TWM555109U - Machine rack cooling device - Google Patents
Machine rack cooling device Download PDFInfo
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- TWM555109U TWM555109U TW106215310U TW106215310U TWM555109U TW M555109 U TWM555109 U TW M555109U TW 106215310 U TW106215310 U TW 106215310U TW 106215310 U TW106215310 U TW 106215310U TW M555109 U TWM555109 U TW M555109U
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Abstract
本新型為一種機櫃冷卻裝置，其機櫃的本體內形成有相通的第一容室與第二容室，在該二容室前端部分別設有進氣口及排出口，在後端部形成有相通的氣流通道，該第二容室內設有一液體冷卻模組，該液體冷卻模組可與建築物內部所設置的空調冰水系統連接，使得在第一容室的熱氣流導引至第二容室並以液體冷卻模組予以降溫，使冷空氣可由進氣口再流入第一容室內進行對內部所安裝的伺服器模組進行散熱，具有可顯著降低能源使用效率值及可有效減少機櫃的體積等實用功效。The present invention is a cabinet cooling device, wherein a body of a first chamber and a second chamber are formed in a body of the cabinet, and an air inlet and a discharge port are respectively disposed at a front end portion of the two chambers, and a rear end portion is formed at the rear end portion. An air flow passage is provided, and a liquid cooling module is disposed in the second chamber, and the liquid cooling module is connected to an air conditioning ice water system disposed inside the building, so that the hot air flow in the first chamber is guided to the second The chamber is cooled by a liquid cooling module, so that the cold air can be flowed into the first chamber from the air inlet to dissipate heat to the internal server module, which can significantly reduce the energy efficiency value and effectively reduce the cabinet. The practical effect of the volume.
Description
本新型為一種冷卻設備，尤指可對機房內所設置之伺服器產生的高熱進行熱交換的機櫃冷卻裝置。The present invention is a cooling device, especially a cabinet cooling device that can exchange heat for high heat generated by a server provided in a machine room.
現有技術的建築物的機房可提供複數伺服器的設置，具體實施例在機房內設有機櫃，將複數個伺服器安裝設置在機櫃內，該機櫃的構造概略具有一高度且內部呈中空的容置空間，為了可有效的運用該容置空間，在該容置空間內間隔設有複數滑軌，在各該滑軌上可分別提供複數伺服器的固定安裝；當機櫃內所設置的各伺服器啟動運作時，將產生有大量的高熱，此時機櫃內部的溫度升高，若未能有效降溫則高熱將影響到各伺服器的運作效率，甚至造成伺服器無法運作使用。目前現有降溫方式通常為使用空調系統予以達成，例如，在機櫃所設置的建築物的機房內安裝冷氣機，使得該機房內的溫度經常保持低溫，如此可將伺服器的溫度控制在可正常運作的溫度，然此一方式將明顯的增加整個空調系統的負載。The equipment room of the prior art building can provide a plurality of servers. The specific embodiment has a cabinet in the equipment room, and a plurality of servers are installed in the cabinet. The structure of the cabinet has a height and a hollow interior. In order to effectively use the accommodating space, a plurality of slide rails are disposed in the accommodating space, and a fixed installation of the plurality of servers can be separately provided on each of the slide rails; and each servo set in the cabinet is provided When the device starts to operate, a large amount of high heat will be generated. At this time, the temperature inside the cabinet rises. If the temperature is not effectively lowered, the high heat will affect the operation efficiency of each server, and even cause the server to be inoperable. At present, the existing cooling mode is usually achieved by using an air conditioning system. For example, an air conditioner is installed in a machine room of a building provided in a cabinet, so that the temperature in the machine room is often kept low, so that the temperature of the server can be controlled to operate normally. The temperature, however, will significantly increase the load on the entire air conditioning system.
如圖3所示，現有技術為可更有效的對伺服器模組30進行降溫，是在機櫃40的中空狀本體41內且位在各伺服器模組30的熱氣排出位置處設有一降溫用的冷卻機構50，當各伺服器模組30所排出的熱氣與冷卻機構50的熱交換器接觸後，該空氣與熱交換器接觸並進行熱交換使空氣溫度降低，而低温空氣再提供各該伺服器模組30進行冷卻使用，而現有冷卻機構50為安裝在各伺服器模組30後方亦即為設置在機櫃40的本體41後方，為了可供冷卻機構50所需的各組件的配置安裝，然此一冷卻方式必須在機櫃40的本體41後方預留有一設置空間，此一空間的配置將使整個機櫃40的所需的面積及體積均大，進而影響到機房空間的使用率，均為現有技術所存在的問題及缺點。As shown in FIG. 3, in the prior art, the server module 30 can be cooled more effectively, and a cooling device is disposed in the hollow body 41 of the cabinet 40 and located at the hot gas discharge position of each server module 30. The cooling mechanism 50, after the hot gas discharged from each of the server modules 30 is in contact with the heat exchanger of the cooling mechanism 50, the air is in contact with the heat exchanger and exchanges heat to lower the air temperature, and the low temperature air is provided again. The server module 30 is used for cooling, and the existing cooling mechanism 50 is installed behind each of the server modules 30, that is, behind the body 41 of the cabinet 40, and is installed for the components required for the cooling mechanism 50. However, in this cooling mode, a space is required to be disposed behind the body 41 of the cabinet 40. The configuration of the space will increase the required area and volume of the entire cabinet 40, thereby affecting the usage rate of the equipment room. The problems and shortcomings of the prior art.
為了解決前述現有技術所存在的問題及缺點，本新型設置在機櫃的冷卻裝置，為使用液體冷卻方式，在機櫃上方設有冷卻盤管及風扇以進行熱交換降溫後的冷空氣可直接再進入機櫃內，以降低對原有空調系統的負載的實用目的。In order to solve the problems and shortcomings of the prior art mentioned above, the cooling device disposed in the cabinet is a liquid cooling method, and a cooling coil and a fan are arranged above the cabinet to perform heat exchange and the cold air can be directly re-entered. In the cabinet, to reduce the load on the original air conditioning system for practical purposes.
本新型為可達到前述的目的，所運用的技術手段在於提供一種機櫃冷卻裝置，其包括有一機櫃及一液體冷卻模組；該機櫃具有一本體，該本體為一中空體且內部區隔有一第一容室及一第二容室，該第二容室位在該第一容室上方，該本體的第一容室內的前端部設有複數進氣口並與該第一容室相通，在後端部形成有一氣流通道，本體的第一容室與第二容室之間且相對於該氣流通道設有一通孔；該液體冷卻模組至少具有一冷卻盤管及一風扇並設置在該第二容室內，在該第二容室的前端部設有複數排出口，各該排出口與該第二容室相通，該第二容室後端部相鄰於該通孔。The present invention is capable of achieving the foregoing objectives, and the technical means employed is to provide a cabinet cooling device including a cabinet and a liquid cooling module; the cabinet has a body, the body is a hollow body and the interior is separated by a first a chamber and a second chamber, the second chamber is located above the first chamber, the front end of the first chamber of the body is provided with a plurality of air inlets and communicates with the first chamber, An air flow passage is formed at the rear end portion, and a through hole is defined between the first chamber and the second chamber of the body and opposite to the air flow passage; the liquid cooling module has at least one cooling coil and a fan disposed thereon In the second chamber, a plurality of discharge ports are disposed at a front end portion of the second chamber, and each of the discharge ports is in communication with the second chamber, and a rear end portion of the second chamber is adjacent to the through hole.
所述之機櫃冷卻裝置，其中位在該第二容室的該冷卻盤管位在相鄰於該本體的前端部，該風扇位在相鄰於該本體的後端部。In the cabinet cooling device, the cooling coil located in the second chamber is located adjacent to a front end portion of the body, and the fan is located adjacent to a rear end portion of the body.
本新型運用前述的技術手段，在本體內形成有第一容室與第二容室且二容室的前端部分別設有相通的進氣口及排出口，在第一容室後端部形成有一與第二容室相通的氣流通道，該第二容室內設有一液體冷卻模組藉以將第一容室所產生的熱氣流予以導引並予以降溫，使冷空氣可再經由進氣口流入第一容室內部，又由於該液體冷卻模組可與建築物內部所設置的空調冰水系統連接，而具有可明顯的降低能源使用效率(PUE, Power Usage Effectiveness)值，再者將該液體冷卻模組設置在本體上方的第二容室內，可使機櫃佔用機房內部的地坪面積減小等實用功效。According to the above technical means, the first chamber and the second chamber are formed in the body, and the front end portions of the two chambers are respectively provided with communicating air inlets and discharge ports, and are formed at the rear end portion of the first chamber. An air flow passage communicating with the second chamber, wherein the second chamber is provided with a liquid cooling module for guiding and cooling the hot air generated by the first chamber, so that the cold air can flow through the air inlet The first chamber has a liquid cooling module that can be connected to the air conditioning ice water system installed in the building, and has a significantly lower energy use efficiency (PUE) value. The cooling module is disposed in the second chamber above the body, so that the cabinet occupies a practical effect of reducing the floor area inside the machine room.
參看圖1及圖2所示，本新型為一種機櫃冷卻裝置，其包括有一機櫃10及一液體冷卻模組20；1 and 2, the present invention is a cabinet cooling device, comprising a cabinet 10 and a liquid cooling module 20;
該機櫃10具有一本體11，該本體11為中空體，其內部至少可區隔具有一第一容室12及一第二容室13，其中該第二容室13位在該第一容室12上方，在該本體11的前端部設有複數進氣口14，各該進氣口14與該第一容室12相通，該第一容室12內且相鄰於各該進氣口14位置間隔設有複數隔板（圖中未示），在各該隔板上可供設有伺服器模組30，各該伺服器模組30的前方與該進氣口14相鄰，又各該伺服器模組30的後方與該本體11後端部的第一容室12內形成有一氣流通道16，在本體11的第一容室12與第二容室13之間且相對於該氣流通道16設有一通孔17，該通孔17可使該第一容室12與該第二容室13相互連通，且該第二容室13後端部為相鄰於該通孔。The cabinet 10 has a body 11 which is a hollow body, and the interior thereof is at least separated by a first chamber 12 and a second chamber 13 , wherein the second chamber 13 is located in the first chamber A plurality of air inlets 14 are disposed at a front end of the body 11 , and the air inlets 14 are communicated with the first chamber 12 , and the first chambers 12 are adjacent to the air inlets 14 . A plurality of partition plates (not shown) are disposed at the position interval, and a server module 30 is disposed on each of the partition plates, and the front of each of the server modules 30 is adjacent to the air inlet 14 and each An air flow passage 16 is formed in the rear of the server module 30 and the first chamber 12 at the rear end portion of the body 11 between the first chamber 12 and the second chamber 13 of the body 11 and opposite to the air flow. The passage 16 is provided with a through hole 17 for allowing the first chamber 12 and the second chamber 13 to communicate with each other, and the rear end of the second chamber 13 is adjacent to the through hole.
該液體冷卻模組20設置在該第二容室13內，其至少具有一冷卻盤管21及一風扇22，該第二容室13在該本體11的前端部設有複數排出口15，各該排出口15與該第二容室13相通，該冷卻盤管21位在相鄰於該本體11的前端部，該風扇22位在相鄰於該本體11的後端部，該風扇22與該通孔17及氣流通道16相通並將所產生的氣流朝向該冷卻盤管21吹送。The liquid cooling module 20 is disposed in the second chamber 13 and has at least one cooling coil 21 and a fan 22. The second chamber 13 is provided with a plurality of discharge ports 15 at the front end of the body 11. The discharge port 15 is in communication with the second chamber 13 . The cooling coil 21 is located adjacent to the front end of the body 11 . The fan 22 is located adjacent to the rear end of the body 11 . The fan 22 is The through hole 17 and the air flow passage 16 communicate with each other and the generated air current is blown toward the cooling coil 21.
該液體冷卻模組20的冷卻盤管21的管口可分別與一空調冰水系統之供水端與回水端以管路相互連接，例如，與建築物內部所設置的空調冰水系統連接，即該水冷模組的空調冰水系統將降溫後的液體以管路連接導入該冷卻盤管21的進水管口，該風扇22將空氣氣流朝向該冷卻盤管21吹送，該空氣溫度即可降低，此時冷空氣由該本體11的排出口15送出，將可再經進氣口14進入伺服器模組30，以提供對運作中的各該伺服器模組30進行散熱，又吸收熱量的空氣將被輸出至該本體11後端部的氣流通道16處，此時熱氣流將向上流動及受到風扇22運作中所形成的循環氣流而受到該冷卻盤管21的降溫；The nozzles of the cooling coils 21 of the liquid cooling module 20 can be respectively connected to the water supply end and the return water end of an air conditioning ice water system by a pipeline, for example, connected to an air conditioning ice water system installed in the building. That is, the air-conditioning chilled water system of the water-cooling module introduces the cooled liquid into the water inlet port of the cooling coil 21 by a pipeline connection, and the fan 22 blows the air flow toward the cooling coil 21, and the air temperature can be lowered. At this time, the cold air is sent out from the discharge port 15 of the body 11 and can enter the server module 30 through the air inlet 14 to provide heat dissipation for each of the server modules 30 in operation and absorb heat. The air will be output to the airflow passage 16 at the rear end of the body 11, and the hot airflow will flow upward and be cooled by the circulating airflow formed in the operation of the fan 22 by the cooling coil 21;
由於各該伺服器模組30所產生的高熱空氣係經由該液體冷卻模組20予以降溫，因此僅需在機櫃10內設有該冷卻盤管21及該風扇22即可，整體機櫃10所需的設置面積尺寸較小。更重要本新型的創作將可大幅降低機房內的空調冷卻系統所需使用的電力可大幅減少，亦即可顯著降低能源使用效率(PUE, Power Usage Effectiveness)值。Since the high-heat air generated by each of the server modules 30 is cooled by the liquid cooling module 20, the cooling coil 21 and the fan 22 need only be disposed in the cabinet 10, and the entire cabinet 10 is required. The set area size is small. More importantly, the creation of this new model will greatly reduce the power required for the air conditioning cooling system in the equipment room, and can significantly reduce the energy usage effectiveness (PUE) value.
10‧‧‧機櫃
11‧‧‧本體
12‧‧‧第一容室
13‧‧‧第二容室
14‧‧‧進氣口
15‧‧‧排出口
16‧‧‧氣流通道
17‧‧‧通孔
20‧‧‧液體冷卻模組
21‧‧‧冷卻盤管
22‧‧‧風扇
30‧‧‧伺服器模組
40‧‧‧機櫃
41‧‧‧本體
50‧‧‧冷卻機構10‧‧‧ cabinet
11‧‧‧Ontology
12‧‧‧First room
13‧‧‧Second room
14‧‧‧air inlet
15‧‧‧Export
16‧‧‧Air passage
17‧‧‧through hole
20‧‧‧Liquid cooling module
21‧‧‧Cooling coil
22‧‧‧Fan
30‧‧‧Server Module
40‧‧‧ cabinet
41‧‧‧Ontology
50‧‧‧Cooling mechanism
圖1為本新型的外觀立體示意圖。 圖2為本新型實施狀態示意圖。 圖3為現有技術之機櫃與冷卻機構的設置示意圖。Figure 1 is a perspective view showing the appearance of the present invention. Figure 2 is a schematic view of the state of the present invention. 3 is a schematic view showing the arrangement of a cabinet and a cooling mechanism of the prior art.
10‧‧‧機櫃 10‧‧‧ cabinet
11‧‧‧本體 11‧‧‧Ontology
12‧‧‧第一容室 12‧‧‧First room
13‧‧‧第二容室 13‧‧‧Second room
14‧‧‧進氣口 14‧‧‧air inlet
15‧‧‧排出口 15‧‧‧Export
16‧‧‧氣流通道 16‧‧‧Air passage
17‧‧‧通孔 17‧‧‧through hole
21‧‧‧冷卻盤管 21‧‧‧Cooling coil
22‧‧‧風扇 22‧‧‧Fan
30‧‧‧伺服器模組 30‧‧‧Server Module
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106215310U TWM555109U (en) | 2017-10-18 | 2017-10-18 | Machine rack cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106215310U TWM555109U (en) | 2017-10-18 | 2017-10-18 | Machine rack cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM555109U true TWM555109U (en) | 2018-02-01 |
Family
ID=62015258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106215310U TWM555109U (en) | 2017-10-18 | 2017-10-18 | Machine rack cooling device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM555109U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108673093A (en) * | 2018-04-10 | 2018-10-19 | 江苏聚泰科技有限公司 | A kind of pressurize shaping equipment of mobile fingerprint module |
| TWD194977S (en) | 2018-02-12 | 2018-12-21 | 大陸商大族激光科技產業集團股份有限公司 | Cabinet air conditioner |
| CN110139533A (en) * | 2018-02-09 | 2019-08-16 | 夏敬懿 | Cabinet |
-
2017
- 2017-10-18 TW TW106215310U patent/TWM555109U/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139533A (en) * | 2018-02-09 | 2019-08-16 | 夏敬懿 | Cabinet |
| TWD194977S (en) | 2018-02-12 | 2018-12-21 | 大陸商大族激光科技產業集團股份有限公司 | Cabinet air conditioner |
| CN108673093A (en) * | 2018-04-10 | 2018-10-19 | 江苏聚泰科技有限公司 | A kind of pressurize shaping equipment of mobile fingerprint module |
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