CN204269928U - semiconductor laser-diffraction optical element module - Google Patents
semiconductor laser-diffraction optical element module Download PDFInfo
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- CN204269928U CN204269928U CN201420731427.4U CN201420731427U CN204269928U CN 204269928 U CN204269928 U CN 204269928U CN 201420731427 U CN201420731427 U CN 201420731427U CN 204269928 U CN204269928 U CN 204269928U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
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- 230000003321 amplification Effects 0.000 description 6
- 238000003199 nucleic acid amplification method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
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- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 1
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Abstract
The utility model provides a semiconductor laser-diffraction optical element module, which comprises a laser light source module, a diffraction optical element and a shell, wherein the laser light source module outputs a non-collimated point light beam; the diffraction optical element receives the non-collimated point light beam from the laser light source module and modulates and outputs the non-collimated point light beam into light with optical information, wherein the diffraction optical element comprises a transparent substrate and a microstructure formed on a first surface of the transparent substrate; the housing accommodates the laser light source module and the diffractive optical element, and the light with optical information is emitted out of the housing. The utility model discloses utilize this diffraction optical element that can receive a non-collimation point light beam to cooperate the laser light source module of launching this non-collimation point light beam, so can shorten the interval between laser light source module and the diffraction optical element as far as possible for the length of whole semiconductor laser-diffraction optical element module can shorten.
Description
Technical field
The utility model about the field of semiconductor laser-diffraction optical element module, particularly about the field of integrating semiconductor laser and diffraction optical element module.
Background technology
The mobile devices such as smart mobile phone are indispensable outfits during modern lives, and under the designer trends of large touch plate, mobile device can have the element needed for enough space.But except large touch plate, the light and outward appearance of slimming is also the mainstay of mobile device.Therefore; when the some elements in mobile device must be arranged in mobile device in a specific way because of factors such as functions; the thinness of the thickness of this little element or size and mobile device will have direct relation; such as commercially available at present smart mobile phone; the thickness of its camera lens module is greater than the thickness of smart mobile phone; therefore the camera lens module be placed in smart mobile phone, the position at its place can protrude from the lid of smart mobile phone usually, affects the attractive in appearance of smart mobile phone.
Except camera lens module, more and more many sign displays, it is one of designer trends that the element with projecting function is integrated into smart mobile phone.The side schematic view of the light source design of Fig. 1 needed for general projection.Please refer to Fig. 1, general semiconductor laser 12 sends a light beam 13, collimating mirror 14 acceptance point light beam 13 also becomes collimated light beam 15 by collimate for a light beam 13, then will export required diffraction light 17 after it diffraction by diffraction optical element (DOE) 16 reception collimated light beam 15.In above-mentioned light source framework, the operating distance between semiconductor laser 12 and collimating mirror 14 is specific and need pin-point accuracy, because this increasing assembly cost.In addition, need the light source of above-mentioned three kinds of elements, its entire length or thickness are also considerable, are probably difficult to be placed on lightening mobile device.
Utility model content
The technical problems to be solved in the utility model is, for prior art above shortcomings, a kind of semiconductor laser-diffraction optical element module integrating diffraction optical element is provided, this diffraction optical element can receive and process non-aligned light beam, therefore when being applied to projection light source, lens and the assembly cost of required collimating mirror originally can be reduced.
The technical problems to be solved in the utility model is, for prior art above shortcomings, a kind of semiconductor laser-diffraction optical element module integrating diffraction optical element is provided, without the need to arranging general collimating mirror between this diffraction optical element and semiconductor laser, because this reducing the length of framework entirety, be applicable to being applied to the mobile device as smart mobile phone.
The technical problems to be solved in the utility model is, for prior art above shortcomings, a kind of semiconductor laser-diffraction optical element module integrating diffraction optical element is provided, it comprises the concave mirror structure be made on diffraction optical element, the function that tool expands, when making light beam can arrive diffraction optical element face in short distance, enough beam area are had to beat on diffraction optical element face.
The technical problems to be solved in the utility model is, for prior art above shortcomings, a kind of semiconductor laser-diffraction optical element module integrating diffraction optical element is provided, utilizes the diffraction optical element of the light source not needing tool to collimate, required diffraction bright dipping configuration can be produced.
The utility model solves the technical scheme that its technical matters adopts and is to provide a kind of semiconductor laser-diffraction optical element module, and it comprises LASER Light Source module, diffraction optical element and housing, and this LASER Light Source module exports a non-aligned point light beam; This diffraction optical element receives this non-aligned point light beam from this LASER Light Source module, and this non-aligned point beam modulation is output into one with the light of optical information, wherein, this diffraction optical element comprises transparency carrier and is formed at the microstructure of a first surface of this transparent substrates; This housing this LASER Light Source module accommodating and this diffraction optical element, wherein, should penetrate outside this housing with the light of optical information.
Preferably, this non-aligned point light beam of this microstructure diffraction.
Preferably, this first surface being formed with this microstructure is a plane or a curved surface.
Preferably, this cavity disperse characteristic in this first surface part or all on.
Preferably, this microstructure is positioned at the outside of this first surface to be exposed to outside this first surface, or this microstructure is positioned at the inner side of this first surface.
Preferably, this diffraction optical element also comprises the functional structure that can expand, the functional structure that this can expand is formed or is arranged at one second of this transparent substrates, and the functional structure that this non-aligned point light beam can be expanded by this, this functional structure that can expand comprises a concave mirror.
Preferably, this LASER Light Source module and this diffraction optical element keep a spacing, and this spacing is 0 or is not 0.
Preferably, this housing is not more than 6 millimeters in a length of an optical axis direction of this non-aligned point light beam.
Preferably, this housing is not more than 4 millimeters in a length of an optical axis direction of this non-aligned point light beam.
The utility model also provides a kind of semiconductor laser-diffraction optical element module, and it comprises LASER Light Source module and diffraction optical element, and this LASER Light Source module exports a non-aligned point light beam; This diffraction optical element receives from this non-aligned point light beam of this LASER Light Source module, and this non-aligned point beam modulation is output into one with the light of optical information.
Preferably, this semiconductor laser-diffraction optical element module also comprises the housing of this LASER Light Source module accommodating and this diffraction optical element.
Preferably, this diffraction optical element comprises transparency carrier and is formed at the microstructure of a first surface of this transparent substrates, this non-aligned point light beam of this microstructure diffraction.
Preferably, this first surface being formed with this microstructure is a plane or a curved surface.
Preferably, this cavity disperse characteristic in this first surface part or all on.
Preferably, this microstructure is positioned at the outside of this first surface to be exposed to outside this first surface, or this microstructure is positioned at the inner side of this first surface.
Preferably, this first surface is towards this LASER Light Source module, or this first surface is towards outside this semiconductor laser-diffraction optical element module.
Preferably, this diffraction optical element also comprises the functional structure that can expand, and the functional structure that this can expand is formed or is arranged at one second of this transparent substrates, and the functional structure that this non-aligned point light beam can be expanded by this.
Preferably, this functional structure that can expand comprises the concavees lens being processed into or becoming with Precision Machining a geometrical optics face with manufacture of semiconductor.
Preferably, this first surface is between this LASER Light Source module and this second, or this second between this LASER Light Source module and this first surface.
Preferably, this LASER Light Source module and this diffraction optical element keep a spacing, and this spacing is 0 or is not 0.
The utility model also provides a kind of diffraction optical element, it microstructure comprising transparent substrates and receive non-aligned laser spots light beam, and wherein, this microstructure is formed on this transparent substrates.
Preferably, this microstructure of this diffraction optical element is positioned at a first surface of this transparent substrates, and this diffraction optical element also comprises the functional structure that can expand, and this functional structure that can expand is positioned at one second of this transparent substrates.
Preferably, this diffraction optical element this cavity disperse characteristic in this first surface part or all on.
Preferably, this functional structure that can expand of this diffraction optical element comprises the concavees lens be distributed on part or all of this second.
The light source that diffraction optical element of the present utility model does not need tool to collimate, and can receive and process non-aligned light beam, when being applied to projection light source, lens and the assembly cost of required collimating mirror originally can be reduced; This diffraction optical element also can be arranged the functional structure that can expand, thus have and expand function, when making light beam can arrive diffraction optical element face in short distance, have enough beam area to beat on diffraction optical element face.By this diffraction optical element, semiconductor laser of the present utility model-diffraction optical element module, eliminate the collimation optics needing between existing diffraction optical element and LASER Light Source module to place, even diffraction optical element can be attached on LASER Light Source module, the length of whole module on parallel optical axis direction can be shortened thus, reduce material and the assembly cost of whole module, on the movement being applicable to being applied to slimming or object wearing device simultaneously.
In order to technology, means and effect that the utility model is taked for reaching predetermined object can be understood further, refer to following relevant detailed description of the present utility model and accompanying drawing.The purpose of this utility model, feature or feature, when obtaining one thus deeply and concrete understanding, but institute's accompanying drawings only provides with reference to and use is described, and is not used to the utility model in addition limitr.
Accompanying drawing explanation
The side schematic view of the light source design of Fig. 1 needed for general projection.
Fig. 2 is the side schematic view of semiconductor of the present utility model laser-diffraction optical element module design embodiment.
Fig. 3 is the amplification side schematic view of diffraction optical element one embodiment of the present utility model.
Fig. 4 is the amplification side schematic view of diffraction optical element one embodiment of the present utility model.
Fig. 5 is the amplification side schematic view of diffraction optical element one embodiment of the present utility model.
Fig. 6 is the amplification side schematic view of diffraction optical element one embodiment of the present utility model.
Embodiment
Semiconductor laser-diffraction optical element the module of diffraction optical element of the present utility model and this diffraction optical element of integration, is applicable to being applied on the mobile devices such as smart mobile phone as LASER Light Source.With presently, utilize the laser instrument that TO-CAN encapsulates, the semiconductor laser module being suitable for smart mobile phone is of a size of 6 × 6 × 7 millimeters of (long × wide × thick), in the future more evolution to 4 × 6 × 4 millimeter.Therefore, the thickness of the semiconductor laser-diffraction optical element module of this diffraction optical element of integration of the present utility model can be compressed to less than 4 millimeters.If use surperficial fixed element (Surface Mount Device further, SMD) laser instrument encapsulated, laser module thickness more can drop to 2 millimeters, enough hand-held devices use, and laser module also can directly in printed circuit board (PCB) (Printed Circuit Board, PCB), on, traditional piece mode is utilized to produce.
Secondly, the laser beam sent by general LASER Light Source is one uncollimated some light beam, and prior art just can other optical element incident after utilizing a collimating mirror this uncollimated some beam collimation to be turned to directional light more.The non-collimated light of the utility model the following stated, refer to the laser beam sent by general LASER Light Source, without any collimate before incidence diffraction optical element of the present utility model, it generally has the beam divergence angle (beam divergence) being not equal to 0 degree.The applicable LASER Light Source sending uncollimated some light beam of the utility model, illustrate but do not limit ground, the such as LASER Light Source of common semiconductor edge-emitting laser instrument (edge emitting laser), vertical cavity surface-emitting laser (VCSEL) or other kind.
Fig. 2 is the side schematic view of semiconductor of the present utility model laser-diffraction optical element module design embodiment.Please refer to Fig. 2, semiconductor laser-diffraction optical element module 2 comprises LASER Light Source module 22 and a diffraction optical element 24, and semiconductor laser-diffraction optical element module 2 more can comprise a housing 23 of accommodating LASER Light Source module 22 and diffraction optical element 24.In the present embodiment; the non-aligned point light beam 25 of LASER Light Source module 22 is penetrated by a window 221 of LASER Light Source module 22; wherein window 221 can be an opening of LASER Light Source module 22; or have other not have an element (figure does not paint) of alignment function at opening, such as dust-proof one transparency protected or encapsulating.Understandable, LASER Light Source module 22 also can provide a surface, or as the array of source of vertical cavity surface-emitting laser (VCSEL), to send multiple non-aligned point light beam 25.
Secondly, diffraction optical element 24 is arranged on LASER Light Source module 22 to make the incident diffraction optical element 24 of non-aligned point light beam 25, wherein, LASER Light Source module 22 itself or and diffraction optical element 24 between do not have the optical element of the collimate function of any tool or structure to get involved.Again, can have a spacing L between diffraction optical element 24 and LASER Light Source module 22, wherein spacing L can be 0 or not be 0, and also calling diffraction optical element 24 can be attached on LASER Light Source module 22 completely, or keeps a distance with LASER Light Source module 22.Be with, diffraction optical element 24 of the present utility model can be attached on LASER Light Source module 22 completely, therefore make diffraction optical element 24 can shorten to very little with the total length T (length on parallel non-aligned point light beam 25 optical axis direction) of LASER Light Source module 22, and then less than 4 millimeters that make the thickness U of housing 23 can also shorten to reach above-mentioned.
Moreover, non-aligned point light beam 25 is incident also just becomes the light 27 with optical information with more than two or two dimension after the diffraction process of diffraction optical element 24, the light 27 with optical information penetrate just can be projected to after outside semiconductor laser-diffraction optical element module 2 any suitably light face or spatially.Understandable, owing to being through the modulation of diffraction optical element 24 with the light 27 of optical information, therefore the brightness of optical information according to design requirement very evenly or have the change of gray scale, can there will not be the lofty bright spot outside design conditions.Except with except the optical information of greater brightness, the light 27 with optical information can also with the more weak bias light of brightness, even and the brightness of bias light is also even or gradual.
Fig. 3,4,5 is the amplification side schematic view of the different embodiment of diffraction optical element of the present utility model.Please refer to Fig. 3,4,5, diffraction optical element 34,44,54 of the present utility model with suitable light transmissive material for transparent substrates 28, can make at least arbitrary surface of transparent substrates 28 or form the microstructure of diffraction lines or pattern.With Fig. 3, the first surface 341 of transparent substrates 28 is towards LASER Light Source module, light with optical information is then penetrated by the second face 343 of transparent substrates 28, the microstructure 36 then with the diffraction lines or pattern receiving non-aligned point light beam is made on the first surface 341 of transparent substrates 28, second 343, face can be without microstructure, and wherein microstructure 36 can be that the making of UV solidification glue-line is exposed on first surface 341 or etching makes lines outside first surface 341.Fig. 4 is then contrary with Fig. 3, and the first surface 441 towards LASER Light Source module does not have a diffraction function, and the second 443, face comprises and can receive the diffraction lines of non-aligned point light beam or the microstructure 46 of pattern and produce diffraction image.First surface 541 in Fig. 5 and 543, the second face all comprise the diffraction lines of reception non-aligned point light beam or the microstructure 56 of pattern.In addition, be noted that first surface or second face of diffraction optical element 34,44,54 all can be respectively plane or have the face of radian or curvature.In addition, the diffraction lines of non-aligned point light beam or the microstructure of pattern can distribute or be formed at part or all surface of transparent substrates.
Except making the microstructure of diffraction lines or pattern, diffraction optical element of the present utility model still can comprise the functional surfaces of other function.Fig. 6 is the amplification side schematic view of another embodiment of diffraction optical element of the present utility model.Please refer to Fig. 6, diffraction optical element 64 is also transparent substrates 28 with light transmissive material, its first surface 641 towards LASER Light Source module has or comprises a structure that can expand or shape 642, such as with a concavees lens structure in the geometrical optics face that manufacture of semiconductor DOE makes or Precision Machining makes, light with optical information is then penetrated by the second face 643 of the microstructure 66 comprising diffraction lines or pattern, its role is to expand incident non-aligned point beam size, make the light beam through microstructure 66 can have larger light area, more wavefront modification information could be accepted, and then project finer and smoother pattern.Understandable, the structure that so can expand or shape can also be distributed in a part for transparent substrates or whole surface.
According to above-mentioned, for whole semiconductor laser-diffraction optical element module, omit the collimation optics needing between existing diffraction optical element and LASER Light Source module to place, even diffraction optical element is attached on LASER Light Source module, semiconductor laser of the present utility model-diffraction optical element module can shorten the length of whole module on parallel optical axis direction, reduce material and the assembly cost of whole module, on the movement being applicable to being applied to slimming or object wearing device simultaneously.
The foregoing is only preferred embodiment of the present utility model, and be not used to limit right of the present utility model, therefore under all other does not depart from the spirit that the utility model discloses, the equivalence that completes changes or modifies, and all should be contained in scope of the present utility model.
Claims (9)
1. semiconductor laser-diffraction optical element module, is characterized in that, comprising:
LASER Light Source module, it exports a non-aligned point light beam;
Diffraction optical element, it receives this non-aligned point light beam from this LASER Light Source module, and this non-aligned point beam modulation is output into one with the light of optical information, wherein, this diffraction optical element comprises transparent substrates and is formed at the microstructure of a first surface of this transparent substrates; And
Housing, its this LASER Light Source module accommodating and this diffraction optical element, wherein, should penetrate outside this housing with the light of optical information.
2. semiconductor laser-diffraction optical element module as claimed in claim 1, is characterized in that, this non-aligned point light beam of this microstructure diffraction.
3. semiconductor laser-diffraction optical element module as claimed in claim 1 or 2, it is characterized in that, this first surface being formed with this microstructure is a plane or a curved surface.
4. semiconductor laser-diffraction optical element module as claimed in claim 1 or 2, is characterized in that, this cavity disperse characteristic in this first surface part or all on.
5. semiconductor laser-diffraction optical element module as claimed in claim 1 or 2, it is characterized in that, this microstructure is positioned at the outside of this first surface to be exposed to outside this first surface, or this microstructure is positioned at the inner side of this first surface.
6. semiconductor laser-diffraction optical element module as claimed in claim 1 or 2, it is characterized in that, this diffraction optical element also comprises the functional structure that can expand, the functional structure that this can expand is formed or is arranged at one second of this transparent substrates, and the functional structure that this non-aligned point light beam can be expanded by this, this functional structure that can expand comprises a concave mirror.
7. semiconductor laser-diffraction optical element module as claimed in claim 1 or 2, is characterized in that, this LASER Light Source module and this diffraction optical element keep a spacing, and this spacing is 0 or is not 0.
8. semiconductor laser-diffraction optical element module as claimed in claim 1 or 2, it is characterized in that, this housing is not more than 6 millimeters in a length of an optical axis direction of this non-aligned point light beam.
9. semiconductor laser-diffraction optical element module as claimed in claim 7, it is characterized in that, this housing is not more than 4 millimeters in a length of an optical axis direction of this non-aligned point light beam.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103220315 | 2014-11-14 | ||
| TW103220315U TWM503009U (en) | 2014-11-14 | 2014-11-14 | Laser diode-doe module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204269928U true CN204269928U (en) | 2015-04-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420731427.4U Active CN204269928U (en) | 2014-11-14 | 2014-11-27 | semiconductor laser-diffraction optical element module |
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| Country | Link |
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| CN (1) | CN204269928U (en) |
| TW (1) | TWM503009U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017088325A1 (en) * | 2015-11-24 | 2017-06-01 | 深圳奥比中光科技有限公司 | Laser module and image information capturing device |
| CN108507761A (en) * | 2018-03-12 | 2018-09-07 | 广东欧珀移动通信有限公司 | Laser projection module and its detection method and device, depth camera and electronic device |
| CN110192312A (en) * | 2017-01-19 | 2019-08-30 | 欧司朗光电半导体有限公司 | Semiconductor laser and method for manufacturing this semiconductor laser |
| WO2019192238A1 (en) * | 2018-04-04 | 2019-10-10 | Oppo广东移动通信有限公司 | Diffractive optical component, laser projection module, depth camera, and electronic device |
| US11563930B2 (en) | 2018-03-12 | 2023-01-24 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection component, detection method thereof, and electronic device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI585467B (en) * | 2015-08-28 | 2017-06-01 | 高準精密工業股份有限公司 | Lighting apparatus with the corresponding diffractive optical elements |
-
2014
- 2014-11-14 TW TW103220315U patent/TWM503009U/en not_active IP Right Cessation
- 2014-11-27 CN CN201420731427.4U patent/CN204269928U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017088325A1 (en) * | 2015-11-24 | 2017-06-01 | 深圳奥比中光科技有限公司 | Laser module and image information capturing device |
| CN110192312A (en) * | 2017-01-19 | 2019-08-30 | 欧司朗光电半导体有限公司 | Semiconductor laser and method for manufacturing this semiconductor laser |
| US10797469B2 (en) | 2017-01-19 | 2020-10-06 | Osram Oled Gmbh | Semiconductor laser and method for producing such a semiconductor laser |
| CN110192312B (en) * | 2017-01-19 | 2021-09-24 | 欧司朗光电半导体有限公司 | Semiconductor laser and method for producing such a semiconductor laser |
| CN108507761A (en) * | 2018-03-12 | 2018-09-07 | 广东欧珀移动通信有限公司 | Laser projection module and its detection method and device, depth camera and electronic device |
| US11563930B2 (en) | 2018-03-12 | 2023-01-24 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection component, detection method thereof, and electronic device |
| WO2019192238A1 (en) * | 2018-04-04 | 2019-10-10 | Oppo广东移动通信有限公司 | Diffractive optical component, laser projection module, depth camera, and electronic device |
| US11048155B2 (en) | 2018-04-04 | 2021-06-29 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Diffractive optical assembly, laser projection unit, and depth camera |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM503009U (en) | 2015-06-11 |
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Effective date of registration: 20200110 Address after: PO box 31119 Furong Bay, 802 West Bay Road, ky1-1205 Grand Cayman, Cayman Islands Patentee after: Gaozhun International Technology Co., Ltd Address before: 5th floor, No.66, Jiansan Road, Zhonghe District, Xinbei, Taiwan, China Patentee before: Huajin Photoelectric Science and Technology Co., Ltd. |
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