TWM539147U - Action device - Google Patents
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- TWM539147U TWM539147U TW105216559U TW105216559U TWM539147U TW M539147 U TWM539147 U TW M539147U TW 105216559 U TW105216559 U TW 105216559U TW 105216559 U TW105216559 U TW 105216559U TW M539147 U TWM539147 U TW M539147U
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Description
本創作係關於一種分離設備，尤指一種可用於劈裂製程之分離設備之作用裝置。 This creation relates to a separation device, and more particularly to a device for use in a separation device for a cleaving process.
習知半導體製程中，晶圓於製造完成後，會進行薄化製程、切單製程、封裝製程等，其中，切單製程之方式繁多，例如、雷射切割、機械切割、劈裂分離等。 In the conventional semiconductor process, after the wafer is manufactured, the thinning process, the singulation process, the packaging process, and the like are performed. Among them, the singulation process is various, for example, laser cutting, mechanical cutting, splitting and the like.
如第1A及1B圖所示，習知劈裂式分離設備1係包括：一機台本體(圖略)、一設於該機台本體下側之基座10、一設於該機台本體上側之劈裂裝置12、以及一設於該基座10上之貼膜13。 As shown in FIGS. 1A and 1B, the conventional splitting and separating apparatus 1 includes: a machine body (not shown), a base 10 disposed on a lower side of the machine body, and a base disposed on the machine body. The upper side splitting device 12 and a film 13 disposed on the base 10.
於進行劈裂作業時，先將一具有複數預切割道80的晶圓8黏貼於該貼膜13上，再將該劈裂裝置12之劈刀120對位於其中一預切割道80上，並利用該劈裂裝置12之震動件121撞擊該劈刀120，使該劈刀120碰觸該晶圓8對應該預切割道80之背面位置A，以令該晶圓8沿該預切割道80裂開(如裂痕S)。之後重複上述該劈裂裝置12之劈裂步驟，以於該晶圓8背面之直向與橫向上劈裂各該預切割道80，使該晶圓8分離成複數晶粒8a。 For performing the splitting operation, a wafer 8 having a plurality of pre-cutting streets 80 is first adhered to the film 13, and the boring tool 120 of the splitting device 12 is placed on one of the pre-cutting streets 80, and utilized. The vibrating member 121 of the splitting device 12 strikes the boring tool 120, so that the boring tool 120 touches the wafer 8 corresponding to the back position A of the pre-cutting path 80, so that the wafer 8 is cracked along the pre-cutting path 80. Open (such as crack S). Then, the cleaving step of the cleaving device 12 is repeated to split the pre-cutting streets 80 in the straight direction and the lateral direction of the back surface of the wafer 8, so that the wafer 8 is separated into a plurality of crystal grains 8a.
習知劈裂裝置12中，如第1C圖所示，該震動件121 係包括一內壁具有電磁線圈122a之殼體122、設於該殼體122中之擊針121a、及套設於該擊針121a後端的彈簧123。於進行劈裂作業時，將該電磁線圈122a通電以帶動該擊針121a向下錘擊該劈刀120，同時帶動該彈簧123產生形變。之後藉由該彈簧123帶動該擊針121a回復至初始位置。 In the conventional splitting device 12, as shown in FIG. 1C, the vibrating member 121 The utility model comprises a casing 122 having an electromagnetic coil 122a on the inner wall, a pin 121a disposed in the casing 122, and a spring 123 sleeved on the rear end of the pin 121a. When the splitting operation is performed, the electromagnetic coil 122a is energized to drive the firing pin 121a to hammer the boring tool 120 downward, and the spring 123 is driven to deform. The needle 121a is then brought back to the initial position by the spring 123.
然而，習知劈裂式分離設備中，該擊針121a係設於具有該電磁線圈122a之殼體122中，且因該殼體122與該擊針121a之間具有間隙t，因而不易控制該擊針121a相對該殼體122的同心度，故當該擊針121a透過該彈簧123回復至原始位置時，該擊針121a容易傾斜(如第1D圖所示),致使後續該擊針121a再次錘擊該劈刀120時，該擊針121a會與該殼體122發生摩擦，不僅會產生粉塵而汙損該晶圓8，且會影響敲擊力道而無法有效劈裂該晶圓8。 However, in the conventional splitting type separation device, the pin 121a is provided in the casing 122 having the electromagnetic coil 122a, and since there is a gap t between the casing 122 and the pin 121a, it is difficult to control the pin. The concentricity of the pin 121a with respect to the housing 122 is such that when the pin 121a is returned to the original position by the spring 123, the pin 121a is easily tilted (as shown in FIG. 1D), so that the subsequent pin 121a is again When the boring tool 120 is hammered, the stylus 121a rubs against the casing 122, which not only generates dust but stains the wafer 8, but also affects the striking force and does not effectively crack the wafer 8.
因此，如何克服習知技術之種種問題，實為一重要課題。 Therefore, how to overcome various problems of the prior art is an important issue.
為解決上述習知技術之問題，本創作遂揭露一種作用裝置，係包括：撞擊部；連動結構，係具有相對之第一側與第二側，該第一側係連結動力源，以帶動該撞擊部位移；以及作用源，係與該撞擊部相間隔設置。 In order to solve the above problems in the prior art, the present invention discloses an action device, comprising: an impact portion; a linkage structure having opposite first and second sides, the first side is coupled with a power source to drive the The displacement of the impact portion; and the source of action are spaced apart from the impact portion.
前述之作用裝置中，該動力源係為音圈馬達。 In the aforementioned action device, the power source is a voice coil motor.
前述之作用裝置中，該作用源係為物理供力結構，例如，該作用源係為劈刀。 In the above-mentioned action device, the action source is a physical power supply structure, for example, the action source is a file.
前述之作用裝置中，該撞擊部係為板體或桿體。 In the above-mentioned action device, the impact portion is a plate body or a rod body.
前述之作用裝置中，該撞擊部係設於該動力源上。 In the above-mentioned action device, the impact portion is provided on the power source.
前述之作用裝置中，復包括該線性位移結構，係連接該連動結構。例如，該線性位移結構係為滑軌結構或線性軸承結構。 In the foregoing acting device, the linear displacement structure is further included, and the interlocking structure is connected. For example, the linear displacement structure is a slide rail structure or a linear bearing structure.
由上可知，本創作之作用裝置中，主要藉由該連動結構之第一側連結該動力源，而非將該連動結構設於該動力源中，故相較於習知技術，該連動結構不會與該動力源發生摩擦，因而不會產生粉塵，進而避免汙損晶圓之問題。 It can be seen from the above that in the active device of the present invention, the power source is mainly connected by the first side of the interlocking structure, and the interlocking structure is not disposed in the power source. Therefore, the interlocking structure is compared with the prior art. It does not rub against this power source, so it does not generate dust, thus avoiding the problem of staining the wafer.
再者，藉由該線性位移結構連接該連動結構，使該連動結構於進行劈裂作業時不會發生傾斜，故相較於習知技術，本創作之作用裝置能有效控制該該連動結構之敲擊力道，以有效劈裂晶圓。 Furthermore, by connecting the interlocking structure by the linear displacement structure, the interlocking structure does not tilt when performing the splitting operation, so that the working device of the present invention can effectively control the interlocking structure compared with the prior art. Strike the force to effectively split the wafer.
1‧‧‧分離設備 1‧‧‧Separation equipment
10‧‧‧基座 10‧‧‧ Pedestal
12‧‧‧劈裂裝置 12‧‧‧Cleavage device
120‧‧‧劈刀 120‧‧‧劈
121‧‧‧震動件 121‧‧‧Vibration parts
121a,301‧‧‧擊針 121a, 301‧‧‧needle
122,30a,40a‧‧‧殼體 122, 30a, 40a‧‧‧shell
122a,300‧‧‧電磁線圈 122a, 300‧‧‧ electromagnetic coil
123,302‧‧‧彈簧 123,302‧‧. Spring
13‧‧‧貼膜 13‧‧‧ film
2a,2b,3‧‧‧作用裝置 2a, 2b, 3‧‧‧ action devices
20,30‧‧‧動力源 20,30‧‧‧Power source
200‧‧‧定子 200‧‧‧stator
201‧‧‧動子 201‧‧‧ mover
21,31‧‧‧線性位移結構 21,31‧‧‧linear displacement structure
210‧‧‧支撐座 210‧‧‧ support
211‧‧‧線性滑座 211‧‧‧linear slide
22,42‧‧‧連動結構 22,42‧‧‧ linkage structure
22a‧‧‧第一側 22a‧‧‧ first side
22b‧‧‧第二側 22b‧‧‧ second side
23‧‧‧基座 23‧‧‧ Pedestal
24‧‧‧作用源 24‧‧‧Source
25‧‧‧撞擊部 25‧‧‧ Impact Department
5‧‧‧固定板 5‧‧‧ fixed plate
8‧‧‧晶圓 8‧‧‧ wafer
8a‧‧‧晶粒 8a‧‧‧ grain
80‧‧‧預切割道 80‧‧‧ pre-cutting road
A‧‧‧背面位置 A‧‧‧back position
d‧‧‧間隔 D‧‧‧ interval
S‧‧‧裂痕 S‧‧‧ crack
t‧‧‧間隙 T‧‧‧ gap
X,Y‧‧‧箭頭方向 X, Y‧‧‧ arrow direction
第1A圖係為習知分離設備之剖面示意圖；第1B圖係為第1A圖之局部放大示意圖；第1C圖係為第1B圖之劈裂裝置之放大側視示意圖；第1D圖係為第1C圖之實際情況之側視示意圖；第2A圖係為本創作之作用裝置之第一實施例的側視示意圖；第2B圖係為本創作之作用裝置之第二實施例的側視示意圖；第3圖係為本創作之作用裝置之第三實施例的側視示意圖；第4A圖係為本創作之作用裝置之第四實施例的立體 示意圖；以及第4B圖係為第4A圖的側視剖面示意圖。 1A is a schematic cross-sectional view of a conventional separation device; FIG. 1B is a partial enlarged view of FIG. 1A; FIG. 1C is an enlarged side view of the cleaving device of FIG. 1B; 1A is a side view of the first embodiment of the working device of the present invention; FIG. 2B is a side view of the second embodiment of the working device of the present invention; Figure 3 is a side view showing a third embodiment of the working device of the present invention; Figure 4A is a perspective view of the fourth embodiment of the working device of the present invention. Schematic; and Figure 4B is a side cross-sectional view of Figure 4A.
以下藉由特定的具體實施例說明本創作之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本創作之其他優點及功效。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure of the present disclosure.
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本創作可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本創作所能產生之功效及所能達成之目的下，均應仍落在本創作所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如「上」、「第一」、「第二」及「一」等之用語，亦僅為便於敘述之明瞭，而非用以限定本創作可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本創作可實施之範疇。 It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effectiveness and the purpose of the creation. The technical content revealed by the creation can be covered. In the meantime, the terms "upper", "first", "second" and "one" as used in this specification are for convenience only, and are not intended to limit the scope of the creation of the creation. Changes or adjustments in their relative relationship are considered to be within the scope of the creation of the creation of the product without substantial changes.
第2A圖係為本創作之作用裝置2a之第一實施例的側視示意圖。如第2A圖所示，該作用裝置2a係包括：一基座23、一設於該基座23上之動力源20、一作用源24、一連動結構22以及一線性位移結構21。 Figure 2A is a side elevational view of the first embodiment of the active device 2a of the present invention. As shown in FIG. 2A, the action device 2a includes a base 23, a power source 20 disposed on the base 23, an active source 24, a linkage structure 22, and a linear displacement structure 21.
所述之動力源20係為音圈馬達，其包含一定子200與一動子201，該動子201連結該連動結構22，該定子200係於通電後會作動該動子201。然而，有關該動力源20之 種類繁多，並不限於上述。 The power source 20 is a voice coil motor, and includes a stator 200 and a mover 201. The mover 201 is coupled to the interlocking structure 22. The stator 200 is activated to activate the mover 201. However, regarding the power source 20 A wide variety is not limited to the above.
所述之作用源24係為物理供力結構，如劈刀或其它可分離晶圓之類似結構。 The source 24 is a physical power supply structure such as a file or a similar structure of a separable wafer.
所述之連動結構22係為桿架結構，其可依需求呈現各種外觀結構，且具有相對之第一側22a與第二側22b，該第一側22a係連結該動力源20之動子201，而該第二側22b係具有一撞擊部25。 The interlocking structure 22 is a rod structure, which can provide various appearance structures according to requirements, and has a first side 22a and a second side 22b opposite to each other. The first side 22a is coupled to the mover 201 of the power source 20. And the second side 22b has an impact portion 25.
於本實施例中，該撞擊部25係為板體，其與該作用源24之間具有間隔d。 In the present embodiment, the striking portion 25 is a plate body having a spacing d from the action source 24.
所述之線性位移結構21係連接該連動結構22，以令該連動結構22沿直線(如第2A圖所示之箭頭方向Y)位移。 The linear displacement structure 21 is connected to the linkage structure 22 to displace the linkage structure 22 along a straight line (as indicated by the arrow direction Y in FIG. 2A).
於本實施例中，該線性位移結構21係為滑軌結構，其包含一設於該第一側22a與該第二側22b之間的支撐座210與一設於該支撐座210上之線性滑座211，且該線性滑座211接合於該連動結構22上，使該連動結構22相對該線性滑座211直線滑移。 In this embodiment, the linear displacement structure 21 is a slide rail structure including a support base 210 disposed between the first side 22a and the second side 22b and a linearity disposed on the support base 210. The slider 211 is coupled to the linkage structure 22 such that the linkage structure 22 linearly slides relative to the linear slider 211.
於進行分離作業時，以第1B圖所示之劈裂作業為例，先將該作用源24對位於其中一預切割道80上，再將該動力源20通電以令該動子201作動該連動結構22，使該撞擊部25撞擊該作用源24，致使該作用源24劈裂該晶圓8而分離成複數晶粒8a。 For the separation operation, taking the splitting operation shown in FIG. 1B as an example, the active source 24 is first placed on one of the pre-cutting streets 80, and then the power source 20 is energized to activate the mover 201. The interlocking structure 22 causes the impact portion 25 to strike the source 24 such that the source 24 splits the wafer 8 and separates into a plurality of crystal grains 8a.
本創作之作用裝置2a藉由該連動結構22之第一側22a連結該動力源20，而非將該連動結構22設於該動力源20 中，故相較於習知技術，該連動結構22不會與該動力源20發生摩擦，因而不會產生粉塵，進而避免汙損晶圓之問題。 The active device 2a of the present invention is coupled to the power source 20 by the first side 22a of the linkage structure 22, instead of the linkage structure 22 being disposed at the power source 20 Therefore, compared with the prior art, the interlocking structure 22 does not rub against the power source 20, so that no dust is generated, thereby avoiding the problem of staining the wafer.
再者，藉由該線性位移結構21之設計，該連動結構22於進行分離作業時不會發生傾斜，故相較於習知技術，本創作之作用裝置2a能有效控制該撞擊部25之敲擊力道，以有效劈裂晶圓。 Moreover, by the design of the linear displacement structure 21, the interlocking structure 22 does not tilt when performing the separating operation, so that the acting device 2a of the present invention can effectively control the knocking of the striking portion 25 compared with the prior art. Strike the way to effectively split the wafer.
第2B圖係為本創作之作用裝置2b之第二實施例的側視示意圖。本實施例係將該線性位移結構21與該連動結構22連結如第1C圖所示之震動件之結構，以改良習知技術之缺失。 Figure 2B is a side elevational view of the second embodiment of the active device 2b of the present invention. In this embodiment, the linear displacement structure 21 and the interlocking structure 22 are coupled to the structure of the vibrating member as shown in FIG. 1C to improve the lack of the prior art.
如第2B圖所示，該線性位移結構21係包含一固定於環境(如壁面或固定板5)的支撐座210與一可滑移於該支撐座210上之線性滑座211，且該線性滑座211固接該連動結構22之第二側22b。 As shown in FIG. 2B, the linear displacement structure 21 includes a support base 210 fixed to the environment (such as a wall or a fixed plate 5) and a linear slide 211 slidable on the support base 210, and the linearity The carriage 211 is fixed to the second side 22b of the linkage structure 22.
於本實施例中，該動力源30係包括一內壁具有電磁線圈300之殼體30a、設於該殼體30a中之擊針301、及套設於該擊針301後端的彈簧302，該電磁線圈300係於通電後會作動該擊針301，且該連動結構22之第一側22a係固接該擊針301後端，而該擊針301之前端係一體設有如桿體之撞擊部25。 In the present embodiment, the power source 30 includes a housing 30a having an inner wall having an electromagnetic coil 300, a pin 301 disposed in the housing 30a, and a spring 302 sleeved at a rear end of the pin 301. The electromagnetic coil 300 is activated to activate the pin 301, and the first side 22a of the interlocking structure 22 is fixed to the rear end of the pin 301, and the front end of the pin 301 is integrally provided with an impact portion such as a rod body. 25.
當該電磁線圈300作動該擊針301時，由於該線性滑座211會沿該支撐座210直線滑動(如箭頭方向X)而使該連動結構22僅能直線位移，故該連動結構22能控制該 擊針301穩定可靠地直線位移而不會傾斜。 When the electromagnetic coil 300 activates the firing pin 301, since the linear sliding block 211 slides linearly along the supporting base 210 (such as the arrow direction X), the interlocking structure 22 can only be linearly displaced, so the interlocking structure 22 can be controlled. The The shot 301 is stably and reliably linearly displaced without tilting.
因此，相較於習知技術，當該擊針301透過該彈簧302回復至原始位置時，該擊針301不會傾斜，故後續該擊針301再次錘擊該作用源24時，該連動結構22與該擊針301不會與該殼體30a發生摩擦，因而不會產生粉塵，進而避免汙損晶圓之問題，且能有效控制該撞擊部25之敲擊力道，以有效劈裂晶圓。 Therefore, compared with the prior art, when the striker 301 returns to the original position through the spring 302, the striker 301 does not tilt, so when the striker 301 hammers the action source 24 again, the interlocking structure 22 and the pin 301 does not rub against the casing 30a, so that no dust is generated, thereby avoiding the problem of staining the wafer, and effectively controlling the striking force of the striking portion 25 to effectively split the wafer. .
第3圖係為本創作之作用裝置3之第三實施例的側視示意圖。本實施例與上述實施例之差異在於該線性位移結構31為線性軸承結構。 Figure 3 is a side elevational view of a third embodiment of the active device 3 of the present invention. The difference between this embodiment and the above embodiment is that the linear displacement structure 31 is a linear bearing structure.
如第3圖所示，該連動結構22係為桿體，其穿設該線性位移結構31，使該連動結構22可相對該線性位移結構31直線位移。 As shown in FIG. 3, the interlocking structure 22 is a rod body that passes through the linear displacement structure 31 such that the interlocking structure 22 can be linearly displaced relative to the linear displacement structure 31.
於本實施例中，係將該線性位移結構31與該連動結構22配合如第1C圖所示之震動件之結構，以改良習知技術之缺失。例如，該動力源30係包括一內壁具有電磁線圈300之殼體30a、設於該殼體30a中之擊針301、及套設於該擊針301後端的彈簧302，該電磁線圈300係於通電後會作動該擊針301，且該連動結構22之第一側22a係固接該擊針301後端，而該擊針301之前端係一體設有如桿體之撞擊部25。 In the present embodiment, the linear displacement structure 31 and the interlocking structure 22 are coupled to the structure of the vibrating member as shown in FIG. 1C to improve the lack of the prior art. For example, the power source 30 includes a housing 30a having an inner wall having an electromagnetic coil 300, a pin 301 disposed in the housing 30a, and a spring 302 sleeved at a rear end of the pin 301. The electromagnetic coil 300 is The pin 301 is actuated after being energized, and the first side 22a of the interlocking structure 22 is fixed to the rear end of the pin 301, and the front end of the pin 301 is integrally provided with an impact portion 25 such as a rod.
當該電磁線圈300作動該擊針301時，由於該連動結構22僅能沿該線性位移結構31直線滑動(如箭頭方向X)，故該連動結構22能控制該擊針301穩定可靠地直線 位移而不會傾斜。 When the electromagnetic coil 300 activates the firing pin 301, since the interlocking structure 22 can only slide linearly along the linear displacement structure 31 (such as the arrow direction X), the interlocking structure 22 can control the needle 301 to be stably and reliably straight. Displace without tilting.
因此，相較於習知技術，當該擊針301透過該彈簧302回復至原始位置時，該擊針301不會傾斜，故後續該擊針301再次錘擊該作用源24時，該連動結構22與該擊針301不會與該殼體30a發生摩擦，因而不會產生粉塵，進而避免汙損晶圓之問題，且能有效控制該撞擊部25之敲擊力道，以有效劈裂晶圓。 Therefore, compared with the prior art, when the striker 301 returns to the original position through the spring 302, the striker 301 does not tilt, so when the striker 301 hammers the action source 24 again, the interlocking structure 22 and the pin 301 does not rub against the casing 30a, so that no dust is generated, thereby avoiding the problem of staining the wafer, and effectively controlling the striking force of the striking portion 25 to effectively split the wafer. .
第4A及4B圖係為本創作之作用裝置之第四實施例的示意圖。本實施例與第三實施例之差異在於該線性位移結構31與該擊針301之製作方式。 4A and 4B are schematic views of a fourth embodiment of the active device of the present invention. The difference between this embodiment and the third embodiment lies in the manner in which the linear displacement structure 31 and the shot 301 are made.
如第4A及4B圖所示，該連動結構42係為桿體，其與該擊針301一體製成為同一桿件，以令該桿件穿設該線性位移結構31，且該桿件與該線性位移結構31裝設於殼體40a中，其中，該線性位移結構31為線性軸承結構，且該撞擊部25伸出該殼體40a。 As shown in FIGS. 4A and 4B, the interlocking structure 42 is a rod body which is integrally formed with the needle 301 as a same rod member so that the rod member passes through the linear displacement structure 31, and the rod member and the rod member are The linear displacement structure 31 is mounted in the housing 40a, wherein the linear displacement structure 31 is a linear bearing structure, and the striker portion 25 projects out of the housing 40a.
同理地，當動力源(如第三實施例的電磁線圈埋設於該殼體40a中)作動該擊針301時，該連動結構42能控制該撞擊部25穩定可靠地直線位移而不會傾斜。因此，該擊針301不會與殼體發生摩擦，因而不會產生粉塵，進而避免汙損晶圓之問題。 Similarly, when the power source (such as the electromagnetic coil of the third embodiment is embedded in the casing 40a) actuates the pin 301, the interlocking structure 42 can control the striking portion 25 to stably and reliably linearly shift without tilting. . Therefore, the shot 301 does not rub against the casing, so that no dust is generated, thereby avoiding the problem of staining the wafer.
另外，應可理解地，有關該線性位移結構之種類繁多，其可依需求設計，並不限於上述。 In addition, it should be understood that there are many kinds of linear displacement structures, which can be designed according to requirements, and are not limited to the above.
綜上所述，本創作之作用裝置中，主要藉由該連動結構之第一側連結該動力源，而非將該連動結構設於該動力 源中，故該連動結構不會與該動力源發生摩擦，因而不會產生粉塵，進而避免汙損晶圓之問題。 In summary, in the active device of the present invention, the power source is mainly connected by the first side of the linkage structure, instead of the linkage structure being disposed on the power In the source, the interlocking structure does not rub against the power source, so that no dust is generated, thereby avoiding the problem of staining the wafer.
再者，藉由該線性位移結構連接該連動結構，使該連動結構於進行劈裂作業時不會發生傾斜，故本創作之作用裝置能有效控制該該連動結構之敲擊力道，以有效劈裂晶圓。 Furthermore, by connecting the interlocking structure by the linear displacement structure, the interlocking structure does not tilt when performing the splitting operation, so the acting device of the present invention can effectively control the striking force of the interlocking structure, so as to effectively Crack the wafer.
上述實施例係用以例示性說明本創作之原理及其功效，而非用於限制本創作。任何熟習此項技藝之人士均可在不違背本創作之精神及範疇下，對上述實施例進行修改。因此本創作之權利保護範圍，應如後述之申請專利範圍所列。 The above embodiments are intended to illustrate the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone who is familiar with the art may modify the above embodiments without departing from the spirit and scope of the creation. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.
2a‧‧‧作用裝置 2a‧‧‧Action device
20‧‧‧動力源 20‧‧‧Power source
200‧‧‧定子 200‧‧‧stator
201‧‧‧動子 201‧‧‧ mover
21‧‧‧線性位移結構 21‧‧‧linear displacement structure
210‧‧‧支撐座 210‧‧‧ support
211‧‧‧線性滑座 211‧‧‧linear slide
22‧‧‧連動結構 22‧‧‧ linkage structure
22a‧‧‧第一側 22a‧‧‧ first side
22b‧‧‧第二側 22b‧‧‧ second side
23‧‧‧基座 23‧‧‧ Pedestal
24‧‧‧作用源 24‧‧‧Source
25‧‧‧撞擊部 25‧‧‧ Impact Department
d‧‧‧間隔 D‧‧‧ interval
Y‧‧‧箭頭方向 Y‧‧‧ arrow direction
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105216559U TWM539147U (en) | 2016-10-31 | 2016-10-31 | Action device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105216559U TWM539147U (en) | 2016-10-31 | 2016-10-31 | Action device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM539147U true TWM539147U (en) | 2017-04-01 |
Family
ID=59254662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105216559U TWM539147U (en) | 2016-10-31 | 2016-10-31 | Action device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM539147U (en) |
-
2016
- 2016-10-31 TW TW105216559U patent/TWM539147U/en unknown
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