TWM469475U - Heat-spreading board structure - Google Patents
Heat-spreading board structure Download PDFInfo
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- TWM469475U TWM469475U TW102212852U TW102212852U TWM469475U TW M469475 U TWM469475 U TW M469475U TW 102212852 U TW102212852 U TW 102212852U TW 102212852 U TW102212852 U TW 102212852U TW M469475 U TWM469475 U TW M469475U
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Description
一種均溫板結構，尤指一種可大幅降低製造成本的均溫板結構。
A uniform temperature plate structure, especially a temperature equalizing plate structure capable of greatly reducing manufacturing costs.
隨現行電子設備逐漸以輕薄作為標榜之訴求，故各項元件皆須隨之縮小其尺寸，但電子設備之尺寸縮小伴隨而來產生的熱變成電子設備與系統改善性能的主要障礙。無論形成電子元件的半導體尺寸不斷地縮小，仍持續地要求增加性能。
當半導體尺寸縮小，結果熱通量增加，熱通量增加所造成將產品冷卻的挑戰超過僅僅是全部熱的增加，因為熱通量的增加造成在不同時間和不同長度尺寸會過熱，可能導致電子故障或損毀。
故習知業者為解決上述習知技術因散熱空間狹小之問題，故以一種VC(Vapor chamber)Heat Sink置於chip上方作為散熱器使用，為了增加毛細極限，利用銅柱coating燒結、燒結柱、發泡柱等毛細結構用以支撐作為回流道，但由於微均溫板上下壁厚較薄(1.5mm以下應用)，利用上述此毛細結構作為支撐之習知結構於應用在微均溫板上，會造成該習知微均溫板在有銅柱、燒結柱或發泡柱之處才有支撐，而其餘未設有之處即形成塌限或凹陷，造成該微均溫板結構之整體平面度與強度無法維持，因此無法實現薄型化。
前述均溫板中之工作流體當由蒸發區域受熱域產生蒸發，工作流體由液態轉換為汽態，汽態之工作流體至均溫板之冷凝區域後由汽態冷凝轉化成為液態，再回流於蒸發區域繼續循環，均溫板之冷凝區域通常為光滑面，又或者為具有燒結之毛細結構態樣，汽態之工作流體在該冷凝區域冷凝成液態小水珠狀後，因重力或毛細結構之關係使得可回流至蒸發區域，但前述習知冷凝區域之結構由於係呈光滑面，致使冷凝後之液態水珠需儲至一定容積方才依重力垂滴，造成其回流效率實顯不足，且因液態工作流體回流速率過慢，使得蒸發區域中無工作流體而產生乾燒之狀態，令熱傳導效率大幅降低；若為加強工作流體之回流效率則增設毛細結構則為習知不可或缺之結構，但此一毛細結構(如燒結體或網格)之設置則令均溫板無法實現薄型化之功效。
薄型化熱板主要係透過蝕刻之方式於該板體開設溝槽做毛細結構或於板體上形成支撐結構，但由於蝕刻之缺點為精度不佳，以及加工時耗費時間，令薄型化熱板或均溫板製造成本無法降低。
With the current gradual appeal of electronic devices, all components must be reduced in size, but the heat generated by the shrinking of electronic devices has become a major obstacle to the improvement of performance of electronic devices and systems. Regardless of the ever-shrinking size of semiconductors forming electronic components, there is a continuing demand for increased performance.
As semiconductors shrink in size, the resulting heat flux increases, and the increase in heat flux causes the challenge of cooling the product more than just the increase in total heat, as the increase in heat flux causes overheating at different times and lengths, possibly leading to electrons. Failure or damage.
Therefore, in order to solve the above problem, the conventional manufacturer has a problem that the heat dissipation space is narrow. Therefore, a VC (Vapor chamber) Heat Sink is placed on the chip as a heat sink. In order to increase the capillary limit, a copper column is used for coating sintering and sintering. A capillary structure such as a foaming column is used as a backflow path, but since the thickness of the lower and lower walls of the micro-average temperature is thin (application of 1.5 mm or less), the conventional structure using the above-described capillary structure as a support is applied to the micro-average temperature plate. , which will cause the conventional micro-average temperature plate to have support in the presence of a copper column, a sintered column or a foaming column, and the remaining portions are not formed to form a collapse limit or a depression, resulting in the overall structure of the micro-average temperature plate. The flatness and strength cannot be maintained, so thinning cannot be achieved.
The working fluid in the above-mentioned temperature equalizing plate evaporates from the heated domain in the evaporation zone, and the working fluid is converted from the liquid state to the vapor state, and the working fluid in the vapor state is converted into a liquid state by vapor condensation and then refluxed. The evaporation zone continues to circulate, and the condensation zone of the temperature equalization plate is usually a smooth surface, or has a sintered capillary structure, and the vaporous working fluid condenses into a liquid small water droplet shape in the condensation zone, due to gravity or capillary structure. The relationship is such that the structure can be returned to the evaporation zone, but the structure of the conventional condensation zone is smooth, so that the liquid water droplets after condensation need to be stored to a certain volume before being dripped by gravity, resulting in insufficient reflux efficiency. Because the liquid working fluid reflux rate is too slow, there is no working fluid in the evaporation zone to produce a dry burning state, which greatly reduces the heat conduction efficiency; if the reflow efficiency of the working fluid is strengthened, the addition of the capillary structure is an indispensable structure. However, the setting of such a capillary structure (such as a sintered body or a mesh) makes it impossible to achieve a thinning effect on the temperature equalizing plate.
The thinned hot plate mainly adopts etching to form a capillary structure on the plate body to form a capillary structure or form a support structure on the plate body, but the shortcoming of the etching is poor precision, and the processing takes time, and the thinned hot plate is made. Or the production cost of the uniform temperature plate cannot be reduced.
爰此，為解決上述習知技術之缺點，本創作之主要目的，係提供一種可降低製造成本的均溫板結構。
為達上述目的本創作係提供一種均溫板結構，係包含：一本體、一凸部、一工作流體；
所述本體具有一冷凝區及一蒸發區及一腔室，所述冷凝區及該蒸發區分設於該腔室之兩側；所述凸部係選擇由該蒸發部或冷凝區其中任一凸起所構形；所述工作流體填充於前述腔室內。
透過本創作均溫板結構係可大幅降低均溫板之製造成本，並進一步可提升製造精度者。
Accordingly, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a uniform temperature plate structure which can reduce the manufacturing cost.
In order to achieve the above purpose, the present invention provides a temperature equalizing plate structure comprising: a body, a convex portion, and a working fluid;
The body has a condensation zone and an evaporation zone and a chamber, and the condensation zone and the evaporation zone are disposed on both sides of the cavity; the protrusions are selected by any one of the evaporation section or the condensation zone The configuration is configured; the working fluid is filled in the chamber.
Through the creation of the uniform temperature plate structure, the manufacturing cost of the temperature equalizing plate can be greatly reduced, and the manufacturing precision can be further improved.
11‧‧‧本體
11a‧‧‧第一板體
11b‧‧‧第二板體
111‧‧‧凸部
1111‧‧‧凸體
1111a‧‧‧自由端
2‧‧‧工作流體
3‧‧‧毛細結構
112‧‧‧冷凝區
113‧‧‧蒸發區
114‧‧‧腔室
11‧‧‧Ontology
11a‧‧‧First board
11b‧‧‧Second plate
111‧‧‧ convex
1111‧‧‧ convex
1111a‧‧‧Free end
2‧‧‧Working fluid
3‧‧‧Capillary structure
112‧‧‧Condensation zone
113‧‧‧Evaporation zone
114‧‧‧ chamber
第1圖係為本創作均溫板結構第一實施例之立體分解圖；
第2圖係為本創作均溫板結構第一實施例之立體組合圖；
第3圖係為本創作均溫板結構第一實施例之剖視圖；
第4圖係為本創作均溫板結構第二實施例之剖視圖；
第5圖係為本創作均溫板結構第三實施例之剖視圖；
第6圖係為本創作均溫板結構第四實施例之剖視圖。
Figure 1 is a perspective exploded view of the first embodiment of the creation of the uniform temperature plate structure;
2 is a three-dimensional combination diagram of the first embodiment of the creation of the uniform temperature plate structure;
Figure 3 is a cross-sectional view showing the first embodiment of the creation of the uniform temperature plate structure;
Figure 4 is a cross-sectional view showing a second embodiment of the creation of a uniform temperature plate structure;
Figure 5 is a cross-sectional view showing a third embodiment of the creation of the uniform temperature plate structure;
Fig. 6 is a cross-sectional view showing a fourth embodiment of the creation of the uniform temperature plate structure.
本創作之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。
請參閱第1、2、3圖，係為本創作均溫板結構第一實施例之立體分解及組合與剖視圖，如圖所示，所述均溫板結構，係包含：一本體11、一凸部111、一工作流體2；
所述本體11具有一冷凝區112及一蒸發區113及一腔室114，並所述本體11更具有一第一板體11a及一第二板體11b所述第一、二板體11a、11b對應蓋合並共同界定前述腔室114，所述冷凝區112設於該第一板體11a一側，該蒸發區113設於該第二板體11b一側，即所述冷凝區112及該蒸發區113分設於該腔室114之兩側並相互對應。
所述凸部111係選擇由該蒸發區113或冷凝區112其中任一或二者(蒸發區113、冷凝區112)都凸起所構形，本實施例之所述凸部111係具有複數凸體1111，該等凸體1111係由該蒸發區113向相反該蒸發區113之方向延伸所構成，並該凸體1111具有一自由端1111a，該自由端1111a與前述冷凝區112連接，該本體11相鄰該等凸體1111之周邊處係對應呈凹狀，本實施例之該等凸體1111係透過壓浮花法所成型，故該等凸體1111之另一側係呈平坦狀，該工作流體2係填充於前述腔室114內。
請參閱第4圖，係為本創作均溫板結構第二實施例之剖視圖，如圖所示，本實施例係與前述第一實施例部分結構技術特徵相同，故在此將不再贅述，惟本實例與前述第一實施例之不同處係為所述蒸發區113之複數凸體1111相對之另一側係呈凹狀。
請參閱第5圖，係為本創作均溫板結構第三實施例之剖視圖，如圖所示，本實施例係與前述第一實施例部分結構技術特徵相同，故在此將不再贅述，惟本實例與前述第一實施例之不同處係為所述凸部111係具有複數凸體1111，該等凸體1111係由該冷凝區112向相反該冷凝區112之方向延伸所構成，該本體11相鄰該等凸體1111之周邊處係對應呈凹狀。
請參閱第6圖，係為本創作均溫板結構第四實施例之剖視圖，如圖所示，本實施例係與前述第一、二、三實施例部分結構技術特徵相同，故在此將不再贅述，惟本實例與前述第一、二、三實施例之不同處係為所述本體11係為一扁狀管體。
前述各實施例中係更具有一毛細結構3，所述毛細結構3係設於前述腔室114表面，即該等凸體1111與該冷凝區112間具有前述毛細結構3。
The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
Please refer to the first, second and third figures, which are the three-dimensional decomposition and the combination and sectional view of the first embodiment of the creation of the temperature equalizing plate structure. As shown in the figure, the temperature equalizing plate structure comprises: a body 11 and a a convex portion 111, a working fluid 2;
The body 11 has a condensing area 112 and an evaporation area 113 and a chamber 114, and the body 11 further has a first plate body 11a and a second plate body 11b. The first and second plates 11a, 11b corresponds to the cover to jointly define the chamber 114, the condensation zone 112 is disposed on the side of the first plate body 11a, and the evaporation zone 113 is disposed on the side of the second plate body 11b, that is, the condensation zone 112 and the The evaporation zone 113 is disposed on both sides of the chamber 114 and corresponds to each other.
The convex portion 111 is selected to be convexly formed by either or both of the evaporation zone 113 or the condensation zone 112 (the evaporation zone 113 and the condensation zone 112). The convex part 111 of the embodiment has a plurality of a convex body 1111, the convex body 1111 is formed by extending the evaporation zone 113 in a direction opposite to the evaporation zone 113, and the convex body 1111 has a free end 1111a, and the free end 1111a is connected to the condensation zone 112. The protrusions 1111 are formed in a concave shape adjacent to the periphery of the protrusions 1111. The protrusions 1111 of the embodiment are formed by a pressure float method, so that the other side of the protrusions 1111 is flat. The working fluid 2 is filled in the chamber 114.
Referring to FIG. 4, it is a cross-sectional view of a second embodiment of the present invention. As shown in the figure, the present embodiment is identical to the technical features of the first embodiment, and therefore will not be described again. However, the difference between the present example and the first embodiment described above is that the other side of the plurality of convex bodies 1111 of the evaporation zone 113 is concave.
Referring to FIG. 5, it is a cross-sectional view of a third embodiment of the present invention. As shown in the figure, the present embodiment is identical to the structural features of the first embodiment, and therefore will not be described again. However, the difference between the present embodiment and the first embodiment is that the convex portion 111 has a plurality of convex bodies 1111, and the convex bodies 1111 are formed by extending the condensation region 112 in a direction opposite to the condensation region 112. The body 11 is adjacent to the periphery of the protrusions 1111 and has a concave shape.
Please refer to FIG. 6 , which is a cross-sectional view of a fourth embodiment of the creation of the temperature equalizing plate structure. As shown in the figure, the embodiment has the same technical features as the first, second and third embodiments, and therefore will be It will not be described again, but the difference between this example and the foregoing first, second and third embodiments is that the body 11 is a flat tube.
In the foregoing embodiments, a capillary structure 3 is further disposed. The capillary structure 3 is disposed on the surface of the chamber 114, that is, the capillary structure 3 is disposed between the protrusions 1111 and the condensation region 112.
11‧‧‧本體 11‧‧‧Ontology
11a‧‧‧第一板體 11a‧‧‧First board
11b‧‧‧第二板體 11b‧‧‧Second plate
111‧‧‧凸部 111‧‧‧ convex
1111‧‧‧凸體 1111‧‧‧ convex
1111a‧‧‧自由端 1111a‧‧‧Free end
2‧‧‧工作流體 2‧‧‧Working fluid
3‧‧‧毛細結構 3‧‧‧Capillary structure
112‧‧‧冷凝區 112‧‧‧Condensation zone
113‧‧‧蒸發區 113‧‧‧Evaporation zone
114‧‧‧腔室 114‧‧‧ chamber
Claims (9)
一本體，具有一冷凝區及一蒸發區及一腔室，所述冷凝區及該蒸發區分設於該腔室之兩側；
一凸部，係選擇由該蒸發區或冷凝區其中任一凸起所構形；
一工作流體，填充於前述腔室內。A uniform temperature plate structure comprising:
a body having a condensation zone and an evaporation zone and a chamber, the condensation zone and the evaporation zone being disposed on both sides of the cavity;
a convex portion selected to be configured by any one of the evaporation zone or the condensation zone;
A working fluid is filled in the chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102212852U TWM469475U (en) | 2013-07-08 | 2013-07-08 | Heat-spreading board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102212852U TWM469475U (en) | 2013-07-08 | 2013-07-08 | Heat-spreading board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM469475U true TWM469475U (en) | 2014-01-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102212852U TWM469475U (en) | 2013-07-08 | 2013-07-08 | Heat-spreading board structure |
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| Country | Link |
|---|---|
| TW (1) | TWM469475U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI801739B (en) * | 2019-10-31 | 2023-05-11 | 建準電機工業股份有限公司 | Temperature-uniformizing board and method for making the same |
-
2013
- 2013-07-08 TW TW102212852U patent/TWM469475U/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI801739B (en) * | 2019-10-31 | 2023-05-11 | 建準電機工業股份有限公司 | Temperature-uniformizing board and method for making the same |
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