TWM501425U - Carrying tray for semiconductor device - Google Patents
Carrying tray for semiconductor device Download PDFInfo
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- TWM501425U TWM501425U TW103216517U TW103216517U TWM501425U TW M501425 U TWM501425 U TW M501425U TW 103216517 U TW103216517 U TW 103216517U TW 103216517 U TW103216517 U TW 103216517U TW M501425 U TWM501425 U TW M501425U
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Description
本新型是有關於一種裝設於基板等之前之半導體裝置(IC)的搬送用托盤。The present invention relates to a transfer tray for a semiconductor device (IC) mounted on a substrate or the like.
同時裝載複數個經樹脂密封元件且於外側露出端子之半導體裝置之搬送用托盤揭示於例如專利文獻1、2等。特別是，專利文獻2中揭示了，在比收納半導體裝置之製品收納部更外側之周邊部分設置至少一組之可嵌合之凹部凸部、或重疊配置搬送用托盤，上模之搬送用托盤可發揮下側之搬送用托盤之蓋的作用等。A transfer tray of a semiconductor device in which a plurality of resin sealing members are simultaneously exposed and exposed to the outside is disclosed, for example, in Patent Documents 1, 2 and the like. In particular, Patent Document 2 discloses that at least one set of engageable recesses is provided in a peripheral portion of the outer side of the product storage portion that houses the semiconductor device. The conveyance tray is placed in a convex portion or in a superposed manner, and the transfer tray of the upper mold can function as a lid of the lower transfer tray.
另一方面，半導體裝置之搬送用托盤以JEDEC(Joint Electron Device Engineering Council)的規格決定主要的外形、高度等尺寸，並且複數企業共通使用該搬送用托盤。On the other hand, the transfer tray of the semiconductor device determines the size such as the main shape and height of the JEDEC (Joint Electron Device Engineering Council), and the transfer tray is used in common by a plurality of companies.
【專利文獻1】日本專利特開平6-40482號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 6-40482
【專利文獻2】日本專利特開2005-162307號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2005-162307
然而，近年來半導體裝置持續小型化、薄型化，連接端子的形狀也不同。特別是，JEDEC之規格中，搬送用托盤之全高度是定為12.19mm或7.62mm，因此以往的半導體裝置之搬送用托盤之製品收納部要不晃動地堆積載置薄型之半導體裝置是困難的。However, in recent years, semiconductor devices have been continuously miniaturized and thinned, and the shapes of connection terminals have also been different. In particular, in the JEDEC standard, the total height of the transport tray is set to be 12.19 mm or 7.62 mm. Therefore, it is difficult to deposit a thin semiconductor device without sloshing in the product storage portion of the conventional semiconductor device transport tray. .
因此，習知之半導體裝置之搬送用托盤在半導體裝置之載置部分也有具有必要以上的高度、體積大、重量變重，半導體裝置之收納效率差的問題。Therefore, the transfer tray of the conventional semiconductor device has a problem that the height of the mounting portion of the semiconductor device is large, the volume is large, the weight is increased, and the storage efficiency of the semiconductor device is poor.
本新型是有鑑於上述情況而作成者，其目的在於提供一種縱横尺寸可使用習知之規格，且更輕量、半導體裝置之收納效率也高，減少使用材料之半導體裝置之搬送用托盤。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a transfer tray for a semiconductor device in which a semiconductor device of a material used can be used in a lighter weight and a higher storage efficiency of a semiconductor device.
依據前述目的之本新型的半導體裝置之搬送用托盤，由導電性樹脂所構成，包含有：框體，以平面來看為矩形，且具有橫框構件及縱框構件，前述橫框構件是長尺狀且成對，並且分別具有朝下方開放之固定爪裝設用之2個缺口，前述縱框構件是成對且用以連結前述成對之橫框構件之兩端部，且分別具有朝外方突出之固定部；及複數個製品收納部，是在連接狀態下成縱橫地設置於該框體之內側，前述框體於上部內側具有突出部，且於前述框體之下部內側形成前述突出部可嵌入之寬度的空間部，進而在相鄰之前述製品收納部之間設有與前述突出部相同高度之 分隔部，前述固定部除外之前述框體之外側的横尺寸為315mm±0.25mm之範圍，前述框體之外側之縱尺寸為135.9mm±0.25mm之範圍，其中，包含前述突出部之該搬送用托盤的總高度為3~7.4mm之範圍。The transfer tray for a semiconductor device according to the above-described object is composed of a conductive resin, and includes a frame which is rectangular in plan view and has a horizontal frame member and a vertical frame member, and the horizontal frame member is long. Dimensional and paired, and each having two notches for fixing claws that are opened downward, the vertical frame members are paired and connected to both end portions of the pair of lateral frame members, respectively a fixing portion that protrudes outward; and a plurality of product accommodating portions that are vertically and horizontally disposed inside the frame in a connected state, wherein the frame body has a protruding portion on an inner side of the upper portion, and the inner side of the lower portion of the frame body is formed inside a protruding portion can be embedded in the space portion of the width, and further provided with the same height as the protruding portion between the adjacent product receiving portions a partitioning portion, wherein a lateral dimension of the outer side of the frame except the fixing portion is 315 mm ± 0.25 mm, and a longitudinal dimension of the outer side of the frame is 135.9 mm ± 0.25 mm, wherein the conveying of the protruding portion is included The total height of the tray is in the range of 3 to 7.4 mm.
其中，包含前述突出部之該搬送用托盤之總高度更宜為3~5mm(最佳為3.8~4.2mm)之範圍。再者，搬送用托盤之總高度小於3mm時，半導體裝置之收納會變困難，若使總高度比該範圍厚，則無省空間化及材料削減之效果。The total height of the transfer tray including the protruding portion is preferably in the range of 3 to 5 mm (optimally 3.8 to 4.2 mm). Further, when the total height of the transfer tray is less than 3 mm, the storage of the semiconductor device becomes difficult, and if the total height is made thicker than the range, there is no space saving and The effect of material reduction.
又，導電性樹脂可使用碳黑、碳纖、奈米碳管、其他之導體之微小粉末混入PS、PP、ABS、PPE、PES、PEEK等之熱可塑性塑膠者。Further, the conductive resin may be a thermoplastic powder such as carbon black, carbon fiber, carbon nanotube or other conductor mixed with PS, PP, ABS, PPE, PES, PEEK or the like.
本新型之半導體裝置之搬送用托盤(以下，也稱為「搬送用托盤」)可將搬送用托盤之高度作成比習知小，因此達到以下效果。In the transfer tray for a semiconductor device of the present invention (hereinafter also referred to as "transfer tray"), the height of the transfer tray can be made smaller than conventionally, and the following effects are achieved.
(1)縮小製品收納部之高度，可有效率地收納近年來之小型且薄的半導體裝置。(1) By reducing the height of the product storage unit, it is possible to efficiently store a small and thin semiconductor device in recent years.
(2)即使將更多的搬送用托盤重疊也比習知之搬送用托盤的高度還低，且相同高度、相同重量的話可重疊更多的搬送用托盤，提供空間之利用度。(2) Even if a plurality of transfer trays are stacked, the height of the conventional transfer tray is lower than that of the conventional transfer tray, and the same transfer weight can be used to overlap the transfer tray, thereby providing space availability.
(3)由於使用的材料較少即可完成，因此可達成搬送用托盤之輕量化，並且可便宜地製造搬送用托盤。(3) Since the material to be used can be completed, the weight of the transfer tray can be reduced, and the transfer tray can be manufactured inexpensively.
(4)特別是，令包含突出部之框體的總高度為3~5mm時，相較於習知之搬送用托盤，可以相同高度堆疊約2倍之 搬送用托盤。(4) In particular, when the total height of the frame including the protruding portion is 3 to 5 mm, it can be stacked at the same height by about 2 times as compared with the conventional transfer tray. Transfer tray.
(5)再者，搬送用托盤之縱横尺寸、厚度(高度)是根據JEDEC之規格而定。其中，變更縱横之尺寸時，由於習知之搬送機器等多半無法使用，因此關於縱横之尺寸則照舊，但發現厚度亦可使用習知之搬送機器，並且配合半導體裝置之小型化而薄化，確認了以上所記載之優點而完成本新型。(5) Furthermore, the aspect ratio and thickness (height) of the transfer tray are determined according to the specifications of JEDEC. In addition, when the size of the vertical and horizontal is changed, the conventional transfer machine and the like are not used, and the size of the vertical and horizontal is still the same, but it is found that the thickness can be reduced by using a conventional transfer device, and the thickness of the semiconductor device is reduced. The present invention has been completed with the advantages described above.
10‧‧‧半導體裝置之搬送用托盤10‧‧‧Transfer tray for semiconductor devices
11‧‧‧框體11‧‧‧ frame
11a‧‧‧周緣部11a‧‧‧The Peripheral Department
12~14‧‧‧製品收納部12~14‧‧‧Product Storage Department
15‧‧‧開口15‧‧‧ openings
16、17‧‧‧缺口16, 17‧‧ ‧ gap
18、19‧‧‧橫框構件18, 19‧‧‧ transverse frame members
20、21‧‧‧固定部20, 21‧‧‧ fixed department
22、23‧‧‧縱框構件22, 23‧‧‧ stile components
24‧‧‧突出部24‧‧‧Protruding
25‧‧‧空間部25‧‧‧ Space Department
26、27‧‧‧分隔部26, 27‧‧‧Departure
28‧‧‧底部28‧‧‧ bottom
29‧‧‧無壁部29‧‧‧No wall
30‧‧‧平面部30‧‧‧Flat Department
32~35‧‧‧半導體裝置之搬送用托盤32~35‧‧‧Transfer tray for semiconductor devices
36‧‧‧缺口36‧‧‧ gap
37‧‧‧載置台37‧‧‧ mounting table
38‧‧‧半導體裝置38‧‧‧ semiconductor devices
39‧‧‧製品收納部39‧‧‧Product Storage Department
40‧‧‧緣40‧‧‧ Margin
41‧‧‧製品收納部41‧‧‧Product Storage Department
42‧‧‧半導體裝置42‧‧‧Semiconductor device
43‧‧‧空間部43‧‧‧ Space Department
44‧‧‧製品收納部44‧‧‧Product Storage Department
46‧‧‧傾斜面46‧‧‧Sloping surface
47‧‧‧半導體裝置47‧‧‧Semiconductor device
圖1是顯示本新型之一實施形態之半導體裝置之搬送用托盤，且(A)為正面圖，(B)為底面圖，(C)為側面圖。1 is a transfer tray of a semiconductor device according to an embodiment of the present invention, wherein (A) is a front view, (B) is a bottom view, and (C) is a side view.
圖2是同搬送用托盤之部分放大圖。Fig. 2 is a partial enlarged view of the same transfer tray.
圖3是(A)為同搬送用托盤之部分截面圖，(B)為將同搬送用托盤重疊2片之狀態的部分截面圖。3(A) is a partial cross-sectional view showing the same tray for transfer, and (B) is a partial cross-sectional view showing a state in which two sheets are stacked in the same tray.
圖4是(A)~(D)為本新型之其他實施形態之搬送用托盤的部分截面圖。Fig. 4 is a partial cross-sectional view showing a transfer tray according to another embodiment of the present invention (A) to (D).
接著，參考附圖，就本新型已具體化之實施形態加以說明。Next, an embodiment of the present invention will be described with reference to the accompanying drawings.
如圖1(A)~(C)、圖2所示，本新型之一實施形態之半導體裝置之搬送用托盤10是由具有導電性之樹脂構成，以平面視圖而言(圖1(A)中為正面視圖)，具有：矩形之框體11、及在連接狀態下縱横地排列配置於框體11之內側 之複數製品收納部12~14。再者，該實施形態所示之製品收納部12~14是如圖2所示，構成中央具有開口15之直接支撐型之製品搭載部。其中，從開口15露出搭載之半導體裝置之下側端子。As shown in Fig. 1 (A) to (C) and Fig. 2, the transport tray 10 of the semiconductor device according to the embodiment of the present invention is made of a conductive resin, in plan view (Fig. 1(A) The front view is a rectangular frame 11 and is arranged side by side in the connected state on the inner side of the frame 11 The plurality of product storage units 12 to 14. Further, as shown in FIG. 2, the product storage portions 12 to 14 shown in this embodiment constitute a direct-support type product mounting portion having an opening 15 at the center. Among them, the lower side terminal of the mounted semiconductor device is exposed from the opening 15.
框體11如圖1(A)~(C)所示，包含有：成對之橫框構件18、19，成長尺狀，分別具有朝下方開放之固定爪裝設用之2個缺口16、17；及成對之縱框構件22、23，用以連結成對之橫框構件18、19的兩端，且分別具有朝外方突出之固定部20、21。As shown in FIGS. 1(A) to 1(C), the housing 11 includes a pair of lateral frame members 18 and 19 which are in the shape of a long sleeve, and each of which has two notches 16 for fixing claws which are opened downward, 17; and the pair of vertical frame members 22, 23 for connecting the two ends of the pair of horizontal frame members 18, 19, respectively, and having fixing portions 20, 21 protruding outward.
該框體11除去固定部21、22之横尺寸a，根據JEDEC之規格，是在315mm±0.25mm之範圍內，框體11之縱尺寸b在135.9mm±0.25mm之範圍內(任一者皆為外側尺寸)。又，框體11之高度(即，搬送用托盤10之總高度)c在4mm±0.25mm之範圍內。再者，以上之尺寸中，±0.25mm為公差，表示容許該範圍之尺寸誤差。The frame 11 is separated from the lateral dimension a of the fixing portions 21 and 22, and is within a range of 315 mm ± 0.25 mm according to the specification of JEDEC, and the longitudinal dimension b of the frame 11 is in the range of 135.9 mm ± 0.25 mm (either All are outside dimensions). Further, the height of the casing 11 (that is, the total height of the transport tray 10) c is in the range of 4 mm ± 0.25 mm. Further, among the above dimensions, ±0.25 mm is a tolerance, indicating that the dimensional error of the range is allowed.
如圖1~圖3(A)、(B)所示，框體11在上部內側具有高度比框體11之周緣部11a高1mm(再者，亦可為0.8~1.2mm)之突出部24。該突出部24在該實施形態中為連續之壁狀，且於突出部24之內側設有製品收納部12~14。其中，製品收納部14位於與突出部24之角部相接之部位，製品收納部13位於與直線狀之突出部24相接之部位，製品收納部12位於遠離突出部24之部位。As shown in FIGS. 1 to 3 (A) and (B), the casing 11 has a projection 24 having a height higher than the peripheral edge portion 11a of the casing 11 by 1 mm (again, 0.8 to 1.2 mm). . In the embodiment, the protruding portion 24 has a continuous wall shape, and the product housing portions 12 to 14 are provided inside the protruding portion 24. The product storage portion 14 is located at a portion that is in contact with the corner portion of the protruding portion 24, the product storage portion 13 is located at a portion that is in contact with the linear protruding portion 24, and the product storage portion 12 is located away from the protruding portion 24.
又，在框體11之下部內側形成空間部25，並且可嵌入位於下層之搬送用托盤10之突出部24。突出部24嵌入空間 部25時，會抵接上下之搬送用托盤10之框體11。藉此，可使上下相鄰之搬送用托盤10之積層間距為約3mm。Moreover, the space portion 25 is formed inside the lower portion of the casing 11, and the projecting portion 24 of the transport tray 10 located in the lower layer can be fitted. The protrusion 24 is embedded in the space At the time of the portion 25, the frame 11 of the upper and lower transfer trays 10 is abutted. Thereby, the laminated pitch of the conveyance trays 10 adjacent to each other can be made about 3 mm.
在相鄰之製品收納部12~14之間，具有與突出部24相同高度之分隔部26、27。該面積不同的分隔部26、27是用以防止為搭載於製品收納部12~14之製品的半導體裝置的横向移動，且上端可抵接於配置在上層之搬送用托盤10之底部28(參照圖3(B))。相鄰之製品收納部12~14之分隔部26、27成不連續，且於各製品收納部12~14之角部形成有無壁部29。再者，亦可在各搬送用托盤10之底部設置分隔部26、27之上端部嵌入之溝，藉此，可更為提高搬送用托盤10之強度，並且減少樹脂使用量。Between the adjacent product storage portions 12 to 14, the partition portions 26 and 27 having the same height as the protruding portion 24 are provided. The partition portions 26 and 27 having different areas are for preventing lateral movement of the semiconductor device mounted on the product storage portions 12 to 14 and the upper end can abut against the bottom portion 28 of the transport tray 10 disposed on the upper layer (refer to Figure 3 (B)). The partition portions 26 and 27 of the adjacent product storage portions 12 to 14 are discontinuous, and the wall portion 29 is formed at a corner portion of each of the product storage portions 12 to 14. Further, a groove in which the end portions of the partition portions 26 and 27 are fitted to the bottom of each of the transport trays 10 can be provided, whereby the strength of the transport tray 10 can be further increased, and the amount of resin used can be reduced.
在搬送用托盤10之中央設有複數個平面部30(本實施形態中為6個)，該平面部30是載置一個一個吸附搬送該搬送用托盤10之吸附用墊。In the center of the transport tray 10, a plurality of flat portions 30 (six in the present embodiment) are provided, and the flat portion 30 is placed on one of the adsorption pads for adsorbing and transporting the transport tray 10.
使用該搬送用托盤10時，在各搬送用托盤10之製品收納部12~14放入預定之半導體裝置，在該狀態下重疊搬送用托盤10。此種情況下，將各搬送用托盤10之突出部24放入位於上層之搬送用托盤10之空間部25。藉此，上下之搬送用托盤10之框體11(正確來說是外側)之間會抵接，且分隔部26、27之頂部也抵接於設置在上方之搬送用托盤10之底部28。藉此，搬送用托盤10不僅是支持框體11，亦可支持位於中央之分隔部26、27的載重，故可增加重疊複數個搬送用托盤10之全體強度，不會撓曲。When the transport tray 10 is used, a predetermined semiconductor device is placed in the product storage units 12 to 14 of each transport tray 10, and the transport tray 10 is superimposed in this state. In this case, the protruding portion 24 of each of the transport trays 10 is placed in the space portion 25 of the transport tray 10 located above. Thereby, the frame 11 (correctly the outer side) of the upper and lower transfer trays 10 abuts, and the tops of the partitions 26 and 27 also abut against the bottom portion 28 of the transport tray 10 provided above. Thereby, the transport tray 10 can support not only the support frame 11, but also the load of the partition portions 26 and 27 located at the center, so that the total strength of the plurality of transport trays 10 can be increased without being bent.
再者，搬送複數之搬送用托盤10時，可藉由在設置於 框體11之縱框構件22、23之固定部20、21裝設搬送手段之鉤扣，或者在形成於框體11之橫框構件18、19之缺口16、17固定搬送手段之鉤扣(固定爪)而進行之。Furthermore, when transporting a plurality of transport trays 10, it is possible to The fixing portions 20 and 21 of the vertical frame members 22 and 23 of the casing 11 are provided with hooks of the conveying means, or the hooks of the conveying means formed by the notches 16 and 17 formed in the horizontal frame members 18 and 19 of the casing 11 ( Carry out the claws).
接著，參照圖4(A)~(D)說明本新型之其他實施形態之搬送用托盤32~35。再者，與搬送用托盤10相同的構成要件則賦予相同編號並省略說明。Next, the transport trays 32 to 35 according to other embodiments of the present invention will be described with reference to Figs. 4(A) to 4(D). The same components as those of the transfer tray 10 are denoted by the same reference numerals and will not be described.
如圖4(A)所示之搬送用托盤32中，在框體11之內側具有在中央形成有矩形缺口36之載置台37。藉由缺口36，搭載於載置台37之半導體裝置38之端子可露出於下方。As shown in FIG. 4(A), the transport tray 32 has a mounting table 37 having a rectangular cutout 36 formed in the center inside the housing 11. The terminal of the semiconductor device 38 mounted on the mounting table 37 can be exposed below by the notch 36.
如圖4(B)所示之搬送用托盤33具有承架支撐型之製品收納部39，並且於周圍具有緣40。The transport tray 33 shown in FIG. 4(B) has a rack-supporting product storage portion 39 and has a rim 40 around.
圖4(C)具有中央支撐型之製品收納部41，並且於半導體裝置42之底部具有空間部43。4(C) has a product support portion 41 of a central support type, and has a space portion 43 at the bottom of the semiconductor device 42.
圖4(D)具有斜面支撐型之製品收納部44，沿著傾斜面46載置有半導體裝置47(參照特許第3764173號)。4(D) has a product support portion 44 of a slope support type, and a semiconductor device 47 is placed along the inclined surface 46 (refer to No. 3764173).
本新型並不限定於前述之實施形態，可在不變更本新型之要旨之範圍內變更其構成。 例如，該實施形態中，將包含突出部之搬送用托盤之總高度作成4mm，但在3~7.4mm(更宜為3~5mm)之範圍，習知之搬送用托盤之厚度會更薄，因此全體之體積會變小，有助於減少使用材料。The present invention is not limited to the above-described embodiments, and the configuration can be changed without departing from the spirit and scope of the invention. For example, in this embodiment, the total height of the transfer tray including the protruding portion is set to 4 mm, but in the range of 3 to 7.4 mm (more preferably 3 to 5 mm), the thickness of the conventional transfer tray is thinner. The overall volume will be smaller, helping to reduce the use of materials.
又，製品收納部之形狀即使是圖2、圖4(A)~(D)所示者以外者，只要是可載置半導體裝置者皆可適用本新型。Further, even if the shape of the product storage portion is other than those shown in FIGS. 2 and 4 (A) to (D), the present invention can be applied to any semiconductor device.
10‧‧‧半導體裝置之搬送用托盤10‧‧‧Transfer tray for semiconductor devices
11‧‧‧框體11‧‧‧ frame
11a‧‧‧周緣部11a‧‧‧The Peripheral Department
12~14‧‧‧製品收納部12~14‧‧‧Product Storage Department
15‧‧‧開口15‧‧‧ openings
16、17‧‧‧缺口16, 17‧‧ ‧ gap
18、19‧‧‧橫框構件18, 19‧‧‧ transverse frame members
20、21‧‧‧固定部20, 21‧‧‧ fixed department
22、23‧‧‧縱框構件22, 23‧‧‧ stile components
24‧‧‧突出部24‧‧‧Protruding
26、27‧‧‧分隔部26, 27‧‧‧Departure
29‧‧‧無壁部29‧‧‧No wall
30‧‧‧平面部30‧‧‧Flat Department
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014150890A JP6182513B2 (en) | 2014-07-24 | 2014-07-24 | Transport tray for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM501425U true TWM501425U (en) | 2015-05-21 |
Family
ID=52954884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103216517U TWM501425U (en) | 2014-07-24 | 2014-09-17 | Carrying tray for semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6182513B2 (en) |
| CN (1) | CN204250552U (en) |
| TW (1) | TWM501425U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD213093S (en) | 2020-06-22 | 2021-08-01 | 日商大福股份有限公司 | Conveyance tray |
| TWD213094S (en) | 2020-06-22 | 2021-08-01 | 日商大福股份有限公司 | Conveyance tray |
| TWD213092S (en) | 2020-06-22 | 2021-08-01 | 日商大福股份有限公司 | Conveyance tray |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6500068B1 (en) * | 2017-10-03 | 2019-04-10 | シノン電気産業株式会社 | Tray for semiconductor integrated circuit having notch for binding band |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG147355A1 (en) * | 2007-04-24 | 2008-11-28 | Peak Plastic & Metal Prod | Reinforced tray for delicate devices |
-
2014
- 2014-07-24 JP JP2014150890A patent/JP6182513B2/en active Active
- 2014-09-17 TW TW103216517U patent/TWM501425U/en unknown
- 2014-09-30 CN CN201420570287.7U patent/CN204250552U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD213093S (en) | 2020-06-22 | 2021-08-01 | 日商大福股份有限公司 | Conveyance tray |
| TWD213094S (en) | 2020-06-22 | 2021-08-01 | 日商大福股份有限公司 | Conveyance tray |
| TWD213092S (en) | 2020-06-22 | 2021-08-01 | 日商大福股份有限公司 | Conveyance tray |
Also Published As
| Publication number | Publication date |
|---|---|
| CN204250552U (en) | 2015-04-08 |
| JP6182513B2 (en) | 2017-08-16 |
| JP2016022991A (en) | 2016-02-08 |
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