CN202517778U - Material laminated structure of electronic product shell - Google Patents
Material laminated structure of electronic product shell Download PDFInfo
- Publication number
- CN202517778U CN202517778U CN2012201449673U CN201220144967U CN202517778U CN 202517778 U CN202517778 U CN 202517778U CN 2012201449673 U CN2012201449673 U CN 2012201449673U CN 201220144967 U CN201220144967 U CN 201220144967U CN 202517778 U CN202517778 U CN 202517778U
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Abstract
The utility model discloses a material laminated structure of an electronic product shell. The material laminated structure comprises a composite material part, wherein the composite material part is formed by splicing a plurality of layers of element material structures; each element material structure is formed by resin and a plastic fiber layer; the plastic fiber layer is at least one of a carbon fiber layer, a glass fiber layer and a Keveler fiber layer; the resin is thermosetting resin or thermoplastic resin; and the composite material part has two opposite surfaces, and a plastic film is formed on at least one of the two opposite surfaces. Due to the plastic film on the surface of the composite material part, the subsequent surface treatment process can be simplified, and the product can achieve the effect of a final product only by polishing, putty and spraying once or without polishing, putty and spraying, so that the surface treatment cost is reduced.
Description
Technical field
The utility model belongs to the electronic product shell field of materials, is specifically related to a kind of material stack structure that can simplify the electronic product casing of surface treatment procedure.
Background technology
The composite that existing electronic product casing is adopted; General product surface after the process of surface treatment moulding has a lot of flaws and problem, need just can obtain final finished through repeatedly rebuilding polishing benefit soil, and the common coating of composite material surface is difficult for adhering to; Need spraying bridge formation coating to guarantee the interlayer adherence between coating; Therefore cause composite material surface complex treatment process and cost high, be unfavorable for the raising of its occupation rate of market, hindered it to a certain extent and used and development.
The utility model content
In order to overcome above-mentioned defective, the utility model provides a kind of electronic product casing material stack structure, and this electronic product casing material stack structure can be simplified follow-up process of surface treatment and reduce the surface treatment cost.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of electronic product casing material stack structure; Comprise composite portion; Said composite portion constitutes by several layers unit material structure is bonding; Each said unit material structure all is made up of resin and one deck plastic optical fibre layer, and said plastic optical fibre layer is at least a in carbon fiber layer, fiberglass layer and the Ke Weila fibrage, and said resin is a kind of in thermosetting resin and the thermoplastic resin; Said composite portion has two relative surfaces, is formed with plastic foil at least one surface in said two surfaces.
The further technical scheme of the utility model is:
Preferably, said plastic foil is a kind of in Merlon (PC) film, poly terephthalic acid class plastics (PET) film, polymethyl methacrylate (PMMA has another name called acrylic) film and the polyamide (PA) film.
Preferably, the thickness of said plastic foil is 38 μ m～125 μ m.
Preferably, said two relative surfaces of said composite portion are respectively outer surface and inner surface, are formed with said plastic foil on the said outer surface.Certainly, also can be formed with said plastic foil on the said inner surface, also can not have plastic foil, look process requirements and decide.
Said plastic foil surface can have pattern.
Preferably, said composite portion is a kind of in following five kinds of structures:
One, said composite portion constitutes by several layers unit material structure is bonding, and each said unit material structure all is made up of thermosetting resin and one deck carbon fiber layer;
Two, said composite portion constitutes by several layers unit material structure is bonding, and each said unit material structure all is made up of thermoplastic resin and one deck carbon fiber layer;
Three, said composite portion constitutes by several layers unit material structure is bonding; Said several layers unit material structure is meant some carbon fiber unit material structures and some glass unit material structures; Said carbon fiber unit material structure and said glass unit material structure be interlaced pile up bonding; Each said carbon fiber unit material structure all is made up of thermosetting resin and one deck carbon fiber layer, and each said glass unit material structure all is made up of thermosetting resin and layer of glass fiber layer;
Four, said composite portion constitutes by several layers unit material structure is bonding; Said several layers unit material structure is meant some carbon fiber unit material structures and some glass unit material structures; Said carbon fiber unit material structure and said glass unit material structure be interlaced pile up bonding; Each said carbon fiber unit material structure all is made up of thermoplastic resin and one deck carbon fiber layer, and each said glass unit material structure all is made up of thermoplastic resin and layer of glass fiber layer;
Five, said composite portion constitutes by several layers unit material structure is bonding; Said several layers unit material structure is meant a carbon fiber unit material structure and some glass unit material structures; Some glass unit material structures are piled up bonding formation glass basic unit; A said carbon fiber unit material structure is piled up and is adhered to said glass basic unit; Said carbon fiber unit material structure is made up of thermosetting resin and one deck carbon fiber layer, and each said glass unit material structure all is made up of thermosetting resin and layer of glass fiber layer.
The beneficial effect of the utility model is: the utility model mainly is in composite material forming, to form one deck plastic foil at composite material surface; The electronic product casing material stack structure that formation is made up of composite portion and plastic foil; To simplify follow-up process of surface treatment; Only need or need not polish and mend the effect that native spraying (exempting from spraying) just can reach product final finished in the electronic product casing material stack structure surface of the utility model through the soil spraying of once polishing benefit, reduced the surface treatment cost.
Description of drawings
Fig. 1 is the generalized section of the utility model electronic product casing material stack structure.
The specific embodiment
Embodiment: a kind of electronic product casing material stack structure; Comprise composite portion 1; Said composite portion constitutes by several layers unit material structure is bonding; Each said unit material structure all is made up of resin and one deck plastic optical fibre layer, and said plastic optical fibre layer is at least a in carbon fiber layer, fiberglass layer and the Ke Weila fibrage, and said resin is a kind of in thermosetting resin and the thermoplastic resin; Said composite portion has opposed outer surface and inner surface, is formed with plastic foil 2 on the said outer surface.
Said plastic foil is a kind of in Merlon (PC) film, poly terephthalic acid class plastics (PET) film, polymethyl methacrylate (PMMA has another name called acrylic) film and the polyamide (PA) film.
The thickness of said plastic foil is 38 μ m～125 μ m.
Said plastic foil surface can have pattern.
Said composite portion is a kind of in following five kinds of structures:
One, said composite portion constitutes by several layers unit material structure is bonding, and each said unit material structure all is made up of thermosetting resin and one deck carbon fiber layer;
Two, said composite portion constitutes by several layers unit material structure is bonding, and each said unit material structure all is made up of thermoplastic resin and one deck carbon fiber layer;
Three, said composite portion constitutes by several layers unit material structure is bonding; Said several layers unit material structure is meant some carbon fiber unit material structures and some glass unit material structures; Said carbon fiber unit material structure and said glass unit material structure be interlaced pile up bonding; Each said carbon fiber unit material structure all is made up of thermosetting resin and one deck carbon fiber layer, and each said glass unit material structure all is made up of thermosetting resin and layer of glass fiber layer;
Four, said composite portion constitutes by several layers unit material structure is bonding; Said several layers unit material structure is meant some carbon fiber unit material structures and some glass unit material structures; Said carbon fiber unit material structure and said glass unit material structure be interlaced pile up bonding; Each said carbon fiber unit material structure all is made up of thermoplastic resin and one deck carbon fiber layer, and each said glass unit material structure all is made up of thermoplastic resin and layer of glass fiber layer;
Five, said composite portion constitutes by several layers unit material structure is bonding; Said several layers unit material structure is meant a carbon fiber unit material structure and some glass unit material structures; Some glass unit material structures are piled up bonding formation glass basic unit; A said carbon fiber unit material structure is piled up and is adhered to said glass basic unit; Said carbon fiber unit material structure is made up of thermosetting resin and one deck carbon fiber layer, and each said glass unit material structure all is made up of thermosetting resin and layer of glass fiber layer.
The manufacturing approach of above-mentioned electronic product casing material stack structure is following: the several layers plastic optical fibre cloth that will soak resin in advance piles up and forms the folded structure of a composite; Said plastic optical fibre cloth is at least a in carbon cloth, glass cloth and the Ke Weila cloth; The folded structure of said composite has opposed bottom surface and end face; On said end face, cover one deck plastic foil; The folded structure curing molding of said composite that is coated with said plastic foil through making for the mould pressurized, heated then makes said electronic product casing material stack structure after the die sinking.
Wherein, the folded structure of said composite is a kind of in following five kinds of stack manners:
One, the carbon cloth that several layers was soaked thermosetting resin in advance piles up;
Two, the carbon cloth that several layers was soaked thermoplastic resin in advance piles up;
Three, several layers was soaked the carbon cloth of thermosetting resin in advance and glass cloth that several layers soaked thermosetting resin in advance is staggeredly stacked;
Four, several layers was soaked the carbon cloth of thermoplastic resin in advance and glass cloth that several layers soaked thermoplastic resin in advance is staggeredly stacked;
Five, the glass cloth that several layers was soaked thermosetting resin in advance piles up, and constitutes a glass substrate, and the end face in the glass substrate piles up the carbon cloth that one deck soaked thermosetting resin in advance then.
Claims (6)
1. electronic product casing material stack structure; Comprise composite portion (1); Said composite portion constitutes by several layers unit material structure is bonding; Each said unit material structure all is made up of resin and one deck plastic optical fibre layer, and said plastic optical fibre layer is at least a in carbon fiber layer, fiberglass layer and the Ke Weila fibrage, and said resin is a kind of in thermosetting resin and the thermoplastic resin; It is characterized in that: said composite portion has two relative surfaces, is formed with plastic foil (2) at least one surface in said two surfaces.
2. electronic product casing material stack structure as claimed in claim 1 is characterized in that: said plastic foil is a kind of in polycarbonate membrane, poly terephthalic acid class plastic foil, polymethyl methacrylate film and the PA membrane.
3. electronic product casing material stack structure as claimed in claim 1 is characterized in that: the thickness of said plastic foil is 38 μ m～125 μ m.
4. electronic product casing material stack structure as claimed in claim 1 is characterized in that: said two relative surfaces of said composite portion are respectively outer surface and inner surface, are formed with said plastic foil on the said outer surface.
5. electronic product casing material stack structure as claimed in claim 1 is characterized in that: said composite portion is a kind of in following five kinds of structures:
One, said composite portion constitutes by several layers unit material structure is bonding, and each said unit material structure all is made up of thermosetting resin and one deck carbon fiber layer;
Two, said composite portion constitutes by several layers unit material structure is bonding, and each said unit material structure all is made up of thermoplastic resin and one deck carbon fiber layer;
Three, said composite portion constitutes by several layers unit material structure is bonding; Said several layers unit material structure is meant some carbon fiber unit material structures and some glass unit material structures; Said carbon fiber unit material structure and said glass unit material structure be interlaced pile up bonding; Each said carbon fiber unit material structure all is made up of thermosetting resin and one deck carbon fiber layer, and each said glass unit material structure all is made up of thermosetting resin and layer of glass fiber layer;
Four, said composite portion constitutes by several layers unit material structure is bonding; Said several layers unit material structure is meant some carbon fiber unit material structures and some glass unit material structures; Said carbon fiber unit material structure and said glass unit material structure be interlaced pile up bonding; Each said carbon fiber unit material structure all is made up of thermoplastic resin and one deck carbon fiber layer, and each said glass unit material structure all is made up of thermoplastic resin and layer of glass fiber layer;
Five, said composite portion constitutes by several layers unit material structure is bonding; Said several layers unit material structure is meant a carbon fiber unit material structure and some glass unit material structures; Some glass unit material structures are piled up bonding formation glass basic unit; A said carbon fiber unit material structure is piled up and is adhered to said glass basic unit; Said carbon fiber unit material structure is made up of thermosetting resin and one deck carbon fiber layer, and each said glass unit material structure all is made up of thermosetting resin and layer of glass fiber layer.
6. electronic product casing material stack structure as claimed in claim 1 is characterized in that: said plastic foil surface has pattern.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201449673U CN202517778U (en) | 2012-04-09 | 2012-04-09 | Material laminated structure of electronic product shell |
| TW101225183U TWM453585U (en) | 2012-04-09 | 2012-12-26 | Laminated material structure for casing of electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201449673U CN202517778U (en) | 2012-04-09 | 2012-04-09 | Material laminated structure of electronic product shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202517778U true CN202517778U (en) | 2012-11-07 |
Family
ID=47100741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201449673U Expired - Lifetime CN202517778U (en) | 2012-04-09 | 2012-04-09 | Material laminated structure of electronic product shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202517778U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102615888A (en) * | 2012-04-09 | 2012-08-01 | 昆山帆宏表面处理有限公司 | Electronic product shell material laminating structure and manufacture method thereof |
| WO2017028199A1 (en) * | 2015-08-18 | 2017-02-23 | Hewlett-Packard Development Company, L.P. | Composite material |
| US20220001653A1 (en) * | 2019-03-22 | 2022-01-06 | Hewlett-Packard Development Company, L.P. | Covers for electronic devices |
-
2012
- 2012-04-09 CN CN2012201449673U patent/CN202517778U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102615888A (en) * | 2012-04-09 | 2012-08-01 | 昆山帆宏表面处理有限公司 | Electronic product shell material laminating structure and manufacture method thereof |
| CN102615888B (en) * | 2012-04-09 | 2015-07-15 | 昆山同寅兴业机电制造有限公司 | Electronic product shell material laminating structure and manufacture method thereof |
| WO2017028199A1 (en) * | 2015-08-18 | 2017-02-23 | Hewlett-Packard Development Company, L.P. | Composite material |
| EP3337657A4 (en) * | 2015-08-18 | 2019-04-10 | Hewlett-Packard Development Company, L.P. | Composite material |
| US11046058B2 (en) | 2015-08-18 | 2021-06-29 | Hewlett-Packard Development Company, L.P. | Composite material |
| US20220001653A1 (en) * | 2019-03-22 | 2022-01-06 | Hewlett-Packard Development Company, L.P. | Covers for electronic devices |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: KUNSHAN TONGYIN INDUSTRIAL ELECTRICAL CO., LTD. Free format text: FORMER OWNER: KUNSHAN FANHONG SURFACE TREATMENT CO., LTD. Effective date: 20130322 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20130322 Address after: Suzhou City, Jiangsu province 215314 city town of Kunshan city week Caimao Road No. 2 Patentee after: Kunshan Tongyin Industrial Electrical Co., Ltd. Address before: Suzhou City, Jiangsu province 215314 city town of Kunshan city week Caimao Road No. 2 Patentee before: Kunshan Fanhong Surface Processing Technology |
|
| CX01 | Expiry of patent term |
Granted publication date: 20121107 |
|
| CX01 | Expiry of patent term |