TWM482102U - Water-cooling head structure and the heat exchange plate thereof - Google Patents
Water-cooling head structure and the heat exchange plate thereof Download PDFInfo
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- TWM482102U TWM482102U TW103202057U TW103202057U TWM482102U TW M482102 U TWM482102 U TW M482102U TW 103202057 U TW103202057 U TW 103202057U TW 103202057 U TW103202057 U TW 103202057U TW M482102 U TWM482102 U TW M482102U
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- water
- head structure
- notches
- cooling head
- fins
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- 238000001816 cooling Methods 0.000 title claims description 43
- 239000000758 substrate Substances 0.000 claims description 10
- 239000012530 fluid Substances 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本創作係有關於水冷頭結構，尤指一種用於液態冷卻的水冷頭結構及其熱交換板。 This creation is about water-cooled head structures, especially a water-cooled head structure for liquid cooling and its heat exchange plates.
隨著半導體加工技術的進步，半導體晶片的運算速度也較以往倍增，但運算效率提升同時也伴隨產生加倍的熱能。對於現今半導體晶片所產的熱能，傳統的空氣強制冷卻機制已不敷使用，因此如水冷系統之液態冷卻機制勢必是未來的驅勢。水冷頭為水冷系統中用於接解發熱源(例如半導體晶片)的元件，其一般的工作方式是與發熱源以熱傳導方式進行熱交換而將發熱源工作中所產生的熱能移除，再藉由工作流體(例如水)流入水冷頭內以熱對流的方式與水冷頭進行熱交換而將熱能轉移至工作流體中，隨著工作流體的流出而帶離水冷頭。因此水冷頭內的流道設計與其熱對流的效效息息相關，一般是藉由在水冷頭內設置鰭片形成流道供工作流體流經鰭片而與鰭片進行熱交換，若能夠在冷頭內設置更多的鰭片則理論上因水冷頭與工作流體相接觸的熱交換面積增加，故能夠得到較好的熱傳遞效率。 With the advancement of semiconductor processing technology, the computing speed of semiconductor wafers has also doubled, but the increase in computational efficiency is accompanied by the doubling of thermal energy. For the thermal energy produced by today's semiconductor wafers, the traditional air forced cooling mechanism is no longer sufficient, so the liquid cooling mechanism such as water cooling system is bound to be the future driving force. The water-cooling head is an element for connecting a heat-generating source (for example, a semiconductor wafer) in a water-cooling system, and the general working mode is to exchange heat with a heat source in a heat conduction manner to remove heat energy generated during operation of the heat source, and then borrow The working fluid (for example, water) flows into the water cooling head to exchange heat with the water cooling head in a heat convection manner to transfer the thermal energy into the working fluid, and is carried away from the water cooling head as the working fluid flows out. Therefore, the design of the flow channel in the water cooling head is closely related to the effect of the heat convection. Generally, the fins are formed in the water cooling head to form a flow channel for the working fluid to flow through the fins to exchange heat with the fins. The provision of more fins in the theory is theoretically due to the increased heat exchange area of the water-cooling head in contact with the working fluid, so that better heat transfer efficiency can be obtained.
為了能夠在有限的空間內增加鰭片的密度，因而發展出以刨削金屬塊的方式在金屬塊形成緊密間隔排列的鰭片。藉此雖能夠增單位體積內的熱交換面積，但其造成流道狹窄，因此流場的邊界層 效應更為顯著，工作流體在流經整個鰭片的過程中，因邊界層效應導致其流場特性改變，因此流道末端無法得到如流道入口處同等的熱傳遞效率。 In order to be able to increase the density of the fins in a limited space, it has been developed to form closely spaced fins in the metal block in a manner of shaving the metal blocks. Although the heat exchange area per unit volume can be increased, the flow path is narrow, so the boundary layer of the flow field The effect is more pronounced. During the flow of the working fluid through the entire fin, the flow field characteristics change due to the boundary layer effect, so the end of the flow channel cannot obtain the same heat transfer efficiency as the inlet of the flow channel.
有鑑於此，本創作人遂針對上述現有技術，特潛心研究並配合學理的運用，盡力解決上述之問題點，即成為本創作人改良之目標。 In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.
本創作之主要目的，在於提供一種用於液態冷卻的水冷頭結構，其結構能夠調整流動於其中的工作流體之特性，藉以增進水冷頭結構與工作流體之間的熱交換效率。 The main object of the present invention is to provide a water-cooled head structure for liquid cooling that is structured to adjust the characteristics of the working fluid flowing therein to enhance the heat exchange efficiency between the water-cooled head structure and the working fluid.
為了達成上述之目的，本創作係提供一種水冷頭結構，包含一基板及複數個鰭片。基板具有一熱對流面，鰭片直立設置在該熱對流面且相互間隔並列，各鰭片的頂緣分別開設有至少一缺口，缺口連通鰭片的二側，各缺口與相鄰的另一鰭片上相對應的另一缺口併排而連通形成一缺槽。 In order to achieve the above object, the present invention provides a water-cooled head structure comprising a substrate and a plurality of fins. The substrate has a heat convection surface, the fins are erected on the heat convection surface and are juxtaposed with each other, and the top edges of the fins are respectively provided with at least one notch, and the notches communicate with the two sides of the fin, and each notch and the adjacent one another The other notch on the fin is connected side by side to form a slot.
較佳地，前述之水冷頭結構，其各鰭片的頂緣的缺口為複數個。 Preferably, in the water-cooling head structure described above, the top edge of each fin has a plurality of notches.
較佳地，前述之水冷頭結構更包含一罩蓋，罩蓋罩設在熱對流面而且遮罩該些鰭片，罩蓋開設有二通口。 Preferably, the water-cooling head structure further comprises a cover, the cover is disposed on the heat convection surface and covers the fins, and the cover is opened with a two-port.
較佳地，前述之水冷頭結構，其中相鄰的任意二鰭片之間分別形成有一流道，二通口分別相對地對應各流道的二端配置。 Preferably, in the water-cooling head structure described above, a first-class track is formed between any adjacent two fins, and the two-ports respectively correspond to the two-end arrangement of each flow channel.
較佳地，前述之水冷頭結構，其該些缺口排列構成複數個缺槽。 Preferably, in the water-cooling head structure described above, the notches are arranged to form a plurality of slots.
較佳地，前述之水冷頭結構，其該些缺槽為相互分隔。 Preferably, in the foregoing water-cooling head structure, the notches are separated from each other.
較佳地，前述之水冷頭結構，其缺槽呈長條形。 Preferably, in the foregoing water-cooling head structure, the missing groove has an elongated shape.
較佳地，前述之水冷頭結構，其中一缺槽與至少另一缺槽交叉而相互連通。 Preferably, in the foregoing water-cooling head structure, one of the notches intersects with at least one of the other notches to communicate with each other.
本創作的水冷頭結構藉由相鄰的鰭片而在二者之間形成流道，且鰭片的頂緣開設有缺口。當流動於流道內的工作流體流經缺口時，缺口能使工作流體流場的邊界層特性改變，藉此增進工作流體與鰭片之間的熱交換效率。 The water-cooled head structure of the present invention forms a flow path between the two by adjacent fins, and the top edge of the fin is provided with a notch. When the working fluid flowing in the flow passage flows through the notch, the notch can change the boundary layer characteristics of the working fluid flow field, thereby increasing the heat exchange efficiency between the working fluid and the fin.
20‧‧‧發熱源 20‧‧‧heat source
30‧‧‧幫浦 30‧‧‧ pump
40‧‧‧水槽 40‧‧‧Sink
50‧‧‧散熱排 50‧‧‧ heat sink
100‧‧‧基板 100‧‧‧Substrate
101‧‧‧熱傳導面 101‧‧‧heat conduction surface
102‧‧‧熱對流面 102‧‧‧Hot convection
200‧‧‧罩蓋 200‧‧‧ Cover
210/220‧‧‧通口 210/220‧‧‧ mouth
300‧‧‧鰭片 300‧‧‧Fins
301‧‧‧流道 301‧‧‧ flow path
310‧‧‧缺口 310‧‧‧ gap
320‧‧‧缺槽 320‧‧‧ Missing slots
A‧‧‧參考軸 A‧‧‧ reference axis
第一圖係本創作第一實施例之水冷頭結構之立體分解示意圖。 The first figure is a perspective exploded view of the water-cooled head structure of the first embodiment of the present invention.
第二圖係本創作第一實施例之水冷頭結構之配置示意圖。 The second drawing is a schematic view showing the configuration of the water-cooling head structure of the first embodiment of the present invention.
第三圖係本創作第一實施例之水冷頭結構之工作狀態示意圖。 The third figure is a schematic view showing the working state of the water-cooled head structure of the first embodiment of the present invention.
第四圖係本創作第二實施例之水冷頭結構之示意圖。 The fourth figure is a schematic view of the water-cooled head structure of the second embodiment of the present creation.
第五圖係本創作第三實施例之水冷頭結構之示意圖。 The fifth figure is a schematic view of the water-cooled head structure of the third embodiment of the present creation.
參閱第一圖，本創作之第一實施例提供一種水冷頭結構，其包含有一基板100以及一罩蓋200。 Referring to the first figure, a first embodiment of the present invention provides a water-cooled head structure including a substrate 100 and a cover 200.
基板100具有一熱傳導面101以及與熱傳導面101相對配置的一熱對流面102。 The substrate 100 has a heat conducting surface 101 and a heat convection surface 102 disposed opposite the heat conducting surface 101.
熱對流面102上直立設置有複數個鰭片300，各鰭片300的頂緣分別切削形成有至少一缺口310，於本實施例中各鰭片300的頂緣較佳地分別形成有複數個缺口310。各缺口310分別連通其所在鰭片 300二側的流道301，且各缺口310分別與相鄰的另一鰭片300上相對應的另一缺口310併排連通，多個相對應缺口310並行排列而構成一缺槽320。於本實施例中，該些缺口310較佳地形成複數個相互分隔的的直條狀缺槽320。於本實施例中，較佳地複數缺口310沿一參考軸A排列成一缺槽320，並且會至少有兩組平行的參考軸A排列成複數缺槽320。 A plurality of fins 300 are erected on the heat convection surface 102. The top edges of the fins 300 are respectively formed with at least one notch 310. In the embodiment, the top edges of the fins 300 are preferably formed with a plurality of top edges. Notch 310. Each notch 310 is connected to its fin The flow channels 301 are disposed on the two sides of the 300, and each of the notches 310 is in parallel with another notch 310 corresponding to the other of the adjacent fins 300. The plurality of corresponding notches 310 are arranged in parallel to form a notch 320. In the embodiment, the notches 310 preferably form a plurality of straight strip-shaped slots 320 that are separated from each other. In the present embodiment, preferably, the plurality of notches 310 are arranged along a reference axis A to form a slot 320, and at least two sets of parallel reference axes A are arranged in a plurality of slots 320.
罩蓋200罩設在該基板100的熱對流面102上，而且罩蓋200遮罩該些鰭片300。罩蓋200開設有二通口210/220，二通口210/220分別相對地對應各流道301的二端配置。 The cover 200 is disposed on the heat convection surface 102 of the substrate 100, and the cover 200 covers the fins 300. The cover 200 is provided with a two-port 210/220, and the two-port 210/220 respectively correspond to the two-end arrangement of each flow channel 301.
參閱第二圖，本創作的水冷頭結構用以貼附接觸於一發熱源20，且水冷頭結構串連連通一個幫浦30、用以容納工作流體的一水槽40及一散熱排50而構成一迴路。幫浦30在迴路內提供一壓差而驅使工作流體在迴路中循環流動。工作流體流經水冷頭結構將發熱源20的產生熱源帶離發熱源20，並且工作流體流經散熱排50而將其所帶熱能通過散熱排50排出至空氣中。 Referring to the second figure, the water-cooling head structure of the present invention is attached to a heat source 20, and the water-cooling head structure is connected in series to a pump 30, a water tank 40 for containing the working fluid, and a heat dissipation row 50. First circuit. The pump 30 provides a pressure differential within the circuit that drives the working fluid to circulate in the circuit. The working fluid flows through the water-cooling head structure to carry the heat source of the heat source 20 away from the heat source 20, and the working fluid flows through the heat-dissipating row 50 to discharge the heat energy thereof to the air through the heat-dissipating row 50.
參閱第三圖，基板100的熱傳導面101用於貼附接觸於發熱源20，藉由與發熱源20進行熱交換而將發熱源20所產生的熱能自發熱源20上移除。罩蓋200的其中一個通口210供工作流體流入罩蓋200後分流入各流道301，工作流體自各流道301位於同側的其中一端流入各流道301。工作流體流經各流道301後通過各流道301的另一端流出流道301並且滙流通過另一通口220流出罩蓋200。 Referring to the third figure, the heat conducting surface 101 of the substrate 100 is used for attaching to the heat source 20, and the heat energy generated by the heat source 20 is removed from the heat source 20 by heat exchange with the heat source 20. One of the openings 210 of the cover 200 flows into the cover 200 after the working fluid flows into the cover 200, and the working fluid flows into the respective flow paths 301 from one end of the flow channels 301 on the same side. The working fluid flows through the respective flow passages 301 and then flows out of the flow passage 301 through the other end of each flow passage 301 and flows out through the other opening 220 to flow out of the cover 200.
本創作的水冷頭結構藉由相鄰的鰭片300而在二者之間形成流道301，且鰭片300的頂緣開設有缺口310。當流動於流道301內的工 作流體流經缺口310時，缺口310能在工作流體流場的邊界層產生擾動而使其邊界層特性趨向紋流，藉此增進工作流體與鰭片300之間的熱對流效率。 The water-cooled head structure of the present invention forms a flow channel 301 therebetween by adjacent fins 300, and the top edge of the fin 300 is provided with a notch 310. When working in the flow channel 301 As the fluid flows through the notch 310, the notch 310 can cause disturbances in the boundary layer of the working fluid flow field to cause its boundary layer characteristics to tend to flow, thereby enhancing the thermal convection efficiency between the working fluid and the fins 300.
參閱第四圖，本創作之第二實施例提供一種水冷頭結構，其構造大致如同前述第一實施例，其相同之處不再贅述。本實施例與第一實施例不同之處在於鰭片300的頂緣的缺口310構成多個相互分隔的彎曲長條狀缺槽320，且各缺槽320彎曲呈波狀。 Referring to the fourth figure, a second embodiment of the present invention provides a water-cooled head structure, which is substantially the same as the first embodiment described above, and the same portions will not be described again. This embodiment differs from the first embodiment in that the notch 310 of the top edge of the fin 300 constitutes a plurality of curved elongated strip-shaped cutouts 320, and each of the cutouts 320 is curved in a wave shape.
參閱第五圖，本創作之第三實施例提供一種水冷頭結構，其構造大致如同前述第一實施例，其相同之處不再贅述。本實施例與第一實施例不同之處在於鰭片300的頂緣的缺口310構成多個交叉而相互連通的直條狀缺槽320。 Referring to the fifth embodiment, a third embodiment of the present invention provides a water-cooled head structure, which is substantially the same as the first embodiment described above, and the same portions will not be described again. This embodiment differs from the first embodiment in that the notch 310 of the top edge of the fin 300 constitutes a plurality of straight strip-shaped slots 320 that intersect and communicate with each other.
以上所述僅為本創作之較佳實施例，非用以限定本創作之專利範圍，其他運用本創作之專利精神之等效變化，均應俱屬本創作之專利範圍。 The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents of the present invention. Other equivalent variations of the patent spirit using the present invention are all within the scope of the patent.
100‧‧‧基板 100‧‧‧Substrate
101‧‧‧熱傳導面 101‧‧‧heat conduction surface
102‧‧‧熱對流面 102‧‧‧Hot convection
200‧‧‧罩蓋 200‧‧‧ Cover
210/220‧‧‧通口 210/220‧‧‧ mouth
300‧‧‧鰭片 300‧‧‧Fins
310‧‧‧缺口 310‧‧‧ gap
320‧‧‧缺槽 320‧‧‧ Missing slots
A‧‧‧參考軸 A‧‧‧ reference axis
Claims (21)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103202057U TWM482102U (en) | 2014-01-29 | 2014-01-29 | Water-cooling head structure and the heat exchange plate thereof |
| CN201420541601.9U CN204244622U (en) | 2014-01-29 | 2014-09-22 | heat exchange plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103202057U TWM482102U (en) | 2014-01-29 | 2014-01-29 | Water-cooling head structure and the heat exchange plate thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM482102U true TWM482102U (en) | 2014-07-11 |
Family
ID=51724200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103202057U TWM482102U (en) | 2014-01-29 | 2014-01-29 | Water-cooling head structure and the heat exchange plate thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN204244622U (en) |
| TW (1) | TWM482102U (en) |
-
2014
- 2014-01-29 TW TW103202057U patent/TWM482102U/en not_active IP Right Cessation
- 2014-09-22 CN CN201420541601.9U patent/CN204244622U/en active Active
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| Publication number | Publication date |
|---|---|
| CN204244622U (en) | 2015-04-01 |
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