份的實施例示意圖；圖9顯示換能元件之結構實施例示意圖；圖10(A)(B)(C)顯示換能元件之側面結構實施例示意圖；圖11顯示換能元件中導磁結構實施例示意圖；圖12顯示換能元件中晶片結構實施例示意圖之一；圖13顯示換能元件中晶片結構實施例示意圖之二；圖14顯示換能元件中晶片結構實施例示意圖之三；圖15顯示換能元件的結構實施例示意圖；圖16顯示換能元件的實施例立體視圖；圖17顯示以換能元件實現揚聲元件的實施例圖之一； 圖18顯示以換能元件實現揚聲元件的實施例圖之二；以及圖19顯示應用微線圈元件換能元件的製作方法實施例流程圖。 Fig. 1 shows a schematic diagram of an embodiment of the internal structure of the transducer element; Fig. 2 shows an embodiment diagram of the micro-coil element; Fig. 3 shows a schematic diagram of one embodiment of the wiring on the micro-coil element; Fig. 4 shows another contact point on the micro-coil element Fig. 5 shows a schematic diagram of a plurality of embodiments of forming an arrayed micro-coil element with micro-coil elements; Fig. 6 shows a schematic diagram of an embodiment of a transducer element; Fig. 7(A)(B)(C)( D)(E) shows a schematic diagram of an embodiment of making the first part of the transducer element; FIG. 8(A)(B)(C)(D)(E) shows an embodiment of making the second part of the transducer element Schematic diagram; Figure 9 shows a schematic diagram of a structural embodiment of a transducer element; Figure 10 (A) (B) (C) shows a schematic diagram of a side structure embodiment of the transducer element; Figure 11 shows a schematic diagram of an embodiment of the magnetically conductive structure in the transducer element; Figure 12 shows the first schematic diagram of the chip structure in the transducer element; Figure 13 shows the second schematic diagram of the chip structure in the transducer element; Figure 14 shows the third schematic diagram of the chip structure in the transducer element; Figure 15 shows the transducer element Schematic diagram of the structural embodiment of the element; FIG. 16 shows a perspective view of an embodiment of the transducer element; FIG. 17 shows one of the embodiments of the speaker element realized by the transducer element; FIG. 18 shows the second embodiment of the transducer element to realize the speaker element; and FIG. 19 shows the flow chart of the embodiment of the manufacturing method of the transducer element using the micro-coil element.

以下是通過特定的具體實施例來說明本創作的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本創作的構思下進行各種修改與變更。另外，本創作的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本創作的相關技術內容，但所公開的內容並非用以限制本創作的保護範圍。 The following are specific specific examples to illustrate the implementation of the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings in this creation are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present creation in detail, but the disclosed contents are not intended to limit the protection scope of the present creation.

應當可以理解的是，雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號，但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一信號與另一信號。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

根據揭露書所揭示實施例，提出一種換能元件，換能元件的主要目的之一是能夠將電氣信號轉換為振動信號，例如聲波，例如揚聲器中的揚聲元件、馬達中的驅動元件，根據實施例之一，所實現的揚聲元件可以微型化線圈元件形成的磁性元件取代傳統揚聲元件中線圈與磁鐵等傳統磁性元件，將電氣信號轉為振動信號所實現的揚聲元件例如為耳機、助聽器、喇叭等裝置中執行電氣信號轉為聲波信號的電子元件。 According to the embodiments disclosed in the disclosure, a transducer element is proposed. One of the main purposes of the transducer element is to convert an electrical signal into a vibration signal, such as a sound wave, such as a speaker element in a speaker and a drive element in a motor. In one embodiment, the realized speaker element can be a magnetic element formed by a miniaturized coil element to replace traditional magnetic elements such as coils and magnets in the traditional speaker element, and the speaker element realized by converting an electrical signal into a vibration signal is, for example, an earphone. , Hearing aids, speakers and other devices that perform the conversion of electrical signals into sound wave signals.

圖1顯示為換能元件實施例示意圖。 FIG. 1 shows a schematic diagram of an embodiment of a transducer element.

圖中顯示為一個換能元件中的主要元件，其中提出一載體101， 此為通過振動而發聲的元件，固定在一懸邊(dangling edge)102上，並結合於第二磁性元件103以及固定此第二磁性元件103的定芯支片105中，這幾個元件可以再裝設於墊圈107中，其他的元件還有另一側的導磁元件111與第一磁性元件109，最後安裝在殼體113內。 The figure shows the main elements of a transducer element, in which a carrier 101 is proposed, This is an element that emits sound through vibration, which is fixed on a dangling edge 102 and is combined with the second magnetic element 103 and the fixed core support 105 for fixing the second magnetic element 103. These elements can be It is then installed in the washer 107 , and the other components include the magnetic conductive element 111 and the first magnetic element 109 on the other side, and finally installed in the housing 113 .

其中載體101以音膜為例，可依照不同音頻選擇不同的材料，例如可以產生高音的音膜材料可以是陶瓷、玻璃或金屬；產生低音的音膜材料例如碳材、塑料(如PEI、PEK、PET等)，或特定金屬合金。其中第二磁性元件103傳統上以線圈為主，經通入電流後，在線圈上形成磁場，可與其中引導磁場的導磁元件111與第一磁性元件109(如磁鐵或其他可以感應形成磁場的元件)交互作用，載體101可以為一種可隨著磁場改變而運動的振膜，因此通過改變電流與方向形成可以改變極性的磁場，即可帶動振膜前後運動，就會因為振動而推動空氣產生聲音。 The carrier 101 is a sound film as an example, and different materials can be selected according to different audio frequencies. For example, the sound film material that can generate high sound can be ceramic, glass or metal; , PET, etc.), or specific metal alloys. The second magnetic element 103 is traditionally mainly a coil. After passing a current, a magnetic field is formed on the coil, which can form a magnetic field with the magnetic conductive element 111 and the first magnetic element 109 (such as a magnet or other inductive magnetic field) in which the magnetic field is guided. The carrier 101 can be a diaphragm that can move with the change of the magnetic field, so by changing the current and direction to form a magnetic field that can change the polarity, the diaphragm can be driven to move back and forth, and the air will be pushed due to vibration produce sound.

以揚聲元件為例，其中的其他元件如定芯支片105，這是作為阻尼之用，用來穩定第二磁性元件103的振動。還有設於側面牆上的空氣閥，例如可在換能元件側邊或者底部開洞，讓空氣進出，使得推動空氣產生的聲音可以輸出。特別的是，以換能元件實現的揚聲元件中的第二磁性元件103與第一磁性元件109可以是一種以半導體製程製作的微線圈元件，打線(wire bonding)或者覆晶(flip chip)方式電連接其驅動電路。換能元件中的兩個磁性元件(103、109)可以都採用這種微線圈元件，或是由多個微線圈元件形成的陣列式微線圈元件，或是其中之一採用即可，另一則為特定磁性物體即可。 Taking the speaker element as an example, other elements in it, such as the fixed core support piece 105 , are used for damping, and are used to stabilize the vibration of the second magnetic element 103 . There is also an air valve on the side wall, for example, a hole can be opened on the side or bottom of the transducer element to allow air to enter and exit, so that the sound produced by pushing the air can be output. In particular, the second magnetic element 103 and the first magnetic element 109 in the speaker element implemented by the transducer element may be a micro-coil element fabricated by a semiconductor process, wire bonding or flip chip. way to electrically connect its drive circuit. The two magnetic elements (103, 109) in the transducer element can both use this micro-coil element, or an array-type micro-coil element formed by a plurality of micro-coil elements, or one of them can be used, and the other is A specific magnetic object is sufficient.

繼續以揚聲元件為例，當以單一或陣列式微線圈元件實現所述磁性元件(103、109)時，微線圈元件經通電後可以產生磁場，因為阻抗的控制更好，帶動載體101與其懸邊102的運動可更為細緻與輸出更好的聲音。 應用於如上述換能元件內的磁性元件(第一磁性元件109、第二磁性元件103)實施例示意圖可參考圖2至5顯示的單一微線圈元件或是多個微線圈元件組成的陣列式微線圈元件。 Continuing to take the speaker element as an example, when the magnetic element (103, 109) is implemented with a single or arrayed micro-coil element, the micro-coil element can generate a magnetic field after being energized, because the impedance is better controlled, driving the carrier 101 to its suspension The movement of the side 102 can be more detailed and output better sound. The schematic diagrams of the embodiments of the magnetic elements (the first magnetic element 109 and the second magnetic element 103 ) applied to the above-mentioned transducer elements can refer to the single micro-coil element shown in FIGS. coil element.

微線圈元件的基本結構如圖2顯示的實施例圖，所示微線圈元件可以鍍層或金屬化製程，或是光罩與蝕刻製程在一基材(如一種絕緣體)上形成一連續金屬線20，並在金屬線20兩端形成電接點，一端第一電極21可以是微線圈元件的負極，另一端第二電極22可以是微線圈元件的正極。 The basic structure of the micro-coil element is shown in the embodiment diagram shown in FIG. 2. The micro-coil element can be formed by a plating or metallization process, or a photomask and an etching process to form a continuous metal line 20 on a substrate (such as an insulator). , and electrical contacts are formed at both ends of the metal wire 20, the first electrode 21 at one end can be the negative electrode of the micro-coil element, and the second electrode 22 at the other end can be the positive electrode of the micro-coil element.

微線圈元件經連接電源通電後，流經其中的穩定電流可以在微線圈元件上形成一個均勻磁場，當中的金屬線20的材料、線寬、長度、圈數等都是決定整個微線圈元件阻抗值的參數，因此在設計此微線圈元件，需要知道阻抗以及想要形成的磁場條件。 After the micro-coil element is connected to the power supply and energized, the stable current flowing through it can form a uniform magnetic field on the micro-coil element. The material, line width, length and number of turns of the metal wire 20 in it all determine the impedance of the entire micro-coil element. Therefore, when designing this microcoil element, you need to know the impedance and the magnetic field conditions you want to form.

根據揭露書所提出微線圈元件的主要實施樣態是，將微線圈元件上的金屬線根據需求形成多個斷點，如圖3所示微線圈元件上佈線的實施例之一示意圖。 According to the main implementation of the micro-coil element proposed in the disclosure, a plurality of breakpoints are formed on the metal wire on the micro-coil element according to requirements, as shown in FIG.

圖3中顯示一個微線圈單元30，主要結構有圖示的佈線層，另有電極層，佈線層上設有多段由一起始點開始並環繞此起始點形成多圈連續佈線的金屬線段(301,302,…,310)，起始點可設於微線圈元件的任一位置，較佳可如微線圈元件中靠近中央區域的位置，但並不以此為限，可根據實際需求決定起始點位置。此起始點形成第一電極31，例如是微線圈元件的負極，而金屬線段的末端，也就是多段連續佈線的金屬線段的末端為微線圈元件的第二電極32，可為微線圈元件的正極。 A micro-coil unit 30 is shown in FIG. 3. The main structure includes a wiring layer as shown in the figure, and an electrode layer. The wiring layer is provided with a plurality of metal line segments ( 301, 302, . point location. This starting point forms the first electrode 31, for example, the negative electrode of the microcoil element, and the end of the metal line segment, that is, the end of the metal line segment of the multi-segment continuous wiring, is the second electrode 32 of the microcoil element, which can be the end of the microcoil element. positive electrode.

多段金屬線段(301,302,...,310)中每個金屬線段都有兩個端點，其中之一為第一電極端，如較靠近起始點形成的第一電極31的一端；另一端為第二電極32，則為較靠近金屬線段末端的端點。 Each of the multi-segment metal line segments (301, 302, . is the second electrode 32, and is the end point closer to the end of the metal line segment.

接著如圖4所示，此圖顯示為圖3所示微線圈元件中另一接點面的實施例之一示意圖。此圖顯示為微線圈元件對應佈線層上多個金屬線段兩端點的接點41，以及對應第一電極31與第二電極32的另一側電極，如第一電極接點31’與第二電極接點32’。 Next, as shown in FIG. 4 , this figure is a schematic diagram of an embodiment of another contact surface of the microcoil element shown in FIG. 3 . This figure shows that the micro-coil element corresponds to the contacts 41 at the two ends of the multiple metal line segments on the wiring layer, and the other side electrodes corresponding to the first electrode 31 and the second electrode 32, such as the first electrode contact 31' and the first electrode Two electrode contacts 32'.

根據圖3與圖4顯示的微線圈元件中佈線層的結構特徵，可知，所提出的微線圈元件的設計可以根據實際需求(如阻抗值、磁場或尺寸)決定其中多段金屬線段的一總長、一線寬、鄰近金屬線段之間的一線距、各金屬線段的一長度、一圈數、一圈距以及/或金屬線段的材料等。所述實際需求主要是所應用的微線圈裝置的需求，根據此需求還可決定使用單一微線圈元件，或是如圖5所示的以多個微線圈元件形成陣列式微線圈元件的實施例。 According to the structural features of the wiring layer in the micro-coil element shown in FIGS. 3 and 4 , it can be seen that the design of the proposed micro-coil element can determine the total length, Line width, line spacing between adjacent metal line segments, a length of each metal line segment, the number of turns, a turn distance, and/or the material of the metal line segments, etc. The actual requirement is mainly the requirement of the applied micro-coil device. According to this requirement, a single micro-coil element or an embodiment of forming an array-type micro-coil element with a plurality of micro-coil elements as shown in FIG. 5 can also be determined.

根據圖5顯示由多個以陣列排列的微線圈單元30組成的陣列式微線圈元件50，圖示的陣列式微線圈元件50形狀與其中微線圈元件的數量都不是用來限制其實施範圍。 5 shows an arrayed microcoil element 50 composed of a plurality of microcoil units 30 arranged in an array. The illustrated shape of the arrayed microcoil element 50 and the number of the microcoil elements are not intended to limit its implementation range.

同樣地，圖中單一微線圈元件30仍具有上述實施例所描述的佈線層，其中設有多段由一起始點開始並環繞此起始點形成多圈連續佈線的金屬線段，以及電極層，其中設有分別匯集各金屬線段的第一電極端與第二電極端的至少一第一電極區與至少一第二電極區，依照實際需求與設計可以為一個或一個以上的第一電極區與第二電極區。值得一提的是，匯集各金屬線段的第一電極端與第二電極端的第一電極區與第二電極區可以通過另一元件中的電連接層實現匯集各電極端的功能，例如，在此電連接層中，可以多條金屬線將佈線層上各金屬線段的第一電極端通過其基材上的導孔(via)或導線導向在所述電極層的第一電極區，亦將各金屬線段的第二電極端導向在電極層的第二電極區。 Similarly, the single micro-coil element 30 in the figure still has the wiring layer described in the above-mentioned embodiment, wherein there are multiple metal line segments starting from a starting point and forming multiple circles of continuous wiring around the starting point, and an electrode layer, wherein There are at least one first electrode area and at least one second electrode area that respectively gather the first electrode end and the second electrode end of each metal line segment. According to actual needs and designs, there can be one or more first electrode areas and second electrode areas. electrode area. It is worth mentioning that the first electrode area and the second electrode area that gather the first electrode end and the second electrode end of each metal line segment can realize the function of gathering each electrode end through the electrical connection layer in another element. For example, here In the electrical connection layer, a plurality of metal wires can be used to guide the first electrode end of each metal wire segment on the wiring layer to the first electrode region of the electrode layer through vias or wires on the substrate, and also connect each metal wire segment to the first electrode region of the electrode layer. The second electrode end of the metal line segment is led to the second electrode region of the electrode layer.

除以上實施例，單一微線圈元件的形狀與其中圈數或是各線段 長度與寬度都不限於上述方形的實施例，而可以依照實際需求設計成不同形狀，所示陣列式微線圈元件中亦可根據實際需求(如磁場的需求)設有形狀或尺寸不一的多個微線圈元件，在此不再贅述。 In addition to the above embodiments, the shape of a single micro-coil element is related to the number of turns or each line segment. The length and width are not limited to the above-mentioned square embodiments, but can be designed into different shapes according to actual needs. The array micro-coil element shown can also be provided with a plurality of different shapes or sizes according to actual needs (such as the needs of the magnetic field). The micro-coil element will not be repeated here.

在此一提的是，除了可以在特定用途有特別考量的設計外，根據主要的實施例，每個如圖3與圖5顯示的單一微線圈元件經通電後可讓多個金屬線段中形成方向一致的電流，即可形成一個等效一多匝線圈形成的磁場，若以多個微線圈元件30組成的陣列式微線圈元件50，整體上還能產生一個可以消除個別微線圈元件邊緣較弱的不均勻磁場的等效磁場。 It should be mentioned here that, in addition to the design that can be specially considered for specific applications, according to the main embodiment, each single micro-coil element as shown in FIG. Currents in the same direction can form an equivalent magnetic field formed by a multi-turn coil. If an array-type micro-coil element 50 composed of a plurality of micro-coil elements 30 is used, it can also generate a magnetic field that can eliminate the weak edge of individual micro-coil elements as a whole. The equivalent magnetic field of the inhomogeneous magnetic field.

在此一提的是，以上顯示的微線圈單元30或是陣列式微線圈元件50並不限於所示圖例，其中各微線圈單元中多個金屬線段的起始點(如圖3顯示的第一電極31)除了可以為靠近中央區域的電極端，起始點還可依照實際設計設於偏離中央的任一位置。 It should be mentioned here that the micro-coil unit 30 or the array-type micro-coil element 50 shown above is not limited to the illustrated example, wherein the starting points of a plurality of metal line segments in each micro-coil unit (the first one shown in FIG. 3 ) The electrode 31) can be not only the electrode end close to the central area, but also the starting point can be set at any position deviated from the center according to the actual design.

進一步地，在製作以單一微線圈元件或陣列式微線圈元件實現的磁性元件的實施例中，可以有多種方式增加磁性元件的導磁性。例如，在一實施例中，製作具有多層結構的磁性元件時，可以有一或多層結構不做線路，而是鍍上導磁物質，用以增加磁性元件整體導磁性。在另一實施例中，也可以選擇磁性元件的材料時，選擇有參雜導磁性元素的基材製作磁性元件，可以有效增加磁性元件整體導磁性。於再一實施例中，在磁性元件製作完成後，可直接在一側的結構上鍍上一層導磁物質，以增加元件的導磁性。 Further, in the embodiment of manufacturing the magnetic element realized by a single micro-coil element or an arrayed micro-coil element, there may be various ways to increase the magnetic permeability of the magnetic element. For example, in one embodiment, when fabricating a magnetic element with a multi-layer structure, one or more of the multi-layer structures may be coated with a magnetic conductive material instead of wiring, so as to increase the overall magnetic conductivity of the magnetic element. In another embodiment, when selecting the material of the magnetic element, a base material doped with magnetically permeable elements can be selected to make the magnetic element, which can effectively increase the overall magnetic permeability of the magnetic element. In yet another embodiment, after the magnetic element is fabricated, a layer of magnetic conductive material can be directly plated on one side of the structure to increase the magnetic conductivity of the element.

接著如圖6所示換能元件的實施例示意圖，此圖顯示有一換能元件60，此換能元件60的結構在側面牆607的包覆中包括有兩部份。 Next, as shown in FIG. 6 , a schematic diagram of an embodiment of the transducer element is shown. This figure shows a transducer element 60 . The structure of the transducer element 60 includes two parts in the cladding of the side wall 607 .

第一部份如換能元件中的下半部結構，其中第一基材608可以為一般塑膠基材，或是電路板，在此第一基材608上形成一承載片611，接著在承載片611上結合一個元件，此例顯示形成第一元件609。根據實施例，第一 元件609可以是固定的元件，可為針對特定需求而製作的元件，實施例如一個磁性元件，可以是各種能形成磁場的元件，以此連接承載片611，如導磁片，通過第一元件打線615電連接電路板，通電後可以產生固定磁場，在另一實施例中亦可為磁鐵等磁性物體，主要目的是能夠在元件中形成穩定的磁場。 The first part is the lower half structure of the transducer element, wherein the first base material 608 can be a general plastic base material or a circuit board, a carrier sheet 611 is formed on the first base material 608, and then a carrier sheet 611 is formed on the first base material 608 Sheet 611 is bonded to an element, this example showing forming the first element 609 . According to an embodiment, the first The element 609 can be a fixed element, or an element made for specific needs, such as a magnetic element, or various elements that can form a magnetic field, so as to connect the carrier sheet 611, such as a magnetic conductive sheet, and wire through the first element The 615 is electrically connected to the circuit board, and can generate a fixed magnetic field after being energized. In another embodiment, it can also be a magnetic object such as a magnet. The main purpose is to form a stable magnetic field in the element.

第二部份如換能元件的上半部結構，載體601可通過彈性結構連接著第二基材603，第二基材603較佳地是以彈性物質支撐載體601與一元件，此元件可以為圖示的第二元件605，第二基材603可同時擁有連接電路之功能，又有穩定元件振動產生阻尼效果，如一種連接柔性電路板(Flexible Printed Circuit，FPC)。在載體601上連結元件，實施例如第二元件605，第二元件605可如一般線圈或是上述實施例所提出的微線圈單元或陣列式微線圈單元，通過第二元件打線613電連接第二基材603，經過通電後產生與第一元件609的交互作用而產生振動。 The second part is the upper half structure of the transducer element. The carrier 601 can be connected to the second substrate 603 through an elastic structure. The second substrate 603 preferably supports the carrier 601 and an element with an elastic material. The element can For the second element 605 shown in the figure, the second substrate 603 can simultaneously have the function of connecting the circuit, and also has the function of stabilizing the vibration of the element to produce damping effect, such as a flexible printed circuit (FPC) connection. Elements are connected on the carrier 601 , such as the second element 605 . The second element 605 can be a general coil or the micro-coil unit or the array-type micro-coil unit proposed in the above-mentioned embodiments, and the second element is electrically connected to the second substrate through the second element bonding wire 613 . The material 603, after being electrified, interacts with the first element 609 to generate vibration.

在此一提的是，所述第二基材603可以是柔性電路板，材料可以是PI、PET、PEI、PEK等，而可以取代彈性結構與定芯支片之功能，甚至在一實施例中，因為其為彈性材料，還可以直接取代上述振膜的功能(僅一片柔性電路板)，或是於再一實施例中，可直接將振膜貼附到整片柔性電路板上，而不需留下孔洞。進一步地，所述第一元件(實施例為第一晶片)與第二元件(實施例為第二晶片)中，可以分別形成第一磁性元件與第二磁性元件，實際應用時可以其中之一採用晶片，另一採用磁鐵等磁性元件，或是兩者皆採用晶片。 It should be mentioned here that the second substrate 603 can be a flexible circuit board, and the material can be PI, PET, PEI, PEK, etc., and can replace the functions of the elastic structure and the fixed core support, even in one embodiment Since it is an elastic material, it can directly replace the function of the above-mentioned diaphragm (only one flexible circuit board), or in another embodiment, the diaphragm can be directly attached to the entire flexible circuit board, and No holes need to be left. Further, in the first element (the first wafer in the embodiment) and the second element (the second wafer in the embodiment), a first magnetic element and a second magnetic element may be formed respectively, and one of them may be formed in practical application. Chips are used, the other uses magnetic components such as magnets, or both use chips.

根據製作換能元件的實施例，可參考圖7(A)(B)(C)(D)(E)與圖8(A)(B)(C)(D)(E)等示意圖，其中第一部份的實施例示意圖如圖7(A)(B)(C)(D)(E)所示，其中顯示一個元件的俯視圖，並對照側面結構。相關流程可參考圖19所示流程實施例圖。 According to an embodiment of fabricating a transducer element, reference may be made to the schematic diagrams in FIG. 7(A)(B)(C)(D)(E) and FIG. 8(A)(B)(C)(D)(E). The schematic diagram of the embodiment of the first part is shown in FIG. 7(A)(B)(C)(D)(E), which shows a top view of an element and compares the side structure. For related processes, reference may be made to the process embodiment diagram shown in FIG. 19 .

一開始，如圖7(A)，備置第一基材701(圖19步驟S171)，第一基材701可以是預備好具有佈線(wiring)的一印刷電路板，主要用途之一是用以提供導入第一晶片705的電流。在圖7(B)中，在第一基材701上利用機鑽、雷射、蝕刻等的方式形成空氣閥結構(圖19步驟S173)，這是用於輸出振動的空氣，形成具有空氣閥的第一基材701’(可稱第一電路板)。在圖7(C)中，在具有空氣閥的第一基材701’上的某個位置形成承載件703(圖19步驟S175)，承載件703較佳以金屬材料製作，可以用鍍膜或是黏貼的方式在具有空氣閥的第一基材701’上形成承載件703。在圖7(D)中，再於承載件703上結合一晶片，如第一晶片705，並使得晶片可以通過打線(wire bonding)707電連接在具有空氣閥的第一基材701’上，或是以覆晶(flip chip)方式電連接此具有空氣閥的第一基材701’(圖19步驟S177)。第一基材701’的結構設計可用於空氣流通與散熱用途。最後，如圖7(E)所示，可以填膠形成保護晶片(如第一晶片705)與承載件703的封裝體709(圖19步驟S179)。但實際實施可以不用封裝體709，換能元件內各個元件可以通過側面牆形成的殼體保護。 Initially, as shown in FIG. 7(A), a first substrate 701 is prepared (step S171 in FIG. 19 ). The first substrate 701 may be a printed circuit board with wiring prepared. One of the main uses is to The current introduced into the first wafer 705 is provided. In FIG. 7(B), an air valve structure is formed on the first base material 701 by means of machine drilling, laser, etching, etc. (step S173 in FIG. 19 ), which is used to output vibrating air, forming an air valve with an air valve. The first substrate 701' (may be called a first circuit board). In FIG. 7(C) , a carrier 703 is formed at a certain position on the first substrate 701 ′ with the air valve (step S175 in FIG. 19 ). The carrier 703 is preferably made of a metal material, which can be coated or The carrier 703 is formed on the first substrate 701 ′ with the air valve by means of pasting. In FIG. 7(D), a chip, such as a first chip 705, is bonded on the carrier 703, so that the chip can be electrically connected to the first substrate 701' with an air valve through wire bonding 707, Alternatively, the first substrate 701 ′ with the air valve is electrically connected in a flip chip manner (step S177 in FIG. 19 ). The structural design of the first substrate 701' can be used for air circulation and heat dissipation. Finally, as shown in FIG. 7(E), a package body 709 for protecting the chip (eg, the first chip 705) and the carrier 703 may be formed by filling (step S179 in FIG. 19). However, in actual implementation, the encapsulation body 709 may not be used, and each element in the transducer element may be protected by a casing formed by a side wall.

接著如圖8(A)(B)(C)(D)(E)顯示製作換能元件的第二部份的實施例示意圖。 Next, FIG. 8(A)(B)(C)(D)(E) shows a schematic diagram of an embodiment of manufacturing the second part of the transducer element.

接著進行第二部份的製程，開始如圖8(A)所示，備置第二基材801(圖19步驟S181)，根據電路設計，第二基材801可通過製程形成一電路板，除了一般電路板材外，在一實施例中可以是一種柔性電路板，上方已經設計有電路，用於電連接控制換能元件運作以及可根據輸入信號產生電氣信號的控制電路，第二基材801亦用於支撐換能元件中的元件，如載體805。再如圖8(B)所示，通過蝕刻、鑿穿、雷射或機鑽等方式在第二基材801上製作孔洞803(圖19步驟S183)，形成具有孔洞的第二基材801’(可稱第二電路板)，這是如圖8(C)所示，用於將載體805設置在此孔洞803上，並且載體805之邊緣 可固定至具有孔洞的第二基材801’上(圖19步驟S185)。根據上述實施例之一，當所述第二基材801可為柔性電路板，因此本身在一適當的材質下可以直接作為載體805用途。 Next, the second part of the process is performed. As shown in FIG. 8(A), the second substrate 801 is prepared (step S181 in FIG. 19 ). According to the circuit design, the second substrate 801 can be formed into a circuit board through the process, except In addition to the general circuit board, in one embodiment, it can be a flexible circuit board with a circuit designed on the top for electrically connecting to a control circuit that controls the operation of the transducer element and can generate electrical signals according to the input signal. The second substrate 801 is also Used to support elements in the transducing element, such as carrier 805 . As shown in FIG. 8(B), holes 803 are formed on the second substrate 801 by means of etching, punching, laser or machine drilling (step S183 in FIG. 19 ) to form a second substrate 801 ′ with holes (Can be called the second circuit board), which is shown in FIG. 8(C), used to set the carrier 805 on the hole 803, and the edge of the carrier 805 It can be fixed to the second substrate 801' having holes (step S185 in FIG. 19 ). According to one of the above embodiments, when the second substrate 801 can be a flexible circuit board, it can be directly used as the carrier 805 under an appropriate material.

接著，如圖8(D)所示，將元件翻轉過來，備置一電路板807，此即為上述控制換能元件運作以及可根據輸入信號產生電氣信號的控制電路，在電路板807上設置具有孔洞的第二基材801’(圖19步驟S187)。此例顯示這是一個環形的電路板。再如圖8(E)所示，在載體805中間部份結合另一晶片，如此例顯示的第二晶片809，晶片(如第二晶片809)可通過打線811或是以覆晶(flip chip)方式電連接具有孔洞的第二基材801’，使之結合至第二電路板(圖19步驟S189)。 Next, as shown in FIG. 8(D), the element is turned over, and a circuit board 807 is prepared, which is the control circuit that controls the operation of the transducer element and can generate electrical signals according to the input signal. The second base material 801 ′ of the hole (step S187 in FIG. 19 ). This example shows that this is a ring board. As shown in FIG. 8(E), another chip, such as the second chip 809 shown in this example, can be bonded to the middle part of the carrier 805. The chip (such as the second chip 809) can pass through the wire bonding 811 or be a flip chip. ) way to electrically connect the second base material 801 ′ with holes so as to be combined with the second circuit board (step S189 in FIG. 19 ).

根據實施例之一，所述具有孔洞的第二基材801’用於承載作為形成振波的可振動的載體805以及第二晶片809，因此具有孔洞的第二基材801’本身可以柔性材料製作，本身形成一個具有彈性的結構，使得整體上可以隨著所承載的載體805一同振動。更者，在一實施方式中，具有孔洞的第二基材801’並非全部為彈性結構，而是與載體805連結的部份設計為一彈性結構。 According to one of the embodiments, the second substrate 801 ′ with holes is used to carry the vibrating carrier 805 and the second wafer 809 as vibration waves, so the second substrate 801 ′ with holes itself can be a flexible material The manufacturing process itself forms an elastic structure, so that the whole can vibrate with the carrier 805 carried. Furthermore, in one embodiment, not all of the second substrate 801' with holes is an elastic structure, but the part connected to the carrier 805 is designed as an elastic structure.

運作時，根據電路板807產生電氣信號，使得電路板導入電流至第二晶片809，產生的磁場與第一部份的承載件703與第一晶片705交互作用，使得載體805隨著電流改變而振動。 During operation, an electrical signal is generated according to the circuit board 807, so that the circuit board introduces a current to the second chip 809, and the generated magnetic field interacts with the first part of the carrier 703 and the first chip 705, so that the carrier 805 changes with the current. vibration.

值得一提的是，在製作所述第一晶片705與第二晶片809(或兩者之一)的步驟可以是將已經完成製作的第一晶片705接合承載件703，以及在載體805上貼附已經完成製作的第二晶片809，或是在這些步驟中利用鍍層、金屬化製程或是蝕刻製程分別在承載件703與載體805上形成具有多圈多金屬線段的第一晶片705與第二晶片809。 It is worth mentioning that the steps of fabricating the first wafer 705 and the second wafer 809 (or one of the two) may be to join the fabricated first wafer 705 to the carrier 703 , and paste the first wafer 705 on the carrier 805 . Attached is the second wafer 809 that has been fabricated, or in these steps, the first wafer 705 and the second wafer 705 with multiple turns of multi-metal segments are formed on the carrier 703 and the carrier 805 by a plating, metallization process or an etching process, respectively. Wafer 809.

最後，製程將結合圖7(E)顯示的第一部份與圖8(E)顯示的第二 部份(圖19步驟S191)，形成如圖9顯示的換能元件結構實施例示意圖，製程包括將第一部份結構的周圍點上錫球、錫膏或導電膠等導電材料，再反轉第二部份，經控制其間距相互黏合後，可在一製程實施例中將整個元件置入烤箱固化(curing)黏合的部份(圖19步驟S193)。 Finally, the process will combine the first part shown in Figure 7(E) with the second part shown in Figure 8(E) Part (step S191 in FIG. 19 ), the schematic diagram of the embodiment of the transducer element structure shown in FIG. 9 is formed. The process includes applying conductive materials such as solder balls, solder paste or conductive glue around the first part of the structure, and then inverting In the second part, after the spacing is controlled to be bonded to each other, in one process embodiment, the entire component can be placed in an oven to cure the bonded part (step S193 in FIG. 19 ).

圖10A顯示在換能元件側面牆上需要設置有讓空氣進出的一或多處空氣流通的結構，另還可成為裝置散熱的結構，如圖中顯示元件的側面牆10的孔洞，俯視圖如圖10B顯示的側面牆11，孔洞的形式也不限於此圖，還可如圖10C顯示在換能元件四周的側面牆(12a,12b,12c,12d)上以交錯方式形成讓空氣流通的縫隙。 Fig. 10A shows that one or more structures for air circulation should be provided on the side wall of the transducer element, and it can also be a structure for heat dissipation of the device. The hole in the side wall 10 of the element is shown in the figure, and the top view is as shown in the figure. The side wall 11 shown in 10B, the form of the holes is not limited to this figure, and as shown in Figure 10C, the side walls (12a, 12b, 12c, 12d) around the transducer element can be staggered to form gaps for air circulation.

在此一提的是，換能元件的側面牆上需要開洞讓空氣進出，其孔洞數量及大小皆有特殊設計，其中孔洞數量為質數(2、3、5、7、11等)時，可達到較佳效果。孔洞大小也會改變振動的效果，以聲波為例，如孔洞總面積為載體面積之0~20%大小時，可產生較高音；其孔洞總面積為載體面積之20~50%大小，或更大，可產生較低音。而開洞方式可採用機鑽、雷射、蝕刻等方式。 It should be mentioned here that the side wall of the transducer element needs to have holes to let air in and out. The number and size of the holes are specially designed. When the number of holes is a prime number (2, 3, 5, 7, 11, etc.), Better results can be achieved. The size of the holes will also change the effect of vibration. Taking sound waves as an example, if the total area of the holes is 0~20% of the carrier area, higher sound can be produced; the total area of the holes is 20~50% of the carrier area, or more. large, which produces lower pitches. The hole opening method can be machine drilling, laser, etching and other methods.

而孔洞的高度則會影響到整體發聲效率，主要是因為當控制換能元件中上下兩部份中晶片的距離時，即改變磁場與衝程(stroke)，衝程與振波的關係是，較高振動頻率所需衝程較小，較低振動頻率所需衝程較大，而距離過遠也會影響其振動效率。 The height of the hole will affect the overall sound efficiency, mainly because when the distance between the chips in the upper and lower parts of the transducer element is controlled, the magnetic field and the stroke are changed, and the relationship between the stroke and the vibration wave is higher. The vibration frequency requires a smaller stroke, and the lower vibration frequency requires a larger stroke, and the distance will also affect its vibration efficiency.

根據以上描述，揭露書提出的換能元件將電氣信號轉換為振動信號時，可以實現揚聲元件，或特定形式的馬達中的驅動元件，圖11接著顯示以換能元件實現揚聲元件時當中設於電路板110上的導磁金屬112，此例顯示根據需求如圖顯示的陣列形式。 According to the above description, when the transducer element proposed in the disclosure converts the electrical signal into a vibration signal, it can realize a speaker element, or a driving element in a motor of a specific form. Fig. 11 then shows when the transducer element is used to realize the speaker element. The magnetic conductive metal 112 disposed on the circuit board 110 is shown in an array form as shown in the figure in this example according to requirements.

圖12接著顯示換能元件中在電路板121上形成導磁金屬123與磁 性元件125的結構，在此結構實施例中，磁性元件(涵蓋第一、第二磁性元件)可以打線127方式電連接電路板121。如圖13所示在電路板131上形成導磁金屬133以及磁性元件135，此例顯示磁性元件135是以覆晶方式形成於導磁金屬133上，其中示意顯示有焊接點137，通過線路電連接至電路板131上。 FIG. 12 then shows that the magnetic conductive metal 123 and the magnetic field are formed on the circuit board 121 in the transducer element. The structure of the magnetic element 125 , in this structural embodiment, the magnetic element (including the first and the second magnetic element) can be electrically connected to the circuit board 121 by a wire 127 . As shown in FIG. 13 , the magnetic conductive metal 133 and the magnetic element 135 are formed on the circuit board 131 . This example shows that the magnetic element 135 is formed on the magnetic conductive metal 133 in a flip-chip manner, and a solder joint 137 is schematically shown. connected to the circuit board 131 .

在一實施例中，換能元件可以忽略所述承載件，如圖14所示，電路板141上直接以焊接點145覆晶的方式電連接磁性元件143。以產生磁場以及導磁目的為例，承載件為導磁金屬，也就是說，磁性元件143直接擔負穩定磁場的工作。導磁金屬的設計目的是加強磁場的效率，當換能元件的側面牆使用導磁金屬材料，即可不需要額外設置導磁金屬，導磁金屬的形狀可為一片狀，依固定磁場之外型決定，其面積相等或者較大10%內；外型也可為一碗狀，將固定磁場包圍住，只露出上方，其高度需高於固定磁場；而導磁金屬的厚度需大於等於固定磁場之厚度。 In one embodiment, the transducer element can ignore the carrier. As shown in FIG. 14 , the magnetic element 143 is directly electrically connected to the circuit board 141 by flip-chip soldering points 145 . Taking the purpose of generating a magnetic field and magnetic conductivity as an example, the carrier is a magnetically conductive metal, that is to say, the magnetic element 143 is directly responsible for the work of stabilizing the magnetic field. The design purpose of the magnetic conductive metal is to enhance the efficiency of the magnetic field. When the side wall of the transducer element is made of magnetic conductive metal material, there is no need to provide additional magnetic conductive metal. The area is equal to or within 10% larger; the shape can also be a bowl, which surrounds the fixed magnetic field and only exposes the upper part, and its height must be higher than the fixed magnetic field; and the thickness of the magnetic conductive metal must be greater than or equal to the fixed magnetic field. the thickness of the magnetic field.

圖15接著顯示換能元件的結構實施例示意圖，圖16則顯示組合後的立體視圖。根據上述製作方法，可知換能元件的主要元件包括載體151、懸邊153、第二磁性元件155，通過側面牆157結合了第一磁性元件158與電路板159。在一實施例中，所述側面牆157部分連接上半部結構，可與側面牆為一體成型構造，或者分開生產，若其電路需整體連接，可於底部或者側面露出接點，側面牆157的材料可使用導磁金屬、塑料射出成形、PCB、FPCB等。如果將側面牆設計為導磁金屬，其厚度需大於等於固定磁場之厚度。 FIG. 15 then shows a schematic view of a structural embodiment of the transducer element, and FIG. 16 shows a combined three-dimensional view. According to the above manufacturing method, the main components of the transducer element include the carrier 151 , the suspension edge 153 , and the second magnetic element 155 , and the first magnetic element 158 and the circuit board 159 are combined with the side wall 157 . In one embodiment, the side wall 157 is partially connected to the upper half of the structure, and can be integrally formed with the side wall or produced separately. If the circuit needs to be integrally connected, the contacts can be exposed at the bottom or side, and the side wall 157 The material can use magnetic conductive metal, plastic injection molding, PCB, FPCB, etc. If the side wall is designed as a magnetic conductive metal, its thickness should be greater than or equal to the thickness of the fixed magnetic field.

圖17顯示以換能元件實現揚聲元件的實施例圖之一，此圖例顯示的揚聲元件主要部件有設於懸邊173上的音膜171，包括以換能元件實現的第一磁性元件177與第二磁性元件175，可以取代傳統揚聲元件中的線圈與磁鐵等傳統磁性元件，通過磁性元件的磁場變化決定音膜171的振動方式，這些元件組合，並與電路板179結合，形成揚聲元件，此例中，電路板179上可以 形成讓空氣流動的氣孔176,178。 FIG. 17 shows one of the embodiments of the speaker element implemented by the transducer element. The main components of the speaker element shown in this illustration include the sound membrane 171 arranged on the suspension edge 173, including the first magnetic element implemented with the transducer element. 177 and the second magnetic element 175 can replace traditional magnetic elements such as coils and magnets in traditional loudspeaker elements, and determine the vibration mode of the sound film 171 through the change of the magnetic field of the magnetic element. These elements are combined and combined with the circuit board 179 to form The speaker components, in this case, on the circuit board 179 can be Air holes 176, 178 are formed to allow air to flow.

圖18則顯示另一實施例，圖例顯示有換能元件實現的第一磁性元件187與第二磁性元件183，設於懸邊182上的音膜181，音膜181為根據第一磁性元件187與第二磁性元件183因為磁場變化互動而運動，產生音波。裝置通過其中金屬結構185連接電路，金屬結構185上形成音波流動的氣孔186,188，且此例特別的是設有上下懸邊182,189，可以承載第一磁性元件187與第二磁性元件183，整體組合後實現揚聲元件。 FIG. 18 shows another embodiment. The illustration shows a first magnetic element 187 and a second magnetic element 183 realized by a transducer element, a sound film 181 arranged on the suspension edge 182, and the sound film 181 is based on the first magnetic element 187. The second magnetic element 183 moves due to the change of the magnetic field to generate sound waves. The device is connected to the circuit through the metal structure 185. The metal structure 185 is formed with air holes 186, 188 for the sound wave to flow, and in this case, the upper and lower suspension edges 182, 189 are especially provided, which can carry the first magnetic element 187 and the second magnetic element 183. After the overall combination Implement the speaker element.

綜上所述，根據上述換能元件實施例，換能元件的主要目的之一是將電氣信號轉換為振動信號，其中以磁性元件為例，可以為一種半導體晶片，可以單一微線圈元件實現換能元件中磁性元件的模式，或是以多個微線圈元件組成陣列式微線圈元件實現磁性元件的模式，特別的是，因為各微線圈元件由多段金屬線段組成，相較於現有技術的線圈設計，揭露書所提出的微線圈設計的概念在於可通過多段不相連接的線路以繞圈的方式進行磁場的堆疊，其一目的是能增加電流密度，同時又以並聯的方式來降低整體電阻。如此，在電性設計上，可以各微線圈元件的多個線段的負極連線到一負極接點區、多個微線圈元件的多個線段的正極連接到一正極接點區，不僅多段金屬線段可彼此並聯，還可分別再並聯到總負極接點區與總正極接點區，也達成多個微線圈元件彼此並聯的佈線設計。在設計上，還能依照阻抗值、磁場或尺寸等實際的需求決定微線圈元件中金屬線段的各種佈線參數，提供多樣化的應用。 To sum up, according to the above-mentioned embodiments of the transducer element, one of the main purposes of the transducer element is to convert electrical signals into vibration signals. Taking the magnetic element as an example, it can be a semiconductor wafer, and a single micro-coil element can be used to realize the transformation. The mode of the magnetic element in the energy element, or the mode of realizing the magnetic element by forming an array of micro-coil elements with a plurality of micro-coil elements, in particular, because each micro-coil element is composed of a plurality of metal wire segments, compared with the coil design of the prior art , The concept of the micro-coil design proposed in the publication is that the magnetic field can be stacked in a winding manner through multiple unconnected lines. One of the purposes is to increase the current density and reduce the overall resistance in a parallel manner. In this way, in terms of electrical design, the negative electrodes of multiple segments of each micro-coil element can be connected to a negative contact area, and the positive electrodes of multiple segments of multiple micro-coil elements can be connected to a positive contact area. The line segments can be connected in parallel with each other, and can also be connected in parallel to the total negative contact area and the total positive contact area respectively, and a wiring design in which a plurality of micro-coil elements are connected in parallel with each other is also achieved. In terms of design, various wiring parameters of the metal line segments in the micro-coil element can also be determined according to actual needs such as impedance value, magnetic field or size, providing diversified applications.

以上所公開的內容僅為本新型的優選可行實施例，並非因此侷限本新型的申請專利範圍，所以凡是運用本新型說明書及圖式內容所做的等效技術變化，均包含於本新型的申請專利範圍內。 The contents disclosed above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

60:換能元件 60: Transducer element

601:載體 601: Carrier

603:第二基材 603: Second substrate

608:第一基材 608: First Substrate

605:第二元件 605: Second element

607:側面牆 607: Side Wall

609:第一元件 609: The first element

611:承載片 611: Carrier sheet

613:第二元件打線 613: The second component is wired

615:第一元件打線 615: The first component is wired

Claims (10)

一種換能元件，用於將一電氣信號轉換為一振動信號，包括： 一第一部份，包括： 一第一基材； 一第一元件，該第一元件連接該第一基材； 一第二部份，包括： 一第二基材，於該第二基材上形成一孔洞； 一載體，形成於該第二基材的該孔洞上，該載體之邊緣固定至該第二基材上； 一第二元件，結合該載體，該第二元件連接該第二基材； 其中，經結合該第一部份與該第二部份，形成該換能元件。 A transducer element for converting an electrical signal into a vibration signal, comprising: A first part, including: a first substrate; a first element, the first element is connected to the first substrate; A second part, including: a second substrate, a hole is formed on the second substrate; a carrier formed on the hole of the second substrate, and the edge of the carrier is fixed on the second substrate; a second element, combined with the carrier, the second element is connected to the second substrate; Wherein, the transducer element is formed by combining the first part and the second part. 如請求項1所述的換能元件，其中該第二基材用於支撐該載體，該第二元件電連接至該第二基材；通過該第二基材導入電流至該第二元件，產生的磁場與該該第一元件交互作用，使得該載體隨著電流改變而振動。The transducer element according to claim 1, wherein the second base material is used to support the carrier, the second element is electrically connected to the second base material; current is introduced to the second element through the second base material, The generated magnetic field interacts with the first element, causing the carrier to vibrate as the current changes. 如請求項2所述的換能元件，其中，在該第一部份中，於完成電連接後，以一封裝體保護該第一元件。The transducer element according to claim 2, wherein, in the first part, after the electrical connection is completed, a package is used to protect the first element. 如請求項2所述的換能元件，其中載體為一音膜，使得該換能元件實現一揚聲元件。The transducer element according to claim 2, wherein the carrier is a sound membrane, so that the transducer element realizes a speaker element. 如請求項2所述的換能元件，其中該第二基材通過一彈性結構連結該載體。The transducer element according to claim 2, wherein the second substrate is connected to the carrier through an elastic structure. 如請求項1所述的換能元件，其中，於備置該第一基材後，於該第一基材上形成空氣流通的結構。The transducer element according to claim 1, wherein after the first base material is prepared, an air circulation structure is formed on the first base material. 如請求項1至6中任一項所述的換能元件，其中該第一元件或該第二元件為一微線圈元件或由多個該微線圈元件形成的一陣列式微線圈元件，其中該微線圈元件包括： 一佈線層，設有多段由一起始點開始並環繞該起始點形成多圈連續佈線的金屬線段，每個金屬線段的兩端為一第一電極端與一第二電極端，其中該起始點為該微線圈元件的一第一電極，該多段連續佈線的金屬線段的末端為該微線圈元件的一第二電極；以及 一電極層，設有至少一第一電極區與至少一第二電極區，該至少一第一電極區用以匯集該多段金屬線段中各金屬線段的該第一電極端，以及該至少一第二電極區用以匯集該多段金屬線段中各金屬線段的該第二電極端。 The transducer element according to any one of claims 1 to 6, wherein the first element or the second element is a microcoil element or an arrayed microcoil element formed by a plurality of the microcoil elements, wherein the Microcoil components include: A wiring layer is provided with a plurality of metal line segments starting from a starting point and surrounding the starting point to form multiple circles of continuous wiring. The two ends of each metal line segment are a first electrode terminal and a second electrode terminal, wherein the starting point is The starting point is a first electrode of the micro-coil element, and the end of the metal wire segment of the multi-segment continuous wiring is a second electrode of the micro-coil element; and an electrode layer provided with at least one first electrode region and at least one second electrode region, the at least one first electrode region is used for collecting the first electrode end of each metal line segment in the plurality of metal line segments, and the at least one first electrode region The two electrode regions are used for collecting the second electrode ends of each metal line segment of the plurality of metal line segments. 如請求項7所述的換能元件，其中該微線圈元件還包括一電連接層，於該電連接層中，以多條金屬線將該佈線層上各金屬線段的該第一電極端導向在該電極層的該至少一第一電極區，亦將各金屬線段的該第二電極端導向在該電極層的該至少一第二電極區。The transducer element according to claim 7, wherein the micro-coil element further comprises an electrical connection layer, and in the electrical connection layer, a plurality of metal wires are used to guide the first electrode end of each metal wire segment on the wiring layer In the at least one first electrode region of the electrode layer, the second electrode end of each metal line segment is also guided to the at least one second electrode region of the electrode layer. 如請求項7所述的換能元件，其中，依照阻抗值、磁場或尺寸需求決定該微線圈元件中該多段金屬線段的一總長、一線寬、鄰近金屬線段之間的一線距、各金屬線段的一長度、一圈數、一圈距以及/或該金屬線段的材料。The transducer element according to claim 7, wherein a total length, line width, line spacing between adjacent metal line segments, and each metal line segment in the micro-coil element are determined according to impedance value, magnetic field or size requirements a length, a number of turns, a turn distance and/or the material of the metal wire segment. 如請求項7所述的換能元件，其中該第一元件或該第二元件為一磁性元件。The transducer element according to claim 7, wherein the first element or the second element is a magnetic element.

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