TWM530714U - Electromagnetic field assisted laser drilling mechanism - Google Patents
Electromagnetic field assisted laser drilling mechanism Download PDFInfo
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- TWM530714U TWM530714U TW105210048U TW105210048U TWM530714U TW M530714 U TWM530714 U TW M530714U TW 105210048 U TW105210048 U TW 105210048U TW 105210048 U TW105210048 U TW 105210048U TW M530714 U TWM530714 U TW M530714U
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Description
本創作係關於一種雷射鑽孔機構；更詳而言之，係指一種電磁場輔助雷射鑽孔機構。 This creation relates to a laser drilling mechanism; more specifically, to an electromagnetic field assisted laser drilling mechanism.
參閱圖1及圖2，習知的雷射設備1係一機台11，一設於該機台11上方之雷射裝置12，一設於機台11上且與該雷射裝置12相對應之平台13，以及一放置於該平台13上且透過該雷射裝置12鑽孔之加工物件14。 Referring to FIG. 1 and FIG. 2, the conventional laser device 1 is a machine table 11, a laser device 12 disposed above the machine table 11, and a laser device 12 disposed on the machine table 11 and corresponding to the laser device 12. The platform 13 and a workpiece 14 placed on the platform 13 and bored through the laser device 12.
在使用時，將該欲鑽孔之加工物件14，置放於該平台13上，透過該雷射裝置12進行加工，然，在使用後發現，該加工物件14很容易受到該雷射裝置12鑽孔後而在該孔洞周圍產生熔渣堆積，進而影響到該加工物件14的後續製程。 In use, the workpiece 14 to be drilled is placed on the platform 13 and processed through the laser device 12. However, after use, the processed article 14 is easily received by the laser device 12. After drilling, slag buildup is generated around the hole, thereby affecting the subsequent process of the workpiece 14.
有鑑於此，本人遂依其多年從事相關領域之研發經驗，針對前述之缺失進行深入探討，並依前述需求積極尋求解決之道，歷經長時間的努力研究與多次測試，終於完成本創作。 In view of this, I have been engaged in research and development in related fields for many years, and have conducted in-depth discussions on the above-mentioned shortcomings, and actively sought solutions based on the above-mentioned needs. After a long period of hard work and many tests, I finally completed this creation.
本創作之主要優點在於在鑽孔後，該電場裝置可使該熔渣有效的減少，以使該加工物件可在後續製程中有較佳之良率。 The main advantage of this creation is that after drilling, the electric field device can effectively reduce the slag so that the processed article can have a better yield in subsequent processes.
為達上述之目的，本創作之電磁場輔助雷射鑽孔機構係包含有一機台，一設於該機台上方之雷射裝置，一設於機台上且與該雷射裝置相對應之平台，一放置於該平台上且透過該雷射裝置鑽孔之加工物件，以及一設於該平台上之電場裝置，用以提供電場至該加工物件；其中，該雷射裝置具有雷射噴頭，以及連接該雷射噴頭之吹氣單元。 For the above purposes, the electromagnetic field assisted laser drilling mechanism of the present invention comprises a machine, a laser device disposed above the machine, and a platform disposed on the machine and corresponding to the laser device. a processing object placed on the platform and bored through the laser device, and an electric field device disposed on the platform for providing an electric field to the processed object; wherein the laser device has a laser nozzle And a blowing unit connected to the laser nozzle.
本創作特徵在於，透過該電場裝置所提供的電場，可使該鑽孔後所產生之熔渣較不易形成，以確保該鑽孔後的物件在表面上較為平滑，並在後續的製程中能有更好之良率。 The present invention is characterized in that the slag generated after the drilling is less likely to be formed by the electric field provided by the electric field device, so as to ensure that the object after the drilling is smooth on the surface and can be processed in a subsequent process. Have a better yield.
2‧‧‧電磁場輔助雷射鑽孔機構 2‧‧‧Electromagnetic field assisted laser drilling mechanism
21‧‧‧機台 21‧‧‧ machine
22‧‧‧雷射裝置 22‧‧‧ Laser device
221‧‧‧雷射噴頭 221‧‧‧Laser nozzle
222‧‧‧吹氣單元 222‧‧‧Blowing unit
23‧‧‧平台 23‧‧‧ platform
24‧‧‧加工物件 24‧‧‧Processed objects
24’‧‧‧陶瓷基板 24'‧‧‧Ceramic substrate
25‧‧‧電場裝置 25‧‧‧Electrical field installation
251‧‧‧上側電極 251‧‧‧Upper electrode
252‧‧‧下側電極 252‧‧‧lower electrode
〔習知〕 [study]
1‧‧‧雷射設備 1‧‧ ‧ laser equipment
11‧‧‧機台 11‧‧‧ machine
12‧‧‧雷射裝置 12‧‧‧ Laser device
13‧‧‧平台 13‧‧‧ platform
14‧‧‧加工物件 14‧‧‧Processed objects
第1圖：習知立體示意圖；第2圖：習知鑽孔後的加工物件示意圖；第3圖：本創作之實施例立體示意圖；第4圖：本創作之實施例電場裝置第一態樣示意圖；第5圖：本創作之實施例電場裝置第二態樣示意圖；第6圖：本創作之實施例電場裝置第三態樣示意圖；第7圖：本創作鑽孔後的加工物件示意圖。 Figure 1: Schematic diagram of a conventional one; Figure 2: Schematic diagram of a processed object after drilling; Figure 3: A perspective view of an embodiment of the present invention; Figure 4: First aspect of the electric field device of the embodiment of the present invention FIG. 5 is a schematic view showing the second aspect of the electric field device of the embodiment of the present invention; FIG. 6 is a schematic view showing the third aspect of the electric field device of the embodiment of the present invention; and FIG. 7 is a schematic view of the processed object after the drilling.
為期許本發明之目的、功效、特徵及結構能夠有更為詳盡之瞭解，茲舉較佳實施例並配合圖式說明如後。 A more detailed understanding of the objects, functions, features and structures of the present invention will be apparent.
請參考第3圖，第3圖是本創作之立體示意圖。 Please refer to Figure 3, which is a three-dimensional diagram of the creation.
如圖3所述，本創作之電磁場輔助雷射鑽孔機構2，包含有一機台21，一設於該機台21上方之雷射裝置22，一設於機台21上且與該雷射裝置22相對應之平台23，一放置於該平台23上且透過該雷射裝置22鑽孔之加工物件24，以及一設於該平台23上之電場裝置25，用以提供電場至該加工物件24；其中，該雷射裝置22具有雷射噴頭221，以及連接該雷射噴頭221之吹氣單元222。 As shown in FIG. 3, the electromagnetic field-assisted laser drilling mechanism 2 of the present invention comprises a machine table 21, a laser device 22 disposed above the machine table 21, and a laser device 22 disposed on the machine table 21 and the laser device. The device 22 corresponding to the platform 23, a processed object 24 placed on the platform 23 and bored through the laser device 22, and an electric field device 25 disposed on the platform 23 for providing an electric field to the processed object 24; wherein the laser device 22 has a laser nozzle 221 and a blowing unit 222 connected to the laser nozzle 221 .
請同時參考第4圖、第5圖及第6圖，第4圖是本創作之實施例電場裝置第一態樣示意圖，第5圖是本創作之實施例電場裝置第二態樣示意圖，第6圖是本創作之實施例電場裝置第三態樣示意圖。 Please refer to FIG. 4, FIG. 5 and FIG. 6 at the same time. FIG. 4 is a first schematic view of the electric field device of the embodiment of the present invention, and FIG. 5 is a second schematic view of the electric field device of the embodiment of the present invention. Figure 6 is a schematic view of the third aspect of the electric field device of the embodiment of the present invention.
接續前述，如圖4所示，其中，該電場裝置25係適時設於該平台23上，且同時平行相對位於該加工物件24鑽孔處上方及下方，同時將該加工物件24鑽孔處夾於該電場裝置25之中，而前述該電場裝置25提供水平於該加工物件24方向之電場，使該鑽孔後之熔渣能向該水平方向之電場吸引，而不致囤積在該鑽孔處；另，本圖中該加工物件24以陶瓷基板24’為例做說明。 In the foregoing, as shown in FIG. 4, the electric field device 25 is disposed on the platform 23 at the same time, and is simultaneously located above and below the drilled portion of the workpiece 24 in parallel, and simultaneously clamps the workpiece 24 into the hole. In the electric field device 25, the electric field device 25 provides an electric field horizontal to the direction of the workpiece 24, so that the slag after the drilling can be attracted to the electric field in the horizontal direction without being accumulated in the hole. In addition, in the figure, the processed object 24 is exemplified by a ceramic substrate 24'.
如圖5所示，該電場裝置25也可以第二態樣呈現，即，該電場裝置25可適時向該平台23方向沿伸設於該雷射噴頭221上，並懸空於該加工物件24上方，而前述該電場裝置25提供水平於該加工物件24方向之電場，使該鑽孔後之熔渣能向該水平方向之電場吸引，而不致囤積在該鑽孔處。 As shown in FIG. 5, the electric field device 25 can also be presented in a second aspect, that is, the electric field device 25 can be extended to the laser head 221 in the direction of the platform 23 and suspended above the workpiece 24 The electric field device 25 described above provides an electric field horizontal to the direction of the workpiece 24 so that the slag after the drilling can be attracted to the electric field in the horizontal direction without being accumulated at the bore.
如圖6所示，該電場裝置25亦可以第三態樣呈現，即，其中，該電場裝置25具有延伸設於該雷射噴頭221的上側電極251，且該上側電極251可與該雷射裝置22連動，以及設於該加工物件24與該平台23之間的下側電極252，而前述該電場裝置25係提供垂直於該加工物件24方向的電場，且該下側電極252可適時鑽出許多複數個孔洞，當雷射裝置鑽孔後所產生的氣流，可透過該複數孔洞具有更順利流通，進而解決氣流難以排出而造成熔渣移除效果不佳之現象。 As shown in FIG. 6, the electric field device 25 can also be presented in a third aspect, that is, the electric field device 25 has an upper electrode 251 extending from the laser head 221, and the upper electrode 251 can be coupled to the laser. The device 22 is interlocked, and a lower electrode 252 is disposed between the workpiece 24 and the platform 23. The electric field device 25 provides an electric field perpendicular to the direction of the workpiece 24, and the lower electrode 252 can be drilled at the right time. A plurality of holes are formed, and the airflow generated by the drilling of the laser device can be smoothly circulated through the plurality of holes, thereby solving the phenomenon that the airflow is difficult to be discharged and the slag removal effect is poor.
延續前述，如圖4所示，本實施例中以該電場裝置25第一態樣為例做說明。 Continuing the foregoing, as shown in FIG. 4, the first aspect of the electric field device 25 is taken as an example for description in the present embodiment.
當該雷射裝置22發出雷射並鑽孔於該陶瓷基板24’後，該陶瓷基板24’中的主要成分氧化鋁會部分形成熔融態，且在尚未汽化前即被該吹氣單元222吹出該孔洞，使汽化後的物質會凝固於該孔洞的周圍形成熔渣，而本實施例中，該熔融態之氧化鋁會解離出帶正負電的離子，在被雷射鑽孔而產生汽化時也會產生帶電離子形成電漿，而該電場裝置25即可在熔融態或者汽化時的陶瓷基板24’之孔洞附近，將該可能 形成熔渣的帶電離子吸引，以減少該孔洞周圍熔渣之堆積，即可獲得如圖7之鑽孔後的陶瓷基板24’，如此所得之陶瓷基板24’較為平滑，較不會使在後續製程時有所缺失，導致降低良率，是以，可以產生更好之加工成品。 After the laser device 22 emits a laser and drills the ceramic substrate 24', the main component alumina in the ceramic substrate 24' is partially formed into a molten state, and is blown out by the blowing unit 222 before it is vaporized. The pores cause the vaporized material to solidify around the pores to form slag, and in the present embodiment, the molten alumina dissociates the positively and negatively charged ions, and is vaporized by laser drilling. A charged ion is also formed to form a plasma, and the electric field device 25 can be in the vicinity of the hole of the ceramic substrate 24' in a molten state or vaporized, which is possible The charged ion attraction of the slag is formed to reduce the accumulation of slag around the hole, so that the ceramic substrate 24' after drilling as shown in FIG. 7 can be obtained, and the ceramic substrate 24' thus obtained is relatively smooth, and is less likely to be followed. There are some defects in the process, which leads to a lower yield, so that a better finished product can be produced.
綜上所述，本創作之電磁場輔助雷射鑽孔機構係具有下列之優點： In summary, the electromagnetic field-assisted laser drilling mechanism of the present invention has the following advantages:
1.經該電場裝置所產生之電場處理後之鑽孔作動，該孔洞較少有熔渣形成，可有助於提高後續製程之良率。 1. After the electric field treatment by the electric field device is performed, the hole is less slag formed, which can help to improve the yield of the subsequent process.
2.該電場裝置之第二態樣，可縮短電極之間距，提高電場應用效率。 2. The second aspect of the electric field device can shorten the distance between the electrodes and improve the application efficiency of the electric field.
3.該電場裝置之第三態樣，該下側電極特別有許多孔洞，可使該電場裝置在雷射鑽孔後，氣流可更順利的流通，故可解決一般氣流無法順利排出而造成熔渣移除效果不佳之功效。 3. The third aspect of the electric field device, the lower electrode has a plurality of holes, which can make the electric field device flow more smoothly after the laser drilling, so that the general airflow cannot be smoothly discharged and the melting is caused. The effect of poor slag removal.
故，本創作在同類產品中具有極佳之進步性以及實用性，同時查遍國內外關於此類結構之技術資料文獻後，確實未發現有相同或近似之構造存在於本案申請之前，因此本案應已符合『創作性』、『合於產業利用性』以及『進步性』的專利要件，爰依法提出申請之。 Therefore, this creation has excellent progress and practicality in similar products. At the same time, after checking the technical literature on such structures at home and abroad, it has not been found that the same or similar structure exists before the application of this case, so this case It should meet the patent requirements of "creative", "combined with industrial use" and "progressive", and apply in accordance with the law.
唯，以上所述者，僅係本創作之較佳實施例而已，舉凡應用本創作說明書及申請專利範圍所為之其它等效結構變化者，理應包含在本創作之申請專利範圍內。 It is to be understood that the above-mentioned preferred embodiments of the present invention are intended to be included in the scope of the present invention.
2‧‧‧電磁場輔助雷射鑽孔機構 2‧‧‧Electromagnetic field assisted laser drilling mechanism
21‧‧‧機台 21‧‧‧ machine
22‧‧‧雷射裝置 22‧‧‧ Laser device
221‧‧‧雷射噴頭 221‧‧‧Laser nozzle
222‧‧‧吹氣單元 222‧‧‧Blowing unit
23‧‧‧平台 23‧‧‧ platform
24‧‧‧加工物件 24‧‧‧Processed objects
25‧‧‧電場裝置 25‧‧‧Electrical field installation
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105210048U TWM530714U (en) | 2016-07-04 | 2016-07-04 | Electromagnetic field assisted laser drilling mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105210048U TWM530714U (en) | 2016-07-04 | 2016-07-04 | Electromagnetic field assisted laser drilling mechanism |
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| Publication Number | Publication Date |
|---|---|
| TWM530714U true TWM530714U (en) | 2016-10-21 |
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| TW105210048U TWM530714U (en) | 2016-07-04 | 2016-07-04 | Electromagnetic field assisted laser drilling mechanism |
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| TW (1) | TWM530714U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108161052A (en) * | 2018-02-06 | 2018-06-15 | 华侨大学 | Magnetic field assists cylindrical turning equipment |
-
2016
- 2016-07-04 TW TW105210048U patent/TWM530714U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108161052A (en) * | 2018-02-06 | 2018-06-15 | 华侨大学 | Magnetic field assists cylindrical turning equipment |
| CN108161052B (en) * | 2018-02-06 | 2023-12-29 | 华侨大学 | Magnetic field auxiliary cylindrical turning equipment |
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