TWI485590B - Touch panel and manufacturing method thereof - Google Patents
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本發明是有關於一種面板及其製造方法，且特別是關於一種觸控面板及其製造方法。The present invention relates to a panel and a method of fabricating the same, and more particularly to a touch panel and a method of fabricating the same.
隨著資訊技術、無線行動通訊和資訊家電的快速發展與應用，為了達到攜帶便利、體積輕巧化以及操作人性化的目的，許多資訊產品已由傳統之鍵盤或滑鼠等輸入裝置，轉變為使用觸碰面板作為輸入裝置。With the rapid development and application of information technology, wireless mobile communication and information appliances, many information products have been transformed from traditional keyboards or mouse input devices to use for the convenience of portability, light weight and user-friendly operation. Touch the panel as an input device.
目前，觸控面板大致可區分為電阻式、電容式、紅外線式及超音波式等觸控面板，其中以電阻式觸控面板與電容式觸控面板為最常見的產品。就電容式觸控面板而言，可多點觸控的特性提供更人性化的操作模式而使得電容式觸控面板受到市場的青睞。Currently, touch panels can be roughly classified into resistive, capacitive, infrared, and ultrasonic touch panels. Among them, resistive touch panels and capacitive touch panels are the most common products. In the case of a capacitive touch panel, the multi-touch feature provides a more user-friendly operation mode, and the capacitive touch panel is favored by the market.
一般而言，電容式觸控面板是藉由使用者透過手指或導電物件觸碰電容式觸控面板所造成之電容值的改變去偵測手指或導電物件的觸碰位置。進一步而言，電容式觸控面板通常具有彼此電性絕緣的第一導電層以及第二導電層。在使用者未觸碰觸控面板下，導電層之間具有一電容初始值。而當使用者觸碰觸控面板時，導電層之間會產生電容值的改變，因而改變原本的電容初始值。此時，則能藉由判別改變的電容值之位置去判定使用者觸碰的位置。In general, a capacitive touch panel detects a touch position of a finger or a conductive object by a change in a capacitance value caused by a user touching a capacitive touch panel through a finger or a conductive object. Further, the capacitive touch panel generally has a first conductive layer and a second conductive layer that are electrically insulated from each other. When the user does not touch the touch panel, there is an initial value of capacitance between the conductive layers. When the user touches the touch panel, a change in the capacitance value occurs between the conductive layers, thereby changing the original capacitance initial value. At this time, it is possible to determine the position touched by the user by discriminating the position of the changed capacitance value.
目前市面上的觸控面板大多是以銦錫氧化物(Indium Tin Oxide,ITO)作為第一導電層以及第二導電層的材料。然而，銦為稀有物質，其除了易受限於出產地而造成材料取得上的不易之外，其價格亦相對昂貴，使得觸控面板的製程成本無法降低，而不利於商業上的競爭。Currently, touch panels on the market are mostly indium tin oxide (Indium). Tin Oxide, ITO) is used as the material of the first conductive layer and the second conductive layer. However, indium is a rare substance, and its price is relatively expensive in addition to being easily limited by the place of production. The price of the touch panel cannot be reduced, which is unfavorable for commercial competition.
本發明提供一種觸控面板，其具有相對低廉的製程成本。The invention provides a touch panel which has a relatively low process cost.
本發明提供一種觸控面板的製造方法，其可製造出製程成本相對低廉的觸控面板。The invention provides a method for manufacturing a touch panel, which can manufacture a touch panel with relatively low process cost.
本發明一實施例提供一種觸控面板，包括基板、第一導電層、第一絕緣層以及第二導電層。第一導電層配置於基板上。第一絕緣層配置於第一導電層上，且第一導電層位於第一絕緣層與基板之間。第二導電層配置於第一絕緣層上，且第一絕緣層位於第二導電層與該第一導電層之間，其中第二導電層的材料為奈米銀。An embodiment of the invention provides a touch panel including a substrate, a first conductive layer, a first insulating layer, and a second conductive layer. The first conductive layer is disposed on the substrate. The first insulating layer is disposed on the first conductive layer, and the first conductive layer is located between the first insulating layer and the substrate. The second conductive layer is disposed on the first insulating layer, and the first insulating layer is located between the second conductive layer and the first conductive layer, wherein the material of the second conductive layer is nano silver.
在本發明之一實施例中，前述之第一導電層的材料為金屬氧化物、奈米銀、奈米碳管(Carbon Nano Tube,CNT)、石墨烯或高分子導電材料。In an embodiment of the invention, the material of the first conductive layer is a metal oxide, a nano silver, a carbon nanotube (CNT), a graphene or a polymer conductive material.
在本發明之一實施例中，前述之第一絕緣層的材料為無機材料、有機材料或上述之組合。In an embodiment of the invention, the material of the first insulating layer is an inorganic material, an organic material or a combination thereof.
在本發明之一實施例中，前述之第一絕緣層的材料為聚乙烯(PE)、聚丙烯(PP)、聚苯乙烯(PS)、聚甲基丙烯酸甲酯(PMMA)、聚氯乙烯(PVC)、尼龍(Nylon)、 聚碳酸酯(PC)、聚氨酯(PU)、聚四氟乙烯(PTFE)或聚對苯二甲酸乙二酯(PET)。In an embodiment of the invention, the material of the first insulating layer is polyethylene (PE), polypropylene (PP), polystyrene (PS), polymethyl methacrylate (PMMA), polyvinyl chloride. (PVC), nylon (Nylon), Polycarbonate (PC), polyurethane (PU), polytetrafluoroethylene (PTFE) or polyethylene terephthalate (PET).
在本發明之一實施例中，前述之觸控面板更包括第一黏著層位於第一絕緣層與第一導電層之間。In an embodiment of the invention, the touch panel further includes a first adhesive layer between the first insulating layer and the first conductive layer.
在本發明之一實施例中，前述之觸控面板更包括第二絕緣層以及第二黏著層。第二絕緣層位於第一導電層與基板之間。第二黏著層位於第二絕緣層與基板之間。In an embodiment of the invention, the touch panel further includes a second insulating layer and a second adhesive layer. The second insulating layer is located between the first conductive layer and the substrate. The second adhesive layer is located between the second insulating layer and the substrate.
在本發明之一實施例中，前述之基板的材料為玻璃、石英、有機聚合物或高分子材料。In an embodiment of the invention, the material of the substrate is glass, quartz, organic polymer or polymer material.
在本發明之一實施例中，前述之觸控面板更包括黑矩陣圖案配置於基板上，基板具有觸控區以及鄰接觸控區的週邊區，且週邊區被黑矩陣圖案所覆蓋，而觸控區未被黑矩陣圖案所覆蓋，且黑矩陣圖案鄰近觸控區的一側的部份區域位於第一導電層與基板之間。In an embodiment of the invention, the touch panel further includes a black matrix pattern disposed on the substrate, the substrate has a touch area and a peripheral area adjacent to the touch area, and the peripheral area is covered by the black matrix pattern. The control region is not covered by the black matrix pattern, and a portion of the black matrix pattern adjacent to one side of the touch region is located between the first conductive layer and the substrate.
在本發明之一實施例中，前述之觸控面板更包括多條金屬走線位於黑矩陣圖案上，並電性連接於第一導電層或第二導電層。In an embodiment of the invention, the touch panel further includes a plurality of metal traces on the black matrix pattern and electrically connected to the first conductive layer or the second conductive layer.
在本發明之一實施例中，前述之觸控面板更包括蓋板以及黑矩陣圖案。蓋板配置於基板的對向。黑矩陣圖案位於蓋板與基板之間。基板具有觸控區以及鄰接觸控區的週邊區，且週邊區被黑矩陣圖案所覆蓋，而觸控區未被黑矩陣圖案所覆蓋。In an embodiment of the invention, the touch panel further includes a cover plate and a black matrix pattern. The cover plate is disposed opposite to the substrate. The black matrix pattern is located between the cover and the substrate. The substrate has a touch area and a peripheral area adjacent to the touch area, and the peripheral area is covered by the black matrix pattern, and the touch area is not covered by the black matrix pattern.
本發明一實施例提供一種觸控面板的製造方法，包括下述步驟。提供一基板。於基板上形成第一導電層。於第 一導電層上形成第一絕緣層，且第一導電層位於第一絕緣層與基板之間。於第一絕緣層上形成第二導電層，且第一絕緣層位於第二導電層與第一導電層之間，其中第二導電層的材料為奈米銀。An embodiment of the invention provides a method for manufacturing a touch panel, which includes the following steps. A substrate is provided. A first conductive layer is formed on the substrate. Yu Di A first insulating layer is formed on a conductive layer, and the first conductive layer is located between the first insulating layer and the substrate. A second conductive layer is formed on the first insulating layer, and the first insulating layer is located between the second conductive layer and the first conductive layer, wherein the material of the second conductive layer is nano silver.
在本發明之一實施例中，前述之第一導電層的材料為金屬氧化物、奈米銀、奈米碳管、石墨烯或高分子導電材料。In an embodiment of the invention, the material of the first conductive layer is a metal oxide, a nano silver, a carbon nanotube, a graphene or a polymer conductive material.
在本發明之一實施例中，前述之第一絕緣層的材料為無機材料、有機材料或上述之組合。In an embodiment of the invention, the material of the first insulating layer is an inorganic material, an organic material or a combination thereof.
在本發明之一實施例中，前述之第一絕緣層的材料為聚乙烯、聚丙烯、聚苯乙烯、聚甲基丙烯酸甲酯、聚氯乙烯、尼龍、聚碳酸酯、聚氨酯、聚四氟乙烯或聚對苯二甲酸乙二酯。In an embodiment of the invention, the material of the first insulating layer is polyethylene, polypropylene, polystyrene, polymethyl methacrylate, polyvinyl chloride, nylon, polycarbonate, polyurethane, polytetrafluoroethylene. Ethylene or polyethylene terephthalate.
在本發明之一實施例中，前述在第一絕緣層上形成第二導電層之後，以及在第一導電層上形成第一絕緣層之前更包括於第一絕緣層上形成第一黏著層，且第一絕緣層透過第一黏著層而固定於第一導電層上。In an embodiment of the present invention, after the forming the second conductive layer on the first insulating layer, and forming the first insulating layer on the first conductive layer, forming a first adhesive layer on the first insulating layer, And the first insulating layer is fixed on the first conductive layer through the first adhesive layer.
在本發明之一實施例中，前述在基板上形成第一導電層的方法更包括下述步驟。於第二絕緣層上形成第一導電層。於第二絕緣層上相對於第一導電層的表面形成第二黏著層。將第二黏著層固定於基板上。In an embodiment of the invention, the foregoing method of forming a first conductive layer on a substrate further comprises the following steps. Forming a first conductive layer on the second insulating layer. A second adhesive layer is formed on the second insulating layer with respect to a surface of the first conductive layer. The second adhesive layer is fixed on the substrate.
在本發明之一實施例中，前述之基板的材料為玻璃、石英、有機聚合物或高分子材料。In an embodiment of the invention, the material of the substrate is glass, quartz, organic polymer or polymer material.
在本發明之一實施例中，前述於基板上形成第一導電 層之前，更包括於基板上形成黑矩陣圖案。基板具有觸控區以及鄰接觸控區的週邊區，且週邊區被黑矩陣圖案所覆蓋，而觸控區未被黑矩陣圖案所覆蓋。In an embodiment of the invention, the first conductive layer is formed on the substrate Before the layer, a black matrix pattern is further formed on the substrate. The substrate has a touch area and a peripheral area adjacent to the touch area, and the peripheral area is covered by the black matrix pattern, and the touch area is not covered by the black matrix pattern.
在本發明之一實施例中，前述之觸控面板的製造方法更包括於黑矩陣圖案上形成多條金屬走線。這些金屬走線電性連接於第一導電層或第二導電層。In an embodiment of the invention, the method for manufacturing the touch panel further includes forming a plurality of metal traces on the black matrix pattern. The metal traces are electrically connected to the first conductive layer or the second conductive layer.
在本發明之一實施例中，前述之觸控面板的製造方法更包括於蓋板上形成黑矩陣圖案以及將基板與蓋板接合。黑矩陣圖案位於蓋板與基板之間。基板具有觸控區以及鄰接觸控區的週邊區，且週邊區被黑矩陣圖案所覆蓋，而觸控區未被黑矩陣圖案所覆蓋。In an embodiment of the invention, the method for manufacturing a touch panel further includes forming a black matrix pattern on the cover plate and bonding the substrate to the cover plate. The black matrix pattern is located between the cover and the substrate. The substrate has a touch area and a peripheral area adjacent to the touch area, and the peripheral area is covered by the black matrix pattern, and the touch area is not covered by the black matrix pattern.
在本發明之一實施例中，前述將基板與蓋板接合的方法包括使基板透過第三黏著層而固定於蓋板上。In one embodiment of the invention, the method of joining the substrate to the cover plate includes attaching the substrate to the cover plate through the third adhesive layer.
基於上述，本發明以奈米銀作為第二導電層的材料。由於奈米銀在材料取得上相對容易，且價格相對低廉。因此，本發明可製造出製程成本相對低廉的觸控面板。Based on the above, the present invention uses nanosilver as the material of the second conductive layer. Because nano silver is relatively easy to obtain in materials, and the price is relatively low. Therefore, the present invention can manufacture a touch panel having a relatively low process cost.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1A至圖1C為本發明一實施例之觸控面板的製作流程剖面示意圖。請參照圖1A，提供基板110。基板110的材質例如為透明材質。此處，透明材質泛指一般具備高穿透率之材質，而非用以限定穿透率為100%之材質。1A to FIG. 1C are schematic cross-sectional views showing a manufacturing process of a touch panel according to an embodiment of the invention. Referring to FIG. 1A, a substrate 110 is provided. The material of the substrate 110 is, for example, a transparent material. Here, a transparent material generally refers to a material that generally has a high transmittance, and is not a material that defines a transmittance of 100%.
此外，基板110可選用硬質基板或是可撓基板。詳言之，基板110的材料可以是玻璃、石英、有機聚合物、高分子材料或其它合適的材料。高分子材料例如是聚乙烯、聚丙烯、聚苯乙烯、聚甲基丙烯酸甲酯、聚氯乙烯、尼龍、聚碳酸酯、聚氨酯、聚四氟乙烯、聚對苯二甲酸乙二酯等材料。應用所述可撓基板所形成之觸控面板可具有撓曲性，因而適於應用在撓曲表面或是任何需要觸控功能的可撓曲物件上，例如是顯示面板。In addition, the substrate 110 may be a rigid substrate or a flexible substrate. In detail, the material of the substrate 110 may be glass, quartz, organic polymer, polymer material or other suitable material. The polymer material is, for example, polyethylene, polypropylene, polystyrene, polymethyl methacrylate, polyvinyl chloride, nylon, polycarbonate, polyurethane, polytetrafluoroethylene, polyethylene terephthalate or the like. The touch panel formed by applying the flexible substrate can have flexibility and is therefore suitable for application on a flexural surface or any flexible object that requires a touch function, such as a display panel.
於基板110上形成第一導電層120。在本實施例中，形成第一導電層120的方法例如是於基板110上形成第一導電材料(即第一導電層120的材料)，並圖案化第一導電材料，而形成第一導電層120。A first conductive layer 120 is formed on the substrate 110. In this embodiment, the method of forming the first conductive layer 120 is, for example, forming a first conductive material (ie, a material of the first conductive layer 120) on the substrate 110, and patterning the first conductive material to form a first conductive layer. 120.
第一導電層120的材料例如是透明導電材料。詳言之，第一導電材料120a可以是金屬氧化物、奈米銀、奈米碳管或、石墨希烯或導電高分子等材料。金屬氧化物例如是錫鎵氧化物、氧化鋅、氧化鋅鎵、銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物、銦鍺鋅氧化物、或選自於鈦、鋅、鋯、銻、銦、錫、鋁及矽等所構成之金屬氧化物群組中的其中一者、或者是上述至少二者之堆疊層。The material of the first conductive layer 120 is, for example, a transparent conductive material. In detail, the first conductive material 120a may be a metal oxide, a nano silver, a carbon nanotube, or a graphite or a conductive polymer. The metal oxide is, for example, tin gallium oxide, zinc oxide, zinc gallium oxide, indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium antimony zinc oxide, or selected from titanium and zinc. And one of a group of metal oxides composed of zirconium, hafnium, indium, tin, aluminum, and antimony, or a stacked layer of at least two of the foregoing.
在本實施例中，第一導電層120的材料例如是，但不限於，奈米銀。此外，於基板110上形成奈米銀的方法可以是直接塗佈或是濺鍍、蒸鍍等。在其他實施例中，第一導電層120的材料也可以是金屬氧化物、奈米碳管或高分子導電材料等具有高穿透率的導電材料。金屬氧化物例如 是銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物、銦鍺鋅氧化物、或選自於鈦、鋅、鋯、銻、銦、錫、鋁及矽等所構成之金屬氧化物群組中的其中一者、或者是上述至少二者之堆疊層。於基板上形成上述材料的方法為此領域中具有通常知識者所知悉，於此便不再贅述。此外，圖案化第一導電材料的方法例如包括微影製程及蝕刻製程，其中蝕刻製程可以是乾式蝕刻製程、濕式蝕刻製程或是其他適於圖案化第一導電材料的製程。In this embodiment, the material of the first conductive layer 120 is, for example, but not limited to, nano silver. Further, the method of forming nano silver on the substrate 110 may be direct coating or sputtering, evaporation, or the like. In other embodiments, the material of the first conductive layer 120 may also be a conductive material having high transmittance such as a metal oxide, a carbon nanotube or a polymer conductive material. Metal oxides such as It is composed of indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium antimony zinc oxide, or selected from the group consisting of titanium, zinc, zirconium, hafnium, indium, tin, aluminum, and antimony. One of the group of metal oxides or a stacked layer of at least two of the above. Methods of forming the above materials on a substrate are known to those of ordinary skill in the art and will not be described again. In addition, the method of patterning the first conductive material includes, for example, a lithography process and an etching process, wherein the etching process may be a dry etching process, a wet etching process, or other processes suitable for patterning the first conductive material.
請參照圖1B，於第一導電層120上形成第一絕緣層130，其中第一導電層120位於第一絕緣層130與基板110之間。在本實施例中，第一絕緣層130的材料可以是無機材料、有機材料或上述之組合。無機材料例如是氧化矽、氮化矽、氮氧化矽、矽鋁氧化物或上述至少二種材料的堆疊層。當然，凡是可以提供絕緣特性的材料都可以選擇性地應用於本實施例以製作第一絕緣層130。Referring to FIG. 1B , a first insulating layer 130 is formed on the first conductive layer 120 , wherein the first conductive layer 120 is located between the first insulating layer 130 and the substrate 110 . In this embodiment, the material of the first insulating layer 130 may be an inorganic material, an organic material, or a combination thereof. The inorganic material is, for example, ruthenium oxide, tantalum nitride, ruthenium oxynitride, ruthenium aluminum oxide or a stacked layer of at least two of the above materials. Of course, any material that can provide insulating properties can be selectively applied to the present embodiment to fabricate the first insulating layer 130.
請參照圖1C，於第一絕緣層130上形成第二導電層140，其中第一絕緣層130位於第二導電層140與第一導電層120之間，以使兩者電性絕緣。形成第二導電層140的方法例如是於第一絕緣層130上形成第二導電材料(即第二導電層140的材料)，並圖案化第二導電材料，而形成第二導電層140。Referring to FIG. 1C, a second conductive layer 140 is formed on the first insulating layer 130, wherein the first insulating layer 130 is located between the second conductive layer 140 and the first conductive layer 120 to electrically insulate the two. The method of forming the second conductive layer 140 is, for example, forming a second conductive material (ie, a material of the second conductive layer 140) on the first insulating layer 130, and patterning the second conductive material to form the second conductive layer 140.
在本實施例中，第二導電層140的材料為奈米銀。此外，於第一絕緣層130上形成奈米銀的方法可以是直接塗佈或是濺鍍、蒸鍍等。另外，圖案化第二導電材料的方法 例如包括微影製程及蝕刻製程，其中蝕刻製程可以是乾式蝕刻製程、濕式蝕刻製程或是其他適於圖案化第一導電材料的製程。於形成第二導電層140後，本實施例之觸控面板100即初步完成。In this embodiment, the material of the second conductive layer 140 is nano silver. In addition, the method of forming nano silver on the first insulating layer 130 may be direct coating or sputtering, evaporation, or the like. In addition, the method of patterning the second conductive material For example, the lithography process and the etching process may be performed, wherein the etching process may be a dry etching process, a wet etching process, or other processes suitable for patterning the first conductive material. After the second conductive layer 140 is formed, the touch panel 100 of the present embodiment is initially completed.
相較於銦，奈米銀在材料取得上相對容易，且價格相對低廉。因此，透過以奈米銀取代銦錫氧化物作為本實施例之第二導電層140及/或第一導電層120的材料，本實施例之觸控面板100可具有相對低廉的製程成本。此外，利用奈米銀所形成之觸控感測結構可改善銦錫氧化物濺鍍製程時覆蓋不良的問題，因此，可提升觸控面板100之良率。Compared to indium, nanosilver is relatively easy to obtain in materials and relatively inexpensive. Therefore, the touch panel 100 of the present embodiment can have a relatively low process cost by replacing the indium tin oxide with nano silver as the material of the second conductive layer 140 and/or the first conductive layer 120 of the present embodiment. In addition, the touch sensing structure formed by using the nano silver can improve the problem of poor coverage during the indium tin oxide sputtering process, and thus the yield of the touch panel 100 can be improved.
圖2A至圖2B為本發明另一實施例之觸控面板的製作流程剖面示意圖。請參照圖2A及圖2B，本實施例之觸控面板200與圖1C之觸控面板100具有相似的結構以及製程步驟。兩者的差異主要在於第一絕緣層及第二導電層形成於第一導電層上的方法。在本實施例中，觸控面板200的第一絕緣層210為絕緣的薄膜。舉例而言，第一絕緣層210可以是由聚乙烯、聚丙烯、聚苯乙烯、聚甲基丙烯酸甲酯、聚氯乙烯、尼龍、聚碳酸酯、聚氨酯、聚四氟乙烯或聚對苯二甲酸乙二酯等絕緣材質所形成之薄膜。2A-2B are schematic cross-sectional views showing a manufacturing process of a touch panel according to another embodiment of the present invention. Referring to FIG. 2A and FIG. 2B , the touch panel 200 of the present embodiment has a similar structure and process steps as the touch panel 100 of FIG. 1C . The difference between the two is mainly in the method in which the first insulating layer and the second conductive layer are formed on the first conductive layer. In the embodiment, the first insulating layer 210 of the touch panel 200 is an insulating film. For example, the first insulating layer 210 may be made of polyethylene, polypropylene, polystyrene, polymethyl methacrylate, polyvinyl chloride, nylon, polycarbonate, polyurethane, polytetrafluoroethylene or polyparaphenyl. A film formed of an insulating material such as ethylene formate.
此外，為了將上述絕緣的薄膜(第一絕緣層210)形成於第一導電層120上，本實施例之觸控面板200可進一步包括第一黏著層220位於第一絕緣層210與第一導電層120之間。詳言之，本實施例之觸控面板200的製造方法例如是包括如圖1A、圖2A、圖2B所示之步驟。In addition, in order to form the insulating film (the first insulating layer 210) on the first conductive layer 120, the touch panel 200 of the present embodiment may further include the first adhesive layer 220 located on the first insulating layer 210 and the first conductive layer. Between layers 120. In detail, the manufacturing method of the touch panel 200 of the present embodiment includes, for example, the steps shown in FIGS. 1A, 2A, and 2B.
請參照圖1A，於基板110上形成第一導電層120。具體的內容可參照圖1A對應之敘述，於此便不再贅述。Referring to FIG. 1A, a first conductive layer 120 is formed on the substrate 110. For details, refer to the description of FIG. 1A, and details are not described herein again.
請參照圖2A，於第一絕緣層210(絕緣的薄膜)上形成第二導電層140，並於第一絕緣層210相對於第二導電層140的表面上形成第一黏著層220。意即，第一黏著層220與第二導電層140分別位於第一絕緣層210的相對兩表面上。此外，第一黏著層220可以是光學膠(Optical Clear Adhesive,OCA)、感壓膠(Pressure Sensitive Adhesive)或紫外光水膠(Liquid Optically Clear Adhesive,LOCA又名OCR)。在本實施例中，第一黏著層220例如是光學膠，且第一黏著層220例如是全面性地塗佈於第一絕緣層210上。Referring to FIG. 2A, a second conductive layer 140 is formed on the first insulating layer 210 (insulating film), and a first adhesive layer 220 is formed on the surface of the first insulating layer 210 opposite to the second conductive layer 140. That is, the first adhesive layer 220 and the second conductive layer 140 are respectively located on opposite surfaces of the first insulating layer 210. In addition, the first adhesive layer 220 may be an Optical Clear Adhesive (OCA), a Pressure Sensitive Adhesive, or a Liquid Optically Clear Adhesive (LOCA). In the embodiment, the first adhesive layer 220 is, for example, an optical adhesive, and the first adhesive layer 220 is, for example, uniformly coated on the first insulating layer 210.
請參照圖2B，透過第一黏著層220而將第一絕緣層210固定於第一導電層140上。如此，即初步完成本實施例之觸控面板200。Referring to FIG. 2B , the first insulating layer 210 is fixed on the first conductive layer 140 through the first adhesive layer 220 . Thus, the touch panel 200 of the present embodiment is initially completed.
需說明的是，本實施例並不限定圖1A及圖2A的製作順序。在其他實施例中，圖1A及圖2A的製作順序可對調，又或者圖1A及圖2A的步驟可在不同的製程腔體內同時進行。It should be noted that this embodiment does not limit the fabrication sequence of FIGS. 1A and 2A. In other embodiments, the fabrication sequence of FIGS. 1A and 2A can be reversed, or the steps of FIGS. 1A and 2A can be performed simultaneously in different process chambers.
本實施例以奈米銀取代銦錫氧化物作為第二導電層140及/或第一導電層120的材料。因此，本實施例之觸控面板200可具有相對低廉的製程成本，且可改善銦錫氧化物濺鍍製程時覆蓋不良的問題，而提升觸控面板200之良率。In this embodiment, indium tin oxide is replaced by nano silver as the material of the second conductive layer 140 and/or the first conductive layer 120. Therefore, the touch panel 200 of the present embodiment can have a relatively low process cost, and can improve the problem of poor coverage during the indium tin oxide sputtering process, and improve the yield of the touch panel 200.
圖3A至圖3B為本發明再一實施例之觸控面板的製作流程剖面示意圖。請參照圖3A及圖3B，本實施例之觸控面板300與圖2B之觸控面板200具有相似的結構以及製程步驟。兩者的差異主要在於第一導電層形成於基板上的方法。此外，本實施例之觸控面板300更包括第二絕緣層310以及第二黏著層320。第二絕緣層310位於第一導電層120與基板110之間。第二黏著層320位於第二絕緣層310與基板110之間。3A-3B are schematic cross-sectional views showing a manufacturing process of a touch panel according to still another embodiment of the present invention. Referring to FIG. 3A and FIG. 3B , the touch panel 300 of the present embodiment has a similar structure and process steps as the touch panel 200 of FIG. 2B . The difference between the two is mainly in the method in which the first conductive layer is formed on the substrate. In addition, the touch panel 300 of the embodiment further includes a second insulating layer 310 and a second adhesive layer 320. The second insulating layer 310 is located between the first conductive layer 120 and the substrate 110. The second adhesive layer 320 is located between the second insulating layer 310 and the substrate 110.
詳言之，本實施例之觸控面板300的製造方法例如是包括如圖3A、圖2A、圖3B所示之步驟。請參照圖3A，於第二絕緣層310上形成第一導電層120。第二絕緣層310可以是由聚乙烯、聚丙烯、聚苯乙烯、聚甲基丙烯酸甲酯、聚氯乙烯、尼龍、聚碳酸酯、聚氨酯、聚四氟乙烯或聚對苯二甲酸乙二酯等絕緣材質所形成之薄膜。此外，於第二絕緣層310上相對於第一導電層120的表面形成第二黏著層320。意即，第二黏著層320與第一導電層120分別位於第二絕緣層310的相對兩表面上。另外，第二黏著層320可以是光學膠、感壓膠或紫外光水膠。在本實施例中，第二黏著層320例如是光學膠，且第二黏著層320例如是全面性地塗佈於第二絕緣層310上，以使第一導電層120透過第二黏著層320而固定於基板110上。In detail, the manufacturing method of the touch panel 300 of the present embodiment includes, for example, the steps shown in FIGS. 3A, 2A, and 3B. Referring to FIG. 3A, a first conductive layer 120 is formed on the second insulating layer 310. The second insulating layer 310 may be made of polyethylene, polypropylene, polystyrene, polymethyl methacrylate, polyvinyl chloride, nylon, polycarbonate, polyurethane, polytetrafluoroethylene or polyethylene terephthalate. A film formed by an insulating material. Further, a second adhesive layer 320 is formed on the second insulating layer 310 with respect to the surface of the first conductive layer 120. That is, the second adhesive layer 320 and the first conductive layer 120 are respectively located on opposite surfaces of the second insulating layer 310. In addition, the second adhesive layer 320 may be an optical glue, a pressure sensitive adhesive or an ultraviolet water gel. In the present embodiment, the second adhesive layer 320 is, for example, an optical adhesive, and the second adhesive layer 320 is, for example, uniformly coated on the second insulating layer 310, so that the first conductive layer 120 is transmitted through the second adhesive layer 320. It is fixed on the substrate 110.
請參照圖2A，於第一絕緣層210的相對兩表面上形成第一黏著層220與第二導電層140。具體的內容可參照圖2A對應之敘述，於此便不再贅述。Referring to FIG. 2A, a first adhesive layer 220 and a second conductive layer 140 are formed on opposite surfaces of the first insulating layer 210. The specific content can be referred to the corresponding description of FIG. 2A, and details are not described herein again.
請參照圖3A，使第二導電層140透過第一黏著層220而固定於第一導電層120上。如此，即初步完成本實施例之觸控面板300。Referring to FIG. 3A, the second conductive layer 140 is fixed to the first conductive layer 120 through the first adhesive layer 220. Thus, the touch panel 300 of the present embodiment is initially completed.
需說明的是，本實施例並不限定圖3A及圖2A的製作順序。在其他實施例中，圖3A及圖2A的製作順序可對調，又或者圖3A及圖2A的步驟可在不同的製程腔體內同時進行。It should be noted that this embodiment does not limit the production sequence of FIG. 3A and FIG. 2A. In other embodiments, the fabrication sequence of Figures 3A and 2A can be reversed, or the steps of Figures 3A and 2A can be performed simultaneously in different process chambers.
本實施例以奈米銀取代銦錫氧化物作為第二導電層140及/或第一導電層120的材料。因此，本實施例之觸控面板300可具有相對低廉的製程成本，且可改善銦錫氧化物濺鍍製程時覆蓋不良的問題，而提升觸控面板300之良率。In this embodiment, indium tin oxide is replaced by nano silver as the material of the second conductive layer 140 and/or the first conductive layer 120. Therefore, the touch panel 300 of the present embodiment can have a relatively low process cost, and can improve the problem of poor coverage during the indium tin oxide sputtering process, and improve the yield of the touch panel 300.
圖4為本發明又一實施例的上視示意圖，其中為便於繪示，圖4省略繪示觸控面板之部分膜層(例如絕緣層)。圖5為圖4中A-A’剖線的剖面示意圖。請參照圖4及圖5，本實施例之觸控面板400可採用前述觸控面板100、200、300之疊層結構。另外，本實施例之觸控面板400還可包括黑矩陣圖案BM、多條金屬走線410以及多個接墊420。FIG. 4 is a schematic top view of another embodiment of the present invention. For convenience of illustration, FIG. 4 omits a portion of a film layer (eg, an insulating layer) of the touch panel. Figure 5 is a cross-sectional view taken along line A-A' of Figure 4; Referring to FIG. 4 and FIG. 5 , the touch panel 400 of the present embodiment may adopt a stacked structure of the touch panels 100 , 200 , and 300 . In addition, the touch panel 400 of the embodiment may further include a black matrix pattern BM, a plurality of metal traces 410, and a plurality of pads 420.
詳言之，基板110具有觸控區A1以及鄰接觸控區A1的週邊區A2，且週邊區A2被黑矩陣圖案BM所覆蓋，而觸控區A1未被黑矩陣圖案BM所覆蓋。黑矩陣圖案BM的材料可包括樹脂(resin)、金屬、金屬氧化物或其他具有良好遮光效果與低反射特性的適當材質。In detail, the substrate 110 has a touch area A1 and a peripheral area A2 adjacent to the touch area A1, and the peripheral area A2 is covered by the black matrix pattern BM, and the touch area A1 is not covered by the black matrix pattern BM. The material of the black matrix pattern BM may include a resin, a metal, a metal oxide, or other suitable material having a good light-shielding effect and low reflection characteristics.
第一導電層120包括位於觸控區A1內的多個第一觸 控結構S1，而第二導電層140包括位於觸控區A1內的多個第二觸控結構S2。在本實施例中，這些第一觸控結構S1例如是沿方向X延伸，且沿垂直於方向X的方向Y排列，而這些第二觸控結構S2例如是沿方向Y延伸，且沿方向X排列。本發明不用以限定第一觸控結構S1以及第二觸控結構S2的形狀或排列方式。舉例而言，第一觸控結構S1以及第二觸控結構S2可以是條狀電極交錯而成，又或者是如圖4所示之感測結構。The first conductive layer 120 includes a plurality of first touches located in the touch area A1 The second conductive layer 140 includes a plurality of second touch structures S2 located in the touch area A1. In this embodiment, the first touch structures S1 extend, for example, in the direction X and are arranged in a direction Y perpendicular to the direction X, and the second touch structures S2 extend, for example, along the direction Y, and along the direction X. arrangement. The present invention does not need to limit the shape or arrangement of the first touch structure S1 and the second touch structure S2. For example, the first touch structure S1 and the second touch structure S2 may be staggered with strip electrodes or a sensing structure as shown in FIG. 4 .
進一步而言，本實施例之第一觸控結構S1包括多個菱形狀的感測墊122以及多個連接部124，其中連接部124連接相鄰兩個感測墊122，且各個第一觸控結構S1包括一個由觸控區A1延伸至週邊區A2的連接部124。第二觸控結構S2包括多個菱形狀的感測墊142以及多個連接部144，其中連接部144連接相鄰兩個感測墊142，且各個第二觸控結構S2包括一個由觸控區A1延伸至週邊區A2的連接部144。連接部124與連接部144彼此交錯且透過前述之第一絕緣層(未繪示)而彼此電性絕緣。換言之，前述之第一絕緣層(例如是第一絕緣層130)至少位於連接部124與連接部144之間。Further, the first touch structure S1 of the embodiment includes a plurality of diamond-shaped sensing pads 122 and a plurality of connecting portions 124, wherein the connecting portion 124 connects the adjacent two sensing pads 122, and each of the first touches The control structure S1 includes a connection portion 124 extending from the touch area A1 to the peripheral area A2. The second touch structure S2 includes a plurality of diamond-shaped sensing pads 142 and a plurality of connecting portions 144, wherein the connecting portion 144 is connected to the two adjacent sensing pads 142, and each of the second touch structures S2 includes a touch The area A1 extends to the connection portion 144 of the peripheral area A2. The connecting portion 124 and the connecting portion 144 are staggered with each other and electrically insulated from each other by the first insulating layer (not shown). In other words, the aforementioned first insulating layer (for example, the first insulating layer 130) is located at least between the connecting portion 124 and the connecting portion 144.
在本實施例中，接墊420例如是與第一觸控結構S1或第二觸控結構S2同時製作而成。意即，接墊420可以與第一觸控結構S1同屬第一導電層120，如此，接墊420可以是在圖案化第一導電材料(即第一導電層120的材料)時，與第一觸控結構S1同時製作而成。又或者，接墊420 可以與第二觸控結構S2同屬第二導電層140，如此，接墊420可以是在圖案化第二導電材料(即第二導電層140的材料)時，與第二觸控結構S2同時製作而成。In this embodiment, the pad 420 is fabricated at the same time as the first touch structure S1 or the second touch structure S2. That is, the pad 420 may be the same as the first touch structure S1, and thus the pad 420 may be when the first conductive material (ie, the material of the first conductive layer 120) is patterned. A touch structure S1 is simultaneously fabricated. Or alternatively, the pad 420 The second conductive layer 140 can be the same as the second touch structure S2. Thus, the pad 420 can be the same as the second touch structure S2 when the second conductive material (ie, the material of the second conductive layer 140) is patterned. Made.
金屬走線410例如是在形成第二導電層140之後形成。此外，金屬走線410可以是藉由濺鍍及蝕刻的方式形成，又或者，金屬走線410也可以是藉由網版印刷(screen printing)的方式形成。The metal trace 410 is formed, for example, after the second conductive layer 140 is formed. In addition, the metal traces 410 may be formed by sputtering and etching, or the metal traces 410 may be formed by screen printing.
各金屬走線410的一端由黑矩陣圖案BM延伸至其中一個接墊420上，且各金屬走線410的另一端由黑矩陣圖案BM延伸至其中一個延伸至週邊區A2的連接部124或延伸至週邊區A2的連接部144上，其中延伸至週邊區A2的連接部124的端部(或延伸至週邊區A2的連接部144的端部)位於所對應之金屬走線410與黑矩陣圖案BM之間(如圖5所示)。換言之，部分的金屬走線410將第一觸控結構S1與接墊420電性連接，且部分的金屬走線410將第二觸控結構S2與接墊420電性連接。因此，焊接於接墊420上的軟性電路板或晶片(未繪示)可傳遞或是接收來自於第一觸控結構S1以及第二觸控結構S2的訊號，進而藉由判別改變的電容值之位置去判定使用者觸碰的位置。在本實施例中，這些金屬走線410設置於週邊區A2內。因此，黑矩陣圖案BM可遮蔽這些不透光的金屬走線410，而避免使用者直接看到週邊區A2內的線路，進而增加觸控面板400的美觀。One end of each metal trace 410 extends from the black matrix pattern BM to one of the pads 420, and the other end of each metal trace 410 extends from the black matrix pattern BM to one of the connections 124 extending to the peripheral area A2 or extending. To the connection portion 144 of the peripheral area A2, wherein the end portion of the connection portion 124 extending to the peripheral area A2 (or the end portion of the connection portion 144 extending to the peripheral area A2) is located at the corresponding metal trace 410 and the black matrix pattern Between BM (as shown in Figure 5). In other words, a portion of the metal traces 410 electrically connect the first touch structure S1 and the pads 420, and a portion of the metal traces 410 electrically connect the second touch structure S2 to the pads 420. Therefore, the flexible circuit board or the chip (not shown) soldered to the pad 420 can transmit or receive signals from the first touch structure S1 and the second touch structure S2, thereby discriminating the changed capacitance value. The position is used to determine the location touched by the user. In the present embodiment, these metal traces 410 are disposed in the peripheral region A2. Therefore, the black matrix pattern BM can shield the opaque metal traces 410, and the user can directly see the lines in the peripheral area A2, thereby increasing the aesthetics of the touch panel 400.
在本實施例中，黑矩陣圖案BM例如是形成在第一導 電層120之前。也就是說，於基板110上形成第一導電層120之前，更包括於基板110上形成黑矩陣圖案BM。In this embodiment, the black matrix pattern BM is formed, for example, in the first guide. Before the electrical layer 120. That is to say, before the first conductive layer 120 is formed on the substrate 110, the black matrix pattern BM is further formed on the substrate 110.
在其他實施例中，如圖6A至圖6C所示，觸控面板還可進一步地包括蓋板150以及第三黏著層160，其中黑矩陣圖案BM位於蓋板150與基板110之間。在圖6A至圖6C的實施例中，基板110位於第二導電層140與蓋板150之間，意即，觸控元件(包括第一導電層120與第二導電層140)與黑矩陣圖案BM位於基板110的相對兩側，但本發明不限於此。在其他未繪示的實施例中，觸控元件(包括第一導電層120與第二導電層140)與黑矩陣圖案BM也可以是位於基板110的同一側。In other embodiments, as shown in FIG. 6A to FIG. 6C , the touch panel may further include a cover plate 150 and a third adhesive layer 160 , wherein the black matrix pattern BM is located between the cover plate 150 and the substrate 110 . In the embodiment of FIG. 6A to FIG. 6C, the substrate 110 is located between the second conductive layer 140 and the cover 150, that is, the touch element (including the first conductive layer 120 and the second conductive layer 140) and the black matrix pattern. The BMs are located on opposite sides of the substrate 110, but the invention is not limited thereto. In other embodiments not shown, the touch elements (including the first conductive layer 120 and the second conductive layer 140) and the black matrix pattern BM may also be located on the same side of the substrate 110.
蓋板150的材料可以是玻璃、石英、高分子材料或其它合適的材料。高分子材料例如是聚乙烯、聚丙烯、聚苯乙烯、聚甲基丙烯酸甲酯、聚氯乙烯、尼龍、聚碳酸酯、聚氨酯、聚四氟乙烯、聚對苯二甲酸乙二酯、聚醯亞胺或丙烯酸樹酯等材料。蓋板150以及前述之基板110若應用所述可撓基材，則可使所形成之觸控面板具有撓曲性，因而適於應用在撓曲表面或是任何需要觸控功能的可撓曲物件上。第三黏著層160可以是光學膠、感壓膠或紫外光水膠。The material of the cover plate 150 may be glass, quartz, a polymer material or other suitable material. The polymer material is, for example, polyethylene, polypropylene, polystyrene, polymethyl methacrylate, polyvinyl chloride, nylon, polycarbonate, polyurethane, polytetrafluoroethylene, polyethylene terephthalate, polyfluorene. Materials such as imine or acrylic resin. The cover plate 150 and the substrate 110 described above can apply the flexible substrate to make the formed touch panel flexible, and thus is suitable for use on a flexible surface or any flexible function requiring touch function. On the object. The third adhesive layer 160 may be an optical glue, a pressure sensitive adhesive or an ultraviolet water gel.
詳言之，黑矩陣圖案BM可以是形成在蓋板150上，再透過第三黏著層160將形成有黑矩陣圖案BM的蓋板與前述形成有第一導電層120及第二導電層140之基板110接合。如此，可避免在進行蝕刻製程時，特別是在乾式蝕 刻製程中，黑矩陣圖案被含氟氣體(fluoric-based)電漿破壞，而被腐蝕或形成表面凸起。是以，圖6A至圖6C實施例之觸控面板可選用較濕式蝕刻製程更為環保之乾式蝕刻製程來圖案化第一導電材料及第二導電材料。如此，可在保有黑矩陣圖案BM的完整性下，解決濕式蝕刻製程後的廢液處理問題。In detail, the black matrix pattern BM may be formed on the cap plate 150, and the cap plate on which the black matrix pattern BM is formed through the third adhesive layer 160 and the first conductive layer 120 and the second conductive layer 140 are formed. The substrate 110 is bonded. In this way, it is possible to avoid the etching process, especially in dry etching. In the engraving process, the black matrix pattern is destroyed by a fluorine-based plasma and is etched or surface-embedded. Therefore, the touch panel of the embodiment of FIG. 6A to FIG. 6C can select a more environmentally friendly dry etching process to pattern the first conductive material and the second conductive material. In this way, the waste liquid processing problem after the wet etching process can be solved while maintaining the integrity of the black matrix pattern BM.
此外，透過選用厚度相對薄的基板110或厚度相對薄的蓋板150，例如是厚度小於0.33，且較佳約為0.125毫米的基板110或蓋板150，則可使觸控面板具有相對薄的厚度。另外，基板110及蓋板150可選用可撓取的材質，如此，則可提升觸控面板的撓取性，進而使觸控面板適於應用在撓曲表面或是任何需要觸控功能的可撓曲物件上。In addition, by using a relatively thin substrate 110 or a relatively thin cover 150, such as a substrate 110 or a cover 150 having a thickness of less than 0.33, and preferably about 0.125 mm, the touch panel can be relatively thin. thickness. In addition, the substrate 110 and the cover plate 150 can be made of a flexible material, so that the flexibility of the touch panel can be improved, and the touch panel can be applied to a flexible surface or any touch function. Flex the object.
綜上所述，本發明以奈米銀作為第二導電層的材料。由於奈米銀在材料取得上相對容易，且價格相對低廉。因此，本發明可製造出製程成本相對低廉的觸控面板。In summary, the present invention uses nanosilver as the material of the second conductive layer. Because nano silver is relatively easy to obtain in materials, and the price is relatively low. Therefore, the present invention can manufacture a touch panel having a relatively low process cost.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100、200、300、400‧‧‧觸控面板100, 200, 300, 400‧‧‧ touch panels
110‧‧‧基板110‧‧‧Substrate
120‧‧‧第一導電層120‧‧‧First conductive layer
122、142‧‧‧感測墊122, 142‧‧‧ Sense pads
124、144‧‧‧連接部124, 144‧‧‧ Connections
130、210‧‧‧第一絕緣層130, 210‧‧‧ first insulation
140‧‧‧第二導電層140‧‧‧Second conductive layer
150‧‧‧蓋板150‧‧‧ cover
160‧‧‧第三黏著層160‧‧‧ third adhesive layer
220‧‧‧第一黏著層220‧‧‧First adhesive layer
310‧‧‧第二絕緣層310‧‧‧Second insulation
320‧‧‧第二黏著層320‧‧‧Second Adhesive Layer
410‧‧‧金屬走線410‧‧‧Metal routing
420‧‧‧接墊420‧‧‧ pads
BM‧‧‧黑矩陣圖案BM‧‧‧Black Matrix Pattern
A1‧‧‧觸控區A1‧‧‧ touch area
A2‧‧‧週邊區A2‧‧‧ surrounding area
S1‧‧‧第一觸控結構S1‧‧‧ first touch structure
S2‧‧‧第二觸控結構S2‧‧‧ second touch structure
X、Y‧‧‧方向X, Y‧‧ direction
A-A’‧‧‧剖線A-A’‧‧‧ cut line
圖1A至圖1C為本發明一實施例之觸控面板的製作流程剖面示意圖。1A to FIG. 1C are schematic cross-sectional views showing a manufacturing process of a touch panel according to an embodiment of the invention.
圖2A至圖2B為本發明另一實施例之觸控面板的製作 流程剖面示意圖。2A to 2B illustrate the fabrication of a touch panel according to another embodiment of the present invention; Schematic diagram of the process profile.
圖3A至圖3B為本發明再一實施例之觸控面板的製作流程剖面示意圖。3A-3B are schematic cross-sectional views showing a manufacturing process of a touch panel according to still another embodiment of the present invention.
圖4為本發明又一實施例的上視示意圖。4 is a top plan view of still another embodiment of the present invention.
圖5為圖4中A-A’剖線的剖面示意圖。Figure 5 is a cross-sectional view taken along line A-A' of Figure 4;
圖6A至圖6C為本發明其他實施例的剖面示意圖。6A to 6C are schematic cross-sectional views showing other embodiments of the present invention.
100‧‧‧觸控面板100‧‧‧ touch panel
110‧‧‧基板110‧‧‧Substrate
120‧‧‧第一導電層120‧‧‧First conductive layer
130‧‧‧第一絕緣層130‧‧‧First insulation
140‧‧‧第二導電層140‧‧‧Second conductive layer
Claims (21)
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| TW101148145A TWI485590B (en) | 2012-12-18 | 2012-12-18 | Touch panel and manufacturing method thereof |
| CN201310055355.6A CN103870076A (en) | 2012-12-18 | 2013-02-21 | Touch panel and manufacturing method thereof |
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| TW101148145A TWI485590B (en) | 2012-12-18 | 2012-12-18 | Touch panel and manufacturing method thereof |
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| TWI485590B true TWI485590B (en) | 2015-05-21 |
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| CN114489367A (en) * | 2020-11-13 | 2022-05-13 | 瀚宇彩晶股份有限公司 | Electronic device and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100530065C (en) * | 2006-04-20 | 2009-08-19 | 铼宝科技股份有限公司 | Transparent touch-control panel structure |
| TW201104540A (en) * | 2009-07-22 | 2011-02-01 | Ritdisplay Corp | Capacitive type touch sensor |
| TW201140199A (en) * | 2010-05-04 | 2011-11-16 | Wei-Chuan Chen | Manufacturing method of touch panel |
| CN202183092U (en) * | 2011-07-27 | 2012-04-04 | 北京京东方光电科技有限公司 | Resistive touch screen and touch control equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100530065C (en) * | 2006-04-20 | 2009-08-19 | 铼宝科技股份有限公司 | Transparent touch-control panel structure |
| TW201104540A (en) * | 2009-07-22 | 2011-02-01 | Ritdisplay Corp | Capacitive type touch sensor |
| TW201140199A (en) * | 2010-05-04 | 2011-11-16 | Wei-Chuan Chen | Manufacturing method of touch panel |
| CN202183092U (en) * | 2011-07-27 | 2012-04-04 | 北京京东方光电科技有限公司 | Resistive touch screen and touch control equipment |
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