TWM535319U - Auto focusing device providing inspection and measurement - Google Patents
Auto focusing device providing inspection and measurement Download PDFInfo
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Description
一種提供檢查與量測之自動對焦裝置，尤指一種自動對焦的檢測裝置。 An autofocus device for providing inspection and measurement, especially an autofocus detection device.
高精度光學檢測技術，其係廣泛地應用於檢測技術中，如面板、晶圓、晶粒或電子零件。 High-precision optical inspection technology, which is widely used in inspection technologies such as panels, wafers, die or electronic components.
但現有的高精度光學裝置於檢測時，若未對焦則高精度光學裝置無法取得有效的圖像。雖可採用自動對焦系統克服前述之無法有效取得有效的圖像之缺點，但自動對焦系統係微量移動鏡頭方式，以進行圖像元素的對比分析，藉以尋找最適當的取像焦距，但自動對焦的距離會受到限制，所以自動對焦系統無法適用於對焦距離大與精度要求高的情況，故現有的解決方式係以人上調整檢測平台與對焦，並進行隨機抽檢。 However, in the case of the conventional high-precision optical device, if the focus is not in focus, the high-precision optical device cannot obtain an effective image. Although the autofocus system can be used to overcome the above-mentioned shortcomings of not being able to effectively obtain an effective image, the autofocus system is a micro-moving lens method for performing comparative analysis of image elements, thereby finding the most appropriate image capturing focal length, but autofocusing. The distance is limited, so the autofocus system cannot be applied to situations where the focus distance is large and the accuracy is high. Therefore, the existing solution is to adjust the detection platform and focus on the person and perform random sampling.
如上所述，現有的自動對焦系統具有對焦距離大與精度要求高的限制，而人工調整則具有耗時與耗工的缺點，故現有的高精度光學檢測技術仍有可改善的空間。 As described above, the existing autofocus system has a limitation of large focusing distance and high precision, and manual adjustment has the disadvantages of time consuming and labor-intensive, so the existing high-precision optical detecting technology still has room for improvement.
有鑑於上述之缺點，本創作之目的在於提供一種提供檢查與量測之自動對焦裝置及其方法，其係藉由改變待測物於一第三軸向之位置，而使視覺模組能夠達到對焦之效果。 In view of the above disadvantages, the purpose of the present invention is to provide an autofocus apparatus and method for providing inspection and measurement, which can achieve a visual module by changing a position of a test object in a third axial direction. The effect of focusing.
為了達到上述之目的，本創作之技術手段在於提供一種提供檢查與量測之自動對焦裝置，其包含有： 一量距單元；一檢測單元，其係相鄰於該量距單元，該檢測單元具有一視覺模組與一承台，該視覺模組係位於該承台的上方；以及一控制單元，其係訊號連接該量距單元與該檢測單元；其中，該量距單元係提供至少一待測物之資訊或位於該至少一待測物之至少一標的之資訊給該控制單元，該控制單元係依據該至少一待測物之資訊或依據該至少一標的之資訊或計算該至少一待測物之資訊或計算該至少一標的之資訊，以使該承台調整位於該承台之該待測物與該視覺模組之間的距離。 In order to achieve the above object, the technical means of the present invention is to provide an autofocus device for providing inspection and measurement, which comprises: a measuring unit, adjacent to the measuring unit, the detecting unit has a visual module and a platform, the visual module is located above the platform; and a control unit The measuring unit is connected to the measuring unit and the detecting unit; wherein the measuring unit provides at least one information of the object to be tested or information of at least one target of the at least one object to be tested, the control unit is And calculating information of the at least one object or calculating information of the at least one target according to the information of the at least one object to be tested or according to the information of the at least one target, so that the platform is adjusted to be tested at the platform The distance between the object and the vision module.
如上所述，待測物之形狀可能為矩形、圓形或多邊形，待測物之表面可能為曲面、凹弧面、凸弧面或一凹凸面。藉由上述之資訊，控制單元係控制承台，以調整待測物於一第三軸向之位置，故能夠使視覺模組能夠確實完成待測物的對焦程序，所以視覺模組能夠於不平坦表面且不共面之待測物取得清晰且可利用的影像。 As described above, the shape of the object to be tested may be a rectangle, a circle, or a polygon, and the surface of the object to be tested may be a curved surface, a concave curved surface, a convex curved surface, or a concave-convex surface. With the above information, the control unit controls the bearing platform to adjust the position of the object to be tested in a third axial direction, so that the visual module can surely complete the focusing process of the object to be tested, so the visual module can A flat surface and a non-coplanar object to be tested obtains a clear and usable image.
另外，量距單元係能夠針對多個待測物或特定之待測物進行擷取資訊。於此所述之資訊為量距；以及檢測單元係能夠針對多個待測物或特定之待測物進行檢測。 In addition, the spanning unit is capable of capturing information for a plurality of objects to be tested or a specific object to be tested. The information described herein is the span; and the detection unit is capable of detecting for a plurality of analytes or specific analytes.
1‧‧‧量距單元 1‧‧‧Meeting unit
11‧‧‧讀取模組 11‧‧‧Reading module
2‧‧‧檢測單元 2‧‧‧Detection unit
20‧‧‧承台 20‧‧ ‧ captain
21‧‧‧位移模組 21‧‧‧ Displacement Module
22‧‧‧視覺模組 22‧‧‧Vision Module
3‧‧‧控制單元 3‧‧‧Control unit
40‧‧‧待測物 40‧‧‧Test object
41‧‧‧托盤 41‧‧‧Tray
S1~S2‧‧‧步驟 S1~S2‧‧‧ steps
第1圖為本創作之一種提供檢查與量測之自動對焦裝置之示意圖。 Figure 1 is a schematic diagram of an automatic focusing device that provides inspection and measurement.
第2圖為本創作之一種提供檢查與量測之自動對焦方法之流程圖。 Figure 2 is a flow chart of an automatic focusing method for providing inspection and measurement.
第3圖為至少一待測物與一量距單元之示意圖。 Figure 3 is a schematic diagram of at least one object to be tested and a distance measuring unit.
第4圖為至少一待測物與一托盤之局部示意圖。 Figure 4 is a partial schematic view of at least one object to be tested and a tray.
第5圖為至少一待測物與一檢測單元之示意圖。 Figure 5 is a schematic diagram of at least one object to be tested and a detecting unit.
第6圖為至少一待測物與檢測單元之示意圖。 Figure 6 is a schematic diagram of at least one object to be tested and a detecting unit.
以下係藉由特定的具體實施例說明本創作之實施方式，所屬技術領域中具有通常知識者可由本說明書所揭示之內容，輕易地瞭解本創作之其他優點與功效。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention by the contents disclosed in the present specification.
請配合參考第1圖所示，本創作係一種提供檢查與量測之自動對焦裝置之第一實施例，其包含有一量距單元1、一檢測單元2與一控制單元3。 Please refer to FIG. 1 , which is a first embodiment of an auto-focusing device for providing inspection and measurement, comprising a measuring unit 1, a detecting unit 2 and a control unit 3.
量距單元1具有至少一讀取模組11。於一實施例中，讀取模組11能夠為一雷射測厚儀或一雷射測距儀。於又一實施例中，讀取模組11能夠為一讀碼器或一遠紅外線感應器。 The distance measuring unit 1 has at least one reading module 11. In an embodiment, the reading module 11 can be a laser thickness gauge or a laser range finder. In still another embodiment, the reading module 11 can be a reader or a far infrared sensor.
檢測單元2係相鄰於量距單元1，檢測單元2具有一承台20、一位移模組21與一視覺模組22。位移模組21係設於承台20的下方，位移模組21係使承台20進行一第一軸向、一第二軸向、一第三軸向或第一軸向至第三軸向移動，前述之第一軸向至第三軸向可視為X軸向、Y軸向與Z軸向，但不限制。視覺模組22係設於承台20的上方。上述之讀取模組11係可設與承台20的上方或承台20的上方與下方。 The detecting unit 2 is adjacent to the measuring unit 1 , and the detecting unit 2 has a platform 20 , a displacement module 21 and a vision module 22 . The displacement module 21 is disposed under the cap 20, and the displacement module 21 is configured to cause the cap 20 to perform a first axial direction, a second axial direction, a third axial direction or a first axial direction to a third axial direction. For movement, the aforementioned first axial to third axial directions may be regarded as X-axis, Y-axis, and Z-axis, but are not limited. The vision module 22 is disposed above the platform 20. The above-described reading module 11 can be disposed above the platform 20 or above and below the platform 20.
控制單元3係訊號連接檢測單元2與量距單元1。 The control unit 3 is a signal connection detecting unit 2 and a distance measuring unit 1.
請配合參考第2圖所示，本創作應用於一種提供檢查與量測之自動對焦方法，其步驟包含有： Please refer to Figure 2 for illustration. This creation is applied to an autofocus method that provides inspection and measurement. The steps include:
步驟S1，量測至少一待測物之表面高度或厚度。如第3圖與第4圖所示，至少一待測物40係放置於一托盤41，托盤41具有至少一對位記號42。對位記號42係相鄰於待測物40。舉例而言，待測物40為面板、晶圓、晶粒或電子零件。 In step S1, the surface height or thickness of at least one object to be tested is measured. As shown in FIGS. 3 and 4, at least one object to be tested 40 is placed on a tray 41 having at least one pair of position marks 42. The alignment mark 42 is adjacent to the object to be tested 40. For example, the object to be tested 40 is a panel, a wafer, a die, or an electronic component.
托盤41係位於承台20的頂端。托盤41可利用夾具、箝制工具或機械裝置固定於承台20的頂端。若讀取模組11僅設於承台20的上方，讀取模組11係先讀取對位記號42，以確認待測物40是否位於讀取模組11可讀取待測物40之位置。若待測物40已位於讀取模組11可讀取之位置，則承台20停止作動。若待測物40未位於讀取模組11可讀取之位置，則承台20則將待測物40移動至讀取模組11可讀取之位置。 The tray 41 is located at the top end of the cap 20. The tray 41 can be fixed to the top end of the cap 20 by means of a clamp, a clamping tool or a mechanical device. If the reading module 11 is only disposed above the platform 20, the reading module 11 first reads the alignment mark 42 to confirm whether the object to be tested 40 is located in the reading module 11 and can read the object to be tested 40. position. If the object to be tested 40 is already at a position readable by the reading module 11, the platform 20 stops operating. If the object to be tested 40 is not located at a position readable by the reading module 11, the platform 20 moves the object to be tested 40 to a position readable by the reading module 11.
讀取模組11為雷射測距儀，則讀取模組11係擷取位托盤41頂端之至少一待測物40之高度，前述之高度為拖盤41之頂端至待測物40之頂端的距離。讀取模組11係將前述之高度轉轉換為一高度資訊。 The reading module 11 is a laser range finder, and the reading module 11 is configured to capture the height of at least one object 40 at the top of the tray 41. The height is the top of the tray 41 to the object to be tested 40. The distance from the top. The reading module 11 converts the aforementioned height into a height information.
若待測物40為多個，並且待測物40之頂端可能有高低起伏的現象。承台20係於第一軸向移動、第二軸向移動或第一軸向與第二軸向組合移動，進而改變待測物40相對於讀取模組11之位置，以使讀取模組11能擷取多個待測物40之高度。讀取模組11係將至少一高度資訊傳送給控制單元3，控制單元3係接收至少一高度資訊。控制單元3係將所接收之高度資訊予以平均，而得出一高度平均資訊。高度平均資訊包含有待測物40之平均高度與待測物40相對於托盤41之位置。 If there are a plurality of objects 40 to be tested, and the top of the object to be tested 40 may have a high and low undulation. The cap 20 is moved in a first axial direction, a second axial direction, or a combination of the first axial direction and the second axial direction, thereby changing the position of the test object 40 relative to the reading module 11 to enable the reading mode Group 11 can capture the height of a plurality of analytes 40. The reading module 11 transmits at least one height information to the control unit 3, and the control unit 3 receives at least one height information. The control unit 3 averages the received height information to obtain a high average information. The height average information includes the average height of the object to be tested 40 and the position of the object to be tested 40 with respect to the tray 41.
或者，如上所述之多個高度資訊係被控制單元3所接收，但於此步驟中，控制單元3不將多個高度資訊予以平均。 Alternatively, the plurality of height information as described above is received by the control unit 3, but in this step, the control unit 3 does not average the plurality of height information.
或者，各待測物40具有至少一標的，讀取模組11係擷取至少一標的之資訊，並將所擷取之該至少一標的之資訊轉換為至少一標的資訊，再將該至少一標的資訊傳送給控制單元3。 Or, the object to be tested 40 has at least one target, and the reading module 11 captures at least one target information, and converts the captured information of the at least one target into at least one target information, and then at least one The target information is transmitted to the control unit 3.
若讀取模組11係設於載台10的上方與下方，並且讀取模組11為雷射測厚儀，則讀取模組11係量測待測物40托盤41之總厚度，該總厚度為待測物40之頂端至托盤41之底端的距離。讀取模組11係將前述之總厚度轉換為一厚度資訊，並將厚度資訊傳送給控制單元3。控制單元3係接收厚度資訊。若讀取模組11傳送多個厚度資訊給控制單元3，控制單元3係將所接收之厚度資訊予以平均，而得出一厚度平均資訊。厚度平均資訊包含待測物40與托盤41之平均總厚度，以及待測物40相對於托盤41之位置。 If the reading module 11 is disposed above and below the stage 10, and the reading module 11 is a laser thickness gauge, the reading module 11 measures the total thickness of the tray 41 of the object 40 to be tested. The total thickness is the distance from the top end of the object 40 to the bottom end of the tray 41. The reading module 11 converts the aforementioned total thickness into a thickness information and transmits the thickness information to the control unit 3. The control unit 3 receives the thickness information. If the reading module 11 transmits a plurality of thickness information to the control unit 3, the control unit 3 averages the received thickness information to obtain a thickness average information. The thickness average information includes the average total thickness of the object to be tested 40 and the tray 41, and the position of the object to be tested 40 with respect to the tray 41.
或者，如上所述之多個厚度資訊係被控制單元3所接收，但於此步驟中，控制單元3未將多個厚度資訊予以平均。 Alternatively, the plurality of thickness information as described above is received by the control unit 3, but in this step, the control unit 3 does not average the plurality of thickness information.
若讀取模組11為一讀碼器或一遠紅外線感應器，則待測物40之高度或厚度可於另一製程先行量測，當讀取模組11讀取位於待測物40之條碼或晶片後，或者該讀取模組11讀取位於托盤41之 條碼或晶片後，讀取模組11係取得待測物40之高度或厚度，如上所述，讀取模組11現將高度資訊或厚度資訊傳送給控制單元3，以使控制單元3得出高度平均資訊或厚度平均資訊。 If the reading module 11 is a reader or a far-infrared sensor, the height or thickness of the object to be tested 40 can be measured first in another process, and when the reading module 11 reads the object to be tested 40 After the barcode or wafer, or the reading module 11 reads the tray 41 After the barcode or the wafer, the reading module 11 obtains the height or thickness of the object to be tested 40. As described above, the reading module 11 now transmits the height information or the thickness information to the control unit 3, so that the control unit 3 obtains High average information or thickness average information.
另外，若待測物40之表面具有高低起伏，或為一不規則凹凸面，或為一曲面，則讀取模組11係擷取待測物40之表面資訊，再將該表面資訊傳送給控制單元3，控制單元3係計算該表面資訊，以得出待測物40之表面狀態，以及前述之高度資訊或厚度資訊。如前所述，當讀取模組11擷取表面資訊時，承台20亦會配合待測物40之位置，而進行第一軸向移動、第二軸向移動或第一軸向與第二軸向之組合移動。 In addition, if the surface of the object to be tested 40 has a high or low undulation, or an irregular concave-convex surface, or a curved surface, the reading module 11 extracts the surface information of the object to be tested 40, and transmits the surface information to the surface. The control unit 3, the control unit 3 calculates the surface information to obtain the surface state of the object to be tested 40, and the aforementioned height information or thickness information. As described above, when the reading module 11 captures the surface information, the platform 20 also cooperates with the position of the object to be tested 40 to perform the first axial movement, the second axial movement or the first axial direction and the first The combination of two axial movements.
綜合上述，量距單元1係提供至少一待測物40之資訊或位於該至少一待測物40之至少一標的之資訊給控制單元3。或者量距單元1係能夠針對多個待測物40或特定之待測物40進行擷取資訊。於此所述之資訊為量距，但不限定。 In summary, the distance measuring unit 1 provides information of at least one object to be tested 40 or information of at least one object of the at least one object to be tested 40 to the control unit 3. Alternatively, the span unit 1 can extract information for a plurality of objects 40 to be tested or a specific object to be tested 40. The information described herein is span, but is not limited.
步驟S2，進行一焦距調整。請配合參考第5圖所示，承台20係將待測物40連同托盤41移動至檢測單元2之視覺模組22的下方。 In step S2, a focus adjustment is performed. Referring to FIG. 5, the platform 20 moves the object to be tested 40 together with the tray 41 to the lower side of the vision module 22 of the detecting unit 2.
視覺模組22係擷取待測物40與對位記號42之影像資訊，並將影像資訊傳送給控制單元3，該影像資訊係包含待測物40與對位記號42之間的相對距離。控制單元3依據影像資訊，以判斷待測物40是否位處於設置位置。 The visual module 22 captures the image information of the object 40 and the alignment mark 42 and transmits the image information to the control unit 3, where the image information includes the relative distance between the object 40 and the alignment mark 42. The control unit 3 determines whether the object to be tested 40 is in the set position according to the image information.
若否，則檢查單元2之位移模組21係使承台20進行一第一軸向移動、一第二軸向移動或第一軸向與第二軸向之組合移動，而使位於承台20頂端之待測物40回復至設置位置。 If not, the displacement module 21 of the inspection unit 2 causes the bearing platform 20 to perform a first axial movement, a second axial movement or a combination of the first axial direction and the second axial direction to be located on the bearing platform. The top 40 of the object to be tested 40 is returned to the set position.
或者，控制單元3通知工作人員，而使工作人員將未位於設置位置之待測物40回復至設置位置。 Alternatively, the control unit 3 notifies the worker, but causes the worker to return the object to be tested 40 that is not in the set position to the set position.
若待測物40已位於設置位置，則控制單元3依據上述之厚度資訊或高度資訊，以控制位移模組21，而使承台20進行一第三軸向移動，如第6圖所示。待承台20於第三軸向移動至一預定距離後，位移模組21停止動作。 If the object to be tested 40 is already in the set position, the control unit 3 controls the displacement module 21 according to the thickness information or the height information described above, and causes the platform 20 to perform a third axial movement, as shown in FIG. After the platform 20 is moved to a predetermined distance in the third axial direction, the displacement module 21 stops operating.
視覺模組22係擷取待測物40之待測影像資訊，並將待測影像資訊傳送控制模組3，控制模組3依據待測影像資訊，以檢測待測物40。 The visual module 22 captures the image information to be tested of the object to be tested 40, and transmits the image information to be tested to the control module 3, and the control module 3 detects the object to be tested 40 according to the image information to be tested.
控制單元3亦可依據待測影像資訊或上述之影像資訊，以判斷待測物40於外觀是否有瑕疵，該瑕疵係為破損或尺寸不合。若有瑕疵產生，則控制單元3係通知工作人員，以取出或置換具有瑕疵之待測物40；或者控制單元3係記憶或記號有瑕疵之待測物40，以於後續製程再進一步處理。 The control unit 3 can also determine whether the object to be tested 40 has flaws according to the image information to be tested or the image information described above, and the flaw is not damaged or the size is different. If there is a defect, the control unit 3 notifies the worker to take out or replace the object to be tested 40 having the defect; or the control unit 3 is the object to be tested 40 that is memorized or marked for further processing in the subsequent process.
若更進一步論述第5圖與第6圖，如第5圖所示，依據高度資訊或厚度資訊，待測物40之厚度或高度較其餘的待測物40為厚或高，故位移模組21可選擇不動，或者沿著第三軸向朝遠離視覺模組22之方向移動一距離，以符合視覺模組22之焦距。 If the fifth and sixth figures are further discussed, as shown in FIG. 5, according to the height information or the thickness information, the thickness or height of the object to be tested 40 is thicker or higher than the remaining objects 40, so the displacement module 21 may be selected to move or move a distance away from the vision module 22 along the third axis to conform to the focal length of the vision module 22.
如第6圖所示，依據高度資訊或厚度資訊，待測物40之厚度或高度較其餘的待測物40為薄或低，位移模組21係沿著第三軸向朝向視覺模組22之方向移動一距離，以符合視覺模組22之焦距。 As shown in FIG. 6, according to the height information or the thickness information, the thickness or height of the object to be tested 40 is thinner or lower than the remaining objects 40, and the displacement module 21 faces the visual module 22 along the third axis. The direction is moved a distance to match the focal length of the vision module 22.
如上所述，控制單元3係依據至少一待測物40之資訊或依據至少一標的之資訊或計算至少一待測物40之資訊或計算該至少一標的之資訊，以使承台20調整位於承台20之待測物40與視覺模組22之間的距離。於此所述之資訊係為上述之厚度資訊或高度資訊，前述之計算可視為平均。經平均之至少一待測物40之資訊係轉換為厚度平均資訊或高度平均資訊。經平均之至少一標的之資訊係轉換為標的平均資訊。 As described above, the control unit 3 calculates the information of the at least one object 40 or calculates the information of the at least one object according to the information of the at least one object 40 or according to the information of the at least one object 40, so that the platform 20 is adjusted. The distance between the object 40 of the platform 20 and the vision module 22. The information described herein is the thickness information or height information described above, and the foregoing calculation can be regarded as an average. The average of at least one of the objects 40 to be tested is converted into thickness average information or height average information. The average of at least one of the subject information is converted to the target average information.
另外，控制模組3亦可依據多個資訊，而使視覺模組22依序擷取位於不同位置之待測物40之影像。或者依據高度平均資訊或厚度平均資訊，而使承台20維持第三軸向之一固定位置，以使視覺模組22擷取待測物40之影像。故視覺模組22能夠單點量測待測物40，再由承台20將所欲檢測之單點或待測物40，移動至視覺模組22的下方，並依據前述之資訊調整承台20於第三軸向之位置，以利進行取像。 In addition, the control module 3 can also sequentially capture the image of the object to be tested 40 at different positions according to the plurality of information. Or the platform 20 maintains a fixed position of the third axis according to the height average information or the thickness average information, so that the vision module 22 captures the image of the object 40 to be tested. Therefore, the vision module 22 can measure the object to be tested 40 at a single point, and then the platform 20 moves the single point or the object to be tested 40 to be below the vision module 22, and adjusts the platform according to the foregoing information. 20 is in the position of the third axis to facilitate image taking.
再者，控制單元3亦可由視覺模組22所擷取的影像，判斷待測物40之形狀，舉例而言，若待測物40為圓形、矩形、多角形或不規則形，控制單元3可由所擷取之影像判斷出。舉例而言，若待測物40為曲面物體，可藉由承台20第一軸向及第二軸向的移動取得曲面上之多點測距值，並使控制單元3描繪出曲面之輪廓及分析計算曲面狀況。 Furthermore, the control unit 3 can also determine the shape of the object to be tested 40 by the image captured by the vision module 22, for example, if the object to be tested 40 is circular, rectangular, polygonal or irregular, the control unit 3 can be judged by the captured image. For example, if the object to be tested 40 is a curved object, the multi-point ranging value on the curved surface can be obtained by the movement of the first axial direction and the second axial direction of the cap 20, and the control unit 3 can draw the contour of the curved surface. And analyze and calculate the surface condition.
再一，檢測單元2係能夠針對多個待測物40或特定之待測物40進行檢測。 Furthermore, the detecting unit 2 is capable of detecting a plurality of objects 40 to be tested or a specific object to be tested 40.
綜合上述，待測物40之形狀可能為矩形、圓形或多邊形，待測物40之表面可能為曲面、凹弧面、凸弧面或一凹凸面。本創作係藉由量測待測物40之高度或厚度。位移模組21依據前述之厚度或高度，以調整待測物40於第三軸向之位置，故能夠使視覺模組22能夠確實完成待測物40的對焦程序，所以視覺模組22能夠於不平坦表面且不共面之待測物40取得清晰且可利用的影像。 In summary, the shape of the object to be tested 40 may be rectangular, circular or polygonal, and the surface of the object to be tested 40 may be a curved surface, a concave curved surface, a convex curved surface or a concave-convex surface. The present invention measures the height or thickness of the object to be tested 40. The displacement module 21 adjusts the position of the object to be tested 40 in the third axial direction according to the thickness or height, so that the vision module 22 can surely complete the focusing process of the object 40, so the vision module 22 can The object 40 that is not flat and not coplanar obtains a clear and usable image.
以上所述之具體實施例，僅係用於例釋本創作之特點及功效，而非用於限定本創作之可實施範疇，於未脫離本創作上揭之精神與技術範疇下，任何運用本創作所揭示內容而完成之等效改變及修飾，均仍應為下述之申請專利範圍所涵蓋。 The specific embodiments described above are only used to illustrate the features and functions of the present invention, and are not intended to limit the scope of implementation of the present invention, without departing from the spirit and technical scope of the present invention. Equivalent changes and modifications made by the disclosure of the disclosure are still covered by the scope of the following patent application.
1‧‧‧量距單元 1‧‧‧Meeting unit
11‧‧‧讀取模組 11‧‧‧Reading module
2‧‧‧檢測單元 2‧‧‧Detection unit
20‧‧‧承台 20‧‧ ‧ captain
21‧‧‧位移模組 21‧‧‧ Displacement Module
22‧‧‧視覺模組 22‧‧‧Vision Module
3‧‧‧控制單元 3‧‧‧Control unit
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| TW105214660U TWM535319U (en) | 2016-09-23 | 2016-09-23 | Auto focusing device providing inspection and measurement |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI608226B (en) * | 2016-09-23 | 2017-12-11 | 均華精密工業股份有限公司 | Providing examination and measurement of auto focus apparatus and method using the same |
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| TWI608226B (en) * | 2016-09-23 | 2017-12-11 | 均華精密工業股份有限公司 | Providing examination and measurement of auto focus apparatus and method using the same |
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