TWM521714U - Seamless welding radiator - Google Patents

Seamless welding radiator Download PDF

Info

Publication number
TWM521714U
TWM521714U TW104220466U TW104220466U TWM521714U TW M521714 U TWM521714 U TW M521714U TW 104220466 U TW104220466 U TW 104220466U TW 104220466 U TW104220466 U TW 104220466U TW M521714 U TWM521714 U TW M521714U
Authority
TW
Taiwan
Prior art keywords
heat
heat dissipating
heat dissipation
seamless
fins
Prior art date
Application number
TW104220466U
Other languages
Chinese (zh)
Inventor
jun-ping Huang
Original Assignee
Chia Cherne Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chia Cherne Industry Co Ltd filed Critical Chia Cherne Industry Co Ltd
Priority to TW104220466U priority Critical patent/TWM521714U/en
Publication of TWM521714U publication Critical patent/TWM521714U/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

無縫焊接散熱排 Seamless welding heat sink

本創作係有關一種無縫焊接散熱排,尤其是有關一種透過磨擦焊接合之無縫焊接散熱排。 This creation is about a seamless soldering heat sink, especially for a seamless soldering heat sink that is welded by friction.

散熱裝置在機械領域應用非常普遍,尤其在工具機或大型機具等產業應用更為廣泛,由於機械運作過程往往會產生極高的溫度,因此將其熱量排出非常重要,特別是能將熱量快速排出並且具備耐用性尤其重要。 The heat sink is widely used in the mechanical field, especially in the industrial applications such as machine tools or large-scale machines. Since the mechanical operation process often produces extremely high temperatures, it is very important to discharge the heat, especially to quickly discharge the heat. And durability is especially important.

目前常見可安裝於各種工具機或大型機具之散熱裝置,通常會採用水冷散熱器,其原理係使用液體在泵的帶動下強制循環帶走散熱器的熱量,與風冷相比具有安靜、降溫穩定、對環境依賴小等優點。 At present, it is common to install heat sinks for various machine tools or large-scale machines. Water-cooled radiators are usually used. The principle is to use the liquid to force the circulation of the radiator to take away the heat of the radiator, which is quieter and cooler than air-cooling. Stable, small dependence on the environment and so on.

詳而言之,水冷散熱器有一個進水口及出水口,散熱器內部有多條水流散熱通道,水流散熱通道與進水口及出水口之管道連通形成封閉空間,僅保留可供流體流進水冷散熱器之進水口並且自出水口流出,這樣可以充分發揮水冷的優勢,能帶走更多的熱量。 In detail, the water-cooled radiator has a water inlet and a water outlet. The radiator has a plurality of water flow heat dissipation channels. The water flow heat dissipation passage communicates with the water inlet and the water outlet to form a closed space, and only the fluid can be kept into the water cooling. The water inlet of the radiator and the water outlet flow out, so that the advantages of water cooling can be fully utilized and more heat can be taken away.

如上所述,傳統上將水流散熱通道與進水口及出水口之管道接合密封需要透過焊接處理,焊接是一種以加熱方式接合金屬或其他熱塑性材料如塑料的製造工藝及技術。一種焊接方式,例如硬焊,係將熔點低於欲連接工件之熔填料(焊料)加熱至高於熔點,使之具有足夠的流動性,利用毛細作用充分填充於兩工件間,並待其凝固後將二者接合起來的一種接合法。 As described above, the conventional joint sealing of the water flow passage and the water inlet and the water outlet requires a through-welding process, which is a manufacturing process and technique for joining metal or other thermoplastic materials such as plastic in a heated manner. A welding method, such as brazing, is to heat a molten filler (solder) having a melting point lower than that of a workpiece to be joined to a melting point, so as to have sufficient fluidity, fully filled between the two workpieces by capillary action, and after being solidified A bonding method that joins the two.

然而於焊接的過程所加入的熔填料於加熱時,往往會有熔化之熔填料流出而阻塞部分流體出入口、或密封不實造成流體運行時部分流 體有溢出的現象,或熔化之熔填料於硬化時殘留餘料造成水冷散熱器外觀不佳的現象。 However, when the molten filler added during the welding process is heated, there is a tendency that the melted molten filler flows out to block a part of the fluid inlet and outlet, or the seal is not solid, causing partial flow of the fluid during operation. The phenomenon of overflow of the body, or the residual material remaining by the molten filler during hardening causes the appearance of the water-cooled heat sink to be poor.

因此,為解決傳統焊接之散熱器所產生之上述缺點,實有將之改善之必要。 Therefore, in order to solve the above-mentioned shortcomings caused by the conventional soldering heat sink, it is necessary to improve it.

為了解決現有之散熱裝置其密封接合時,須以加熱方式將焊料熔化以接合金屬,而導致散熱裝置密封不完全,甚至堵塞流體出入口的問題,本創作的主要目的在於提供一種製程簡單、密封效果佳且完成密封後不留焊料殘渣的一種無縫焊接散熱排,包括:複數個散熱件,各該散熱件之一本體內部沿該散熱件軸向貫通設有至少一導熱通道,並於該本體所設之一第一散熱面及一第二散熱面上分別削切並折翻出有複數個第一散熱鰭片和複數個第二散熱鰭片,其中,該些第一散熱鰭片和該些第二散熱鰭片係沿著該散熱件軸向平行排列;一導流件組,包括一第一導流管與一第二導流管,該第一導流管與該第二導流管分別設有複數個第一通孔與第二通孔,該些散熱件係間隔設置於該第一導流管與該第二導流管之間,使該些導熱通道二端分別與該第一通孔與該第二通孔接合連通,其中該些散熱件與該導流件組係透過磨擦焊方式接合。 In order to solve the problem that the existing heat dissipating device is sealed and joined, the solder must be melted by heating to join the metal, thereby causing the heat sink to be incompletely sealed or even blocking the fluid inlet and outlet. The main purpose of the present invention is to provide a simple process and a sealing effect. A seamless soldering heat dissipation row that does not leave a solder residue after the sealing, and includes: a plurality of heat dissipating members, wherein each of the heat dissipating members has at least one heat conducting channel extending along the axial direction of the heat dissipating member, and The first heat dissipating surface and the second heat dissipating surface of the main body are respectively cut and folded to have a plurality of first heat dissipating fins and a plurality of second heat dissipating fins, wherein the first heat dissipating fins and The second heat dissipating fins are arranged in parallel along the axial direction of the heat dissipating member; a flow guiding member group includes a first guiding tube and a second guiding tube, the first guiding tube and the second guiding tube The flow tubes are respectively provided with a plurality of first through holes and second through holes, and the heat dissipating members are disposed between the first guiding tube and the second guiding tube, so that the two ends of the heat conducting channels are respectively The first through hole and the second Engaging hole communicates, wherein the heat dissipating member engaged with the guide member through group-based friction welding method.

在本創作的一實施例中,前述之無縫焊接散熱排,其中該些第一散熱鰭片及該些第二散熱鰭片係呈等間距排列。 In an embodiment of the present invention, the foregoing seamless soldering heat dissipation fins, wherein the first heat dissipation fins and the second heat dissipation fins are arranged at equal intervals.

在本創作的一實施例中,前述之無縫焊接散熱排,其中各該第一散熱鰭片及各該第二散熱鰭片係與分別與該第一散熱面及該第二散熱面垂直。 In an embodiment of the present invention, the seamless soldering heat dissipation row, wherein each of the first heat dissipation fins and each of the second heat dissipation fins are perpendicular to the first heat dissipation surface and the second heat dissipation surface, respectively.

在本創作的一實施例中,前述之無縫焊接散熱排,其中該導熱通道包括一第一導熱通道與一第二導熱通道,該第一導熱通道與該第二導熱通道係以一第一隔板相間隔。 In an embodiment of the present invention, the heat conduction channel includes a first heat conduction channel and a second heat conduction channel, and the first heat conduction channel and the second heat conduction channel are first. The partitions are spaced apart.

在本創作的一實施例中,前述之無縫焊接散熱排,其中該導熱通道進一步包括一第三導熱通道,該第二導熱通道與該第三導熱通道係以一第二隔板相間隔。 In an embodiment of the present invention, the aforementioned seamless soldering heat sink, wherein the heat conducting channel further comprises a third heat conducting channel, the second heat conducting channel and the third heat conducting channel being spaced apart by a second spacer.

在本創作的一實施例中,前述之無縫焊接散熱排,其中該第一導流管係將一流體導入並流入該些散熱件,該第二導流管係將該流體由該些散熱件內導出。 In an embodiment of the present invention, the foregoing seamless soldering heat dissipation row, wherein the first guiding tube introduces a fluid into and flows into the heat dissipating members, and the second guiding tube is configured to dissipate the fluid from the heat dissipation. Export within the piece.

在本創作的一實施例中,前述之無縫焊接散熱排,其中該無縫焊接散熱排導入流體,該流體包括水、油、或冷媒。 In an embodiment of the present invention, the aforementioned seamlessly welded heat sink, wherein the seamlessly welded heat sink is introduced into a fluid, the water comprising water, oil, or a refrigerant.

在本創作的一實施例中,前述之無縫焊接散熱排,其中該些散熱鰭片係呈方形或波浪型。 In an embodiment of the present invention, the aforementioned seamless soldering heat dissipation fins, wherein the heat dissipating fins are square or wave-shaped.

因此,本創作之無縫焊接散熱排其接合密封僅需透過CNC摩擦焊加工即可製成,毋須於欲加工之二工件之間加入焊料熔化焊接,即可精準地將散熱裝置之工件無縫焊接,且藉由摩擦焊接加工後之散熱裝置,不僅其外觀相對美觀,亦可防止散熱之流體外漏同時縮短工件加工時間之功效。 Therefore, the seamless soldering heat sink of this creation can be made only by CNC friction welding. It is possible to accurately weld the workpiece of the heat sink without adding solder fusion welding between the two workpieces to be processed. Welding, and the heat dissipating device after friction welding, not only has a relatively beautiful appearance, but also prevents leakage of fluid from heat dissipation and shortens the processing time of the workpiece.

10‧‧‧散熱件 10‧‧‧ Heat sink

11‧‧‧本體 11‧‧‧Ontology

12‧‧‧導熱通道 12‧‧‧Heat conduction channel

12a‧‧‧第一導熱通道 12a‧‧‧First heat conduction channel

12b‧‧‧第二導熱通道 12b‧‧‧second heat conduction channel

14a‧‧‧第一散熱面 14a‧‧‧First heat sink

14b‧‧‧第二散熱面 14b‧‧‧second heat sink

16a‧‧‧第一散熱鰭片 16a‧‧‧First heat sink fin

16b‧‧‧第二散熱鰭片 16b‧‧‧second heat sink fin

18‧‧‧第一隔板 18‧‧‧ first partition

20‧‧‧導流件組 20‧‧‧Guide group

20a‧‧‧第一導流管 20a‧‧‧First draft tube

20b‧‧‧第二導流管 20b‧‧‧Second guide tube

22‧‧‧第一通孔 22‧‧‧ first through hole

第一圖係本創作之無縫焊接散熱排之散熱件之立體示意圖。 The first picture is a three-dimensional schematic diagram of the heat sink of the seamless soldering heat sink of the present invention.

第二圖係本創作之無縫焊接散熱排之散熱件與導流件組之一導流管接合之立體示意圖。 The second figure is a three-dimensional schematic diagram of the heat sink of the seamless soldering heat sink of the present invention and a guide tube of the flow guide group.

第三圖係本創作之無縫焊接散熱排之複數個散熱件與導流件組組合完成後之立體示意圖。 The third figure is a three-dimensional schematic diagram of the combination of a plurality of heat dissipating members and a flow guiding member group of the seamless welding heat dissipating row of the present invention.

第四圖係本創作之無縫焊接散熱排之剖面圖。 The fourth picture is a cross-sectional view of the seamlessly welded heat sink of the present creation.

以下係藉由特定的具體實施例說明本創作之實施方式,熟悉此技藝之人士可由散熱說明書所揭示之內容輕易地瞭解散熱發明之其他優點與功效。本創作亦可藉由其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本創作之精神下 進行各種修飾與變更。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily understand other advantages and effects of the heat-dissipating invention from the disclosure of the heat-dissipating specification. The present invention may also be implemented or applied by other different specific embodiments, and the details in the present specification may also be based on different viewpoints and applications, without departing from the spirit of the present creation. Make various modifications and changes.

請參閱第一圖,其係為本創作之無縫焊接散熱排之散熱件之立體示意圖。本創作係一無縫焊接散熱排,其各該散熱件10之一本體11內部沿該散熱件10軸向貫通設有至少一導熱通道12,並於該本體所設之一第一散熱面14a及一第二散熱面14b上分別削切並折翻出有複數個第一散熱鰭片16a和複數個第二散熱鰭片16b,其中,該些第一散熱鰭片16a和該些第二散熱鰭片16b係沿著該散熱件10軸向平行排列。 Please refer to the first figure, which is a three-dimensional schematic diagram of the heat sink of the seamless soldering heat sink of the present invention. The present invention is a seamless soldering heat dissipation row, and one of the heat dissipating members 10 is internally provided with at least one heat conduction channel 12 along the axial direction of the heat dissipation member 10, and a first heat dissipation surface 14a is disposed on the body. And a plurality of first heat dissipation fins 16a and a plurality of second heat dissipation fins 16b, wherein the first heat dissipation fins 16a and the second heat dissipation fins 16b are respectively cut and folded The fins 16b are arranged in parallel along the axial direction of the heat sink 10.

上述說明中,該複數個第一散熱鰭片16a和複數個第二散熱鰭片16b係呈等間距排列,並且這些散熱鰭片(16a,16b)可分別與該第一散熱面14a及該第二散熱面14b垂直,以及這些散熱鰭片(16a,16b)可呈方形或波浪型,但不以此為限,其他形狀之變更或修改,亦包括在本創作之申請專利範圍之內。 In the above description, the plurality of first heat dissipation fins 16a and the plurality of second heat dissipation fins 16b are arranged at equal intervals, and the heat dissipation fins (16a, 16b) and the first heat dissipation surface 14a and the first The two heat dissipating surfaces 14b are vertical, and the heat dissipating fins (16a, 16b) may be square or wavy, but are not limited thereto, and other shapes and modifications may be included in the scope of the present patent application.

此外,該至少一導熱通道12包括第一導熱通道12a與該第二導熱通道12b,其間係以一第一隔板18相間隔,該導熱通道又可進一步包括一第三導熱通道(圖中未顯示),該第二導熱通道12b與該第三導熱通道(圖中未顯示)係以一第二隔板(圖中未顯示)相間隔,上述之導熱通道12之數量僅作為本實施例之示例,換言之,其他數量之導熱通道亦包括在本創作之申請專利範圍之內。 In addition, the at least one heat conduction channel 12 includes a first heat conduction channel 12a and a second heat conduction channel 12b separated by a first partition plate 18, and the heat conduction channel may further include a third heat conduction channel (not shown) The second heat conduction channel 12b and the third heat conduction channel (not shown) are separated by a second spacer (not shown), and the number of the heat conduction channels 12 is only used as the embodiment. For example, in other words, other numbers of thermally conductive channels are also included in the scope of the present patent application.

請參閱第二圖,其係為本創作之無縫焊接散熱排之散熱件與導流件組之一導流管接合之立體示意圖。本創作之導流件組22,包括一第一導流管20a與一第二導流管20b,其中圖式中僅例示其中導流件組22之一導流管,例如圖中的第一導流管20a,如圖所示,該第一導流管20a與該第二導流管20b分別設有複數個第一通孔22與第二通孔(圖中未顯示),該些散熱件10係間隔設置於該第一導流管20a與該第二導流管20b之間,使該些導熱通道12二端分別與該第一通孔22與該第二通孔(圖中未顯示)接合連通,此外該散熱件10之另一端亦透過磨擦焊方式與第二導流管20b接合並且連通。 Please refer to the second figure, which is a three-dimensional schematic diagram of the heat sink of the seamless soldering heat sink of the present invention and a guide tube of the flow guide group. The guide group 22 of the present invention includes a first draft tube 20a and a second draft tube 20b, wherein only one of the guide tubes 22 is illustrated in the drawing, for example, the first in the figure. The first draft tube 20a and the second draft tube 20b are respectively provided with a plurality of first through holes 22 and second through holes (not shown) for dissipating heat. The first 10 holes and the second through holes are respectively disposed at the two ends of the heat conduction channels 12 and the second through holes (not shown) In addition, the joint is connected, and the other end of the heat sink 10 is also joined and communicated with the second draft tube 20b by friction welding.

根據第二圖之圖式,本創作之無縫焊接散熱排之散熱件10與導流件組20之接合係透過磨擦焊之加工方式來完成。該磨擦焊之加工 係一種利用壓力和摩擦熱使工件連接在一起的固態連接方法。其焊接時,由電動機帶動一個工件旋轉,例如本創作之散熱件10,同時把另一工件,例如本創作之第一導流管20a,壓向旋轉工件,使其接觸面相互摩擦產生熱量和一定塑性變形,然後減速停止旋轉,同時施加頂鍛壓力完成焊接。 According to the drawing of the second figure, the joint of the heat dissipating member 10 and the deflector group 20 of the seamless soldering heat sink of the present invention is completed by the processing method of the friction welding. The processing of friction welding A solid-state joining method that uses pressure and frictional heat to join workpieces together. When welding, a workpiece is rotated by the motor, such as the heat sink 10 of the present invention, while another workpiece, such as the first draft tube 20a of the present invention, is pressed against the rotating workpiece, and the contact surfaces rub against each other to generate heat and It must be plastically deformed, then decelerate to stop the rotation, and at the same time apply the upset pressure to complete the welding.

請參閱第三圖,其係為無縫焊接散熱排之複數個散熱件與導流件組組合完成後之立體示意圖。如上之說明,上述磨擦焊之加工程序完成後,經過冷卻及隨後之加工修飾後,即可完成如第三圖所示之本創作之無縫焊接散熱排,如圖所示,該導流件組20,包括一第一導流管20a與一第二導流管20b,其間設置有並排且與該第一導流管20a與該第二導流管20b相連通之該些散熱件10。 Please refer to the third figure, which is a three-dimensional schematic diagram of the combination of a plurality of heat sinks and a flow guide group after seamlessly soldering the heat dissipation row. As described above, after the processing procedure of the above-mentioned friction welding is completed, after cooling and subsequent processing modification, the seamless soldering heat dissipation row of the present invention as shown in the third figure can be completed, as shown in the figure, the flow guiding member is as shown in the figure. The group 20 includes a first draft tube 20a and a second draft tube 20b, and the heat dissipating members 10 are arranged side by side and communicate with the first draft tube 20a and the second draft tube 20b.

請參閱第四圖,其係本創作之無縫焊接散熱排之剖面圖。如圖所示,本創作之無縫焊接散熱排,係藉由其第一導流管20a導入流體(橫向長箭頭方向),例如水、油、以或冷媒等,再流向由第一導流管20a與該些散熱件10連通之複數個導熱通道12(縱向複數個短箭頭)中,藉由該些散熱件10上之複數個散熱鰭片(16a,16b)接收由例如工具機或大型機具傳導過來的熱所產生的熱流體導向第二導流管20b導出,以將熱帶走,藉此達到散熱之效果。 Please refer to the fourth figure, which is a cross-sectional view of the seamless welded heat sink of this creation. As shown in the figure, the seamless welded heat sink of the present invention is introduced into the fluid (direction of a long horizontal arrow) by its first draft tube 20a, such as water, oil, or refrigerant, and then flows to the first flow. The plurality of heat-dissipating channels 12 (longitudinal short arrows) in the tube 20a and the heat dissipating members 10 are received by a plurality of heat-dissipating fins (16a, 16b) on the heat dissipating members 10, for example, by a machine tool or a large The hot fluid generated by the heat transmitted by the implement is guided to the second draft tube 20b to be taken out to take the tropics, thereby achieving the effect of heat dissipation.

本創作之無縫焊接散熱排,其散熱散之外表面經削切並折翻出複數個散熱鰭片乃透過機械加工刨削而成,不需經由複雜之製程即可一體成形生產出,並且該散熱件與導流件組之結合係藉由摩擦焊加工而完成,因此生產快速,所完成之散熱排係無縫縫焊,故不會外漏流體,且外觀視覺佳,不僅可達到充分的散熱效果,而且可有效降低組裝成本。 The seamless soldering heat sink of the creation, the surface of the heat dissipating surface is cut and folded, and a plurality of heat dissipating fins are formed by machining, and can be integrally formed without a complicated process, and The combination of the heat dissipating member and the flow guiding member is completed by friction welding, so that the production is fast, and the completed heat dissipating is seamless seam welding, so that no fluid is leaked and the appearance is good, which can not only achieve sufficient The heat dissipation effect can effectively reduce the assembly cost.

綜上所述,僅是本創作的較佳實施例,並非對本創作任何形式上的限制,任何所屬技術領域中具有通常知識者,若在不脫離本創作所提技術特徵的範圍內,利用本創作所揭示技術內容作出局部更動或修飾的等效實施例,均仍屬於本創作技術特徵的範圍內。 In summary, the present invention is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any person having ordinary knowledge in the technical field may use the present invention without departing from the technical features of the present invention. Equivalent embodiments that make local modifications or modifications to the technical content disclosed herein remain within the scope of the inventive features.

10‧‧‧散熱件 10‧‧‧ Heat sink

16a‧‧‧第一散熱鰭片 16a‧‧‧First heat sink fin

16b‧‧‧第二散熱鰭片 16b‧‧‧second heat sink fin

20‧‧‧導流件組 20‧‧‧Guide group

20a‧‧‧第一導流管 20a‧‧‧First draft tube

20b‧‧‧第二導流管 20b‧‧‧Second guide tube

Claims (8)

一種無縫焊接散熱排,包括:複數個散熱件,各該散熱件之一本體內部沿該散熱件軸向貫通設有至少一導熱通道,並於該本體所設之一第一散熱面及一第二散熱面上分別削切並折翻出有複數個第一散熱鰭片和複數個第二散熱鰭片,其中,該些第一散熱鰭片和該些第二散熱鰭片係沿著該散熱件軸向平行排列;一導流件組,包括一第一導流管與一第二導流管,該第一導流管與該第二導流管分別設有複數個第一通孔與第二通孔,該些散熱件係間隔設置於該第一導流管與該第二導流管之間,使該些導熱通道二端分別與該第一通孔與該第二通孔接合連通,其中該些散熱件與該導流件組係透過磨擦焊方式接合。 A seamless soldering heat dissipating row includes: a plurality of heat dissipating members, wherein each of the heat dissipating members has at least one heat conducting channel extending along the axial direction of the heat dissipating member, and a first heat dissipating surface of the body is disposed A plurality of first heat dissipation fins and a plurality of second heat dissipation fins are respectively cut and folded, wherein the first heat dissipation fins and the second heat dissipation fins are along The heat dissipating members are arranged in parallel in the axial direction; a flow guiding member group includes a first guiding tube and a second guiding tube, and the first guiding tube and the second guiding tube are respectively provided with a plurality of first passages a hole and a second through hole, the heat dissipating members are disposed between the first guiding tube and the second guiding tube, and the two ends of the heat conducting channels are respectively connected to the first through hole and the second through hole The holes are in continuous communication, wherein the heat dissipating members are joined to the baffle assembly by friction welding. 如申請專利範圍第1項所述之無縫焊接散熱排,其中該些第一散熱鰭片及該些第二散熱鰭片係呈等間距排列。 The seamless soldering heat dissipation row according to claim 1, wherein the first heat dissipation fins and the second heat dissipation fins are arranged at equal intervals. 如申請專利範圍第1項所述之無縫焊接散熱排,其中各該第一散熱鰭片及各該第二散熱鰭片係與分別與該第一散熱面及該第二散熱面垂直。 The seamless soldering heat sink according to claim 1, wherein each of the first heat dissipating fins and each of the second heat dissipating fins are perpendicular to the first heat dissipating surface and the second heat dissipating surface, respectively. 如申請專利範圍第1項所述之無縫焊接散熱排,其中該導熱通道包括一第一導熱通道與一第二導熱通道,該第一導熱通道與該第二導熱通道係以一第一隔板相間隔。 The seamless soldering heat dissipation row of claim 1, wherein the heat conduction channel comprises a first heat conduction channel and a second heat conduction channel, wherein the first heat conduction channel and the second heat conduction channel are separated by a first gap. The plates are spaced apart. 如申請專利範圍第4項所述之無縫焊接散熱排,其中該導熱通道進一步包括一第三導熱通道,該第二導熱通道與該第三導熱通道係以一第二隔板相間隔。 The seamless soldering heat sink of claim 4, wherein the heat conducting channel further comprises a third heat conducting channel, the second heat conducting channel and the third heat conducting channel being spaced apart by a second spacer. 如申請專利範圍第1項所述之無縫焊接散熱排,其中,該第一導流管係 將一流體導入並流入該些散熱件,該第二導流管係將該流體由該些散熱件內導出。 The seamless welding heat dissipation row according to claim 1, wherein the first guiding pipe system A fluid is introduced into and flows into the heat sinks, and the second draft tube directs the fluid from the heat sinks. 如申請專利範圍第6項所述之無縫焊接散熱排,其中,該流體包括水、油、以或冷媒。 The seamlessly welded heat sink according to claim 6, wherein the fluid comprises water, oil, or a refrigerant. 如申請專利範圍第1項所述之無縫焊接散熱排,其中,該些散熱鰭片係呈方形或波浪型。 The seamless soldering heat sink according to claim 1, wherein the heat dissipating fins are square or wave-shaped.
TW104220466U 2015-12-21 2015-12-21 Seamless welding radiator TWM521714U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104220466U TWM521714U (en) 2015-12-21 2015-12-21 Seamless welding radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104220466U TWM521714U (en) 2015-12-21 2015-12-21 Seamless welding radiator

Publications (1)

Publication Number Publication Date
TWM521714U true TWM521714U (en) 2016-05-11

Family

ID=56510314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104220466U TWM521714U (en) 2015-12-21 2015-12-21 Seamless welding radiator

Country Status (1)

Country Link
TW (1) TWM521714U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108073255A (en) * 2016-11-10 2018-05-25 英业达科技有限公司 Heat dissipation row and servomechanism cooling system
TWI695569B (en) * 2018-06-19 2020-06-01 友永股份有限公司 Heat exchanger

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108073255A (en) * 2016-11-10 2018-05-25 英业达科技有限公司 Heat dissipation row and servomechanism cooling system
TWI695569B (en) * 2018-06-19 2020-06-01 友永股份有限公司 Heat exchanger

Similar Documents

Publication Publication Date Title
US9233438B2 (en) Heat sink and method for manufacturing
WO2016031604A1 (en) Flat heat pipe
KR102085716B1 (en) Heat exchanger and method for manufacturing the same
KR101179353B1 (en) Method for producing heat exchanger plate, and heat exchanger plate
TWM486246U (en) Isothermal plate with heat sink
KR20140070012A (en) Heat exchanger and method for manufacturing the same
TWM521714U (en) Seamless welding radiator
WO2019123678A1 (en) Method for manufacturing liquid cooling jacket
CN105682431A (en) Liquid-cooling cold plate
US11311963B2 (en) Method for producing liquid-cooled jacket
CN1233038C (en) Microjet array cooling heat sink
WO2016009727A1 (en) Liquid-cooled jacket and method for manufacturing liquid-cooled jacket
TWM523891U (en) Water-cooling apparatus for seamless welding
US20050252951A1 (en) Method for assembling and brazing CPU heat sink modules
CN205305328U (en) Pore free welded water cooling plant
JP3208562U (en) Water cooling heat sink structure
KR101321344B1 (en) The method for making a heat exchanger which is used in heater
JP4888422B2 (en) Heat transfer plate manufacturing method and heat transfer plate
JP2013158831A (en) Method for processing workpiece
JP2012160688A (en) Heat sink and method for manufacturing the same
TWI541485B (en) Fabricating method of liquid cooling plate with its components
TW201604674A (en) Etched vapor chamber
JP5071249B2 (en) Heat transfer plate manufacturing method and heat transfer plate
TWM566319U (en) Heat-dissipation element
CA2927555A1 (en) Cooling system to reduce liquid metal embrittlement in metal tube and pipe

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees