TWM526184U - Composite optical sensor for small aperture - Google Patents
Composite optical sensor for small aperture Download PDFInfo
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- TWM526184U TWM526184U TW105204399U TW105204399U TWM526184U TW M526184 U TWM526184 U TW M526184U TW 105204399 U TW105204399 U TW 105204399U TW 105204399 U TW105204399 U TW 105204399U TW M526184 U TWM526184 U TW M526184U
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本創作係有關一種適用於小孔徑之複合型光學感測器，其不僅設製開孔為圓形孔，在智慧型手持行動裝置之外觀上呈現較短之小孔徑，也能俾達近接感測器之近接感測角度極小化、環境光感測器之環境光感測角度極大化。 The present invention relates to a composite optical sensor suitable for a small aperture, which not only has a circular hole for opening, but also has a short aperture in the appearance of a smart handheld mobile device, and can also provide a close proximity. The proximity sensing angle of the detector is minimized, and the ambient light sensing angle of the ambient light sensor is maximized.
按，在智慧型手持行動裝置中(例如手機)，常會搭配環境光感測器(Ambient Light Sensor,ALS)偵測環境光亮度，亦能使螢幕隨著環境光變化，而調節螢幕亮度，以增加使用時間，及近接感測器(Proximity Sensor,PS)與發光元件，亦可偵測物體靠近程度，當使用者的臉部靠近螢幕時，則螢幕的觸控功能會自動關閉，避免使用者在講電話的過程，而造成臉部誤觸螢幕，以增進人機間的互動性，再者，環境光線感測器與近接感測器皆為感測光線，能被整合至同一封裝結構，不僅可共享空間、耗材，也能合併電力供應的線路佈局。而上述之ALS及PS結構，一般是設在手機顯示面板的側邊，而手機表面為了因應不同型態的ALS及PS結構，必須設製開孔如圖1A所示之長形孔(G1)，或圖1B所示之圓形孔(G2)。 Press, in smart handheld mobile devices (such as mobile phones), often use Ambient Light Sensor (ALS) to detect ambient light brightness, and also enable the screen to adjust the brightness of the screen as the ambient light changes. Increase the usage time, and proximity sensor (PS) and light-emitting components, and detect the proximity of the object. When the user's face is close to the screen, the touch function of the screen will be automatically turned off to avoid the user. In the process of talking on the phone, the face is accidentally touched by the screen to enhance the interaction between the human and the human. Furthermore, the ambient light sensor and the proximity sensor are both sensing light and can be integrated into the same package structure. Not only can you share space, consumables, but also the layout of the power supply. The above ALS and PS structures are generally disposed on the side of the display panel of the mobile phone, and the surface of the mobile phone must have an elongated hole (G 1 as shown in FIG. 1A) in order to respond to different types of ALS and PS structures. ), or a circular hole (G 2 ) as shown in Fig. 1B.
次按，智慧型手持行動裝置之外觀設計逐漸受到消費者之重視，對於外觀設計上之開孔乃越小孔徑越好，但ALS及PS結構在應用上的考量不同，如發光元件與PS結構之間的近接感測角度越小越好，而ALS結構之環境光感測角度越大越好，若整合至同一封裝結構，則ALS結構與PS結構需一起對應開孔，因此，開孔在智慧型手持行動裝置之外觀上呈現小孔徑，並非簡 單之事，如圖1A所示，其智慧型手持行動裝置(P)之開孔為長形孔(G1)，設計成較長之大孔徑(T1)，但為了符合消費者對外觀設計需求，逐漸將智慧型手持行動裝置(P)之開孔為圓形孔(G2)，設計成較短之小孔徑(T2)，如圖1B所示，不過，卻犧牲環境光感測器之環境光感測範圍。 Sub-press, the design of the smart handheld mobile device is gradually receiving the attention of consumers. The smaller the aperture is, the better the opening is, but the ALS and PS structure are different in application, such as between the light-emitting component and the PS structure. The smaller the proximity sensing angle, the better, and the larger the ambient light sensing angle of the ALS structure, the better. If integrated into the same package structure, the ALS structure and the PS structure need to be correspondingly opened, so the opening is in the smart hand. The appearance of the mobile device is small, which is not a simple matter. As shown in FIG. 1A, the opening of the smart handheld mobile device (P) is an elongated hole (G 1 ), which is designed to have a long aperture (T). 1 ), but in order to meet the consumer's design requirements, the opening of the smart handheld mobile device (P) is gradually made into a circular hole (G 2 ), designed as a short small aperture (T 2 ), as shown in Figure 1B. As shown, however, the ambient light sensing range of the ambient light sensor is sacrificed.
如圖2所示，其乃為一種光學近接感測器封裝結構10，其ALS及PS結構係屬一種橫向配置型態，因此手機乃配合開孔為長形孔(G1)，屬於較長之大孔徑(T1)，其結構包含：一基板11；一紅外線發光二極體12(IR LED)，係安裝於該基板11；一感測器13，係安裝於該基板11，並具有一近接感測單元131及環境光線感測單元132；以及該感測器13與該紅外線發光二極體12之間形成一障壁14，因此，該障壁14可防止該紅外線發光二極體12干擾該感測器13之近接感測單元131，當該紅外線發光二極體12自發光源經物體(O)反射後至該感測器13之近接感測單元131，形成近接感測角度(θa1)，與該感測器13之環境光線感測單元132預定環境光感測角度(θb1)而接受環境光源(L)，但該障壁14會阻擋該環境光線感測單元132之環境光感測範圍，使環境光感測角度(θb1)不宜過大，且該近接感測單元131靠近該環境光線感測單元132左側，使近接感測角度(θa1)不宜過小，因此，近接感測角度(θa1)與環境光感測角度(θb1)相互配合皆為適中，此時，該發光元件12與該環境光線感測單元132、近接感測單元131之間距離較長，故設製開孔為長形孔(G1)，在智慧型手持行動裝置(P)之外觀上呈現較長之大孔徑(T1)。 As shown in FIG. 2, it is an optical proximity sensor package structure 10, and the ALS and PS structures are in a horizontal configuration. Therefore, the mobile phone is matched with the opening as an elongated hole (G 1 ), which is longer. The large aperture (T 1 ) has a structure including: a substrate 11; an infrared light emitting diode 12 (IR LED) mounted on the substrate 11; a sensor 13 mounted on the substrate 11 and having a proximity sensing unit 131 and an ambient light sensing unit 132; and a barrier 14 formed between the sensor 13 and the infrared light emitting diode 12, so that the barrier 14 can prevent the infrared light emitting diode 12 from interfering with The proximity sensing unit 131 of the sensor 13 is configured to form a proximity sensing angle (θ a1 when the infrared light emitting diode 12 is reflected from the light source through the object (O) to the proximity sensing unit 131 of the sensor 13 The ambient light sensing unit 132 of the sensor 13 receives the ambient light sensing angle (θ b1 ) to receive the ambient light source (L), but the barrier 14 blocks the ambient light perception of the ambient light sensing unit 132. Measuring range, so that the ambient light sensing angle (θ b1 ) should not be too large, and the proximity sensing unit 131 depends on Near the left side of the ambient light sensing unit 132, the proximity sensing angle (θ a1 ) should not be too small. Therefore, the proximity sensing angle (θ a1 ) and the ambient light sensing angle (θ b1 ) are matched to each other. The distance between the light-emitting element 12 and the ambient light sensing unit 132 and the proximity sensing unit 131 is long, so that the opening is an elongated hole (G 1 ), and the appearance of the smart handheld mobile device (P) A longer, larger aperture (T 1 ) is present.
如圖3所示，其揭示在US Patent No.8,143,608，為一種層疊封裝光學近接感測器20，其ALS及PS結構亦屬一種橫向配置型態，因此手機配合開孔為長形孔(G1)，屬於較長之大孔徑(T1)，包括：一紅外光發射 器211，安裝於一第一基板21上，且該第一基板21具有導線結合襯墊212；一光偵測器221、環境光感測器222，安裝於一第二基板22上，且該第二基板22具有導線結合襯墊223、224；以及一積體電路(圖未示)，安裝於一第三基板23上並藉由一包覆成型複合物24予以囊封，該積體電路包括光發射器驅動、光偵測電路及環境光感測電路，該第三基板23進一步包括至少第一組、第二組及第三組電連接至該積體電路且未被該包覆成型複合物24覆蓋的導線結合襯墊231、232、233；其中該第一基板21及該第二基板22係安裝於該包覆成型複合物24上，該紅外光發射器211透過該第一基板21之導線結合襯墊212，以導線25經由該第一組導線結合襯墊231至該光發射器驅動電路，該光偵測器221、環境光感測器222透過該第二基板22之導線結合襯墊223、224，以導線25分別經由該第二及三組導線結合襯墊232、233至該光偵測電路、環境光感測電路；一第一模塑紅外光通過組件26可經塑形以包含透鏡261，並被配置於該紅外光發射器211之上並覆蓋該紅外光發射器211；一第二模塑紅外光通過組件27可經塑形以包含透鏡271，並被配置於該光偵測器221、環境光感測器222之上並覆蓋該光偵測器221、環境光感測器222，且一模塑紅外光截止組件(圖未示)被配置於該第三基板23之若干部份與該第一紅外光通過組件26及該第二紅外光通過組件27之間及之上，因此，該紅外光發射器211、光偵測器221分別安裝於該第一基板21、第二基板22，可防止該紅外光發射器211干擾該光偵測器221，當該紅外光發射器211自發光源經物體(O)反射後至該光偵測器221，形成近接感測角度(θa2)，與該環境光感測器預定環境光感測角度(θb2)而接受環境光源(L)，且無障壁讓該環境光感測器222之環境光感測範圍不會被阻擋，使環境光感測角度(θb2)可變大，不過，該環境光感測器222係位於該紅外光發射器211與該光偵測器221之間，使近接感測角度(θa2)無法變小仍為適中，此時，該紅外光發射器211與該光偵測器221之間距離無法縮短距離，故設製開孔為長形 孔(G1)，在智慧型手持行動裝置(P)之外觀上仍呈現較長之大孔徑(T1)。 As shown in FIG. 3, it is disclosed in US Patent No. 8,143,608, which is a laminated package optical proximity sensor 20 whose ALS and PS structures are also in a lateral configuration type, so that the mobile phone cooperates with the opening as an elongated hole (G). 1 ), belonging to a longer large aperture (T 1 ), comprising: an infrared light emitter 211 mounted on a first substrate 21, and the first substrate 21 has a wire bond pad 212; a light detector 221, the ambient light sensor 222 is mounted on a second substrate 22, and the second substrate 22 has wire bonding pads 223, 224; and an integrated circuit (not shown) mounted on a third substrate 23 and encapsulated by a overmolded composite 24 comprising a light emitter drive, a light detecting circuit and an ambient light sensing circuit, the third substrate 23 further comprising at least a first group, Two sets and a third set of wire bond pads 231, 232, 233 electrically connected to the integrated circuit and not covered by the overmolded composite 24; wherein the first substrate 21 and the second substrate 22 are mounted on The infrared light emitter 211 passes through the wire of the first substrate 21 on the overmolded composite 24 The pad 212 is connected to the light emitter driving circuit via the first group of wires, and the light detector 221 and the ambient light sensor 222 pass through the wire bonding pad of the second substrate 22 . 223, 224, through the second and third sets of wires respectively bonding the pads 232, 233 to the photodetection circuit, the ambient light sensing circuit; a first molded infrared light passing through the assembly 26 can be shaped A lens 261 is included and disposed on the infrared light emitter 211 and covers the infrared light emitter 211; a second molded infrared light passing assembly 27 can be shaped to include the lens 271 and disposed on the light The detector 221 and the ambient light sensor 222 cover the photodetector 221 and the ambient light sensor 222, and a molded infrared light blocking component (not shown) is disposed on the third substrate 23 The infrared light emitter 211 and the light detector 221 are respectively mounted on the first substrate 21, and the first infrared light emitter 211 and the light detector 221 are respectively mounted on and between the first infrared light passing component 26 and the second infrared light passing component 27. The second substrate 22 prevents the infrared light emitter 211 from interfering with the photodetector 221 when Spontaneous outer light the light emitter 211 from an object (O) to the rear reflection light detector 221, is formed proximity sensing angle (θ a2), and the predetermined ambient light sensor sensing ambient light sensing angle (θ b2) Receiving the ambient light source (L), and the barrier-free wall makes the ambient light sensing range of the ambient light sensor 222 not blocked, so that the ambient light sensing angle (θ b2 ) can be changed, but the ambient light sensing The 222 is located between the infrared light emitter 211 and the light detector 221, so that the proximity sensing angle (θ a2 ) cannot be made small, and the infrared light emitter 211 and the light detection are the distance between the distance 221 can not be shortened, it is provided an elongated hole opening system (G 1), it is still present large long aperture (T 1) in the appearance of the handheld smart device (P) of.
如圖4示，其揭示在US Patent No.8,716,722，另一種光感測式晶片封裝結構30，其ALS及PS結構係設在一下凹槽內，因此有別於上述二種橫向配置型態，因此手機可配合開孔為圓形孔(G2)，屬於較短之小孔徑(T2)，其結構包含：一基板31，包含有一第一凹槽311、一第二凹槽312及一光線導引槽313，該基板31具有不透光性及底面含有銲墊38(Solder Pad)，該第一凹槽311與該第二凹槽312之開放端方向相異，該光線導引槽313之一開放端與第一凹槽311之開放端同側，另一開放端連通至該第二凹槽312，且該第二凹槽312及光線導引槽313內各設有一光反射層34；一發光晶片32，其係設置於第一凹槽311內；以及一光學感測晶片33，其係設置於第二凹槽312內，並以金屬凸塊37覆固於該第二凹槽312內，該光學感測晶片33具有環境光線感測單元331與近接感測單元332，並以一第一封裝膠體35與一第二封裝膠體36，該第一封裝膠體35是填設於該第一凹槽311內且覆蓋該發光晶片32，該第二封裝膠體36是填設於該光線導引槽313內且覆蓋該光學感測晶片33，且該第一封裝膠體35與該第二封裝膠體36是透光材料，因此，該發光晶片32、該光學感測晶片33之環境光線感測單元331、近接感測單元332分別設置於該第一凹槽311、第二凹槽312，可防止該發光晶片32干擾光學感測晶片33之近接感測單元332，當該發光晶片32自發光源經物體(O)反射後，經由該光線導引槽313導引至該光學感測晶片33之近接感測單元332，形成近接感測角度(θa3)，與該光學感測晶片33之環境光感測器331預定環境光感測角度(θb3)，經由該光線導引槽313導引而接受環境光源(L)，除此之外，該第一凹槽311與該第二凹槽312之間部分疊設，相對地，該光學感測晶片33之環境光感測器331、近接感測單元332與該發光晶片32之間可縮短距離，使近接感測角度(θa3)、環境光感測角度(θb3)皆變小，故設製開孔為圓形孔(G2)， 在智慧型手持行動裝置(P)之外觀上呈現較短之小孔徑(T2)，但卻犧牲環境光感測器之環境光感測範圍。 As shown in FIG. 4, it is disclosed in US Patent No. 8,716,722, another photo-sensing chip package structure 30 in which the ALS and PS structures are disposed in the lower recesses, and thus are different from the above two lateral configuration types. Therefore, the mobile phone can cooperate with the opening as a circular hole (G 2 ), and belongs to a short small aperture (T 2 ). The structure comprises: a substrate 31 including a first groove 311, a second groove 312 and a The light guiding groove 313, the substrate 31 has opacity and the bottom surface includes a solder pad 38. The first groove 311 is different from the open end of the second groove 312. One open end of the 313 is on the same side as the open end of the first recess 311, and the other open end is connected to the second recess 312. The second recess 312 and the light guiding slot 313 are respectively provided with a light reflecting layer. An illuminating chip 32 is disposed in the first recess 311; and an optical sensing wafer 33 is disposed in the second recess 312 and is fixed to the second recess by a metal bump 37. In the slot 312, the optical sensing chip 33 has an ambient light sensing unit 331 and a proximity sensing unit 332, and a first encapsulant 35 and a first The first encapsulant 35 is filled in the first recess 311 and covers the illuminating chip 32. The second encapsulant 36 is filled in the ray guiding groove 313 and covers the optical sensation. The wafer 33 is measured, and the first encapsulant 35 and the second encapsulant 36 are light transmissive materials. Therefore, the illuminating chip 32, the ambient light sensing unit 331 and the proximity sensing unit 332 of the optical sensing chip 33 respectively The first recess 311 and the second recess 312 are disposed to prevent the illuminating chip 32 from interfering with the proximity sensing unit 332 of the optical sensing chip 33. When the illuminating chip 32 is reflected from the illuminating source through the object (O), The light guiding groove 313 is guided to the proximity sensing unit 332 of the optical sensing chip 33 to form a proximity sensing angle (θ a3 ), and the ambient light sensor 331 of the optical sensing chip 33 is predetermined ambient light. The angle of view (θ b3 ) is guided by the light guiding groove 313 to receive the ambient light source (L). In addition, the first groove 311 and the second groove 312 are partially overlapped, and oppositely The ambient light sensor 331 of the optical sensing chip 33, the proximity sensing unit 332 and the hair Distance between the wafer 32 can be shortened, so that proximity sensing angle (θ a3), the ambient light sensing angle (θ b3) are small, so the system provided openings are circular holes (G 2), in the handheld smart The device (P) exhibits a short, small aperture (T 2 ) in appearance, but at the expense of the ambient light sensing range of the ambient light sensor.
此外，基於ALS及PS結構在應用上的考量不同，將PS結構與發光元件設成一模組，及ALS結構設成另一模組，並分別對應不同開孔，因此，設製不同開孔皆為圓形孔，分別在智慧型手持行動裝置之外觀上呈現小孔徑，雖外觀設計符合消費者需求，不過，兩個模組並非整合至同一封裝結構，相對地，體積較為龐大，而不易組裝至智慧型手持行動裝置(P)內，故容不贅述。 In addition, based on the application considerations of the ALS and the PS structure, the PS structure and the light-emitting element are set as one module, and the ALS structure is set as another module, and respectively corresponding to different openings, therefore, different openings are set. They are all circular holes, which respectively have a small aperture in the appearance of the smart handheld mobile device. Although the design is in line with the consumer's needs, the two modules are not integrated into the same package structure, but the volume is relatively large and not easy. Assembled into the smart handheld mobile device (P), so I won't go into details.
本創作人有鑑於該光學近接感測器封裝結構10、層疊封裝光學近接感測器20及光感測式晶片封裝結構30，乃構思一種適用於小孔徑之複合型光學感測器，不僅設製開孔為圓形孔(G2)，在智慧型手持行動裝置(P)之外觀上呈現較短之小孔徑(T2)，也能配合ALS及PS結構在應用上的考量不同，如發光元件(紅外線發光二極體12、紅外光發射器211、發光晶片32)與PS結構(近接感測單元131、光偵測器221、近接感測單元332)之間的近接感測角度越小越好，而ALS結構(環境光線感測單元132、環境光感測器222、環境光線感測單元331)之環境光感測角度越大越好，為本創作所欲解決的課題。 In view of the optical proximity sensor package structure 10, the package package optical proximity sensor 20 and the light sensing chip package structure 30, the present inventors conceived a composite optical sensor suitable for a small aperture, not only The opening is a circular hole (G 2 ), which exhibits a short small aperture (T 2 ) in the appearance of the smart handheld mobile device (P), and can also be used in conjunction with ALS and PS structures, such as application considerations, such as The closer the proximity sensing angle between the light-emitting element (infrared light-emitting diode 12, infrared light emitter 211, and light-emitting chip 32) and the PS structure (near-sensing unit 131, photodetector 221, and proximity sensing unit 332) The smaller the better, the larger the ambient light sensing angle of the ALS structure (the ambient light sensing unit 132, the ambient light sensor 222, and the ambient light sensing unit 331) is, and the better the problem is to be solved.
緣是，本創作之主要目的，係在提供一種適用於小孔徑之複合型光學感測器，其將ALS結構獨立成一個環境光感測晶片，並與PS結構為近接感測器之電路相互分離，令環境光感測晶片、近接感測器皆可縮短與發光元件的距離，不僅開孔為圓形孔，在智慧型手持行動裝置之外觀上呈現較短之小孔徑，也能俾達近接感測器之近接感測角度極小化、環境光感測器之環境光感測角度極大化。 The main purpose of this creation is to provide a composite optical sensor suitable for small apertures, which separates the ALS structure into an ambient light sensing chip and interacts with the PS structure as a proximity sensor circuit. Separation, so that the ambient light sensing chip and the proximity sensor can shorten the distance from the light emitting element, and the opening is not only a circular hole, but also has a short aperture in the appearance of the smart handheld mobile device. The proximity sensing angle of the proximity sensor is minimized, and the ambient light sensing angle of the ambient light sensor is maximized.
為達上述目的，本創作採用之技術手段包含：一基板(Frame)；一發光元件，係耦接於該基板上；一特殊應用集成電路晶片(Application Specific Integrated Circuit Die,ASIC Die)，係耦接於該基板上，且該特殊應用集成電路晶片係嵌入一近接感測器(Proximity Sensor,PS)，並在該特殊應用集成電路晶片與該發光元件之間係設有一障壁(Barrier)；以及一環境光感測晶片(Ambient Light Sensor Die,ALS Die)，該環境光感測晶片係先製造成型後，再耦接於該特殊應用集成電路晶片上，使其呈現獨立凸起於該特殊應用集成電路晶片上一預定高度之型態，且該環境光感測晶片未遮蔽該特殊應用集成電路晶片之近接感測器，據以形成一適用於小孔徑之複合型光學感測器；藉此，該發光元件自發光源經反射至該近接感測器，以一定之該障壁高度防止該發光元件自發光源干擾該近接感測器，而該環境光感測晶片之高度可配合該障壁高度獨立製造成型，讓該環境光感測晶片之環境光感測範圍不被該障壁高度所阻擋，俾使該近接感測器之近接感測角度極小化，及使該環境光感測器之環境光感測角度極大化。 In order to achieve the above objectives, the technical means adopted by the present invention comprises: a substrate; a light-emitting component coupled to the substrate; an application specific integrated circuit die (ASIC Die), coupled Connected to the substrate, and the special application integrated circuit chip is embedded in a Proximity Sensor (PS), and a barrier is disposed between the special application integrated circuit chip and the light emitting element; An Ambient Light Sensor Die (ALS Die), which is first fabricated and then coupled to the special application integrated circuit chip to make it stand out from the special application. Forming a predetermined height on the integrated circuit chip, and the ambient light sensing wafer does not shield the proximity sensor of the special application integrated circuit chip, thereby forming a composite optical sensor suitable for a small aperture; The illuminating element is reflected from the illuminating source to the proximity sensor, and the height of the barrier is prevented to prevent the illuminating element from interfering with the proximity sensor from the illuminating source, and the environment The height of the sensing chip can be independently formed and matched with the height of the barrier, so that the ambient light sensing range of the ambient light sensing chip is not blocked by the height of the barrier, so that the proximity sensing angle of the proximity sensor is minimized. And maximizing the ambient light sensing angle of the ambient light sensor.
依據前揭特徵，該環境光感測晶片可為環境光感測、或是三原色(RGB)感測晶片或紫外線(UV)感測晶片其中之一所構成。 According to the foregoing features, the ambient light sensing wafer can be formed by ambient light sensing, or one of a three primary color (RGB) sensing wafer or an ultraviolet (UV) sensing wafer.
依據前揭特徵，該發光元件可為發光二極體(LED)、雷射二極體(LD)或光垂直腔面發射激光器(Vertical Cavity Surface Emission Laser,VCSEL)其中之一所構成。 According to the foregoing feature, the light emitting element may be composed of one of a light emitting diode (LED), a laser diode (LD) or a Vertical Cavity Surface Emission Laser (VCSEL).
依據前揭特徵，該基板係可由陶瓷電路板或印刷電路板其中之一所構成，使該基板之內部形成相互連接之電性導線，令該特殊應用集成電路晶片與該發光元件相互耦接，且該特殊應用集成電路晶片具有複數個第一電性接觸點及該環境光感測晶片具有複數個第二電性接觸點，並以該第二電性接觸點係耦接至該第一電性接觸點，令該特殊應用集成電路晶片與 該環境光感測晶片相互耦接。 According to the foregoing feature, the substrate may be formed by one of a ceramic circuit board or a printed circuit board, such that an internal electrical connection is formed between the substrate, and the special application integrated circuit chip and the light emitting component are coupled to each other. The special application integrated circuit chip has a plurality of first electrical contact points, and the ambient light sensing chip has a plurality of second electrical contact points, and the second electrical contact point is coupled to the first electrical Sexual contact points, the special application integrated circuit chip The ambient light sensing wafers are coupled to each other.
依據前揭特徵，該基板之底面係可設有複數個銲墊(Solder Pad)，該銲墊透過該基板之內部，與該特殊應用集成電路晶片、發光元件相互耦接，使該複合型光學感測器形成表面黏著元件(Surface Mount Devices,SMD)。 According to the foregoing feature, a plurality of solder pads (Solder Pads) may be disposed on the bottom surface of the substrate, and the solder pads are coupled to the special application integrated circuit chip and the light-emitting elements to enable the composite optical body. The sensor forms a surface mount device (SMD).
依據前揭特徵，該基板上更可包括複數個透明封裝體，該透明封裝體係各別封裝該環境光感測晶片、特殊應用集成電路晶片與該發光元件。 According to the foregoing feature, the substrate further includes a plurality of transparent packages, and the transparent package system respectively encapsulates the ambient light sensing chip, the special application integrated circuit chip and the light emitting element.
依據前揭特徵，該基板上更可包括一非透明封裝體，該非透明封裝體係封裝該障壁。 According to the foregoing feature, the substrate further includes a non-transparent package, and the non-transparent package system encapsulates the barrier.
依據前揭特徵，該透明封裝體可為透鏡。 According to the foregoing features, the transparent package can be a lens.
藉助上揭技術手段，其該環境光感測晶片呈現獨立凸起於該特殊應用集成電路晶片上一預定高度之型態，使該環境光感測器之環境光感測角度極大化，及該近接感測器被嵌入於該特殊應用集成電路晶片，使該近接感測器之近接感測角度極小化，進而具有相輔相成之效果，在不犧牲該環境光感測器之環境光感測範圍，該環境光感測晶片與該近接感測器能整合至同一結構，據以形成一適用於小孔徑之複合型光學感測器，故設製開孔為圓形孔，在智慧型手持行動裝置之外觀上呈現較短之小孔徑。 By means of the above-mentioned technical means, the ambient light sensing chip exhibits a shape of a predetermined height on the special application integrated circuit chip, so that the ambient light sensing angle of the ambient light sensor is maximized, and The proximity sensor is embedded in the special application integrated circuit chip, so that the proximity sensing angle of the proximity sensor is minimized, thereby complementing the effect, without sacrificing the ambient light sensing range of the ambient light sensor, The ambient light sensing chip and the proximity sensor can be integrated into the same structure, thereby forming a composite optical sensor suitable for a small aperture, so that the opening is a circular hole, and the smart handheld mobile device The appearance of the short aperture is short.
40‧‧‧複合型光學感測器 40‧‧‧Composite optical sensor
41‧‧‧基板 41‧‧‧Substrate
411‧‧‧銲墊 411‧‧‧ solder pads
42‧‧‧發光元件 42‧‧‧Lighting elements
43‧‧‧特殊應用集成電路晶片 43‧‧‧Special application integrated circuit chip
431‧‧‧近接感測器 431‧‧‧ proximity sensor
432‧‧‧第一電性接觸點 432‧‧‧First electrical contact point
44‧‧‧障壁 44‧‧‧Baffle
45‧‧‧環境光感測晶片 45‧‧‧ Ambient light sensing chip
451‧‧‧第二電性接觸點 451‧‧‧Second electrical contact point
46‧‧‧透明封裝體 46‧‧‧Transparent package
47‧‧‧非透明封裝體 47‧‧‧Non-transparent package
48‧‧‧電性導線 48‧‧‧Electrical wires
O‧‧‧物體 O‧‧‧ objects
L‧‧‧環境光線 L‧‧‧ Ambient light
G2‧‧‧圓形孔 G 2 ‧‧‧round hole
T2‧‧‧小孔徑 T 2 ‧‧‧Small aperture
P‧‧‧智慧型手持行動裝置 P‧‧‧Smart handheld mobile device
θa4‧‧‧近接感測角度 θ a4 ‧‧‧ proximity sensing angle
θb4‧‧‧環境光感測角度 θ b4 ‧‧‧ Ambient light sensing angle
h1‧‧‧障壁高度 h 1 ‧ ‧ barrier height
h2‧‧‧環境光感測晶片高度 h 2 ‧‧‧ Ambient light sensing wafer height
圖1A係先前技術開孔為長形孔之示意圖。 Figure 1A is a schematic illustration of a prior art aperture being an elongated aperture.
圖1B係先前技術開孔為圓形孔之示意圖。 Figure 1B is a schematic illustration of a prior art aperture being a circular aperture.
圖2係先前技術光學近接感測器封裝結構之示意圖。 2 is a schematic illustration of a prior art optical proximity sensor package structure.
圖3係先前技術層疊封裝光學近接感測器之示意圖。 3 is a schematic illustration of a prior art stacked package optical proximity sensor.
圖4係先前技術光感測式晶片封裝結構之示意圖。 4 is a schematic diagram of a prior art photo-sensing chip package structure.
圖5係本創作之俯視圖。 Figure 5 is a top view of the creation.
圖6係本創作之仰視圖。 Figure 6 is a bottom view of the present creation.
圖7A係圖5中7A-7A之斷面剖視圖。 Figure 7A is a cross-sectional view taken along line 7A-7A of Figure 5.
圖7B係本創作之示意圖。 Figure 7B is a schematic diagram of the present creation.
圖8係本創作之使用狀態圖。 Figure 8 is a diagram showing the state of use of the present creation.
圖9係本創作與先前技術比較環境光感測角度之角位移曲線圖。 Fig. 9 is a graph showing the angular displacement of the ambient light sensing angle compared with the prior art.
首先，請參閱圖5~圖9所示，本創作一種適用於小孔徑之複合型光學感測器40，尤指一種使近接感測角度(θa4)極小化且使環境光感測角度(θb4)極大化之光學感測器，較佳實施例包含：一基板41(Frame)，本實施例中，該基板41係由陶瓷電路板或印刷電路板其中之一所構成，但不限定於此。 First, referring to FIG. 5 to FIG. 9, the present invention is a composite optical sensor 40 suitable for a small aperture, in particular, a method for minimizing the proximity sensing angle (θ a4 ) and making the ambient light sensing angle ( θ b4 ) The maximum size of the optical sensor, the preferred embodiment comprises: a substrate 41 (Frame), in this embodiment, the substrate 41 is composed of one of a ceramic circuit board or a printed circuit board, but is not limited herein.
一發光元件42，係耦接於該基板41上，乃透過電性導線48進行電性連接，令該發光元件42與該基板41相互耦接，本實施例中，該發光元件42為發光二極體(LED)、雷射二極體(LD)或光垂直腔面發射激光器(Vertical Cavity Surface Emission Laser,VCSEL)其中之一所構成，但不限定於此。 A light-emitting element 42 is coupled to the substrate 41 and electrically connected through the electrical wires 48. The light-emitting component 42 and the substrate 41 are coupled to each other. In this embodiment, the light-emitting component 42 is light-emitting. It is composed of one of a polar body (LED), a laser diode (LD), or a Vertical Cavity Surface Emission Laser (VCSEL), but is not limited thereto.
一特殊應用集成電路晶片43(Application Specific Integrated Circuit Die,ASIC Die)，係耦接於該基板41上，乃透過電性導線48進行電性連接，令該特殊應用集成電路晶片43與該基板41相互耦接，且該特殊應用集成電路晶片43係嵌入一近接感測器431(Proximity Sensor,PS)，並在該特殊應用集成電路晶片43與該發光元件42之間係設有一障壁44(Barrier)，本實施例中，該基板41之內部形成相互連接之電性導線，令該特殊應用集成 電路晶片43與該發光元件42相互耦接，且該特殊應用集成電路晶片43具有複數個第一電性接觸點432及該環境光感測晶片45具有複數個第二電性接觸點451，並以該第二電性接觸點451係耦接至該第一電性接觸點432，乃透過電性導線48進行電性連接，令該特殊應用集成電路晶片43與該環境光感測晶片45相互耦接，但不限定於此。 An application specific integrated circuit die 43 (ASIC) is coupled to the substrate 41 and electrically connected through the electrical wires 48. The special application integrated circuit chip 43 and the substrate 41 are electrically connected. The special application integrated circuit chip 43 is embedded in a proximity sensor 431 (Proximity Sensor, PS), and a barrier 44 is disposed between the special application integrated circuit chip 43 and the light emitting element 42. In this embodiment, the internals of the substrate 41 form interconnected electrical wires to integrate the special application. The circuit chip 43 and the light emitting element 42 are coupled to each other, and the special application integrated circuit chip 43 has a plurality of first electrical contact points 432 and the ambient light sensing wafer 45 has a plurality of second electrical contact points 451, and The second electrical contact point 451 is coupled to the first electrical contact point 432, and is electrically connected through the electrical wire 48. The special application integrated circuit chip 43 and the ambient light sensing chip 45 are mutually connected. Coupling, but not limited to.
一環境光感測晶片45(Ambient Light Sensor Die,ALS Die)，該環境光感測晶片45係先製造成型後，再耦接於該特殊應用集成電路晶片43上，乃透過電性導線48進行電性連接，使其呈現獨立凸起於該特殊應用集成電路晶片43上一預定高度之型態，且該環境光感測晶片45未遮蔽該特殊應用集成電路晶片43之近接感測器431，據以形成一適用於小孔徑之複合型光學感測器40，本實施例中，該環境光感測晶片45亦可接收環境光，但不限定於此，該環境光感測晶片45更可為三原色(RGB)感測晶片或紫外線(UV)感測晶片其中之一所構成，亦可接收三原色、紫外線，因此，該環境光感測晶片45亦可接收環境光、三原色、紫外線。 An ambient light sensing die 45 (ALS Die) is formed by first molding and then coupled to the special application integrated circuit chip 43 via an electrical conductor 48. Electrically connected to form a predetermined height on the special application integrated circuit chip 43 , and the ambient light sensing chip 45 does not shield the proximity sensor 431 of the special application integrated circuit chip 43 . In this embodiment, the ambient light sensing wafer 45 can also receive ambient light, but is not limited thereto, and the ambient light sensing chip 45 can be further configured to form a composite optical sensor 40. It is composed of one of three primary color (RGB) sensing wafers or ultraviolet (UV) sensing wafers, and can also receive three primary colors and ultraviolet rays. Therefore, the ambient light sensing wafer 45 can also receive ambient light, three primary colors, and ultraviolet rays.
如圖5、圖7A所示，其該環境光感測晶片45獨立凸起於該特殊應用集成電路晶片43之電路外，令該環境光感測晶片45製造成型至該特殊應用集成電路晶片43上，可適時調整與該障壁44的距離，使該特殊應用集成電路晶片43之電路免於變更，並配合圖6所示，其該基板41之底面係設有複數個銲墊411(Solder Pad)，該銲墊411透過該基板41之內部，與該特殊應用集成電路晶片43、發光元件42相互耦接，使該複合型光學感測器40形成表面黏著元件(Surface Mount Devices,SMD)，但不限定於此。 As shown in FIG. 5 and FIG. 7A, the ambient light sensing wafer 45 is independently protruded from the circuit of the special application integrated circuit chip 43, and the ambient light sensing wafer 45 is molded to the special application integrated circuit wafer 43. In the above, the distance from the barrier 44 can be adjusted to make the circuit of the special application integrated circuit chip 43 free from modification. As shown in FIG. 6, the bottom surface of the substrate 41 is provided with a plurality of pads 411 (Solder Pad). The bonding pad 411 is coupled to the special application integrated circuit chip 43 and the light emitting element 42 through the inside of the substrate 41, so that the composite optical sensor 40 forms a surface mount device (SMD). However, it is not limited to this.
如圖7B所示之示意圖，其該基板41上更包括複數個透明封裝體46及一非透明封裝體47，該透明封裝體46係各別封裝該環境光感測晶片45、特殊應用集成電路晶片43與該發光元件42，及該非透明封裝體47係封裝該障壁44，在另一實施例中，該透明封裝體46為透鏡。 As shown in FIG. 7B, the substrate 41 further includes a plurality of transparent packages 46 and a non-transparent package 47. The transparent package 46 separately encapsulates the ambient light sensing chip 45 and the special application integrated circuit. The wafer 43 and the light-emitting element 42 and the non-transparent package 47 encapsulate the barrier 44. In another embodiment, the transparent package 46 is a lens.
如圖8所示之使用狀態圖，其該發光元件42自發光源經物體(O)反射至該近接感測器431，並以一定之該障壁高度(h1)防止該發光元件42自發光源干擾該近接感測器431，而該環境光感測晶片45之高度(h2)可配合該障壁高度(h1)獨立製造成型，當該環境光感測晶片45偵測環境光源(L)亮度，讓該環境光感測晶片45之環境光感測範圍不被該障壁高度(h1)所阻擋，俾使該近接感測器之近接感測角度(θa4)極小化，及使該環境光感測器之環境光感測角度(θb4)極大化，故設製開孔為圓形孔(G2)，在智慧型手持行動裝置(P)之外觀上呈現較短之小孔徑(T2)，進一步，令該特殊應用集成電路晶片43可接收該自發光源及該環境光源(L)之光通量，並控制該環境光感測晶片45、發光元件42及近接感測器431之作動狀態。 As shown in FIG. 8, the light-emitting element 42 is reflected from the light-emitting source through the object (O) to the proximity sensor 431, and the light-emitting element 42 is prevented from interfering with the light-emitting source by a certain height (h 1 ) of the barrier. The proximity sensor 431, and the height (h 2 ) of the ambient light sensing chip 45 can be independently fabricated with the barrier height (h 1 ), and the ambient light sensing chip 45 detects the ambient light source (L) brightness. The ambient light sensing range of the ambient light sensing chip 45 is not blocked by the barrier height (h 1 ), so that the proximity sensing angle (θ a4 ) of the proximity sensor is minimized, and the environment is made The ambient light sensing angle (θ b4 ) of the photo sensor is maximized, so the opening is a circular hole (G 2 ), and the appearance of the smart handheld mobile device (P) exhibits a short small aperture ( T 2), further, enabling the application specific integrated circuit wafer 43 may receive the light and the spontaneous ambient light source (L) of the light flux, and controlling the ambient light sensing chip 45, the light emitting element 42 and the proximity sensor 431 of the actuator for status.
進一步，為能清楚分析及說明習用先前技術A、B及C與本創作之開孔呈現孔徑大小、近接感測器之近接感測角度(θa4)、環境光感測器之環境光感測角度(θb4)的差異性，茲列表比較如後：
如圖9所示，能清楚分析及說明本創作與先前技術比較環境光感測角度之角位移曲線圖，如下所述： As shown in FIG. 9, the angular displacement curve of the ambient light sensing angle compared with the prior art can be clearly analyzed and illustrated as follows:
(1).曲線A為先前技術光學近接感測器封裝結構之環境光感測角度之角位移曲線，其環境光感測角度不宜過大，且近接感測單元靠近環境光線感測單元左側，使近接感測角度不宜過小，因此，近接感測角度與環境光感測角度相互配合皆為適中，故設製開孔為長形孔，在智慧型手持行動裝置之外觀上無法呈現較短之小孔徑。 (1) Curve A is the angular displacement curve of the ambient light sensing angle of the prior art optical proximity sensor package structure, and the ambient light sensing angle should not be too large, and the proximity sensing unit is close to the left side of the ambient light sensing unit, so that The proximity sensing angle should not be too small. Therefore, the proximity sensing angle and the ambient light sensing angle are compatible with each other. Therefore, the opening is a long hole, and the appearance of the smart handheld mobile device cannot be short. Aperture.
(2).曲線B為先前技術層疊封裝光學近接感測器之環境光感測角度之角位移曲線，其環境光感測角度可變大，而近接感測角度無法變小仍為適中，故設製開孔為長形孔，在智慧型手持行動裝置之外觀上無法呈現較短之小孔徑。 (2) Curve B is the angular displacement curve of the ambient light sensing angle of the prior art packaged optical proximity sensor. The ambient light sensing angle can be large, and the proximity sensing angle cannot be reduced, so it is still moderate. The opening is made of an elongated hole, and the short small aperture cannot be presented in the appearance of the smart handheld mobile device.
(3).曲線C先前技術光感測式晶片封裝結構之環境光感測角度之角位移曲線，其近接感測角度、環境光感測角度皆變小，雖設製開孔為圓形孔，在智慧型手持行動裝置之外觀上呈現較短之小孔徑，但卻犧牲環境光感測器之環境光感測範圍。 (3) Curve C The angular displacement curve of the ambient light sensing angle of the prior art light sensing chip package structure, the proximity sensing angle and the ambient light sensing angle are all smaller, although the opening is a circular hole The appearance of the smart handheld mobile device presents a short aperture, but at the expense of the ambient light sensing range of the ambient light sensor.
(4).曲線D為本創作複合型光學感測器40之環境光感測角度(θb4)之角位移曲線，其使近接感測器之近接感測角度(θa4)極小化，及使環境光感測器之環境光感測角度(θb4)極大化，因此，曲線D之環境光感測角度(θb4)大於曲線A、曲線C之環境光感測角度，並與曲線B之環境光感測角度接近重疊狀態，不僅設製開孔為圓形孔(G2)，在智慧型手持行動裝置(P)之外觀上呈現較短之小孔徑(T2)，也不需犧牲環境光感測器之環境光感測範圍。 (4) Curve D is the angular displacement curve of the ambient light sensing angle (θ b4 ) of the artificial composite optical sensor 40, which minimizes the proximity sensing angle (θ a4 ) of the proximity sensor, and The ambient light sensing angle (θ b4 ) of the ambient light sensor is maximized. Therefore, the ambient light sensing angle (θ b4 ) of the curve D is greater than the ambient light sensing angle of the curve A and the curve C, and the curve B the ambient light sensing angle close overlapping state, openings are provided not only made a circular hole (G 2), exhibits a shorter small aperture (T 2) in the appearance of the handheld smart device (P), the need also Sacrificial ambient light sensing range of ambient light sensor.
綜上所述，本創作所揭示之技術手段，確具「新穎性」、「進步性」及「可供產業利用」等新型專利要件，祈請 鈞局惠賜專利，以勵創作，無任德感。 In summary, the technical means disclosed in this creation are indeed new types of patents such as "novelty", "progressiveness" and "available for industrial use", and pray for the patents of the bureau to encourage creation. German sense.
惟，上述所揭露之圖式、說明，僅為本創作之較佳實施 例，大凡熟悉此項技藝人士，依本案精神範疇所作之修飾或等效變化，仍應包括在本案申請專利範圍內。 However, the drawings and descriptions disclosed above are only preferred implementations of the present creation. For example, any modification or equivalent change made by a person familiar with this skill in the spirit of the case should still be included in the scope of the patent application in this case.
40‧‧‧複合型光學感測器 40‧‧‧Composite optical sensor
41‧‧‧基板 41‧‧‧Substrate
42‧‧‧發光元件 42‧‧‧Lighting elements
43‧‧‧特殊應用集成電路晶片 43‧‧‧Special application integrated circuit chip
431‧‧‧近接感測器 431‧‧‧ proximity sensor
432‧‧‧第一電性接觸點 432‧‧‧First electrical contact point
44‧‧‧障壁 44‧‧‧Baffle
45‧‧‧環境光感測晶片 45‧‧‧ Ambient light sensing chip
451‧‧‧第二電性接觸點 451‧‧‧Second electrical contact point
48‧‧‧電性導線 48‧‧‧Electrical wires
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| TW105204399U TWM526184U (en) | 2016-03-30 | 2016-03-30 | Composite optical sensor for small aperture |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI585437B (en) * | 2016-03-30 | 2017-06-01 | Composite optical sensor for small aperture and its preparation method | |
| CN107800400A (en) * | 2016-09-01 | 2018-03-13 | 达帕有限公司 | Suitable for the high degree of integration crystal oscillator encapsulating structure of high validity |
| TWI627572B (en) * | 2017-07-05 | 2018-06-21 | 光寶新加坡有限公司 | Mobile device and proximity sensor module thereof |
| CN108731799A (en) * | 2017-04-24 | 2018-11-02 | 达帕有限公司 | Sensing environment light chip forms the composite optical sensor of nature barrier |
| TWI684268B (en) * | 2017-04-20 | 2020-02-01 | 億光電子工業股份有限公司 | Sensor module and method of manufacturing the same |
| TWI699898B (en) * | 2016-12-29 | 2020-07-21 | 香港商南京矽力杰半導體（香港）有限公司 | Optical sensor package assembly and its manufacturing method and electronic equipment |
| CN114459598A (en) * | 2021-05-20 | 2022-05-10 | 义明科技股份有限公司 | Light sensing integrated circuit and electronic device using same |
| TWI808691B (en) * | 2022-03-22 | 2023-07-11 | 神煜電子股份有限公司 | Optical sensor package assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI585437B (en) * | 2016-03-30 | 2017-06-01 | Composite optical sensor for small aperture and its preparation method | |
| CN107800400A (en) * | 2016-09-01 | 2018-03-13 | 达帕有限公司 | Suitable for the high degree of integration crystal oscillator encapsulating structure of high validity |
| TWI699898B (en) * | 2016-12-29 | 2020-07-21 | 香港商南京矽力杰半導體（香港）有限公司 | Optical sensor package assembly and its manufacturing method and electronic equipment |
| TWI684268B (en) * | 2017-04-20 | 2020-02-01 | 億光電子工業股份有限公司 | Sensor module and method of manufacturing the same |
| TWI733289B (en) * | 2017-04-20 | 2021-07-11 | 億光電子工業股份有限公司 | Sensor module and method of manufacturing the same |
| CN108731799A (en) * | 2017-04-24 | 2018-11-02 | 达帕有限公司 | Sensing environment light chip forms the composite optical sensor of nature barrier |
| TWI627572B (en) * | 2017-07-05 | 2018-06-21 | 光寶新加坡有限公司 | Mobile device and proximity sensor module thereof |
| CN114459598A (en) * | 2021-05-20 | 2022-05-10 | 义明科技股份有限公司 | Light sensing integrated circuit and electronic device using same |
| CN114459598B (en) * | 2021-05-20 | 2024-05-14 | 义明科技股份有限公司 | Light sensing integrated circuit and electronic device using same |
| TWI808691B (en) * | 2022-03-22 | 2023-07-11 | 神煜電子股份有限公司 | Optical sensor package assembly |
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