TWM503009U - Laser diode-doe module - Google Patents
Laser diode-doe module Download PDFInfo
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- TWM503009U TWM503009U TW103220315U TW103220315U TWM503009U TW M503009 U TWM503009 U TW M503009U TW 103220315 U TW103220315 U TW 103220315U TW 103220315 U TW103220315 U TW 103220315U TW M503009 U TWM503009 U TW M503009U
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Abstract
Description
本案是關於一種有關半導體雷射-繞射光學元件模組的領域，特別是一種有關整合半導體雷射及繞射光學元件模組的領域。This case relates to the field of semiconductor laser-diffractive optical component modules, and more particularly to the field of integrating semiconductor laser and diffractive optical component modules.
智慧手機等行動裝置是現代人生活中不可缺少的配備，在大尺寸觸控板的設計趨勢下，行動裝置可以有足夠的空間容納所需的元件。然而，除了大尺寸觸控板，輕且薄型化的外觀也是行動裝置的主流設計。因此，當行動裝置中的若干元件因功能等因素而必須以特定方式設置於行動裝置中時，此些元件的厚度或尺寸大小和行動裝置的薄度將有直接的關係，例如目前市售的智慧手機，其鏡頭模組的厚度大於智慧手機的厚度，故容置於智慧手機中的鏡頭模組，其所在之位置通常會凸出於智慧手機的蓋體，影響智慧手機的美觀。Mobile devices such as smart phones are indispensable in modern life. In the design trend of large-sized touch panels, mobile devices can have enough space to accommodate the required components. However, in addition to the large size touchpad, the light and thin appearance is also the mainstream design of mobile devices. Therefore, when several components in a mobile device must be disposed in a mobile device in a specific manner due to factors such as functions, the thickness or size of such components and the thinness of the mobile device will be directly related, such as currently commercially available. Smart phone, the thickness of the lens module is greater than the thickness of the smart phone, so the lens module placed in the smart phone, its location usually highlights the cover of the smart phone, affecting the beauty of the smart phone.
除了鏡頭模組外，愈來愈多的跡象顯示，投影功能的元件整合入智慧手機是設計趨勢之一。圖1為一般投影所需的光源設計的側面示意圖。請參考圖1，一般的半導體雷射12發出點光束13，準直鏡14接收點光束13並將點光束13準直化成為準直光束15，再由繞射光學元件16接收準直光束15將之繞射後輸出所需的繞射光17。上述的光源架構中，半導體雷射12和準直鏡14間的工作距離特定且需要高準確度，因此增加了組裝成本。此外，需要上述三種元件的光源，其整體長度或厚度亦可觀，恐難以容置於 輕薄化的行動裝置上。In addition to the lens module, there are more and more indications that the integration of components of the projection function into the smart phone is one of the design trends. Figure 1 is a side elevational view of the light source design required for general projection. Referring to FIG. 1, a general semiconductor laser 12 emits a spot beam 13, a collimating mirror 14 receives a spot beam 13 and collimates the spot beam 13 into a collimated beam 15, and receives a collimated beam 15 from the diffractive optical element 16. It is diffracted to output the desired diffracted light 17. In the above-described light source architecture, the working distance between the semiconductor laser 12 and the collimating mirror 14 is specific and requires high accuracy, thus increasing assembly costs. In addition, a light source that requires the above three components may have an overall length or thickness, which may be difficult to accommodate. Light and thin on the mobile device.
為解決上述問題，本案提供一種繞射光學元件和整合該繞射光學元件的半導體雷射-繞射光學元件模組，該繞射光學元件可接收並處理非準直化光束，故應用於投影光源時，可以減少原本所需準直鏡的透鏡和組裝成本。In order to solve the above problems, the present invention provides a diffractive optical element and a semiconductor laser-diffractive optical element module incorporating the diffractive optical element, the diffractive optical element can receive and process a non-collimated beam, and thus is applied to projection When the light source is used, the lens and assembly cost of the collimating mirror originally required can be reduced.
為解決上述問題，本案提供一種繞射光學元件和整合該繞射光學元件的半導體雷射-繞射光學元件模組，該繞射光學元件和半導體雷射之間無需設置一般的準直鏡，因此減少了架構整體的長度，適合應用於如智慧手機的行動裝置。In order to solve the above problems, the present invention provides a diffractive optical element and a semiconductor laser-diffractive optical element module incorporating the diffractive optical element, and a general collimating mirror is not required between the diffractive optical element and the semiconductor laser. Therefore, the overall length of the architecture is reduced, and it is suitable for use in mobile devices such as smart phones.
為解決上述問題，本案提供一種繞射光學元件和整合該繞射光學元件的半導體雷射-繞射光學元件模組，其包括製作於繞射光學元件上的一凹面鏡結構，具擴束的功能，使得光束能於短距離內到達繞射光學元件面時，有足夠的光束面積打在繞射光學元件面上。In order to solve the above problems, the present invention provides a diffractive optical element and a semiconductor laser-diffractive optical element module incorporating the diffractive optical element, comprising a concave mirror structure fabricated on the diffractive optical element, having the function of expanding beam When the light beam can reach the surface of the diffractive optical element within a short distance, there is enough light beam area to hit the surface of the diffractive optical element.
為解決上述問題，本案提供一種繞射光學元件和整合該繞射光學元件的半導體雷射-繞射光學元件模組，利用不需具準直的光源的繞射光學元件，可以產生所需的繞射出光配置。In order to solve the above problems, the present invention provides a diffractive optical element and a semiconductor laser-diffractive optical element module incorporating the diffractive optical element, which can generate desired light by using a diffractive optical element that does not require a collimated light source. Diffraction light output configuration.
依據上述，一種半導體雷射-繞射光學元件模組，包括：一雷射光源模組，其輸出一非準直點光束；一繞射光學元件，其接收來自該雷射光源模組的該非準直點光束以及將該非準直點光束調制輸出成為一帶有光資訊的光，其中，該繞射光學元件包括一透明基板以及形成於該透光基板之一第一面的一微結構；以及一殼體，其容置該雷射光源模組和該繞 射光學元件，其中，該帶有光資訊的光射出該殼體外。According to the above, a semiconductor laser-diffractive optical element module includes: a laser light source module that outputs a non-collimated point beam; and a diffractive optical element that receives the non-radiation from the laser source module And collimating the non-collimated point beam into a light with optical information, wherein the diffractive optical element comprises a transparent substrate and a microstructure formed on a first side of the transparent substrate; a housing that houses the laser light source module and the winding The optical element is emitted, wherein the light with information of light is emitted outside the housing.
較佳地，該微結構繞射該非準直點光束。Preferably, the microstructure diffracts the non-collimated point beam.
較佳地，具有該微結構的該第一面為一平面或一曲面。Preferably, the first surface having the microstructure is a plane or a curved surface.
較佳地，該微結構分布於一部分或全部該第一面上。Preferably, the microstructure is distributed over a portion or all of the first side.
較佳地，該微結構位於該第一面的外側以暴露於該第一面外，或是位於該第一面的內側。Preferably, the microstructure is located outside the first face to be exposed to the outside of the first face or to the inside of the first face.
較佳地，該繞射光學元件更包括一可擴束的功能結構形成或設置於該透光基板之一第二面，並且該非準直點光束通過該可擴束的功能結構，該可擴束的功能結構包括一凹面鏡。Preferably, the diffractive optical element further comprises a expandable functional structure formed or disposed on a second side of the transparent substrate, and the non-collimated point beam passes through the expandable functional structure, the expandable The functional structure of the bundle includes a concave mirror.
較佳地，該雷射光源模組和該繞射光學元件保持一間距，該間距為0或不為0。Preferably, the laser light source module and the diffractive optical element maintain a spacing of 0 or not 0.
較佳地，該殼體於該非準直點光束的一光軸方向的一長度不大於6毫米。Preferably, the length of the housing in an optical axis direction of the non-collimated point beam is no more than 6 mm.
較佳地，該殼體於該非準直點光束的一光軸方向的一長度不大於4毫米。Preferably, the length of the housing in an optical axis direction of the non-collimated point beam is no more than 4 mm.
依據上述，一種半導體雷射-繞射光學元件模組，包括：一雷射光源模組，其輸出一非準直點光束；以及一繞射光學元件，其接收來自該雷射光源模組的該非準直點光束以及將該非準直點光束調制輸出成為一帶有光資訊的光。According to the above, a semiconductor laser-diffractive optical element module includes: a laser light source module that outputs a non-collimated point beam; and a diffractive optical element that receives the laser light source module from the laser light source module The non-collimated point beam and the non-collimated point beam modulated output are a light with light information.
較佳地，該半導體雷射-繞射光學元件模組更包括容置該雷射光源模組和該繞射光學元件的一殼體。Preferably, the semiconductor laser-diffractive optical element module further comprises a housing for housing the laser light source module and the diffractive optical element.
較佳地，該繞射光學元件包括一透明基板以及形成於該透光 基板之一第一面的一微結構，該微結構繞射該非準直點光束。Preferably, the diffractive optical element comprises a transparent substrate and is formed in the transparent a microstructure of the first side of one of the substrates, the microstructure diffracting the non-collimated point beam.
較佳地，具有該微結構的該第一面為一平面或一曲面。Preferably, the first surface having the microstructure is a plane or a curved surface.
較佳地，該微結構分布於一部分或全部該第一面上。Preferably, the microstructure is distributed over a portion or all of the first side.
較佳地，該微結構位於該第一面的外側以暴露於該第一面外，或是位於該第一面的內側。Preferably, the microstructure is located outside the first face to be exposed to the outside of the first face or to the inside of the first face.
較佳地，該第一面朝向該雷射光源模組，或是朝向該半導體雷射-繞射光學元件模組外。Preferably, the first surface faces the laser light source module or faces the semiconductor laser-diffractive optical element module.
較佳地，該繞射光學元件更包括一可擴束的功能結構形成或設置於該透光基板之一第二面，並且該非準直點光束通過該可擴束的功能結構。Preferably, the diffractive optical element further comprises a expandable functional structure formed or disposed on a second side of the transparent substrate, and the non-collimated point beam passes through the expandable functional structure.
較佳地，該可擴束的功能結構包括以半導體製程加工成或以精密加工成一幾何光學面的一凹透鏡。Preferably, the expandable functional structure comprises a concave lens processed in a semiconductor process or precisely machined into a geometrical optical surface.
較佳地，該第一面介於該雷射光源模組和該第二面之間，或是該第二面介於該雷射光源模組和該第一面之間。Preferably, the first surface is between the laser light source module and the second surface, or the second surface is between the laser light source module and the first surface.
較佳地，該雷射光源模組和該繞射光學元件保持一間距，該間距為0或不為0。Preferably, the laser light source module and the diffractive optical element maintain a spacing of 0 or not 0.
依據上述，一種繞射光學元件，包括一透光基板以及接收非準直雷射點光束的一微結構，其中，該微結構形成於該透光基板上。According to the above, a diffractive optical element includes a light transmissive substrate and a microstructure for receiving a beam of non-collimated laser spot, wherein the microstructure is formed on the light transmissive substrate.
較佳地，該繞射光學元件的該微結構位於該透光基板的一第一面，該繞射光學元件更包括一可擴束的功能結構位於該透光基板的一第二面。Preferably, the microstructure of the diffractive optical element is located on a first side of the transparent substrate, and the diffractive optical element further comprises a expandable functional structure on a second side of the transparent substrate.
較佳地，該繞射光學元件的該微結構分布於一部分或全部該 第一面上。Preferably, the microstructure of the diffractive optical element is distributed in part or all of the The first side.
較佳地，該繞射光學元件的該可擴束的功能結構包括分布於一部分或全部該第二面上的一凹透鏡。Preferably, the expandable functional structure of the diffractive optical element comprises a concave lens distributed over a portion or all of the second side.
為了能進一步了解本創作為達成預定目的所採取之技術、手段及功效，請參閱以下有關本創作的詳細說明及附圖。本創作的目的、特徵或特點，當可由此得到一深入且具體的瞭解，然而所附圖式僅提供參考與說明用，並非用以對本創作加以限制者。In order to further understand the techniques, means and effects of this creation for the intended purpose, please refer to the following detailed description and drawings of this creation. The purpose, features, and characteristics of the present invention are to be understood as an in-depth and specific understanding.
12‧‧‧半導體雷射12‧‧‧Semiconductor laser
13‧‧‧點光束13‧‧‧ spot beam
14‧‧‧準直鏡14‧‧‧ Collimation mirror
15‧‧‧準直光束15‧‧‧ Collimated beam
16‧‧‧繞射光學元件16‧‧‧Diffractive optical components
17‧‧‧繞射光17‧‧‧Diffraction light
2‧‧‧半導體雷射-繞射光學元件模組2‧‧‧Semiconductor laser-diffractive optical component module
22‧‧‧雷射光源模組22‧‧‧Laser light source module
24‧‧‧繞射光學元件24‧‧‧Diffractive optical components
23‧‧‧殼體23‧‧‧ housing
25‧‧‧非準直點光束25‧‧‧ Non-collimated point beam
221‧‧‧窗口221‧‧‧ window
27‧‧‧帶有光資訊的光27‧‧‧Light with light information
L‧‧‧間距L‧‧‧ spacing
T‧‧‧總長度T‧‧‧ total length
U‧‧‧厚度U‧‧‧thickness
34、44、54‧‧‧繞射光學元件34, 44, 54‧‧‧Diffractive optical components
28‧‧‧透光基板28‧‧‧Transparent substrate
341、441、541‧‧‧第一面First side of 341, 441, 541‧‧
343、443、543‧‧‧第二面343, 443, 543‧‧‧ second side
64‧‧‧繞射光學元件64‧‧‧Diffractive optical components
641‧‧‧第一面641‧‧‧ first side
643‧‧‧第二面643‧‧‧ second side
642‧‧‧可擴束的結構或形狀642‧‧‧ expandable structure or shape
36、46、56、66‧‧‧微結構36, 46, 56, 66‧‧‧ microstructure
圖1為一般投影所需的光源設計的側面示意圖。Figure 1 is a side elevational view of the light source design required for general projection.
圖2為本案之一雷射光源模組設計實施例的側面示意圖。FIG. 2 is a schematic side view showing a design embodiment of a laser light source module of the present invention.
圖3為本案之繞射光學元件不同實施例的放大側面示意圖。Figure 3 is an enlarged side elevational view of a different embodiment of the diffractive optical element of the present invention.
圖4為本案之繞射光學元件不同實施例的放大側面示意圖。Figure 4 is an enlarged side elevational view of a different embodiment of the diffractive optical element of the present invention.
圖5為本案之繞射光學元件不同實施例的放大側面示意圖。Figure 5 is an enlarged side elevational view of a different embodiment of the diffractive optical element of the present invention.
圖6為本案之繞射光學元件不同實施例的放大側面示意圖。Figure 6 is an enlarged side elevational view of a different embodiment of the diffractive optical element of the present invention.
本案之繞射光學元件和整合該繞射光學元件的半導體雷射-繞射光學元件模組，適合應用於智慧手機等行動裝置上作為雷射光源。以目前而言，利用TO-CAN封裝的雷射，適合於智慧手機的半導體雷射模組的尺寸為6x6x7毫米(長x寬x厚)，將來更演進至4x6x4毫米。因此，本案之整合該繞射光學元件的半導體雷射-繞射光學元件模組的厚度將可以壓縮至4毫米以下。如果進一步使用表面固定型元件(Surface Mount Device,SMD)封裝的雷射，雷射模組厚度更可降到2毫米，足夠手持裝置使用，並且雷射模組 也可直接於印刷電路板(Printed Circuit Board,PCB)板上，利用傳統打件方式生產。The diffractive optical element of the present invention and the semiconductor laser-diffractive optical element module incorporating the diffractive optical element are suitable for use as a laser light source on a mobile device such as a smart phone. At present, with the laser of TO-CAN package, the size of the semiconductor laser module suitable for smart phones is 6x6x7 mm (length x width x thickness), and in the future it will evolve to 4x6x4 mm. Therefore, the thickness of the semiconductor laser-diffractive optical element module incorporating the diffractive optical element in the present case can be compressed to less than 4 mm. If you further use a surface mount device (SMD) packaged laser, the thickness of the laser module can be reduced to 2 mm, enough for handheld devices, and the laser module It can also be produced directly on a Printed Circuit Board (PCB) board using traditional parts.
其次，由一般雷射光源發出的雷射光束為一非準直的點光束，習知多利用一準直鏡將此非準直的點光束準直化後為平行光後才會入射其他光學元件。本案以下所述的非準直光，係指由一般雷射光源發出的雷射光束，在入射本案之繞射光學元件前未經過任何的準直化，其一般具有不等於0度的光束發散角(beam divergence)。本案可應用的發出非準直的點光束的雷射光源，舉例但不限地，例如常見半導體端射型雷射(edge emitting laser)、垂直共振腔面射雷射(VCSEL)或其他種類的雷射光源。Secondly, the laser beam emitted by the general laser source is a non-collimated point beam. It is conventional to use a collimating mirror to collimate the non-collimated point beam into parallel light before entering other optical components. . The non-collimated light described below in this case refers to a laser beam emitted by a general laser source, which has not undergone any collimation before being incident on the diffractive optical element of the present invention, and generally has a beam divergence not equal to 0 degrees. Beam divergence. A laser source that emits a non-collimated point beam, such as, but not limited to, a common semiconductor edge-emitting laser, vertical cavity laser (VCSEL), or other types of applications. Laser source.
圖2為本案之一半導體雷射-繞射光學元件模組設計實施例的側面示意圖。請參考圖1，半導體雷射-繞射光學元件模組2包括一雷射光源模組22以及一繞射光學元件24，半導體雷射-繞射光學元件模組2可更包括容置雷射光源模組22以及繞射光學元件24的一殼體23。於本實施例中，雷射光源模組22的非準直點光束25由雷射光源模組22的一窗口221射出，其中窗口221可以為雷射光源模組22的一開口，或是在開口有其他不具準直功能的元件(圖上未繪)，例如防塵用的一透明保護片或灌膠。可以理解的，雷射光源模組22亦可提供一表面，或如垂直共振腔面射雷射(VCSEL)的光源陣列，以發出複數個非準直點光束25。2 is a side view showing a design embodiment of a semiconductor laser-diffractive optical element module of the present invention. Referring to FIG. 1 , the semiconductor laser-diffractive optical element module 2 includes a laser light source module 22 and a diffractive optical element 24 , and the semiconductor laser-diffractive optical element module 2 can further include a receiving laser. The light source module 22 and a housing 23 of the diffractive optical element 24. In this embodiment, the non-collimated point beam 25 of the laser source module 22 is emitted from a window 221 of the laser source module 22, wherein the window 221 can be an opening of the laser source module 22, or The opening has other components that are not collimated (not shown), such as a transparent protective sheet or glue for dustproofing. It can be understood that the laser source module 22 can also provide a surface, or an array of light sources such as a vertical cavity surface-emitting laser (VCSEL), to emit a plurality of non-collimated point beams 25.
其次，繞射光學元件24設置於雷射光源模組22上以使非準直點光束25入射繞射光學元件24，其中，雷射光源模組22本身或和繞射光學元件24之間並未有任何具準直化功能的光學元件或結構介入。又，繞射光學元件24和雷射光源模組22之間可具有一間距L，其中間距L可以是0或不為 0，亦謂繞射光學元件24可以完全貼附於雷射光源模組22上，或是與雷射光源模組22保持一距離。是以，本案的繞射光學元件24可以完全貼附於雷射光源模組22上，故使得繞射光學元件24和雷射光源模組22的總長度T(平行非準直點光束25方向上的長度)可以縮短到很小，進而使得殼體23的厚度U亦可以縮短以達到上述的4毫米以下。Next, the diffractive optical element 24 is disposed on the laser source module 22 such that the non-collimated point beam 25 is incident on the diffractive optical element 24, wherein the laser source module 22 itself and the diffractive optical element 24 are There are no optical components or structural interventions with collimation capabilities. Moreover, the diffractive optical element 24 and the laser source module 22 may have a spacing L, wherein the spacing L may be 0 or not 0, that is, the diffractive optical element 24 can be completely attached to the laser light source module 22 or at a distance from the laser light source module 22. Therefore, the diffractive optical element 24 of the present invention can be completely attached to the laser light source module 22, so that the total length T of the diffractive optical element 24 and the laser source module 22 (parallel non-collimated point beam 25 direction) The length of the upper portion can be shortened to a small extent, so that the thickness U of the casing 23 can also be shortened to reach the above-mentioned 4 mm or less.
再者，非準直點光束25入射並經過繞射光學元件24的繞射處理後便成為具有二或二以上維度的帶有光資訊的光27，帶有光資訊的光27射出半導體雷射-繞射光學元件模組2外後便可以投影至任何適當的著光面或空間上。可以理解的，由於帶有光資訊的光27是經過繞射光學元件24的調制，因此光資訊的亮度可以依設計需求很均勻或有灰度的變化，不會出現設計條件外的突兀亮點。除了帶有較大亮度的光資訊外，帶有光資訊的光27亦可以帶有亮度較弱的背景光，並且即使是背景光的亮度也是均勻或緩變的。Furthermore, the non-collimated point beam 25 is incident and subjected to diffraction processing by the diffractive optical element 24 to become optical information 27 having two or more dimensions, and the light 27 with optical information is emitted from the semiconductor laser. - The diffractive optical element module 2 can be projected onto any suitable illuminating surface or space. It can be understood that since the light 27 with optical information is modulated by the diffractive optical element 24, the brightness of the light information can be uniform or gradual according to design requirements, and there is no sudden highlight outside the design conditions. In addition to light information with greater brightness, the light 27 with light information can also have a background light with a weaker brightness, and even the brightness of the background light is uniform or slow.
圖3、4、5為本案之繞射光學元件不同實施例的放大側面示意圖。請參考圖3、4、5，本案的繞射光學元件34、44、54可以以適當的透光材料為透光基板28，在透光基板28的至少任一表面製作或形成繞射紋路或圖樣的微結構。以圖3來看，透光基板28的第一面341朝向雷射光源模組，帶有光資訊的光則由透光基板28的第二面343射出，則具有接收非準直點光束的繞射紋路或圖樣的微結構36製作於透光基板28的第一面341上，第二面343則可為無微結構，其中微結構36可以是UV固化膠層製作於暴露於第一面341上或蝕刻製作紋路於第一面341外側。圖4則和圖3相反，朝向雷射光源模組的第一面441不具繞射功能，第二面443則包括可接收非準直點光束 的繞射紋路或圖樣的微結構46並產生繞射圖像。圖5中的第一面541和第二面543則皆包括接收非準直點光束的繞射紋路或圖樣的微結構56。此外，要說明的是，繞射光學元件34、44、54的第一面或第二面皆可以分別為平面或是有弧度或曲率的面。另外，非準直點光束的繞射紋路或圖樣的微結構可以分布或形成於透光基板的一部分或全部表面。3, 4, and 5 are enlarged side views of different embodiments of the diffractive optical element of the present invention. Referring to FIGS. 3, 4, and 5, the diffractive optical elements 34, 44, and 54 of the present invention may be made of a light transmissive substrate 28 with a suitable light transmissive material, and a diffraction pattern may be formed or formed on at least any surface of the transparent substrate 28. The microstructure of the pattern. As shown in FIG. 3, the first surface 341 of the transparent substrate 28 faces the laser light source module, and the light with optical information is emitted by the second surface 343 of the transparent substrate 28, and has a light beam for receiving the non-collimated point beam. The microstructures 36 of the ridge pattern or pattern are formed on the first surface 341 of the transparent substrate 28, and the second surface 343 may be microstructure-free. The microstructure 36 may be a UV-curable adhesive layer formed on the first surface 341. The upper or etched lines are formed on the outside of the first side 341. 4 is opposite to FIG. 3, the first surface 441 facing the laser light source module has no diffraction function, and the second surface 443 includes a non-collimated point beam. The diffraction pattern or pattern of microstructures 46 produces a diffracted image. The first side 541 and the second side 543 of FIG. 5 each include a microstructure 56 that receives a diffraction pattern or pattern of non-collimated point beams. Furthermore, it is to be noted that the first or second faces of the diffractive optical elements 34, 44, 54 may each be planar or have a curved or curved face. In addition, the diffraction pattern or pattern microstructure of the non-collimated point beam may be distributed or formed on a portion or all of the surface of the light transmissive substrate.
除了製作繞射紋路或圖樣的微結構外，本案之繞射光學元件仍可包括其他功能的功能面。圖6為本案之繞射光學元件另一實施例的放大側面示意圖。請參考圖6，繞射光學元件64亦以透光材料為透光基板28，其朝向雷射光源模組的第一面641具有或包括一可擴束的結構或形狀642，例如以半導體製程DOE製作或精密加工製作的幾何光學面的一凹透鏡結構，帶有光資訊的光則由包括繞射紋路或圖樣的微結構66的第二面643射出，其作用在於擴大入射的非準直點光束大小，使得經過微結構66的光束可以有較大著光面積，才能接受較多的波前調製資訊，進而投射出較細膩的圖樣。可以理解的，如此的可擴束的結構或形狀亦可以分布於透光基板的一部分或整個表面。In addition to making the microstructure of the diffraction pattern or pattern, the diffractive optical element of the present invention can still include functional surfaces of other functions. Fig. 6 is an enlarged side elevational view showing another embodiment of the diffractive optical element of the present invention. Referring to FIG. 6 , the diffractive optical element 64 also has a light transmissive material as the transparent substrate 28 , which has or includes a expandable structure or shape 642 toward the first surface 641 of the laser light source module, for example, in a semiconductor process. A concave lens structure of a geometrical optical surface produced by DOE or precision machined, light with optical information is emitted by a second side 643 of a microstructure 66 including a diffraction pattern or pattern, which acts to enlarge the incident non-collimated point beam. The size allows the beam passing through the microstructure 66 to have a large illumination area to receive more wavefront modulation information, thereby projecting a finer pattern. It will be appreciated that such a expandable structure or shape may also be distributed over a portion or the entire surface of the light transmissive substrate.
依據上述，對於整個半導體雷射-繞射光學元件模組而言，省略習知的繞射光學元件和雷射光源模組之間需放置準直光學元件，甚至將繞射光學元件貼附於雷射光源模組上，本案的半導體雷射-繞射光學元件模組可縮短整個模組於平行光軸上的長度，同時降低整個模組的材料和組裝成本，是適合應用於薄型化的行動或穿戴裝置上。According to the above, for the entire semiconductor laser-diffractive optical element module, a collimating optical element between the conventional diffractive optical element and the laser light source module is omitted, and even the diffractive optical element is attached to In the laser light source module, the semiconductor laser-diffractive optical element module of the present invention can shorten the length of the entire module on the parallel optical axis, and at the same time reduce the material and assembly cost of the entire module, and is suitable for thinning. Act or wear the device.
以上所述僅為本創作的較佳實施例，並非用以限定本創作的權利要求範圍，因此凡其他未脫離本創作所揭示的精神下所完成的等效改 變或修飾，均應包含于本創作的範圍內。The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention, and therefore, other equivalent modifications are not made without departing from the spirit of the present disclosure. Changes or modifications should be included in the scope of this creation.
2‧‧‧半導體雷射-繞射光學元件模組2‧‧‧Semiconductor laser-diffractive optical component module
22‧‧‧雷射光源模組22‧‧‧Laser light source module
24‧‧‧繞射光學元件24‧‧‧Diffractive optical components
23‧‧‧殼體23‧‧‧ housing
25‧‧‧非準直點光束25‧‧‧ Non-collimated point beam
221‧‧‧窗口221‧‧‧ window
27‧‧‧帶有光資訊的光27‧‧‧Light with light information
L‧‧‧間距L‧‧‧ spacing
T‧‧‧總長度T‧‧‧ total length
U‧‧‧厚度U‧‧‧thickness
Claims (9)
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| TW103220315U TWM503009U (en) | 2014-11-14 | 2014-11-14 | Laser diode-doe module |
| CN201420731427.4U CN204269928U (en) | 2014-11-14 | 2014-11-27 | semiconductor laser-diffraction optical element module |
| US14/706,401 US20170131560A1 (en) | 2014-11-14 | 2015-05-07 | Diffractive optical element and laser diode-doe module |
| US16/161,258 US10895753B2 (en) | 2014-11-14 | 2018-10-16 | Structured light generation device and diffractive optical element thereof |
| US17/118,789 US20210191143A1 (en) | 2014-11-14 | 2020-12-11 | Structured light generation device and diffractive optical element thereof |
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| TWI585467B (en) * | 2015-08-28 | 2017-06-01 | 高準精密工業股份有限公司 | Lighting apparatus with the corresponding diffractive optical elements |
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| CN105372905A (en) * | 2015-11-24 | 2016-03-02 | 深圳奥比中光科技有限公司 | Laser module and image information acquisition apparatus |
| DE102017100997A1 (en) | 2017-01-19 | 2018-07-19 | Osram Opto Semiconductors Gmbh | Semiconductor laser and method for producing such a semiconductor laser |
| EP3561574A4 (en) | 2018-03-12 | 2019-12-25 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection module and detection method and apparatus therefor, and depth camera module and electronic apparatus |
| CN108507761B (en) * | 2018-03-12 | 2020-01-10 | Oppo广东移动通信有限公司 | Laser projection module, detection method and device thereof, depth camera and electronic device |
| CN108594393A (en) * | 2018-04-04 | 2018-09-28 | Oppo广东移动通信有限公司 | Diffraction optical assembly, laser projection module, depth camera and electronic device |
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| TWI585467B (en) * | 2015-08-28 | 2017-06-01 | 高準精密工業股份有限公司 | Lighting apparatus with the corresponding diffractive optical elements |
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