TWM457292U - Package structure of lighting element - Google Patents
Package structure of lighting element Download PDFInfo
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- TWM457292U TWM457292U TW102200667U TW102200667U TWM457292U TW M457292 U TWM457292 U TW M457292U TW 102200667 U TW102200667 U TW 102200667U TW 102200667 U TW102200667 U TW 102200667U TW M457292 U TWM457292 U TW M457292U
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Description
本創作有關於一種發光元件的封裝結構，有利於使用者進行發光二極體及/或電路元件的設置及線路連接。
The present invention relates to a package structure of a light-emitting element, which is convenient for a user to set up and connect a light-emitting diode and/or a circuit component.
發光二極體(LED；Light-Emitting Diode)由於具備有壽命長、體積小、耗電量少、反應速度快、無輻射及單色性發光等優點，因而被廣泛應用於指示燈、廣告看板、交通號誌燈、汽車車燈、顯示面板、通訊器具、消費電子等各項產品中。Light-Emitting Diode (LED) is widely used in indicator lights and advertising boards because of its long life, small size, low power consumption, fast response, no radiation and monochromatic illumination. , traffic lights, car lights, display panels, communications equipment, consumer electronics and other products.
在高功率發光二極體元件中，尤其是作為照明使用之發光二極體元件，為使得發光二極體產生提供更高的亮度，往往必須提高發光二極體之工作電流，或者是增大每一個發光二極體元件之發光晶粒尺寸。In the high-power light-emitting diode element, especially the light-emitting diode element used for illumination, in order to provide higher brightness of the light-emitting diode, it is necessary to increase the operating current of the light-emitting diode or increase it. The size of the light-emitting crystal of each of the light-emitting diode elements.
然而，隨著工作電流的提升，將會使得發光二極體產生更多的熱量，因而導致發光二極體的工作溫度上升。隨著發光二極體之工作溫度提高，將會導致發光二極體之發光效率下降，甚至可能造成發光二極體的損壞。因此如何將發光二極體在發光過程中所產生的熱量向外界排出，並使發光二極體元件保持適當的工作溫度，進而增進發光二極體之發光效率，為高功率發光二極體在研發上的一項重要課題。However, as the operating current increases, it will cause the light-emitting diode to generate more heat, thus causing the operating temperature of the light-emitting diode to rise. As the operating temperature of the light-emitting diode increases, the luminous efficiency of the light-emitting diode is lowered, and even the light-emitting diode may be damaged. Therefore, how to discharge the heat generated by the light-emitting diode during the light-emitting process to the outside, and maintain the proper operating temperature of the light-emitting diode element, thereby improving the luminous efficiency of the light-emitting diode, and is a high-power light-emitting diode. An important topic in research and development.
請參閱第１圖所示，為習用發光元件的構造示意圖。如圖所示，發光元件10主要包括有一發光二極體11、一第一導電架13、一第二導電架15及一封裝材料17。發光二極體11設置於第一導電架13上，且發光二極體11分爺透過導線12及導線14電性連接第一導電架13及第二導電架15。封裝材料17為透光材料，並可用以包覆發光二極體11、導線12/14、部分之第一導電架13及部分之第二導電架15，藉此以保護發光二極體11及導線12/14的結構。Please refer to FIG. 1 , which is a schematic view of the structure of a conventional light-emitting element. As shown in the figure, the light-emitting component 10 mainly includes a light-emitting diode 11, a first conductive frame 13, a second conductive frame 15, and a packaging material 17. The light-emitting diodes 11 are disposed on the first conductive frame 13 , and the light-emitting diodes 11 are electrically connected to the first conductive frame 13 and the second conductive frame 15 through the wires 12 and the wires 14 . The encapsulating material 17 is a light transmissive material, and can be used to cover the light emitting diode 11, the wire 12/14, a portion of the first conductive frame 13 and a portion of the second conductive frame 15 to protect the light emitting diode 11 and The structure of the wires 12/14.
在使用時可經由第一導電架13及第二導電架15對發光二極體11進行供電，使得發光二極體11發出光源，並經由第一導電架13將發光二極體11在發光過程中所產生熱量導出發光元件10。When in use, the light emitting diode 11 can be powered via the first conductive frame 13 and the second conductive frame 15 , so that the light emitting diode 11 emits a light source, and the light emitting diode 11 is illuminated during the light emitting process via the first conductive frame 13 . The heat generated in the light source is derived from the light-emitting element 10.
透過上述發光元件10的架構，雖然可以驅動發光二極體11產生光源。然而，封裝材料17本身僅具有透光的特性，並無法將發光二極體11在發光過程中所產生的熱量導出，使得發光二極體11所產生的熱量僅能由第一導電架13導出。Through the structure of the above-described light-emitting element 10, it is possible to drive the light-emitting diode 11 to generate a light source. However, the encapsulating material 17 itself has only the characteristics of light transmission, and the heat generated by the light emitting diode 11 during the light emitting process cannot be derived, so that the heat generated by the light emitting diode 11 can only be derived from the first conductive frame 13. .
隨著使用時間的增加，將會使得發光元件10的溫度上升，並造成發光二極體11的發光效率降低。特別是對高功率的發光二極體11而言，更可能會隨著溫度的上升而造成封裝材料17受熱膨脹或變形，並導致導線12/14受到拉扯，而造成發光元件10的結構損壞。
As the use time increases, the temperature of the light-emitting element 10 rises, and the luminous efficiency of the light-emitting diode 11 is lowered. In particular, for the high-power light-emitting diode 11, it is more likely that the sealing material 17 is thermally expanded or deformed as the temperature rises, and the wire 12/14 is pulled, causing damage to the structure of the light-emitting element 10.
本創作之一目的，在於提供一種發光元件的封裝結構，主要將至少一發光二極體設置在雙面電路板上，並於導熱基板上設置至少一穿孔。當雙面電路板連接導熱基板時，雙面電路板上的發光二極體將位於導熱基板的穿孔內，並有利於使用者進行發光二極體的連線。One of the purposes of the present invention is to provide a package structure for a light-emitting element, wherein at least one light-emitting diode is disposed on a double-sided circuit board, and at least one through hole is disposed on the heat-conductive substrate. When the double-sided circuit board is connected to the heat-conducting substrate, the light-emitting diodes on the double-sided circuit board will be located in the perforations of the heat-conducting substrate, and the user is allowed to connect the light-emitting diodes.
本創作之一目的，在於提供一種發光元件的封裝結構，主要將至少一電路元件及/或至少一發光二極體設置在雙面電路板上，並於導熱基板上設置至少一穿孔。當雙面電路板連接導熱基板時，雙面電路板上的電路元件及/或發光二極體將位於導熱基板的穿孔內，並有利於使用者進行電路元件及/或發光二極體的連線。One of the purposes of the present invention is to provide a package structure for a light-emitting component, wherein at least one circuit component and/or at least one light-emitting diode is disposed on a double-sided circuit board, and at least one through hole is disposed on the heat-conductive substrate. When the double-sided circuit board is connected to the heat-conducting substrate, the circuit components and/or the light-emitting diodes on the double-sided circuit board will be located in the perforations of the heat-conducting substrate, and the user is allowed to connect the circuit components and/or the light-emitting diodes. line.
本創作之一目的，在於提供一種發光元件的封裝結構，主要將至少一電路元件設置在雙面電路板上，將至少一發光二極體設置在導熱基板上，並於導熱基板上設置至少一穿孔。當雙面電路板連接導熱基板時，雙面電路板上的電路元件將會位於穿孔內，並有利於使用者進行電路元件及發光二極體的連線。An object of the present invention is to provide a package structure of a light-emitting element, which mainly comprises at least one circuit component disposed on a double-sided circuit board, at least one light-emitting diode disposed on the heat-conductive substrate, and at least one disposed on the heat-conductive substrate perforation. When the double-sided circuit board is connected to the heat-conducting substrate, the circuit components on the double-sided circuit board will be located in the through holes, and the user can connect the circuit components and the light-emitting diodes.
為達到上述目的，本創作提供一種發光元件的封裝結構，包括：一導熱基板，包括一個或多個穿孔；一雙面電路板，包括一第一表面及一第二表面，其中雙面電路板的第一表面連接導熱基板；及一個或多個發光二極體，位於雙面電路板的第一表面，其中雙面電路板與導熱基板連接時，發光二極體將會位於導熱基板的穿孔內。In order to achieve the above object, the present invention provides a package structure for a light emitting device, comprising: a heat conductive substrate including one or more through holes; a double-sided circuit board including a first surface and a second surface, wherein the double-sided circuit board The first surface is connected to the heat conductive substrate; and the one or more light emitting diodes are located on the first surface of the double-sided circuit board. When the double-sided circuit board is connected to the heat conductive substrate, the light-emitting diode will be located at the perforation of the heat-conductive substrate Inside.
本創作還提供一種發光元件的封裝結構，包括：一導熱基板，包括一個或多個穿孔；一雙面電路板，包括一第一表面及一第二表面，其中雙面電路板的第二表面連接導熱基板；一個或多個發光二極體，位於雙面電路板的第一表面；及一個或多個電路元件，位於雙面電路板的第二表面，其中雙面電路板與導熱基板連接時，電路元件將會位於導熱基板的穿孔內。The present invention also provides a package structure for a light-emitting component, comprising: a heat-conducting substrate comprising one or more perforations; a double-sided circuit board comprising a first surface and a second surface, wherein the second surface of the double-sided circuit board Connecting a thermally conductive substrate; one or more light emitting diodes on the first surface of the double-sided circuit board; and one or more circuit components on the second surface of the double-sided circuit board, wherein the double-sided circuit board is connected to the thermally conductive substrate When the circuit components are placed in the perforations of the thermally conductive substrate.
本創作還提供另一種發光元件的封裝結構，包括：一導熱基板，包括一個或多個穿孔；一雙面電路板，包括一第一表面及一第二表面，其中雙面電路板的第二表面連接導熱基板；一個或多個發光二極體，位於導熱基板上；及一個或多個電路元件，位於雙面電路板的第二表面，其中雙面電路板與導熱基板連接時，電路元件將會位於導熱基板的穿孔內，且電路元件電性連接發光二極體。The present invention also provides another package structure for a light-emitting component, comprising: a thermally conductive substrate comprising one or more perforations; a double-sided circuit board comprising a first surface and a second surface, wherein the second surface of the double-sided circuit board The surface is connected to the heat conductive substrate; one or more light emitting diodes are disposed on the heat conductive substrate; and one or more circuit components are located on the second surface of the double-sided circuit board, wherein the circuit component is connected to the heat conductive substrate It will be located in the perforation of the thermally conductive substrate, and the circuit components are electrically connected to the light emitting diode.
在本創作發光元件的封裝結構一實施例中，還包括至少一電路元件位於雙面電路板的第二表面，其中電路元件透過雙面電路板電性連接發光二極體。In an embodiment of the package structure of the present light-emitting device, at least one circuit component is disposed on the second surface of the double-sided circuit board, wherein the circuit component is electrically connected to the light-emitting diode through the double-sided circuit board.
在本創作發光元件的封裝結構一實施例中，其中發光二極體透過板上晶片技術或覆晶技術電性連接雙面電路板。In an embodiment of the package structure of the present light-emitting device, the light-emitting diode is electrically connected to the double-sided circuit board through a wafer technology or a flip chip technology.
在本創作發光元件的封裝結構一實施例中，還包括一導熱膠位於導熱基板及雙面電路板的第一表面之間。In an embodiment of the package structure of the present light-emitting device, a thermal adhesive is further disposed between the thermally conductive substrate and the first surface of the double-sided circuit board.
在本創作發光元件的封裝結構一實施例中，還包括至少一螢光膠覆蓋發光二極體。
In an embodiment of the package structure of the present light-emitting device, at least one fluorescent glue covers the light-emitting diode.
10‧‧‧發光元件
11‧‧‧發光二極體
12‧‧‧導線
13‧‧‧第一導電架
14‧‧‧導線
15‧‧‧第二導電架
17‧‧‧封裝材料
20‧‧‧封裝結構
21‧‧‧雙面電路板
211‧‧‧第一表面
213‧‧‧第二表面
215‧‧‧導孔
22‧‧‧導熱膠
23‧‧‧導熱基板
231‧‧‧穿孔
233‧‧‧底板
235‧‧‧側板
25‧‧‧發光二極體
251‧‧‧導線
27‧‧‧電路元件
29‧‧‧螢光膠
30‧‧‧封裝結構
31‧‧‧雙面電路板
311‧‧‧第一表面
313‧‧‧第二表面
315‧‧‧導孔
33‧‧‧導熱基板
331‧‧‧穿孔
333‧‧‧底板
335‧‧‧側板
40‧‧‧封裝結構
41‧‧‧雙面電路板
411‧‧‧第一表面
413‧‧‧第二表面
415‧‧‧導孔
43‧‧‧導熱基板
431‧‧‧穿孔
44‧‧‧絕緣層
45‧‧‧發光二極體
451‧‧‧導線
47‧‧‧電路元件10‧‧‧Lighting elements
11‧‧‧Lighting diode
12‧‧‧ wire
13‧‧‧First Conductor
14‧‧‧Wire
15‧‧‧Second conductive frame
17‧‧‧Encapsulation materials
20‧‧‧Package structure
21‧‧‧Double-sided circuit board
211‧‧‧ first surface
213‧‧‧ second surface
215‧‧‧ Guide hole
22‧‧‧thermal adhesive
23‧‧‧ Thermal substrate
231‧‧‧Perforation
233‧‧‧floor
235‧‧‧ side panels
25‧‧‧Lighting diode
251‧‧‧Wire
27‧‧‧ Circuit components
29‧‧‧Fluorescent glue
30‧‧‧Package structure
31‧‧‧Double-sided circuit board
311‧‧‧ first surface
313‧‧‧ second surface
315‧‧‧ Guide hole
33‧‧‧thermal substrate
331‧‧‧Perforation
333‧‧‧floor
335‧‧‧ side panels
40‧‧‧Package structure
41‧‧‧Double-sided circuit board
411‧‧‧ first surface
413‧‧‧ second surface
415‧‧‧ Guide hole
43‧‧‧thermal substrate
431‧‧‧Perforation
44‧‧‧Insulation
45‧‧‧Lighting diode
451‧‧‧Wire
47‧‧‧ Circuit components
第１圖：為習用發光元件的構造示意圖；
第２圖：為本創作發光元件的封裝結構一實施例的立體示意圖；
第３圖：為本創作發光元件的封裝結構一實施例的剖面示意圖；
第４圖：為本創作發光元件的封裝結構又一實施例的剖面示意圖；
第５圖：為本創作發光元件的封裝結構又一實施例的立體示意圖；
第６圖：為本創作發光元件的封裝結構又一實施例的立體示意圖；
第７圖：為本創作發光元件的封裝結構又一實施例的剖面示意圖；
第８圖：為本創作發光元件的封裝結構又一實施例的剖面示意圖；
第９圖：為本創作發光元件的封裝結構又一實施例的立體示意圖；
第10圖：為本創作發光元件的封裝結構又一實施例的立體示意圖；及
第11圖：為本創作發光元件的封裝結構又一實施例的剖面示意圖。
雖然已透過舉例方式在圖式中描述了本創作的具體實施方式，並在本文中對其作了詳细的說明，但是本創作還允許有各種修改和替換形式。本創作之圖式內容可為不等比例，圖式及其詳細的描述僅為特定型式的揭露，並不為本創作的限制，相反的，依據專利範圍之精神和範圍內進行修改、均等構件及其置換皆為本創作所涵蓋的範圍。
Figure 1: Schematic diagram of the construction of a conventional light-emitting element;
2 is a perspective view showing an embodiment of a package structure of the present light-emitting element;
Figure 3 is a cross-sectional view showing an embodiment of a package structure of the present light-emitting element;
Figure 4 is a cross-sectional view showing still another embodiment of the package structure of the light-emitting element of the present invention;
Figure 5 is a perspective view showing still another embodiment of the package structure of the light-emitting element of the present invention;
Figure 6 is a perspective view showing still another embodiment of the package structure of the light-emitting element of the present invention;
Figure 7 is a cross-sectional view showing still another embodiment of the package structure of the light-emitting element of the present invention;
Figure 8 is a cross-sectional view showing still another embodiment of the package structure of the light-emitting element of the present invention;
Figure 9 is a perspective view showing still another embodiment of the package structure of the light-emitting element of the present invention;
FIG. 10 is a perspective view showing still another embodiment of the package structure of the light-emitting element of the present invention; and FIG. 11 is a cross-sectional view showing still another embodiment of the package structure of the light-emitting element.
While the specific embodiments of the present invention have been described in the drawings and are described in detail herein, the invention herein The schema content of this creation may be unequal proportions. The schema and its detailed description are only the disclosure of specific types, and are not limitations of the creation. On the contrary, modifications and equal components are made according to the spirit and scope of the patent scope. Both their replacements are covered by this creation.
請參閱第２圖，為本創作發光元件的封裝結構一實施例的立體示意圖。如圖所示，發光元件的封裝結構20主要包括一雙面電路板21、一導熱基板23及至少一發光二極體25，其中發光二極體25位於雙面電路板21上，而導熱基板23則包括一個或多個穿孔231，當雙面電路板21連接導熱基板23時，發光二極體25將會位於穿孔231內。Please refer to FIG. 2 , which is a perspective view of an embodiment of a package structure of the light-emitting element of the present invention. As shown in the figure, the package structure 20 of the light-emitting component mainly comprises a double-sided circuit board 21, a heat-conducting substrate 23 and at least one light-emitting diode 25, wherein the light-emitting diode 25 is located on the double-sided circuit board 21, and the heat-conductive substrate 23 includes one or more perforations 231. When the double-sided circuit board 21 is connected to the thermally conductive substrate 23, the LEDs 25 will be located within the perforations 231.
雙面電路板21包括一第一表面211及一第二表面213，其中第一表面211及第二表面213上皆設置連接線路(未顯示)。本創作實施例所述之發光二極體25位於雙面電路板21的第一表面211上，並電性連接第一表面211上的連接線路，且雙面電路板21的第一表面211連接導熱基板23。The double-sided circuit board 21 includes a first surface 211 and a second surface 213. The first surface 211 and the second surface 213 are provided with connecting lines (not shown). The LEDs 25 of the present embodiment are located on the first surface 211 of the double-sided circuit board 21, and are electrically connected to the connection lines on the first surface 211, and the first surface 211 of the double-sided circuit board 21 is connected. Thermally conductive substrate 23.
在本創作一實施例中，請配合參閱第３圖，雙面電路板21的第二表面213上亦可設置至少一電路元件27，並使得電路元件27電性連接第二表面213上的連接線路，其中電路元件27透過雙面電路板21電性連接發光二極體25。此外在實際應用時，亦可於雙面電路板21上設置一個或多個導孔215，使得第一表面211上的發光二極體25可透過導孔215電性連接第二表面213上的電路元件27。例如電路元件27可將驅動電源傳送至發光二極體25，使得發光二極體25產生光源。In an embodiment of the present invention, with reference to FIG. 3, at least one circuit component 27 may be disposed on the second surface 213 of the double-sided circuit board 21, and the circuit component 27 is electrically connected to the connection on the second surface 213. The circuit in which the circuit component 27 is electrically connected to the light-emitting diode 25 through the double-sided circuit board 21 is provided. In addition, in the actual application, one or more via holes 215 may be disposed on the double-sided circuit board 21, so that the LEDs 25 on the first surface 211 can be electrically connected to the second surface 213 through the via holes 215. Circuit element 27. For example, the circuit component 27 can transmit the driving power source to the light emitting diode 25 such that the light emitting diode 25 generates a light source.
導熱基板23由具導熱特性的材質所製成，例如金屬材質，導熱基板23上設置一個或多個穿孔231，當導熱基板23連接雙面電路板21的第一表面211時，發光二極體25將位於穿孔231內，以利於將發光二極體25所產生的光源導出。The heat conductive substrate 23 is made of a material having thermal conductivity, such as a metal material. One or more through holes 231 are disposed on the heat conductive substrate 23, and the light emitting diodes are connected when the heat conductive substrate 23 is connected to the first surface 211 of the double-sided circuit board 21. 25 will be located within the perforations 231 to facilitate the extraction of the light source produced by the LEDs 25.
在本創作一實施例中，導熱基板23及雙面電路板21的第一表面211之間設置一導熱膠22，以連接導熱基板23及雙面電路板21，例如可將導熱膠22塗佈在部分雙面電路板21的第一表面211及/或導熱基板23上，並透過導熱膠22黏合雙面電路板21及導熱基板23。導熱膠22具有導熱的特性，發光二極體25在發光過程中所產生的熱量可經由導熱膠22傳遞至導熱基板23，以降低發光二極體25的工作溫度。In an embodiment of the present invention, a thermal conductive adhesive 22 is disposed between the thermally conductive substrate 23 and the first surface 211 of the double-sided circuit board 21 to connect the thermally conductive substrate 23 and the double-sided circuit board 21, for example, the thermal conductive adhesive 22 can be coated. On the first surface 211 of the partial double-sided circuit board 21 and/or the heat-conducting substrate 23, the double-sided circuit board 21 and the heat-conductive substrate 23 are bonded through the thermal conductive adhesive 22. The heat conductive adhesive 22 has a heat conducting property, and heat generated by the light emitting diode 25 during the light emitting process can be transmitted to the heat conductive substrate 23 via the thermal conductive adhesive 22 to lower the operating temperature of the light emitting diode 25.
在實際應用時亦可於發光二極體25上設置螢光膠29，螢光膠29可完整的覆蓋發光二極體25，並用以保護發光二極體25。此外發光二極體25所產生的光源在穿透螢光膠29時，將會激發螢光膠29內的螢光物質，並產生其他顏色的光源。In the actual application, the fluorescent glue 29 can also be disposed on the light-emitting diode 25, and the fluorescent glue 29 can completely cover the light-emitting diode 25 and protect the light-emitting diode 25. In addition, when the light source generated by the light-emitting diode 25 penetrates the fluorescent rubber 29, the fluorescent material in the fluorescent rubber 29 is excited and a light source of another color is generated.
在本創作一實施例中，發光二極體25可透過覆晶技術(flip chip)設置在雙面電路板21的第一表面211上，並經由導孔215電性連接第二表面213上的電路元件27，如第３圖所示。In an embodiment of the present invention, the LEDs 25 are disposed on the first surface 211 of the double-sided circuit board 21 through a flip chip, and are electrically connected to the second surface 213 via the vias 215. Circuit element 27 is shown in Figure 3.
在本創作另一實施例中，發光二極體25則可透過板上晶片技術(COB、chip on board)設置在雙面電路板21的第一表面211上，例如將發光二極體25設置在雙面電路板21的第一表面211，並透過導線251連接發光二極體25與第一表面211上的連接線路，使得位於第一表面211上的發光二極體25同樣可與第二表面213上的電路元件27電性連接，如第４圖所示。In another embodiment of the present invention, the LEDs 25 are disposed on the first surface 211 of the double-sided circuit board 21 via a chip on board (COB), for example, the LEDs 25 are disposed. The first surface 211 of the double-sided circuit board 21 is connected to the connecting line on the first surface 211 of the light-emitting diode 25 through the wire 251, so that the light-emitting diode 25 on the first surface 211 can also be connected to the second surface. The circuit elements 27 on the surface 213 are electrically connected as shown in FIG.
本創作所述之導熱基板23的形狀並不侷限為平板，亦可為任意的形狀或造型。在本創作一實施例中導熱基板23包括一底板233及至少一側板235，其中底板233上設置至少一穿孔231，而側板235則環設在底板233的周圍。底板233與側板235之間存在一夾角a，例如夾角a可大於90度，並有利於透過側板235引導或反射發光二極體25的光源，如第５圖所示。The shape of the heat conductive substrate 23 described in the present application is not limited to a flat plate, and may be any shape or shape. In one embodiment of the present invention, the thermally conductive substrate 23 includes a bottom plate 233 and at least one side plate 235. The bottom plate 233 is provided with at least one through hole 231, and the side plate 235 is disposed around the bottom plate 233. There is an angle a between the bottom plate 233 and the side plate 235. For example, the angle a may be greater than 90 degrees, and the light source of the light-emitting diode 25 is guided or reflected through the side plate 235, as shown in FIG.
請參閱第６圖，為本創作發光元件的封裝結構又一實施例的立體示意圖。如圖所示，發光元件的封裝結構30主要包括一雙面電路板31、一導熱基板33及至少一電路元件27，其中電路元件27位於雙面電路板31上，而導熱基板33則包括一個或多個穿孔331，當雙面電路板31連接導熱基板33時，電路元件27將會位於穿孔331內。Please refer to FIG. 6 , which is a perspective view of still another embodiment of the package structure of the light-emitting element. As shown, the package structure 30 of the light-emitting element mainly comprises a double-sided circuit board 31, a heat-conducting substrate 33 and at least one circuit component 27, wherein the circuit component 27 is located on the double-sided circuit board 31, and the heat-conducting substrate 33 includes a Or a plurality of through holes 331, when the double-sided circuit board 31 is connected to the heat conductive substrate 33, the circuit component 27 will be located in the through hole 331.
雙面電路板31包括一第一表面311及一第二表面313，其中第一表面311及第二表面313上皆設置連接線路(未顯示)。本創作實施例所述之電路元件27位於雙面電路板31的第二表面313上，並電性連接第二表面313上的連接線路，且雙面電路板31的第一表面311連接導熱基板33。The double-sided circuit board 31 includes a first surface 311 and a second surface 313. The first surface 311 and the second surface 313 are provided with connecting lines (not shown). The circuit component 27 of the present embodiment is located on the second surface 313 of the double-sided circuit board 31 and electrically connected to the connection line on the second surface 313, and the first surface 311 of the double-sided circuit board 31 is connected to the heat-conductive substrate. 33.
在本創作一實施例中，請配合參閱第７圖，雙面電路板31的第一表面311上還設置至少一發光二極體25，並使得發光二極體25電性連接第一表面311上的連接線路。在實際應用時可於雙面電路板31上設置一個或多個導孔315，使得第一表面311上的發光二極體25可透過導孔315電性連接第二表面313上的電路元件27。In an embodiment of the present invention, the first surface 311 of the double-sided circuit board 31 is further provided with at least one light-emitting diode 25, and the light-emitting diodes 25 are electrically connected to the first surface 311. The connection line on the. One or more via holes 315 may be disposed on the double-sided circuit board 31 in a practical application, so that the light-emitting diodes 25 on the first surface 311 can be electrically connected to the circuit components 27 on the second surface 313 through the via holes 315. .
導熱基板33透過導熱膠22連接雙面電路板31的第二表面313，使得電路元件27位於穿孔331內。在本創作一實施例中，可將導熱膠22塗佈在部分雙面電路板31的第二表面311及/或導熱基板33上，並透過導熱膠22黏合雙面電路板31及導熱基板33。在實際應用時可將發光二極體25及/或電路元件27所產生的熱量傳遞至導熱基板33，以降低發光二極體25及/或電路元件27的工作溫度。The thermally conductive substrate 33 is connected to the second surface 313 of the double-sided circuit board 31 through the thermal conductive adhesive 22 such that the circuit component 27 is located within the through hole 331. In an embodiment of the present invention, the thermal conductive adhesive 22 may be coated on the second surface 311 of the partial double-sided circuit board 31 and/or the thermal conductive substrate 33, and the double-sided circuit board 31 and the thermal conductive substrate 33 may be bonded through the thermal conductive adhesive 22. . In practical applications, the heat generated by the light-emitting diodes 25 and/or the circuit elements 27 can be transferred to the heat-conducting substrate 33 to lower the operating temperature of the light-emitting diodes 25 and/or the circuit elements 27.
在不同實施例中，亦可於以螢光膠29覆蓋發光二極體25，並用以保護發光二極體25。此外發光二極體25所產生的光源在穿透螢光膠29時，將會激發螢光膠29內的螢光物質，並產生其他顏色的光源。In different embodiments, the light-emitting diode 25 can also be covered with the fluorescent glue 29 and used to protect the light-emitting diode 25. In addition, when the light source generated by the light-emitting diode 25 penetrates the fluorescent rubber 29, the fluorescent material in the fluorescent rubber 29 is excited and a light source of another color is generated.
在本創作一實施例中，發光二極體25可透過覆晶技術(flip chip)設置在雙面電路板31的第一表面311上，並透過導孔315電性連接第二表面313上的電路元件27，如第７圖所示。In an embodiment of the present invention, the LEDs 25 are disposed on the first surface 311 of the double-sided circuit board 31 through a flip chip, and are electrically connected to the second surface 313 through the vias 315. Circuit element 27, as shown in Figure 7.
在本創作另一實施例中，發光二極體25則可透過板上晶片技術(COB、chip on board)設置在雙面電路板31的第一表面311上，例如將發光二極體25設置在雙面電路板31的第一表面311，並透過導線251連接發光二極體25與第一表面311上的連接線路，使得位於第一表面311上的發光二極體25可與第二表面313上的電路元件27電性連接，如第８圖所示。In another embodiment of the present invention, the LEDs 25 are disposed on the first surface 311 of the double-sided circuit board 31 via a chip on board (COB), for example, the LEDs 25 are disposed. The first surface 311 of the double-sided circuit board 31 is connected to the connecting line on the first surface 311 of the light-emitting diode 25 through the wire 251, so that the light-emitting diode 25 on the first surface 311 can be connected to the second surface. The circuit components 27 on 313 are electrically connected as shown in FIG.
本創作所述之導熱基板33的形狀並不侷限為平板，亦可為任意的形狀或造型。在本創作一實施例中導熱基板33包括一底板333及至少一側板335，其中底板333上設置至少一穿孔331，而側板335則環設在底板333的周圍。底板333與側板335之間存在一夾角a，例如夾角a可大於90度。雙面電路板31的第二表面313可貼附在底板331上，使得側板335環繞在雙面電路板31及/或發光二極體25的周圍，並可透過側板335引導或反射發光二極體25的光源，如第９圖所示。The shape of the heat conductive substrate 33 described in the present application is not limited to a flat plate, and may be any shape or shape. In one embodiment of the present invention, the thermally conductive substrate 33 includes a bottom plate 333 and at least one side plate 335. The bottom plate 333 is provided with at least one through hole 331, and the side plate 335 is disposed around the bottom plate 333. There is an angle a between the bottom plate 333 and the side plate 335, for example, the angle a may be greater than 90 degrees. The second surface 313 of the double-sided circuit board 31 can be attached to the bottom plate 331 such that the side plate 335 surrounds the double-sided circuit board 31 and/or the light-emitting diode 25, and can guide or reflect the light-emitting diode through the side plate 335. The light source of the body 25 is as shown in Fig. 9.
請參閱第10圖及第11圖，分別為本創作發光元件的封裝結構又一實施例的立體示意圖及剖面示意圖。如圖所示，發光元件的封裝結構40主要包括一雙面電路板41、一導熱基板43、至少一發光二極體45及至少一電路元件47，其中發光二極體45位於導熱基板43上，而電路元件47則位於雙面電路板41上。導熱基板43包括一個或多個穿孔431，當雙面電路板41連接導熱基板43時，電路元件47將會位於穿孔431內。Please refer to FIG. 10 and FIG. 11 , which are respectively a perspective view and a cross-sectional view of another embodiment of the package structure of the light-emitting element. As shown in the figure, the package structure 40 of the light-emitting component mainly comprises a double-sided circuit board 41, a heat-conducting substrate 43, at least one light-emitting diode 45 and at least one circuit component 47, wherein the light-emitting diode 45 is located on the heat-conducting substrate 43. The circuit component 47 is located on the double-sided circuit board 41. The thermally conductive substrate 43 includes one or more perforations 431 that will be located within the perforations 431 when the double-sided circuit board 41 is coupled to the thermally conductive substrate 43.
雙面電路板41包括一第一表面411及一第二表面413，其中第一表面411及第二表面413上皆設置連接線路(未顯示)。本創作所一實施例中，導熱基板43連接雙面電路板41的第二表面413，而電路元件47亦位於雙面電路板41的第二表面413。當雙面電路板41連接導熱基板43時，電路元件47將會位於導熱基板43的穿孔431內。The double-sided circuit board 41 includes a first surface 411 and a second surface 413. The first surface 411 and the second surface 413 are provided with connecting lines (not shown). In an embodiment of the present invention, the thermally conductive substrate 43 is coupled to the second surface 413 of the double-sided circuit board 41, and the circuit component 47 is also located on the second surface 413 of the double-sided circuit board 41. When the double-sided circuit board 41 is connected to the thermally conductive substrate 43, the circuit component 47 will be located within the perforations 431 of the thermally conductive substrate 43.
在本創作一實施例中，雙面電路板41及發光二極體45皆設置在導熱基板43的同一的表面，其中雙面電路板41之第二表面413透過導熱膠22連接導熱基板43，而發光二極體45則透過絕緣層44連接導熱基板43。In the embodiment of the present invention, the double-sided circuit board 41 and the light-emitting diodes 45 are disposed on the same surface of the heat-conductive substrate 43, wherein the second surface 413 of the double-sided circuit board 41 is connected to the heat-conductive substrate 43 through the thermal conductive adhesive 22, The light-emitting diode 45 is connected to the heat-conductive substrate 43 through the insulating layer 44.
在本創作一實施例中，發光二極體45可透過板上晶片技術(COB、chip on board)電性連接雙面電路板41的第一表面411，例如發光二極體45可透過導線451電性連接雙面電路板41的第一表面411，並經由雙面電路板41上的導孔415與第二表面413上的電路元件47電性連接。In an embodiment of the present invention, the LEDs 45 can be electrically connected to the first surface 411 of the double-sided circuit board 41 through a chip-on-board technology (COB, chip on board). For example, the LEDs 45 can pass through the wires 451. The first surface 411 of the double-sided circuit board 41 is electrically connected and electrically connected to the circuit component 47 on the second surface 413 via the via 415 on the double-sided circuit board 41.
在本創作實施例中，發光二極體45位於導熱基板43上，並有利於將發光過程中所產生的熱量傳遞至導熱基板43，藉此以降低發光二極體45的溫度。此外雙面電路板41的面積可小於導熱基板43，並將發光二極體45設置在未設置雙面電路板41的導熱基板43上。In the present embodiment, the light-emitting diodes 45 are located on the heat-conducting substrate 43 and facilitate the transfer of heat generated during the light-emitting process to the heat-conductive substrate 43, thereby reducing the temperature of the light-emitting diodes 45. Further, the area of the double-sided circuit board 41 may be smaller than that of the heat-conductive substrate 43, and the light-emitting diodes 45 may be disposed on the heat-conductive substrate 43 on which the double-sided circuit board 41 is not disposed.
在本創作中所述之連接指的是一個或多個物體或構件之間的直接連接或者是間接連接，例如可在一個或多個物體或構件之間存在有一個或多個中間連接物。A connection as used in this creation refers to a direct connection or an indirect connection between one or more objects or components, for example one or more intermediate connections may be present between one or more objects or components.
說明書之系統中所描述之也許、必須及變化等字眼並非本創作之限制。說明書所使用的專業術語主要用以進行特定實施例的描述，並不為本創作的限制。說明書所使用的單數量詞(如一個及該個)亦可為複數個，除非在說明書的內容有明確的說明。例如說明書所提及之一個裝置可包括有兩個或兩個以上之裝置的結合，而說明書所提之一物質則可包括有多種物質的混合。The words "may," and "changes" described in the system of the specification are not limitations of this creation. The technical terms used in the specification are mainly for the description of specific embodiments, and are not intended to be limiting. The single quantifiers (such as one and the one) used in the specification may also be plural, unless explicitly stated in the contents of the specification. For example, a device referred to in the specification may include a combination of two or more devices, and one of the materials mentioned in the specification may include a mixture of a plurality of substances.
以上所述者，僅為本創作之較佳實施例而已，並非用來限定本創作實施之範圍，即凡依本創作申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾，均應包括於本創作之申請專利範圍內。
The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications of the shapes, structures, features and spirits described in the scope of the patent application. , should be included in the scope of the patent application of this creation.
20‧‧‧封裝結構 20‧‧‧Package structure
21‧‧‧雙面電路板 21‧‧‧Double-sided circuit board
211‧‧‧第一表面 211‧‧‧ first surface
213‧‧‧第二表面 213‧‧‧ second surface
23‧‧‧導熱基板 23‧‧‧ Thermal substrate
231‧‧‧穿孔 231‧‧‧Perforation
25‧‧‧發光二極體 25‧‧‧Lighting diode
Claims (13)
一導熱基板，包括一個或多個穿孔；
一雙面電路板，包括一第一表面及一第二表面，其中該雙面電路板的第一表面連接該導熱基板；及
一個或多個發光二極體，位於該雙面電路板的第一表面，其中該雙面電路板與該導熱基板連接時，該發光二極體將會位於該導熱基板的穿孔內。A package structure of a light-emitting element, comprising:
a thermally conductive substrate comprising one or more perforations;
a double-sided circuit board comprising a first surface and a second surface, wherein a first surface of the double-sided circuit board is connected to the heat-conductive substrate; and one or more light-emitting diodes are located on the double-sided circuit board A surface, wherein the double-sided circuit board is connected to the thermally conductive substrate, the light-emitting diode will be located in the perforation of the thermally conductive substrate.
一導熱基板，包括一個或多個穿孔；
一雙面電路板，包括一第一表面及一第二表面，其中該雙面電路板的第二表面連接該導熱基板；
一個或多個發光二極體，位於該雙面電路板的第一表面；及
一個或多個電路元件，位於該雙面電路板的第二表面，其中該雙面電路板與該導熱基板連接時，該電路元件將會位於該導熱基板的穿孔內。A package structure of a light-emitting element, comprising:
a thermally conductive substrate comprising one or more perforations;
a double-sided circuit board comprising a first surface and a second surface, wherein the second surface of the double-sided circuit board is connected to the thermally conductive substrate;
One or more light emitting diodes on the first surface of the double-sided circuit board; and one or more circuit components on the second surface of the double-sided circuit board, wherein the double-sided circuit board is connected to the heat conductive substrate The circuit component will be located within the perforations of the thermally conductive substrate.
一導熱基板，包括一個或多個穿孔；
一雙面電路板，包括一第一表面及一第二表面，其中該雙面電路板的第二表面連接該導熱基板；
一個或多個發光二極體，位於該導熱基板上；及
一個或多個電路元件，位於該雙面電路板的第二表面，其中該雙面電路板與該導熱基板連接時，該電路元件將會位於該導熱基板的穿孔內，且該電路元件電性連接該發光二極體。A package structure of a light-emitting element, comprising:
a thermally conductive substrate comprising one or more perforations;
a double-sided circuit board comprising a first surface and a second surface, wherein the second surface of the double-sided circuit board is connected to the thermally conductive substrate;
One or more light emitting diodes on the thermally conductive substrate; and one or more circuit components on the second surface of the double-sided circuit board, wherein the circuit component is connected to the thermally conductive substrate It will be located in the perforation of the thermally conductive substrate, and the circuit component is electrically connected to the LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102200667U TWM457292U (en) | 2013-01-11 | 2013-01-11 | Package structure of lighting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102200667U TWM457292U (en) | 2013-01-11 | 2013-01-11 | Package structure of lighting element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM457292U true TWM457292U (en) | 2013-07-11 |
Family
ID=49227811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102200667U TWM457292U (en) | 2013-01-11 | 2013-01-11 | Package structure of lighting element |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM457292U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107620871A (en) * | 2017-10-30 | 2018-01-23 | 赛尔富电子有限公司 | A kind of LED light source module and its manufacture method |
-
2013
- 2013-01-11 TW TW102200667U patent/TWM457292U/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107620871A (en) * | 2017-10-30 | 2018-01-23 | 赛尔富电子有限公司 | A kind of LED light source module and its manufacture method |
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| Date | Code | Title | Description |
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| MM4K | Annulment or lapse of a utility model due to non-payment of fees |