TWM585431U

TWM585431U - Heat dissipating device

Info

Publication number: TWM585431U
Application number: TW108208111U
Authority: TW
Inventors: 陳朝泉; 劉冠昕
Original assignee: 展緻企業有限公司
Priority date: 2019-06-25
Filing date: 2019-06-25
Publication date: 2019-10-21

Abstract

一種散熱裝置，包括一基板及多個熱交換鰭片。基板具有一第一表面及一第二表面，該些熱交換鰭片設置於基板的第一表面上，該些熱交換鰭片凸出於基板的第一表面，該些熱交換鰭片形成間隔的設置，每相鄰的兩熱交換鰭片之間各形成一溝槽，且該些溝槽凹陷於基板的第一表面，該些溝槽由基板的第一表面朝向第二表面的方向凹陷。由此，可獲得較大的熱交換面積，且使流體較為接近熱源，使其散熱效率提升。A heat dissipation device includes a substrate and a plurality of heat exchange fins. The substrate has a first surface and a second surface. The heat exchange fins are disposed on the first surface of the substrate. The heat exchange fins protrude from the first surface of the substrate. The heat exchange fins form a space. A groove is formed between each adjacent two heat exchange fins, and the grooves are recessed on the first surface of the substrate, and the grooves are recessed from the first surface of the substrate toward the second surface. . Thereby, a larger heat exchange area can be obtained, and the fluid can be closer to the heat source, so that the heat radiation efficiency is improved.

Description

散熱裝置Heat sink

本創作涉及一種散熱裝置，尤指一種能用以協助電子發熱元件散熱的散熱裝置。This creation relates to a heat dissipation device, and more particularly to a heat dissipation device that can be used to assist the heat dissipation of electronic heating elements.

現今科技工業的產品發展趨於精密化，如積體電路或電腦等裝置，除了體積設計小型化外，相對所衍生的熱量也大幅地增加，故其運作時所產生的熱量也相當的可觀。針對各種電子發熱元件皆設有相對應的散熱裝置，以能維持其在許可的溫度下正常運作。At present, the development of products in the technology industry tends to be more sophisticated. In addition to the compact design of devices such as integrated circuits or computers, the relative amount of heat generated has also increased significantly, so the heat generated during its operation is also considerable. Corresponding heat dissipation devices are provided for various electronic heating elements to maintain their normal operation at permitted temperatures.

對於於高功率電子發熱元件來說，一般會使用水冷頭協助散熱，該水冷頭包括一基板及多個熱交換鰭片，該些熱交換鰭片設置於基板上，用以增加熱交換面積。該些熱交換鰭片的製作通常是在基板上預先成型一凸台，再利用刀具於凸台上銑切出多個溝槽，該些溝槽位於基板的表面外，該些熱交換鰭片形成於該些溝槽之間。另外，也可在基板上利用刀具直接銑切出多個溝槽，藉以形成多個熱交換鰭片。For high-power electronic heating elements, a water-cooling head is generally used to assist in heat dissipation. The water-cooling head includes a substrate and a plurality of heat exchange fins. The heat exchange fins are arranged on the substrate to increase the heat exchange area. The heat exchange fins are usually manufactured by forming a boss on the substrate in advance, and then using a cutter to mill a plurality of grooves on the boss, the grooves are located outside the surface of the substrate, and the heat exchange fins Formed between the trenches. In addition, a plurality of grooves can be directly milled on the substrate by a cutter to form a plurality of heat exchange fins.

另，該水冷頭還可包括一蓋體，該蓋體蓋置於基板上，使該些熱交換鰭片位於蓋體的腔室內，流體能通過一入水口輸入腔室內，並由一出水口輸出。該基板能與電子發熱元件接觸，當流體通過腔室時，能將電子發熱元件所產生的熱，藉由該流體快速帶走，用以協助電子發熱元件散熱。In addition, the water cooling head may further include a cover, the cover is placed on the base plate, so that the heat exchange fins are located in the cavity of the cover, and the fluid can be input into the cavity through a water inlet, and a water outlet Output. The substrate can be in contact with the electronic heating element. When the fluid passes through the chamber, the heat generated by the electronic heating element can be quickly taken away by the fluid to assist the electronic heating element to dissipate heat.

惟，上述現有的散熱裝置，無法獲得較大的熱交換面積，且流體無法更為接近熱源，使其散熱效率難以提升。However, the above existing heat dissipation devices cannot obtain a large heat exchange area, and the fluid cannot be closer to the heat source, making it difficult to improve the heat dissipation efficiency.

本創作所要解決的技術問題在於，針對現有技術的不足提供一種散熱裝置，可獲得較大的熱交換面積，且使流體較為接近熱源，使其散熱效率提升。The technical problem to be solved by this creation is to provide a heat dissipation device for the shortcomings of the prior art, which can obtain a larger heat exchange area, and make the fluid closer to the heat source, so that the heat dissipation efficiency is improved.

為了解決上述的技術問題，本創作所採用的技術方案是，提供一種散熱裝置，包括：一基板，該基板具有一第一表面及一第二表面，該第一表面及該第二表面分別位於該基板相對的兩面；以及多個熱交換鰭片，該些熱交換鰭片設置於該基板的第一表面上，該些熱交換鰭片凸出於該基板的第一表面，該些熱交換鰭片形成間隔的設置，每相鄰的兩熱交換鰭片之間各形成一溝槽，且該些溝槽凹陷於該基板的第一表面，該些溝槽由該基板的第一表面朝向該第二表面的方向凹陷。In order to solve the above-mentioned technical problems, the technical solution adopted in this creation is to provide a heat dissipation device including: a substrate having a first surface and a second surface, the first surface and the second surface being respectively located at The two opposite sides of the substrate; and a plurality of heat exchange fins, the heat exchange fins are disposed on the first surface of the substrate, the heat exchange fins protrude from the first surface of the substrate, and the heat exchange The fins are spaced apart from each other, and a groove is formed between each adjacent two heat exchange fins, and the grooves are recessed on the first surface of the substrate, and the grooves face from the first surface of the substrate The direction of the second surface is concave.

較佳的，該基板上靠近該些溝槽的一側形成多個槽底面，該些槽底面分別鄰接於該些溝槽，該些槽底面各具有一直線段及兩弧線段，該兩弧線段分別連接於該直線段相對的兩端。Preferably, a plurality of groove bottom surfaces are formed on a side of the substrate near the grooves, the groove bottom surfaces are respectively adjacent to the grooves, and the groove bottom surfaces each have a straight line segment and two arc segments, and the two arc segments They are respectively connected to opposite ends of the straight line segment.

本創作的有益效果在於，本創作所提供的散熱裝置，該些溝槽凹陷於基板的第一表面，該些溝槽由基板的第一表面朝向第二表面的方向凹陷，使得該些溝槽較為接近基板的第二表面及熱源，當流體通過該些溝槽時，流體可較接近熱源，可提供熱源較佳的散熱效率，且該些溝槽由基板的第一表面朝向第二表面的方向凹陷，亦可使得該些熱交換鰭片的熱交換面積大幅的增加，以增加熱交換率，提升其散熱效率。The beneficial effect of this creation is that the grooves provided in this creation are recessed in the first surface of the substrate, and the grooves are recessed from the first surface of the substrate toward the second surface, so that the grooves The fluid is closer to the second surface of the substrate and the heat source. When the fluid passes through the grooves, the fluid can be closer to the heat source, which can provide better heat dissipation efficiency of the heat source. The recessed direction can also greatly increase the heat exchange area of the heat exchange fins, so as to increase the heat exchange rate and improve its heat dissipation efficiency.

為使能更進一步瞭解本創作的特徵及技術內容，請參閱以下有關本創作的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本創作加以限制。In order to better understand the features and technical contents of this creation, please refer to the following detailed description and drawings about this creation. However, the drawings provided are only for reference and explanation, and are not intended to limit this creation.

以下是通過特定的具體實施例來說明本創作所公開的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本創作的構思下進行各種修改與變更。另外，本創作的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本創作的相關技術內容，但所公開的內容並非用以限制本創作的保護範圍。The following are specific implementation examples to explain the implementation of the present disclosure. Those skilled in the art can understand the advantages and effects of the present disclosure from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of this creation. In addition, the drawings of this creation are only for simple and schematic illustrations, and are not drawn in actual size, so stated in advance. The following embodiments will further describe the technical content of this creation in detail, but the disclosed content is not intended to limit the scope of protection of this creation.

[第一實施例][First embodiment]

請參閱圖1至圖4，本創作提供一種散熱裝置，尤指一種能應用於水冷裝置或氣冷裝置的散熱裝置，該散熱裝置是以導熱性良好的金屬材料製成(如鋁或銅等)，該散熱裝置包括一基板1及多個熱交換鰭片2。Please refer to FIG. 1 to FIG. 4. The present invention provides a heat sink, especially a heat sink that can be applied to a water-cooled device or an air-cooled device. ), The heat dissipation device includes a substrate 1 and a plurality of heat exchange fins 2.

該基板1呈板體，其形狀並不限制，在本實施例中，該基板1呈方形板體。該基板1具有一第一表面11及一第二表面12，該第一表面11及第二表面12分別位於基板1相對的兩面，該第一表面11及第二表面12可為平面或凹凸面，並不予以限制。該第二表面12可用以與熱源(如電子發熱元件)接觸，使熱源的高溫可傳遞至基板1及該些熱交換鰭片2。在本實施例中，該第二表面12上設有一凸出部121，可用以與熱源接觸。The substrate 1 is a plate, and its shape is not limited. In this embodiment, the substrate 1 is a square plate. The substrate 1 has a first surface 11 and a second surface 12. The first surface 11 and the second surface 12 are respectively located on opposite sides of the substrate 1. The first surface 11 and the second surface 12 may be flat or uneven surfaces. Without restrictions. The second surface 12 can be in contact with a heat source (such as an electronic heating element), so that the high temperature of the heat source can be transmitted to the substrate 1 and the heat exchange fins 2. In this embodiment, a protruding portion 121 is provided on the second surface 12, which can be used to contact the heat source.

該些熱交換鰭片2設置於基板1的第一表面11上，該些熱交換鰭片2凸出於基板1的第一表面11。該些熱交換鰭片2的製作可在基板1的第一表面11上預先成型一凸台3，再利用刀具於凸台3上銑切出多個溝槽4，該些熱交換鰭片2形成於該些溝槽4之間，該些溝槽4遠離基板1的第一表面11的一側形成開口狀。每相鄰的兩熱交換鰭片2之間各形成一溝槽4，該些熱交換鰭片2之間分別以該些溝槽4區隔，使該些熱交換鰭片2形成間隔的設置，且該些溝槽4的相對兩端呈開口狀，使得流體可以沿著該些溝槽4的延伸方向流動，以便與該些熱交換鰭片2接觸進行熱交換。The heat exchange fins 2 are disposed on the first surface 11 of the substrate 1, and the heat exchange fins 2 protrude from the first surface 11 of the substrate 1. The heat exchange fins 2 can be manufactured by forming a protrusion 3 on the first surface 11 of the substrate 1 in advance, and then milling a plurality of grooves 4 on the protrusion 3 by using a cutter. The heat exchange fins 2 The trenches 4 are formed between the trenches 4, and the trenches 4 are formed in an opening shape on a side far from the first surface 11 of the substrate 1. A groove 4 is formed between each adjacent two heat exchange fins 2, and the heat exchange fins 2 are separated by the grooves 4, respectively, so that the heat exchange fins 2 form a spaced arrangement. The opposite ends of the grooves 4 are open, so that fluid can flow along the extending direction of the grooves 4 so as to contact the heat exchange fins 2 for heat exchange.

該些溝槽4凹陷(剖入)於基板1的第一表面11，該些溝槽4由基板1的第一表面11朝向第二表面12的方向凹陷，使得該些溝槽4較為接近基板1的第二表面12及熱源(如電子發熱元件)，當流體(冷卻水)通過該些溝槽4時，可提供熱源較佳的散熱效率，且該些溝槽4由基板1的第一表面11朝向第二表面12的方向凹陷，亦可使得該些熱交換鰭片2的熱交換面積增加。The grooves 4 are recessed (cut into) on the first surface 11 of the substrate 1, and the grooves 4 are recessed from the first surface 11 of the substrate 1 toward the second surface 12, so that the grooves 4 are closer to the substrate When the fluid (cooling water) passes through the grooves 4, the second surface 12 of 1 and the heat source (such as an electronic heating element) can provide better heat dissipation efficiency of the heat source. The depression of the surface 11 toward the second surface 12 can also increase the heat exchange area of the heat exchange fins 2.

在本實施例中，該基板1上靠近該些溝槽4的一側形成多個槽底面13，該些槽底面13分別鄰接於該些溝槽4，該些槽底面13各具有一直線段131及兩弧線段132、133，該兩弧線段132、133分別連接於直線段131相對的兩端。兩弧線段132、133可分別用以導引流體流入及流出溝槽4的底部。In this embodiment, a plurality of groove bottom surfaces 13 are formed on a side of the substrate 1 near the grooves 4, the groove bottom surfaces 13 are respectively adjacent to the grooves 4, and the groove bottom surfaces 13 each have a straight line segment 131. And two arc segments 132 and 133, which are connected to opposite ends of the straight segment 131, respectively. The two arc segments 132 and 133 can be used to guide the fluid into and out of the bottom of the trench 4, respectively.

在本實施例中，該些溝槽4延伸的方向相同，亦即該些溝槽4相互平行，該些熱交換鰭片2延伸的方向也是相同，亦即該些熱交換鰭片2也是相互平行。惟，該些溝槽4延伸的方向並不限制，例如在另一實施例中，該些溝槽4也可以相互垂直。In this embodiment, the extending directions of the grooves 4 are the same, that is, the grooves 4 are parallel to each other, and the extending directions of the heat exchange fins 2 are also the same, that is, the heat exchange fins 2 are also mutually parallel. However, the extending direction of the trenches 4 is not limited. For example, in another embodiment, the trenches 4 may be perpendicular to each other.

[第二實施例][Second embodiment]

請參閱圖5至圖7，本創的散熱裝置還可包括一蓋體5，該蓋體5具有一蓋板51，該蓋板51內形成有一腔室52，該蓋板51連接有一入水口53及一出水口54，該入水口53及出水口54與腔室52相連通，較佳的，該入水口53及出水口54分別靠近該蓋板51的相對兩側。該蓋體5蓋置於基板1上，該基板1及蓋體5之間亦可設置密封元件(圖略)，使基板1及蓋體5之間維持良好密封性，可使流體於基板1及蓋體5之間流動時不易向外洩漏。該些熱交換鰭片2遠離基板1的第一表面11的一側可抵觸於蓋體5的蓋板51，使該些溝槽4遠離基板1的第一表面11的一側形成封閉狀。該基板1及蓋體5可組成一水冷頭，能以水冷方式協助熱源(如電子發熱元件)散熱。Please refer to FIG. 5 to FIG. 7. The heat dissipation device of the present invention may further include a cover body 5 having a cover plate 51. A cavity 52 is formed in the cover plate 51, and the cover plate 51 is connected to a water inlet. 53 and a water outlet 54, the water inlet 53 and the water outlet 54 are in communication with the chamber 52, preferably, the water inlet 53 and the water outlet 54 are close to opposite sides of the cover plate 51, respectively. The cover 5 is placed on the substrate 1, and a sealing element (not shown) may be provided between the substrate 1 and the cover 5, so as to maintain a good seal between the substrate 1 and the cover 5, and allow fluid to flow on the substrate 1. It is difficult to leak to the outside when flowing between the cover 5. The side of the heat exchange fins 2 away from the first surface 11 of the substrate 1 can abut the cover 51 of the cover 5, so that the side of the grooves 4 away from the first surface 11 of the substrate 1 forms a closed shape. The substrate 1 and the cover 5 can form a water-cooled head, which can assist a heat source (such as an electronic heating element) to dissipate heat in a water-cooled manner.

該些熱交換鰭片2位於蓋體5的腔室52內，流體(如冷卻水)能通過入水口53輸入腔室52內，使流體能與該些熱交換鰭片2接觸以進行熱交換，並由出水口54輸出熱交換後的流體。該基板1的第二表面12可與熱源(如電子發熱元件)接觸，當流體通過該腔室52時，能將熱源所產生的熱，藉由該流體快速帶走，用以協助熱源散熱。The heat exchange fins 2 are located in the chamber 52 of the cover 5. A fluid (such as cooling water) can be input into the chamber 52 through the water inlet 53, so that the fluid can contact the heat exchange fins 2 for heat exchange. The heat exchange fluid is output from the water outlet 54. The second surface 12 of the substrate 1 can be in contact with a heat source (such as an electronic heating element). When the fluid passes through the chamber 52, the heat generated by the heat source can be quickly taken away by the fluid to assist the heat source to dissipate heat.

本創作的散熱裝置亦可應用於氣冷裝置，該散熱裝置包括一基板1及多個熱交換鰭片2，該些溝槽4由基板1的第一表面11朝向第二表面12的方向凹陷，使得該些溝槽4較為接近基板1的第二表面12及熱源(如電子發熱元件)，使得流體(空氣)通過該些溝槽4時，可提供熱源較佳的散熱效率。The heat dissipation device of the present invention can also be applied to an air cooling device. The heat dissipation device includes a substrate 1 and a plurality of heat exchange fins 2. The grooves 4 are recessed from the first surface 11 of the substrate 1 toward the second surface 12. The grooves 4 are relatively close to the second surface 12 of the substrate 1 and a heat source (such as an electronic heating element), so that when a fluid (air) passes through the grooves 4, a better heat dissipation efficiency of the heat source can be provided.

[本創作的有益效果][Beneficial effects of this creation]

本創作的有益效果在於，本創作散熱裝置包括一基板及多個熱交換鰭片，該些熱交換鰭片設置於基板的第一表面上，該些熱交換鰭片凸出於基板的第一表面，每相鄰的兩熱交換鰭片之間各形成一溝槽，該些溝槽凹陷於基板的第一表面，該些溝槽由基板的第一表面朝向第二表面的方向凹陷，使得該些溝槽較為接近基板的第二表面及熱源，當流體通過該些溝槽時，流體可較接近熱源，可提供熱源較佳的散熱效率，且該些溝槽由基板的第一表面朝向第二表面的方向凹陷，亦可使得該些熱交換鰭片的熱交換面積大幅的增加，以增加熱交換率，提升其散熱效率。The beneficial effect of this creation is that the heat dissipation device of this creation includes a substrate and a plurality of heat exchange fins, the heat exchange fins are disposed on the first surface of the substrate, and the heat exchange fins protrude from the first of the substrate On the surface, a groove is formed between each adjacent two heat exchange fins, the grooves are recessed on the first surface of the substrate, and the grooves are recessed from the first surface of the substrate toward the second surface, so that The grooves are relatively close to the second surface of the substrate and the heat source. When the fluid passes through the grooves, the fluid can be closer to the heat source, which can provide better heat dissipation efficiency of the heat source, and the grooves face from the first surface of the substrate. The recessed direction of the second surface can also greatly increase the heat exchange area of the heat exchange fins, so as to increase the heat exchange rate and improve its heat dissipation efficiency.

以上所公開的內容僅為本創作的優選可行實施例，並非因此侷限本創作的申請專利範圍，所以凡是運用本創作說明書及圖式內容所做的等效技術變化，均包含於本創作的申請專利範圍內。The content disclosed above is only the preferred and feasible embodiment of this creation, and therefore does not limit the scope of the patent application for this creation. Therefore, any equivalent technical changes made using this creation specification and diagram content are included in this creation application Within the scope of the patent.

1‧‧‧基板1‧‧‧ substrate

11‧‧‧第一表面 11‧‧‧ the first surface

12‧‧‧第二表面 12‧‧‧ second surface

121‧‧‧凸出部 121‧‧‧ protrusion

13‧‧‧槽底面 13‧‧‧Slot bottom surface

131‧‧‧直線段 131‧‧‧Straight segment

132‧‧‧弧線段 132‧‧‧arc segment

133‧‧‧弧線段 133‧‧‧arc segment

2‧‧‧熱交換鰭片 2‧‧‧ heat exchange fins

3‧‧‧凸台 3‧‧‧ boss

4‧‧‧溝槽 4‧‧‧ groove

5‧‧‧蓋體 5‧‧‧ cover

51‧‧‧蓋板 51‧‧‧ cover

52‧‧‧腔室 52‧‧‧ Chamber

53‧‧‧入水口 53‧‧‧Inlet

54‧‧‧出水口 54‧‧‧outlet

圖1為本創作散熱裝置的立體圖(一)。FIG. 1 is a perspective view (1) of the creative heat sink.

圖2為本創作散熱裝置的立體圖(二)。FIG. 2 is a perspective view (2) of the creative heat sink.

圖3為圖1的Ⅲ-Ⅲ剖視圖。Fig. 3 is a sectional view taken along the line III-III of Fig. 1.

圖4為圖1的Ⅳ-Ⅳ剖視圖。Fig. 4 is a sectional view taken along the line IV-IV of Fig. 1.

圖5為本創作散熱裝置另一實施例的立體分解圖。FIG. 5 is an exploded perspective view of another embodiment of the creative heat sink.

圖6為本創作散熱裝置另一實施例的立體圖。FIG. 6 is a perspective view of another embodiment of the creative heat sink.

圖7為圖6的Ⅶ-Ⅶ剖視圖。FIG. 7 is a sectional view taken along the line IX-VII in FIG. 6.

Claims

一種散熱裝置，包括：一基板，該基板具有一第一表面及一第二表面，該第一表面及該第二表面分別位於該基板相對的兩面；以及多個熱交換鰭片，該些熱交換鰭片設置於該基板的第一表面上，該些熱交換鰭片凸出於該基板的第一表面，該些熱交換鰭片形成間隔的設置，每相鄰的兩熱交換鰭片之間各形成一溝槽，該些溝槽凹陷於該基板的第一表面，該些溝槽由該基板的第一表面朝向該第二表面的方向凹陷。A heat dissipation device includes: a substrate having a first surface and a second surface, the first surface and the second surface being located on opposite sides of the substrate, and a plurality of heat exchange fins, The exchange fins are disposed on the first surface of the substrate, the heat exchange fins protrude from the first surface of the substrate, the heat exchange fins form a spaced arrangement, and each adjacent two heat exchange fins A groove is formed in between, the grooves are recessed on the first surface of the substrate, and the grooves are recessed from the first surface of the substrate toward the second surface.

如申請專利範圍第1項所述的散熱裝置，其中該基板上靠近該些溝槽的一側形成多個槽底面，該些槽底面分別鄰接於該些溝槽，該些槽底面各具有一直線段及兩弧線段，該兩弧線段分別連接於該直線段相對的兩端。The heat dissipation device according to item 1 of the patent application scope, wherein a plurality of groove bottom surfaces are formed on a side of the substrate near the grooves, the groove bottom surfaces are respectively adjacent to the grooves, and the groove bottom surfaces each have a straight line Segment and two arc segments, the two arc segments are respectively connected to opposite ends of the straight segment.

如申請專利範圍第1項所述的散熱裝置，其中該第二表面上設有一凸出部，能用以與熱源接觸。The heat dissipation device according to item 1 of the scope of patent application, wherein a protrusion is provided on the second surface, which can be used to contact the heat source.

如申請專利範圍第1項所述的散熱裝置，其中該基板的第一表面上成型一凸台，該凸台上銑切出該些溝槽。The heat dissipation device according to item 1 of the scope of patent application, wherein a protrusion is formed on the first surface of the substrate, and the grooves are milled out on the protrusion.

如申請專利範圍第1項所述的散熱裝置，其中該些溝槽延伸的方向相同，該些溝槽相互平行。The heat dissipation device according to item 1 of the scope of the patent application, wherein the grooves extend in the same direction, and the grooves are parallel to each other.

如申請專利範圍第1項所述的散熱裝置，其中該些溝槽的相對兩端呈開口狀。The heat dissipation device according to item 1 of the scope of patent application, wherein opposite ends of the grooves are open.

如申請專利範圍第1項所述的散熱裝置，其中還包括一蓋體，該蓋體具有一蓋板，該蓋板內形成有一腔室，該蓋板連接有一入水口及一出水口，該入水口及該出水口與該腔室相連通，該蓋體蓋置於該基板上，該些熱交換鰭片位於該蓋體的腔室內，流體能通過該入水口輸入該腔室內，使流體能與該些熱交換鰭片接觸以進行熱交換，並由該出水口輸出熱交換後的流體。The heat dissipation device according to item 1 of the scope of patent application, further comprising a cover having a cover plate, a cavity is formed in the cover plate, and the cover plate is connected with a water inlet and a water outlet. The water inlet and the water outlet are in communication with the chamber, the cover is placed on the substrate, the heat exchange fins are located in the chamber of the cover, and the fluid can be input into the chamber through the water inlet to make the fluid It can be in contact with the heat exchange fins for heat exchange, and the heat exchange fluid is output from the water outlet.

如申請專利範圍第7項所述的散熱裝置，其中該入水口及該出水口分別靠近該蓋板的相對兩側。The heat dissipation device according to item 7 of the scope of patent application, wherein the water inlet and the water outlet are respectively located near opposite sides of the cover plate.

如申請專利範圍第7項所述的散熱裝置，其中該些熱交換鰭片遠離該基板的第一表面的一側抵觸於該蓋體的蓋板，使該些溝槽遠離該基板的第一表面的一側形成封閉狀。The heat dissipation device according to item 7 of the scope of patent application, wherein a side of the heat exchange fins away from the first surface of the substrate is in contact with the cover plate of the cover body, so that the grooves are away from the first surface of the substrate. One side of the surface is closed.