TWM490962U - Disintegration component applied in wafer packaging - Google Patents

Description

應用於晶圓封裝之離形元件Detached component for wafer packaging

本創作係關於轉移成型晶圓封裝之技術，尤指一種應用於轉移成型晶圓封裝之離形元件。This creation is about transfer molding of wafer packages, especially one that is used in transfer molded wafer packages.

目前壓縮成型為熱固性塑膠最主要的加工方式，但因熱固性塑膠必須冷卻才能硬化，故壓縮成型時需等待模具冷卻後才能退件，大大的減緩了生產效率。有鑑於此，轉移成型技術遂被提出，其中，轉移成型所需之設備主要包括模具、加熱的轉移室、動力源。請參閱第一圖，係習用的轉移成型之製程示意圖，如第一圖所示，轉移成型係包括以下製程步驟：(1)將一成型塑料11’放置於一轉移室15’內；(2)將一欲成型之元件60’放置於一閉合模具14’內，且該閉合模具14’以一澆口16’與該轉移室15’相連；(3)加熱使該成型塑料11’在該轉移室15’內液化；(4)將液化塑料13’由該澆口16’灌入加熱的閉合模具14’中； (5)冷卻該閉合模具14’，使閉合模型14’中的塑料硬化；(6)開啟該閉合模具14’，並將欲成型之元件60’與模具分離；(7)取出該欲成型之元件60’；(8)有少量硬化的塑膠留存於轉移室15’和澆口16’內，於第二次成型開始前須予以除去。At present, compression molding is the most important processing method for thermosetting plastics. However, since thermosetting plastics must be cooled to be hardened, it is necessary to wait for the mold to cool before compression molding, which greatly reduces the production efficiency. In view of this, a transfer molding technique has been proposed, in which the equipment required for transfer molding mainly includes a mold, a heated transfer chamber, and a power source. Please refer to the first figure, which is a schematic diagram of a conventional transfer molding process. As shown in the first figure, the transfer molding system includes the following process steps: (1) placing a molding plastic 11' in a transfer chamber 15'; Place a component 60' to be formed in a closed mold 14', and the closed mold 14' is connected to the transfer chamber 15' by a gate 16'; (3) heating to make the molded plastic 11' Liquefaction in the transfer chamber 15'; (4) pouring the liquefied plastic 13' from the gate 16' into the heated closed mold 14'; (5) cooling the closed mold 14' to harden the plastic in the closed mold 14'; (6) opening the closed mold 14' and separating the element 60' to be formed from the mold; (7) taking out the shape to be formed Element 60'; (8) a small amount of hardened plastic remains in transfer chamber 15' and gate 16' and must be removed prior to the second molding.

通常，上述之轉移成型技術係必須於該閉合模具之內表面設置一離型元件，如此，當執行上述之步驟(7)時才能夠使成型之元件與模具易於分離。有鑑於此，本案之創作人係極力加以研究創作，終於研發完成本創作之一種應用於晶圓封裝之離形元件。In general, the above-described transfer molding technique requires a release member to be disposed on the inner surface of the closed mold, so that the formed member can be easily separated from the mold when the above step (7) is performed. In view of this, the creators of this case tried their best to research and create a distracting component for wafer packaging.

本創作之主要目的，在於提供一種應用於晶圓封裝之離形元件，一種應用於晶圓封裝之離形元件，係應用於積體電路之轉移成型封裝製程之中，並貼附於一成型模具之一上模具與一下模具的內表面，亦即是應用於IC之晶圓(Wafer)封裝(IC Package)用晶圓封裝之離形元件。其中，本創作之應用於晶圓封裝之離形元件為一離型膜，其優點在於可於分離轉移成型製程之成型元件與模具之時提供穩定的離型力，使得該成型元件易於自模具之中被分離出來，並避免塑料殘留於該模具上。The main purpose of this creation is to provide a release component for wafer packaging, a release component for wafer packaging, which is applied to a transfer molding process of an integrated circuit and attached to a molding process. One of the molds is the inner surface of the mold and the lower mold, that is, the release member for the wafer package of the IC wafer package (IC package). Among them, the present invention is a release film for a wafer package, which has the advantage of providing a stable release force when separating the molded component and the mold of the transfer molding process, so that the molded component is easy to be self-molded. It is separated and plastic is left on the mold.

因此，為了達成本創作上述之目的，本案之創作人提出一種應用於晶圓封裝之離形元件，係應用於積體電路之轉移成型封裝製程之中，並貼附於一成型模具之一上模具與一下模具的內表面，其係包括：一離型膜，且該離型膜之厚度係介於0.01mm~2mm之間；並且，該離型膜之硬度係為1邵氏硬度(SHORE Type A)~90邵氏硬度(SHORE Type D)。Therefore, in order to achieve the above-mentioned purpose of the present creation, the creator of the present invention proposes a release component applied to a wafer package, which is applied to a transfer molding process of an integrated circuit and attached to one of the molding dies. The inner surface of the mold and the lower mold comprises: a release film, and the thickness of the release film is between 0.01 mm and 2 mm; and the hardness of the release film is 1 Shore hardness (SHORE) Type A) ~90 Shore hardness (SHORE Type D).

<本創作><this creation>

10‧‧‧模具10‧‧‧Mold

101‧‧‧上模具101‧‧‧Upper mold

102‧‧‧下模具102‧‧‧Next mold

11‧‧‧離型膜11‧‧‧ release film

12‧‧‧矽油/氟化合膜12‧‧‧矽Oil/fluorinated film

<習知><知知>

11’‧‧‧成型塑料11'‧‧‧ molding plastic

15’‧‧‧轉移室15’‧‧‧Transfer room

60’‧‧‧欲成型之元件60'‧‧‧ Components to be molded

13’‧‧‧液化塑料13’‧‧‧Liquid plastic

14’‧‧‧閉合模具14’‧‧‧Closed mold

16’‧‧‧澆口16’‧‧‧Gate

第一圖係習用的轉移成型之製程示意圖；第二圖係一種轉移成型之製程示意圖；第三圖係離型膜的側面剖視圖；以及第四圖係離型膜的側面剖視圖。The first drawing is a schematic diagram of a conventional transfer molding process; the second drawing is a schematic view of a transfer molding process; the third drawing is a side sectional view of the release film; and the fourth drawing is a side sectional view of the release film.

為了能夠更清楚地描述本創作所提出之一種應用於晶圓封裝之離形元件，以下將配合圖式，詳盡說明本創作之較佳實施例。In order to more clearly describe a release component of the present invention which is applied to a wafer package, a preferred embodiment of the present invention will be described in detail below with reference to the drawings.

請參閱第二圖，係一種轉移成型之製程示意圖。如第二圖所示，本創作之應用於晶圓封裝之離形元件係用於貼附在一轉移成型製程之模具10的上模具101與下模具102的內表面。該離形元件主要包括：一離型膜11。Please refer to the second figure, which is a schematic diagram of a transfer molding process. As shown in the second figure, the present invention is applied to a wafer packaged release member for attaching to the inner surfaces of the upper mold 101 and the lower mold 102 of a mold 10 of a transfer molding process. The release member mainly comprises: a release film 11.

繼續地參閱第二圖，並請同時參閱第三圖，係該離 型膜的側面剖視圖。如圖所示，離型膜11為一塑膠材料，且該塑膠材料係選自於下列群組之中的任一者：聚對苯二甲酸乙二酯(PET)、聚丙烯(PP)、聚碳酸酯(PC)、聚乙烯(PE)、聚醯亞胺(PI)、與氯綸(PVC)。並且，離型膜11之厚度係介於0.01mm~2mm之間，且該離型膜11之硬度係為邵氏硬度(SHORE Type A)~90邵氏硬度(SHORE Type D)。Continue to refer to the second picture, and please refer to the third picture at the same time. A side cross-sectional view of the film. As shown, the release film 11 is a plastic material, and the plastic material is selected from any of the following groups: polyethylene terephthalate (PET), polypropylene (PP), Polycarbonate (PC), polyethylene (PE), polyimine (PI), and polyvinyl chloride (PVC). Further, the thickness of the release film 11 is between 0.01 mm and 2 mm, and the hardness of the release film 11 is from SHORE Type A to 90 Shore Type D.

在其它可能的應用中，離型膜11之製造材料也可以是純矽膠或矽膠/橡膠化合物。其中，所述的矽膠/橡膠化合物係由一矽膠、一橡膠與一塑膠材料所組成，其中該矽膠與該橡膠的組成比例為100%：0%~5%：90%，且剩餘比例則添加該塑膠材料予以補足。In other possible applications, the material of the release film 11 may also be a pure silicone or silicone/rubber compound. Wherein, the silicone/rubber compound is composed of a silicone rubber, a rubber and a plastic material, wherein the composition ratio of the silicone rubber to the rubber is 100%: 0% to 5%: 90%, and the remaining ratio is added. The plastic material is complemented.

進一步地參閱第四圖，係離型膜之側面剖視圖。如第四圖所示，為了增進該離型膜11之離型功效，可藉由塗佈的方式於離型膜11之上進一步地形成一矽油/氟化合膜12。其中，含有氟或矽之化合物含量可從0.1~100%。Referring further to the fourth drawing, a side cross-sectional view of the release film is shown. As shown in the fourth figure, in order to enhance the release effect of the release film 11, an eucalyptus/fluorinated film 12 can be further formed on the release film 11 by coating. Among them, the content of the compound containing fluorine or hydrazine may be from 0.1 to 100%.

如此，上述係已完整且清楚地說明本創作之應用於晶圓封裝之離形元件的所有實施例，並且，經由上述可以得知本創作之應用於晶圓封裝之離形元件係應用於積體電路之轉移成型封裝製程之中，並貼附於一成型模具之一上模具與一下模具的內表面，亦即是應用於IC之晶圓(Wafer)封裝(IC Package)用晶圓封裝之離形元件。其中， 本創作之應用於晶圓封裝之離形元件為一離型膜，其優點在於可於分離轉移成型製程之成型元件與模具之時提供穩定的離型力，使得該成型元件易於自模具之中被分離出來，並避免塑料殘留於該模具上。Thus, the above embodiments have completely and clearly explained all the embodiments of the present invention for the off-chip component of the wafer package, and it can be seen from the above that the present invention is applied to the wafer package. The transfer process of the bulk circuit is attached to the inner surface of the mold and the lower mold of one of the molding molds, that is, the wafer package for the Wafer package (IC Package) of the IC. Detached component. among them, The release component of the present invention applied to the wafer package is a release film, which has the advantages of providing a stable release force when separating the molding component and the mold of the transfer molding process, so that the molding component is easy to be self-molded. It is separated and plastic is left on the mold.

必須加以強調的是，上述之詳細說明係針對本創作可行實施例之具體說明，惟該實施例並非用以限制本創作之專利範圍，凡未脫離本創作技藝精神所為之等效實施或變更，均應包含於本案之專利範圍中。It is to be understood that the foregoing detailed description of the embodiments of the present invention is not intended to limit the scope of the present invention. Both should be included in the scope of the patent in this case.

10‧‧‧模具10‧‧‧Mold

101‧‧‧上模具101‧‧‧Upper mold

102‧‧‧下模具102‧‧‧Next mold

11‧‧‧離型膜11‧‧‧ release film

Claims (6)

一種應用於晶圓封裝之離形元件，係應用於積體電路之轉移成型封裝製程之中，並貼附於一成型模具之一上模具與一下模具的內表面，其係包括：一離型膜，且該離型膜之厚度係介於0.01mm~2mm之間；並且，該離型膜之硬度係為邵氏硬度(SHORE Type A)~90邵氏硬度(SHORE Type D)。A release component applied to a wafer package is applied to a transfer molding process of an integrated circuit, and is attached to an inner surface of a mold and a mold of a molding die, and the system includes: a release type The film has a thickness of between 0.01 mm and 2 mm; and the hardness of the release film is SHORE Type A to SHORE Type D. 如申請專利範圍第1項所述之應用於晶圓封裝之離形元件，其中，該離型膜為一塑膠材料，且該塑膠材料係選自於下列群組之中的任一者：聚對苯二甲酸乙二酯、聚丙烯、聚碳酸酯、聚乙烯、聚醯亞胺、與氯綸。The release component for a wafer package according to claim 1, wherein the release film is a plastic material, and the plastic material is selected from any one of the following groups: Ethylene terephthalate, polypropylene, polycarbonate, polyethylene, polyimine, and polyvinyl chloride. 如申請專利範圍第1項所述之應用於晶圓封裝之離形元件，其中，該離型膜之製造材料係選自於下列群組之任一者：純矽膠與矽膠/橡膠化合物。The release member for a wafer package according to claim 1, wherein the release film is made of any one of the following groups: pure tannin and tannin/rubber compound. 如申請專利範圍第3項所述之應用於晶圓封裝之離形元件，其中，所述的矽膠/橡膠化合物係由一矽膠、一橡膠與一塑膠材料所組成，其中該矽膠與該橡膠的組成比例為100%：0%~5%：90%，且剩餘比例則添加該塑膠材料予以補足。The release component for a wafer package according to claim 3, wherein the silicone/rubber compound is composed of a silicone rubber, a rubber and a plastic material, wherein the silicone rubber and the rubber The composition ratio is 100%: 0%~5%: 90%, and the remaining proportion is added to the plastic material to make up. 如申請專利範圍第1項所述之應用於晶圓封裝之離形元件，更包括一矽油/氟化合膜，係塗佈形成於該離型膜之上，用以增進該離型膜之離型功效。The detachable component for wafer package according to claim 1, further comprising an oil/fluorinated film formed on the release film to enhance the separation of the release film. Type effect. 如申請專利範圍第5項所述之應用於晶圓封裝之離形元件，其中，該矽油/氟化合膜氟或矽之化合物含量可從0.1~100%。The detachable component for wafer encapsulation according to claim 5, wherein the eucalyptus/fluorinated film fluorine or strontium compound content is from 0.1 to 100%.