TWM464807U - Wafer cleaning device - Google Patents
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- TWM464807U TWM464807U TW102208438U TW102208438U TWM464807U TW M464807 U TWM464807 U TW M464807U TW 102208438 U TW102208438 U TW 102208438U TW 102208438 U TW102208438 U TW 102208438U TW M464807 U TWM464807 U TW M464807U
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Abstract
Description
本新型關於半導體積體電路製造技術領域,尤其關於一種晶圓清洗裝置。The present invention relates to the field of semiconductor integrated circuit manufacturing technology, and more particularly to a wafer cleaning apparatus.
對於半導體產業而言,隨著半導體器件關鍵尺寸的不斷縮小以及新材料的引入,在半導體器件的製造過程中,對半導體基板如晶圓表面的潔淨度要求越來越嚴苛,同時,由於半導體器件關鍵尺寸的縮小使得清洗的工藝窗口變窄,進而使既要滿足基板清洗效率又要儘量減小基板表面刻損和結構損壞變得不那麽容易。而現如今,對於基板上的污染物的去除能力以及基板表面的刻損和結構損壞程度的要求越來越高,基板上的污染物如顆粒、有機物和金屬通常需要用化學反應或物理力作用來克服化學鍵的引力或物理粘附力從而被去除。For the semiconductor industry, as the critical dimensions of semiconductor devices continue to shrink and new materials are introduced, the cleanliness of semiconductor substrates such as wafer surfaces is becoming more stringent in the manufacturing process of semiconductor devices, and at the same time, due to semiconductors. The shrinking of the critical dimensions of the device narrows the process window for cleaning, which in turn makes it difficult to achieve substrate cleaning efficiency while minimizing substrate surface damage and structural damage. Nowadays, the requirements for the removal of contaminants on the substrate and the degree of damage and structural damage on the substrate surface are becoming higher and higher. Contaminants such as particles, organic matter and metals on the substrate usually require chemical reaction or physical force. To overcome the gravitational or physical adhesion of chemical bonds to be removed.
目前基板清洗仍以濕式清洗為主,濕式清洗通常分為槽式清洗和單片清洗兩種方式。槽式清洗能同時處理若干片基板,具有很高的清洗效率,然而,隨著半導體器件關鍵尺寸的縮小,槽式清洗已經越來越無法適應濕式清洗的要求。槽式清洗的最大缺點是污染物去除率受到一定的限制,這是因為即使在清洗中使用高純度的化學試劑與去離子水,從基板上清洗下來的污染物仍然存在於清洗 液中,會對基板造成二次污染。為了避免基板被二次污染,單片清洗正逐步取代槽式清洗,單片清洗能有效防止基板的二次污染。在基板的清洗過程中,新的化學試劑和去離子水不斷地供應到基板的表面,而用過的化學試劑與去離子水直接排出並被回收。此外,成品率也是轉型到單片清洗的一個重要因素,透過使用單片清洗可以有效提高100納米及以下工藝的成品率。與槽式清洗相比,單片清洗具有清洗效果好,清洗液回收率高,能有效防止交叉污染等優勢,不過產能相比槽式清洗而言比較低。At present, substrate cleaning is still mainly wet cleaning, and wet cleaning is usually divided into two types: slot cleaning and single chip cleaning. Trench cleaning can process several substrates at the same time, which has high cleaning efficiency. However, with the shrinking of critical dimensions of semiconductor devices, trench cleaning has become increasingly incapable of meeting the requirements of wet cleaning. The biggest disadvantage of tank cleaning is that the removal rate of contaminants is limited because even if high-purity chemicals and deionized water are used in the cleaning, the contaminants washed from the substrate still exist in the cleaning. In the liquid, it will cause secondary pollution to the substrate. In order to avoid secondary contamination of the substrate, single-chip cleaning is gradually replacing the tank cleaning, and single-chip cleaning can effectively prevent secondary contamination of the substrate. During the cleaning of the substrate, new chemical reagents and deionized water are continuously supplied to the surface of the substrate, and the used chemical reagent is directly discharged from the deionized water and recovered. In addition, the yield is an important factor in the transition to single-chip cleaning, which can effectively improve the yield of 100 nanometers and below through the use of single-chip cleaning. Compared with tank cleaning, single-chip cleaning has the advantages of good cleaning effect, high recovery rate of cleaning liquid, and can effectively prevent cross-contamination, but the production capacity is lower than that of tank cleaning.
在一些工藝中,為了獲得較佳的清洗效果,需要採用槽式清洗和單片清洗相結合的方式對基板進行清洗,而現有的槽式清洗裝置和單片清洗裝置是完全獨立分開的兩套裝置,基板在槽式清洗裝置中清洗並乾燥後,再放入單片清洗裝置中清洗和乾燥,從而導致清洗工藝週期長,清洗成本高,且兩套裝置佔用空間大。In some processes, in order to obtain a better cleaning effect, it is necessary to clean the substrate by a combination of trough cleaning and single-chip cleaning, and the existing trough cleaning device and the single-chip cleaning device are completely separate and separate. The device and the substrate are cleaned and dried in the trough cleaning device, and then placed in a single-chip cleaning device for cleaning and drying, thereby resulting in a long cleaning process cycle, high cleaning cost, and large space occupied by the two devices.
本新型的目的在於提供一種晶圓清洗裝置,該裝置不僅能夠對晶圓進行槽式清洗和單片清洗,而且該裝置能夠縮短晶圓清洗工藝週期,降低清洗成本,此外,該裝置佔用空間小。The purpose of the present invention is to provide a wafer cleaning device which can not only perform slot cleaning and single-chip cleaning of a wafer, but also can shorten the wafer cleaning process cycle and reduce the cleaning cost, and further, the device takes up less space. .
為達到上述目的,本新型提供的一種晶圓清洗裝置,包括:主體框架、晶圓裝載埠、晶圓傳送裝置、槽式清洗裝置及單片清洗裝置。晶圓裝載埠設置於主體框架的外側端,晶圓傳送裝置、槽式清洗裝置及單片清洗裝置 設置於主體框架內。晶圓裝載埠接收和放置晶圓盒,晶圓盒存放晶圓。槽式清洗裝置開設有用於傳送晶圓的第一晶圓進出口,槽式清洗裝置用於一片或多片晶圓的浸泡清洗。單片清洗裝置開設有用於傳送晶圓的第二晶圓進出口,單片清洗裝置用於單片晶圓的清洗和乾燥。晶圓傳送裝置在晶圓裝載埠的晶圓盒、槽式清洗裝置及單片清洗裝置之間傳送晶圓。To achieve the above object, the present invention provides a wafer cleaning apparatus comprising: a main body frame, a wafer loading cassette, a wafer transfer apparatus, a trough cleaning apparatus, and a single piece cleaning apparatus. The wafer loading cassette is disposed at the outer end of the main body frame, the wafer transfer device, the trough cleaning device and the single-chip cleaning device Set in the main frame. The wafer is loaded, the wafer cassette is received and placed, and the wafer cassette is used to store the wafer. The trough cleaning device is provided with a first wafer inlet and outlet for transferring wafers, and the trough cleaning device is used for immersion cleaning of one or more wafers. The single-chip cleaning device is provided with a second wafer inlet and outlet for transferring wafers, and the single-chip cleaning device is used for cleaning and drying a single wafer. The wafer transfer device transfers the wafer between the wafer cassette loaded with the wafer, the tank cleaning device, and the single wafer cleaning device.
綜上所述,本新型晶圓清洗裝置透過將槽式清洗裝置和單片清洗裝置集成於主體框架內,由一套晶圓傳送裝置完成晶圓的傳送,縮短了晶圓清洗工藝週期,降低了生產成本,且集成於一套裝置後佔用空間縮小。In summary, the novel wafer cleaning device integrates the trough cleaning device and the single-chip cleaning device into the main body frame, and the wafer transfer device completes the wafer transfer, thereby shortening the wafer cleaning process cycle and reducing The production cost is reduced and the footprint is reduced after being integrated into a set of devices.
110‧‧‧主體框架110‧‧‧ Mainframe
120‧‧‧晶圓裝載埠120‧‧‧ Wafer loading埠
130‧‧‧晶圓傳送裝置130‧‧‧ wafer transfer device
131‧‧‧傳送機械手131‧‧‧Transfer manipulator
131’‧‧‧傳送機械手131’‧‧‧Transfer manipulator
132‧‧‧溶液接收器132‧‧‧Solution Receiver
133‧‧‧機械手安裝台133‧‧‧manipulator mounting table
134‧‧‧機械手驅動裝置134‧‧‧Robot drive
135‧‧‧支架板135‧‧‧ bracket plate
136‧‧‧支座136‧‧‧Support
137‧‧‧限位塊137‧‧‧Limited blocks
138‧‧‧排液口138‧‧‧Draining port
140‧‧‧槽式清洗裝置140‧‧‧ trough cleaning device
140’‧‧‧槽式清洗裝置140'‧‧‧ trough cleaning unit
141‧‧‧隔板141‧‧ ‧ partition
141’‧‧‧外殼141’‧‧‧ Shell
142‧‧‧第一晶圓進出口142‧‧‧First wafer import and export
142’‧‧‧第一晶圓進出口142'‧‧‧First wafer import and export
143‧‧‧槽式清洗槽143‧‧‧ trough cleaning tank
143’‧‧‧槽式清洗槽143'‧‧‧ trough cleaning tank
144‧‧‧密封蓋144‧‧‧ Sealing cover
144’‧‧‧密封蓋144’‧‧‧ Sealing cover
145‧‧‧密封擋板145‧‧‧Seal baffle
145’‧‧‧密封擋板145'‧‧‧ Sealed baffle
146‧‧‧支撐架146‧‧‧Support frame
146’‧‧‧支撐架146’‧‧‧Support frame
147‧‧‧升降機構147‧‧‧ Lifting mechanism
147’‧‧‧升降機構147’‧‧‧ Lifting mechanism
148‧‧‧翻轉機構148‧‧‧ flip mechanism
148’‧‧‧翻轉機構148’‧‧‧ Turning mechanism
149‧‧‧晶圓卡盒149‧‧‧wafer cassette
150‧‧‧單片清洗裝置150‧‧‧one-piece cleaning device
151‧‧‧第二晶圓進出口151‧‧‧Second wafer import and export
152‧‧‧風機篩檢程式機組152‧‧‧fan screening program unit
153‧‧‧架體153‧‧‧ ‧ frame
154‧‧‧架板154‧‧‧ ‧ boards
155‧‧‧密封圈155‧‧‧ sealing ring
160‧‧‧氮氣保護裝置160‧‧‧Nitrogen protection device
160’‧‧‧氮氣保護裝置160'‧‧‧Nitrogen protection device
1311‧‧‧凹槽1311‧‧‧ Groove
1311’‧‧‧凹槽1311’‧‧‧ Groove
1312‧‧‧通孔1312‧‧‧through hole
1312’‧‧‧通孔1312’‧‧‧through hole
1313’‧‧‧凸起1313’‧‧‧ raised
1411’‧‧‧排氣口1411’‧‧‧ Vent
1431‧‧‧內槽1431‧‧‧Internal slot
1432‧‧‧外槽1432‧‧‧ outer trough
1433‧‧‧出液口1433‧‧‧liquid outlet
1441‧‧‧頂壁1441‧‧‧ top wall
1442‧‧‧側壁1442‧‧‧ side wall
1443‧‧‧後壁1443‧‧‧Back wall
1444‧‧‧導流槽1444‧‧‧Guide trough
第1圖揭示了根據本新型的晶圓清洗裝置的結構示意圖。Figure 1 is a schematic view showing the structure of a wafer cleaning apparatus according to the present invention.
第2圖揭示了根據本新型的晶圓清洗裝置的又一結構示意圖。Figure 2 is a schematic view showing still another structure of the wafer cleaning apparatus according to the present invention.
第3圖揭示了根據本新型的晶圓傳送裝置的結構示意圖。Figure 3 is a block diagram showing the structure of a wafer transfer apparatus according to the present invention.
第4圖揭示了根據本新型的晶圓傳送裝置的又一結構示意圖。Fig. 4 is a view showing still another structure of the wafer transfer apparatus according to the present invention.
第5圖揭示了根據本新型的晶圓傳送裝置的傳送機械手的一實施例的結構示意圖。Figure 5 is a block diagram showing an embodiment of a transfer robot of a wafer transfer apparatus according to the present invention.
第6圖揭示了根據第5圖的沿VI-VI的剖面結構示意 圖。Figure 6 shows a schematic cross-sectional structure along VI-VI according to Figure 5 Figure.
第7圖揭示了根據本新型的晶圓傳送裝置的傳送機械手的又一實施例的結構示意圖。Fig. 7 is a view showing the configuration of still another embodiment of the transfer robot of the wafer transfer apparatus according to the present invention.
第8圖揭示了根據本新型的槽式清洗裝置的結構示意圖。Figure 8 is a schematic view showing the structure of the trough cleaning apparatus according to the present invention.
第9圖揭示了根據本新型的槽式清洗裝置的槽式清洗槽的結構示意圖。Fig. 9 is a view showing the structure of a trough cleaning tank of the trough cleaning apparatus according to the present invention.
第10圖揭示了根據本新型的槽式清洗裝置的密封蓋的結構示意圖。Fig. 10 is a view showing the structure of a sealing cover of the trough cleaning apparatus according to the present invention.
第11圖揭示了根據本新型的密封蓋的剖視圖。Figure 11 is a cross-sectional view showing the sealing cover according to the present invention.
第12圖揭示了根據本新型的槽式清洗裝置打開密封蓋的結構示意圖。Figure 12 is a schematic view showing the structure of the slot cleaning device according to the present invention for opening the sealing cover.
第13圖揭示了根據本新型的槽式清洗裝置打開密封蓋的又一結構示意圖。Fig. 13 is a view showing still another structural view of the slot cleaning device according to the present invention for opening the sealing cover.
第14圖揭示了根據本新型的槽式清洗裝置的又一結構示意圖。Figure 14 is a schematic view showing still another structure of the trough cleaning apparatus according to the present invention.
第15圖揭示了根據本新型的槽式清洗裝置的又一實施例的結構示意圖。Fig. 15 is a view showing the structure of still another embodiment of the trough cleaning apparatus according to the present invention.
第16圖揭示了根據本新型的單片清洗裝置的結構示意圖。Figure 16 is a block diagram showing the structure of a single-piece cleaning apparatus according to the present invention.
第17圖揭示了根據第16圖的沿XVII-XVII的剖面結構示意圖。Fig. 17 is a view showing a sectional structure along XVII-XVII according to Fig. 16.
第18圖揭示了根據第17圖的B處的局部放大圖。Fig. 18 is a partially enlarged view showing a portion B according to Fig. 17.
為詳細說明本新型的技術內容、構造特徵、所達成的目的及功效,下面將結合實施例並配合圖式予以詳細說明。In order to explain the technical content, structural features, objects and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and drawings.
參閱第1圖和第2圖,揭示了根據本新型的晶圓清洗裝置的結構示意圖。該晶圓清洗裝置包括主體框架110、晶圓裝載埠120、晶圓傳送裝置130、槽式清洗裝置140及單片清洗裝置150。晶圓裝載埠120設置於主體框架110的外側端,晶圓裝載埠120接收和放置晶圓盒(圖中未示),晶圓盒存放待清洗或清洗完畢的晶圓。晶圓裝載埠120的數量不限於一個,可以根據晶圓清洗裝置的處理能力選擇合適數量的晶圓裝置埠120。晶圓傳送裝置130、槽式清洗裝置140及單片清洗裝置150分別集成於主體框架110內。Referring to Figures 1 and 2, a schematic structural view of a wafer cleaning apparatus according to the present invention is disclosed. The wafer cleaning apparatus includes a main body frame 110, a wafer loading cassette 120, a wafer transfer apparatus 130, a tank cleaning apparatus 140, and a single piece cleaning apparatus 150. The wafer loading cassette 120 is disposed at an outer end of the main body frame 110. The wafer loading cassette 120 receives and places a wafer cassette (not shown), and the wafer cassette stores the wafer to be cleaned or cleaned. The number of wafer loading cassettes 120 is not limited to one, and an appropriate number of wafer units 120 can be selected according to the processing capabilities of the wafer cleaning apparatus. The wafer transfer device 130, the tank cleaning device 140, and the single-chip cleaning device 150 are integrated in the main body frame 110, respectively.
如第3圖和第4圖所示,晶圓傳送裝置130包括傳送機械手131、溶液接收器132及機械手安裝台133。傳送機械手131用於在晶圓裝載埠120的晶圓盒、槽式清洗裝置140及單片清洗裝置150之間傳送晶圓。傳送機械手131和溶液接收器132均裝配在機械手安裝台133上,溶液接收器132位於傳送機械手131的下方,工藝處理時,溶液接收器132接收從傳送機械手131上滴落的溶液,以避免傳送機械手131上的溶液滴落至晶圓清洗裝置內,污染晶圓清洗裝置。溶液接收器132大致呈漏斗形,溶液接收器132的底部開設有排液口138,溶液接收器132內的溶液從排液口138排出。As shown in FIGS. 3 and 4, the wafer transfer device 130 includes a transfer robot 131, a solution receiver 132, and a robot mount 133. The transfer robot 131 is used to transfer wafers between the wafer cassette of the wafer loading cassette 120, the tank cleaning device 140, and the single-chip cleaning device 150. The transfer robot 131 and the solution receiver 132 are both mounted on the robot mounting table 133, and the solution receiver 132 is located below the transfer robot 131. During the process, the solution receiver 132 receives the solution dripped from the transfer robot 131. In order to prevent the solution on the transfer robot 131 from dripping into the wafer cleaning device, the wafer cleaning device is contaminated. The solution receiver 132 is generally funnel shaped, with a liquid discharge port 138 at the bottom of the solution receiver 132, and the solution in the solution receiver 132 is discharged from the liquid discharge port 138.
晶圓傳送裝置130還包括機械手驅動裝置134、支架板135及支座136。機械手安裝台133裝配在支架板135上,機械手驅動裝置134驅動支架板135沿支座136垂直上升或下降,從而帶動機械手安裝台133垂直上升或下降。由於傳送機械手131和溶液接收器132裝配在機械手安裝台133上,因而,傳送機械手131和溶液接收器132隨機械手安裝台133垂直上升或下降,以調節傳送機械手131和溶液接收器132在垂直方向的高度。支座136的頂端設置有一對限位塊137,支架板135沿支座136垂直上升至限位塊137處時,支架板135停止上升。機械手驅動裝置134可以選用氣缸。The wafer transfer device 130 also includes a robot drive 134, a bracket plate 135, and a support 136. The robot mounting platform 133 is mounted on the bracket plate 135, and the robot driving device 134 drives the bracket plate 135 to vertically rise or fall along the support 136, thereby causing the robot mounting platform 133 to vertically ascend or descend. Since the transport robot 131 and the solution receiver 132 are mounted on the robot mount 133, the transfer robot 131 and the solution receiver 132 are vertically raised or lowered with the robot mount 133 to adjust the transfer robot 131 and the solution reception. The height of the 132 in the vertical direction. The top end of the support 136 is provided with a pair of limiting blocks 137. When the bracket plate 135 is vertically raised to the limiting block 137 along the support 136, the bracket plate 135 stops rising. The robot drive 134 can be a cylinder.
通常設置有兩個或兩個以上的傳送機械手131,較佳的,至少設置兩個傳送機械手131,其中一個傳送機械手131用於傳送乾態晶圓,一個傳送機械手131用於傳送濕態晶圓,用於傳送濕態晶圓的傳送機械手131位於用於傳送乾態晶圓的傳送機械手131的下方。傳送機械手131可以選用本領域技術人員熟知的機械手,但在工藝處理時,傳統機械手存在一弊端,即清洗溶液會堆積在機械手上,使用傳統機械手取放晶圓時,晶圓粘附在機械手上不易脫落。為了解決此弊端,本新型對傳統機械手實施了改進,如第5圖和第6圖所示,本新型傳送機械手131上用於承載晶圓的一面開設有大致呈V型的凹槽1311,凹槽1311的開口寬度大致與傳送機械手131末指端的寬度一致。凹槽1311內開設有數個通孔1312,堆積在傳送機械手 131上的清洗溶液彙集於凹槽1311內,並從通孔1312滴落至傳送機械手131下方的溶液接收器132內。Usually, two or more transfer robots 131 are provided. Preferably, at least two transfer robots 131 are provided, one of which is for transferring dry wafers and one for transporting robots 131 for transfer. The wet wafer, the transfer robot 131 for transporting the wet wafer, is located below the transfer robot 131 for transferring the dry wafer. The transfer robot 131 can select a robot that is well known to those skilled in the art, but there is a drawback in the conventional robot when the process is processed, that is, the cleaning solution is accumulated on the robot, and the wafer is stuck when the wafer is picked up by a conventional robot. Attached to the robot is not easy to fall off. In order to solve this drawback, the present invention implements an improvement on a conventional manipulator. As shown in FIGS. 5 and 6, the one side of the transfer robot 131 for carrying a wafer is provided with a substantially V-shaped groove 1311. The opening width of the groove 1311 substantially coincides with the width of the terminal end of the transfer robot 131. A plurality of through holes 1312 are defined in the groove 1311, and are stacked on the transfer robot. The cleaning solution on 131 collects in the recess 1311 and drops from the through hole 1312 into the solution receiver 132 below the transfer robot 131.
參閱第7圖,揭示了根據本新型的傳送機械手的又一實施例的結構示意圖。該傳送機械手131’上用於承載晶圓的一面開設有大致呈V型的凹槽1311’,凹槽1311’內開設有數個通孔1312’。與前述實施例的不同之處在於,本實施例的傳送機械手131’上用於承載晶圓的一面還設置有數個台階狀的凸起1313’,傳送晶圓時,該數個凸起1313’托起晶圓,目的是儘量減少晶圓與傳送機械手131’的接觸面積,進而減少晶圓與傳送機械手131’之間的粘附力,以利於晶圓的取放。Referring to Figure 7, a schematic structural view of yet another embodiment of a transfer robot in accordance with the present invention is disclosed. A side of the transport robot 131' for carrying the wafer is provided with a substantially V-shaped recess 1311', and a plurality of through holes 1312' are formed in the recess 1311'. The difference from the foregoing embodiment is that the surface of the transport robot 131' of the embodiment for carrying the wafer is further provided with a plurality of stepped protrusions 1313'. When the wafer is transported, the plurality of protrusions 1313 'The purpose of holding up the wafer is to minimize the contact area between the wafer and the transfer robot 131', thereby reducing the adhesion between the wafer and the transfer robot 131' to facilitate wafer pick-and-place.
參閱第8圖、第12圖至第14圖同時結合第1圖和第2圖,槽式清洗裝置140包括隔板141,隔板141將槽式清洗裝置140與晶圓傳送裝置130隔離,隔板141的前側設置晶圓傳送裝置130,隔板141的背側設置槽式清洗裝置140。隔板141上開設有用於傳送晶圓的第一晶圓進出口142,傳送機械手131透過該第一晶圓進出口142將晶圓放入槽式清洗裝置140或從槽式清洗裝置140內取出。設置於隔板141背側的槽式清洗裝置140包括槽式清洗槽143、密封蓋144、密封擋板145、支撐架146、升降機構147、翻轉機構148及晶圓卡盒149。槽式清洗槽143、密封蓋144及密封擋板145形成一密閉空間,以用於一片或多片晶圓的工藝處理。密封擋板145固定安裝在槽式清洗槽143上。升降機構147安裝在支撐架146上,升降機構147與密封蓋 144連接,升降機構147驅動密封蓋144上升或下降,以打開或閉合該密閉空間。用於放置並卡持晶圓的晶圓卡盒149裝配在密封蓋144上,翻轉機構148驅動晶圓卡盒149翻轉,以使晶圓卡盒149水平佈置於密封蓋144內或豎直懸掛於密封蓋144下。Referring to FIG. 8 and FIG. 12 to FIG. 14 in conjunction with FIGS. 1 and 2, the trough cleaning apparatus 140 includes a partition 141 that isolates the trough cleaning apparatus 140 from the wafer transfer apparatus 130. A wafer transfer device 130 is disposed on the front side of the plate 141, and a groove cleaning device 140 is disposed on the back side of the separator 141. A first wafer inlet and outlet 142 for transferring a wafer is opened on the separator 141, and the transfer robot 131 passes the wafer into the tank cleaning device 140 or from the tank cleaning device 140 through the first wafer inlet and outlet 142. take out. The tank cleaning device 140 disposed on the back side of the partition 141 includes a tank cleaning tank 143, a sealing cover 144, a sealing shutter 145, a support frame 146, a lifting mechanism 147, a turning mechanism 148, and a wafer cassette 149. The trough cleaning tank 143, the sealing cover 144, and the sealing baffle 145 form a closed space for the processing of one or more wafers. The sealing baffle 145 is fixedly mounted on the trough cleaning tank 143. The lifting mechanism 147 is mounted on the support frame 146, the lifting mechanism 147 and the sealing cover 144 is connected, and the lifting mechanism 147 drives the sealing cover 144 to rise or fall to open or close the sealed space. A wafer cassette 149 for placing and holding wafers is mounted on the sealing cover 144, and the turning mechanism 148 drives the wafer cassette 149 to flip so that the wafer cassette 149 is horizontally disposed within the sealing cover 144 or vertically suspended Under the sealing cover 144.
如第9圖所示,槽式清洗槽143具有內槽1431和外槽1432。內槽1431存放清洗溶液如TMAH、NMP、IPA、DIW或丙酮等,晶圓卡盒149豎直懸掛於密封蓋144下並豎直收容於內槽1431以用於一片或多片晶圓的浸泡清洗。內槽1431的槽口呈鋸齒型,以防止清洗溶液堆積於內槽1431槽口的頂面,如果清洗溶液較粘稠,使用一段時間後,清洗溶液可能會凝固於內槽1431槽口的頂面,設計成鋸齒型後,清洗溶液不會堆積於內槽1431槽口的頂面。外槽1432的底面為傾斜的斜坡面,且在斜坡面的坡底部開設有出液口1433。出液口1433與一泵(圖中未示)的進液口連接,泵的出液口與槽式清洗槽的內槽1431連接。在泵的出液口與槽式清洗槽的內槽1431之間設置有加熱裝置(圖中未示)。內槽1431中的清洗溶液透過內槽1431的槽口溢出至外槽1432,由於外槽1432的底面為傾斜的斜坡面,外槽1432中的清洗溶液彙集於斜坡面的坡底部,並透過出液口1433、泵及加熱裝置後再供應至內槽1431,以構成清洗溶液的循環使用。As shown in Fig. 9, the trough cleaning tank 143 has an inner tank 1431 and an outer tank 1432. The inner tank 1431 stores a cleaning solution such as TMAH, NMP, IPA, DIW or acetone, and the wafer cassette 149 is vertically suspended under the sealing cover 144 and vertically received in the inner groove 1431 for immersion in one or more wafers. Cleaning. The notch of the inner groove 1431 is serrated to prevent the cleaning solution from accumulating on the top surface of the notch of the inner groove 1431. If the cleaning solution is thick, after a period of use, the cleaning solution may solidify at the top of the notch of the inner groove 1431. After the surface is designed to be serrated, the cleaning solution does not accumulate on the top surface of the notch of the inner groove 1431. The bottom surface of the outer groove 1432 is an inclined slope surface, and a liquid outlet 1433 is opened at the bottom of the slope of the slope surface. The liquid outlet 1433 is connected to a liquid inlet of a pump (not shown), and the liquid outlet of the pump is connected to the inner tank 1431 of the tank cleaning tank. A heating device (not shown) is disposed between the liquid outlet of the pump and the inner tank 1431 of the tank cleaning tank. The cleaning solution in the inner groove 1431 overflows through the notch of the inner groove 1431 to the outer groove 1432. Since the bottom surface of the outer groove 1432 is an inclined slope surface, the cleaning solution in the outer groove 1432 is collected at the bottom of the slope surface and is transmitted through The liquid port 1433, the pump and the heating device are then supplied to the inner tank 1431 to constitute a recycling use of the cleaning solution.
密封蓋144扣合於槽式清洗槽143上,以形成上述密閉空間。如第10圖和第11圖所示,密封蓋144具 有頂壁1441和與頂壁1441連接的兩側壁1442及後壁1443。密封蓋144的頂壁1441、兩側壁1442及後壁1443圍成一容納空間以收容晶圓卡盒149。密封蓋144的頂壁1441為前高後低的傾斜斜面。密封蓋144的後壁1443的底部形成有導流槽1444。工藝處理時,如果槽式清洗槽143的內槽1431內的清洗溶液溫度較高,清洗溶液汽化為蒸汽,為了防止蒸汽泄漏,密封蓋144扣合於槽式清洗槽143上,且連同密封擋板145形成上述密閉空間。蒸汽上升至密封蓋144的頂壁1441後,蒸汽在密封蓋144的頂壁1441液化,液化後的清洗溶液沿密封蓋144的頂壁1441流至密封蓋144的後壁1443後流入導流槽1444,然後清洗溶液從導流槽1444流入槽式清洗槽143的外槽1432,並透過出液口1433、泵及加熱裝置後再供應至內槽1431,以構成清洗溶液的循環使用。The sealing cover 144 is fastened to the trough cleaning tank 143 to form the above-mentioned sealed space. As shown in Figures 10 and 11, the sealing cover 144 has There is a top wall 1441 and two side walls 1442 and a rear wall 1443 which are connected to the top wall 1441. The top wall 1441, the two side walls 1442 and the rear wall 1443 of the sealing cover 144 enclose a receiving space for receiving the wafer cassette 149. The top wall 1441 of the sealing cover 144 is a sloped bevel that is high in front and low in the front. A bottom of the rear wall 1443 of the sealing cover 144 is formed with a flow guiding groove 1444. During the processing, if the temperature of the cleaning solution in the inner tank 1431 of the tank cleaning tank 143 is high, the cleaning solution is vaporized into steam, and in order to prevent steam leakage, the sealing cover 144 is fastened to the tank cleaning tank 143, together with the sealing block. The plate 145 forms the above-described sealed space. After the steam rises to the top wall 1441 of the sealing cover 144, the vapor liquefies on the top wall 1441 of the sealing cover 144, and the liquefied cleaning solution flows along the top wall 1441 of the sealing cover 144 to the rear wall 1443 of the sealing cover 144 and flows into the guiding groove. 1444, then the cleaning solution flows from the diversion tank 1444 into the outer tank 1432 of the tank cleaning tank 143, and is supplied to the inner tank 1431 through the liquid outlet 1433, the pump and the heating device to constitute a recycling solution of the cleaning solution.
參閱第12圖至第14圖,使用該槽式清洗裝置140清洗晶圓時,傳送機械手131從晶圓裝載埠120處的晶圓盒取出待清洗的晶圓,此時,升降機構147驅動密封蓋144上升至工藝所需的高度,翻轉機構148驅動晶圓卡盒149翻轉,以使晶圓卡盒149水平佈置於密封蓋144內。然後,傳送機械手131透過第一晶圓進出口142將晶圓水平放置於晶圓卡盒149內。放入數片晶圓至晶圓卡盒149後,翻轉機構148驅動晶圓卡盒149翻轉,以使晶圓卡盒149豎直懸掛於密封蓋144下。升降機構147驅動密封蓋144下降,槽式清洗槽143、密封蓋144及密封擋板145形成密 閉空間,懸掛於密封蓋144下的晶圓卡盒149收容於槽式清洗槽143的內槽1431,以浸泡清洗晶圓。晶圓清洗完畢後,升降機構147驅動密封蓋144上升,打開密閉空間,翻轉機構148驅動晶圓卡盒149翻轉,以使晶圓卡盒149水平佈置於密封蓋144內,傳送機械手131透過第一晶圓進出口142從晶圓卡盒149內水平取出晶圓。Referring to FIGS. 12 to 14, when the wafer cleaning apparatus 140 is used to clean the wafer, the transfer robot 131 takes out the wafer to be cleaned from the wafer cassette at the wafer loading cassette 120, and at this time, the lifting mechanism 147 drives The sealing cover 144 is raised to the height required for the process, and the flip mechanism 148 drives the wafer cassette 149 to flip so that the wafer cassette 149 is horizontally disposed within the sealing cover 144. Then, the transfer robot 131 horizontally places the wafer in the wafer cassette 149 through the first wafer inlet and outlet 142. After placing a plurality of wafers into the wafer cassette 149, the flip mechanism 148 drives the wafer cassette 149 to flip so that the wafer cassette 149 is vertically suspended below the sealing cover 144. The lifting mechanism 147 drives the sealing cover 144 to descend, and the trough cleaning tank 143, the sealing cover 144 and the sealing baffle 145 form a dense In the closed space, the wafer cassette 149 suspended under the sealing cover 144 is received in the inner groove 1431 of the trough cleaning tank 143 to soak the cleaning wafer. After the wafer cleaning is completed, the lifting mechanism 147 drives the sealing cover 144 to rise, opens the sealed space, and the turning mechanism 148 drives the wafer cassette 149 to flip, so that the wafer cassette 149 is horizontally disposed in the sealing cover 144, and the conveying robot 131 passes through The first wafer inlet and outlet 142 horizontally takes out the wafer from within the wafer cassette 149.
隔板141的背側設置有氮氣保護裝置160,該氮氣保護裝置160位於第一晶圓進出口142的上方。氮氣保護裝置160用於向傳送機械手131吹氮氣,儘量使傳送機械手131保持乾的狀態,以免晶圓粘附在傳送機械手131上。A nitrogen gas protection device 160 is disposed on the back side of the separator 141, and the nitrogen gas protection device 160 is located above the first wafer inlet and outlet port 142. The nitrogen gas protection device 160 is for blowing nitrogen gas to the transfer robot 131 to keep the transfer robot 131 as dry as possible to prevent the wafer from adhering to the transfer robot 131.
為了提高晶圓清洗裝置的使用壽命,本新型揭示了槽式清洗裝置的又一實施例,如第15圖所示,在該實施例中,隔板141由外殼141’取代,該外殼141’具有頂壁、底壁、前壁、後壁及兩側壁(其中有一側壁在圖中未顯示),外殼141’的頂壁、底壁、前壁、後壁及兩側壁圍成了一密閉的收容空間。槽式清洗裝置140’的槽式清洗槽143’、密封蓋144’、密封擋板145’、支撐架146’、升降機構147’、翻轉機構148’及晶圓卡盒均收容於該密閉的收容空間。外殼141’的側壁開設有排氣口1411’,該排氣口1411’與排氣裝置(圖中未示)相連,顯然,排氣口1411’不限於開設在外殼141’的側壁,例如,外殼141’的後壁也可以開設該排氣口1411’。外殼141’的前壁開設有第一晶圓進出口142’。氮氣保護裝置160’設置在外 殼141’的前壁並收容於該密閉的收容空間。氮氣保護裝置160’位於第一晶圓進出口142’的上方。工藝處理時,氮氣保護裝置160’一直向第一晶圓進出口142’處吹氮氣,透過外殼141’的內外壓力差阻止外殼141’內的氣體泄漏。透過設置外殼141’,槽式清洗裝置140’內清洗溶液和氣體不會泄漏至晶圓清洗裝置內,因而可以提高晶圓清洗裝置的使用壽命。In order to increase the service life of the wafer cleaning apparatus, the present invention discloses a further embodiment of the tank cleaning apparatus, as shown in Fig. 15, in which the partition 141 is replaced by a casing 141', the casing 141' The top wall, the bottom wall, the front wall, the rear wall and the two side walls (one of which is not shown in the figure), the top wall, the bottom wall, the front wall, the rear wall and the two side walls of the outer casing 141' are enclosed by a closed Containment space. The trough cleaning tank 143', the sealing cover 144', the sealing baffle 145', the support frame 146', the elevating mechanism 147', the reversing mechanism 148', and the wafer cassette of the trough cleaning device 140' are housed in the sealed Containment space. The side wall of the outer casing 141' is provided with an exhaust port 1411', which is connected to an exhaust device (not shown). Obviously, the exhaust port 1411' is not limited to being opened on the side wall of the outer casing 141', for example, The exhaust port 1411' may also be formed in the rear wall of the outer casing 141'. The front wall of the outer casing 141' is provided with a first wafer inlet and outlet 142'. Nitrogen protection device 160' is placed outside The front wall of the case 141' is housed in the sealed accommodating space. Nitrogen protection device 160' is located above first wafer inlet and outlet 142'. During the process, the nitrogen gas protecting device 160' always blows nitrogen gas to the first wafer inlet and outlet 142', and the pressure difference between the inside and the outside of the outer casing 141' prevents gas leakage in the outer casing 141'. By providing the outer casing 141', the cleaning solution and gas in the tank cleaning device 140' are not leaked into the wafer cleaning device, so that the life of the wafer cleaning device can be improved.
參閱第16圖至第18圖,單片清洗裝置150用於單片晶圓的清洗和乾燥。單片清洗裝置150開設有用於傳送晶圓的第二晶圓進出口151。單片清洗裝置150的頂部設置有風機篩檢程式機組(FFU)152。單片清洗裝置150的底部開設有排氣口(圖中未示)。單片清洗裝置150是一個完全密封的裝置,單片清洗裝置150內的氣體只能透過排氣口排出。為了達到單片清洗裝置150的完全密封性,本新型使用了大量密封圈以密封單片清洗裝置150,例如,單片清洗裝置150具有架體153及安裝於架體153上的架板154,架體153與架板154的安裝處設置有密封圈155。單片清洗裝置150內設置有超/兆聲波裝置,可以對單片清洗裝置150內的晶圓進行超/兆聲波清洗。單片清洗裝置150內的清洗溶液可以為TMAH、NMP、IPA、DIW或丙酮等。Referring to Figures 16 through 18, the single-chip cleaning apparatus 150 is used for cleaning and drying a single wafer. The single-chip cleaning device 150 is provided with a second wafer inlet and outlet 151 for transferring wafers. A fan screening program unit (FFU) 152 is disposed at the top of the single piece cleaning device 150. The bottom of the single-chip cleaning device 150 is provided with an exhaust port (not shown). The single piece cleaning device 150 is a completely sealed device, and the gas in the single piece cleaning device 150 can only be discharged through the exhaust port. In order to achieve complete sealing of the single-chip cleaning device 150, the present invention uses a large number of sealing rings to seal the single-piece cleaning device 150. For example, the single-chip cleaning device 150 has a frame 153 and a shelf 154 mounted on the frame 153. A seal ring 155 is provided at the mounting portion of the frame body 153 and the shelf plate 154. An ultra/mega sonic apparatus is provided in the single-chip cleaning apparatus 150 to perform ultrasonic/megasonic cleaning of the wafer in the single-chip cleaning apparatus 150. The cleaning solution in the single-chip cleaning device 150 may be TMAH, NMP, IPA, DIW or acetone.
本新型在槽式清洗裝置140和單片清洗裝置150內分別設有火焰探測器和滅火器噴頭,目的是保證槽式清洗裝置140和單片清洗裝置150的安全性。The present invention is provided with a flame detector and a fire extinguisher nozzle in the tank cleaning device 140 and the single-chip cleaning device 150, respectively, for the purpose of ensuring the safety of the tank cleaning device 140 and the single-chip cleaning device 150.
為了保證槽式清洗裝置140/140’和單片清洗 裝置150的密封性,本新型分別在第一晶圓進出口142/142’及第二晶圓進出口151處設置有感應門,只有當傳送機械手131需要透過第一晶圓進出口142/142’或第二晶圓進出口151取放晶圓時,感應門才打開,其餘時間段,感應門關閉。In order to ensure the tank cleaning device 140/140' and single-chip cleaning The sealing of the device 150, the present invention is provided with an inductive door at the first wafer inlet and outlet 142/142' and the second wafer inlet and outlet 151, respectively, only when the transfer robot 131 needs to pass through the first wafer inlet and outlet 142/ When the 142' or the second wafer inlet and outlet 151 picks up the wafer, the sensing door is opened, and the remaining time period, the sensing door is closed.
本新型晶圓清洗裝置清洗晶圓的過程如下:傳送機械手131從晶圓裝載埠120處的晶圓盒取出待清洗的晶圓,此時,升降機構147驅動密封蓋144上升至工藝所需的高度,翻轉機構148驅動晶圓卡盒149翻轉,以使晶圓卡盒149水平佈置於密封蓋144內。然後,傳送機械手131透過第一晶圓進出口142將晶圓水平放置於晶圓卡盒149內。放入數片晶圓至晶圓卡盒149後,翻轉機構148驅動晶圓卡盒149翻轉,以使晶圓卡盒149豎直懸掛於密封蓋144下。升降機構147驅動密封蓋144下降,槽式清洗槽143、密封蓋144及密封擋板145形成密閉空間,懸掛於密封蓋144下的晶圓卡盒149收容於槽式清洗槽143的內槽1431,以浸泡清洗晶圓。晶圓清洗完畢後,升降機構147驅動密封蓋144上升,打開密閉空間,翻轉機構148驅動晶圓卡盒149翻轉,以使晶圓卡盒149水平佈置於密封蓋144內,傳送機械手131透過第一晶圓進出口142從晶圓卡盒149內水平取出晶圓。然後,傳送機械手131透過第二晶圓進出口151將晶圓放入單片清洗裝置150內進行清洗和乾燥。晶圓在單片清洗裝置150內清洗和乾燥後,傳送機械手131透過第二晶圓進出口151從單片清洗裝置150 內取出晶圓並將晶圓放回至晶圓裝載埠120處的晶圓盒。The process of cleaning the wafer by the novel wafer cleaning device is as follows: the transfer robot 131 takes out the wafer to be cleaned from the wafer cassette at the wafer loading cassette 120, and at this time, the lifting mechanism 147 drives the sealing cover 144 to rise to the process. The flip mechanism 148 drives the wafer cassette 149 to flip so that the wafer cassette 149 is horizontally disposed within the sealing cover 144. Then, the transfer robot 131 horizontally places the wafer in the wafer cassette 149 through the first wafer inlet and outlet 142. After placing a plurality of wafers into the wafer cassette 149, the flip mechanism 148 drives the wafer cassette 149 to flip so that the wafer cassette 149 is vertically suspended below the sealing cover 144. The lifting mechanism 147 drives the sealing cover 144 to descend. The groove cleaning tank 143, the sealing cover 144 and the sealing baffle 145 form a closed space. The wafer cassette 149 suspended under the sealing cover 144 is received in the inner groove 1431 of the trough cleaning tank 143. To soak the wafer for cleaning. After the wafer cleaning is completed, the lifting mechanism 147 drives the sealing cover 144 to rise, opens the sealed space, and the turning mechanism 148 drives the wafer cassette 149 to flip, so that the wafer cassette 149 is horizontally disposed in the sealing cover 144, and the conveying robot 131 passes through The first wafer inlet and outlet 142 horizontally takes out the wafer from within the wafer cassette 149. Then, the transfer robot 131 passes the wafer into the single-chip cleaning device 150 through the second wafer inlet and outlet 151 for cleaning and drying. After the wafer is cleaned and dried in the single-chip cleaning device 150, the transfer robot 131 passes through the second wafer inlet and outlet 151 from the single-chip cleaning device 150. The wafer is taken out and placed back to the wafer cassette at the wafer loading cassette 120.
為了提高單片晶圓的處理效率,通常設置有兩個或兩個以上單片清洗裝置150,在本新型中,設置有兩個單片清洗裝置150,該兩個單片清洗裝置150層疊設置於主體框架110內。將晶圓放入頂層的單片清洗裝置150或從頂層的單片清洗裝置150內取出晶圓時,機械手驅動裝置134驅動支架板135沿支座136垂直上升,從而帶動機械手安裝台133垂直上升,使傳送機械手131與頂層的單片清洗裝置150的第二晶圓進出口151位於相同的高度。將晶圓放入底層的單片清洗裝置150或從底層的單片清洗裝置150內取出晶圓時,機械手驅動裝置134驅動支架板135沿支座136垂直下降,從而帶動機械手安裝台133垂直下降,使傳送機械手131與底層的單片清洗裝置150的第二晶圓進出口151位於相同的高度。In order to improve the processing efficiency of the single wafer, two or more single-chip cleaning devices 150 are usually provided. In the present invention, two single-chip cleaning devices 150 are provided, and the two single-chip cleaning devices 150 are stacked. In the main body frame 110. When the wafer is placed in the top-level single-chip cleaning device 150 or the wafer is removed from the top-level single-chip cleaning device 150, the robot driving device 134 drives the bracket plate 135 to rise vertically along the holder 136, thereby driving the robot mounting table 133. Vertically rising, the transfer robot 131 is at the same height as the second wafer inlet and outlet 151 of the top sheet single-chip cleaning device 150. When the wafer is placed in the underlying single-chip cleaning device 150 or the wafer is removed from the underlying single-chip cleaning device 150, the robot driver 134 drives the carrier plate 135 to vertically descend along the support 136, thereby driving the robot mounting table 133. The vertical drop causes the transfer robot 131 to be at the same height as the second wafer inlet and outlet 151 of the underlying one-chip cleaning device 150.
本新型晶圓清洗裝置透過將槽式清洗裝置140和單片清洗裝置150集成於主體框架110內,由一套晶圓傳送裝置130完成晶圓的傳送,縮短了晶圓清洗工藝週期,降低了生產成本,且集成於一套裝置後佔用空間縮小。The novel wafer cleaning device integrates the trough cleaning device 140 and the single-chip cleaning device 150 into the main body frame 110, and the wafer transfer device 130 completes the wafer transfer, thereby shortening the wafer cleaning process cycle and reducing the wafer cleaning process cycle. Production cost, and the footprint is reduced after being integrated into a set of devices.
綜上所述,本新型晶圓清洗裝置透過上述實施方式及相關圖式說明,己具體、詳實的揭露了相關技術,使本領域的技術人員可以據以實施。而以上所述實施例只是用來說明本新型,而不是用來限制本新型的,本新型的權利範圍,應由本新型的申請專利範圍來界定。至於本文中所述元件數目的改變或等效元件的代替等仍都應屬於本 新型的權利範圍。In summary, the novel wafer cleaning apparatus has been specifically and specifically disclosed by the above-described embodiments and related drawings, and can be implemented by those skilled in the art. The above described embodiments are only intended to illustrate the present invention, and are not intended to limit the present invention. The scope of the present invention is defined by the scope of the present patent application. As for the change in the number of components described herein or the replacement of equivalent components, etc. A new range of rights.
110‧‧‧主體框架110‧‧‧ Mainframe
120‧‧‧晶圓裝載埠120‧‧‧ Wafer loading埠
130‧‧‧晶圓傳送裝置130‧‧‧ wafer transfer device
141‧‧‧隔板141‧‧ ‧ partition
142‧‧‧第一晶圓進出口142‧‧‧First wafer import and export
150‧‧‧單片清洗裝置150‧‧‧one-piece cleaning device
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CN 201320216748 CN203250724U (en) | 2013-04-25 | 2013-04-25 | Wafer cleaning device |
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CN103551344A (en) * | 2013-11-01 | 2014-02-05 | 苏州辰轩光电科技有限公司 | Full-automatic washing machine |
CN105097623A (en) * | 2014-05-07 | 2015-11-25 | 盛美半导体设备(上海)有限公司 | Wafer loading port structure |
CN105529291A (en) * | 2014-09-29 | 2016-04-27 | 盛美半导体设备(上海)有限公司 | Wafer supporting device |
CN105336649A (en) * | 2015-11-27 | 2016-02-17 | 上海广奕电子科技股份有限公司 | Wafer corrosion device |
CN105665339B (en) * | 2016-02-17 | 2018-04-06 | 上海华力微电子有限公司 | A kind of drying device and drying means for groove profile wet method equipment |
TWI645913B (en) * | 2016-11-10 | 2019-01-01 | 辛耘企業股份有限公司 | Liquid processing device |
CN109633220B (en) * | 2019-01-29 | 2021-08-24 | 江阴佳泰电子科技有限公司 | Pre-blowing and washing type wafer probe station |
JP7313229B2 (en) * | 2019-08-07 | 2023-07-24 | ニデックインスツルメンツ株式会社 | processing system |
CN112235926B (en) * | 2020-09-26 | 2021-05-07 | 江苏亚电科技有限公司 | Wafer static electricity removing and cleaning method |
CN113097099A (en) * | 2021-03-08 | 2021-07-09 | 长江存储科技有限责任公司 | Cleaning machine table |
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