JP6716866B2 - Coil parts - Google Patents

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JP6716866B2
JP6716866B2 JP2015131265A JP2015131265A JP6716866B2 JP 6716866 B2 JP6716866 B2 JP 6716866B2 JP 2015131265 A JP2015131265 A JP 2015131265A JP 2015131265 A JP2015131265 A JP 2015131265A JP 6716866 B2 JP6716866 B2 JP 6716866B2
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resin
coil
substrate
resin wall
wall
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JP2017017140A (en
Inventor
大久保　等
等 大久保
正純 荒田
正純 荒田
太田　学
学 太田
優也 要
優也 要
佳宏 前田
佳宏 前田
崇宏 川原
崇宏 川原
北斗 江田
北斗 江田
佐藤　茂樹
佐藤　　茂樹
京平 伊木
京平 伊木
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TDK Corp
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TDK Corp
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Priority to KR1020160080507A priority patent/KR101846817B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/323—Insulation between winding turns, between winding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures

Description

本発明は、コイル部品に関する。 The present invention relates to a coil component.

従来、表面実装型の平面コイル素子等のコイル部品が、民生用機器、産業用機器等の電気製品に幅広く利用されている。中でも小型携帯機器においては、機能の充実化に伴い、各々のデバイスを駆動させるために単一の電源から複数の電圧を得る必要が生じてきている。そこで、このような電源用途等にも表面実装型の平面コイル素子が使用されている。 2. Description of the Related Art Conventionally, coil components such as surface mount type planar coil elements have been widely used for electric products such as consumer equipment and industrial equipment. In particular, in small portable devices, with the enhancement of functions, it has become necessary to obtain a plurality of voltages from a single power source to drive each device. Therefore, surface mounting type planar coil elements are also used for such power supply applications.

このようなコイル部品は、たとえば、下記特許文献１に開示されている。この文献に開示されたコイル部品は、基板の表裏面にそれぞれ平面渦巻き状の空芯コイルが設けられ、空芯コイルの磁芯部分において基板を貫くように設けられたスルーホール導体により空芯コイル同士が接続されている。 Such a coil component is disclosed, for example, in Patent Document 1 below. In the coil component disclosed in this document, flat spiral air core coils are provided on the front and back surfaces of the substrate, respectively, and the air core coil is formed by a through-hole conductor provided so as to penetrate the substrate at the magnetic core portion of the air core coil. They are connected to each other.

特開２００５−２１００１０号公報JP, 2005-210010, A

上述した空芯コイルは、基板上に設けられたシードパターンに、Ｃｕなどの導体材料をめっき成長させることで形成されるが、基板の面方向へのめっき成長によりコイルの巻回部の間隔が狭まる。コイルの巻回部の間隔が狭い場合には、コイルの絶縁性低下が懸念されるため、より確実に絶縁する技術が望まれている。 The air-core coil described above is formed by plating and growing a conductive material such as Cu on a seed pattern provided on a substrate. However, due to the plating growth in the plane direction of the substrate, the coil windings are spaced apart from each other. Narrows. When the spacing between the winding portions of the coil is narrow, there is a concern that the insulation property of the coil may deteriorate. Therefore, a technique for more reliable insulation is desired.

そこで、コイルの隣り合う巻回部の間に樹脂壁を設けて確実な絶縁を図る技術の開発が進められている。ただし、コイル部品には、基板の厚さ方向や面方向からの圧力が付加されることが考えられ、該圧力に起因する歪みや倒壊が生じない程度の十分な強度が上記巻回部には求められる。 Therefore, a technique for providing a resin wall between adjacent winding portions of the coil for reliable insulation is being developed. However, it is conceivable that a pressure is applied to the coil component from the thickness direction or the surface direction of the substrate, and the coiled portion has sufficient strength to prevent distortion or collapse due to the pressure. Desired.

本発明は、上述の課題を解決するためになされたものであり、巻回部の強度の向上が図られたコイル部品を提供することを目的とする。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a coil component in which the strength of a wound portion is improved.

本発明の一側面に係るコイル部品は、基板と、基板の主面上にめっき成長で設けられたコイルと、基板の主面上に設けられ、コイルの巻回部が間に延びる複数の樹脂壁を有する樹脂体と、磁性粉含有樹脂からなり、基板の主面のコイルと樹脂体とを一体的に覆う被覆樹脂とを備え、樹脂壁は、上端部の幅が下端部の幅より広い。 A coil component according to one aspect of the present invention includes a substrate, a coil provided on the main surface of the substrate by plating growth, and a plurality of resins provided on the main surface of the substrate and having coil winding portions extending therebetween. A resin body having a wall and a coating resin made of a resin containing magnetic powder and integrally covering the coil and the resin body on the main surface of the substrate are provided, and the resin wall has a width at the upper end portion wider than the width at the lower end portion. ..

このようなコイル部品においては、樹脂壁の上端部の幅が下端部の幅より広く、該樹脂壁の間に延びる巻回部では、上端部の幅が下端部の幅より狭くなっている。そのため、巻回部は、基板側の断面積が大きな安定した断面形状を有している。そのため、巻回部は強度の向上が図られており、このようなコイル部品においては、基板の厚さ方向や面方向からの圧力に起因する巻回部の歪みや倒壊が抑制される。 In such a coil component, the width of the upper end portion of the resin wall is wider than the width of the lower end portion, and in the winding portion extending between the resin walls, the width of the upper end portion is narrower than the width of the lower end portion. Therefore, the winding portion has a stable cross-sectional shape with a large cross-sectional area on the substrate side. Therefore, the strength of the wound portion is improved, and in such a coil component, distortion or collapse of the wound portion due to pressure from the thickness direction or the surface direction of the substrate is suppressed.

樹脂壁の幅は、該樹脂壁の側面が傾斜面となるように、上端部から下端部に向けて漸次狭まる態様であってもよく、また、該樹脂壁の側面に段部が形成されるように、上端部から下端部に向けて段階的に狭まる態様であってもよい。 The width of the resin wall may be gradually narrowed from the upper end portion to the lower end portion so that the side surface of the resin wall becomes an inclined surface, and a step portion is formed on the side surface of the resin wall. As described above, the mode may be gradually narrowed from the upper end toward the lower end.

また、樹脂体の樹脂壁の断面形状が四角形状である態様であってもよい。このとき、樹脂体の樹脂壁の断面は底辺の長さに対する高さの比が１より大きく、該樹脂壁が基板の主面の法線方向に沿って長く延びている態様であってもよい。 Alternatively, the resin wall of the resin body may have a quadrangular cross section. At this time, the cross section of the resin wall of the resin body may have a ratio of the height to the length of the bottom side of more than 1, and the resin wall may extend long along the direction normal to the main surface of the substrate. ..

また、コイルの巻回部の断面形状が四角形状である態様であってもよい。このとき、コイルの巻回部の断面は底辺の長さに対する高さの比が１より大きく、該巻回部の断面が基板の主面の法線方向に沿って長く延びている態様であってもよい。 Alternatively, the winding portion of the coil may have a quadrangular cross-sectional shape. At this time, the ratio of the height to the length of the bottom side of the cross section of the coil is larger than 1, and the cross section of the coil extends long along the normal to the main surface of the substrate. May be.

また、樹脂体の樹脂壁の高さがコイルの巻回部の高さより高い態様であってもよい。この場合、巻回部は、高さ方向にわたって設計寸法どおりの厚さとなり得る。また、巻回部同士が樹脂壁を越えて接する事態が有意に回避される。 Further, the height of the resin wall of the resin body may be higher than the height of the winding portion of the coil. In this case, the winding portion can have a thickness as designed in the height direction. In addition, the situation where the wound portions contact each other over the resin wall is significantly avoided.

また、樹脂体は、基板の主面上にコイルがめっき成長される前に設けられ、コイルの巻回部は、樹脂体の樹脂壁に接着されていない態様であってもよい。 The resin body may be provided before the coil is plated and grown on the main surface of the substrate, and the winding portion of the coil may not be bonded to the resin wall of the resin body.

また、基板の主面上に複数並んだ樹脂壁のうち、最外に位置する樹脂壁の厚さが内側に位置する樹脂壁の厚さより厚い態様であってもよい。 Further, among a plurality of resin walls arranged on the main surface of the substrate, the outermost resin wall may be thicker than the inner resin wall.

本発明によれば、巻回部の強度の向上が図られたコイル部品が提供される。 According to the present invention, there is provided a coil component in which the strength of the wound portion is improved.

図１は、本発明の実施形態に係るコイル部品の概略斜視図である。FIG. 1 is a schematic perspective view of a coil component according to an embodiment of the present invention. 図２は、図１に示すコイル部品の製造に用いられる基板を示した斜視図である。FIG. 2 is a perspective view showing a substrate used for manufacturing the coil component shown in FIG. 図３は、図２に示した基板のシードパターンを示した平面図である。FIG. 3 is a plan view showing a seed pattern of the substrate shown in FIG. 図４は、図１に示すコイル部品の製造方法の一工程を示した斜視図である。FIG. 4 is a perspective view showing one step of the method for manufacturing the coil component shown in FIG. 図５は、図４のＶ−Ｖ線断面図である。FIG. 5 is a sectional view taken along line VV of FIG. 図６は、コイルの巻回部上に設けられる絶縁体を示した断面図である。FIG. 6 is a cross-sectional view showing an insulator provided on the winding portion of the coil. 図７は、図１に示すコイル部品の製造方法の一工程を示した斜視図である。FIG. 7 is a perspective view showing one step of the method for manufacturing the coil component shown in FIG. 図８は、図１に示すコイル部品の製造方法の一工程を示した斜視図である。FIG. 8 is a perspective view showing one step of the method for manufacturing the coil component shown in FIG. 図９は、樹脂壁の変形例を示した断面図である。FIG. 9 is a sectional view showing a modified example of the resin wall.

以下、添付図面を参照して、本発明の実施形態について詳細に説明する。なお、説明において、同一要素又は同一機能を有する要素には、同一符号を用いることとし、重複する説明は省略する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same function will be denoted by the same reference symbols, without redundant description.

まず、本発明の実施形態に係るコイル部品の構造について、図１〜４を参照しつつ説明する。説明の便宜上、図示のようにＸＹＺ座標を設定する。すなわち、平面コイル素子の厚さ方向をＺ方向、外部端子電極の対面方向をＹ方向、Ｚ方向とＹ方向とに直交する方向をＸ方向と設定する。 First, the structure of the coil component according to the embodiment of the present invention will be described with reference to FIGS. For convenience of explanation, XYZ coordinates are set as shown. That is, the thickness direction of the planar coil element is set as the Z direction, the facing direction of the external terminal electrode is set as the Y direction, and the direction orthogonal to the Z direction and the Y direction is set as the X direction.

コイル部品１は、略直方体形状を呈する本体部１０と、本体部１０の対向する一対の端面を覆うようにして設けられた一対の外部端子電極３０Ａ、３０Ｂとによって構成されている。コイル部品１は、一例として、長辺２．０ｍｍ、短辺１．６ｍｍ、高さ０．９ｍｍの寸法で設計される。 The coil component 1 includes a main body 10 having a substantially rectangular parallelepiped shape, and a pair of external terminal electrodes 30A and 30B provided so as to cover a pair of end faces of the main body 10. As an example, the coil component 1 is designed with dimensions of 2.0 mm in long side, 1.6 mm in short side, and 0.9 mm in height.

以下では、本体部１０を作製する手順を示しつつ、併せて、コイル部品１の構造についても説明する。 Below, the structure of the coil component 1 is also explained while showing the procedure for producing the main body 10.

本体部１０は、図２に示す基板１１を含んでいる。基板１１は、非磁性の絶縁材料で構成された平板矩形状の部材である。基板１１の中央部分には、主面１１ａ、１１ｂ間を繋ぐように貫通された略円形の開口１２が設けられている。基板１１としては、ガラスクロスにシアネート樹脂（ＢＴ（ビスマレイミド・トリアジン）レジン：登録商標）が含浸された基板で、板厚６０μｍのものを用いることができる。なお、ＢＴレジンのほか、ポリイミド、アラミド等を用いることもできる。基板１１の材料としては、セラミックやガラスを用いることもできる。基板１１の材料としては、大量生産されているプリント基板材料が好ましく、特にＢＴプリント基板、ＦＲ４プリント基板、あるいはＦＲ５プリント基板に用いられる樹脂材料が最も好ましい。 The main body 10 includes the substrate 11 shown in FIG. The substrate 11 is a flat plate rectangular member made of a non-magnetic insulating material. A substantially circular opening 12 is formed in the central portion of the substrate 11 so as to connect the principal surfaces 11a and 11b. As the substrate 11, a substrate in which a glass cloth is impregnated with a cyanate resin (BT (bismaleimide triazine) resin: registered trademark) and having a plate thickness of 60 μm can be used. In addition to BT resin, polyimide, aramid or the like can be used. Ceramic or glass can also be used as the material of the substrate 11. As a material for the substrate 11, a mass-produced printed circuit board material is preferable, and a resin material used for a BT printed circuit board, an FR4 printed circuit board, or an FR5 printed circuit board is most preferable.

基板１１には、図３に示すように、それぞれの主面１１ａ、１１ｂに、後述するコイル１３をめっき成長させるためのシードパターン１３Ａが形成されている。シードパターン１３Ａは、基板１１の開口１２の周りを回る螺旋パターン１４Ａと、基板１１のＹ方向に関する端部に形成された端部パターン１５Ａとを有し、これらのパターン１４Ａ、１５Ａが連続的かつ一体的に形成されている。なお、一方の主面１１ａ側に設けられるコイル１３と他方の主面１１ｂ側に設けられるコイル１３とでは電極引き出し方向が逆であり、そのため、一方の主面１１ａ側の端部パターン１５Ａと他方の主面１１ｂ側の端部パターンとは、基板１１のＹ方向に関する互いに異なる端部に形成されている。 As shown in FIG. 3, the substrate 11 is provided with seed patterns 13A on the principal surfaces 11a and 11b for plating growth of the coil 13 described later. The seed pattern 13A has a spiral pattern 14A that revolves around the opening 12 of the substrate 11 and an end pattern 15A that is formed at the end of the substrate 11 in the Y direction, and these patterns 14A and 15A are continuous and It is formed integrally. Note that the coil 13 provided on the one main surface 11a side and the coil 13 provided on the other main surface 11b side have opposite electrode lead-out directions, and therefore the end pattern 15A on the one main surface 11a side and the other end pattern 15A on the other main surface 11a side The end pattern on the main surface 11b side is formed at different end portions in the Y direction of the substrate 11.

図２に戻って、基板１１の各主面１１ａ、１１ｂ上には、樹脂体１７が設けられている。樹脂体１７は、公知のフォトリソグラフィーによってパターニングされた厚膜レジストである。樹脂体１７は、コイル１３の巻回部１４の成長領域を画定する樹脂壁１８と、コイル１３の引出電極部１５の成長領域を画定する樹脂壁１９とを有している。 Returning to FIG. 2, a resin body 17 is provided on each main surface 11 a, 11 b of the substrate 11. The resin body 17 is a thick film resist patterned by known photolithography. The resin body 17 has a resin wall 18 that defines a growth region of the winding portion 14 of the coil 13, and a resin wall 19 that defines a growth region of the extraction electrode portion 15 of the coil 13.

図４は、シードパターン１３Ａを用いてコイル１３をめっき成長させたときの基板１１の状態を示している。コイル１３のめっき成長には、公知のめっき成長方法を採用することができる。 FIG. 4 shows a state of the substrate 11 when the coil 13 is plated and grown using the seed pattern 13A. For the plating growth of the coil 13, a known plating growth method can be adopted.

コイル１３は、銅で構成されており、シードパターン１３Ａの螺旋パターン１４Ａ上に形成された巻回部１４と、シードパターン１３Ａの端部パターン１５Ａ上に形成された引出電極部１５とを有している。コイル１３は、平面視したときに、シードパターン１３Ａ同様、基板１１の主面１１ａ、１１ｂに平行に延在する平面渦巻き状の空芯コイルの形状となっている。より詳しくは、基板上面１１ａの巻回部１４は、上面側から見て外側に向かう方向に沿って左回転の渦巻きであり、基板下面１１ｂの巻回部１４は、下面側から見て、外側に向かう方向に沿って左回転の渦巻きである。基板上面１１ａおよび基板下面１１ｂの両コイル１３は、たとえば、開口１２の近傍に別途設けられた貫通孔を介して端部同士が接続される。両コイル１３に一方向に電流を流したときには、両コイル１３の電流の流れる回転方向が同一となるため、コイル１３で発生する磁束が重畳して強め合う。 The coil 13 is made of copper and has a winding portion 14 formed on the spiral pattern 14A of the seed pattern 13A and an extraction electrode portion 15 formed on the end pattern 15A of the seed pattern 13A. ing. The coil 13 has the shape of a planar spiral air-core coil that extends parallel to the principal surfaces 11a and 11b of the substrate 11 when viewed in a plan view, similar to the seed pattern 13A. More specifically, the winding portion 14 of the substrate upper surface 11a is a spiral that rotates counterclockwise along the direction toward the outside when viewed from the upper surface side, and the winding portion 14 of the substrate lower surface 11b is outside when viewed from the lower surface side. It is a spiral that rotates counterclockwise along the direction toward. Both ends of the coils 13 on the substrate upper surface 11a and the substrate lower surface 11b are connected to each other, for example, through through holes separately provided near the opening 12. When current is applied to both coils 13 in one direction, the current flows in both coils 13 in the same rotational direction, and the magnetic fluxes generated in the coils 13 are superposed and strengthened.

図５は、図４に示しためっき成長後の基板１１の状態を示しており、図４のＶ−Ｖ線断面図である。 FIG. 5 shows a state of the substrate 11 after the plating growth shown in FIG. 4, and is a cross-sectional view taken along line VV of FIG.

図５に示すように、基板１１上には、基板１１の法線方向（Ｚ方向）に沿って長く延びる四角形状断面（図５では台形状断面）の樹脂壁１８が形成されており、これらの樹脂壁１８の間においてコイル１３の巻回部１４がＺ方向に成長する。コイル１３の巻回部１４は、その成長領域が、めっき成長前に基板１１上に形成された樹脂壁１８によって予め画定されている。 As shown in FIG. 5, a resin wall 18 having a quadrangular cross section (trapezoidal cross section in FIG. 5) extending long along the normal line direction (Z direction) of the substrate 11 is formed on the substrate 11. The wound portion 14 of the coil 13 grows in the Z direction between the resin walls 18 of FIG. The winding area of the winding portion 14 of the coil 13 is defined in advance by a resin wall 18 formed on the substrate 11 before the plating growth.

コイル１３の巻回部１４は、螺旋パターン１４Ａの一部であるシード部１４ａと、シード部１４ａ上にめっき成長させためっき部１４ｂとで構成されており、シード部１４ａ周りにめっき部１４ｂが徐々に成長していくことにより形成される。このとき、コイル１３の巻回部１４は、隣り合う２つの樹脂壁１８の間に画成された空間を充たすように成長して、樹脂壁１８の間に画成された空間と同一の形状に形成され、その結果、コイル１３の巻回部１４は基板１１の法線方向（Ｚ方向）に沿って長く延びる形状となる。すなわち、樹脂壁１８の間に画成される空間の形状を調整することで、コイル１３の巻回部１４の形状が調整され、設計したとおりの形状にコイル１３の巻回部１４を形成することができる。 The winding portion 14 of the coil 13 includes a seed portion 14a that is a part of the spiral pattern 14A and a plated portion 14b that is plated and grown on the seed portion 14a. It is formed by gradually growing. At this time, the winding part 14 of the coil 13 grows so as to fill the space defined between the two adjacent resin walls 18, and has the same shape as the space defined between the resin walls 18. As a result, the winding portion 14 of the coil 13 has a shape extending long along the normal direction (Z direction) of the substrate 11. That is, by adjusting the shape of the space defined between the resin walls 18, the shape of the winding portion 14 of the coil 13 is adjusted, and the winding portion 14 of the coil 13 is formed in the shape as designed. be able to.

コイル１３の巻回部１４は、隣り合う２つの樹脂壁１８の間を成長する際、成長領域を画定する樹脂壁１８の内側面に接しながら成長していく。このとき、コイル１３の巻回部１４と樹脂壁１８との間には、機械的結合も化学的結合も生じない。すなわち、コイル１３の巻回部１４は、樹脂壁１８と接着されないままめっき成長し、非接着状態で樹脂壁１８の間に介在する。本明細書において「非接着状態」とは、アンカー効果等の機械的結合および共有結合等の化学的結合が生じていない状態をいう。 The winding part 14 of the coil 13 grows while contacting with the inner side surface of the resin wall 18 that defines the growth region when growing between the two adjacent resin walls 18. At this time, neither mechanical bond nor chemical bond occurs between the winding part 14 of the coil 13 and the resin wall 18. That is, the wound portion 14 of the coil 13 grows by plating without being bonded to the resin wall 18, and is interposed between the resin walls 18 in a non-bonded state. In the present specification, the “non-adhesive state” refers to a state in which mechanical bond such as anchor effect and chemical bond such as covalent bond are not generated.

樹脂壁１８は、四角形状断面（図５では上底よりも下底が短い台形状断面）を有し、上端部の幅ｄ２’が下端部の幅ｄ２’’より広くなっている。樹脂壁１８、より具体的には、樹脂壁１８の側面１８ａが傾斜面となるように、上端部から下端部に向けて漸次狭まっている。樹脂壁１８の断面寸法は、一例として、高さ５０〜３００μｍ、上端部の幅（厚さ）５〜３０μｍ、下端部の幅（厚さ）５〜３０μｍ、下端部の幅（底辺）に対する高さの比５〜３０である。樹脂壁１８の断面寸法は、高さ１８０〜３００μｍ、上端部の幅（厚さ）５〜１２μｍ、下端部の幅（厚さ）５〜１２μｍ、下端部の幅に対する高さの比１５〜３０であってもよい。なお、樹脂壁１８の下端部の幅ｄ２’’は、上端側の幅ｄ２’の８０％〜３０％とすることができる。樹脂壁１８の上端部の幅ｄ２’を、下端部の幅ｄ２’’に対して広くすることは、たとえば、フォトリソグラフィの露光条件を調整することにより実現することができる。 The resin wall 18 has a quadrangular cross section (a trapezoidal cross section in which the lower bottom is shorter than the upper bottom in FIG. 5), and the width d2' of the upper end is wider than the width d2" of the lower end. The resin wall 18, more specifically, the side surface 18a of the resin wall 18 is gradually narrowed from the upper end portion to the lower end portion so that the side surface 18a is an inclined surface. The cross-sectional dimensions of the resin wall 18 are, for example, a height of 50 to 300 μm, an upper end width (thickness) of 5 to 30 μm, a lower end width (thickness) of 5 to 30 μm, and a height relative to the lower end width (bottom). The ratio is 5 to 30. The cross-sectional dimensions of the resin wall 18 are 180 to 300 μm in height, 5 to 12 μm in width (thickness) at the upper end, 5 to 12 μm in width (thickness) at the lower end, and the ratio of height to width at the lower end is 15 to 30 μm. May be The width d2″ of the lower end portion of the resin wall 18 can be 80% to 30% of the width d2′ of the upper end side. Increasing the width d2' of the upper end portion of the resin wall 18 with respect to the width d2'' of the lower end portion can be realized by, for example, adjusting the exposure conditions of photolithography.

コイル１３の巻回部１４は、図５に示すように上底よりも下底が長い台形状断面を有し、その断面寸法は、一例として、高さ８０〜２６０μｍ、幅（厚さ）４０〜２６０μｍ、下端部の幅（底辺）に対する高さの比１〜５である。コイル１３の巻回部１４の下端部の幅に対する高さの比は２〜５であってもよい。 As shown in FIG. 5, the winding portion 14 of the coil 13 has a trapezoidal cross section in which the lower bottom is longer than the upper bottom, and the cross sectional dimensions are, for example, a height of 80 to 260 μm and a width (thickness) of 40. ˜260 μm, and the ratio of height to width (bottom) of the lower end is 1 to 5. The ratio of the height to the width of the lower end of the winding portion 14 of the coil 13 may be 2 to 5.

さらに、図５に示すように、コイル１３の巻回部１４の上面１４ｃは、上側に突き出た形状となっている。より詳しくは、コイル１３の巻回部１４の上面１４ｃは、中央部では基板１１の主面１１ａに対して略平行になっているが、樹脂壁１８近傍の端部では曲線状に漸次下降している。そして、コイル１３の巻回部１４の上面１４ｃにおいては、基板１１の主面１１ａに対する相対位置に関し、上面１４ｃの樹脂壁１８と接する高さ位置が、上面１４ｃの中央部に位置する最高の高さ位置よりも低くなっている。 Further, as shown in FIG. 5, the upper surface 14c of the winding portion 14 of the coil 13 has a shape protruding upward. More specifically, the upper surface 14c of the winding portion 14 of the coil 13 is substantially parallel to the main surface 11a of the substrate 11 at the central portion, but gradually descends in a curved shape at the end portion near the resin wall 18. ing. Then, in the upper surface 14c of the winding portion 14 of the coil 13, with respect to the relative position with respect to the main surface 11a of the substrate 11, the height position of the upper surface 14c in contact with the resin wall 18 is the highest height located in the central portion of the upper surface 14c. It is lower than the position.

図５に示すとおり、コイル１３の巻回部１４の高さｈは、樹脂壁１８の高さＨよりも低いこと（ｈ＜Ｈ）が好ましい。すなわち、コイル１３の巻回部１４のめっき成長が樹脂壁１８の高さＨよりも低い位置で止まるように調整することが好ましい。コイル１３の巻回部１４の高さｈが樹脂壁１８の高さＨよりも低いと、巻回部１４は高さ方向にわたって設計寸法どおりの厚さとなる。また、コイル１３の巻回部１４の高さｈが、樹脂壁１８の高さＨより高いと、隣り合う巻回部１４同士が接触したり後述する絶縁体４０や接合層４１の厚さを十分に確保できなくなったりする事態が生じ、コイル１３の耐圧抵抗が低下するためである。 As shown in FIG. 5, the height h of the winding portion 14 of the coil 13 is preferably lower than the height H of the resin wall 18 (h<H). That is, it is preferable to adjust so that the plating growth of the wound portion 14 of the coil 13 stops at a position lower than the height H of the resin wall 18. When the height h of the winding portion 14 of the coil 13 is lower than the height H of the resin wall 18, the winding portion 14 has a thickness as designed in the height direction. If the height h of the winding portion 14 of the coil 13 is higher than the height H of the resin wall 18, the adjacent winding portions 14 may come into contact with each other or the thickness of the insulator 40 or the bonding layer 41 described later may be reduced. This is because a situation in which sufficient securing cannot be achieved occurs and the withstand voltage resistance of the coil 13 decreases.

また、樹脂壁１８によって画成された空間は、上端が開放されており、樹脂壁１８の上端部が巻回部１４の上側を覆うように回り込んでいないため、巻回部１４の上側の設計自由度が高い。すなわち、巻回部１４の上に任意の層を形成する態様も何の層も形成しない態様も選択し得る。 Further, the space defined by the resin wall 18 has an open upper end, and the upper end portion of the resin wall 18 does not wrap around so as to cover the upper side of the winding section 14, so that the upper side of the winding section 14 is High degree of freedom in design. That is, a mode in which an arbitrary layer is formed on the winding portion 14 or a mode in which no layer is formed can be selected.

巻回部１４の上に層を形成する場合には、各種の層形態や層材料を選択し得る。たとえば、図６に示すように、巻回部１４の上に、後述する被覆樹脂２１に含まれる金属磁性粉と巻回部１４との間の絶縁性を高めるために、絶縁体４０を設けることができる。絶縁体４０は、絶縁樹脂または絶縁磁性材料で構成することができる。また、絶縁体４０は、巻回部１４の上面１４ｃに直接的または間接的に接するとともに、巻回部１４と樹脂壁１８とを一体的に覆っている。なお、絶縁体４０は、巻回部１４のみを選択的に覆う構成にすることもできる。また、巻回部１４と絶縁体４０との間の接合性を高めるために、所定の接合層（たとえば、酸化による銅めっきの黒化層）４１を設けることができる。 When forming a layer on the winding part 14, various layer forms and layer materials can be selected. For example, as shown in FIG. 6, an insulator 40 is provided on the winding portion 14 in order to improve the insulation between the magnetic metal powder contained in the coating resin 21 described later and the winding portion 14. You can The insulator 40 can be made of an insulating resin or an insulating magnetic material. The insulator 40 directly or indirectly contacts the upper surface 14 c of the winding portion 14 and integrally covers the winding portion 14 and the resin wall 18. The insulator 40 may be configured to selectively cover only the winding portion 14. Further, in order to improve the bondability between the wound portion 14 and the insulator 40, a predetermined bonding layer (for example, a blackened layer of copper plating due to oxidation) 41 can be provided.

さらに、図５に示すとおり、複数の樹脂壁１８のうち、最外に位置する樹脂壁１８の厚さｄ１が内側に位置する樹脂壁１８の厚さｄ２より厚いこと（ｄ１＞ｄ２）が好ましい。この場合、コイル部品１の作製時や使用時に受けるＺ方向の圧力に対して剛性が付与される。厚さが厚い樹脂壁１８を最外位置に配置することで、この部分において主に上記圧力を受け止める。剛性の観点からは、両端に位置する樹脂壁１８の両方が、内側に位置する樹脂壁１８の厚さより厚いことが好ましい。 Further, as shown in FIG. 5, among the plurality of resin walls 18, it is preferable that the thickness d1 of the outermost resin wall 18 be thicker than the thickness d2 of the inner resin wall 18 (d1>d2). .. In this case, rigidity is imparted to the pressure in the Z direction that is received when the coil component 1 is manufactured or used. By arranging the thick resin wall 18 at the outermost position, the pressure is mainly received at this portion. From the viewpoint of rigidity, it is preferable that both of the resin walls 18 located at both ends are thicker than the resin walls 18 located inside.

なお、上述したコイル１３のめっき成長は、基板１１の両主面１１ａ、１１ｂにおいておこなわれる。両主面１１ａ、１１ｂのコイル１３同士は、基板１１の開口においてそれぞれの端部同士が接続されて導通される。 The plating growth of the coil 13 described above is performed on both main surfaces 11a and 11b of the substrate 11. The coils 13 on both main surfaces 11a and 11b are electrically connected by connecting their ends at the opening of the substrate 11.

基板１１上にコイル１３をめっき成長させた後、図７に示すように、基板１１は被覆樹脂２１で全体的に覆われる。すなわち、被覆樹脂２１が、基板１１の主面１１ａ、１１ｂのコイル１３と樹脂体１７とを一体的に覆う。樹脂体１７は、被覆樹脂２１内に残ったままコイル部品１の一部を構成する。被覆樹脂２１は、金属磁性粉含有樹脂からなり、ウエハ状態の基板１１の上に形成され、その後、硬化されることにより形成される。 After the coil 13 is plated and grown on the substrate 11, the substrate 11 is entirely covered with the coating resin 21, as shown in FIG. 7. That is, the coating resin 21 integrally covers the coil 13 and the resin body 17 on the main surfaces 11 a and 11 b of the substrate 11. The resin body 17 constitutes a part of the coil component 1 while remaining in the coating resin 21. The coating resin 21 is made of a resin containing metal magnetic powder, is formed on the substrate 11 in a wafer state, and is then cured to be formed.

被覆樹脂２１を構成する金属磁性粉含有樹脂は、金属磁性粉が分散された樹脂で構成されている。金属磁性粉は、たとえば鉄ニッケル合金（パーマロイ合金）、カルボニル鉄、アモルファス、非晶質または結晶質のＦｅＳｉＣｒ系合金、センダスト等で構成され得る。金属磁性粉含有樹脂に用いられる樹脂は、たとえば熱硬化性のエポキシ樹脂である。金属磁性粉含有樹脂に含まれる金属磁性粉の含有量は、一例として、９０〜９９ｗｔ％である。 The metal magnetic powder-containing resin forming the coating resin 21 is a resin in which the metal magnetic powder is dispersed. The magnetic metal powder may be composed of, for example, iron-nickel alloy (permalloy alloy), carbonyl iron, amorphous, amorphous or crystalline FeSiCr-based alloy, sendust, or the like. The resin used for the metal magnetic powder-containing resin is, for example, a thermosetting epoxy resin. The content of the metal magnetic powder contained in the metal magnetic powder-containing resin is, for example, 90 to 99 wt %.

さらに、ダイシングしてチップ化することで、図８に示す本体部１０が得られる。チップ化した後、必要に応じてバレル研磨等によりエッジの面取りをおこなってもよい。 Further, by dicing and forming into chips, the main body 10 shown in FIG. 8 is obtained. After chipping, the edge may be chamfered by barrel polishing or the like, if necessary.

最後に、本体部１０の端部パターン１５Ａが露出した端面（Ｙ方向において対向する端面）に、端部パターン１５Ａと電気的に接続されるように外部端子電極３０Ａ、３０Ｂを設けることで、コイル部品１が完成する。外部端子電極３０Ａ、３０Ｂは、コイル部品を搭載する基板の回路に接続するための電極であり、複数層構造とすることができる。たとえば、外部端子電極３０Ａ、３０Ｂは、端面に樹脂電極材料を塗布した後、その樹脂電極材料に金属めっきを施すことにより形成することができる。外部端子電極３０Ａ、３０Ｂの金属めっきには、Ｃｒ、Ｃｕ、Ｎｉ、Ｓｎ、Ａｕ、はんだ等を用いることができる。 Finally, the external terminal electrodes 30A and 30B are provided on the exposed end surface (end surface facing in the Y direction) of the end portion pattern 15A of the main body portion 10 so as to be electrically connected to the end portion pattern 15A. Part 1 is completed. The external terminal electrodes 30A and 30B are electrodes for connecting to the circuit of the board on which the coil component is mounted, and can have a multi-layer structure. For example, the external terminal electrodes 30A and 30B can be formed by applying a resin electrode material to the end faces and then performing metal plating on the resin electrode material. For metal plating of the external terminal electrodes 30A and 30B, Cr, Cu, Ni, Sn, Au, solder or the like can be used.

上述したコイル部品１によれば、図５で示したとおり、樹脂壁１８の上端部の幅ｄ２’が下端部の幅ｄ２’’より広く、該樹脂壁１８の間に延びる巻回部１４では、上端部の幅が下端部の幅より狭くなっている。そのため、巻回部１４は、基板１１側の断面積が大きな安定した断面形状を有している。そのため、巻回部１４は強度の向上が図られており、このようなコイル部品１においては、基板１１の厚さ方向（図５の上下方向）や面方向（図５の左右方向）からの圧力に起因する巻回部１４の歪みや倒壊が抑制される。 According to the coil component 1 described above, as shown in FIG. 5, the width d2′ of the upper end portion of the resin wall 18 is wider than the width d2″ of the lower end portion thereof, and the winding portion 14 extending between the resin walls 18 is The width of the upper end is smaller than the width of the lower end. Therefore, the winding portion 14 has a stable cross-sectional shape with a large cross-sectional area on the substrate 11 side. Therefore, the winding portion 14 is improved in strength, and in such a coil component 1, the winding portion 14 is formed from the thickness direction (vertical direction in FIG. 5) and the plane direction (horizontal direction in FIG. 5) of the substrate 11. The distortion and collapse of the winding portion 14 due to the pressure are suppressed.

特に、樹脂壁１８は、その側面１８ａが傾斜面となるように、上端部から下端部に向けて漸次狭まっているため、巻回部１４は、応力が付加されたときに側面のどの箇所にも応力が集中しにくくなっている。そのため、巻回部１４は、基板１１の厚さ方向や面方向からの圧力に対するさらなる強度向上が図られている。 In particular, since the resin wall 18 is gradually narrowed from the upper end portion to the lower end portion so that the side surface 18a becomes an inclined surface, the winding portion 14 is located at any position on the side surface when stress is applied. Stress is hard to concentrate. Therefore, the winding portion 14 is further improved in strength against pressure from the thickness direction and the surface direction of the substrate 11.

また、樹脂壁１８の上端部の幅ｄ２’が下端部の幅ｄ２’’より広くなっていることで、隣り合う２つの樹脂壁１８の間に画成される空間の上部開口の狭小化が図られている。換言すると、上記空間の上に樹脂壁１８の上端部が張り出して、該空間を樹脂壁１８の上端部が部分的に覆っている。そのため、上記空間の内部においてコイル１３の巻回部１４をめっき成長させる際に、上記空間からめっき部１４ｂが溢れ出る事態が抑制され、その結果、巻回部１４間で短絡が生じる事態も抑制される。 Further, since the width d2′ of the upper end portion of the resin wall 18 is wider than the width d2″ of the lower end portion, the upper opening of the space defined between two adjacent resin walls 18 can be narrowed. Has been planned. In other words, the upper end of the resin wall 18 projects above the space, and the upper end of the resin wall 18 partially covers the space. Therefore, when the winding portion 14 of the coil 13 is plated and grown inside the space, a situation in which the plating portion 14b overflows from the space is suppressed, and as a result, a situation in which a short circuit occurs between the winding portions 14 is also suppressed. To be done.

さらに、樹脂壁１８の下端部の幅ｄ２’’が上端部の幅ｄ２’より狭くなっていることで、隣り合う２つの樹脂壁１８の間に画成される空間が広い底面積を有する。そのため、樹脂壁１８の下端部の側面とシード部１４ａとの間に十分なクリアランスを確保しつつシード部１４ａの幅を拡げることができる。シード部１４ａの幅が拡がると、それに伴ってシード部１４ａとめっき部１４ｂとの間の接合領域が広がるため、コイル１３と基板１１との間の接合強度が向上する。 Further, since the width d2″ of the lower end portion of the resin wall 18 is narrower than the width d2′ of the upper end portion, the space defined between two adjacent resin walls 18 has a wide bottom area. Therefore, it is possible to widen the width of the seed portion 14a while ensuring a sufficient clearance between the side surface of the lower end portion of the resin wall 18 and the seed portion 14a. When the width of the seed portion 14a is increased, the joint region between the seed portion 14a and the plated portion 14b is enlarged accordingly, so that the joint strength between the coil 13 and the substrate 11 is improved.

また、コイル部品１によれば、コイル１３の巻回部１４の上面１４ｃが樹脂壁１８と接する高さ位置が、上面１４ｃにおける最高の高さ位置よりも低くなっている。そのため、巻回部１４から、樹脂壁１８を介して隣り合う巻回部１４までの沿面距離の延長が図られており、隣り合う巻回部１４の間において耐圧が向上している。 Further, according to the coil component 1, the height position where the upper surface 14c of the winding portion 14 of the coil 13 contacts the resin wall 18 is lower than the maximum height position on the upper surface 14c. Therefore, the creepage distance from the wound portion 14 to the adjacent wound portion 14 via the resin wall 18 is extended, and the breakdown voltage between the adjacent wound portions 14 is improved.

さらに、コイル部品１によれば、複数の樹脂壁１８の間にコイル１３の巻回部１４が非接着状態で介在するため、コイル１３の巻回部１４と樹脂壁１８とが互いに対して変位可能である。そのため、コイル部品１の使用環境が高温になったときなどの周辺温度に変化があり、コイル１３の巻回部１４と樹脂壁１８との間の熱膨張係数の差に起因する応力が生じた場合であっても、コイル１３の巻回部１４と樹脂壁１８とが相対移動することでその応力が緩和される。 Further, according to the coil component 1, since the winding portion 14 of the coil 13 is interposed between the plurality of resin walls 18 in a non-adhesive state, the winding portion 14 of the coil 13 and the resin wall 18 are displaced with respect to each other. It is possible. Therefore, there is a change in the ambient temperature when the usage environment of the coil component 1 becomes high, and a stress is generated due to the difference in the coefficient of thermal expansion between the winding portion 14 of the coil 13 and the resin wall 18. Even in such a case, the winding portion 14 of the coil 13 and the resin wall 18 move relative to each other, whereby the stress is relaxed.

また、コイル部品１の製造方法によれば、樹脂体１７の樹脂壁１８の間に介在するように、コイル１３の巻回部１４がめっき成長されている。すなわち、被覆樹脂２１でコイル１３を覆う前に、コイル１３の巻回部１４間にはすでに樹脂壁１８が介在している。そのため、コイル１３の巻回部１４間に樹脂を別途に充填する必要はなく、樹脂壁１８によりコイル１３の巻回部１４間の樹脂の寸法精度の安定化が図られる。 Further, according to the method for manufacturing the coil component 1, the winding portion 14 of the coil 13 is plated and grown so as to be interposed between the resin walls 18 of the resin body 17. That is, before the coil 13 is covered with the coating resin 21, the resin wall 18 is already interposed between the winding portions 14 of the coil 13. Therefore, it is not necessary to separately fill the space between the winding parts 14 of the coil 13, and the resin wall 18 stabilizes the dimensional accuracy of the resin between the winding parts 14 of the coil 13.

なお、コイル部品１は、上述した形態に限らず、様々な形態を採用することができる。 The coil component 1 is not limited to the above-described form, but various forms can be adopted.

たとえば、樹脂壁の断面形状は、図９に示したような断面形状であってもよい。図９に示した樹脂壁１８Ａは、側面１８ａに段部１８ｂが形成されるように、上端部から下端部に向けて段階的に狭まっている。樹脂壁１８Ａも、上述した樹脂壁１８同様、上端部の幅ｄ２’が下端部の幅ｄ２’’より広く、該樹脂壁１８の間に延びる巻回部１４では、上端部の幅が下端部の幅より狭くなっている。そのため、巻回部１４は強度の向上が図られており、このようなコイル部品１においては、基板１１の厚さ方向（図８の上下方向）や面方向（図８の左右方向）からの圧力に起因する巻回部１４の歪みや倒壊が抑制される。 For example, the cross-sectional shape of the resin wall may be the cross-sectional shape as shown in FIG. The resin wall 18A shown in FIG. 9 is gradually narrowed from the upper end to the lower end so that a step 18b is formed on the side surface 18a. Like the resin wall 18 described above, the resin wall 18A has a width d2′ at the upper end portion wider than the width d2″ at the lower end portion, and the winding portion 14 extending between the resin walls 18 has a width at the upper end portion at the lower end portion. Is narrower than the width of. Therefore, the winding portion 14 is improved in strength. In such a coil component 1, the winding portion 14 can be formed in the thickness direction (vertical direction in FIG. 8) or the plane direction (horizontal direction in FIG. 8) of the substrate 11. The distortion and collapse of the winding portion 14 due to the pressure are suppressed.

１…コイル部品、１１…基板、１３…コイル、１４…巻回部、１４ａ…シード部、１４ｂ…めっき部、１４ｃ…上面、１７…樹脂体、１８、１８Ａ…樹脂壁、１８ａ…側面、１８ｂ…段部、２１…被覆樹脂、３０Ａ、３０Ｂ…外部端子電極、４０…絶縁体。 DESCRIPTION OF SYMBOLS 1... Coil component, 11... Substrate, 13... Coil, 14... Winding part, 14a... Seed part, 14b... Plating part, 14c... Top surface, 17... Resin body, 18, 18A... Resin wall, 18a... Side surface, 18b ... step portion, 21... coating resin, 30A, 30B... external terminal electrode, 40... insulator.

Claims (9)

基板と、
前記基板の主面上にめっき成長で設けられたコイルと、
前記基板の主面上に設けられ、前記コイルの巻回部が間に延びる複数の樹脂壁を有する樹脂体と、
磁性粉含有樹脂からなり、前記基板の主面の前記コイルと前記樹脂体とを一体的に覆うとともに前記樹脂体の外周側において前記基板の主面を覆う被覆樹脂と
を備え、
前記樹脂壁は、上端部の幅が下端部の幅より広く、
前記基板の主面上に複数並んだ樹脂壁のうち、最外に位置する樹脂壁の厚さおよび最内に位置する樹脂壁の厚さが、最外に位置する樹脂壁と最内に位置する樹脂壁との間に位置する樹脂壁の厚さより厚い、コイル部品。 Board,
A coil provided by plating growth on the main surface of the substrate,
A resin body provided on the main surface of the substrate and having a plurality of resin walls between which the winding portion of the coil extends,
A magnetic powder-containing resin, and a coating resin that integrally covers the coil and the resin body on the main surface of the substrate and covers the main surface of the substrate on the outer peripheral side of the resin body,
The resin wall is widely than the width of the width of the lower end of the upper portion,
Among a plurality of resin walls arranged on the main surface of the substrate, the thickness of the outermost resin wall and the thickness of the innermost resin wall are the outermost resin wall and the innermost resin wall. It has a thickness than the thickness of the resin wall positioned between the resin walls, coil component. 前記樹脂壁の幅は、該樹脂壁の側面が傾斜面となるように、上端部から下端部に向けて漸次狭まる、請求項１に記載のコイル部品。 The coil component according to claim 1, wherein the width of the resin wall is gradually narrowed from the upper end portion to the lower end portion such that the side surface of the resin wall is an inclined surface. 前記樹脂壁の幅は、該樹脂壁の側面に段部が形成されるように、上端部から下端部に向けて段階的に狭まる、請求項１に記載のコイル部品。 The coil component according to claim 1, wherein the width of the resin wall is gradually narrowed from an upper end portion to a lower end portion so that a step portion is formed on a side surface of the resin wall. 前記樹脂体の樹脂壁の断面形状が四角形状である、請求項１〜３のいずれか一項に記載のコイル部品。 The coil component according to claim 1, wherein the resin wall of the resin body has a quadrangular cross-sectional shape. 前記樹脂体の樹脂壁の断面は底辺の長さに対する高さの比が１より大きく、該樹脂壁が前記基板の主面の法線方向に沿って長く延びている、請求項４に記載のコイル部品。 The cross section of the resin wall of the resin body has a ratio of the height to the length of the bottom side is larger than 1, and the resin wall extends long along the normal direction of the main surface of the substrate. Coil parts. 前記コイルの巻回部の断面形状が四角形状である、請求項１〜５のいずれか一項に記載のコイル部品。 The coil component according to claim 1, wherein the winding portion of the coil has a quadrangular cross-sectional shape. 前記コイルの巻回部の断面は底辺の長さに対する高さの比が１より大きく、該巻回部の断面が前記基板の主面の法線方向に沿って長く延びている、請求項６に記載のコイル部品。 7. The cross section of the winding part of the coil has a ratio of the height to the length of the bottom side of more than 1, and the cross section of the winding part extends long along the normal direction of the main surface of the substrate. Coil parts described in. 前記樹脂体の樹脂壁の高さが前記コイルの巻回部の高さより高い、請求項１〜７のいずれか一項に記載のコイル部品。 The coil component according to claim 1, wherein a height of a resin wall of the resin body is higher than a height of a winding portion of the coil. 前記樹脂体は、前記基板の主面上に前記コイルがめっき成長される前に設けられ、
前記コイルの巻回部は、前記樹脂体の樹脂壁に接着されていない、請求項１〜８のいずれか一項に記載のコイル部品。 The resin body is provided on the main surface of the substrate before the coil is plated and grown,
The coil part according to any one of claims 1 to 8, wherein the winding portion of the coil is not adhered to the resin wall of the resin body.
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