TWM453585U

TWM453585U - Laminated material structure for casing of electronic product

Info

Publication number: TWM453585U
Application number: TW101225183U
Authority: TW
Inventors: Jian-Ling Hong
Original assignee: Kunshan Tong Yin Ind Electronic Making Co Ltd
Priority date: 2012-04-09
Filing date: 2012-12-26
Publication date: 2013-05-21

Description

電子產品外殼材料疊層結構Electronic product shell material laminate structure

本創作屬於電子產品的外殼材料領域，具體涉及一種能夠簡化表面處理工序的電子產品外殼的材料疊層結構。This creation belongs to the field of outer casing materials for electronic products, and specifically relates to a material lamination structure of an electronic product casing which can simplify the surface treatment process.

現有電子產品外殼所採用的複合材料，一般在表面處理工藝成型後的產品表面有很多瑕疵與問題，需要經過多次整修打磨補土才能得到最終成品，且複合材料表面普通塗料不易附著，需噴塗架橋塗料以保證塗料間的層間密著，因此導致複合材料表面處理工藝複雜而且成本高，不利於其市場佔有率的提高，在一定程度上阻礙了其應用與發展。The composite materials used in the outer casing of the existing electronic products generally have many defects and problems on the surface of the surface after the surface treatment process, and it is necessary to refine the soil after repeated renovations to obtain the final product, and the common coating on the surface of the composite material is not easy to adhere, and needs to be sprayed. The bridging coating ensures the adhesion between the layers of the coating, which results in a complicated surface treatment process and high cost, which is not conducive to the increase of its market share, which hinders its application and development to some extent.

為了克服上述缺陷，本創作提供了一種電子產品外殼材料疊層結構，通過發明方法制得的電子產品外殼材料疊層結構能夠簡化後續的表面處理工藝並降低表面處理成本。In order to overcome the above drawbacks, the present invention provides an electronic product casing material laminate structure, and the electronic product casing material laminate structure obtained by the invention method can simplify the subsequent surface treatment process and reduce the surface treatment cost.

本創作為了解決其技術問題所採用的技術方案是：本創作提供了一種電子產品外殼材料疊層結構，包括複合材料部，所述複合材料部由樹脂和若干層塑膠纖維層構成，且若干層塑膠纖維層之間通過所述樹脂粘接，所述塑膠纖維層係選自熱固型碳纖維層、玻纖層、熱塑性碳纖維層以及克維拉(Kevlar)纖維層及其組合所構成之群組，所述複合材料部具有相對的兩個表面，所述兩個表面中的至少一個表面上形成有塑膠膜。The technical solution adopted by the present invention to solve the technical problem is that the present invention provides a laminated structure of an electronic product outer casing material, comprising a composite material portion composed of a resin and a plurality of layers of plastic fibers, and several layers. The plastic fiber layers are bonded by the resin, and the plastic fiber layer is selected from the group consisting of a thermosetting carbon fiber layer, a glass fiber layer, a thermoplastic carbon fiber layer, and a Kevlar fiber layer and combinations thereof. The composite portion has opposite surfaces, and at least one of the two surfaces is formed with Plastic film.

本創作的電子產品外殼材料疊層結構所採用的進一步技術方案是：較佳地，所述塑膠膜是聚碳酸酯(PC)膜、聚對苯二甲酸類塑膠(PET)膜、聚甲基丙烯酸甲酯(PMMA，又名亞克力)膜和聚醯胺(PA)膜中的一種。A further technical solution adopted by the laminated structure of the electronic product casing material of the present invention is: preferably, the plastic film is a polycarbonate (PC) film, a polyphthalic plastic (PET) film, a polymethyl group. One of a film of methyl acrylate (PMMA, also known as acrylic) and a film of polyamine (PA).

較佳地，所述塑膠膜的厚度係在38 μm至125 μm之範圍間。Preferably, the plastic film has a thickness ranging from 38 μm to 125 μm.

較佳地，所述複合材料部的所述相對的兩個表面分別為外表面和內表面，所述外表面上形成有所述塑膠膜。當然，所述內表面上也可形成有所述塑膠膜，也可沒有塑膠膜，視加工需求而定。Preferably, the opposite two surfaces of the composite material portion are an outer surface and an inner surface, respectively, and the plastic film is formed on the outer surface. Of course, the plastic film may also be formed on the inner surface, or may not have a plastic film, depending on processing requirements.

較佳地，所述複合材料部是下述六種結構中的一種：一、所述複合材料部由樹脂和若干層熱固型碳纖維層構成，且若干層熱固型碳纖維層之間透過所述樹脂粘接；二、所述複合材料部由樹脂和若干層熱塑性碳纖維層構成，且若干層熱塑性碳纖維層之間透過所述樹脂粘接；三、所述複合材料部由樹脂、若干層熱固型碳纖維層和若干層玻纖層構成，所述熱固型碳纖維層和所述玻纖層交錯堆疊並透過所述樹脂粘接；四、所述複合材料部由樹脂、若干層熱塑性碳纖維層和若干層玻纖層構成，所述熱塑性碳纖維層和所述玻纖層交錯堆疊並透過所述樹脂粘接；五、所述複合材料部由樹脂、一層熱固型碳纖維層和若干層玻纖層構成，所述若干層玻纖層通過所述樹脂粘接構成玻纖基層，所述熱固型碳纖維層透過所述樹脂粘接於所述玻纖基層；六、所述複合材料部由樹脂、一層熱塑性碳纖維層和若干層玻纖層構成，所述若干層玻纖層通過所述樹脂粘接構成玻纖基層，所述熱塑性碳纖維層透過所述樹脂粘接於所述玻纖基層。Preferably, the composite material portion is one of the following six structures: 1. The composite material portion is composed of a resin and a plurality of layers of thermosetting carbon fiber layers, and a plurality of layers of thermosetting carbon fiber layers are passed through each other. The resin material is composed of a resin and a plurality of layers of thermoplastic carbon fiber layers, and a plurality of layers of thermoplastic carbon fiber layers are bonded through the resin; and the composite material portion is made of a resin and a plurality of layers of heat. a solid carbon fiber layer and a plurality of layers of glass fibers, the thermosetting carbon fiber layer and the glass fiber layer are alternately stacked and bonded through the resin; and the composite material portion is made of a resin and a plurality of layers of thermoplastic carbon fibers. And a plurality of layers of glass fiber layers, the thermoplastic carbon fiber layer and the glass fiber layer are alternately stacked And bonding through the resin; 5. The composite material portion is composed of a resin, a layer of a thermosetting carbon fiber layer and a plurality of layers of glass fibers, and the plurality of layers of glass fibers are bonded by the resin to form a glass fiber base layer. The thermosetting carbon fiber layer is adhered to the glass fiber base layer through the resin; and the composite material portion is composed of a resin, a layer of thermoplastic carbon fiber layer and a plurality of layers of glass fibers, and the plurality of layers of glass fibers pass through The resin is bonded to form a glass fiber base layer, and the thermoplastic carbon fiber layer is adhered to the glass fiber base layer through the resin.

本創作還提供了一種電子產品外殼材料疊層結構的製造方法，將預先浸泡過樹脂的若干層塑膠纖維布堆疊形成一複合材料疊構，所述塑膠纖維布是熱固型碳纖維布、玻纖布、熱塑性碳纖維布以及克維拉纖維布中的至少一種，所述複合材料疊構具有相對的兩個表面，在所述兩表面的至少一個表面上覆蓋一層塑膠膜，然後通過給模具加壓加熱使覆蓋有所述塑膠膜的所述複合材料疊構固化成型，開模後制得所述電子產品外殼材料疊層結構。The present invention also provides a method for manufacturing a laminated structure of an outer casing material of an electronic product, wherein a plurality of layers of plastic fiber cloth pre-soaked with resin are stacked to form a composite material structure, the plastic fiber cloth is a thermosetting carbon fiber cloth and a glass fiber. At least one of a cloth, a thermoplastic carbon fiber cloth, and a Kevlar fiber cloth having opposite surfaces, a plastic film is coated on at least one surface of the two surfaces, and then the mold is pressurized Heating causes the composite material covered with the plastic film to be solidified and formed, and the electronic product outer casing material laminated structure is obtained after the mold is opened.

本創作的製造方法所採用的進一步技術方案是：較佳地，所述塑膠膜是聚碳酸酯(PC)膜、聚對苯二甲酸類塑膠(PET)膜、聚甲基丙烯酸甲酯(PMMA，又名亞克力)膜和聚醯胺(PA)膜中的一種。A further technical solution adopted by the manufacturing method of the present invention is that, preferably, the plastic film is a polycarbonate (PC) film, a polyethylene terephthalate plastic (PET) film, or a polymethyl methacrylate (PMMA). , also known as acrylic, one of a film and a polyamide (PA) film.

較佳地，所述塑膠膜的厚度係在38 μm至125 μm之範圍間。Preferably, the plastic film has a thickness ranging from 38 μm to 125 μm. between.

較佳地，所述複合材料疊構的所述相對的兩個表面分別為頂面和底面，在所述頂面上覆蓋所述塑膠膜。當然，所述底面也可覆蓋所述塑膠膜，也可不覆蓋塑膠膜，視加工需求而定。Preferably, the opposite two surfaces of the composite material are respectively a top surface and a bottom surface, and the plastic film is covered on the top surface. Of course, the bottom surface may also cover the plastic film or may not cover the plastic film, depending on processing requirements.

較佳地，所述複合材料疊構是下述六種堆疊方式中的一種：一、將若干層預先浸泡過樹脂的熱固型碳纖維布堆疊；二、將若干層預先浸泡過樹脂的熱塑性碳纖維布堆疊；三、將若干層預先浸泡過樹脂的熱固型碳纖維布和若干層預先浸泡過樹脂的玻纖布交錯堆疊；四、將若干層預先浸泡過樹脂的熱塑性碳纖維布和若干層預先浸泡過樹脂的玻纖布交錯堆疊；五、將若干層預先浸泡過樹脂的玻纖布堆疊，構成一玻纖基底，然後在玻纖基底的頂面堆疊一層熱固型碳纖維布；六、將若干層預先浸泡過樹脂的玻纖布堆疊，構成一玻纖基底，然後在玻纖基底的頂面堆疊一層熱塑性碳纖維布。Preferably, the composite material stack is one of the following six stacking methods: one, stacking a plurality of layers of a thermosetting carbon fiber cloth pre-soaked through a resin; and second, a plurality of layers of thermoplastic carbon fiber pre-soaked with resin. Cloth stacking; third, stacking several layers of pre-soaked resin thermosetting carbon fiber cloth and several layers of pre-soaked resin fiberglass cloth; 4, pre-soaking several layers of thermoplastic carbon fiber cloth pre-soaked with resin and several layers The resin fiberglass cloth is staggered and stacked; five, several layers of glass fiber cloth pre-soaked through the resin are stacked to form a glass fiber substrate, and then a layer of thermosetting carbon fiber cloth is stacked on the top surface of the glass fiber substrate; The layer is pre-soaked with a resin fiberglass cloth stack to form a glass fiber substrate, and then a thermoplastic carbon fiber cloth is stacked on the top surface of the glass fiber substrate.

本創作的有益效果是：本創作主要是在複合材料成型的同時在複合材料表面形成一層塑膠膜，形成由複合材料部和塑膠膜構成的電子產品外殼材料疊層結構，以簡化後續的表面處理工藝，本創作的電子產品外殼材料疊層結構表面僅需通過一次打磨補土噴塗或者不用打磨補土噴塗(免噴塗)就可以將產品達到最終成品的效果，降低了表面處理成本。The beneficial effect of the creation is that the creation is mainly to form a plastic film on the surface of the composite material while forming the composite material, forming a laminated structure of the outer shell of the electronic product composed of the composite material part and the plastic film to simplify the subsequent surface treatment. The process, the surface of the laminated structure of the electronic product shell material of the present invention can be achieved only by one-time grinding or soil-removing (without spraying) to achieve the final product, and the surface treatment cost is reduced.

請參照第1圖，為本創作實施例之結構剖面示意圖。本創作提出一種電子產品外殼材料疊層結構，包括複合材料部1，所述複合材料部由樹脂和若干層塑膠纖維層構成，且若干層塑膠纖維層之間通過所述樹脂粘接，所述塑膠纖維層係選自熱固型碳纖維層、玻纖層、熱塑性碳纖維層、克維拉纖維層及其組合所構成之群組，所述複合材料部1具有相對的外表面和內表面，所述外表面上形成有塑膠膜2。Please refer to FIG. 1 , which is a schematic cross-sectional view of the structure of the present invention. The present invention proposes a laminated structure of an outer casing material of an electronic product, comprising a composite material portion 1 composed of a resin and a plurality of layers of plastic fibers, and a plurality of layers of plastic fibers are bonded by the resin. The plastic fiber layer is selected from the group consisting of a thermosetting carbon fiber layer, a glass fiber layer, a thermoplastic carbon fiber layer, a Kevlar fiber layer, and a combination thereof, the composite material portion 1 having opposite outer and inner surfaces, A plastic film 2 is formed on the outer surface.

所述塑膠膜2是聚碳酸酯(PC)膜、聚對苯二甲酸類塑膠(PET)膜、聚甲基丙烯酸甲酯(PMMA，又名亞克力)膜和聚醯胺(PA)膜中的一種。The plastic film 2 is a polycarbonate (PC) film, a polyethylene terephthalate plastic (PET) film, a polymethyl methacrylate (PMMA, also known as acrylic) film and a polyamide (PA) film. One.

所述塑膠膜的厚度係在38 μm至125 μm之範圍間。The thickness of the plastic film is in the range of 38 μm to 125 μm.

所述複合材料部1是下述六種結構中的一種：一、所述複合材料部1由樹脂和若干層熱固型碳纖維層構成，且若干層熱固型碳纖維層之間通過所述樹脂粘接；二、所述複合材料部1由樹脂和若干層熱塑性碳纖維層構成，且若干層熱塑性碳纖維層之間通過所述樹脂粘接；三、所述複合材料部1由樹脂、若干層熱固型碳纖維層和若干層玻纖層構成，所述熱固型碳纖維層和所述玻纖層交錯堆疊並通過所述樹脂粘接；四、所述複合材料部1由樹脂、若干層熱塑性碳纖維層和若干層玻纖層構成，所述熱塑性碳纖維層和所述玻纖層交錯堆疊並通過所述樹脂粘接；五、所述複合材料部1由樹脂、一層熱固型碳纖維層和若干層玻纖層構成，所述若干層玻纖層通過所述樹脂粘接構成玻纖基層，所述熱固型碳纖維層通過所述樹脂粘接於所述玻纖基層；六、所述複合材料部1由樹脂、一層熱塑性碳纖維層和若干層玻纖層構成，所述若干層玻纖層通過所述樹脂粘接構成玻纖基層，所述熱塑性碳纖維層通過所述樹脂粘接於所述玻纖基層。The composite material portion 1 is one of the following six structures: 1. The composite material portion 1 is composed of a resin and a plurality of layers of thermosetting carbon fiber layers, and a plurality of layers of thermosetting carbon fiber layers pass between the resins. Bonding; 2. The composite part 1 is composed of a resin and a plurality of layers of thermoplastic carbon fibers, and a plurality of layers of thermoplastic carbon fibers are bonded by the resin; 3. The composite part 1 is made of resin and several layers of heat. a solid carbon fiber layer and a plurality of layers of glass fibers, the thermosetting carbon fiber layer and the glass fiber layer are alternately stacked and bonded by the resin; and the composite material portion 1 is composed of a resin and a plurality of layers of thermoplastic carbon fibers. a layer and a plurality of layers of glass layers, the thermoplastic carbon fiber layer and the glass layer interlaced Laminated and bonded by the resin; 5. The composite material portion 1 is composed of a resin, a layer of a thermosetting carbon fiber layer and a plurality of layers of glass fibers, and the plurality of layers of glass fibers are bonded by the resin to form a glass fiber. a base layer, the thermosetting carbon fiber layer is bonded to the glass fiber base layer by the resin; and the composite material part 1 is composed of a resin, a layer of thermoplastic carbon fiber and a plurality of layers of glass fibers, the plurality of layers of glass The fiber layer is bonded to the glass fiber base layer by the resin, and the thermoplastic carbon fiber layer is bonded to the glass fiber base layer by the resin.

上述電子產品外殼材料疊層結構的製造方法如下：將預先浸泡過樹脂的若干層塑膠纖維布堆疊形成一複合材料疊構，所述塑膠纖維布係選自熱固型碳纖維布、玻纖布、熱塑性碳纖維布、克維拉纖維布及其組合所構成之群組，所述複合材料疊構具有相對的底面和頂面，在所述頂面上覆蓋一層塑膠膜2，然後通過給模具加壓加熱使覆蓋有所述塑膠膜的所述複合材料疊構固化成型，開模後制得所述電子產品外殼材料疊層結構。The method for manufacturing the laminated structure of the electronic product outer casing material is as follows: stacking a plurality of layers of plastic fiber cloth pre-soaked with resin to form a composite material structure, wherein the plastic fiber cloth is selected from the group consisting of a thermosetting carbon fiber cloth and a fiberglass cloth. a group consisting of a thermoplastic carbon fiber cloth, a Kevlar fiber cloth, and a combination thereof, the composite material structure having opposite bottom and top surfaces, covered with a plastic film 2 on the top surface, and then pressurized by a mold Heating causes the composite material covered with the plastic film to be solidified and formed, and the electronic product outer casing material laminated structure is obtained after the mold is opened.

其中，所述複合材料疊構是下述六種堆疊方式中的一種：一、將若干層預先浸泡過樹脂的熱固型碳纖維布堆疊；二、將若干層預先浸泡過樹脂的熱塑性碳纖維布堆疊；三、將若干層預先浸泡過樹脂的熱固型碳纖維布和若干層預先浸泡過樹脂的玻纖布交錯堆疊；四、將若干層預先浸泡過樹脂的熱塑性碳纖維布和若干層預先浸泡過樹脂的玻纖布交錯堆疊；五、將若干層預先浸泡過樹脂的玻纖布堆疊，構成一玻纖基底，然後在玻纖基底的頂面堆疊一層熱固型碳纖維布；六、將若干層預先浸泡過樹脂的玻纖布堆疊，構成一玻纖基底，然後在玻纖基底的頂面堆疊一層熱塑性碳纖維布。Wherein, the composite material stack is one of the following six stacking methods: one, stacking a plurality of layers of the thermosetting carbon fiber cloth pre-soaked through the resin; and second, stacking a plurality of layers of the thermoplastic carbon fiber cloth pre-soaked with the resin. Third, a plurality of layers of pre-soaked resin thermosetting carbon fiber cloth and several layers of pre-soaked resin fiberglass cloth are staggered and stacked; Fourth, several layers of pre-soaked resin thermoplastic carbon fiber cloth and several layers The glass fiber cloth pre-soaked with resin is staggered and stacked; five, several layers of glass fiber cloth pre-soaked with resin are stacked to form a glass fiber substrate, and then a layer of thermosetting carbon fiber cloth is stacked on the top surface of the glass fiber substrate; A plurality of layers of glass cloth pre-soaked with resin are stacked to form a glass fiber substrate, and then a thermoplastic carbon fiber cloth is stacked on the top surface of the glass fiber substrate.

1‧‧‧複合材料部1‧‧‧Composite Materials Division

2‧‧‧塑膠膜2‧‧‧Plastic film

第1圖為本創作實施例之結構剖面示意圖。Figure 1 is a schematic cross-sectional view showing the structure of the present embodiment.

1‧‧‧複合材料部1‧‧‧Composite Materials Division

2‧‧‧塑膠膜2‧‧‧Plastic film

Claims

一種電子產品外殼材料疊層結構，包括一複合材料部，該複合材料部包含一樹脂和複數塑膠纖維層，且該塑膠纖維層之間透過該樹脂粘接，其中該複合材料部具有相對之二表面，該些表面中的至少一個表面上形成一塑膠膜。An electronic product casing material laminated structure comprising a composite material portion, the composite material portion comprising a resin and a plurality of plastic fiber layers, wherein the plastic fiber layers are bonded through the resin, wherein the composite material portion has two opposite A plastic film is formed on at least one of the surfaces.

如請求項1所述之電子產品外殼材料疊層結構，其中，該塑膠纖維層係選自熱固型碳纖維層、玻纖層、熱塑性碳纖維層、克維拉纖維層及其組合所構成之群組。The laminated structure of an electronic product casing material according to claim 1, wherein the plastic fiber layer is selected from the group consisting of a thermosetting carbon fiber layer, a glass fiber layer, a thermoplastic carbon fiber layer, a Kevlar fiber layer, and a combination thereof. group.

如請求項1所述之電子產品外殼材料疊層結構，其中，所述塑膠膜係選自聚碳酸酯膜、聚對苯二甲酸類塑膠膜、聚甲基丙烯酸甲酯膜、聚醯胺膜及其組合所構成之群組。The laminated structure of an outer casing material of an electronic product according to claim 1, wherein the plastic film is selected from the group consisting of a polycarbonate film, a polyphthalate plastic film, a polymethyl methacrylate film, and a polyamide film. And the group formed by its combination.

如請求項1所述之電子產品外殼材料疊層結構，其中，所述塑膠膜的厚度係在38 μm至125 μm之範圍間。The electronic product casing material laminate structure according to claim 1, wherein the plastic film has a thickness ranging from 38 μm to 125 μm.

如請求項1所述之電子產品外殼材料疊層結構，其中，該複合材料部的相對之該些表面分別為一外表面和一內表面，該外表面上形成該塑膠膜。The laminated structure of the outer casing of the electronic product according to claim 1, wherein the opposite surfaces of the composite portion are an outer surface and an inner surface, and the plastic film is formed on the outer surface.

如請求項2所述之電子產品外殼材料疊層結構，其中，該複合材料部由該樹脂和複數熱固型碳纖維層構成，且該些熱固型碳纖維層之間透過該樹脂粘接。The laminate structure of an electronic product casing material according to claim 2, wherein the composite material portion is composed of the resin and a plurality of thermosetting carbon fiber layers, and the thermosetting carbon fiber layers are bonded through the resin.

如請求項2所述之電子產品外殼材料疊層結構，其中，該複合材料部由該樹脂和複數熱塑性碳纖維層構成，且該些熱塑性碳纖維層之間透過該樹脂粘接。The electronic product outer casing material laminate structure according to claim 2, wherein the composite material portion is composed of the resin and the plurality of thermoplastic carbon fiber layers, and the thermoplastic carbon fiber layers are bonded through the resin.

如請求項2所述之電子產品外殼材料疊層結構，其中，該複合材料部由該樹脂、複數熱固型碳纖維層和複數玻纖層構成，該些熱固型碳纖維層和該些玻纖層交錯堆疊並透過該樹脂粘接。The electronic product outer casing material laminated structure according to claim 2, wherein the composite material portion is composed of the resin, a plurality of thermosetting carbon fiber layers and a plurality of glass fiber layers, the thermosetting carbon fiber layers and the glass fibers. The layers are staggered and bonded through the resin.

如請求項2所述之電子產品外殼材料疊層結構，其中，該複合材料部由該樹脂、複數熱塑性碳纖維層和複數玻纖層構成，該熱塑性碳纖維層和該玻纖層交錯堆疊並透過該樹脂粘接。The electronic product outer casing material laminate structure according to claim 2, wherein the composite material portion is composed of the resin, the plurality of thermoplastic carbon fiber layers and the plurality of glass fiber layers, and the thermoplastic carbon fiber layer and the glass fiber layer are alternately stacked and passed through the Resin bonding.

如請求項2所述之電子產品外殼材料疊層結構，其中，該複合材料部由樹脂、一熱固型碳纖維層和複數玻纖層構成，該些玻纖層透過該樹脂粘接構成一玻纖基層，該熱固型碳纖維層透過該樹脂粘接於該玻纖基層。The laminate structure of an electronic product casing material according to claim 2, wherein the composite material portion is composed of a resin, a thermosetting carbon fiber layer and a plurality of glass fiber layers, and the glass fiber layers are bonded to form a glass through the resin. a fiber base layer, the thermosetting carbon fiber layer being bonded to the glass fiber base layer through the resin.

如請求項2所述之電子產品外殼材料疊層結構，其中，該複合材料部由該樹脂、一熱塑性碳纖維層和複數玻纖層構成，該些玻纖層透過該樹脂粘接構成一玻纖基層，該熱塑性碳纖維層透過該樹脂粘接於該玻纖基層。The laminate structure of an electronic product casing material according to claim 2, wherein the composite material portion is composed of the resin, a thermoplastic carbon fiber layer and a plurality of glass fiber layers, and the glass fiber layers are bonded to form a glass fiber through the resin. In the base layer, the thermoplastic carbon fiber layer is bonded to the glass fiber base layer through the resin.