TWM595765U - Direct type backlight device - Google Patents

Abstract

本創作揭露一種直下式背光裝置包含光源座及反射片體。光源座包含電路板、多個反射杯結構及多個發光單元。反射片體包含基材及設置於基材的多個反射層狀結構，基材包含多個反射區域，於各個反射區域中，多個反射層狀結構於反射區域的中心、反射區域的邊角處及反射區域的邊線處是相對密集地排列，各個反射層狀結構是用來反射發光單元所發出的光束。透過反射片體的設置，光源座所發出的光束通過反射片體後，可以更均勻地向外射出，而可改善習知直下式背光裝置所存在亮、暗區的品味問題，且亦可以滿足薄形化及降低發光單元的使用數量的需求。This creation discloses a direct type backlight device including a light source base and a reflective sheet body. The light source base includes a circuit board, multiple reflective cup structures and multiple light emitting units. The reflective sheet body includes a base material and a plurality of reflective layered structures disposed on the base material, the base material includes a plurality of reflective regions, and in each reflective region, a plurality of reflective layered structures are located at the center of the reflective region and the corners of the reflective region The edges of the reflection area and the reflection area are relatively densely arranged. Each reflection layer structure is used to reflect the light beam emitted by the light emitting unit. Through the setting of the reflective sheet body, the light beam emitted by the light source seat can be emitted more uniformly after passing through the reflective sheet body, which can improve the taste problem of the bright and dark areas in the conventional direct backlight device, and can also meet The need for thinning and reducing the number of light-emitting units used.

Description

直下式背光裝置Direct type backlight device

本創作涉及一種背光裝置，特別是一種直下式背光裝置。This creation relates to a backlight device, especially a direct type backlight device.

現有車載顯示器的光源模組，大致可區分為側光式及直下式，直下式背光模組相對於側光式背光模組具有更好的影像表現，因此，直下式背光模組為近年來相關廠商主要開發的技術之一。然，現有的直下式背光模組容易發生各區域的亮度不一致的問題(即一般業界俗稱之品味問題)。The light source module of the existing vehicle-mounted display can be roughly divided into an edge light type and a direct type. The direct type backlight module has better image performance than the edge type type backlight module. Therefore, the direct type backlight module is related in recent years. One of the main technologies developed by the manufacturer. However, the existing direct type backlight module is prone to the problem of inconsistency of brightness in various areas (that is, the taste problem commonly known in the industry).

本創作公開一種直下式背光裝置，主要用以改善現有技術中，直下式背光裝置容易發生暗區、亮區的問題。The present invention discloses a direct-type backlight device, which is mainly used to improve the problems of dark areas and bright areas in direct-type backlight devices in the prior art.

本創作的其中一實施例公開一種直下式背光裝置，其包含：一光源座及一反射片體。光源座包含：一電路板、多個反射杯結構及多個發光單元。多個反射杯結構固定設置於電路板的一側，各個反射杯結構相反於電路板的一側內凹形成有一反射腔。多個發光單元，各個發光單元固定設置於電路板，且多個發光單元對應位於多個反射腔中。反射片體定義有多個反射區域，反射片體設置於光源座的上方，各個反射區域對應位於各個反射杯結構的正上方，且各個反射區域的中心對應位於發光單元的中心的上方。反射片體包含：一基材及多個反射層狀結構。多個反射層狀結構形成於基材的一寬側面，且多個反射層狀結構分布於多個反射區域內，各個反射層狀結構能反射光源座所發出的光束；於各個反射區域內的多個反射層狀結構，越鄰近於反射區域的中心越密集地排列，越鄰近於反射區域的邊線越密集地排列，越鄰近於反射區域的邊角越密集地排列；其中，形成各個反射腔的側壁為一反射面，各個反射腔的反射面，能反射相對應的發光單元所發出的部份光束。One embodiment of this creation discloses a direct-lit backlight device, which includes: a light source holder and a reflective sheet body. The light source base includes: a circuit board, multiple reflective cup structures and multiple light emitting units. A plurality of reflective cup structures are fixedly arranged on one side of the circuit board, and each reflective cup structure is concavely formed on a side opposite to the circuit board to form a reflective cavity. A plurality of light-emitting units, each light-emitting unit is fixedly disposed on the circuit board, and the plurality of light-emitting units are correspondingly located in a plurality of reflective cavities. The reflective sheet body defines a plurality of reflective regions, the reflective sheet body is disposed above the light source holder, each reflective region corresponds to directly above each reflective cup structure, and the center of each reflective region corresponds to above the center of the light emitting unit. The reflective sheet body includes: a substrate and a plurality of reflective layered structures. Multiple reflective layered structures are formed on a wide side of the substrate, and the multiple reflective layered structures are distributed in multiple reflective areas. Each reflective layered structure can reflect the light beam emitted by the light source holder; in each reflective area Multiple reflective layered structures are arranged denser as they are closer to the center of the reflective area, densely arranged as the edges of the reflective area are closer, and densely arranged as the corners are closer to the reflective area; wherein, each reflective cavity is formed The side wall is a reflective surface, and the reflective surfaces of each reflective cavity can reflect part of the light beam emitted by the corresponding light emitting unit.

本創作的其中一實施例公開一種直下式背光裝置，其包含：一光源座及一反射片體。光源座包含一電路板、多個反射杯結構及多個發光單元。多個反射杯結構固定設置於電路板的一側，各個反射杯結構相反於電路板的一側內凹形成有一反射腔。各個發光單元固定設置於電路板，且多個發光單元對應位於多個反射腔中。反射片體定義有多個反射區域，反射片體設置於光源座的上方，各個反射區域對應位於各個反射杯結構的正上方，且各個反射區域的中心對應位於發光單元的中心的上方。反射片體包含：一基材及一反射層。反射層形成於基材的一寬側面，反射層能反射光源座所發出的光束；反射層包含多個穿孔，各個穿孔貫穿反射層，而基材的一部份能通過多個穿孔外露；多個穿孔分布於多個反射區域內；於各個反射區域內的多個穿孔，越遠離於反射區域的中心越密集地排列，越遠離於反射區域的邊線越密集地排列，越遠離於反射區域的邊角越密集地排列；其中，形成各個反射腔的側壁為一反射面，各個反射腔的反射面，能反射相對應的發光單元所發出的部份光束。One embodiment of this creation discloses a direct-lit backlight device, which includes: a light source holder and a reflective sheet body. The light source base includes a circuit board, multiple reflective cup structures and multiple light emitting units. A plurality of reflective cup structures are fixedly arranged on one side of the circuit board, and each reflective cup structure is concavely formed on a side opposite to the circuit board to form a reflective cavity. Each light-emitting unit is fixedly disposed on the circuit board, and the multiple light-emitting units are correspondingly located in the multiple reflective cavities. The reflective sheet body defines a plurality of reflective regions, the reflective sheet body is disposed above the light source holder, each reflective region corresponds to directly above each reflective cup structure, and the center of each reflective region corresponds to above the center of the light emitting unit. The reflective sheet includes: a substrate and a reflective layer. The reflective layer is formed on a wide side of the substrate, the reflective layer can reflect the light beam emitted by the light source holder; the reflective layer includes a plurality of perforations, each perforation penetrates the reflective layer, and a part of the substrate can be exposed through the multiple perforations; The perforations are distributed in multiple reflective areas; the multiple perforations in each reflective area are arranged denser as they are farther away from the center of the reflective area, denserly arranged as they are farther away from the edge of the reflective area, and farther away from the reflective area The denser the corners are arranged; wherein, the side wall forming each reflection cavity is a reflection surface, and the reflection surface of each reflection cavity can reflect part of the light beam emitted by the corresponding light emitting unit.

綜上所述，本創作的直下式背光裝置相對於現有的直下式背光模組具有更好的出光均勻度，即，本創作的直下式背光裝置能大幅改善現有直下式背光模組所容易存在的明顯的暗區及亮區的問題。In summary, the direct-type backlight device of the present invention has better light uniformity compared with the existing direct-type backlight module, that is, the direct-type backlight device of the present invention can greatly improve the existing direct-type backlight module, which is easy to exist The problem of obvious dark and bright areas.

為能更進一步瞭解本創作的特徵及技術內容，請參閱以下有關本創作的詳細說明與附圖，但是此等說明與附圖僅用來說明本創作，而非對本創作的保護範圍作任何的限制。In order to understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings of this creation, but these descriptions and drawings are only used to illustrate this creation, not to make any protection to this creation. limit.

於以下說明中，如有指出請參閱特定圖式或是如特定圖式所示，其僅是用以強調於後續說明中，所述及的相關內容大部份出現於該特定圖式中，但不限制該後續說明中僅可參考所述特定圖式。In the following description, if you are instructed to refer to a specific drawing or as shown in a specific drawing, it is only used to emphasize in the subsequent description, most of the related content mentioned in this specific drawing, However, it does not limit that only specific patterns can be referred to in the subsequent description.

請一併參閱圖1至圖5，圖1顯示為本創作的直下式背光裝置的第一實施例的側面示意圖，圖2顯示為本創作的直下式背光裝置的第一實施例的反射杯結構、發光單元及局部的反射片體的側面示意圖，圖3顯示為本創作的直下式背光裝置的第一實施例的反射杯結構的俯視示意圖，圖4為圖3的局部放大示意圖，圖5顯示為本創作的直下式背光裝置的第一實施例的單一個發光單元的立體示意圖。Please refer to FIG. 1 to FIG. 5 together. FIG. 1 shows a schematic side view of a first embodiment of a direct-type backlight device of the present invention, and FIG. 2 shows a reflective cup structure of a first embodiment of the direct-type backlight device of the present invention. 3, a schematic side view of a light-emitting unit and a partial reflective sheet body. FIG. 3 shows a top schematic view of the reflective cup structure of the first embodiment of the direct-lit backlight device of the present invention. FIG. 4 is a partial enlarged schematic view of FIG. This is a three-dimensional schematic diagram of a single light-emitting unit of the first embodiment of the direct-type backlight device created for this.

如圖1所示，本創作的直下式背光裝置100包含：一光源座1及一反射片體2。光源座1包含：一電路板11、多個反射杯結構12及多個發光單元13。多個反射杯結構12固定設置於電路板11的一側。多個反射杯結構12可以是彼此緊密地排列設置於電路板11上，即相鄰的兩個反射杯結構12之間可以是沒有間距地設置，但不以此為限。在特殊的應用中，彼此相鄰的兩個反射杯結構12也可以是具有經過適當設計(在不影響直下式背光裝置100整體的出光均勻度)的微小間距。如圖3及圖4所示，各個反射杯結構12於其上視圖中可以大致呈現為正方形狀，但不以此為限，各個反射杯結構12於其上視圖中所呈現的外型可以是依據需求變化，例如可以是矩形、圓形、橢圓形等。As shown in FIG. 1, the direct-type backlight device 100 of the present invention includes: a light source holder 1 and a reflective sheet body 2. The light source base 1 includes: a circuit board 11, a plurality of reflective cup structures 12 and a plurality of light emitting units 13. A plurality of reflective cup structures 12 are fixed on one side of the circuit board 11. The plurality of reflective cup structures 12 may be closely arranged on the circuit board 11, that is, two adjacent reflective cup structures 12 may be arranged without a gap, but not limited to this. In special applications, the two reflective cup structures 12 adjacent to each other may also have a fine pitch that has been properly designed (without affecting the uniformity of light output of the direct backlight device 100 as a whole). As shown in FIGS. 3 and 4, each reflective cup structure 12 may be substantially square in its upper view, but not limited to this, the appearance of each reflective cup structure 12 in its upper view may be According to changes in demand, for example, it can be rectangular, circular, oval, etc.

如圖1及圖2所示，各個反射杯結構12由遠離電路板11的一側向靠近電路板11的一側內凹形成有一反射腔121。反射腔121相反於電路板11的一側為一反射面122，反射面122的反射率可以是大於90%。反射杯結構12可以是由高反射率材料所製成，舉例來說可以是使用含有由氧化鈦、氧化鋁、氧化矽等金屬氧化物粒子構成的高反射材料的樹脂製作，但不以此為限；在不同的應用中，反射杯結構12可以是由不摻有高反射材料的樹脂製成，而反射腔121相反於電路板11的一側則設置(例如是以塗佈的方式)具有高反射率的層狀結構，而具有高反射率的層狀結構的一側即可對應形成為前述反射面122。在實際應用中，各個反射腔121的寬度W與高度H比可以是介於2：1至6：1，但不以此為限，反射腔121的尺寸及其外型可以是依據發光單元13的不同而對應改變。As shown in FIGS. 1 and 2, each reflective cup structure 12 is concavely formed from a side away from the circuit board 11 to a side close to the circuit board 11, and a reflective cavity 121 is formed. The side of the reflective cavity 121 opposite to the circuit board 11 is a reflective surface 122, and the reflectivity of the reflective surface 122 may be greater than 90%. The reflective cup structure 12 may be made of a high-reflectivity material, for example, it may be made of a resin containing a high-reflective material composed of metal oxide particles such as titanium oxide, aluminum oxide, silicon oxide, etc., but not as In different applications, the reflective cup structure 12 may be made of resin that is not doped with highly reflective materials, and the reflective cavity 121 is provided on the side opposite to the circuit board 11 (for example, by coating) The layer structure with high reflectivity, and one side of the layer structure with high reflectivity can be correspondingly formed as the aforementioned reflective surface 122. In practical applications, the ratio of the width W to the height H of each reflective cavity 121 may be between 2:1 and 6:1, but not limited to this. The size and shape of the reflective cavity 121 may be based on the light emitting unit 13 Change accordingly.

值得一提的是，在實際應用中，在反射腔121的側面示意圖(如圖1及圖2所示)中，各個反射腔121鄰近於電路板11的位置可以是具有一弧狀區段123，藉此，反射腔121將可以更有效地使發光單元13所發出的光束向反射片體2的方向反射。當然，在不同的實施例中，在反射腔121的側面示意圖中，反射腔121也可以是僅包含有直線區段而不包含有任何弧狀區段。It is worth mentioning that, in practical applications, in a schematic side view of the reflective cavity 121 (as shown in FIGS. 1 and 2 ), the position of each reflective cavity 121 adjacent to the circuit board 11 may have an arc-shaped section 123 In this way, the reflective cavity 121 can more effectively reflect the light beam emitted by the light emitting unit 13 in the direction of the reflective sheet body 2. Of course, in different embodiments, in a schematic side view of the reflective cavity 121, the reflective cavity 121 may also include only straight-line segments without any arc-shaped segments.

如圖2及圖5所示，各個發光單元13固定設置於電路板11，且各個發光單元13對應位於各個反射腔121中，且各個發光單元13可以是對應位於反射腔121的中心且最低的位置。在實際應用中，反射杯結構12可以是包含有用來容置發光單元13的容槽124，而發光單元13則是對應設置於所述容槽124中。各個發光單元13具有一頂發光面13A及一環發光面13B，頂發光面13A的周緣與環發光面13B相連接，發光單元13由頂發光面13A發出的光束強度低於由環發光面13B發出的光束的強度。As shown in FIGS. 2 and 5, each light-emitting unit 13 is fixedly disposed on the circuit board 11, and each light-emitting unit 13 is correspondingly located in each reflective cavity 121, and each light-emitting unit 13 may be correspondingly located in the center of the reflective cavity 121 and the lowest position. In practical applications, the reflective cup structure 12 may include a container 124 for accommodating the light-emitting unit 13, and the light-emitting unit 13 is correspondingly disposed in the container 124. Each light-emitting unit 13 has a top light-emitting surface 13A and a ring-shaped light-emitting surface 13B. The periphery of the top light-emitting surface 13A is connected to the ring light-emitting surface 13B. The light beam intensity of the light-emitting unit 13 emitted by the top light-emitting surface 13A is lower than that emitted by the ring light-emitting surface 13B The intensity of the light beam.

在實際應用中，各個發光單元13於正向0度的光強度可以是低於50%以下，光強度最大值則是落在-55°~-75°及55°~75°之間，而各個發光單元13的光形圖大致呈現為半心形；各個發光單元13的寬度W可以是介於0.1公釐(mm)至2公釐(mm)，各個發光單元13的長度可以是介於0.1公釐(mm)至2公釐(mm)，各個發光單元13的高度H可以是介於0.1公釐(mm)至1.7公釐(mm)。In practical applications, the light intensity of each light-emitting unit 13 at a positive 0 degree may be less than 50%, and the maximum light intensity falls between -55°~-75° and 55°~75°, and The light pattern of each light-emitting unit 13 is roughly half-heart-shaped; the width W of each light-emitting unit 13 may be between 0.1 mm (mm) and 2 mm (mm), and the length of each light-emitting unit 13 may be between From 0.1 mm (mm) to 2 mm (mm), the height H of each light emitting unit 13 may be between 0.1 mm (mm) and 1.7 mm (mm).

如圖5所示，在具體的實施中，各個發光單元13可以是包含一發光二極體131、一半反射件132及一透光體133。發光二極體131可以是矩形立方體，而發光二極體131具有一頂面1311及四個側面1312，頂面1311為發光二極體131相反於與電路板11相連接的一端面，四個側面1312則與頂面1311的周緣相連接。As shown in FIG. 5, in a specific implementation, each light-emitting unit 13 may include a light-emitting diode 131, a half reflector 132 and a light-transmitting body 133. The light emitting diode 131 may be a rectangular cube, and the light emitting diode 131 has a top surface 1311 and four side surfaces 1312. The top surface 1311 is an end surface of the light emitting diode 131 opposite to the one connected to the circuit board 11, four The side surface 1312 is connected to the periphery of the top surface 1311.

半反射件132設置於發光二極體131的頂面1311，而通過頂面1311向外射出的部分光束，將被半反射件132反射，另一部分的光束則能通過半反射件132向外射出。在實際應用中，半反射件132可以是以塗佈的方式形成於發光二極體131的頂面1311，而半反射件132例如可以是由半透明狀的材料所製成；舉例來說，半反射件132可以是由厚度薄到可以使發光單元13所發出的光束直接穿過的反射材料所製成。在具體的應用中，半反射件132可以是由具有不同折射率的片體結構堆疊而成，例如是分佈式布拉格反射膜(Distributed Bragg Reflector)。The semi-reflecting member 132 is disposed on the top surface 1311 of the light emitting diode 131, and part of the light beam emitted outward through the top surface 1311 will be reflected by the semi-reflecting member 132, and the other part of the light beam can be emitted outward through the semi-reflecting member 132 . In practical applications, the semi-reflective member 132 may be formed on the top surface 1311 of the light-emitting diode 131 by coating, and the semi-reflective member 132 may be made of a translucent material; for example, The semi-reflecting member 132 may be made of a reflective material thin enough to allow the light beam emitted by the light emitting unit 13 to directly pass through. In a specific application, the semi-reflective member 132 may be formed by stacking sheet structures with different refractive indexes, for example, a distributed Bragg reflector (Distributed Bragg Reflector).

透光體133包覆半反射件132及發光二極體131設置，透光體133的外型可以是大致呈現為矩形立方體，而透光體133的外圍對應形成有所述頂發光面13A及所述環發光面13B，頂發光面13A與頂面1311彼此相面對地設置，而發光二極體131所發出的光束將通過的透光體133向外射出。所述透光體133用以保護發光二極體131及半反射件132，以避免發光二極體131及半反射件132直接裸露而容易受損。在實際應用中，半反射件132例如可以是包含二氧化矽(SiO2)、二氧化鈦(TiO2)等反射粒子。The light-transmitting body 133 covers the semi-reflecting member 132 and the light-emitting diode 131. The shape of the light-transmitting body 133 may be generally a rectangular cube, and the top light-emitting surface 13A and The ring light-emitting surface 13B, the top light-emitting surface 13A and the top surface 1311 are arranged to face each other, and the light beam emitted by the light-emitting diode 131 will be emitted outward through the transparent body 133 passing through. The light-transmitting body 133 is used to protect the light-emitting diode 131 and the semi-reflective element 132 to prevent the light-emitting diode 131 and the semi-reflective element 132 from being directly exposed and easily damaged. In practical applications, the semi-reflective member 132 may be reflective particles including silicon dioxide (SiO2), titanium dioxide (TiO2), and the like.

在實際應用中，各個發光二極體131可以是依據需求發出不同波長的光束。在發光二極體131是發出波長460奈米至470奈米的藍光光束的實施例中，透光體133內可以是摻有一色轉換材料，色轉換材料例如可以是包含有磷光體、II-VI族半導體奈米晶體或III-V族半導體奈米晶體等材料，而發光二極體131所發出的藍光光束，通過透光體133內的色轉換材料後，將轉換為白光光束向外射出。另外，透光體133中也可以是設置有擴散粒子等，於此不加以限制。In practical applications, each light-emitting diode 131 may emit light beams of different wavelengths according to requirements. In the embodiment where the light emitting diode 131 emits a blue light beam with a wavelength of 460 nm to 470 nm, the light transmitting body 133 may be doped with a color conversion material, and the color conversion material may include, for example, phosphor, II- Group VI semiconductor nanocrystals or III-V semiconductor nanocrystals and other materials, and the blue light beam emitted by the light-emitting diode 131 passes through the color conversion material in the light-transmitting body 133 and is converted into white light beams to be emitted outward . In addition, the light-transmitting body 133 may be provided with diffused particles, etc., which is not limited here.

依上所述，透過上述半反射件132的設置，發光單元13由頂發光面13A向外射出的光束的光通量，將明顯低於發光單元13由環發光面13B向外射出的光束的光通量，從而可提升直下式背光裝置100所發出的光束的均勻度，而避免使用者容易直接觀察到來自於各個發光單元13的頂發光面13A所發出的光束所形成的光點的問題。也就是說，設置有半反射件132的直下式背光裝置100，相較於未設置有半反射件132的直下式背光裝置100，具有更好的出光均勻度，且更不容易被使用者觀察到明顯的光點。As described above, through the arrangement of the semi-reflecting member 132, the light flux of the light beam emitted from the top light emitting surface 13A of the light emitting unit 13 will be significantly lower than that of the light beam emitted from the ring light emitting surface 13B of the light emitting unit 13, Therefore, the uniformity of the light beam emitted by the direct-type backlight device 100 can be improved, and the problem that the light spot formed by the light beam emitted from the top light-emitting surface 13A of each light-emitting unit 13 is easily observed by the user is avoided. That is to say, the direct-type backlight device 100 provided with the semi-reflective member 132 has a better uniformity of light output than the direct-type backlight device 100 not provided with the semi-reflective member 132, and is less likely to be observed by the user To an obvious light spot.

值得一提的是，各個發光單元13的發光二極體131可以是覆晶封裝發光晶片(Flip chip)，且各個發光單元13還可以是包含有一轉接板134。轉接板134包含絕緣結構及導電佈線結構，覆晶封裝發光晶片固定於轉接板134，且覆晶封裝發光晶片與導電佈線結構電性連通，而覆晶封裝發光晶片是通過轉接板134，固定於電路板11，且覆晶封裝發光晶片是通過轉接板134與電路板11電性連通，而電路板11是通過轉接板134傳遞電力及控制訊號至覆晶封裝發光晶片。It is worth mentioning that the light-emitting diode 131 of each light-emitting unit 13 can be a flip chip light-emitting chip (Flip chip), and each light-emitting unit 13 can also include an adapter plate 134. The interposer 134 includes an insulating structure and a conductive wiring structure. The flip-chip package light-emitting chip is fixed to the interposer 134, and the flip-chip package light-emitting chip is electrically connected to the conductive wiring structure, and the flip-chip package light-emitting chip passes through the interposer 134 , Fixed to the circuit board 11, and the flip-chip package light-emitting chip is electrically connected to the circuit board 11 through the adapter plate 134, and the circuit board 11 transmits power and control signals to the flip-chip package light-emitting chip through the adapter plate 134.

透過上述轉接板134的設置，將可大幅降低覆晶封裝發光晶片在安裝於電路板11的過程中發生剝離(Peeling)的問題；更具體來說，在現有技術中，是直接將覆晶發光晶片固定於電路板11上，此種固定方式，在固定的過程中，覆晶發光晶片的電極結構，將容易直接受熱而膨脹，進而導致電極結構發生剝離(Peeling)的問題。相對地，若是使覆晶封裝發光晶片透過轉接板134固定於電路板11上，則在將發光單元13固定於電路板11的過程中，相關的熱能將不易直接傳遞至覆晶封裝發光晶片，而大部份的熱能會先被轉接板134吸收，藉此，覆晶封裝發光晶片將不容易發生上述剝離(Peeling)問題。Through the arrangement of the adapter plate 134, the problem of peeling (Peeling) of the flip-chip package light-emitting chip during the mounting on the circuit board 11 can be greatly reduced; more specifically, in the prior art, the flip chip is directly The light-emitting chip is fixed on the circuit board 11. In this fixing method, during the fixing process, the electrode structure of the flip-chip light-emitting chip will be easily directly heated and expand, which will cause the problem of peeling of the electrode structure. On the contrary, if the flip chip light emitting chip is fixed to the circuit board 11 through the adapter plate 134, the related heat energy will not be easily transferred directly to the flip chip light emitting chip during the process of fixing the light emitting unit 13 to the circuit board 11 And most of the heat energy will be absorbed by the adapter plate 134 first, thereby, the above-mentioned peeling (Peeling) problem of the flip chip light emitting chip will not be easy to occur.

特別強調的是，本創作的直下式背光裝置100所包含的各個發光單元13具體的種類、形式、所發出的光束波長等，皆不以上述說明為限，亦即，在不同的實施例中，本創作的直下式背光裝置100的各個發光單元13可以是一般常見的發光二極體，而其頂發光面可以是不設置有前述半反射件132。It is particularly emphasized that the specific types, forms, and wavelengths of light beams emitted by the light-emitting units 13 included in the direct-type backlight device 100 of the present invention are not limited to the above description, that is, in different embodiments Each light-emitting unit 13 of the direct-type backlight device 100 of the present invention may be a generally common light-emitting diode, and the top light-emitting surface thereof may not be provided with the aforementioned semi-reflective member 132.

請一併參閱圖1、圖2、圖6至圖8，圖6顯示為本創作的直下式背光裝置的第一實施例的反射片體的一側面的正視圖，圖7顯示本創作的直下式背光裝置的第一實施例的反射片體的單一個反射區域的正視圖，圖8顯示為本創作的直下式背光裝置的第一實施例的反射片體的立體示意圖。Please refer to FIG. 1, FIG. 2 and FIG. 6 to FIG. 8 together. FIG. 6 shows a front view of a side surface of the reflector body of the first embodiment of the direct-type backlight device of the creation, and FIG. 7 shows the direct-down of the creation A front view of a single reflective area of the reflective sheet body of the first embodiment of the backlight device of the first embodiment. FIG. 8 shows a schematic perspective view of the reflective sheet body of the first embodiment of the direct-lit backlight device of the present invention.

反射片體2設置於光源座1的上方。如圖1及圖2所示，在實際應用中，光源座1的各個反射杯結構12內凹形成有反射腔121的一側與所述反射片體2之間可以是形成有一間隙G，所述間隙G的距離P(如圖2所示)可以是不大於2公釐(mm)，如此，各個發光單元13所發出的部分光束通過相對應的反射杯結構12反射後，一部分將可以照射到兩個反射杯結構12相連接的位置Q(如圖1所示)，如此，可協助提升直下式背光裝置100的出光均勻度。也就是說，在反射片體2與光源座1之間形成有所述間隙G的實施例中，直下式背光裝置100的出光均勻度，將會高於在反射片體2與光源座1之間沒有形成間隙G的實施例中，直下式背光裝置100的出光均勻度。The reflective sheet body 2 is provided above the light source holder 1. As shown in FIGS. 1 and 2, in practical applications, a gap G may be formed between the side of each reflective cup structure 12 of the light source base 1 in which the reflective cavity 121 is concavely formed and the reflective sheet body 2. The distance P of the gap G (as shown in FIG. 2) can be no more than 2 mm (mm), so that part of the light beams emitted by each light-emitting unit 13 is reflected by the corresponding reflective cup structure 12, a part of it will be irradiated To the position Q (as shown in FIG. 1) where the two reflective cup structures 12 are connected, in this way, it can help to improve the light uniformity of the direct-type backlight device 100. That is to say, in the embodiment where the gap G is formed between the reflective sheet body 2 and the light source holder 1, the uniformity of light output of the direct-type backlight device 100 will be higher than that between the reflective sheet body 2 and the light source holder 1 In the embodiment in which the gap G is not formed, the uniformity of light output of the direct type backlight device 100.

反射片體2包含：一基材21及多組反射層狀結構22。基材21彼此相反的兩個寬側面分別定義為一內側面211及一外側面212。在實際應用中，基材21的厚度可以是介於0.1公釐(mm)至2公釐(mm)。發光單元13所發出的光束，能由基材21未設置有反射層狀結構22的內側面211，穿過所述基材21，而由所述外側面212向外射出。基材21具體的材料及其包含的結構於此不加以限制，舉例來說，基材21可以是類似於擴散板(Diffuser)的結構，或者，基材21可以是由透明高分子材料製成，或者，基材21也可以是多層膜材料，或者，所述基材也可以是玻璃材質，於此不加以限制。The reflective sheet body 2 includes a substrate 21 and multiple sets of reflective layered structures 22. The two wide sides opposite to each other of the substrate 21 are defined as an inner side 211 and an outer side 212, respectively. In practical applications, the thickness of the substrate 21 may be between 0.1 mm and 2 mm. The light beam emitted by the light-emitting unit 13 can pass through the substrate 21 from the inner side 211 of the substrate 21 where the reflective layered structure 22 is not provided, and exit outward from the outer side 212. The specific material of the substrate 21 and the structure contained therein are not limited herein. For example, the substrate 21 may be a structure similar to a diffuser (Diffuser), or the substrate 21 may be made of a transparent polymer material Or, the substrate 21 may also be a multilayer film material, or the substrate may also be made of glass, which is not limited herein.

基材21於內側面211定義有多個反射區域21A。當反射片體2固定設置於光源座1的上方時，基材21的內側面211是面對光源座1，且各個反射區域21A是對應位於各個反射杯結構12的正上方，且各個反射區域21A的中心對應位於發光單元13的頂發光面13A的中心的上方，更具體來說，各個反射區域21A的中心與發光單元13的頂發光面13A的中心是位於同一軸線上。The base 21 defines a plurality of reflective regions 21A on the inner side 211. When the reflective sheet body 2 is fixedly disposed above the light source holder 1, the inner side surface 211 of the substrate 21 faces the light source holder 1, and each reflection area 21A is correspondingly located directly above each reflection cup structure 12, and each reflection area The center of 21A corresponds to the position above the center of the top light-emitting surface 13A of the light-emitting unit 13. More specifically, the center of each reflection area 21A and the center of the top light-emitting surface 13A of the light-emitting unit 13 are on the same axis.

在實際應用中，各個反射區域21A是對應落在各個反射杯結構12向反射片體2的方向的正投影的正投影區域內，或者，反射區域21A可以是等於各個反射杯結構12向反射片體2的方向的正投影的正投影區域；各個反射區域21A的中心是落在各個發光單元13向反射片體2的方向的正投影的正投影區域內。In practical applications, each reflective area 21A corresponds to an orthographic area corresponding to the orthographic projection of each reflective cup structure 12 in the direction of the reflective sheet body 2, or the reflective area 21A may be equal to the reflective sheet of each reflective cup structure 12 The orthographic projection area of the orthographic projection of the direction of the body 2; the center of each reflective area 21A is within the orthographic projection area of the orthographic projection of the respective light emitting unit 13 in the direction of the reflective sheet body 2.

多個反射層狀結構22形成於基材21的內側面211，且多個反射層狀結構22分布於多個反射區域21A內，各個反射層狀結構22能反射光源座1所發出的光束，而被反射層狀結構22反射的至少一部分的光束，將回到所述反射腔121中，並通過反射腔121的反射後，再次向所述反射片體2的方向射出。A plurality of reflective layer structures 22 are formed on the inner surface 211 of the substrate 21, and the plurality of reflective layer structures 22 are distributed in the plurality of reflective regions 21A. Each reflective layer structure 22 can reflect the light beam emitted by the light source holder 1, At least a part of the light beam reflected by the reflective layered structure 22 will return to the reflective cavity 121, and after being reflected by the reflective cavity 121, be emitted toward the reflective sheet body 2 again.

如圖6及圖7所示，於各個反射區域21A內的多個反射層狀結構22的分布方式是：於各個反射區域21A內的多個反射層狀結構22，越鄰近於反射區域21A的中心越密集地排列，越鄰近於反射區域21A的邊線越密集地排列，越鄰近於反射區域21A的邊角越密集地排列。更具體來說，如圖7所示，其顯示為單一個所述反射區域21A的俯視圖，於該單一反射區域21A內的多個所述反射層狀結構22，在圖中所示中心圓圈區域A內、在圖中所示靠近所述反射區域21A的四個邊角的四個圓圈區域B內，以及在圖中所示四個長條區域C內皆是密集地排列，而發光單元13向反射區域21A發出的光束，在中心圓圈區域A、四個圓圈區域B及四個長條區域C的位置，將會被大量地反射回反射杯結構12。As shown in FIGS. 6 and 7, the distribution method of the plurality of reflective layered structures 22 in each reflective area 21A is: the more adjacent to the reflective areas 21A in the plurality of reflective layered structures 22 in each reflective area 21A The denser the centers are, the denser the edges of the reflection area 21A are, and the denser the corners of the reflection area 21A are. More specifically, as shown in FIG. 7, it is shown as a top view of a single reflective area 21A. A plurality of the reflective layered structures 22 in the single reflective area 21A are shown in the center circle area in the figure In A, in the four circle areas B near the four corners of the reflection area 21A shown in the figure, and in the four strip areas C shown in the figure, they are all densely arranged, and the light emitting units 13 The light beams emitted toward the reflective area 21A will be reflected back to the reflective cup structure 12 in large amounts at the positions of the central circle area A, the four circle areas B, and the four elongated areas C.

請一併參閱圖4及圖7，在圖7中所示的中心圓圈區域A是對應位於反射杯結構12的發光單元13的正上方，且在圖7中所示的四個圓圈區域B是對應位於反射杯結構12的四個邊角處，而在圖7中所示的四個長條區域C，則是對應位於反射杯結構12邊界位置；如圖4所示，換句話說，彼此相鄰的兩個反射杯結構12相互連接的邊界位置的正上方的反射片體2是對應形成有較為密集的反射層狀結構22，彼此相鄰的兩個反射杯結構12相互連接的邊角位置的正上方的反射片體2是對應形成有較為密集的反射層狀結構22。Please refer to FIG. 4 and FIG. 7 together. The central circle area A shown in FIG. 7 corresponds to directly above the light-emitting unit 13 of the reflective cup structure 12, and the four circle areas B shown in FIG. 7 are Corresponding to the four corners of the reflective cup structure 12, and the four elongated regions C shown in FIG. 7 are corresponding to the boundary position of the reflective cup structure 12; as shown in FIG. 4, in other words, each other The reflection sheet 2 directly above the boundary position where the two adjacent reflective cup structures 12 are connected to each other is formed with a relatively dense reflective layered structure 22, and the corners of the two adjacent reflective cup structures 12 adjacent to each other are connected to each other The reflective sheet body 2 directly above the position corresponds to a relatively dense reflective layer structure 22 formed.

依上所述，透過使位於單一個反射區域21A內的多個反射層狀結構22，於發光單元13的正上方、反射杯結構12的四個邊線處的正上方及反射杯結構12的四個邊角處的正上方較為密集地排列的設計，將可以使發光單元13通過反射區域21A向外射出的光束更為均勻。As described above, by making the multiple reflective layered structures 22 located in the single reflective area 21A directly above the light emitting unit 13, directly above the four edges of the reflective cup structure 12 and the four sides of the reflective cup structure 12 The densely arranged design directly above the corners will make the light beam emitted by the light-emitting unit 13 through the reflective area 21A more uniform.

更具體來說，若反射片體2的多個反射層狀結構22未依照前述分布狀態的設計，則發光單元13所發出的光束，在通過反射片體2向外射出時，使用者在反射片體2的外側面212的一側，將容易看到在各個發光單元13的正上方的光亮度、兩個相鄰的反射杯結構12的邊界處的光亮度、兩個相鄰的反射杯結構12的邊角處的光亮度，是明顯強於其他區域。反之，若反射片體2的多個反射層狀結構22依照前述分布狀態設置，則使用者在反射片體2的外側面212的一側，觀看反射片體2時，將可以看到反射片體2的各個區域的亮度是差不多亮。More specifically, if the plurality of reflective layer structures 22 of the reflective sheet body 2 are not designed according to the foregoing distribution state, the light beam emitted by the light-emitting unit 13 is reflected by the user when the beam is emitted outward through the reflective sheet body 2 One side of the outer surface 212 of the sheet body 2 will easily see the brightness directly above each light-emitting unit 13, the brightness at the boundary of two adjacent reflective cup structures 12, the two adjacent reflective cups The brightness at the corners of the structure 12 is significantly stronger than other areas. Conversely, if the plurality of reflective layered structures 22 of the reflective sheet body 2 are arranged according to the foregoing distribution state, the user will see the reflective sheet when viewing the reflective sheet body 2 on the side of the outer surface 212 of the reflective sheet body 2 The brightness of each area of the volume 2 is almost bright.

承上，在各個發光單元13未設置有前述半反射件132的實施例中，使用者於反射片體2的外側面212的一側觀看反射片體2時，將更清楚地看到位於發光單元13正上方的區域的亮度及位於相鄰的兩個反射杯結構12的四個交界處的亮度明顯高於其他區域；其中，位於發光單元13的正上方的區域的亮度較高是因為發光單元13指向性的關係，位於相鄰的兩個反射杯結構12的四個交界處的亮度較高是因為兩個反射杯結構12內的發光單元13所發出的光束會同時照射到四個交界處。As mentioned above, in the embodiment in which each light-emitting unit 13 is not provided with the aforementioned semi-reflective member 132, when the user views the reflective sheet body 2 on the side of the outer surface 212 of the reflective sheet body 2, the user will more clearly see the light The brightness of the area directly above the unit 13 and the brightness of the four junctions of the two adjacent reflective cup structures 12 are significantly higher than those of other areas; where the brightness of the area directly above the light-emitting unit 13 is higher because of light emission Due to the directivity of the unit 13, the brightness at the four junctions of the two adjacent reflective cup structures 12 is higher because the light beams emitted by the light-emitting unit 13 in the two reflective cup structures 12 will simultaneously illuminate the four junctions Office.

如圖8所示，在具體的實施中，各個反射層狀結構22例如可以是通過油墨印刷、蒸鍍等方式形成於基材21，各個反射層狀結構22可以是包含有氧化鈦粒子、氧化鋁粒子、氧化矽粒子等高反射率的粒子的樹脂，或者，各個反射層狀結構22也可以是本身即由金屬粒子所組成。各個反射層狀結構22的外徑OD(如圖6所示)可以介於1微米(um)至500微米(um)，較佳地，各個反射層狀結構22的外徑OD可以是介於30微米(um)至100微米(um)。各個反射層狀結構22的厚度D(如圖2所示)可以是介於0.05微米(um)至20微米(um)。As shown in FIG. 8, in a specific implementation, each reflective layered structure 22 may be formed on the substrate 21 by ink printing, vapor deposition, etc., and each reflective layered structure 22 may include titanium oxide particles, oxidized The resin of high-reflectivity particles such as aluminum particles and silicon oxide particles, or each reflective layered structure 22 may itself be composed of metal particles. The outer diameter OD (as shown in FIG. 6) of each reflective layered structure 22 may be between 1 micrometer (um) and 500 micrometers (um), preferably, the outer diameter OD of each reflective layered structure 22 may be between 30 microns (um) to 100 microns (um). The thickness D (as shown in FIG. 2) of each reflective layered structure 22 may be between 0.05 microns (um) and 20 microns (um).

依上所述，透過於光源座1的上方設置反射片體2，且使反射片體2面對光源座1的寬側面設置有多個反射層狀結構22的設計，以及使位於單一個反射區域21A內的多個反射層狀結構22在靠近反射區域21A的中心位置、靠近反射區域21A的邊角位置及靠近反射區域21A的邊線位置較為集中的設計，將可以使發光單元13由頂發光面13A所發出的大部分光束將被反射層狀結構22反射至反射腔121，發光單元13由環發光面13B所發出的大部分光束則是能通過基材21由外側面212向外射出，而發光單元13由環發光面13B所發出的少部分光束則是被反射層狀結構22反射至反射腔121。如此，將可大幅提升光源座1所發出的光束，通過反射片體2射出的出光均勻度。According to the above, the reflective sheet body 2 is provided above the light source base 1, and the reflective sheet body 2 is provided with a plurality of reflective layer structures 22 on the wide side of the light source base 1, and a single reflection is arranged The design of a plurality of reflective layered structures 22 in the area 21A near the center position of the reflective area 21A, the corner position near the reflective area 21A and the edge position near the reflective area 21A will allow the light emitting unit 13 to emit light from the top Most of the light beams emitted by the surface 13A will be reflected by the reflective layered structure 22 to the reflection cavity 121, and most of the light beams emitted by the light-emitting unit 13 from the ring light-emitting surface 13B can be emitted outward from the outer surface 212 through the substrate 21, However, a small part of the light beam emitted by the light-emitting unit 13 from the ring light-emitting surface 13B is reflected by the reflection layer structure 22 to the reflection cavity 121. In this way, the uniformity of the light emitted by the light source base 1 through the reflective sheet 2 can be greatly improved.

請一併參閱圖9至圖11，圖9顯示為本創作的直下式背光裝置的第二實施例的反射片體的一側面的正視圖，圖10顯示為本創作的直下式背光裝置的第二實施例的反射片體的立體示意圖，圖11顯示本創作的直下式背光裝置的第二實施例的反射片體的單一個反射區域的正視圖。如圖9及圖10所示，本實施例與前述實施例最大不同之處在於：反射片體2的其中一個寬側面1312是形成有一反射層23，所述反射層23能反射光源座1所發出的光束。反射層23包含多個穿孔231，各個穿孔231貫穿反射層23，而基材21的一部份能通過多個穿孔231外露。多個穿孔231分布於多個反射區域21A內。Please refer to FIG. 9 to FIG. 11 together. FIG. 9 shows a front view of a side surface of the reflector body of the second embodiment of the direct-type backlight device of the present invention, and FIG. 10 shows the first view of the direct-type backlight device of the present invention. A schematic perspective view of the reflective sheet body of the second embodiment. FIG. 11 shows a front view of a single reflective area of the reflective sheet body of the second embodiment of the direct-type backlight device of the present invention. As shown in FIG. 9 and FIG. 10, the biggest difference between this embodiment and the previous embodiment is that one of the wide sides 1312 of the reflective sheet body 2 is formed with a reflective layer 23, which can reflect the light source holder 1. The emitted light beam. The reflective layer 23 includes a plurality of through holes 231, each of the through holes 231 penetrates the reflective layer 23, and a portion of the substrate 21 can be exposed through the plurality of through holes 231. The plurality of through holes 231 are distributed in the plurality of reflective regions 21A.

如圖10所示，其顯示為單一個所述反射區域21A的俯視圖，於各個反射區域21A內的多個穿孔231，越遠離於反射區域21A的中心是越密集地排列，越遠離於反射區域21A的邊線是越密集地排列，越遠離於反射區域21A的邊角越密集地排列。多個穿孔231在圖10中所示中心圓圈區域A內、在圖中所示靠近所述反射區域21A的四個邊角的四個圓圈區域B內，以及在圖中所示四個長條區域C內皆是密集地排列，而發光單元13向反射區域21A發出的光束，在中心圓圈區域A、四個圓圈區域B及四個長條區域C的位置，將會被大量地反射回反射杯結構12。As shown in FIG. 10, which is shown as a top view of a single reflective area 21A, the plurality of perforations 231 in each reflective area 21A are denserly arranged farther from the center of the reflective area 21A, and further away from the reflective area The edges of 21A are arranged denser, and the corners farther away from the reflection area 21A are arranged denser. A plurality of perforations 231 are shown in the central circle area A shown in FIG. 10, in the four circle areas B near the four corners of the reflection area 21A shown in the figure, and four long bars shown in the figure The areas C are all densely arranged, and the light beams emitted by the light-emitting unit 13 to the reflective area 21A will be largely reflected back at the positions of the central circle area A, the four circle areas B, and the four elongated areas C杯结构12. 12. Cup structure 12.

依上所述，透過使位於單一個反射區域21A內的多個穿孔231，於發光單元13的正上方、反射杯結構12的四個邊線處的正上方及反射杯結構12的四個邊角處的正上方較為密集地排列的設計，將可以使發光單元13通過反射區域21A向外射出的光束更為均勻。As described above, by making the plurality of perforations 231 located in a single reflective area 21A, directly above the light emitting unit 13, directly above the four edges of the reflective cup structure 12 and the four corners of the reflective cup structure 12 The densely arranged design directly above the location will make the light beam emitted by the light emitting unit 13 through the reflective area 21A more uniform.

如圖11所示，在實際應用中，反射層23可以是利用印刷、蒸鍍等方式形成於基材21的一寬側面，而相關用於印刷、蒸鍍的設備，則是直接於上述穿孔231的位置處，不進行印刷、蒸鍍作業，也就是說，前述穿孔231即為基材21未設置有反射層23的位置。As shown in FIG. 11, in practical applications, the reflective layer 23 may be formed on a wide side of the substrate 21 by printing, vapor deposition, etc., and related equipment for printing, vapor deposition is directly on the perforation At the position 231, printing and vapor deposition operations are not performed. That is, the through hole 231 is the position where the reflective layer 23 is not provided on the substrate 21.

請一併參閱圖12及圖13，圖12顯示為本創作的直下式背光裝置的第三實施例的局部側面示意圖，圖13顯示為本創作的直下式背光裝置的第四實施例的局部側面示意圖。圖12所示的實施例與前述第一實施例最大不同之處在於：多個反射層狀結構22是設置於基材21的外側面212。圖13所示的實施例與前述第一實施例最大不同之處在於：基材21的內側面211及外側面212皆設置有多個反射層狀結構22。在圖12及圖13的實施例中，發光單元13所發出的光束將能穿過基材21，具體來說，發光單元13所發出的光束通過所述基材21的穿透率可以是大於80%。在具體的應用中，位於基材21的內側面211的反射層狀結構22的分布狀況，可以是不同於位於基材21的外側面212的反射層狀結構22的分布狀況。Please refer to FIG. 12 and FIG. 13 together. FIG. 12 shows a partial side view of a third embodiment of the direct-type backlight device of the present invention, and FIG. 13 shows a partial side view of the fourth embodiment of the direct-type backlight device of the present invention. Schematic. The embodiment shown in FIG. 12 is most different from the foregoing first embodiment in that a plurality of reflective layer structures 22 are provided on the outer side 212 of the substrate 21. The embodiment shown in FIG. 13 differs from the foregoing first embodiment in that the inner side 211 and the outer side 212 of the substrate 21 are both provided with a plurality of reflective layer structures 22. In the embodiments of FIGS. 12 and 13, the light beam emitted by the light-emitting unit 13 can pass through the substrate 21, specifically, the transmittance of the light beam emitted by the light-emitting unit 13 through the substrate 21 can be greater than 80%. In a specific application, the distribution of the reflective layered structure 22 on the inner side 211 of the substrate 21 may be different from the distribution of the reflective layered structure 22 on the outer side 212 of the substrate 21.

請一併參閱圖14及圖15，圖14顯示為本創作的直下式背光裝置的第五實施例的局部側面示意圖，圖15顯示為本創作的直下式背光裝置的第六實施例的局部側面示意圖。圖14所示的實施例與前述第二實施例最大不同之處在於：反射層23是設置於基材21的外側面212。圖15所示的實施例與前述第二實施例最大不同之處在於：基材21的內側面211及外側面212皆設置有反射層23。在圖14及圖15的實施例中，發光單元13所發出的光束將能穿過基材21，具體來說，發光單元13所發出的光束通過所述基材21的穿透率可以是大於80%。在具體的應用中，位於基材21的內側面211的反射層狀結構22的分布狀況，可以是不同於位於基材21的外側面212的反射層狀結構22的分布狀況。Please refer to FIG. 14 and FIG. 15 together. FIG. 14 shows a partial side schematic view of the fifth embodiment of the direct-type backlight device of the original creation, and FIG. 15 shows a partial side view of the sixth embodiment of the direct-type backlight device of the original creation. Schematic. The biggest difference between the embodiment shown in FIG. 14 and the foregoing second embodiment is that the reflective layer 23 is provided on the outer side 212 of the substrate 21. The biggest difference between the embodiment shown in FIG. 15 and the aforementioned second embodiment is that both the inner side 211 and the outer side 212 of the substrate 21 are provided with a reflective layer 23. In the embodiments of FIGS. 14 and 15, the light beam emitted by the light-emitting unit 13 will be able to pass through the substrate 21, specifically, the transmittance of the light beam emitted by the light-emitting unit 13 through the substrate 21 may be greater than 80%. In a specific application, the distribution of the reflective layered structure 22 on the inner side 211 of the substrate 21 may be different from the distribution of the reflective layered structure 22 on the outer side 212 of the substrate 21.

以上所述僅為本創作的較佳可行實施例，非因此侷限本創作的專利範圍，故舉凡運用本創作說明書及圖式內容所做的等效技術變化，均包含於本創作的保護範圍內。The above is only the preferred and feasible embodiment of this creation, and does not limit the patent scope of this creation. Therefore, all equivalent technical changes made by using this creation description and graphic content are included in the protection scope of this creation. .

100:直下式背光裝置 1:光源座 11:電路板 12:反射杯結構 121:反射腔 122:反射面 123:弧狀區段 124:容槽 13:發光單元 13A:頂發光面 13B:環發光面 131:發光二極體 1311:頂面 1312:側面 132:半反射件 133:透光體 134:轉接板 2:反射片體 21:基材 211:內側面 212:外側面 21A:反射區域 22:反射層狀結構 23:反射層 231:穿孔 A:中心圓圈區域 B:圓圈區域 C:長條區域 D:厚度 G:間隙 P:距離 H:高度 OD:外徑 W:寬度 Q:位置 100: direct type backlight device 1: light source seat 11: Circuit board 12: Reflecting cup structure 121: reflective cavity 122: reflective surface 123: Arc section 124: container 13: Light emitting unit 13A: Top light emitting surface 13B: Ring light emitting surface 131: Light emitting diode 1311: top surface 1312: Side 132: Semi-reflective parts 133: Translucent body 134: adapter board 2: reflective sheet 21: substrate 211: Inner side 212: Outer side 21A: reflective area 22: reflective layered structure 23: reflective layer 231: Piercing A: Central circle area B: Circle area C: Long area D: thickness G: gap P: distance H: height OD: outer diameter W: width Q: Location

圖1顯示為本創作的直下式背光裝置的第一實施例的側面示意圖。FIG. 1 shows a schematic side view of a first embodiment of a direct-type backlight device of the present invention.

圖2顯示為本創作的直下式背光裝置的第一實施例的反射杯結構、發光單元及局部的反射片體的側面示意圖。FIG. 2 shows a schematic side view of a reflective cup structure, a light emitting unit, and a partial reflective sheet body of the first embodiment of the direct-type backlight device of the present invention.

圖3顯示為本創作的直下式背光裝置的第一實施例的反射杯結構的俯視示意圖。FIG. 3 shows a schematic top view of the reflective cup structure of the first embodiment of the direct-lit backlight device of the present invention.

圖4為圖3的局部放大示意圖。FIG. 4 is a partially enlarged schematic diagram of FIG. 3.

圖5顯示為本創作的直下式背光裝置的第一實施例的單一個發光單元的立體示意圖。FIG. 5 shows a schematic perspective view of a single light-emitting unit of the first embodiment of the direct-type backlight device of the present invention.

圖6顯示為本創作的直下式背光裝置的第一實施例的反射片體的一側面的正視圖。FIG. 6 shows a front view of one side of the reflective sheet body of the first embodiment of the direct-type backlight device of the present invention.

圖7顯示本創作的直下式背光裝置的第一實施例的反射片體的單一個反射區域的正視圖。7 shows a front view of a single reflection area of the reflection sheet body of the first embodiment of the direct-type backlight device of the present invention.

圖8顯示為本創作的直下式背光裝置的第一實施例的反射片體的立體示意圖。FIG. 8 shows a perspective schematic view of the reflective sheet body of the first embodiment of the direct-type backlight device of the present invention.

圖9顯示為本創作的直下式背光裝置的第二實施例的反射片體的一側面的正視圖。FIG. 9 shows a front view of a side surface of the reflective sheet body of the second embodiment of the direct-type backlight device of the present invention.

圖10顯示為本創作的直下式背光裝置的第二實施例的反射片體的立體示意圖。FIG. 10 is a schematic perspective view of a reflective sheet of a second embodiment of a direct-type backlight device of the present invention.

圖11顯示本創作的直下式背光裝置的第二實施例的反射片體的單一個反射區域的正視圖。FIG. 11 shows a front view of a single reflection area of the reflection sheet body of the second embodiment of the direct-type backlight device of the present invention.

圖12顯示為本創作的直下式背光裝置的第三實施例的側面示意圖。FIG. 12 shows a schematic side view of a third embodiment of the direct-type backlight device of the present invention.

圖13顯示為本創作的直下式背光裝置的第四實施例的側面示意圖。FIG. 13 shows a schematic side view of the fourth embodiment of the direct-type backlight device of the present invention.

圖14顯示為本創作的直下式背光裝置的第五實施例的側面示意圖。FIG. 14 shows a schematic side view of a fifth embodiment of the direct-type backlight device of the present invention.

圖15顯示為本創作的直下式背光裝置的第六實施例的側面示意圖。FIG. 15 shows a schematic side view of the sixth embodiment of the direct-type backlight device of the present invention.

1:光源座 1: light source seat

11:電路板 11: Circuit board

12:反射杯結構 12: Reflecting cup structure

121:反射腔 121: reflective cavity

122:反射面 122: reflective surface

123:弧狀區段 123: Arc section

124:容槽 124: container

13:發光單元 13: Light emitting unit

13A:頂發光面 13A: Top light emitting surface

13B:環發光面 13B: Ring light emitting surface

131:發光二極體 131: Light emitting diode

132:半反射件 132: Semi-reflective parts

133:透光體 133: Translucent body

2:反射片體 2: reflective sheet

21:基材 21: substrate

211:內側面 211: Inner side

212:外側面 212: Outer side

22:反射層狀結構 22: reflective layered structure

D:厚度 D: thickness

G:間隙 G: gap

P:距離 P: distance

Claims (10)

一種直下式背光裝置，其包含： 一光源座，其包含： 一電路板； 多個反射杯結構，其固定設置於所述電路板的一側，各個所述反射杯結構相反於所述電路板的一側內凹形成有一反射腔； 多個發光單元，各個所述發光單元固定設置於所述電路板，且多個所述發光單元對應位於多個所述反射腔中；以及 一反射片體，其定義有多個反射區域，所述反射片體設置於所述光源座的上方，各個所述反射區域對應位於各個所述反射杯結構的正上方，且各個所述反射區域的中心對應位於所述發光單元的中心的上方，所述反射片體包含： 一基材； 多個反射層狀結構，其形成於所述基材的一寬側面，且多個所述反射層狀結構分布於多個所述反射區域內，各個所述反射層狀結構能反射所述光源座所發出的光束；於各個所述反射區域內的多個所述反射層狀結構，越鄰近於所述反射區域的中心越密集地排列，越鄰近於所述反射區域的邊線越密集地排列，越鄰近於所述反射區域的邊角越密集地排列； 其中，形成各個所述反射腔的側壁為一反射面，各個所述反射腔的所述反射面，能反射相對應的所述發光單元所發出的部份光束。 A direct type backlight device, including: A light source holder, which contains: A circuit board; A plurality of reflective cup structures are fixedly arranged on one side of the circuit board, and each of the reflective cup structures is concavely formed on a side opposite to the circuit board to form a reflective cavity; A plurality of light emitting units, each of the light emitting units is fixedly disposed on the circuit board, and the plurality of light emitting units are correspondingly located in the plurality of reflective cavities; and A reflective sheet body, which defines a plurality of reflective areas, the reflective sheet body is disposed above the light source holder, each of the reflective areas is located directly above each of the reflective cup structures, and each of the reflective areas The center of is located above the center of the light-emitting unit, and the reflective sheet body includes: A substrate A plurality of reflective layered structures are formed on a wide side of the substrate, and the plurality of reflective layered structures are distributed in the plurality of reflective regions, and each of the reflective layered structures can reflect the light source Light beams emitted by the pedestal; the plurality of reflective layered structures in each of the reflective areas are arranged denser as they are closer to the center of the reflective area, and as densely arranged as possible as they are closer to the edges of the reflective area , The closer to the corners of the reflective area the denser the arrangement; Wherein, the side wall forming each of the reflecting cavities is a reflecting surface, and the reflecting surface of each of the reflecting cavities can reflect part of the light beams emitted by the corresponding light-emitting unit. 如請求項1所述的直下式背光裝置，其中，所述光源座的各個所述反射杯結構內凹形成有所述反射腔的一側與所述反射片體之間形成有一間隙，所述間隙的距離不大於2公釐(mm)。The direct type backlight device according to claim 1, wherein a gap is formed between one side of the reflective cup structure of the light source holder in which the reflective cavity is formed and the reflective sheet body, the The distance of the gap is not more than 2 mm (mm). 如請求項1所述的直下式背光裝置，其中，所述基材彼此相反的兩個寬側面皆形成有多個所述層狀反射結構，所述光源座所發出的光束通過所述基材的穿透率大於80%。The direct type backlight device according to claim 1, wherein the two wide side surfaces of the substrate opposite to each other are formed with the plurality of layered reflective structures, and the light beam emitted by the light source holder passes through the substrate The penetration rate is greater than 80%. 如請求項1所述的直下式背光裝置，其中，各個所述反射區落在相對應的所述反射杯結構向所述反射片體的方向的正投影的投影區域內。The direct type backlight device according to claim 1, wherein each of the reflection areas falls within a projection area of the orthographic projection of the corresponding reflection cup structure in the direction of the reflection sheet body. 如請求項1所述的直下式背光裝置，其中，各個所述反射層狀結構為圓形，且各個所述反射層狀結構的外徑介於1微米(um)至500微米(um)；各個所述反射層狀結構的厚度介於0.05微米(um)至20微米(um)；所述反射片體的厚度介於0.1公釐(mm)至2公釐(mm)。The direct type backlight device according to claim 1, wherein each of the reflective layered structures is circular, and the outer diameter of each of the reflective layered structures is between 1 micrometer (um) and 500 micrometers (um); The thickness of each reflective layered structure is between 0.05 micrometers (um) and 20 micrometers (um); the thickness of the reflective sheet is between 0.1 millimeters (mm) and 2 millimeters (mm). 一種直下式背光裝置，其包含： 一光源座，其包含： 一電路板； 多個反射杯結構，其固定設置於所述電路板的一側，各個所述反射杯結構相反於所述電路板的一側內凹形成有一反射腔； 多個發光單元，各個所述發光單元固定設置於所述電路板，且多個所述發光單元對應位於多個所述反射腔中；以及 一反射片體，其定義有多個反射區域，所述反射片體設置於所述光源座的上方，各個所述反射區域對應位於各個所述反射杯結構的正上方，且各個所述反射區域的中心對應位於所述發光單元的中心的上方，所述反射片體包含： 一基材； 一反射層，其形成於所述基材的一寬側面，所述反射層能反射所述光源座所發出的光束；所述反射層包含多個穿孔，各個所述穿孔貫穿所述反射層，而所述基材的一部份能通過多個所述穿孔外露；多個所述穿孔分布於多個所述反射區域內；於各個所述反射區域內的多個所述穿孔，越遠離於所述反射區域的中心越密集地排列，越遠離於所述反射區域的邊線越密集地排列，越遠離於所述反射區域的邊角越密集地排列； 其中，形成各個所述反射腔的側壁為一反射面，各個所述反射腔的所述反射面，能反射相對應的所述發光單元所發出的部份光束。 A direct type backlight device, including: A light source holder, which contains: A circuit board; A plurality of reflective cup structures are fixedly arranged on one side of the circuit board, and each of the reflective cup structures is concavely formed on a side opposite to the circuit board to form a reflective cavity; A plurality of light emitting units, each of the light emitting units is fixedly disposed on the circuit board, and the plurality of light emitting units are correspondingly located in the plurality of reflective cavities; and A reflective sheet body, which defines a plurality of reflective areas, the reflective sheet body is disposed above the light source holder, each of the reflective areas is located directly above each of the reflective cup structures, and each of the reflective areas The center of is located above the center of the light-emitting unit, and the reflective sheet body includes: A substrate A reflective layer formed on a wide side of the substrate, the reflective layer can reflect the light beam emitted by the light source holder; the reflective layer includes a plurality of through holes, each of the through holes penetrates the reflective layer, A part of the substrate can be exposed through a plurality of the perforations; the plurality of the perforations are distributed in the plurality of reflection areas; the more the plurality of the perforations in each of the reflection areas, the farther away from The denser the centers of the reflective areas are, the denser the edges of the reflective areas are, and the denser the corners of the reflective areas are; Wherein, the side wall forming each of the reflecting cavities is a reflecting surface, and the reflecting surface of each of the reflecting cavities can reflect part of the light beams emitted by the corresponding light-emitting unit. 如請求項6所述的直下式背光裝置，其中，所述光源座的各個所述反射杯結構內凹形成有所述反射腔的一側與所述反射片體之間形成有一間隙，所述間隙的距離不大於2公釐(mm)。The direct type backlight device according to claim 6, wherein a gap is formed between one side of the reflective cup structure of the light source holder in which the reflective cavity is formed and the reflective sheet body, the The distance of the gap is not more than 2 mm (mm). 如請求項6所述的直下式背光裝置，其中，所述基材彼此相反的兩個寬側面皆形成有所述反射層，所述光源座所發出的光束通過所述基材的穿透率大於80%。The direct type backlight device according to claim 6, wherein the reflective layer is formed on two wide sides of the substrate opposite to each other, and the transmittance of the light beam emitted by the light source holder through the substrate More than 80%. 如請求項6所述的直下式背光裝置，其中，各個所述反射區落在相對應的所述反射杯結構向所述反射片體的方向的正投影的一投影區域內。The direct type backlight device according to claim 6, wherein each of the reflection areas falls within a projection area of the orthographic projection of the corresponding reflection cup structure in the direction of the reflection sheet body. 如請求項6所述的直下式背光裝置，其中，各個所述穿孔為圓形，且各個所述穿孔的外徑介於1微米(um)至500微米(um)；各個所述反射層狀結構的厚度介於0.05微米(um)至20微米(um)；所述反射片體的厚度介於0.1公釐(mm)至2公釐(mm)。The direct type backlight device according to claim 6, wherein each of the perforations is circular, and the outer diameter of each of the perforations is between 1 micrometer (um) and 500 micrometers (um); each of the reflective layers The thickness of the structure is between 0.05 micrometers (um) and 20 micrometers (um); the thickness of the reflective sheet is between 0.1 millimeters (mm) and 2 millimeters (mm).

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