TWM456284U - Casing - Google Patents
Casing Download PDFInfo
- Publication number
- TWM456284U TWM456284U TW101212863U TW101212863U TWM456284U TW M456284 U TWM456284 U TW M456284U TW 101212863 U TW101212863 U TW 101212863U TW 101212863 U TW101212863 U TW 101212863U TW M456284 U TWM456284 U TW M456284U
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- ink layer
- transfer ink
- glass
- present
- Prior art date
Links
Abstract
Description
本創作關於一種轉印膜元件(transfer film component)以及一種包含該轉印膜元件的殼體(casing)。並且特別地，本創作關於適用於製造殼體的外表面上之玻璃裝飾層的轉印膜元件，例如，熱轉印膜元件(heat transfer film component)、水轉印膜元件(water transfer film component)等。 The present invention relates to a transfer film component and a casing including the transfer film member. And in particular, the present invention relates to a transfer film member suitable for manufacturing a glass decorative layer on an outer surface of a casing, for example, a heat transfer film component, a water transfer film component )Wait.
現有消費性電子產品其殼體的外表面已有利用玻璃材料形成裝飾層。然而，採用玻璃裝飾層的現有技術皆為先行製造殼體本體以及玻璃裝飾片，再行將玻璃裝飾片接合或卡合在殼體本體的外表面上。由於玻璃裝飾片易碎，導致將玻璃裝飾片接合或卡合在殼體本體的外表面上的製造良率低。 Existing consumer electronic products have been formed with a decorative layer of glass on the outer surface of the housing. However, the prior art using the glass decorative layer is to manufacture the housing body and the glass decorative sheet first, and then join or snap the glass decorative sheet to the outer surface of the housing body. Since the glass decorative sheet is fragile, the manufacturing yield for joining or engaging the glass decorative sheet on the outer surface of the casing body is low.
此外，玻璃裝飾片無法包覆殼體本體的所有外表面，尤其是具有曲面的外表面。 Furthermore, the glass decorative sheet cannot cover all of the outer surfaces of the housing body, especially the curved outer surface.
此外，隨著可攜式電子產品對整體產品輕薄、短小的要求，可攜式電子產品之殼體的厚度也隨之被要求減薄。但是，採用玻璃裝飾層的現有技術無法達到減薄可攜式電子產品之殼體的厚度之要求。 In addition, as the portable electronic products are light and thin, the thickness of the casing of the portable electronic product is also required to be thinned. However, the prior art using a glass decorative layer cannot meet the requirements for thinning the thickness of the casing of the portable electronic product.
因此，本創作所欲解決的技術問題在於提供一種轉印膜元件以及一種包含該轉印膜元件的殼體。特別地，本創作之轉印膜元件適用於製造殼體的外表面上之玻璃裝飾層且能包覆殼體所有的外表面，並且本創作之殼體不但具有玻璃裝飾層且整體厚度可減薄。 Therefore, the technical problem to be solved by the present invention is to provide a transfer film member and a casing including the transfer film member. In particular, the transfer film element of the present invention is suitable for manufacturing a glass decorative layer on the outer surface of the casing and covering all outer surfaces of the casing, and the shell of the present invention not only has a glass decorative layer but the overall thickness can be reduced. thin.
本創作之轉印膜元件之一較佳具體實施例基本上為熱轉 印膜元件。本創作之熱轉印膜元件包含基材層、離型層、第一熱轉印油墨層以及接著層。離型層係形成於基材層之內表面上。第一熱轉印油墨層係形成於離型層上，且包含至少一玻璃材料顆粒及/或至少一釉料顆粒。接著層係形成於第一熱轉印油墨層上。 One of the preferred embodiments of the transfer film element of the present invention is substantially heat transfer Film element. The thermal transfer film element of the present invention comprises a substrate layer, a release layer, a first thermal transfer ink layer, and an adhesive layer. The release layer is formed on the inner surface of the substrate layer. The first thermal transfer ink layer is formed on the release layer and comprises at least one glass material particle and/or at least one glaze particle. A layer is then formed on the first thermal transfer ink layer.
進一步，本創作之熱轉印膜元件並且包含抗靜電層。抗靜電層係形成於基材層之外表面上。 Further, the heat transfer film element of the present invention also includes an antistatic layer. The antistatic layer is formed on the outer surface of the substrate layer.
進一步，本創作之熱轉印膜元件並且包含第二熱轉印油墨層。第二熱轉印油墨層係形成在第一熱轉印油墨層與接著層之間，並且包含玻璃助熔劑或低溫玻璃顆粒。 Further, the present thermal transfer film element comprises a second thermal transfer ink layer. A second thermal transfer ink layer is formed between the first thermal transfer ink layer and the adhesive layer and comprises a glass flux or low temperature glass particles.
進一步，本創作之熱轉印膜元件並且包含第三熱轉印油墨層。第三熱轉印油墨層係形成在第一熱轉印油墨層與接著層之間，並且包含金屬氧化物顆粒。 Further, the heat transfer film element of the present invention also includes a third thermal transfer ink layer. A third thermal transfer ink layer is formed between the first thermal transfer ink layer and the adhesive layer and contains metal oxide particles.
進一步，本創作之熱轉印膜元件並且包含第四熱轉印油墨層。第四熱轉印油墨層係形成在第一熱轉印油墨層與第三熱轉印油墨層之間，並且包含玻璃助熔劑或低溫玻璃顆粒。 Further, the heat transfer film element of the present invention further comprises a fourth thermal transfer ink layer. A fourth thermal transfer ink layer is formed between the first thermal transfer ink layer and the third thermal transfer ink layer and comprises a glass flux or low temperature glass particles.
本創作之轉印膜元件之另一較佳具體實施例基本上為水轉印膜元件。本創作之水轉印膜元件包含水溶性基材層以及第一水轉印油墨層。第一水轉印油墨層係形成於水溶性基材層之內表面上，並且包含至少一玻璃材料顆粒及/或至少一釉料顆粒。 Another preferred embodiment of the transfer film element of the present invention is substantially a water transfer film member. The water transfer film element of the present invention comprises a water soluble substrate layer and a first water transfer ink layer. The first water transfer ink layer is formed on the inner surface of the water soluble substrate layer and comprises at least one glass material particle and/or at least one glaze particle.
進一步，本創作之水轉印膜元件並且包含第二水轉印油墨層。第二水轉印油墨層係形成在第一水轉印油墨層上，並且包含玻璃助熔劑或低溫玻璃顆粒。 Further, the water transfer film element of the present invention further comprises a second water transfer ink layer. The second water transfer ink layer is formed on the first water transfer ink layer and contains a glass flux or low temperature glass particles.
進一步，本創作之水轉印膜元件並且包含第三水轉印油墨層。第三水轉印油墨層係形成在第一水轉印油墨層上，並且包含金屬氧化物顆粒。 Further, the water transfer film element of the present invention further comprises a third water transfer ink layer. The third water transfer ink layer is formed on the first water transfer ink layer and contains metal oxide particles.
進一步，本創作之水轉印膜元件並且包含第四水轉印油墨層。第四水轉印油墨層係形成在第一水轉印油墨層與第三水轉印油墨層之間，並且包含玻璃助熔劑或低溫玻璃顆粒。 Further, the water transfer film member of the present invention further comprises a fourth water transfer ink layer. The fourth water transfer ink layer is formed between the first water transfer ink layer and the third water transfer ink layer, and contains a glass flux or low temperature glass particles.
本創作之殼體之一較佳具體實施例，包含主體以及裝飾層。主體具有外表面，且係由輕金屬所形成。裝飾層係形成於外表面上，且係由至少一玻璃材料及/或至少一釉料所形成。 A preferred embodiment of the housing of the present invention comprises a body and a decorative layer. The body has an outer surface and is formed of a light metal. The decorative layer is formed on the outer surface and is formed of at least one glass material and/or at least one glaze.
進一步，本創作之殼體並且包含第一協助接合層。第一協助接合層係形成於主體與裝飾層之間，並且係由玻璃助熔劑或低溫玻璃所形成。 Further, the housing of the present invention also includes a first assisted bonding layer. The first assist bonding layer is formed between the body and the decorative layer and is formed of a glass flux or low temperature glass.
進一步，本創作之殼體並且包含第二協助接合層。第二協助接合層係形成於主體與裝飾層之間，並且係由金屬氧化物所形成。 Further, the housing of the present invention also includes a second assisted bonding layer. A second assist bonding layer is formed between the body and the decorative layer and is formed of a metal oxide.
進一步，本創作之殼體並且包含第三協助接合層。第三協助接合層係形成於第二協助接合層與裝飾層之間，並且係由玻璃助熔劑或低溫玻璃所形成。 Further, the housing of the present invention also includes a third assisted bonding layer. The third assist bonding layer is formed between the second assist bonding layer and the decorative layer, and is formed of a glass flux or low temperature glass.
於一具體實施例中，形成主體之輕金屬可以是鋰合金、鈹合金、鋁、鋁合金、鎂、鎂合金、鈦、鈦合金或其他密度低於4.5 g/cm3且利於成型的金屬或合金。 In one embodiment, the light metal forming the body may be a lithium alloy, a bismuth alloy, aluminum, an aluminum alloy, a magnesium alloy, a titanium alloy, a titanium alloy, or other metal or alloy having a density of less than 4.5 g/cm 3 and facilitating molding. .
與先前技術相較，本創作之具有玻璃裝飾層的殼體，其整體厚度可減薄。 Compared with the prior art, the shell having the glass decorative layer of the present invention can be thinned as a whole.
關於本創作之優點與精神可以藉由以下的實施方式及所附圖式得到進一步的瞭解。 The advantages and spirit of the present invention can be further understood by the following embodiments and the drawings.
請參閱第1圖，為本創作之轉印膜元件1之一較佳具體實施例的結構示意圖。本創作之轉印膜元件1基本上為熱轉印膜元件。 Please refer to FIG. 1 , which is a schematic structural view of a preferred embodiment of the transfer film element 1 of the present invention. The transfer film element 1 of the present invention is basically a thermal transfer film element.
如第1圖所示，本創作之熱轉印膜元件1包含基材層11、離型層12、第一熱轉印油墨層14以及接著層18。離型層12係形成於基材層11之內表面112上。第一熱轉印油墨層14係形成於離型層12上，且包含至少一玻璃材料顆粒及/或至少一釉料顆粒。接著層18係形成於第一熱轉印油墨層14上。 As shown in Fig. 1, the thermal transfer film element 1 of the present invention comprises a substrate layer 11, a release layer 12, a first thermal transfer ink layer 14, and an adhesive layer 18. The release layer 12 is formed on the inner surface 112 of the substrate layer 11. The first thermal transfer ink layer 14 is formed on the release layer 12 and comprises at least one glass material particle and/or at least one glaze particle. Layer 18 is then formed on first thermal transfer ink layer 14.
接著層18可以藉由印刷或塗佈製程形成在第一熱轉印油墨層14上，方便第一熱轉印油墨層14後續與殼體主體做熱熔接合。本創作之熱轉印膜元件1與殼體主體貼合方式可使用平面滾輪式熱轉寫或3D真空立體包膜完成第一熱轉印油墨層14、接著層18接合在殼體主體上的半成品。半成品經中高溫(150-400℃)烘烤移除第一油墨層14、接著層18之樹脂、溶劑，再進行450-1000℃之快速燒結，或半成品直接進行450-1000℃之快速燒結，完成具有玻璃裝飾層的殼體。 Subsequent layer 18 can be formed on the first thermal transfer ink layer 14 by a printing or coating process to facilitate subsequent thermal fusion bonding of the first thermal transfer ink layer 14 with the housing body. The thermal transfer film element 1 of the present invention is bonded to the casing body, and the first thermal transfer ink layer 14 and the subsequent layer 18 are bonded to the casing body by using a flat roller type thermal transfer or a 3D vacuum three-dimensional envelope. Semi finished product. The semi-finished product is baked at a medium-high temperature (150-400 ° C) to remove the first ink layer 14 , followed by the resin and solvent of the layer 18, and then subjected to rapid sintering at 450-1000 ° C, or the semi-finished product is directly subjected to rapid sintering at 450-1000 ° C. The housing with the glass decorative layer is completed.
於一具體實施例中，基材層11可以由PET樹脂、PEN(聚萘二甲酸乙二醇酯(Polyethylene Naphthalate))樹脂、PI(聚醯亞胺(Polyimide)樹脂或其他商用類似樹脂所形成。 In a specific embodiment, the substrate layer 11 may be formed of PET resin, PEN (Polyethylene Naphthalate) resin, PI (Polyimide resin) or other commercially similar resin. .
於實際應用中，基材層11之內表面112可以為一結構化表面。結構化表面係對應用來裝飾後續成型殼體的圖案。 In practical applications, the inner surface 112 of the substrate layer 11 can be a structured surface. The structured surface corresponds to the pattern used to decorate the subsequently formed casing.
於一具體實施例中，離型層12可以由矽膠、氟素樹脂、三聚氰胺或其他商用類似樹脂所形成。 In one embodiment, the release layer 12 can be formed from tannin, fluororesin, melamine, or other commercially similar resins.
於一具體實施例中，形成第一熱轉印油墨層14之油墨係將至少一玻璃材料顆粒及/或至少一釉料顆粒與易熱分解之樹脂、溶劑調和成凹版或網版可印刷型油墨。摻入油墨的玻璃材料顆粒與釉料顆粒視裝飾殼體效果而定，可以是熔點低於1200℃之玻璃；也可以是彩色玻璃(例如，鈷(藍)、錳(紫)、鉻(綠)、銅(Ⅱ)(藍綠)、鐵(Ⅲ)(黃)、鐵(Ⅱ)(藍綠)、氧化鎳(棕)、氧化鉀(紫)、鈦及鈰之氧化物(鮮黃)、氧化錳(黑)……等)；也可以是釉料，以低溫(500-1000℃)燒成之釉料為主(例如，銻黃釉、鉻 紅釉、銅綠釉、土耳其藍釉、鐵黃釉、硒紅釉、錳紫釉、珍珠岩鋯釉、結晶釉、唐三彩綠釉……等)。一般選用含有SiO2、P2O5、CaO、Na2O等成分的玻璃陶瓷，利用其提高金屬表面活性，達成與殼體主體強固接合的目的。 In one embodiment, the ink forming the first thermal transfer ink layer 14 blends at least one glass material particle and/or at least one glaze particle with an easily decomposable resin or solvent into a gravure or screen printable type. Ink. The glass material particles and glaze particles doped with the ink may be glass having a melting point of less than 1200 ° C depending on the effect of the decorative shell; or may be colored glass (for example, cobalt (blue), manganese (purple), chromium (green) ), copper (II) (blue-green), iron (III) (yellow), iron (II) (blue-green), nickel oxide (brown), potassium oxide (purple), titanium and antimony oxide (fresh yellow) , manganese oxide (black), etc.); or glaze, mainly glaze fired at low temperature (500-1000 ° C) (for example, yellow glaze, chrome red glaze, patina glaze, Turkish blue glaze, Iron yellow glaze, selenium red glaze, manganese purple glaze, perlite zirconium glaze, crystal glaze, Tang Sancai green glaze, etc.). Generally, a glass ceramic containing a component such as SiO 2 , P 2 O 5 , CaO or Na 2 O is used, and the surface activity of the metal is improved to achieve a strong bonding with the shell body.
於一具體實施例中，基材層11之厚度約為25μm~250μm。 In one embodiment, the substrate layer 11 has a thickness of about 25 μm to 250 μm.
於一具體實施例中，離型層12之厚度約為0.1μm~1μm。 In one embodiment, the release layer 12 has a thickness of between about 0.1 μm and about 1 μm.
於一具體實施例中，第一熱轉印油墨層14之厚度約為0.01mm~0.2mm。 In one embodiment, the first thermal transfer ink layer 14 has a thickness of about 0.01 mm to 0.2 mm.
於一具體實施例中，接著層18之厚度約為1μm~5μm。 In one embodiment, the thickness of the subsequent layer 18 is between about 1 [mu]m and 5 [mu]m.
同樣示於第1圖，進一步，本創作之熱轉印膜元件1並且包含抗靜電層10。抗靜電層10係形成於基材層11之外表面114上。 Also shown in Fig. 1, further, the heat transfer film element 1 of the present invention comprises an antistatic layer 10. The antistatic layer 10 is formed on the outer surface 114 of the substrate layer 11.
同樣示於第1圖，進一步，本創作之熱轉印膜元件1並且包含第二熱轉印油墨層16。第二熱轉印油墨層16係形成在第一熱轉印油墨層14與接著層18之間，並且包含玻璃助熔劑或低溫玻璃顆粒。第二熱轉印油墨層16用以協助第一熱轉印油墨層14後續燒結成的玻璃裝飾層接合在殼體主體上。玻璃助熔劑或低溫玻璃顆粒可以是熔點低於850℃(低於600℃較佳)之玻璃質及以鹼金屬之氧化物為主的玻璃助熔劑(例如，氧化鋇、氧化鈉、硫酸納、硼酸鈉、碳酸鉀…等)。 Also shown in Fig. 1, further, the heat transfer film element 1 of the present invention comprises a second thermal transfer ink layer 16. A second thermal transfer ink layer 16 is formed between the first thermal transfer ink layer 14 and the adhesive layer 18 and comprises a glass flux or low temperature glass particles. The second thermal transfer ink layer 16 is used to assist the subsequent sintering of the first thermal transfer ink layer 14 into a glass decorative layer bonded to the housing body. The glass flux or the low-temperature glass particles may be a glassy material having a melting point of less than 850 ° C (preferably less than 600 ° C) and a glass flux mainly composed of an alkali metal oxide (for example, cerium oxide, sodium oxide, sodium sulfate, Sodium borate, potassium carbonate, etc.).
於一具體實施例中，第二熱轉印油墨層16之厚度約為0.01mm~0.1mm。 In one embodiment, the second thermal transfer ink layer 16 has a thickness of about 0.01 mm to 0.1 mm.
請參閱第2圖，為本創作之轉印膜元件1之一變形的結構示意圖。本創作之熱轉印膜元件1並且包含第三熱轉印油墨層17。第三熱轉印油墨層17係形成在第一熱轉印油墨層14與接著層18之間，並且包含金屬氧化物顆粒。第三熱轉印油墨層 17用以協助第一熱轉印油墨層14後續燒結成的玻璃裝飾層接合在殼體主體上。進一步，本創作之熱轉印膜元件1並且包含第四熱轉印油墨層16’。第四熱轉印油墨層16’係形成在第一熱轉印油墨層14與第三熱轉印油墨層17之間，並且包含玻璃助熔劑或低溫玻璃顆粒。第四熱轉印油墨層16’之功用同上述第二熱轉印油墨層16。第2圖中具有與第1圖相同號碼標記之元件，有相同或類似的結構以及功能，在此不多做贅述。 Please refer to FIG. 2, which is a structural schematic diagram of a modification of one of the transfer film elements 1 of the present invention. The heat transfer film element 1 of the present invention also includes a third thermal transfer ink layer 17. The third thermal transfer ink layer 17 is formed between the first thermal transfer ink layer 14 and the adhesive layer 18, and contains metal oxide particles. Third thermal transfer ink layer A glass decorative layer for assisting subsequent sintering of the first thermal transfer ink layer 14 is bonded to the housing body. Further, the heat transfer film member 1 of the present invention comprises a fourth thermal transfer ink layer 16'. The fourth thermal transfer ink layer 16' is formed between the first thermal transfer ink layer 14 and the third thermal transfer ink layer 17, and contains a glass flux or low temperature glass particles. The fourth thermal transfer ink layer 16' functions similarly to the second thermal transfer ink layer 16 described above. In the second drawing, elements having the same reference numerals as in the first embodiment have the same or similar structures and functions, and will not be described here.
於一具體實施例中，第三熱轉印油墨層17之厚度約為0.1μm~10μm。 In one embodiment, the third thermal transfer ink layer 17 has a thickness of about 0.1 μm to 10 μm.
請參閱第3圖，為本創作之一較佳具體實施例的轉印膜元件2之結構示意圖。本創作之轉印膜元件2基本上為水轉印膜元件。 Please refer to FIG. 3, which is a schematic structural view of a transfer film member 2 according to a preferred embodiment of the present invention. The transfer film member 2 of the present invention is basically a water transfer film member.
如第3圖所示，本創作之水轉印膜元件2包含水溶性基材層20以及第一水轉印油墨層22。第一水轉印油墨層22係形成於水溶性基材層20之內表面202上，並且包含至少一玻璃材料顆粒及/或至少一釉料顆粒。 As shown in Fig. 3, the water transfer film member 2 of the present invention comprises a water-soluble base material layer 20 and a first water transfer ink layer 22. The first water transfer ink layer 22 is formed on the inner surface 202 of the water soluble substrate layer 20 and comprises at least one glass material particle and/or at least one glaze particle.
本創作之水轉印膜元件2係經由水轉印製程將第一水轉印油墨層22貼合在殼體主體上完成半成品。半成品經中高溫(150-400℃)熱移除第一水轉印油墨層22之樹脂、溶劑，再進行450-1000℃之快速燒結，或半成品直接進行450-1000℃之快速燒結，完成具有玻璃裝飾層的殼體。 The water transfer film member 2 of the present invention is formed by attaching the first water transfer ink layer 22 to the casing main body via a water transfer process to complete the semi-finished product. The semi-finished product is thermally removed at a medium-high temperature (150-400 ° C) to remove the resin and solvent of the first water-transfer ink layer 22, and then subjected to rapid sintering at 450-1000 ° C, or the semi-finished product is directly subjected to rapid sintering at 450-1000 ° C to complete The shell of the glass decorative layer.
於一具體實施例中，水溶性基材層20可以由聚乙烯醇(PVA)、澱粉(Starch)或其他商用類似水溶性材料所形成。 In one embodiment, the water soluble substrate layer 20 can be formed from polyvinyl alcohol (PVA), starch (Starch), or other commercially similar water soluble materials.
於實際應用中，水溶性基材層20之內表面202可以為一結構化表面。結構化表面係對應用來裝飾後續成型殼體的圖案。 In a practical application, the inner surface 202 of the water soluble substrate layer 20 can be a structured surface. The structured surface corresponds to the pattern used to decorate the subsequently formed casing.
於一具體實施例中，形成第一水轉印油墨層22之油墨係 將至少一玻璃材料顆粒及/或至少一釉料顆粒與水轉印專用樹脂、溶劑調和成凹版可印刷型油墨。摻入油墨的玻璃材料顆粒與釉料顆粒視裝飾殼體效果而定，其適用材料已詳述於上文，在此不多做贅述。 In one embodiment, the ink system forming the first water transfer ink layer 22 The at least one glass material particle and/or the at least one glaze particle are blended with a water transfer special resin and a solvent to form a gravure printable ink. The glass material particles and the glaze particles doped with the ink depend on the effect of the decorative shell, and the applicable materials thereof have been described in detail above, and will not be further described herein.
於一具體實施例中，水溶性基材層20之厚度約為20μm~75μm。 In one embodiment, the water soluble substrate layer 20 has a thickness of from about 20 [mu]m to about 75 [mu]m.
於一具體實施例中，第一水轉印油墨層22之厚度約為0.01mm~0.1mm。 In one embodiment, the first water transfer ink layer 22 has a thickness of about 0.01 mm to 0.1 mm.
同樣示於第3圖，進一步，本創作之水轉印膜元件2並且包含第二水轉印油墨層24。第二水轉印油墨層24係形成在第一水轉印油墨層22上，並且包含玻璃助熔劑或低溫玻璃顆粒。第二水轉印油墨層24用以協助第一水轉印油墨層22後續燒結成的玻璃裝飾層接合在殼體主體上。玻璃助熔劑或低溫玻璃顆粒的適用材料已詳述於上文，在此不多做贅述。 Also shown in Fig. 3, further, the water transfer film member 2 of the present invention comprises a second water transfer ink layer 24. The second water transfer ink layer 24 is formed on the first water transfer ink layer 22 and contains a glass flux or low temperature glass particles. The second water transfer ink layer 24 is used to assist the subsequent sintering of the glass decorative layer of the first water transfer ink layer 22 to be bonded to the casing body. Suitable materials for glass fluxes or low temperature glass particles have been described in detail above and will not be further described herein.
於一具體實施例中，第二水轉印油墨層24之厚度約為0.01mm~0.1mm。 In one embodiment, the second water transfer ink layer 24 has a thickness of about 0.01 mm to 0.1 mm.
請參閱第4圖，為本創作之水轉印膜元件2之一變形的結構示意圖。本創作之水轉印膜元件2並且包含第三水轉印油墨層26。第三水轉印油墨層26係形成在第一水轉印油墨層22上，並且包含金屬氧化物顆粒。第三水轉印油墨層26用以協助第一水轉印油墨層22後續燒結成的玻璃裝飾層接合在殼體主體上。進一步，本創作之水轉印膜元件2並且包含第四水轉印油墨層24’。第四水轉印油墨層24’係形成在第一水轉印油墨層22與第三水轉印油墨層26之間，並且包含玻璃助熔劑或低溫玻璃顆粒。第四水轉印油墨層24’之功用同上述第二水轉印油墨層24。第4圖中具有與第3圖相同號碼標記之元件，有相同或類似的結構以及功能，在此不多做贅述。 Please refer to Fig. 4, which is a structural schematic view showing a modification of one of the water transfer film members 2 of the present invention. The water transfer film element 2 of the present invention also includes a third water transfer ink layer 26. The third water transfer ink layer 26 is formed on the first water transfer ink layer 22 and contains metal oxide particles. The third water transfer ink layer 26 is used to assist the subsequent sintering of the glass decorative layer of the first water transfer ink layer 22 to be bonded to the casing body. Further, the water transfer film member 2 of the present invention further includes a fourth water transfer ink layer 24'. The fourth water transfer ink layer 24' is formed between the first water transfer ink layer 22 and the third water transfer ink layer 26, and contains a glass flux or low temperature glass particles. The fourth water transfer ink layer 24' functions similarly to the second water transfer ink layer 24 described above. The components in Fig. 4 having the same reference numerals as in Fig. 3 have the same or similar structures and functions, and will not be described here.
於一具體實施例中，第三水轉印油墨層26之厚度約為0.1μm~10μm。 In one embodiment, the third water transfer ink layer 26 has a thickness of about 0.1 μm to 10 μm.
請參閱第5圖，為本創作之一較佳具體實施例的殼體3之結構示意圖。殼體3係藉由如第1圖、第2圖所示之熱轉印膜元件1或如第3圖、第4圖所示之水轉印膜元件2裝飾外表面而得。 Please refer to FIG. 5, which is a schematic structural view of a housing 3 according to a preferred embodiment of the present invention. The casing 3 is obtained by decorating the outer surface of the thermal transfer film element 1 as shown in Figs. 1 and 2 or the water transfer film element 2 shown in Figs. 3 and 4 .
如第5圖所示，本創作之殼體3之一較佳具體實施例，包含主體30以及裝飾層36。主體30具有外表面302，且係由輕金屬所形成。裝飾層36係形成於外表面302上，且係由至少一玻璃材料及/或至少一釉料所形成。主體30藉由輕金屬的剛性、強度達到實用需求。裝飾層36的外表面362即經由透明玻璃、染色玻璃呈現玻璃材質外觀感覺，或經由釉料金屬氧化物表現如唐三彩、青花瓷、琉璃或琺瑯質感，或經由玻璃陶瓷呈現真實陶瓷質感。玻璃材料與釉料視裝飾殼體效果而定，其適用材料已詳述於上文，在此不多做贅述。裝飾層36的外表面362也可以是具有凹凸的立體化表面。 As shown in FIG. 5, a preferred embodiment of the present housing 3 includes a body 30 and a decorative layer 36. The body 30 has an outer surface 302 and is formed of a light metal. The decorative layer 36 is formed on the outer surface 302 and is formed of at least one glass material and/or at least one glaze. The body 30 achieves practical demand by the rigidity and strength of the light metal. The outer surface 362 of the decorative layer 36 exhibits a glass material appearance through transparent glass or dyed glass, or a glaze metal oxide such as Tang Sancai, blue-and-white porcelain, glass or enamel, or a true ceramic texture via glass ceramics. The glass material and the glaze depend on the effect of the decorative shell, and the applicable materials have been described in detail above, and will not be further described herein. The outer surface 362 of the decorative layer 36 may also be a three-dimensional surface having irregularities.
於一具體實施例中，裝飾層36之厚度約為0.01mm~0.2mm。 In one embodiment, the decorative layer 36 has a thickness of about 0.01 mm to 0.2 mm.
於一具體實施例中，形成主體30之輕金屬可以是鋰合金、鈹合金、鋁、鋁合金、鎂、鎂合金、鈦、鈦合金或其他密度低於4.5 g/cm3且利於成型的金屬或合金。 In a specific embodiment, the light metal forming the body 30 may be a lithium alloy, a bismuth alloy, aluminum, an aluminum alloy, a magnesium alloy, a titanium alloy, a titanium alloy, or other metals having a density of less than 4.5 g/cm 3 and which are favorable for molding or alloy.
同樣示於第5圖，進一步，本創作之殼體3並且包含第一協助接合層34。第一協助接合層34係形成於主體30與裝飾層36之間，並且係由玻璃助熔劑或低溫玻璃所形成。第一協助接合層34用以協助裝飾層36接合在主體30上。玻璃助熔劑或低溫玻璃顆粒的適用材料已詳述於上文，在此不多做贅述。 Also shown in Fig. 5, further, the inventive housing 3 also includes a first assisted bonding layer 34. The first assist bonding layer 34 is formed between the body 30 and the decorative layer 36 and is formed of a glass flux or low temperature glass. The first assist bonding layer 34 is used to assist the decorative layer 36 to engage the body 30. Suitable materials for glass fluxes or low temperature glass particles have been described in detail above and will not be further described herein.
於一具體實施例中，第一協助接合層34之厚度約為0.01mm~0.1mm。 In one embodiment, the first assist bonding layer 34 has a thickness of about 0.01 mm to 0.1 mm.
請參閱第6圖，為本創作之殼體3之一變形的結構示意圖。本創作之殼體3並且包含第二協助接合層32。第二協助接合層32係形成於主體30與裝飾層36之間，並且係由金屬氧化物所形成。第二協助接合層32用以協助裝飾層36接合在主體30上。進一步，本創作之殼體3並且包含第三協助接合層34’。第三協助接合層34’係形成於第二協助接合層32與裝飾層36之間，並且係由玻璃助熔劑或低溫玻璃所形成。 Please refer to FIG. 6 , which is a structural schematic diagram of a variant of the housing 3 of the present invention. The housing 3 of the present invention also includes a second assisted bonding layer 32. The second assist bonding layer 32 is formed between the body 30 and the decorative layer 36 and is formed of a metal oxide. The second assist bonding layer 32 is used to assist the decorative layer 36 to be bonded to the body 30. Further, the housing 3 of the present invention also includes a third assisted bonding layer 34'. The third assist bonding layer 34' is formed between the second assist bonding layer 32 and the decorative layer 36, and is formed of a glass flux or low temperature glass.
於一具體實施例中，第二協助接合層32之厚度約為0.1μm~10μm。 In one embodiment, the second assist bonding layer 32 has a thickness of about 0.1 μm to 10 μm.
藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本創作之特徵與精神，而並非以上述所揭露的較佳具體實施例來對本創作之範疇加以限制。相反地，其目的是希望能涵蓋各種改變及具相等性的安排於本創作所欲申請之專利範圍的範疇內。因此，本創作所申請之專利範圍的範疇應該根據上述的說明作最寬廣的解釋，以致使其涵蓋所有可能的改變以及具相等性的安排。 The features and spirit of the present invention are more clearly described in the above detailed description of the preferred embodiments, and the scope of the present invention is not limited by the preferred embodiments disclosed herein. On the contrary, it is intended to cover all kinds of changes and equivalences within the scope of the patent application to which the present invention is intended. Therefore, the scope of the patent scope applied for by this creation should be interpreted broadly based on the above description so that it covers all possible changes and equivalence arrangements.
1‧‧‧熱轉印膜元件 1‧‧‧ Thermal transfer film components
10‧‧‧抗靜電層 10‧‧‧Antistatic layer
11‧‧‧基材層 11‧‧‧Substrate layer
112‧‧‧內表面 112‧‧‧ inner surface
114‧‧‧外表面 114‧‧‧ outer surface
12‧‧‧離型層 12‧‧‧ release layer
14‧‧‧第一熱轉印油墨層 14‧‧‧First thermal transfer ink layer
16‧‧‧第二熱轉印油墨層 16‧‧‧Second thermal transfer ink layer
16’‧‧‧第四熱轉印油墨層 16'‧‧‧fourth thermal transfer ink layer
17‧‧‧第三熱轉印油墨層 17‧‧‧ Third thermal transfer ink layer
18‧‧‧接著層 18‧‧‧Next layer
2‧‧‧水轉印膜元件 2‧‧‧Water transfer film components
20‧‧‧水溶性基材層 20‧‧‧Water soluble substrate layer
202‧‧‧內表面 202‧‧‧ inner surface
22‧‧‧第一水轉印油墨層 22‧‧‧First water transfer ink layer
24‧‧‧第二水轉印油墨層 24‧‧‧Second water transfer ink layer
24’‧‧‧第四水轉印油墨層 24'‧‧‧ fourth water transfer ink layer
26‧‧‧第三水轉印油墨層 26‧‧‧ Third water transfer ink layer
3‧‧‧殼體 3‧‧‧Shell
30‧‧‧主體 30‧‧‧ Subject
302‧‧‧外表面 302‧‧‧Outer surface
32‧‧‧第二協助接合層 32‧‧‧Second assisted joint
34‧‧‧第一協助接合層 34‧‧‧First assisted joint
34’‧‧‧第三協助接合層 34’‧‧‧ third assisted joint
36‧‧‧裝飾層 36‧‧‧Decorative layer
362‧‧‧外表面 362‧‧‧ outer surface
第1圖係本創作之熱轉印膜元件的結構示意圖。 Fig. 1 is a schematic view showing the structure of the heat transfer film member of the present invention.
第2圖係本創作之熱轉印膜元件之一變形的結構示意圖。 Fig. 2 is a schematic view showing the structure of one of the heat transfer film elements of the present invention.
第3圖係本創作之水轉印膜元件的結構示意圖。 Fig. 3 is a schematic view showing the structure of the water transfer film member of the present invention.
第4圖係本創作之水轉印膜元件之一變形的結構示意圖。 Fig. 4 is a schematic view showing the structure of one of the water transfer film elements of the present invention.
第5圖係本創作之殼體的結構示意圖。 Figure 5 is a schematic view of the structure of the housing of the present invention.
第6圖係本創作之殼體之一變形的結構示意圖。 Figure 6 is a schematic view showing the structure of one of the shells of the present invention.
1‧‧‧熱轉印膜元件 1‧‧‧ Thermal transfer film components
10‧‧‧抗靜電層 10‧‧‧Antistatic layer
11‧‧‧基材層 11‧‧‧Substrate layer
112‧‧‧內表面 112‧‧‧ inner surface
114‧‧‧外表面 114‧‧‧ outer surface
12‧‧‧離型層 12‧‧‧ release layer
14‧‧‧第一熱轉印油墨層 14‧‧‧First thermal transfer ink layer
16‧‧‧第二熱轉印油墨層 16‧‧‧Second thermal transfer ink layer
18‧‧‧接著層 18‧‧‧Next layer
Claims (5)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101212863U TWM456284U (en) | 2012-07-04 | 2012-07-04 | Casing |
| CN 201220439392 CN202826780U (en) | 2012-07-04 | 2012-08-30 | Transfer printing membrane assembly and shell comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101212863U TWM456284U (en) | 2012-07-04 | 2012-07-04 | Casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM456284U true TWM456284U (en) | 2013-07-01 |
Family
ID=47938556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101212863U TWM456284U (en) | 2012-07-04 | 2012-07-04 | Casing |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202826780U (en) |
| TW (1) | TWM456284U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI711358B (en) * | 2018-09-30 | 2020-11-21 | 大陸商比亞迪股份有限公司 | Shell of electronic equipment, electronic equipment and complex |
| WO2021029883A1 (en) * | 2019-08-14 | 2021-02-18 | Hewlett-Packard Development Company, L.P. | Coated metal alloy substrate and process for production thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104210268A (en) * | 2014-05-29 | 2014-12-17 | 昆山华冠商标印刷有限公司 | Transfer printing membrane with outer line, shell structure using transfer printing membrane, making method of transfer printing membrane and making method of shell structure |
-
2012
- 2012-07-04 TW TW101212863U patent/TWM456284U/en not_active IP Right Cessation
- 2012-08-30 CN CN 201220439392 patent/CN202826780U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI711358B (en) * | 2018-09-30 | 2020-11-21 | 大陸商比亞迪股份有限公司 | Shell of electronic equipment, electronic equipment and complex |
| WO2021029883A1 (en) * | 2019-08-14 | 2021-02-18 | Hewlett-Packard Development Company, L.P. | Coated metal alloy substrate and process for production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN202826780U (en) | 2013-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI572066B (en) | The manufacturing method of a wavelength conversion device | |
| TWI778265B (en) | Sandwich glass and its manufacturing method, shell of electronic equipment and electronic equipment | |
| TWM456284U (en) | Casing | |
| CN111592234B (en) | Patterned curved glass and preparation method and application thereof | |
| JP2011000710A (en) | Decorative sheet, decorative sheet molding, and method for manufacturing decorative sheet | |
| CN102976624B (en) | Pattern coating glass and preparation method thereof | |
| JP2021508654A (en) | Windshield of a vehicle with a two-dimensional code and its manufacturing method | |
| JP2009542473A5 (en) | ||
| CN103419524B (en) | The manufacture craft of three layers of single-way perspective membrane printed material | |
| JP5359375B2 (en) | Molded resin laminate | |
| TWI477388B (en) | Method of fabricating casing and casing therefrom | |
| WO2018090473A1 (en) | External adhesive film of electronic product and preparation method thereof | |
| CN201342844Y (en) | Thermal transfer-printing film used for thermoprinting metal pictures and texts | |
| CN115340414B (en) | Metal particle for ceramic tile and preparation method and application thereof | |
| CN106507618A (en) | Exterior panel and its manufacture method | |
| CN102673292A (en) | Method for manufacturing gold foil color focus decorative glass | |
| CN102510688A (en) | Protection shell for digital product and manufacturing method | |
| JP3156701B2 (en) | Thermal transfer foil | |
| CN201245029Y (en) | Ice broken glass decoration picture | |
| WO2009015545A1 (en) | Gluey-magnetic production printed directly on surface | |
| CN212604225U (en) | Glitter heat-transfer seal membrane of carving characters | |
| JPS5857730A (en) | Manufacture of semiconductor package | |
| CN109795205B (en) | Colorful mobile phone shell with noble metal film, manufacturing equipment and forming method | |
| KR101667790B1 (en) | Cloisonne enamel comprising an image and/or letter and manufacturing method thereof | |
| JP2004299200A (en) | Manufacturing method for decorating article |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |