TWM545890U - Heat conduction structure - Google Patents
Heat conduction structure Download PDFInfo
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- TWM545890U TWM545890U TW106205266U TW106205266U TWM545890U TW M545890 U TWM545890 U TW M545890U TW 106205266 U TW106205266 U TW 106205266U TW 106205266 U TW106205266 U TW 106205266U TW M545890 U TWM545890 U TW M545890U
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Description
本創作係有關一種導熱技術，尤指一種導熱結構。This creation relates to a heat transfer technique, especially a heat transfer structure.
隨著電子元件的運算速度不斷提昇，其所產生的熱量亦越來越高，為了有效地解決此高發熱量的問題，業界已將具有良好導熱特性的熱管(Heat Pipe)和均溫板(Vapor Chamber)進行廣泛性的使用，其中熱管雖然具有讓內部的氣態工作流體的流向性一致，但因為體積的拘限導致其所能傳導的熱量相當有限，另均溫板雖具有寬敞的受熱面積來提供給發熱源直接貼附傳導，但其氣態工作流體的流向相當的紊亂，如此皆將限制其導散熱效能。As the computing speed of electronic components continues to increase, the heat generated by them is getting higher and higher. In order to effectively solve this problem of high heat generation, the heat pipe and the temperature equalizing plate (Vapor) with good thermal conductivity are already available in the industry. Chamber) is widely used, in which the heat pipe has the same flow direction of the internal working fluid, but the heat that can be transmitted is limited due to the limitation of the volume, and the temperature plate has a spacious heating area. The heat source is directly attached to the conduction, but the flow of the gaseous working fluid is quite disordered, which will limit the heat dissipation performance.
業界為了解決前述所存在的問題點，已將熱管和均溫板加以組接而形成一導熱結構，其製程步驟大致如下:首先對均溫板的一殼板與熱管進行焊接組合，其次是***芯棒並且填入金屬粉末後，再送入加熱設備中做燒結加工，繼之再將芯棒從熱管中拔出，最後再與均溫板的另一殼板進行密接封合等後續製程，進而完成一導熱結構。In order to solve the above problems, the heat pipe and the temperature equalizing plate have been assembled to form a heat conducting structure. The process steps are as follows: first, the welding of a shell plate and a heat pipe of the temperature equalizing plate is performed, followed by insertion. After the core rod is filled with the metal powder, it is sent to the heating device for sintering processing, and then the core rod is pulled out from the heat pipe, and finally, the other shell plate of the temperature equalizing plate is closely sealed and sealed, and the subsequent process is further performed. Complete a thermal structure.
然而，習知導熱結構，雖然具有導散熱效能，但卻存在有以下的問題點，由於其製作過程相當繁雜，而不利於大量化的製造生產。另由於其芯棒是伸入熱管的底端(封閉端)，在完成燒結加工後，芯棒不易從熱管中被抽拔出來。且芯棒是與毛細組織做大面積的黏著，在芯棒抽拔過程中極易對毛細組織造成損傷或崩裂等不良情況，進而導致產品的製作良率不高，亟待加以改善者。However, the conventional heat-conducting structure has the following problems in terms of heat dissipation performance, and the manufacturing process is rather complicated, which is not advantageous for mass production. In addition, since the core rod extends into the bottom end (closed end) of the heat pipe, the core rod is not easily extracted from the heat pipe after the sintering process is completed. Moreover, the mandrel is adhered to the capillary tissue in a large area, and it is easy to cause damage or cracking of the capillary structure during the extraction process of the mandrel, and the production yield of the product is not high, and it is urgent to be improved.
本創作之一目的，在於提供一種導熱結構，其藉由均溫板與熱管的各別製作，再將熱管直接插接於均溫板，進而提昇製作的容易度且適用於大量的快速生產。One of the aims of the present invention is to provide a heat-conducting structure which is separately fabricated by a temperature equalizing plate and a heat pipe, and then directly inserted into the temperature equalizing plate, thereby improving the ease of manufacture and being suitable for mass production.
為了達成上述之目的，本創作係提供一種導熱結構，包括一均溫板、一熱管及一工作流體，該均溫板包括一上殼體及對應該上殼體密接封合的一下殼體，在該下殼體和該上殼體之間形成有一容腔，該上殼體開設有連通該容腔的一穿孔，在該上殼體內表面鋪設有一第一毛細組織，該第一毛細組織在對應該穿孔位置開設有一通孔；該熱管包括一管體及一第二毛細組織，該第二毛細組織設於該管體內並且延伸出該管體外部而形成有一裸露段，該熱管穿接該穿孔，該裸露段則穿過該通孔以與該第一毛細組織貼接；該工作流體填注在該容腔內。In order to achieve the above object, the present invention provides a heat conducting structure comprising a temperature equalizing plate, a heat pipe and a working fluid, the temperature equalizing plate comprising an upper casing and a lower casing corresponding to the upper casing and the outer casing. A cavity is formed between the lower casing and the upper casing, the upper casing is provided with a through hole communicating with the cavity, and a first capillary structure is disposed on the inner surface of the upper casing, and the first capillary structure is a through hole is defined in the corresponding perforation position; the heat pipe includes a tube body and a second capillary structure, the second capillary structure is disposed in the tube body and extends outside the tube body to form a bare section, the heat pipe is connected to the tube The perforated portion passes through the through hole to adhere to the first capillary structure; the working fluid is filled in the cavity.
本創作還具有以下功效，利用第一毛細組織和第二毛細組織接觸進而提昇工作流體的回流速度。藉由通孔的分割線設置，使得通孔的緣邊易於產生彎曲變形，利於裸露段的穿過並且達成較大面積的貼附接觸。The present invention also has the following effects, which utilizes the contact of the first capillary structure and the second capillary structure to increase the reflow speed of the working fluid. By the dividing line of the through hole, the edge of the through hole is prone to bending deformation, which facilitates the passage of the bare section and achieves a large area of the attaching contact.
有關本創作之詳細說明及技術內容，配合圖式說明如下，然而所附圖式僅提供參考與說明用，並非用來對本創作加以限制者。The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.
請參閱圖1至圖3所示，本創作提供一種導熱結構，其主要包括一均溫板(Vapor Chamber)10、一熱管(Heat Pipe)20及一工作流體30。Referring to FIGS. 1 to 3, the present disclosure provides a heat conducting structure that mainly includes a Vapor Chamber 10, a Heat Pipe 20, and a working fluid 30.
均溫板10包括一上殼體11及一下殼體12，上殼體11和下殼體12皆可為鋁、銅或其合金所製成，以一成型模具(圖未示出)對上殼體11進行沖設加工，從而在上殼體11上形成有複數穿孔111，穿孔111的數量可依實際需求來進行選用，對於微型散熱器亦可以單一穿孔111來進行設置。The temperature equalizing plate 10 includes an upper casing 11 and a lower casing 12, and both the upper casing 11 and the lower casing 12 may be made of aluminum, copper or an alloy thereof, and are formed by a molding die (not shown). The housing 11 is subjected to a punching process, so that a plurality of through holes 111 are formed in the upper casing 11. The number of the through holes 111 can be selected according to actual needs, and the micro heat sink can also be provided with a single through hole 111.
在上殼體11內表面鋪設有一第一毛細組織13，第一毛細組織13可為一金屬編織網，以一成型模具(圖未示出)對第一毛細組織13進行沖孔加工，從而在第一毛細組織13上形成有複數通孔131，此通孔131的數量是對應於前述的穿孔111做設置，且通孔131的內緣直徑小於穿孔111的內緣直徑。將第一毛細組織13的通孔131對正於上殼體11的穿孔111做鋪設，並且透過焊接或固著等方式，使第一毛細組織13穩固地結合於上殼體11的內表面。A first capillary structure 13 is laid on the inner surface of the upper casing 11. The first capillary structure 13 can be a metal woven mesh, and the first capillary structure 13 is punched by a molding die (not shown). The first capillary structure 13 is formed with a plurality of through holes 131. The number of the through holes 131 is set corresponding to the aforementioned through holes 111, and the inner edge diameter of the through holes 131 is smaller than the inner edge diameter of the through holes 111. The through hole 131 of the first capillary structure 13 is laid against the through hole 111 of the upper casing 11, and the first capillary structure 13 is firmly bonded to the inner surface of the upper casing 11 by welding or fixing.
進一步地，在通孔131的中心線上開設有複數分割線132，此等分割線132大致呈「十」字交叉狀，利於通孔131的緣邊易於產生彎曲變形。Further, a plurality of dividing lines 132 are formed on the center line of the through hole 131, and the dividing lines 132 are substantially in a "ten" shape, which facilitates bending deformation of the edge of the through hole 131.
下殼體12已預先加工形成有一空腔和佈設在空腔內部的一第三毛細組織14，此第三毛細組織14可為金屬編織網、多孔性粉末燒結物或槽溝等，將此下殼體12對應於前述上殼體11進行焊接封合，從而在上殼體11和下殼體12之間形成有一容腔A。The lower casing 12 has been pre-formed to form a cavity and a third capillary structure 14 disposed inside the cavity. The third capillary structure 14 may be a metal woven mesh, a porous powder sinter or a groove, etc. The housing 12 is welded and sealed corresponding to the aforementioned upper housing 11, so that a cavity A is formed between the upper housing 11 and the lower housing 12.
熱管20的數量與前述的穿孔111和通孔131的數量相同，每一熱管20包括一管體21及一第二毛細組織22，第二毛細組織22佈設在管體21內部並且延伸出管體21外部而形成有一裸露段221；管體21具有一開口端211及一封閉端212，第二毛細組織22可為一金屬編織網、一多孔性粉末燒結物或一槽溝，其是從管體21的封閉端212一直延伸到開口端211進行佈設，且第二毛細組織22延伸出管體21的開口端211外部而形成有一裸露段221，其中通孔131的內緣直徑小於裸露段221的外緣直徑。The number of the heat pipes 20 is the same as the number of the through holes 111 and the through holes 131. Each heat pipe 20 includes a pipe body 21 and a second capillary structure 22, and the second capillary structure 22 is disposed inside the pipe body 21 and extends out of the pipe body. 21 is formed with a bare section 221; the tubular body 21 has an open end 211 and a closed end 212, and the second capillary structure 22 can be a metal woven mesh, a porous powder sinter or a groove, which is The closed end 212 of the tubular body 21 extends to the open end 211 for deployment, and the second capillary structure 22 extends outside the open end 211 of the tubular body 21 to form a bare section 221, wherein the inner diameter of the through hole 131 is smaller than the exposed section The outer diameter of the 221 is.
組合時係將具有裸露段221的熱管20一端對正於上殼體11的穿孔111做穿接並且以焊接方式進行封合，由於通孔131的內緣直徑小於裸露段221的外緣直徑，在熱管20的裸露段221穿經通孔131時，將使通孔131的緣邊產生彎曲變形，並與裸露段221的外表面相互疊接。In combination, one end of the heat pipe 20 having the bare section 221 is pierced to the through hole 111 of the upper casing 11 and is welded in a welded manner. Since the diameter of the inner edge of the through hole 131 is smaller than the diameter of the outer edge of the exposed section 221, When the exposed portion 221 of the heat pipe 20 passes through the through hole 131, the edge of the through hole 131 is bent and deformed, and overlaps with the outer surface of the exposed portion 221 .
工作流體30係可為水等液體，將工作流體30填入腔室A內，並進行除氣、封口等加工步驟，進而完成本創作導熱結構的製作。The working fluid 30 can be a liquid such as water, fill the working fluid 30 into the chamber A, and perform processing steps such as degassing and sealing, thereby completing the fabrication of the heat-conducting structure of the present invention.
綜上所述，本創作之導熱結構，確可達到預期之使用目的，而解決習知之缺失，又因極具新穎性及進步性，完全符合新型專利申請要件，爰依專利法提出申請，敬請詳查並賜准本案專利，以保障創作人之權利。In summary, the heat-conducting structure of the creation can achieve the intended purpose of use, and solve the lack of conventional knowledge, and because of its novelty and progress, it fully meets the requirements of the new patent application, and applies for the application according to the patent law. Please check and grant the patent in this case to protect the rights of the creator.
10‧‧‧均溫板10‧‧‧Wall plate
11‧‧‧上殼體11‧‧‧Upper casing
111‧‧‧穿孔111‧‧‧Perforation
12‧‧‧下殼體12‧‧‧ Lower case
121‧‧‧底板121‧‧‧floor
122‧‧‧圍板122‧‧‧
13‧‧‧第一毛細組織13‧‧‧First capillary tissue
131‧‧‧通孔131‧‧‧through hole
132‧‧‧分割線132‧‧‧ dividing line
14‧‧‧第三毛細組織14‧‧‧ Third capillary tissue
A‧‧‧容腔A‧‧‧ cavity
20‧‧‧熱管20‧‧‧heat pipe
21‧‧‧管體21‧‧‧ tube body
211‧‧‧開口端211‧‧‧Open end
212‧‧‧封閉端212‧‧‧closed end
22‧‧‧第二毛細組織22‧‧‧Second capillary tissue
221‧‧‧裸露段221‧‧‧Exposed section
30‧‧‧工作流體30‧‧‧Working fluid
圖1 係本創作導熱結構的立體分解圖。Figure 1 is an exploded perspective view of the heat transfer structure of the present invention.
圖2 係本創作導熱結構的組合外觀圖。Figure 2 is a combined appearance of the heat-conducting structure of the present invention.
圖3 係圖2之3-3剖視圖。Figure 3 is a cross-sectional view taken along line 3-3 of Figure 2.
10‧‧‧均溫板 10‧‧‧Wall plate
11‧‧‧上殼體 11‧‧‧Upper casing
111‧‧‧穿孔 111‧‧‧Perforation
12‧‧‧下殼體 12‧‧‧ Lower case
121‧‧‧底板 121‧‧‧floor
122‧‧‧圍板 122‧‧‧
13‧‧‧第一毛細組織 13‧‧‧First capillary tissue
131‧‧‧通孔 131‧‧‧through hole
132‧‧‧分割線 132‧‧‧ dividing line
14‧‧‧第三毛細組織 14‧‧‧ Third capillary tissue
A‧‧‧容腔 A‧‧‧ cavity
20‧‧‧熱管 20‧‧‧heat pipe
21‧‧‧管體 21‧‧‧ tube body
22‧‧‧第二毛細組織 22‧‧‧Second capillary tissue
221‧‧‧裸露段 221‧‧‧Exposed section
30‧‧‧工作流體 30‧‧‧Working fluid
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106205266U TWM545890U (en) | 2017-04-14 | 2017-04-14 | Heat conduction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106205266U TWM545890U (en) | 2017-04-14 | 2017-04-14 | Heat conduction structure |
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| Publication Number | Publication Date |
|---|---|
| TWM545890U true TWM545890U (en) | 2017-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106205266U TWM545890U (en) | 2017-04-14 | 2017-04-14 | Heat conduction structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM545890U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109780903A (en) * | 2017-11-10 | 2019-05-21 | 双鸿电子科技工业(昆山)有限公司 | Radiator |
-
2017
- 2017-04-14 TW TW106205266U patent/TWM545890U/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109780903A (en) * | 2017-11-10 | 2019-05-21 | 双鸿电子科技工业(昆山)有限公司 | Radiator |
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