TWM474197U - Touch apparatus - Google Patents
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- TWM474197U TWM474197U TW102222097U TW102222097U TWM474197U TW M474197 U TWM474197 U TW M474197U TW 102222097 U TW102222097 U TW 102222097U TW 102222097 U TW102222097 U TW 102222097U TW M474197 U TWM474197 U TW M474197U
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Abstract
Description
本創作係有關一種觸控裝置，特別是關於一種貼附電極層於光學膠層的觸控裝置。The present invention relates to a touch device, and more particularly to a touch device for attaching an electrode layer to an optical adhesive layer.
觸控顯示器係結合感測技術及顯示技術所形成的一種輸入/輸出裝置，普遍使用於電子裝置中，例如可攜式及手持式電子裝置。The touch display is an input/output device formed by combining sensing technology and display technology, and is commonly used in electronic devices, such as portable and handheld electronic devices.
電容式觸控面板為一種常用的觸控面板，其利用電容耦合效應以偵測觸碰位置。當手指觸碰電容式觸控面板的表面時，相應位置的電容量會受到改變，因而得以偵測到觸碰位置。A capacitive touch panel is a commonly used touch panel that utilizes a capacitive coupling effect to detect a touch position. When the finger touches the surface of the capacitive touch panel, the capacitance of the corresponding position is changed, and the touch position is detected.
傳統觸控面板之電極層的製造係於透明基板(例如玻璃)上形成氧化銦錫(ITO)，再使用顯影、曝光及蝕刻等技術以形成所要的電極形狀。該些製程不但複雜，且使用之透明基板的厚度無法降低，因而無法有效降低觸控面板的整體厚度。The electrode layer of the conventional touch panel is fabricated by forming indium tin oxide (ITO) on a transparent substrate (for example, glass), and then developing, exposing, and etching techniques to form a desired electrode shape. These processes are not only complicated, but the thickness of the transparent substrate used cannot be reduced, so that the overall thickness of the touch panel cannot be effectively reduced.
因此亟需提出一種新穎的觸控裝置，用以改善傳統觸控面板的缺點。Therefore, it is urgent to propose a novel touch device for improving the shortcomings of the conventional touch panel.
鑑於上述，本創作實施例的目的之一在於提出一種觸控裝置，其電極層係貼附於光學膠層，可有效降低觸控裝置的整體厚度並可簡化製程。In view of the above, one of the objects of the present embodiment is to provide a touch device in which an electrode layer is attached to an optical adhesive layer, which can effectively reduce the overall thickness of the touch device and simplify the process.
根據本創作實施例，觸控裝置包含至少一光學膠層、第一電極層及第二電極層。其中，第一電極層及第二電極層分別貼附於該些光學膠層當中的一光學膠層的同一側或相對二側，該光學膠層兼具基板及黏合功能。According to the present embodiment, the touch device includes at least one optical adhesive layer, a first electrode layer, and a second electrode layer. The first electrode layer and the second electrode layer are respectively attached to the same side or opposite sides of an optical adhesive layer among the optical adhesive layers, and the optical adhesive layer has both a substrate and a bonding function.
100‧‧‧觸控裝置100‧‧‧ touch device
200‧‧‧觸控裝置200‧‧‧ touch device
300‧‧‧觸控裝置300‧‧‧ touch device
11‧‧‧透明基板11‧‧‧Transparent substrate
12‧‧‧第一電極層12‧‧‧First electrode layer
13‧‧‧(第二)光學膠層13‧‧‧(second) optical adhesive layer
14‧‧‧第二電極層14‧‧‧Second electrode layer
15‧‧‧膠合層15‧‧‧Glued layer
16‧‧‧覆蓋層16‧‧‧ Coverage
21‧‧‧第一光學膠層21‧‧‧First optical layer
22‧‧‧第一電極層22‧‧‧First electrode layer
23‧‧‧離形層23‧‧‧Fractal layer
第一圖顯示本創作第一實施例之觸控裝置的剖視圖。The first figure shows a cross-sectional view of the touch device of the first embodiment of the present invention.
第二A圖及第二B圖顯示本創作第二實施例之觸控裝置的剖視圖。2A and 2B show cross-sectional views of the touch device of the second embodiment of the present invention.
第三A圖及第三B圖顯示本創作第三實施例之觸控裝置的剖視圖。3A and 3B show cross-sectional views of the touch device of the third embodiment of the present invention.
第一圖顯示本創作第一實施例之觸控裝置100的剖視圖。在本說明書中，方向“上”或“頂面”係指向觸碰位置，方向“下”或“底面”則是背向觸碰位置。The first figure shows a cross-sectional view of the touch device 100 of the first embodiment of the present invention. In this specification, the direction "up" or "top" refers to the touch position, and the direction "down" or "bottom" is the back touch position.
在本實施例中，觸控裝置100包含透明基板11，其材質可為絕緣材料，例如玻璃、聚碳酸酯(Polycarbonate,PC)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚乙烯(Polyethylen,PE)、聚氯乙烯(Poly vinyl Chloride,PVC)、聚丙烯(Poly propylene,PP)、聚苯乙烯(Poly styrene,PS)、聚甲基丙烯酸甲酯(Polymethyl methacrylate,PMMA)或環烯烴共聚合物(Cyclic olefin copolymer,COC)，但不限定於此。In this embodiment, the touch device 100 includes a transparent substrate 11 made of an insulating material such as glass, polycarbonate (PC), polyethylene terephthalate (PET), and poly. Polyethylen (PE), Polyvinyl Chloride (PVC), Polypropylene (PP), Polystyrene (PS), Polymethyl methacrylate (PMMA) or Cyclic olefin copolymer (COC), but is not limited thereto.
於透明基板11的頂面，以傳統技術形成第一電極層12，例如發射(transmit)電極層(一般簡稱為TX電極)。再以傳統技術圖形化(pattern)第 一電極層12。在本實施例中，第一電極層12的材質可為透明導電材料，例如氧化銦錫(indium tin oxide,ITO)、氧化銦鋅(indium zinc oxide,IZO)、氧化鋅鋁(Al-doped ZnO,AZO)或氧化錫銻(antimony tin oxide,ATO)，但不限定於此。On the top surface of the transparent substrate 11, a first electrode layer 12 is formed by a conventional technique, such as a transmitting electrode layer (generally referred to simply as a TX electrode). Then use the traditional technology to pattern An electrode layer 12. In this embodiment, the material of the first electrode layer 12 may be a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), and aluminum-doped ZnO. , AZO) or antimony tin oxide (ATO), but is not limited thereto.
於第一電極層12之上形成光學膠(optically-clear adhesive,OCA)層13，並於光學膠層13的頂面貼附第二電極層14，例如接收(receive)電極層(一般簡稱為RX電極)。在本實施例中，光學膠層13與第二電極層14係為一種可轉印透明導電膜(transparent conductive transfer film,TCTF)，其可直接貼附於第一電極層12上面。本實施例之光學膠層13的厚度大於50微米。第二電極層14的材質可為非透明導電材料，例如奈米金屬線(metal nanowire)，例如奈米銀線或奈米銅線；或者奈米金屬網(metal nanonet)，例如奈米銀網或奈米銅網。奈米金屬線或金屬網的內徑為奈米等級(亦即數奈米至數百奈米之間)，可藉由塑膠材料(例如樹脂)加以固定。由於奈米金屬線/網非常細，非人眼可以觀察得到，因此由奈米金屬線/網所構成之第二電極層14的透光性極佳。第二電極層14還可包含感光(photosensitive)材料，藉由曝光顯影製程即可形成所要的電極形狀(pattern)，而不需要使用額外的光阻材料。An optically-clear adhesive (OCA) layer 13 is formed on the first electrode layer 12, and a second electrode layer 14 is attached to the top surface of the optical adhesive layer 13, for example, a receiving electrode layer (generally referred to as RX electrode). In the present embodiment, the optical adhesive layer 13 and the second electrode layer 14 are a transparent conductive transfer film (TCTF) which can be directly attached to the first electrode layer 12. The thickness of the optical adhesive layer 13 of this embodiment is greater than 50 microns. The material of the second electrode layer 14 may be a non-transparent conductive material, such as a metal nanowire, such as a nano silver wire or a nano copper wire; or a metal nanonet, such as a nano silver mesh. Or nano copper mesh. The inner diameter of the nanowire or metal mesh is in the nanometer grade (ie, between several nanometers and hundreds of nanometers) and can be fixed by a plastic material such as a resin. Since the nanowire/net is very thin and can be observed by a non-human eye, the second electrode layer 14 composed of a nanowire/mesh has excellent light transmittance. The second electrode layer 14 may also comprise a photosensitive material that can be formed into a desired electrode pattern by an exposure development process without the use of an additional photoresist material.
根據本實施例的特徵之一，光學膠層13係作為第二電極層14的基板(或者作為一種間隔材料)，取代傳統透明基板(例如玻璃、PET等)及黏合膠層。換句話說，本實施例之光學膠層13同時具有基板功能及黏合功能。藉此，相較於傳統觸控裝置的架構，本實施例之觸控裝置100可大量減少整體厚度，有利於製造薄化的觸控裝置100。According to one of the features of the embodiment, the optical adhesive layer 13 serves as a substrate of the second electrode layer 14 (or as a spacer material) instead of a conventional transparent substrate (for example, glass, PET, etc.) and an adhesive layer. In other words, the optical adhesive layer 13 of the present embodiment has both a substrate function and a bonding function. Therefore, the touch device 100 of the present embodiment can reduce the overall thickness in a large amount, which is advantageous for manufacturing the thin touch device 100.
於第二電極層14之上，藉由膠合層15將第二電極層14與覆蓋 層16予以黏合。膠合層15的材質可為(固態)光學膠(OCA)或者(液態)光學樹脂(optically-clear resin,OCR)。覆蓋層16可為平面的二維覆蓋層，也可為曲面的三維覆蓋層。覆蓋層16的材質可為高透光率的絕緣材料，例如玻璃、聚碳酸酯(Polycarbonate,PC)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚甲基丙烯酸甲酯(Polymethyl methacrylate,PMMA)或環烯烴共聚合物(Cyclic olefin copolymer,COC)，但不限定於此。On the second electrode layer 14, the second electrode layer 14 is covered by the glue layer 15 Layer 16 is bonded. The material of the glue layer 15 may be (solid) optical adhesive (OCA) or (liquid) optically-clear resin (OCR). The cover layer 16 can be a planar two-dimensional cover layer or a three-dimensional cover layer of a curved surface. The material of the cover layer 16 can be a high transmittance insulating material such as glass, polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (Polymethyl). Methacrylate, PMMA) or Cyclic olefin copolymer (COC), but is not limited thereto.
第一圖所示的觸控裝置100僅顯示第一實施例的主要組成層級，熟悉該技術領域者可根據應用需求而加入其他層級，例如，可於第一電極層12與光學膠層13之間，或者於第二電極層14與膠合層15之間視需要加入其他層級，以增加其他功能。The first embodiment is shown in FIG. Other levels may be added between the second electrode layer 14 and the glue layer 15 as needed to add other functions.
第二A圖顯示本創作第二實施例之觸控裝置200的剖視圖。與第一圖(第一實施例)相同的組成以相同元件符號來表示，其相關說明不再贅述。如第二A圖所示，本實施例使用第一光學膠層21與第一電極層22來取代第一圖(第一實施例)的透明基板11與第一電極層12。在本實施例中，第一光學膠層21與第一電極層22係為一種可轉印透明導電膜(TCTF)。本實施例之第一光學膠層21的厚度大於50微米。第一電極層22的材質可為非透明導電材料，例如奈米金屬線(metal nanowire)，例如奈米銀線或奈米銅線；或者奈米金屬網(metal nanonet)，例如奈米銀網或奈米銅網。FIG. 2A is a cross-sectional view showing the touch device 200 of the second embodiment of the present invention. The same components as those of the first figure (first embodiment) are denoted by the same reference numerals, and the related description will not be repeated. As shown in FIG. 2A, the first optical layer 21 and the first electrode layer 22 are used in place of the transparent substrate 11 and the first electrode layer 12 of the first figure (first embodiment). In the embodiment, the first optical adhesive layer 21 and the first electrode layer 22 are a transferable transparent conductive film (TCTF). The thickness of the first optical adhesive layer 21 of this embodiment is greater than 50 microns. The material of the first electrode layer 22 may be a non-transparent conductive material, such as a metal nanowire, such as a nano silver wire or a nano copper wire; or a metal nanonet, such as a nano silver mesh. Or nano copper mesh.
根據本實施例的特徵之一，除了以(第二)光學膠層13作為第二電極層14的基板，取代傳統透明基板及黏合膠層，本實施例更以第一光學膠層21作為第一電極層22的基板，取代傳統透明基板(例如第一圖之透明基板11)。藉此，本實施例之觸控裝置200的整體厚度更小於第一實施例(第一圖)的觸控裝置100。此外，由於本實施例的電極層22/14皆貼附於光學膠 層21/13，因此觸控裝置200的製作屬於低溫製程。According to one of the features of the embodiment, in addition to the (second) optical adhesive layer 13 as the substrate of the second electrode layer 14, instead of the conventional transparent substrate and the adhesive layer, the first optical adhesive layer 21 is used as the first embodiment. The substrate of an electrode layer 22 replaces a conventional transparent substrate (for example, the transparent substrate 11 of the first figure). Therefore, the overall thickness of the touch device 200 of the present embodiment is smaller than that of the touch device 100 of the first embodiment (first figure). In addition, since the electrode layers 22/14 of the embodiment are attached to the optical adhesive The layer 21/13 is such that the fabrication of the touch device 200 is a low temperature process.
本實施例之第一光學膠層21的底部還可包含離形(release)層23，當離形層23被剝離後，可將觸控裝置200直接貼附於其他裝置，例如液晶模組(LCM)201，如第二B圖所示，以形成觸控顯示器。The bottom of the first optical adhesive layer 21 of the embodiment may further include a release layer 23, and when the release layer 23 is peeled off, the touch device 200 may be directly attached to other devices, such as a liquid crystal module ( LCM) 201, as shown in FIG. B, to form a touch display.
第三A圖顯示本創作第三實施例之觸控裝置300的剖視圖。與第二A圖(第二實施例)相同的組成以相同元件符號來表示，其相關說明不再贅述。如第三A圖所示，本實施例的第二電極層14直接貼附於第一電極層22的頂面，而第二光學膠層13則黏合至覆蓋層16，因而省略了第二A圖的膠合層15，藉此，本實施例之觸控裝置300的整體厚度更小於第二實施例(第二A圖)的觸控裝置200。FIG. 3A is a cross-sectional view showing the touch device 300 of the third embodiment of the present invention. The same components as those of the second A diagram (second embodiment) are denoted by the same reference numerals, and the related description will not be repeated. As shown in FIG. 3A, the second electrode layer 14 of the present embodiment is directly attached to the top surface of the first electrode layer 22, and the second optical adhesive layer 13 is bonded to the cover layer 16, thereby omitting the second A. The entire thickness of the touch device 300 of the present embodiment is smaller than that of the touch device 200 of the second embodiment (second A).
本實施例之第一光學膠層21的底部還可包含離形層23，當離形層23被剝離後，可將觸控裝置300直接貼附於其他裝置，例如液晶模組(LCM)201，如第三B圖所示，以形成觸控顯示器。The bottom of the first optical adhesive layer 21 of the embodiment may further include a release layer 23. When the release layer 23 is peeled off, the touch device 300 may be directly attached to other devices, such as a liquid crystal module (LCM) 201. As shown in the third B, to form a touch display.
以上所述僅為本創作之較佳實施例而已，並非用以限定本創作之申請專利範圍；凡其它未脫離創作所揭示之精神下所完成之等效改變或修飾，均應包含在下述之申請專利範圍內。The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention; any equivalent changes or modifications made without departing from the spirit of the disclosure should be included in the following Within the scope of the patent application.
100‧‧‧觸控裝置100‧‧‧ touch device
11‧‧‧透明基板11‧‧‧Transparent substrate
12‧‧‧第一電極層12‧‧‧First electrode layer
13‧‧‧光學膠層13‧‧‧Optical adhesive layer
14‧‧‧第二電極層14‧‧‧Second electrode layer
15‧‧‧膠合層15‧‧‧Glued layer
16‧‧‧覆蓋層16‧‧‧ Coverage
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI566148B (en) * | 2015-07-11 | 2017-01-11 | 宸新科技（廈門）有限公司 | A touch panel and fabricating method thereof |
| CN108227987A (en) * | 2017-12-29 | 2018-06-29 | 业成科技（成都）有限公司 | Promote the touch panel application of a surface component of touch-control performance |
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2013
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI566148B (en) * | 2015-07-11 | 2017-01-11 | 宸新科技（廈門）有限公司 | A touch panel and fabricating method thereof |
| CN108227987A (en) * | 2017-12-29 | 2018-06-29 | 业成科技（成都）有限公司 | Promote the touch panel application of a surface component of touch-control performance |
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