TWM599026U

TWM599026U - Consistently automated wafer adhesive remover

Info

Publication number: TWM599026U
Application number: TW108217381U
Authority: TW
Inventors: 易錦良
Original assignee: 天虹科技股份有限公司
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2020-07-21

Abstract

一種一貫自動化之晶圓黏合劑去除機，包括一機台、複數材料儲放架、一中心定位裝置、至少一分離裝置、至少一清洗裝置及一傳送裝置，該機台的內部具有長條狀之一傳送區及位於該傳送區兩側之一儲放區、一定位區、一分離區與一清洗區供分別設置該傳送裝置、該材料儲放架、該中心定位裝置、該分離裝置及該清洗裝置，利用該傳送裝置於該傳送區中直線往返，以供於各區的裝置之間進行製程材料之傳送；藉此係可在晶圓薄化製程後一貫自動化的進行將晶圓與載體分離及去除晶圓上殘留黏合劑之製程以利後續製程進行。 A consistently automated wafer adhesive removal machine, comprising a machine, a plurality of material storage racks, a center positioning device, at least one separating device, at least one cleaning device and a conveying device. The inside of the machine has a long strip shape. A conveying area and a storage area located on both sides of the conveying area, a positioning area, a separation area and a cleaning area for respectively setting the conveying device, the material storage rack, the center positioning device, the separating device and The cleaning device utilizes the conveying device to go back and forth in the conveying area in a straight line for the conveyance of process materials between the devices in each zone; thereby, the wafers and wafers can be automatically and automatically transferred after the wafer thinning process. Carrier separation and removal of residual adhesive on the wafer to facilitate subsequent processes.

Description

一貫自動化之晶圓黏合劑去除機 Consistently automated wafer adhesive remover

本創作係一種晶圓黏合劑去除設備方面的技術領域，尤指可在晶圓薄化製程後一貫自動化的進行將晶圓與載體分離及去除晶圓上殘留黏合劑之製程，以達到大幅提昇工作效率及節省空間與成本等功效之一貫自動化之晶圓黏合劑去除機者。 This creation is a technical field of wafer adhesive removal equipment, especially the process of separating the wafer from the carrier and removing the residual adhesive on the wafer after the wafer thinning process, so as to achieve a significant improvement One of the functions of work efficiency, space saving and cost saving is an automatic wafer adhesive remover.

在全球半導體IC晶圓製程中，為了有利於後期製程中晶圓切割、封裝製程的順利進行，對於整片晶圓厚度係要求薄形化，故使得「晶圓薄化製程」工法的重要性及能見度日漸提高。「晶圓薄化製程」又稱晶圓背面研磨(Wafer Backside Grinding)製程，係有助於縮小IC晶片體積、降低電流導通電阻、加快電流流通速度、減少不必電廢熱增生及延長半導體壽命。在「晶圓薄化製程」之中，為了保護晶圓在研磨過程中不致因厚度薄化而受損，因此通常在研磨之前會利用黏合劑(如蠟)暫時將晶圓的正面黏合在一載體上，藉由該載體來作為研磨時支撐晶圓之基座。故而，當「晶圓薄化製程」完成後需再將晶圓與該載體分離及將該黏合劑去除，方能使該晶圓能再進行後續的切割、封裝等製程。而目前執行將晶圓與載體分離及將黏合劑去除之製程之方式，則主要皆係利用人力將暫時黏合在一起之晶圓與載體運送到一分離機進行分離，然後再利用人力將分離後之晶圓運送到一清洗機進行清洗，以去除晶圓上殘餘之黏合劑。如此，不但非常的浪費人力及時間而使工作效率非常差，而且需另外購置一台分離機及一台清洗機，因而會較佔用空間及增加設備成本。 In the global semiconductor IC wafer manufacturing process, in order to facilitate the smooth progress of the wafer cutting and packaging process in the later process, the thickness of the entire wafer is required to be thinner, which makes the "wafer thinning process" method of importance And visibility is increasing day by day. The "wafer backside grinding process" is also known as the wafer backside grinding process, which helps to reduce the size of IC chips, reduce current on-resistance, speed up current flow, reduce unnecessary electrical waste heat generation, and extend semiconductor life. In the "wafer thinning process", in order to protect the wafer from damage due to the thinning during the polishing process, an adhesive (such as wax) is usually used to temporarily bond the front surface of the wafer together before polishing. On the carrier, the carrier is used as a base for supporting the wafer during polishing. Therefore, after the "wafer thinning process" is completed, it is necessary to separate the wafer from the carrier and remove the adhesive so that the wafer can be subjected to subsequent processes such as cutting and packaging. The current method of performing the process of separating the wafer from the carrier and removing the adhesive is It mainly uses manpower to transport the temporarily bonded wafers and carriers to a separator for separation, and then use manpower to transport the separated wafers to a cleaning machine for cleaning to remove residual adhesive on the wafers . This not only wastes manpower and time and makes work efficiency very poor, but also requires the purchase of a separator and a washing machine, which will take up more space and increase equipment costs.

有鑒於此，本創作人乃係針對上述之問題，而深入構思，且積極研究改良試做而開發設計出本創作。 In view of this, the author developed and designed this creation in response to the above-mentioned problems, and in-depth ideas, and actively researched and improved trials.

本創作之主要目的係在於解決習知晶圓薄化製程後進行分離及清洗作業時所產生之浪費人力、工作效率差、佔空間及增加成本等諸多問題。 The main purpose of this creation is to solve the problems of wasting manpower, poor work efficiency, occupying space and increasing costs during the separation and cleaning operations after the conventional wafer thinning process.

本創作所述之一貫自動化之晶圓黏合劑去除機，包括一機台、複數材料儲放架、一中心定位裝置、至少一分離裝置、至少一清洗裝置及一傳送裝置。其中，該機台係內部具有長條狀之一傳送區及位於該傳送區兩側之一儲放區、一定位區、一分離區與一清洗區。該複數材料儲放架係設於該儲放區，分別供置放複數製程材料，該複數製程材料包含晶圓結合體、載體、多孔性碳化矽盤及晶圓層疊體，該複數晶圓結合體為一晶圓與一載體之間利用黏合劑暫時黏合者，該複數晶圓層疊體係為該多孔性碳化矽盤的上側層疊該晶圓者。該中心定位裝置係設於該定位區，供對該複數晶圓結合體及該複數多孔性碳化矽盤進行中心校正定位。該分離裝置係設於該分離區，利用加熱使該晶圓結合體中的黏合劑融化後將該晶圓與載體分離，並配合該多孔性碳化矽盤與分離後該晶圓形成該晶圓層疊體。該清洗裝置係設於該清洗區，利用使該晶圓層疊體高速旋轉產生離心力及對該晶圓頂面噴灑清洗劑以去除殘餘之黏合劑，再對該晶圓頂面吹送氮氣以利於後續保存。該傳送裝置係設於該傳送區，包含至少一傳送導軌及一機械手臂，該機械手臂可順著該傳送導軌於該傳送區中直線往返，以供於該複數材料儲放架、該中心定位裝置、該分離裝置及該清洗裝置之間進行製程材料之運送。 The automatic wafer adhesive removal machine described in this invention includes a machine, a plurality of material storage racks, a center positioning device, at least one separating device, at least one cleaning device and a conveying device. Among them, the machine has a long conveying area and a storage area located on both sides of the conveying area, a positioning area, a separation area and a cleaning area. The plurality of material storage racks are arranged in the storage area, and are respectively provided with a plurality of process materials, the plurality of process materials include a wafer combination, a carrier, a porous silicon carbide disk, and a wafer stack. The plurality of wafers are combined The body is a wafer and a carrier that are temporarily bonded by an adhesive, and the multiple wafer stacking system is a wafer stacking on the upper side of the porous silicon carbide disk. The center positioning device is arranged in the positioning area for center calibration and positioning of the plurality of wafer combined bodies and the plurality of porous silicon carbide disks. The separation device is set in the separation zone, and heat is used to make the After the adhesive is melted, the wafer is separated from the carrier, and the porous silicon carbide disk is combined with the separated wafer to form the wafer laminate. The cleaning device is installed in the cleaning area, and uses the high-speed rotation of the wafer stack to generate centrifugal force and sprays cleaning agent on the top surface of the wafer to remove residual adhesive, and then blows nitrogen to the top surface of the wafer to facilitate subsequent save. The conveying device is arranged in the conveying area and includes at least one conveying guide rail and a robotic arm. The robotic arm can reciprocate linearly in the conveying area along the conveying guide rail for positioning on the plurality of material storage racks and the center The process material is transported between the device, the separating device and the cleaning device.

本創作所提供之一貫自動化之晶圓黏合劑去除機，係可藉由該傳送裝置先將其中一材料儲放架中的一片多孔性碳化矽盤送到該中心定位裝置進行中心定位，然後將定位完成之該多孔性碳化矽盤送至該分離裝置；再藉由該傳送裝置將另一材料儲放架中的一片晶圓結合體送至該中心定位裝置進行中心定位，然後再將定位完成之該晶圓結合體送至該分離裝置，並將該晶圓結合體翻轉後置於該多孔性碳化矽盤上；藉由該分離裝置將該晶圓結合體中之該載體分離出來，並使該晶圓與該多孔性碳化矽盤層疊成晶圓層疊體；再利用該傳送裝置將分離出來之載體送至另一材料儲放架儲存，及再利用該傳送裝置將該分離裝置上欲清洗之晶圓層疊體送至該清洗裝置；藉由該清洗裝置清除掉該晶圓上殘留的黏合劑；最後再利用該傳送裝置將清洗完成之晶圓層疊體送至另一材料儲放架儲存；如此，便可一貫自動化完成將晶圓與載體分離及去除晶圓上殘留黏合劑之製程，以達到節省人力及大幅提昇工作效率之目的，而且整體不但可減少空間之佔用，更是可減少設備之購置成本。 This creation provides an automated wafer adhesive remover, which can use the conveying device to first send a porous silicon carbide disc in one of the material storage racks to the center positioning device for center positioning, and then The porous silicon carbide disc after positioning is sent to the separation device; then a piece of wafer combination in another material storage rack is sent to the center positioning device by the transfer device for center positioning, and then the positioning is completed The wafer combination is sent to the separation device, and the wafer combination is turned over and placed on the porous silicon carbide disk; the carrier in the wafer combination is separated by the separation device, and The wafer and the porous silicon carbide disc are laminated to form a wafer stack; the transport device is used to transport the separated carrier to another material storage rack for storage, and the transport device is then used to separate the device on the The cleaned wafer stack is sent to the cleaning device; the remaining adhesive on the wafer is removed by the cleaning device; and finally the cleaned wafer stack is sent to another material storage rack by the transfer device Storage; in this way, the process of separating the wafer from the carrier and removing the remaining adhesive on the wafer can be automatically completed to save manpower And the purpose of greatly improving work efficiency, and not only can reduce the space occupation, but also reduce the purchase cost of equipment.

10:機台 10: Machine

11:傳送區 11: Transport area

12:儲放區 12: Storage area

13:定位區 13: positioning area

14:分離區 14: separation zone

15:清洗區 15: Cleaning area

20:材料儲放架 20: Material storage rack

30:中心定位裝置 30: Center positioning device

40:分離裝置 40: Separation device

41:底座 41: Base

410:軌道 410: Track

42:第一載台 42: first stage

420:第一伸縮桿 420: The first telescopic pole

44:移動架 44: mobile rack

45:真空吸附模組 45: Vacuum adsorption module

50:清洗裝置 50: Cleaning device

51:工作平台 51: work platform

510:清洗槽 510: washing tank

511:清洗劑回收槽 511: Cleaning agent recovery tank

52:吸附旋轉模組 52: Adsorption rotating module

53:護罩模組 53: Shield Module

54:清洗劑噴管組 54: Cleaning agent nozzle group

540:第一噴管 540: The first nozzle

541:第二噴管 541: second nozzle

55:氮氣噴管組 55: Nitrogen nozzle group

550:氣體噴管 550: Gas nozzle

60:傳送裝置 60: Conveyor

61:傳送導軌 61: Conveyor rail

62:機械手臂 62: mechanical arm

63:滑座 63: Slide

64:旋臂組 64: Swivel arm group

65:端效器 65: End effector

a:晶圓結合體 a: Wafer combination

a1:晶圓 a1: Wafer

a2:載體 a2: carrier

a3:黏合劑 a3: Adhesive

b:晶圓層疊體 b: Wafer stack

b1:多孔性碳化矽盤 b1: Porous silicon carbide disk

第1圖係本創作之立體外觀示意圖。 Figure 1 is a schematic diagram of the three-dimensional appearance of this creation.

第2圖係本創作之內部結構的俯視及傳送動作示意圖。 Figure 2 is a top view of the internal structure of this creation and a schematic diagram of the transmission action.

第3圖係本創作之分離裝置之立體放大示意圖。 Figure 3 is a three-dimensional enlarged schematic diagram of the separation device of this creation.

第4圖係本創作將多孔性碳化矽盤及晶圓結合體置於分離裝置上之動作示意圖。 Figure 4 is a schematic diagram of the action of placing the porous silicon carbide disk and wafer combination on the separation device in this creation.

第5圖係本創作之分離裝置進行吸附、加熱及移離之動作示意圖。 Figure 5 is a schematic diagram of the adsorption, heating and removal of the separation device of this creation.

第6圖係本創作之分離裝置將晶圓與載體分離完成後之動作示意圖。 Figure 6 is a schematic diagram of the action of the separation device of this creation after the wafer is separated from the carrier.

第7圖係本創作之分離裝置之分離流程示意圖。 Figure 7 is a schematic diagram of the separation process of the separation device of this creation.

第8圖係本創作之清洗裝置之立體放大示意圖。 Figure 8 is a three-dimensional enlarged schematic diagram of the cleaning device of this creation.

第9圖係本創作將晶圓層疊體置放於清洗裝置上之動作示意圖。 Figure 9 is a schematic diagram of the action of placing the wafer stack on the cleaning device in this creation.

第10圖係本創作噴灑清洗劑之動作示意圖。 Figure 10 is a schematic diagram of the action of spraying cleaning agent in this creation.

第11圖係本創作吹送氮氣之動作示意圖。 Figure 11 is a schematic diagram of the action of blowing nitrogen in this creation.

請參閱第1、2圖所示，係顯示本創作所述之一貫自動化之晶圓黏合劑去除機包括一機台10、複數材料儲放架20、一中心定位裝置30、至少一分離裝置40、至少一清洗裝置50及一傳送裝置60，其中： Please refer to Figures 1 and 2, which shows that the automated wafer adhesive removal machine described in this creation includes a machine 10, a plurality of material storage racks 20, a center positioning device 30, and at least one separation device 40 , At least one cleaning device 50 and one conveying device 60, wherein:

該機台10，係內部具有長條狀之一傳送區11及位於該傳送區11兩側之一儲放區12、一定位區13、一分離區14及一清洗區15。 The machine 10 has a long conveying area 11 and a storage area 12 located on both sides of the conveying area 11, a positioning area 13, a separation area 14 and a cleaning area 15 inside.

該複數材料儲放架20，係設於該儲放區12之中，分別供置放複數晶圓結合體a、複數載體a2、複數多孔性碳化矽盤b1及複數晶圓層疊體b等製程材料，其中該複數晶圓結合體a係為一晶圓a1與一載體a2之間利用黏合劑a3暫時黏合者，該複數晶圓層疊體b係為該多孔性碳化矽盤b1上側層疊該晶圓a1者。 The plurality of material storage racks 20 are arranged in the storage area 12, and are respectively used for placing a plurality of wafer combinations a, a plurality of carriers a2, a plurality of porous silicon carbide disks b1, and a plurality of wafer laminates b. Materials, wherein the plurality of wafer assembly a is temporarily bonded between a wafer a1 and a carrier a2 using an adhesive a3, and the plurality of wafer laminates b is a laminate of the crystal on the upper side of the porous silicon carbide disc b1 Round a1.

該中心定位裝置30，係設於該定位區13，供對該複數晶圓結合體a及該複數多孔性碳化矽盤b1進行中心校正定位，以利於分離及清洗製程之進行。 The center positioning device 30 is arranged in the positioning area 13 for centering and positioning the plurality of wafer combinations a and the plurality of porous silicon carbide disks b1 to facilitate the separation and cleaning process.

該分離裝置40，係設於該分離區14，利用加熱使該晶圓結合體a中的黏合劑a3融化後將該晶圓a1與載體a2分離，並配合該多孔性碳化矽盤b1與分離後該晶圓a1形成該晶圓層疊體b以利後續之清洗製程。 The separation device 40 is located in the separation zone 14. The adhesive a3 in the wafer assembly a is melted by heating, and the wafer a1 is separated from the carrier a2, and the porous silicon carbide disc b1 and the separation Then the wafer a1 forms the wafer stack b to facilitate the subsequent cleaning process.

該清洗裝置50，係設於該清洗區15，利用使該晶圓層疊體b高速旋轉產生離心力及對該晶圓a1頂面噴灑清洗劑以去除殘餘之黏合劑a3，再對該晶圓a1頂面吹送氮氣以利於後續保存，其中該清洗裝置50噴灑清洗劑的過程係為先對該晶圓a1噴灑丙酮使去除掉黏合劑a3，然後再對該晶圓a1噴灑乙醇以去除該晶圓a1上殘留的丙酮。 The cleaning device 50 is installed in the cleaning zone 15, and uses the high-speed rotation of the wafer stack b to generate centrifugal force and sprays cleaning agent on the top surface of the wafer a1 to remove the residual adhesive a3, and then the wafer a1 Nitrogen gas is blown on the top surface to facilitate subsequent storage. The cleaning device 50 sprays the cleaning agent on the wafer a1 by spraying acetone to remove the adhesive a3, and then spraying ethanol on the wafer a1 to remove the wafer. Residual acetone on a1.

該傳送裝置60，係設於該傳送區11，包含至少一傳送導軌61及一機械手臂62，該機械手臂62可順著該傳送導軌61於該傳送區11中直線往返，以供於該複數材料儲放架20、該中心定位裝置30、該分離裝置40及該清洗裝置50之間進行製程材料之傳送。 The conveying device 60 is located in the conveying area 11 and includes at least one transmission The conveying rail 61 and a mechanical arm 62 can be linearly reciprocated in the conveying area 11 along the conveying rail 61 for the plural material storage rack 20, the center positioning device 30, and the separating device 40 The process material is transferred between the cleaning device 50 and the cleaning device 50.

在第2圖中係可看出，該機械手臂62包含一滑座63、一旋臂組64及一端效器65。該滑座63係可順著該傳送導軌61直線往返位移。該旋臂組64係一端可轉動地結合於該滑座63上，且係由複數旋臂旋轉連結，使該旋臂組64可藉其產生旋轉、伸張及收縮動作。該端效器65係可轉動地設於該旋臂組64的另一端，可供進行托接、吸附、平移及翻轉該製程材料之動作。 As can be seen in Figure 2, the robotic arm 62 includes a sliding seat 63, a rotating arm group 64 and an end effector 65. The sliding seat 63 can linearly move back and forth along the conveying guide rail 61. The rotating arm set 64 is rotatably connected to the sliding seat 63 at one end, and is rotatably connected by a plurality of rotating arms, so that the rotating arm set 64 can rotate, extend and contract with it. The end effector 65 is rotatably arranged at the other end of the rotating arm set 64, and can be used for supporting, sucking, translating and turning over the process material.

請參閱第3圖所示，係顯示該分離裝置40包含一底座41、一第一載台42、一第二載台43、一移動架44及一真空吸附模組45，其中： Please refer to FIG. 3, which shows that the separation device 40 includes a base 41, a first carrier 42, a second carrier 43, a movable frame 44 and a vacuum suction module 45, in which:

該底座41，係頂面設有平行之兩軌道410。 The base 41 has two parallel rails 410 on the top surface.

該第一載台42，係設於該底座41上，且位於該兩軌道410之間，內部設有真空吸附單元(圖中未示)及加熱單元(圖中未示)可供對頂面之相對應製程材料產生真空吸力及加熱，該第一載台42之中設有可頂撐製程材料之複數第一伸縮桿420，以便於取料及置料。 The first stage 42 is set on the base 41 and is located between the two rails 410. A vacuum suction unit (not shown in the figure) and a heating unit (not shown in the figure) are provided inside for facing the top surface. The corresponding process materials generate vacuum suction and heating. The first carrier 42 is provided with a plurality of first telescopic rods 420 capable of supporting the process materials to facilitate material retrieval and placement.

該第二載台43，係並排設於該第一載台42的一側，且位於該兩軌道410之間，於該第二載台43之中設有可頂撐製程材料之複數第二伸縮桿430，以便於取料及置料。 The second carrier 43 is arranged side by side on one side of the first carrier 42 and is located between the two rails 410. A plurality of second carrier materials capable of supporting the process are arranged in the second carrier 43 The telescopic rod 430 is convenient for picking and placing materials.

該移動架44，係呈ㄇ字形，且下端可滑移地結合於該兩軌道410上。 The movable frame 44 is in the shape of """, and its lower end is slidably connected to the two rails 410.

該真空吸附模組45，係可升降地結合於該移動架44上，可被該移動架44帶動而於該第一、二載台42、43上方位移，而且並可對相對應之製程材料的頂面產生吸力。 The vacuum suction module 45 is connected to the movable frame 44 in a liftable manner, can be driven by the movable frame 44 to move above the first and second stages 42, 43, and can be used for corresponding process materials The top surface produces suction.

上述之移動架44及真空吸附模組45係分別利用一驅動器驅動其位移，而此驅動器仍業界常見且習知之技術，故此不再另加以贅述。 The above-mentioned moving frame 44 and the vacuum suction module 45 respectively use a driver to drive their displacement, and this driver is still a common and well-known technology in the industry, so it will not be repeated here.

請配合參閱第3~7圖所示，係顯示該分離裝置40之製程為：先將一多孔性碳化矽盤b1置於該第一載台42之該複數第一伸縮桿420上，再將一晶圓結合體a倒置於該多孔性碳化矽盤b1上，使該晶圓a1的背面(異於該黏合劑a3之側面)貼靠於該多孔性碳化矽盤b1的頂面(如第4、7圖所示)；然後使該複數第一伸縮桿420縮入該第一載台42中，並使該第一載台42透過該多孔性碳化矽盤b1的多孔特性吸附住該晶圓結合體a，同時使該真空吸附模組45移置該第一載台42的上方並下降吸住該晶圓結合體a之載體a2上，再藉由該第一載台42加熱使該晶圓結合體a中之黏合劑a3融化，之後再利用該真空吸附模組45將該載體a2吸離該晶圓a1，並移至該第二載台43的上方(如第5、7圖所示)；最後再利用該真空吸附模組45下移將該載體a2放置於該第二載台43上，並使該真空吸附模組45退回原位(如第6圖所示)；如此該晶圓a1便與該多孔性碳化矽盤b1層疊成一晶圓層疊體b，而該載體a2則被由該晶圓 a1上分離出來。其中係可藉由該複數第一伸縮桿420將該晶圓層疊體b由該第一載台42上向上頂高，以及藉由該複數第二伸縮桿430將該載體a2由該第二載台43上向上頂高以利於機械手臂62取拿。 Please refer to Figures 3-7, which shows that the manufacturing process of the separation device 40 is as follows: first place a porous silicon carbide disk b1 on the plurality of first telescopic rods 420 of the first carrier 42, and then Place a wafer combination a upside down on the porous silicon carbide disk b1, so that the back side of the wafer a1 (different from the side of the adhesive a3) abuts against the top surface of the porous silicon carbide disk b1 (such as As shown in Figures 4 and 7); then the plurality of first telescopic rods 420 are retracted into the first stage 42, and the first stage 42 is adsorbed by the porous characteristics of the porous silicon carbide disc b1 Wafer assembly a, and at the same time, the vacuum suction module 45 is moved above the first stage 42 and lowered and sucked onto the carrier a2 of the wafer assembly a, and then heated by the first stage 42 The adhesive a3 in the wafer combination a is melted, and then the vacuum suction module 45 is used to suck the carrier a2 away from the wafer a1 and move it to the top of the second stage 43 (e.g., No. 5, No. 7 As shown in the figure); Finally, the vacuum suction module 45 is used to move down the carrier a2 to place the carrier a2 on the second stage 43, and the vacuum suction module 45 is returned to the original position (as shown in Figure 6); In this way, the wafer a1 and the porous silicon carbide disk b1 are laminated to form a wafer laminate b, and the carrier a2 is transferred from the wafer Separated on a1. Wherein, the wafer stack b can be raised upward from the first stage 42 by the plurality of first telescopic rods 420, and the carrier a2 can be lifted from the second carrier by the plurality of second telescopic rods 430 The platform 43 is raised upward to facilitate the mechanical arm 62 to take and take.

請參閱第8圖所示，係顯示該清洗裝置50包含一工作平台51、一吸附旋轉模組52、一護罩模組53、一清洗劑噴管組54及一氮氣噴管組55，其中： Please refer to Figure 8, which shows that the cleaning device 50 includes a working platform 51, an adsorption rotating module 52, a shield module 53, a cleaning agent nozzle group 54 and a nitrogen nozzle group 55, in which :

該工作平台51，係具有一清洗槽510及一清洗劑回收槽511。 The working platform 51 has a cleaning tank 510 and a cleaning agent recovery tank 511.

該吸附旋轉模組52，係設於該清洗槽510之中，可供吸附住欲清洗之晶圓層疊體b並帶動其旋轉。 The adsorption and rotation module 52 is arranged in the cleaning tank 510, and can be used for adsorbing the wafer stack b to be cleaned and driving it to rotate.

該護罩模組53，係可於該清洗槽510中升降，以防止清洗時清洗劑噴濺。 The shield module 53 can be raised and lowered in the cleaning tank 510 to prevent the cleaning agent from spraying during cleaning.

該清洗劑噴管組54，係設於該工作平台51上，且具有可分別噴灑不同清洗劑(如丙酮及乙醇)之一第一噴管540及一第二噴管541，該清洗劑噴管組54係可藉由轉動以使該第一、二噴管540、541之噴嘴移至該晶圓層疊體b或該清洗劑回收槽511的上方。 The cleaning agent nozzle group 54 is set on the working platform 51 and has a first nozzle 540 and a second nozzle 541 that can spray different cleaning agents (such as acetone and ethanol) respectively. The cleaning agent sprays The tube group 54 can be rotated to move the nozzles of the first and second nozzles 540 and 541 to above the wafer stack b or the cleaning agent recovery tank 511.

該氮氣噴管組55，係設於該工作平台51上，且具有可噴出氮氣之至少一氣體噴管550，該氮氣噴管組55係可藉由轉動以使該氣體噴管550之噴嘴移至該晶圓層疊體b上方或移離該清洗槽510上方。 The nitrogen nozzle group 55 is set on the working platform 51 and has at least one gas nozzle 550 capable of ejecting nitrogen. The nitrogen nozzle group 55 can be rotated to move the nozzle of the gas nozzle 550 To the top of the wafer stack b or move away from the cleaning tank 510.

請配合參閱第8~9圖所示，係顯示該清洗裝置50之製程係為：將欲清洗之一晶圓層疊體b置放於該吸附旋轉模組52，利用該吸附旋轉模組52將該晶圓層疊體b吸住並帶動其旋轉(如第9圖所示)；然後使該護罩模組53上升，並使該清洗劑噴管組54之一第一噴管540及一第二噴管541的噴嘴轉移到該晶圓層疊體b的上方，先使該第一噴管540對該晶圓層疊體b的頂面噴灑丙酮，以沖洗該晶圓a1上殘留的黏合劑a3，並使該黏合劑a3藉由旋轉離心力被甩掉，之後使第一噴管540停止噴灑及使該第二噴管541對該晶圓a1的頂面噴灑乙醇以洗掉殘餘之丙酮(如第10圖所示)；再來使該第二噴管541停止噴灑，然後再使該清洗劑噴管組54之一第一噴管540及一第二噴管541的噴嘴轉移到該清洗劑回收槽511的上方，使該清洗劑回收槽511回收滴落之清洗劑，同時使該氮氣噴管組55之氣體噴管550的噴嘴轉移到該晶圓層疊體b的上方，並對該晶圓a1的頂面噴氮氣以防止晶圓a1氧化而有助保存；最後再使該氣體噴管550停止噴氣，並使該氮氣噴管組55轉回原位及使該護罩模組53下降至原位，即完成清洗製程。 Please refer to Figs. 8-9, which shows that the process of the cleaning device 50 is: placing a wafer stack b to be cleaned on the adsorption rotating module 52, and using the adsorption rotating module 52 to The wafer stack b sucks and drives it to rotate (as shown in Figure 9); then the shield module 53 is raised, and the cleaning agent nozzle group 54 is a first nozzle 540 and a first nozzle 540 The nozzle of the second nozzle 541 is transferred to the upper side of the wafer stack b, and the first nozzle 540 is first to spray acetone on the top surface of the wafer stack b to rinse the remaining adhesive a3 on the wafer a1 , And the adhesive a3 is shaken off by rotating centrifugal force, and then the first nozzle 540 is stopped spraying and the second nozzle 541 is sprayed with ethanol on the top surface of the wafer a1 to wash away residual acetone (such as Figure 10); then stop the second nozzle 541 from spraying, and then make the nozzles of the first nozzle 540 and the second nozzle 541 of the cleaning agent nozzle group 54 transfer to the cleaning agent Above the recovery tank 511, the cleaning agent recovery tank 511 is used to recover the dripping cleaning agent, and at the same time, the nozzle of the gas nozzle 550 of the nitrogen nozzle group 55 is transferred to the upper side of the wafer stack b, and the wafer Nitrogen is sprayed on the top surface of the circle a1 to prevent the wafer a1 from being oxidized and helps storage; finally, the gas nozzle 550 is stopped and the nitrogen nozzle group 55 is turned back to the original position and the shield module 53 is lowered To the original position, the cleaning process is completed.

本創作所提供之一貫自動化之晶圓黏合劑去除機，係可藉由該傳送裝置60先將其中一材料儲放架20中的一片多孔性碳化矽盤b1送到該中心定位裝置30進行中心定位，然後將定位完成之該多孔性碳化矽盤b1送至該分離裝置40；再藉由該傳送裝置60將另一材料儲放架20中的一片晶圓結合體a送至該中心定位裝置30進行中心定位，然後再將定位完成之該晶圓結合體a送至該分離裝置40，並將該晶圓結合體a翻轉後置於該多孔性碳化矽盤b1上；藉由該分離裝置40將該晶圓結合體a中之該載體a2分離出來，並使該晶圓a1與該多孔性碳化矽盤b1層疊成晶圓層疊體b；再利用該傳送裝置60將分離出來之載體a2送至另一材料儲放架20儲存，及再利用該傳送裝置60將該分離裝置40上欲清洗之晶圓層疊體b送至該清洗裝置50；藉由該清洗裝置50清除掉該晶圓a1上殘留的黏合劑a3；最後再利用該傳送裝置60將清洗完成之晶圓層疊體b送至另一材料儲放架20儲存；如此，便可一貫自動化完成將晶圓a1與載體a2分離及去除晶圓a1上殘留黏合劑a3之製程，以達到節省人力及大幅提昇效率之目的，而且整體不但可減少空間之佔用，而且更是可減少設備之購置成本。 This creation provides an automated wafer adhesive remover, which can first send a porous silicon carbide disk b1 in one of the material storage racks 20 to the center positioning device 30 through the transfer device 60 Position, and then send the positioned porous silicon carbide disc b1 to the separation device 40; then by the transfer device 60, send a wafer combination a in another material storage rack 20 to the center positioning device 30 Carry out center positioning, and then send the positioned wafer assembly a To the separation device 40, and turn the wafer assembly a on the porous silicon carbide disk b1; the separation device 40 separates the carrier a2 in the wafer assembly a, and makes The wafer a1 and the porous silicon carbide disk b1 are laminated to form a wafer stack b; the transport device 60 is used to transport the separated carrier a2 to another material storage rack 20 for storage, and the transport device 60 is reused The wafer stack b to be cleaned on the separating device 40 is sent to the cleaning device 50; the remaining adhesive a3 on the wafer a1 is removed by the cleaning device 50; finally, the cleaning device 60 is used to complete the cleaning The wafer stack b is sent to another material storage rack 20 for storage; in this way, the process of separating the wafer a1 from the carrier a2 and removing the residual adhesive a3 on the wafer a1 can be automatically completed to save manpower and The purpose of greatly improving efficiency, and not only can reduce the space occupation, but also reduce the purchase cost of equipment.

綜上所述，由於本創作具有上述優點及實用價值，而且在同類產品中均未見有類似之產品發表，故已符合新型專利之申請要件，乃爰依法提出申請。 To sum up, since this creation has the above-mentioned advantages and practical value, and no similar products have been published in similar products, it has met the requirements for application for new patents, and an application is submitted in accordance with the law.

10‧‧‧機台 10‧‧‧machine

11‧‧‧傳送區 11‧‧‧Transportation area

12‧‧‧儲放區 12‧‧‧Storage area

13‧‧‧定位區 13‧‧‧Locating area

14‧‧‧分離區 14‧‧‧Separated Area

15‧‧‧清洗區 15‧‧‧Cleaning area

20‧‧‧材料儲放架 20‧‧‧material storage rack

30‧‧‧中心定位裝置 30‧‧‧Centering device

40‧‧‧分離裝置 40‧‧‧Separation device

50‧‧‧清洗裝置 50‧‧‧Cleaning device

60‧‧‧傳送裝置 60‧‧‧Transport Device

61‧‧‧傳送導軌 61‧‧‧Transfer rail

62‧‧‧機械手臂 62‧‧‧Robot

63‧‧‧滑座 63‧‧‧Slide

64‧‧‧旋臂組 64‧‧‧Swivel arm group

65‧‧‧端效器 65‧‧‧End Effector

a‧‧‧晶圓結合體 a‧‧‧Wafer combination

a2‧‧‧載體 a2‧‧‧Carrier

b‧‧‧晶圓層疊體 b‧‧‧Wafer stack

b1‧‧‧多孔性碳化矽盤 b1‧‧‧Porous Silicon Carbide Disk

Claims

一種一貫自動化之晶圓黏合劑去除機，包括： A consistently automated wafer adhesive remover, including:

一機台，係內部具有一傳送區及位於該傳送區周邊之一儲放區、一定位區、一分離區與一清洗區； A machine with a transfer area and a storage area located on the periphery of the transfer area, a positioning area, a separation area and a cleaning area;

複數材料儲放架，係設於該儲放區，分別供置放複數製程材料，該複數製程材料包含晶圓結合體、載體、多孔性碳化矽盤及晶圓層疊體，該複數晶圓結合體為一晶圓與一載體之間利用黏合劑暫時黏合者，該複數晶圓層疊體係為該多孔性碳化矽盤的上側層疊該晶圓者； A plurality of material storage racks are arranged in the storage area and are respectively provided for storing a plurality of process materials. The plurality of process materials include a wafer combination, a carrier, a porous silicon carbide disk, and a wafer stack. The multiple wafers are combined The body is a wafer and a carrier that are temporarily bonded with an adhesive, and the multiple wafer stacking system is a wafer stacking on the upper side of the porous silicon carbide disk;

一中心定位裝置，係設於該定位區，供對該複數晶圓結合體及該複數多孔性碳化矽盤進行中心校正定位； A center positioning device is provided in the positioning area for centering and positioning the plurality of wafer combinations and the plurality of porous silicon carbide disks;

至少一分離裝置，係設於該分離區，利用加熱使該晶圓結合體中的黏合劑融化後將該晶圓與載體分離，並配合該多孔性碳化矽盤與分離後該晶圓形成該晶圓層疊體； At least one separation device is arranged in the separation zone, and the adhesive in the wafer combination is melted by heating to separate the wafer from the carrier, and cooperate with the porous silicon carbide disk and the separated wafer to form the Wafer stack

至少一清洗裝置，係設於該清洗區，利用使該晶圓層疊體高速旋轉產生離心力及對該晶圓頂面噴灑清洗劑以去除殘餘之黏合劑，再對該晶圓頂面吹送氮氣以利於後續保存；以及 At least one cleaning device is arranged in the cleaning zone, which utilizes the high-speed rotation of the wafer stack to generate centrifugal force and sprays cleaning agent on the top surface of the wafer to remove residual adhesive, and then blows nitrogen gas to the top surface of the wafer Facilitate subsequent preservation; and

一傳送裝置，係設於該傳送區，包含至少一傳送導軌及一機械手臂，該機械手臂可順著該傳送導軌於該傳送區中移動，以供於該複數材料儲放架、該中心定位裝置、該分離裝置及該清洗裝置之間進行製程材料之運送。 A conveying device is installed in the conveying area, and includes at least one conveying guide rail and a robotic arm. The robotic arm can move in the conveying area along the conveying guide rail for positioning on the plurality of material storage racks and the center The process material is transported between the device, the separating device and the cleaning device.

如請求項1所述之一貫自動化之晶圓黏合劑去除機，其中該傳送區呈長條狀，該儲放區、該定位區、該分離區與該清洗區係位於該傳送區兩側，該傳送裝置係可於該傳送區中直線往返。 An automated wafer adhesive remover as described in claim 1, wherein the transfer area is a long strip, and the storage area, the positioning area, the separation area and the cleaning area are Located on both sides of the conveying area, the conveying device can go straight back and forth in the conveying area.

如請求項2所述之一貫自動化之晶圓黏合劑去除機，其中該機械手臂包含一滑座、一旋臂組及一端效器，該滑座係可順著該傳送導軌直線往返位移，該旋臂組係一端可轉動地結合於該滑座上，且係由複數旋臂旋轉連結，使該旋臂組可藉其產生旋轉、伸張及收縮動作，該端效器係可轉動地設於該旋臂組的另一端，可供進行托接、吸附、平移及翻轉該製程材料之動作。 An automated wafer adhesive remover as described in claim 2, wherein the robotic arm includes a sliding seat, a rotary arm group and an end effector, the sliding seat can move linearly and back and forth along the conveying rail, the One end of the rotating arm assembly is rotatably connected to the sliding seat, and is connected by a plurality of rotating arms, so that the rotating arm assembly can rotate, extend and contract with it. The end effector is rotatably arranged at The other end of the rotating arm set can be used for supporting, sucking, translating and turning over the process material.

如請求項2所述之一貫自動化之晶圓黏合劑去除機，其中該分離裝置包含： According to claim 2, an automated wafer adhesive remover, wherein the separating device includes:

一底座，係頂面設有平行之兩軌道； A base with two parallel rails on the top surface;

一第一載台，係設於該底座上，且位於該兩軌道之間，其之內部設有真空吸附單元及加熱單元可供對頂面之相對應製程材料產生真空吸力及加熱； A first stage is set on the base and located between the two rails. A vacuum suction unit and a heating unit are provided inside the base to generate vacuum suction and heat for the corresponding process materials on the top surface;

一第二載台，係並排設於該第一載台的一側，且位於該兩軌道之間； A second carrier is arranged side by side on one side of the first carrier and located between the two rails;

一移動架，係可滑移地結合於該兩軌道上；以及 A movable frame which is slidably coupled to the two rails; and

一真空吸附模組，係可升降地結合於該移動架上，且可被該移動架帶動而於該第一、二載台上方位移，而且並可吸附相對應之製程材料。 A vacuum suction module is combined with the movable frame in a liftable manner, and can be driven by the movable frame to move above the first and second stages, and can adsorb corresponding process materials.

如請求項4所述之一貫自動化之晶圓黏合劑去除機，其中該移動架係呈ㄇ字形。 According to claim 4, an automated wafer adhesive remover, wherein the movable frame is in the shape of a letter.

如請求項4所述之一貫自動化之晶圓黏合劑去除機，其中該第一載台之中設有可頂撐製程材料之複數第一伸縮桿，該第二載台之中設有可頂撐製程材料之複數第二伸縮桿，以共便於該機械手臂取、放料。 According to claim 4, an automated wafer adhesive remover, wherein the first A carrier is provided with a plurality of first telescopic rods capable of supporting process materials, and the second carrier is provided with a plurality of second telescopic rods capable of supporting process materials, so as to facilitate the robot arm to take and unload materials. .

如請求項2所述之一貫自動化之晶圓黏合劑去除機，其中該清洗裝置包含： According to claim 2, an automated wafer adhesive remover, wherein the cleaning device includes:

一工作平台，係具有一清洗槽； A working platform with a cleaning tank;

一吸附旋轉模組，係設於該清洗槽之中，可供吸附住欲清洗之晶圓層疊體並帶動其旋轉； An adsorption and rotation module, which is installed in the cleaning tank, can be used to adsorb and drive the wafer stack to be cleaned to rotate;

一護罩模組，係可於該清洗槽中升降，以防止清洗時清洗劑噴濺； A shield module can be raised and lowered in the cleaning tank to prevent the cleaning agent from splashing during cleaning;

一清洗劑噴管組，係設於該工作平台上，可對該晶圓層疊體的頂面噴灑清潔劑；以及 A cleaning agent nozzle group is set on the work platform, and can spray cleaning agent on the top surface of the wafer stack; and

一氮氣噴管組，係設於該工作平台上，可對該晶圓層疊體的頂面吹送氮氣。 A nitrogen nozzle group is set on the work platform, and can blow nitrogen gas to the top surface of the wafer stack.

如請求項7所述之一貫自動化之晶圓黏合劑去除機，其中該工作平台係具有一清洗劑回收槽，該清洗劑噴管組係可轉動地設於該工作平台上，且具有可分別噴灑不同清洗劑之一第一噴管及一第二噴管，該清洗劑噴管組係可藉由轉動以使該第一、二噴管之噴嘴移至該晶圓層疊體或該清洗劑回收槽的上方，該清洗劑回收槽可回收滴落之清洗劑。 According to claim 7, an automated wafer adhesive remover, wherein the working platform has a cleaning agent recovery tank, and the cleaning agent nozzle group is rotatably arranged on the working platform, and has separate Spraying a first nozzle and a second nozzle of different cleaning agents, the cleaning agent nozzle group can be rotated to move the nozzles of the first and second nozzles to the wafer stack or the cleaning agent Above the recovery tank, the cleaning agent recovery tank can recover the dripping cleaning agent.

如請求項8所述之一貫自動化之晶圓黏合劑去除機，其中該第一噴管係供噴灑丙酮，該第二噴管係供噴灑乙醇。 According to claim 8, an automated wafer adhesive remover, wherein the first nozzle is for spraying acetone, and the second nozzle is for spraying ethanol.

如請求項7所述之一貫自動化之晶圓黏合劑去除機，其中該氮氣噴管組係可轉動地設於該工作平台上，且具有可噴出氮氣之至少一氣體噴管，該氮氣噴管組係可藉由轉動以使該氣體噴管之噴嘴移至該晶圓層疊體上方或移離該清洗槽上方。 According to claim 7, an automated wafer adhesive removal machine, wherein the nitrogen nozzle group is rotatably arranged on the work platform and has at least one gas nozzle capable of spraying nitrogen, the nitrogen nozzle The assembly system can be rotated to move the nozzle of the gas nozzle to the top of the wafer stack or to move away from the cleaning tank.