TWM607912U

TWM607912U - Wafer separation machine

Info

Publication number: TWM607912U
Application number: TW109211489U
Authority: TW
Inventors: 邱新智
Original assignee: 新睿精密股份有限公司
Priority date: 2020-09-02
Filing date: 2020-09-02
Publication date: 2021-02-21

Abstract

本創作提供一種晶圓分離機，其用於將一晶圓及一載板分離，晶圓分離機包括一機座、一吸取裝置、一真空吸盤及一加熱裝置。機座具有一第一工作區及一第二工作區；吸取裝置包括一活動架及一設置於活動架上的吸盤件；真空吸盤設置於第一工作區，用以吸附晶圓與載板；加熱裝置設置於真空吸盤下方，用以對晶圓與載板加熱，以使晶圓與載板受熱而易於彼此脫離；藉此，當晶圓與載板受熱後，吸盤件能將載板自晶圓吸取，使載板隨活動架滑移至第二工作區置放並進行降溫。This creation provides a wafer separator, which is used to separate a wafer and a carrier. The wafer separator includes a base, a suction device, a vacuum chuck, and a heating device. The machine base has a first working area and a second working area; the suction device includes a movable rack and a suction cup set on the movable rack; a vacuum suction cup is installed in the first working area to suck the wafer and the carrier; The heating device is arranged under the vacuum chuck to heat the wafer and the carrier so that the wafer and the carrier are heated and easily separated from each other; thereby, when the wafer and the carrier are heated, the chuck can remove the carrier from the The wafer is sucked so that the carrier board slides along with the movable rack to the second working area for placement and cooling.

Description

晶圓分離機Wafer Separator

本創作係有關一種晶圓分離機，尤指一種有效率地將晶圓與載板分離的晶圓分離機。This creation is about a wafer separator, especially a wafer separator that efficiently separates the wafer from the carrier.

按，在晶圓製程中，晶圓與載板的分離係為重要的加工步驟之一，其中晶圓與載板的分離手段，不外乎是利用溶劑溶解、熱力剪切或是機械剝離等的方式來分離。According to the wafer process, the separation of the wafer and the carrier is one of the important processing steps. The separation of the wafer and the carrier is nothing more than solvent dissolution, thermal shearing, or mechanical peeling. Way to separate.

然而傳統的晶圓分離方式仍著重於人力，其自動化程度低，導致人力成本高，整體效率低，因而有改善之空間。However, the traditional wafer separation method still focuses on manpower, and its low degree of automation leads to high manpower costs and low overall efficiency, so there is room for improvement.

為解決上述課題，本創作揭露一種晶圓分離機，其於晶圓加熱後，利用吸取裝置將載板吸取並移至第二工作區進行降溫，以提升工作效率。In order to solve the above-mentioned problems, this invention discloses a wafer separator, which uses a suction device to suck the carrier after the wafer is heated and move it to the second working area for cooling, so as to improve the working efficiency.

為達上述目的，本創作一項實施例提供一種晶圓分離機，其用於將一晶圓及一載板分離，晶圓分離機包括一機座、一吸取裝置、一真空吸盤、一加熱裝置及一控制裝置。機座具有一第一工作區及一第二工作區；吸取裝置包括一活動架及一設置於活動架上的吸盤件，活動架能夠相對機座沿著X軸方向往復滑移，吸盤件能夠相對機座沿著Y軸方向降昇位移；真空吸盤設置於第一工作區，用以吸附晶圓與載板；加熱裝置設置於真空吸盤下方，用以對晶圓與載板加熱，以使晶圓與載板受熱而易於彼此脫離；控制裝置電性連接於吸取裝置、真空吸盤及加熱裝置；藉此，當晶圓與載板受熱後，吸盤件能將載板自晶圓吸取，使載板隨活動架滑移至第二工作區置放並進行降溫。To achieve the above objective, an embodiment of the present invention provides a wafer separator, which is used to separate a wafer from a carrier. The wafer separator includes a base, a suction device, a vacuum chuck, and a heating device. Device and a control device. The machine base has a first working area and a second working area; the suction device includes a movable frame and a suction cup part arranged on the movable frame. The movable frame can slide back and forth along the X-axis relative to the machine base, and the suction cup part can The relative base is moved downward and upward along the Y-axis direction; the vacuum chuck is arranged in the first working area to suck the wafer and the carrier; the heating device is arranged under the vacuum chuck to heat the wafer and the carrier to make The wafer and the carrier are easily separated from each other by heating; the control device is electrically connected to the suction device, the vacuum chuck and the heating device; thereby, when the wafer and the carrier are heated, the chuck can suck the carrier from the wafer, so that The carrier board slides along with the movable frame to the second working area for placement and cooling.

於本創作另一實施例中，吸取裝置更包括兩滑軌，設置於機座的底部兩側，活動架跨設於機座的兩側且連結於兩滑軌；吸取裝置包括一第一驅動馬達及一第二驅動馬達，第一驅動馬達驅使活動架之動作，第二驅動馬達控制吸盤件之昇降動作。In another embodiment of the present creation, the suction device further includes two sliding rails, which are arranged on both sides of the bottom of the machine base, and the movable frame straddles the two sides of the machine base and is connected to the two sliding rails; the suction device includes a first drive A motor and a second driving motor, the first driving motor drives the movement of the movable frame, and the second driving motor controls the lifting movement of the sucker.

於本創作另一實施例中，真空吸盤至少凹設有一真空迴路及具有至少一真空吸孔與真空迴路連通，至少一真空吸孔經由一管路連通於真空源。In another embodiment of the present invention, the vacuum suction cup is recessed with at least one vacuum circuit and has at least one vacuum suction hole connected to the vacuum circuit, and the at least one vacuum suction hole is connected to the vacuum source via a pipeline.

於本創作另一實施例中，第一工作區具有一盤槽，以供真空吸盤容納，加熱裝置為電熱管，其設置於盤槽與真空吸盤之間。In another embodiment of the present creation, the first working area has a disc groove for receiving the vacuum chuck, and the heating device is an electric heating tube, which is arranged between the disc groove and the vacuum chuck.

於本創作另一實施例中，盤槽底部設有一冷卻管路，真空吸盤內表面凹設有一對應加熱裝置形狀的冷卻道，冷卻道與冷卻管路連通。In another embodiment of the present invention, a cooling pipe is provided at the bottom of the tray, and a cooling passage corresponding to the shape of the heating device is recessed on the inner surface of the vacuum suction cup, and the cooling passage is connected with the cooling pipe.

於本創作另一實施例中，第一工作區於真空吸盤周緣環設有一冷卻水道；機座更包括一冷卻裝置，其設於真空吸盤的下方，冷卻裝置具有一進水部及一連通進水孔的出水部。In another embodiment of this creation, the first working area is provided with a cooling water channel at the periphery of the vacuum chuck; the machine base further includes a cooling device, which is arranged under the vacuum chuck. The cooling device has a water inlet and a communicating inlet. The outlet of the water hole.

於本創作另一實施例中，第二工作區具有一散熱板，散熱板的正投影與冷卻水道的正投影部分重疊。In another embodiment of the present creation, the second working area has a heat sink, and the orthographic projection of the heat sink partially overlaps the orthographic projection of the cooling water channel.

於本創作另一實施例中，第一驅動馬達與第二驅動馬達均為步進馬達，吸盤件的材質為陶瓷。In another embodiment of the present creation, the first driving motor and the second driving motor are both stepping motors, and the material of the suction cup is ceramic.

於本創作另一實施例中，更包括一設置於機座的頂持裝置，頂持裝置具有複數個第一頂針與複數個第二頂針，其同步地分別昇降設置於真空吸盤與第二工作區；更包括一感測裝置設置於機座，用以感測晶圓與載板是否位於真空吸盤的上方。In another embodiment of the present creation, it further includes a holding device arranged on the machine base. The holding device has a plurality of first thimble and a plurality of second thimble, which are synchronously raised and lowered on the vacuum suction cup and the second working device. Area; It also includes a sensing device set on the base for sensing whether the wafer and the carrier are located above the vacuum chuck.

於本創作另一實施例中，頂持裝置更具有一基板及一動力源，基板與動力源設於機座的底部，第一頂針與第二頂針連結設置於基板且分別穿伸於真空吸盤與第二工作區，藉由動力源驅使基板相對機座沿著Y軸方向產生滑動，而使第一頂針與第二頂針產生同步的昇降動作。In another embodiment of the present invention, the holding device further has a base plate and a power source. The base plate and the power source are arranged at the bottom of the base. The first thimble and the second thimble are connected to the base plate and extend through the vacuum chuck. As with the second working area, the power source drives the substrate to slide along the Y-axis direction relative to the base, so that the first thimble and the second thimble generate synchronous lifting actions.

藉此，晶圓與載板於第一工作區進行加熱，使黏膠受熱溶解，讓兩者易於分離，接著以吸取裝置的吸盤件將載板吸取並移至第二工作區進行降溫，藉以完成晶圓分離的工作程序。In this way, the wafer and the carrier are heated in the first working area to dissolve the adhesive, making the two easy to separate, and then the carrier is sucked by the sucker of the suction device and moved to the second working area to cool down. Complete the working procedure of wafer separation.

為便於說明本創作於上述創作內容一欄中所表示的中心思想，茲以具體實施例表達。實施例中各種不同物件係按適於列舉說明之比例，而非按實際元件的比例與以繪製，合先敘明。In order to facilitate the description of the central idea of this creation in the column of the above creation content, specific examples are used to express it. The various objects in the embodiments are drawn according to the proportions suitable for enumerating and explaining, rather than according to the proportions of the actual elements, and are described first.

請參閱圖1至圖7所示，係揭示本創作實施例之晶圓分離機100，其用於將一晶圓2及一載板1分離，晶圓分離機100包括一機座10、一吸取裝置20、一真空吸盤30、一加熱裝置40及一控制裝置50。其中，如圖5所示，晶圓2異於載板1貼合一載體3，載體3為透氣材質，如碳化矽。而載板1與晶圓2之間透過一黏膠4而貼合。Please refer to FIG. 1 to FIG. 7, which shows the wafer separator 100 of the creative embodiment, which is used to separate a wafer 2 and a carrier board 1. The wafer separator 100 includes a base 10, a The suction device 20, a vacuum chuck 30, a heating device 40 and a control device 50. Among them, as shown in FIG. 5, the wafer 2 is different from the carrier 1 and attached to a carrier 3, and the carrier 3 is made of a gas-permeable material, such as silicon carbide. The carrier 1 and the wafer 2 are bonded through an adhesive 4.

機座10，概呈長矩形，並具有一第一工作區11及一第二工作區12。機座10可依需求設置於機台上，以方便進行作業。於本創作實施例中，第二工作區12具有一散熱板13，其為鐵弗龍材質製成，不易被黏膠黏著住，亦不會刮傷載體3，且耐高溫。The base 10 is generally rectangular and has a first working area 11 and a second working area 12. The machine base 10 can be set on the machine table as required to facilitate the operation. In this creative embodiment, the second working area 12 has a heat dissipation plate 13, which is made of Teflon material, is not easy to be adhered to by glue, does not scratch the carrier 3, and is resistant to high temperature.

吸取裝置20，係包括一活動架21、一設置於活動架21上的吸盤件22、一設置於機座10底部的第一驅動馬達23、一設置於活動架21的第二驅動馬達24及兩滑軌25。滑軌25沿機座10的X軸向方向設置於底部兩側，活動架21概呈ㄇ字型，並跨設於機座10的兩側且連結於滑軌25，且活動架21受第一驅動馬達23所驅使而能夠相對機座10沿著X軸方向往復滑移。另外，第二驅動馬達24能控制吸盤件22之昇降動作，使吸盤件22能夠相對機座10沿著Y軸方向降昇位移。其中，第一驅動馬達23與第二驅動馬達24均為步進馬達，其可控制行進速度，且第二驅動馬達24以軟體演算法計算而控制下壓的力度，吸盤件22的材質為陶瓷，且吸盤件22可作萬向角度轉動。而當第二驅動馬達24下壓時，吸盤件22會自動校準水平，而後在拖移時，吸盤件22會持續保持水平移動，確保載板1不會在快脫離時呈現傾斜角度，刮傷晶圓2的側邊。The suction device 20 includes a movable frame 21, a suction cup 22 arranged on the movable frame 21, a first drive motor 23 arranged on the bottom of the base 10, a second drive motor 24 arranged on the movable frame 21, and Two slide rails 25. The slide rails 25 are arranged on both sides of the bottom along the X-axis direction of the machine base 10. The movable frame 21 is generally U-shaped, and is arranged on both sides of the machine base 10 and connected to the slide rail 25, and the movable frame 21 is protected by the first A driving motor 23 can reciprocate sliding relative to the base 10 along the X-axis direction. In addition, the second driving motor 24 can control the lifting movement of the suction cup 22 so that the suction cup 22 can be moved downward and upward relative to the base 10 along the Y-axis direction. Among them, the first driving motor 23 and the second driving motor 24 are both stepping motors, which can control the traveling speed, and the second driving motor 24 is calculated by software algorithm to control the pressing force. The material of the suction cup 22 is ceramic , And the suction cup member 22 can be rotated at a universal angle. When the second drive motor 24 is pressed down, the suction cup 22 will automatically align horizontally, and then when it is dragged, the suction cup 22 will continue to move horizontally to ensure that the carrier 1 will not be inclined or scratched when it is about to detach. The side of wafer 2.

真空吸盤30，其為圓盤形而設置於第一工作區11，用以吸附晶圓2與載板1。真空吸盤30凹設有二個真空迴路31及具有至少一真空吸孔32與真空迴路31連通，真空吸孔32經由設置於機座10底部的一管路33連通於真空源（圖中未繪出），於本創作實施例中，真空迴路31與真空吸孔32各為兩個，且可依晶圓2大小，並以電磁閥進行切換真空吸孔32的導通，以便真空吸盤30能夠吸附不同尺寸的晶圓2。藉此，當晶圓2與載板1位於第一工作區11且放置於真空吸盤30的表面時，透過真空源抽取真空，以便利用真空迴路31與真空吸孔32對晶圓2與載板1產生吸附的效果，使晶圓2與載板1穩定地位於真空吸盤30。The vacuum chuck 30 has a disc shape and is arranged in the first working area 11 for sucking the wafer 2 and the carrier 1. The vacuum chuck 30 is recessed with two vacuum circuits 31 and has at least one vacuum suction hole 32 communicating with the vacuum circuit 31. The vacuum suction hole 32 is connected to a vacuum source via a pipe 33 provided at the bottom of the base 10 (not shown in the figure) In this creative embodiment, there are two vacuum circuits 31 and two vacuum suction holes 32, which can be switched according to the size of the wafer 2, and the conduction of the vacuum suction holes 32 can be switched by a solenoid valve, so that the vacuum suction cup 30 can suck Wafers of different sizes 2. Thereby, when the wafer 2 and the carrier 1 are located in the first working area 11 and are placed on the surface of the vacuum chuck 30, vacuum is drawn through the vacuum source, so that the vacuum circuit 31 and the vacuum suction holes 32 are used to compare the wafer 2 and the carrier. 1 produces a suction effect, so that the wafer 2 and the carrier 1 are stably positioned on the vacuum chuck 30.

加熱裝置40，係設置於真空吸盤30下方，用以對晶圓2與載板1加熱，以使晶圓2與載板1受熱而易於彼此脫離。於本實施例中，第一工作區11具有一盤槽14，以供真空吸盤30容納，而所述的加熱裝置40為電熱管，其設置於盤槽14與真空吸盤30之間，俾使電熱管通電後而對真空吸盤30進行均勻加熱，讓晶圓2與載板1之間的黏膠3受熱溶解，使兩者易於分離。The heating device 40 is arranged under the vacuum chuck 30 to heat the wafer 2 and the carrier 1 so that the wafer 2 and the carrier 1 are heated and easily separated from each other. In this embodiment, the first working area 11 has a disc groove 14 for the vacuum chuck 30 to accommodate, and the heating device 40 is an electric heating tube, which is arranged between the disc groove 14 and the vacuum chuck 30 to make After the electric heating tube is energized, the vacuum chuck 30 is uniformly heated, so that the adhesive 3 between the wafer 2 and the carrier 1 is heated and dissolved, so that the two can be easily separated.

控制裝置50，係電性連接於吸取裝置20、真空吸盤30及加熱裝置40，透過控制裝置50而能控制吸取裝置20、真空吸盤30及加熱裝置40的動作。藉此，當晶圓2與載板1受熱後，此時兩者處於易於分離的狀態，控制裝置50自動偵測判定溫度已達到預定，並利用吸盤件22而能將載板1自晶圓2吸取，使晶圓2相對載板1分離，接著使載板2隨活動架21保持水平滑移(避免刮傷晶圓2與殘膠於分離機)至第二工作區12置放並進行降溫，以完成晶圓2分離之作業。在一些實施例當中，控制裝置50也可以一次控制多台分離機。The control device 50 is electrically connected to the suction device 20, the vacuum chuck 30 and the heating device 40, and can control the actions of the suction device 20, the vacuum chuck 30 and the heating device 40 through the control device 50. In this way, when the wafer 2 and the carrier 1 are heated, they are in a state of being easily separated. The control device 50 automatically detects that the temperature has reached a predetermined temperature, and uses the suction cup 22 to remove the carrier 1 from the wafer. 2 Suction, separate the wafer 2 from the carrier board 1, and then keep the carrier board 2 sliding horizontally with the movable frame 21 (to avoid scratching the wafer 2 and residual glue on the separator) to the second working area 12 to place and proceed The temperature is lowered to complete the operation of wafer 2 separation. In some embodiments, the control device 50 can also control multiple separators at one time.

其中，本創作之控制裝置50能夠顯示、調控，前述各裝置的啟閉動作、行程、加熱溫度、加熱時間等等。Among them, the control device 50 of this creation can display and control the opening and closing actions, strokes, heating temperature, heating time, etc. of the aforementioned devices.

於本創作另一實施例中，盤槽14底部設有一冷卻管路141連通於一冷卻源（圖中未繪出），冷卻管路141為各兩個，其採用一進一出的設計。所述的冷卻源為氣冷式設備，冷卻管路，真空吸盤30內表面凹設有一對應加熱裝置40形狀的冷卻道34，冷卻道34與電熱管的管道重疊而為共同管道，且冷卻道34與冷卻管路141連通，藉此，當載板1被吸盤件22吸取後，透過冷卻氣體吹散真空吸盤30下方的加熱裝置40與盤槽14的高溫以便進行降溫動作。In another embodiment of the present invention, a cooling pipe 141 is provided at the bottom of the tray 14 to communicate with a cooling source (not shown in the figure), and there are two cooling pipes 141 each, which adopts a design of one inlet and one outlet. The cooling source is air-cooled equipment, cooling pipelines, the inner surface of the vacuum chuck 30 is recessed with a cooling channel 34 corresponding to the shape of the heating device 40, the cooling channel 34 overlaps with the pipe of the electric heating tube to form a common pipeline, and the cooling channel 34 is in communication with the cooling pipe 141, whereby when the carrier 1 is sucked by the suction cup 22, the high temperature of the heating device 40 and the disc tank 14 under the vacuum suction cup 30 is blown away by the cooling gas to perform a cooling action.

於本創作另一實施例中，第一工作區11於真空吸盤30周緣環設有一冷卻水道15，冷卻水道15採內藏式設置而不外露，冷卻水道15經由設置於機座10底部的一出水接頭151與一入水接頭152而流體連接於水源，藉此水源注入冷卻水道15而環繞於真空吸盤30周緣，以便輔助前述冷卻源之冷卻效果，防止加熱裝置40向機體擴散溫度。另外，散熱板13的正投影與冷卻水道15的正投影部分重疊，如此一來，冷卻水道15能夠將散熱板13的高溫經由水源流通而帶離，以使散熱板13達到降溫之功效。In another embodiment of the present creation, the first working area 11 is provided with a cooling water channel 15 around the periphery of the vacuum chuck 30. The cooling water channel 15 is built-in and not exposed. The cooling water channel 15 passes through a cooling channel 15 provided at the bottom of the machine base 10. The water outlet connector 151 and a water inlet connector 152 are fluidly connected to a water source, whereby the water source is injected into the cooling water channel 15 and surrounds the periphery of the vacuum suction cup 30 to assist the cooling effect of the aforementioned cooling source and prevent the heating device 40 from spreading temperature to the body. In addition, the orthographic projection of the heat dissipation plate 13 overlaps with the orthographic projection of the cooling water channel 15 so that the cooling water channel 15 can take away the high temperature of the heat dissipation plate 13 through the flow of water, so that the heat dissipation plate 13 achieves the effect of cooling.

於本創作另一實施例中，更包括一設置於機座10的頂持裝置60，頂持裝置60具有複數個第一頂針61、複數個第二頂針62、一基板63及一動力源64。基板63與動力源64設於機座10的底部，第一頂針61與第二頂針62連結設置於基板63且分別穿伸於真空吸盤30與第二工作區12，藉由動力源64驅使基板63相對機座10沿著Y軸方向產生滑動，而使第一頂針61與第二頂針62產生同步的昇降動作。藉此，控制裝置50自動判定後，而使第一頂針61可昇降地設置於真空吸盤30，用以將晶圓2與載板1相對真空吸盤30頂起，亦同步地使第二頂針62可昇降地設置於第二工作區12，用以將載板1相對第二工作區12頂起，方便工作者於降溫至待機溫度後拿取物件。In another embodiment of the present creation, it further includes a holding device 60 disposed on the machine base 10. The holding device 60 has a plurality of first thimble 61, a plurality of second thimble 62, a base plate 63 and a power source 64 . The base plate 63 and the power source 64 are arranged at the bottom of the machine base 10. The first ejector pin 61 and the second ejector pin 62 are connected to the base plate 63 and extend through the vacuum chuck 30 and the second working area 12 respectively. The base plate is driven by the power source 64 The 63 slides along the Y-axis direction relative to the base 10, so that the first thimble 61 and the second thimble 62 have a synchronized lifting action. Thereby, after the control device 50 automatically determines, the first ejector pin 61 is set on the vacuum chuck 30 so as to lift the wafer 2 and the carrier 1 relative to the vacuum chuck 30, and the second ejector pin 62 is also synchronized with the vacuum chuck 30. It is set up and down in the second working area 12 to lift the carrier board 1 relative to the second working area 12 so as to facilitate workers to take objects after cooling down to the standby temperature.

於本創作另一實施例中，更包括一感測裝置70設置於機座10，用以感測晶圓2與載板1是否位於真空吸盤30的上方，感測裝置70以雷射或紅外線方式進行感測，包括一發射件71及一接收件72，發射件71可以設於活動架21，接收件72可以設於第一工作區11，接收件72用以接收發射件71所發出的感測訊號，但感測訊號被遮斷時，則判定晶圓2與載板1是位於真空吸盤30的上方。In another embodiment of the present creation, it further includes a sensing device 70 disposed on the base 10 for sensing whether the wafer 2 and the carrier 1 are located above the vacuum chuck 30, and the sensing device 70 uses a laser or infrared It includes a transmitting element 71 and a receiving element 72. The transmitting element 71 can be set in the movable frame 21, the receiving element 72 can be set in the first working area 11, and the receiving element 72 is used to receive the emission from the transmitting element 71. The sensing signal is detected, but when the sensing signal is interrupted, it is determined that the wafer 2 and the carrier 1 are located above the vacuum chuck 30.

於本創作另一實施例中，機座10更包括一冷卻裝置80，其設於真空吸盤30的下方，冷卻裝置80具有一進水部81及一連通進水部81的出水部82，冷卻裝置80亦連接於冷卻水源，使冷卻水經由進水部81與出水部82在冷卻裝置80內部流通，以便對冷卻機座10底部及真空吸盤30下方進行冷卻。In another embodiment of the present creation, the base 10 further includes a cooling device 80, which is arranged under the vacuum suction cup 30. The cooling device 80 has a water inlet 81 and a water outlet 82 connected to the water inlet 81 to cool The device 80 is also connected to a cooling water source, so that the cooling water circulates inside the cooling device 80 through the water inlet 81 and the water outlet 82 to cool the bottom of the cooling base 10 and the vacuum suction cup 30.

如圖5至圖7所示，係說明利用本創作進行晶圓2分離作業的流程與步驟。首先，如圖5所示，頂持裝置60的第一頂針61與第二頂針62處於昇起狀態，接著以人工或是機械手臂將晶圓2與載板1置放於第一工作區11上，並受第一頂針61所頂持。As shown in Figures 5 to 7, it is an explanation of the flow and steps of the wafer 2 separation operation using this creation. First, as shown in FIG. 5, the first thimble 61 and the second thimble 62 of the holding device 60 are in a raised state, and then the wafer 2 and the carrier 1 are placed in the first working area 11 by manual or mechanical arms. Up, and supported by the first thimble 61.

如圖6所示，頂持裝置60作動而使晶圓2與載板1下降，並置放於真空吸盤30上，同時受真空吸盤30所穩定地吸附，接著對真空吸盤30加熱至一定時間與溫度，俾使使晶圓2與載板1受熱而易於被分離。As shown in FIG. 6, the holding device 60 actuates to lower the wafer 2 and the carrier 1 and place them on the vacuum chuck 30, while being stably sucked by the vacuum chuck 30, and then heat the vacuum chuck 30 to a certain period of time and The temperature is so that the wafer 2 and the carrier 1 can be easily separated by being heated.

如圖7所示，啟動活動架21，利用吸盤件22將載板1自晶圓2取離並移動至第二工作區12置放並進行降溫，以完成晶圓2分離之作業。其中，當晶圓2被分離後，可透過前述的冷卻手段對電熱管與盤槽14進行降溫，同時冷卻水道15也可以對散熱板13進行降溫，之後再利用頂持裝置60將晶圓2與載板1分別撐起，以便工作人員或是機械手臂取離機座10。As shown in FIG. 7, the movable rack 21 is activated, and the carrier plate 1 is removed from the wafer 2 by the suction cup member 22 and moved to the second working area 12 to be placed and cooled to complete the wafer 2 separation operation. Among them, when the wafer 2 is separated, the heating tube and the tray 14 can be cooled by the aforementioned cooling means, and the cooling water channel 15 can also cool the heat sink 13, and then the wafer 2 can be removed by the holding device 60. It is separately propped up with the carrier board 1 so that the staff or the robot arm can take off the base 10.

藉由前述，本創作透過自動化方式，實現晶圓2分離的程序，以予提昇工作效率。Based on the foregoing, this creation realizes the process of wafer 2 separation through an automated method to improve work efficiency.

雖然本創作是以一個最佳實施例作說明，精於此技藝者能在不脫離本創作精神與範疇下作各種不同形式的改變。以上所舉實施例僅用以說明本創作而已，非用以限制本創作之範圍。舉凡不違本創作精神所從事的種種修改或改變，俱屬本創作申請專利範圍。Although this creation is explained in a best embodiment, those skilled in this technique can make various changes in various forms without departing from the spirit and scope of this creation. The above-mentioned embodiments are only used to illustrate the creation, and are not used to limit the scope of the creation. All modifications or changes that do not violate the spirit of this creation belong to the scope of the patent application for this creation.

100:晶圓分離機 2:晶圓 1:載板 10:機座 11:第一工作區 12:第二工作區 13:散熱板 14:盤槽 141:冷卻管路 15:冷卻水道 151:出水接頭 152:入水接頭 20:吸取裝置 21:活動架 22:吸盤件 23:第一驅動馬達 24:第二驅動馬達 25:滑軌 30:真空吸盤 31:真空迴路 32:真空吸孔 33:管路 34:冷卻道 40:加熱裝置 50:控制裝置 60:頂持裝置 61:第一頂針 62:第二頂針 63:基板 64:動力源 70:感測裝置 71:發射件 72:接收件 80:冷卻裝置 81:進水部 82:出水部 3:載體 4:黏膠 X、Y、Z:軸100: Wafer separator 2: Wafer 1: carrier board 10: Base 11: The first working area 12: Second working area 13: Heat sink 14: Disk slot 141: Cooling line 15: Cooling water channel 151: Outlet connector 152: Water inlet connector 20: Suction device 21: Activity frame 22: Suction cup 23: The first drive motor 24: second drive motor 25: Slide 30: Vacuum suction cup 31: Vacuum circuit 32: Vacuum suction hole 33: Pipeline 34: cooling channel 40: heating device 50: control device 60: holding device 61: The first thimble 62: second thimble 63: substrate 64: power source 70: sensing device 71: Launcher 72: Receiving 80: cooling device 81: Inlet 82: Water outlet 3: carrier 4: viscose X, Y, Z: axis

[圖1]係為本創作實施例之晶圓分離機立體示意圖。 [圖2]係為本創作實施例之晶圓分離機結構分解示意圖。 [圖3]係為本創作實施例之晶圓分離機底面示意圖。 [圖4]係為本創作實施例之晶圓分離機頂面示意圖。 [圖5]係為本創作實施例之晶圓分離機進行分離作業的側面示意圖(一)，顯示晶圓與載板置放於第一工作區且位於第一頂針上。 [圖6]係為本創作實施例之晶圓分離機進行分離作業的側面示意圖(二)，顯示晶圓與載板置放於真空吸盤上。 [圖7]係為本創作實施例之晶圓分離機進行分離作業的側面示意圖(三)，顯示載板被吸取裝置移送至第二工作區。 [Figure 1] is a three-dimensional schematic diagram of the wafer separator of this creative embodiment. [Figure 2] is an exploded schematic diagram of the wafer separator structure of this creative embodiment. [Figure 3] is a schematic diagram of the bottom surface of the wafer separator of this creative embodiment. [Figure 4] is a schematic diagram of the top surface of the wafer separator of this creative embodiment. [Fig. 5] is a schematic side view (1) of the separation operation of the wafer separator of this creative embodiment, showing that the wafer and the carrier are placed in the first working area and on the first ejector pin. [Fig. 6] is a schematic side view (2) of the separation operation of the wafer separator of this creative embodiment, showing that the wafer and the carrier are placed on the vacuum chuck. [Fig. 7] is a schematic side view (3) of the separation operation of the wafer separator of this creative embodiment, showing that the carrier board is transferred to the second working area by the suction device.

100:晶圓分離機 100: Wafer separator

10:機座 10: Base

11:第一工作區 11: The first working area

12:第二工作區 12: Second working area

13:散熱板 13: Heat sink

14:盤槽 14: Disk slot

20:吸取裝置 20: Suction device

21:活動架 21: Activity frame

22:吸盤件 22: Suction cup

24:第二驅動馬達 24: second drive motor

30:真空吸盤 30: Vacuum suction cup

50:控制裝置 50: control device

X、Y、Z:軸 X, Y, Z: axis

31:真空迴路 31: Vacuum circuit

32:真空吸孔 32: Vacuum suction hole

70:感測裝置 70: sensing device

71:發射件 71: Launcher

72:接收件 72: Receiving

Claims

一種晶圓分離機，其用於將一晶圓及一載板分離，該晶圓分離機包括：一機座，其具有一第一工作區及一第二工作區；一吸取裝置，係包括一活動架及一設置於該活動架上的吸盤件，該活動架能夠相對該機座沿著X軸方向往復滑移，該吸盤件能夠相對該機座沿著Y軸方向降昇位移；一真空吸盤，其設置於該第一工作區，用以吸附該晶圓與該載板；一加熱裝置，係設置於該真空吸盤下方，用以對該晶圓與該載板加熱，以使該晶圓與該載板受熱而易於彼此脫離；以及一控制裝置，係電性連接於該吸取裝置、該真空吸盤及該加熱裝置；藉此，當該晶圓與該載板受熱後，該吸盤件能將該載板自該晶圓吸取，使該載板隨該活動架滑移至該第二工作區置放並進行降溫。 A wafer separator is used to separate a wafer and a carrier. The wafer separator includes: A base with a first working area and a second working area; A suction device includes a movable frame and a suction cup part arranged on the movable frame, the movable frame can slide back and forth along the X axis direction relative to the base, and the suction cup part can move along the Y axis relative to the base frame Directional down-lift displacement; A vacuum chuck, which is arranged in the first working area, and is used to suck the wafer and the carrier board; A heating device arranged under the vacuum chuck for heating the wafer and the carrier so that the wafer and the carrier are heated and easily separated from each other; and A control device is electrically connected to the suction device, the vacuum chuck and the heating device; thereby, when the wafer and the carrier board are heated, the chuck member can suck the carrier board from the wafer to make The carrier board slides along with the movable frame to the second working area to be placed and cooled.

如請求項1所述之晶圓分離機，其中，該吸取裝置更包括兩滑軌，設置於該機座的底部兩側，該活動架跨設於該機座的兩側且連結於該兩滑軌；該吸取裝置包括一第一驅動馬達及一第二驅動馬達，該第一驅動馬達驅使該活動架之動作，該第二驅動馬達控制該吸盤件之昇降動作。The wafer separator according to claim 1, wherein the suction device further includes two sliding rails arranged on both sides of the bottom of the base, and the movable frame is arranged on both sides of the base and connected to the two Slide rail; the suction device includes a first drive motor and a second drive motor, the first drive motor drives the movement of the movable frame, the second drive motor controls the lifting movement of the suction cup.

如請求項2所述之晶圓分離機，其中，該真空吸盤至少凹設有一真空迴路及具有至少一真空吸孔與該真空迴路連通，該至少一真空吸孔經由一管路連通於真空源。The wafer separator according to claim 2, wherein the vacuum chuck is recessed with at least a vacuum circuit and has at least one vacuum suction hole connected to the vacuum circuit, and the at least one vacuum suction hole is connected to the vacuum source via a pipeline .

如請求項3所述之晶圓分離機，其中，該第一工作區具有一盤槽，以供該真空吸盤容納，該加熱裝置為電熱管，其設置於該盤槽與該真空吸盤之間。The wafer separator according to claim 3, wherein the first working area has a disc groove for the vacuum chuck to accommodate, and the heating device is an electric heating tube, which is arranged between the disc groove and the vacuum chuck .

如請求項4所述之晶圓分離機，其中，該盤槽底部設有一冷卻管路，該真空吸盤內表面凹設有一對應該加熱裝置形狀的冷卻道，該冷卻道與該冷卻管路連通。The wafer separator according to claim 4, wherein the bottom of the tray is provided with a cooling pipe, the inner surface of the vacuum chuck is recessed with a cooling passage corresponding to the shape of the heating device, and the cooling passage is connected with the cooling pipe .

如請求項1或5所述之晶圓分離機，其中，該第一工作區於該真空吸盤周緣環設有一冷卻水道；該機座更包括一冷卻裝置，其設於該真空吸盤的下方，該冷卻裝置具有一進水部及一連通該進水孔的出水部。The wafer separator according to claim 1 or 5, wherein the first working area is provided with a cooling water channel at the periphery of the vacuum chuck; the base further includes a cooling device, which is arranged under the vacuum chuck, The cooling device has a water inlet and a water outlet communicating with the water inlet.

如請求項6所述之晶圓分離機，其中，該第二工作區具有一散熱板，該散熱板的正投影與該冷卻水道的正投影部分重疊。The wafer separator according to claim 6, wherein the second working area has a heat dissipation plate, and the orthographic projection of the heat dissipation plate partially overlaps the orthographic projection of the cooling water channel.

如請求項2所述之晶圓分離機，其中，該第一驅動馬達與該第二驅動馬達均為步進馬達，該吸盤件的材質為陶瓷。The wafer separator according to claim 2, wherein the first driving motor and the second driving motor are both stepping motors, and the material of the suction cup is ceramic.

如請求項1所述之晶圓分離機，更包括一設置於該機座的頂持裝置，該頂持裝置具有複數個第一頂針與複數個第二頂針，其同步地分別昇降設置於該真空吸盤與該第二工作區；更包括一感測裝置設置於該機座，用以感測該晶圓與該載板是否位於該真空吸盤的上方。The wafer separator according to claim 1, further comprising a holding device provided on the base, the holding device has a plurality of first thimble and a plurality of second thimble, which are synchronously raised and lowered and respectively arranged on the base The vacuum chuck and the second working area further include a sensing device arranged on the base for sensing whether the wafer and the carrier board are located above the vacuum chuck.

如請求項9所述之晶圓分離機，其中，該頂持裝置更具有一基板及一動力源，該基板與該動力源設於該機座的底部，該些第一頂針與該些第二頂針連結設置於該基板且分別穿伸於該真空吸盤與該第二工作區，藉由該動力源驅使該基板相對該機座沿著Y軸方向產生滑動，而使該些第一頂針與該些第二頂針產生同步的昇降動作。The wafer separator according to claim 9, wherein the holding device further has a substrate and a power source, the substrate and the power source are arranged at the bottom of the base, the first thimble and the first Two thimbles are connected and arranged on the substrate and respectively extend through the vacuum chuck and the second working area. The power source drives the substrate to slide along the Y-axis direction relative to the base, so that the first thimbles and The second thimble generates a synchronized lifting action.