TWM446274U - LED light bulb - Google Patents
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- TWM446274U TWM446274U TW101220024U TW101220024U TWM446274U TW M446274 U TWM446274 U TW M446274U TW 101220024 U TW101220024 U TW 101220024U TW 101220024 U TW101220024 U TW 101220024U TW M446274 U TWM446274 U TW M446274U
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Description
本創作係為一種LED燈泡，尤指一種藉由於一燈罩以及一底座之材質內混合有預設比例之複數個光擴散粒子，達到將該LED單元(Light Emitting Diodes)所投射之光線予以發散，且令該燈罩與底座均可達到發光的狀態。The present invention is an LED light bulb, in particular, a light diffusing particle that is mixed with a preset ratio by a lampshade and a base material, so that the light projected by the LED unit (Light Emitting Diodes) is diverged. Moreover, both the lamp cover and the base can be illuminated.
市面上各式各樣的燈泡中，投射燈長久以來一直佔了相當固定之比例。傳統的投射燈，係使用110伏特之鹵素投射燈泡，不但耗電量高，且容易發熱，相對的壽命也非常短，平均壽命只有幾個月，在這個電價高漲的年代，不僅非常不環保，且其所散發之高熱亦容易造成電線走火等危險意外。Among the various bulbs on the market, projection lamps have long been a fairly fixed proportion. The traditional projection lamp uses a 110 volt halogen projection bulb, which not only consumes high power, but also is prone to heat, and its relative life is very short. The average life expectancy is only a few months. In this era of high electricity prices, it is not only very environmentally friendly. And the high heat it emits is also likely to cause dangerous accidents such as wire fire.
因此，目前市面上符合MR-16規格之LED投射燈1均利用LED本身之低耗電量的特性來改善傳統鹵素投射燈泡之缺失。請參考圖一、圖二所示，圖一、圖二分別為習用LED投射燈之立體分解示意圖以及立體組合示意圖。習用之LED投射燈1係主要包括有：至少一LED單元11、一導熱柱12、一散熱模組13、至少一金屬基板14、至少一蓋體15、一護套16、一底座17、以及一電路板18所組合而成。該導熱柱12係為一筒狀，且包括有：一頂端121、以及一底端122，並於該頂端設有至少一貫穿孔 1211。Therefore, the LED projection lamp 1 currently conforming to the MR-16 specification on the market utilizes the low power consumption characteristics of the LED itself to improve the lack of the conventional halogen projection bulb. Please refer to FIG. 1 and FIG. 2 . FIG. 1 and FIG. 2 are respectively a three-dimensional exploded schematic view and a stereoscopic combination diagram of a conventional LED projection lamp. The conventional LED projection lamp 1 mainly includes at least one LED unit 11, a heat conducting column 12, a heat dissipation module 13, at least one metal substrate 14, at least one cover 15, a sheath 16, a base 17, and A circuit board 18 is combined. The heat conducting column 12 is cylindrical and includes a top end 121 and a bottom end 122, and is provided with at least a consistent perforation at the top end. 1211.
該散熱模組13係由複數個散熱鰭片131所組合，且靠合於該導熱柱12之外圍呈放射狀間隔環形串接，並以該護套16將該散熱鰭片131之外圈框圍。並於該散熱鰭片131靠合於該導熱柱12之該頂端121處往外擴張一凹階132。該LED單元11係結合於該金屬基板14之上，並固接於該凹階132上。The heat dissipation module 13 is composed of a plurality of heat dissipation fins 131, and is radially connected to the periphery of the heat conduction column 12 in a ring-shaped series, and the heat dissipation fins 131 are surrounded by the sheath 16 Wai. The concave fins 132 are outwardly expanded at the top end 121 of the heat conducting post 12 . The LED unit 11 is coupled to the metal substrate 14 and fixed to the concave step 132.
該蓋體15係覆蓋於該金屬基板14之上並位於該凹階132內。於該底座17上其具有一弧形開口，係與該導熱柱12之底端122所環繞之該散熱鰭片131相互固定，且可令該電路板18係設置於該底座17內。該電路板18透過該導熱柱12上之該貫穿孔1211與該金屬基板14上所結合之LED單元11做電性連接。The cover 15 covers the metal substrate 14 and is located in the concave step 132. The base 17 has an arc-shaped opening, which is fixed to the heat-dissipating fins 131 surrounded by the bottom end 122 of the heat-conducting column 12, and the circuit board 18 is disposed in the base 17. The circuit board 18 is electrically connected to the LED unit 11 coupled to the metal substrate 14 through the through hole 1211 of the heat conducting column 12 .
由於該LED投射燈1所產生之光束必須透過該蓋體15投射至外界，而該蓋體15則負責該LED投射燈1二次折射的功能，但習用之該蓋體15大都採單一透鏡為主，無法將光線加以勻光呈現，以致於使該LED投射燈1的亮度過高且集中，容易產生炫光刺眼現象，且由於該散熱鰭片131直接暴露於外側，容易於手持裝配該LED投射燈1時造成該散熱鰭片131之變形，以致於影響散熱效果；另外，由於該底座17係以容納該電路板18為主，而該底座17大多採不透光之材質所構成，且結合於該底座17上之該散熱鰭片131則完全暴露於空氣中，不僅容易招致外界灰塵的卡附，更容易因濕氣或雨水導致鏽蝕的現象，進一步可能使其內部之該電路板18遭到侵蝕破壞 而短路。Since the light beam generated by the LED projection lamp 1 must be projected to the outside through the cover 15, the cover 15 is responsible for the secondary refraction of the LED projection lamp 1, but the cover 15 is generally a single lens. Mainly, the light cannot be uniformly reflected, so that the brightness of the LED projection lamp 1 is too high and concentrated, and glare glare is easily generated, and since the heat dissipation fin 131 is directly exposed to the outside, it is easy to assemble the LED by hand. When the lamp 1 is projected, the heat dissipation fin 131 is deformed so as to affect the heat dissipation effect. In addition, since the base 17 is mainly for accommodating the circuit board 18, the base 17 is mostly made of a material that is opaque, and The heat dissipating fins 131 coupled to the base 17 are completely exposed to the air, which is not only easy to attract the external dust, but is more likely to be rusted by moisture or rain, and further may cause the circuit board 18 inside. Damaged by erosion And short circuit.
有鑑於此，為改良上述習用LED投射燈1之不足及缺失所造成之困擾，因此，創作人乃決定潛心研究並加以改進所提出之LED燈泡，來加以改善習用LED投射燈1所產生缺失及困擾，經不斷的反覆測試與實驗、研究與改進，並綜集多年相關產品行銷經驗之所得，終於研創出本創作之LED燈泡，不僅進一步將LED單元之所折射之光線予以均勻化呈現，使光線亮度更趨於柔和，且設置於後方之底座亦可同時發光，其外型更加美觀並兼具保護電路以及散熱鰭片之效果，且進一步減少零件以及製程步驟，達到降低成本的目的。In view of the above, in order to improve the troubles caused by the shortage and lack of the conventional LED projection lamp 1, the creator decided to study and improve the proposed LED bulb to improve the defect of the conventional LED projection lamp 1. Troubled, after repeated repeated tests and experiments, research and improvement, and the collection of years of relevant product marketing experience, finally developed the LED bulb of this creation, not only further uniformizing the light reflected by the LED unit, so that The brightness of the light is softer, and the base disposed at the rear can also emit light at the same time. The appearance is more beautiful and has the effects of protecting the circuit and the fins, and further reducing parts and process steps to achieve cost reduction.
本創作的第一目的係在於提供一種LED燈泡，其中，分別於一燈罩與一底座之透光材質內混合有預設比例之複數個光擴散粒子，以達到該LED單元所投射之光線於該燈罩上予以發散並使該底座可同時發光之目的。The first object of the present invention is to provide an LED light bulb in which a plurality of light diffusing particles of a preset ratio are mixed in a light-transmitting material of a light cover and a base respectively to achieve the light projected by the LED unit. The lampshade is diverged and the base can be illuminated at the same time.
本創作的第二目的係在於提供一種LED燈泡，其中，該底座一內壁之上、下緣處分別相對設有一環形陣列且相對應之複數個上、下嵌槽，分別將該些散熱鰭片之一外邊緣固定卡附於該上、下嵌槽之內，達到快速固定該散熱模組之散熱鰭片之目的。The second object of the present invention is to provide an LED light bulb, wherein an upper annular array of the inner wall and the lower edge of the base are respectively opposite to each other, and a plurality of upper and lower recessed grooves are respectively corresponding to the heat dissipation fins. One of the outer edge fixing cards is attached to the upper and lower inserting grooves to achieve the purpose of quickly fixing the heat dissipating fins of the heat dissipating module.
本創作的第三目的係在於提供一種LED燈泡，其中，由於複數個散熱鰭片皆以嵌合的方式固定於該底座之 內，因此無須要再透過額外之固定片或藉由黏合或焊接等方式進一步加以固定，達到節省製程步驟以及降低成本之目的。The third object of the present invention is to provide an LED light bulb in which a plurality of heat dissipating fins are fixed to the base in a fitting manner. Therefore, it is not necessary to further fix the additional fixing piece or by means of bonding or welding, thereby saving the process steps and reducing the cost.
本創作的第四目的係在於提供一種LED燈泡，其中，由於該底座與該燈罩將該散熱模組包覆於其中，透過該底座外所設之複數個導流槽以提供該些散熱鰭片對外做熱循環交換，因此無須針對該些散熱鰭片外觀進行電鍍或防鏽處理，達到方便手持且更具美觀之目的。The fourth object of the present invention is to provide an LED light bulb, wherein the heat dissipation module is covered by the base and the lamp cover, and the plurality of flow guiding grooves provided outside the base are provided to provide the heat dissipation fins. The external heat exchange is performed, so it is not necessary to perform electroplating or anti-rust treatment on the appearance of the heat dissipating fins, so as to achieve convenient hand-held and more beautiful appearance.
為達上述之目的，本創作在於提供一種LED燈泡，其係包括有：至少一LED單元、一散熱模組、一基板、一燈罩、一底座、一電路板、以及複數個光擴散粒子所組合而成。該散熱模組係由複數個散熱鰭片呈放射狀間隔環形串接所構成，其中央具有一中空處。該複數散熱鰭片分別各具有一外緣邊、一內緣邊、以及一頂邊。該基板係具有一貫孔並結合於該散熱模組之上，且提供該LED單元予以結合。該燈罩係卡合於該散熱模組之上。該底座係為具有一導電螺紋之殼體，並可將該散熱模組容納入該底座之內，且該導電螺紋上方具有一中空柱體伸入於該散熱模組之該中空處，並於該底座且位於各別兩散熱鰭片間隔處設有貫穿之一導流槽，以加強該散熱模組與該底座外空氣之熱對流。該電路板至少包括一電路迴路，設置於該中空柱體之內，進而與該導電螺紋做電性連接，且透過該中空柱體經由該基板之該貫孔與該基板上所結合之LED單元做電性連接。In order to achieve the above object, the present invention provides an LED light bulb comprising: at least one LED unit, a heat dissipation module, a substrate, a lamp cover, a base, a circuit board, and a plurality of light diffusion particles. Made. The heat dissipation module is composed of a plurality of heat dissipation fins arranged in a radial interval and has a hollow portion at the center. The plurality of heat dissipation fins each have an outer edge, an inner edge, and a top edge. The substrate has a consistent aperture and is bonded to the heat dissipation module, and the LED unit is provided for bonding. The lamp cover is engaged with the heat dissipation module. The base is a housing having a conductive thread, and the heat dissipation module is received in the base, and a hollow cylinder extends above the conductive thread into the hollow portion of the heat dissipation module, and The base is disposed at a spacing between the two heat-dissipating fins to extend through a flow guiding groove to enhance thermal convection of the heat-dissipating module and the air outside the base. The circuit board includes at least one circuit loop disposed in the hollow cylinder and electrically connected to the conductive thread, and the LED unit coupled to the substrate through the through hole of the substrate through the hollow cylinder Make an electrical connection.
於該底座之一內壁之上、下緣處分別相對設有一環形 陣列之複數個上、下嵌槽，且分別藉由相對應之該上、下嵌槽各別將該些散熱鰭片之該外緣邊固定於該內壁之上。於該燈罩以及該底座之材質內混合有預設比例之複數個光擴散粒子，透過該LED單元並利用該光擴散粒子所產生之折射，令該燈罩與該底座將該LED單元所投射之光線予以發散。且由於該LED單元之光線經由該燈罩內之該光擴散粒子的折射至該底座內，並透過該底座上所設置之該些光擴散粒子進一步將光線於該底座內進行折射，使透光材質所構成之該底座也可達到發光的狀態。a ring is respectively arranged on the upper and lower edges of one of the bases And a plurality of upper and lower recessed grooves of the array, and the outer edge of the heat dissipation fins are respectively fixed on the inner wall by corresponding upper and lower slots. A plurality of light diffusing particles of a preset ratio are mixed in the material of the lamp cover and the base, and the light emitted by the LED unit is transmitted through the LED unit and the refraction generated by the light diffusing particles Dissipate. And the light of the LED unit is refracted into the base through the light diffusing particles in the lamp cover, and the light diffusing particles disposed on the base further refract light in the base to make the light transmissive material The base formed by the base can also reach a state of illumination.
為了能更清楚地描述本創作所提出之LED燈泡，以下將配合圖式詳細說明之。In order to more clearly describe the LED bulb proposed in the present application, the following will be described in detail in conjunction with the drawings.
請參閱圖三、圖四、圖五、圖六所示，圖三為本創作LED燈泡之立體分解示意圖。圖四為本創作LED燈泡之立體組合示意圖。圖五為本創作LED燈泡之A-A剖面示意圖。圖六為本創作LED燈泡之部分剖面放大示意圖。其中，該LED燈泡2係包括有：至少一LED單元21、一散熱模組22、一基板23、一燈罩24、一底座25、一電路板26、以及複數個光擴散粒子27所組合而成。該散熱模組22係藉由複數個散熱鰭片221呈放射狀間隔環形串接而構成一環狀結構，且於該散熱模組22中央形成一中空處220。該複數散熱鰭片221分別各具有一外緣邊2211、一內緣邊2212、以及一頂邊2213。各別該散熱鰭 片221之該頂邊2213係往一第一方向彎折90度角而形成有一串接部22131，使各別該散熱鰭片221分別可藉由該串接部22131與相鄰之該散熱鰭片221進行串接，進而使該些散熱鰭片221於串接後大致呈一環形串接的結構(散熱模組22)。於本實施例中，該第一方向係大致與該散熱鰭片221的表面垂直，且於該外緣邊2211預設位置處設有一卡槽22111。各別該散熱鰭片221之該串接部22131往外後往上方擴張一預設距離，令串接後呈環形串接結構之該複數散熱鰭片221中央形成一凹階2215用以提供該基板23予以緊密結合。Please refer to Figure 3, Figure 4, Figure 5, and Figure 6. Figure 3 is a three-dimensional exploded view of the LED bulb. Figure 4 is a three-dimensional combination diagram of the LED bulbs. Figure 5 is a schematic cross-sectional view of the A-A of the LED bulb. Figure 6 is an enlarged schematic cross-sectional view of a portion of the LED bulb of the present invention. The LED bulb 2 includes at least one LED unit 21, a heat dissipation module 22, a substrate 23, a lamp cover 24, a base 25, a circuit board 26, and a plurality of light diffusion particles 27. . The heat dissipation module 22 forms a ring structure by radially connecting a plurality of heat dissipation fins 221 in a ring shape, and a hollow portion 220 is formed in the center of the heat dissipation module 22 . The plurality of heat dissipation fins 221 each have an outer edge 2111, an inner edge 2212, and a top edge 2213. Separate heat sink fins The top edge 2213 of the sheet 221 is bent at a 90 degree angle to a first direction to form a tandem portion 22131, so that the heat dissipation fins 221 can be respectively connected to the heat dissipation fins by the series connection portion 22131. The strips 221 are connected in series, and the heat dissipating fins 221 are substantially in a ring-connected structure (heat dissipating module 22) after being connected in series. In this embodiment, the first direction is substantially perpendicular to the surface of the heat dissipation fin 221, and a card slot 22111 is disposed at a predetermined position of the outer edge 2211. The splicing portion 22131 of the heat dissipating fins 221 is outwardly extended upward by a predetermined distance, so that a center of the plurality of heat dissipating fins 221 in a series of annular structures is formed to form a recess 2215 for providing the substrate. 23 is closely integrated.
該散熱鰭片221不僅藉由該串接部22131提供更大的導熱面積，且將該基板23上之該LED單元21所產生之熱能得以快速均勻的傳遞至所銜接之其他相鄰散熱鰭片221上，藉以達到熱交換對流之效果以提高該散熱模組22之散熱效率，且由於在該些散熱鰭片221上分別經由沖壓而得之該串接部22131以及該卡槽22111，其不僅提供兩相鄰散熱鰭片211相互結合更提供該燈罩24進一步固定於該散熱模組22之上，也就是將該燈罩24之一結合端241嵌附於該散熱鰭片221之卡槽22111內，達到提高整體之該散熱模組22結構強度之目的。該些散熱鰭片221之表面上設有複數個通孔2216以增加兩散熱鰭片221間之熱空氣對流，藉此加速將熱能經由空氣透過各別該散熱鰭片221上所設置之該些通孔2216間進行熱能之流通交換，以達到迅速將熱能散發至外界空氣中。組成該散熱模組22之該些散熱鰭片221可以是以導熱性較佳之鐵、銅、 鋁、銀、以及金等金屬或合金所製成者。The heat dissipation fins 221 not only provide a larger heat conduction area by the series connection portion 22131, but also quickly and uniformly transfer the heat energy generated by the LED unit 21 on the substrate 23 to the adjacent heat dissipation fins that are connected. 221, in order to achieve the effect of heat exchange convection to improve the heat dissipation efficiency of the heat dissipation module 22, and the ferrule 22131 and the card slot 22111 are respectively obtained by stamping on the heat dissipation fins 221, Providing the two adjacent heat dissipating fins 211 to each other further provides that the lamp cover 24 is further fixed on the heat dissipating module 22, that is, the bonding end 241 of the lamp cover 24 is embedded in the card slot 22111 of the heat dissipating fin 221 The purpose of improving the structural strength of the heat dissipation module 22 as a whole is achieved. A plurality of through holes 2216 are formed in the surface of the heat dissipation fins 221 to increase the hot air convection between the two heat dissipation fins 221, thereby accelerating the heat energy to be transmitted through the air through the heat dissipation fins 221 The flow of heat energy is exchanged between the through holes 2216 to quickly dissipate heat energy to the outside air. The heat dissipation fins 221 constituting the heat dissipation module 22 may be iron, copper, or the like having better thermal conductivity. A metal or alloy made of aluminum, silver, or gold.
該基板23係具有一貫孔231並提供該LED單元21結合於其上，並設置於該散熱鰭片221中央所形成之該凹階2215內，更於該基板23上可設置若干IC電容用以調節該LED單元21發光時所需之電壓，同時利用該基板23將該LED單元21發光時所產生之熱能透過該串接部22131之表面傳遞至該散熱鰭片221以排出至外界。於基板23上可使用絕緣環氧樹脂(Epoxy)來避免IC電容與LED單元21發生短路。該基板23之外徑D距離係大於或等於該複數散熱鰭片221經由串接後所構成之該凹階2215的直徑距離d(D≧d)，如此不僅可將該基板23與該些散熱鰭片221緊密固定，更可確保該基板23與該串接部22131之表面緊密貼合以進行導熱銜接。於本實施例中，該基板23之材質是以鐵、銅、鋁、銀、金、或其合金所製成。The substrate 23 has a uniform hole 231 and is provided with the LED unit 21 coupled thereto, and is disposed in the concave step 2215 formed in the center of the heat dissipation fin 221, and a plurality of IC capacitors can be disposed on the substrate 23 for The voltage required for the LED unit 21 to emit light is adjusted, and the thermal energy generated when the LED unit 21 is illuminated by the substrate 23 is transmitted to the heat dissipation fin 221 through the surface of the tandem portion 22131 to be discharged to the outside. An insulating epoxy resin (Epoxy) can be used on the substrate 23 to avoid short circuit between the IC capacitor and the LED unit 21. The distance D of the outer diameter D of the substrate 23 is greater than or equal to the diameter distance d(D≧d) of the plurality of heat dissipation fins 221 formed by the series connection of the concave steps 2215, so that the substrate 23 and the heat dissipation can be not only The fins 221 are tightly fixed to ensure that the substrate 23 and the surface of the series portion 22131 are in close contact for thermal conduction. In the embodiment, the material of the substrate 23 is made of iron, copper, aluminum, silver, gold, or an alloy thereof.
該燈罩24係為可透光材質之中空殼體，係卡合於該散熱模組22之上，其下方延伸有環狀之該結合端241分別嵌附於該些散熱鰭片221之該卡槽22111上，並將該基板23上所設置之該LED單元21覆蓋於該燈罩24之一內側面242內，令該LED單元21可透過該燈罩24將光線呈均勻發散的方式投射至外界。The lamp cover 24 is a hollow shell of a light-transmitting material, and is engaged with the heat-dissipating module 22, and the ring-shaped connecting end 241 is respectively embedded in the heat-dissipating fins 221 The card unit 22111 covers the LED unit 21 disposed on the substrate 23 in an inner side surface 242 of the lamp cover 24, so that the LED unit 21 can project the light to the outside through the lamp cover 24 in a uniform manner. .
該底座25係為具有一導電螺紋251之殼體，並可將該散熱模組22容納入該底座25之殼體內，且該導電螺紋251上方並位於該底座25中央處具有一中空柱體252伸入於該散熱模組22之該中空處220，並以該中空柱體252 之週緣分別提供該散熱鰭片221之該內緣邊2212進行抵靠，而該中空柱體252則與該底座25一體成形。此外，於該底座25且位於各別兩散熱鰭片221間隔處設有貫穿之一導流槽253，以加強該散熱模組22與該底座25外空氣之熱對流。The base 25 is a housing having a conductive thread 251, and the heat dissipation module 22 is received in the housing of the base 25, and a hollow cylinder 252 is disposed above the conductive thread 251 and at the center of the base 25. Extending into the hollow portion 220 of the heat dissipation module 22, and the hollow cylinder 252 The peripheral edge of the heat dissipation fin 221 is respectively provided to abut against the inner edge 2212 of the heat dissipation fin 221, and the hollow cylinder 252 is integrally formed with the base 25. In addition, a plurality of guiding channels 253 are formed in the base 25 and at intervals of the two heat dissipation fins 221 to enhance thermal convection of the heat dissipation module 22 and the air outside the base 25.
換句話說，可藉由陣列環繞且貫穿該底座25之該些導流槽253，可將該底座25外的冷空氣引入該底座25之殼體內，且由於各別之該導流槽253之位置係分別介於兩散熱鰭片221之該外緣邊2211中央間隔處，因此，透過該些導流槽253所引進的冷空氣更可藉由該些散熱鰭片221上所分別設置複數個通孔2216交互進行熱對流，如此一來，更可加速該LED燈泡2內部與外界冷空氣之熱循環交換，使該LED單元21所產生之熱能可快速排出於該底座25之外，同時可延長該LED單元所使用之壽命。In other words, cold air outside the base 25 can be introduced into the housing of the base 25 by the array surrounding the guide grooves 253 of the base 25, and due to the respective guide grooves 253 The positions of the cooling fins 221 are spaced apart from each other by the central portion of the two fins 221, so that the cold air introduced through the guiding slots 253 can be respectively disposed on the heat dissipating fins 221 The through holes 2216 are alternately subjected to thermal convection, so that the thermal cycle exchange between the inside of the LED bulb 2 and the outside cold air can be accelerated, so that the heat generated by the LED unit 21 can be quickly discharged outside the base 25, and at the same time Extend the life of the LED unit.
於本創作實施例中，該底座25之一內壁254之上、下緣處分別相對設置複數個環形陣列之上、下嵌槽255、256，該些上、下嵌槽255、256係分別位於該底座25之兩導流槽253中央處，且藉由相對應之該些上、下嵌槽255、256各別將該些散熱鰭片221之該外緣邊2211固定於該內壁254之上，使得各別之該散熱鰭片221之該外緣邊2211可大致貼合固定於該底座25之該內壁254上。也就是說，將每兩片散熱鰭片221透過該些上、下嵌槽255、256定位於該內壁254之中央間隔處皆具有貫通該底座25之該導流槽253，使該LED單元21工作時所產生之熱量得以藉由該些散熱鰭片221並透過其上所設之複數個通 孔2216以及該底座25上所設之該些導流槽253對外進行熱對流交換，藉此達到迅速散熱的目的。In the present embodiment, the upper and lower edges of one of the inner walls 254 of the base 25 are oppositely disposed on the plurality of annular arrays and the lower embedded grooves 255 and 256, and the upper and lower embedded grooves 255 and 256 are respectively The outer edge 2211 of the heat dissipation fins 221 is fixed to the inner wall 254 by the corresponding upper and lower insertion grooves 255 and 256 respectively. The outer edge 2211 of each of the heat dissipation fins 221 is substantially affixed to the inner wall 254 of the base 25 . That is, each of the two fins 221 is disposed at the central portion of the inner wall 254 through the upper and lower recesses 255, 256, and has a flow guiding groove 253 extending through the base 25 to enable the LED unit. The heat generated during the operation of 21 can be obtained by the heat dissipation fins 221 and through the plurality of passes provided thereon. The holes 2216 and the flow guiding grooves 253 provided on the base 25 are externally exchanged for heat convection, thereby achieving rapid heat dissipation.
於本創作實施例中，該燈罩24以及該底座25兩者為可以是透光材質所構成，並且透過超音波熱融合技術將該燈罩24之該結合端241與該底座25進一步予以接合，其材質分別可以是聚碳酸酯(Polycarbonate)、聚甲基丙烯酸甲酯(PMMA)、聚對苯二甲酸乙二酯(PET)、聚氯乙烯(PVC)、以及環氧樹脂等透明樹脂其中之一。於該燈罩24以及該底座25之材質內混合有預設比例之複數個光擴散粒子27且分別經由模具射出後一體成形，透過該LED單元21並利用該些光擴散粒子27所產生之折射、反射、或繞射，令該燈罩24與該底座25兩者之透光性提高，其藉由該些光擴散粒子27進一步將該LED單元21所投射之光線予以擴大且發散呈現。其中，該些光擴散粒子27係可以是一種有機硅膠樹脂微球粒子所構成，其折射率介於為1.4~1.5之間。In the present embodiment, the lamp cover 24 and the base 25 are both made of a light transmissive material, and the bonding end 241 of the lamp cover 24 is further joined to the base 25 by ultrasonic thermal fusion technology. The materials may be one of transparent resin such as polycarbonate (polycarbonate), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polyvinyl chloride (PVC), and epoxy resin. . A plurality of light-diffusing particles 27 of a predetermined ratio are mixed in the material of the globe 24 and the base 25, and are integrally formed by being ejected through a mold, and are transmitted through the LED unit 21 and refracted by the light-diffusing particles 27, The light reflection between the lamp cover 24 and the base 25 is improved by reflection or diffraction, and the light projected by the LED unit 21 is further enlarged and diverged by the light diffusion particles 27 . The light-diffusing particles 27 may be composed of an organic silica resin microsphere particle having a refractive index between 1.4 and 1.5.
也就是說，由於該燈罩24以及該底座25於製造時於材質內分別混合有預設比例之該光擴散粒子27(俗稱：光擴散劑)，以致於該LED單元21於該燈罩24內進行光線折射時，可經由該燈罩24之該內側面242上所附著的該光擴散粒子27將光線部分折射至該底座25之該內壁254上，且由於該底座25本身為可透光之材質所構成，且於材質內亦混合有預設比例之該些光擴散粒子27，因此，來自於該燈罩24內的光線折射亦可透過該底座25之該內壁254上所附著之該些光擴散粒子27進一步將光 線於該底座25以及該燈罩24內進行折射、反射、或繞射，使透光材質所構成之該底座25也可達到發光的狀態，令整體之該LED燈泡2前、後端也就是該燈罩24之投射端與該底座25皆可同時發光，達到類似傳統球狀燈泡會整顆燈泡發光之效果。In other words, since the lamp cover 24 and the base 25 are respectively mixed with a predetermined proportion of the light diffusing particles 27 (commonly known as a light diffusing agent) in the material, the LED unit 21 is disposed in the lamp cover 24 . When the light is refracted, the light diffusing particles 27 attached to the inner side surface 242 of the lamp cover 24 are partially refracted to the inner wall 254 of the base 25, and since the base 25 itself is a light permeable material The light diffusing particles 27 are also mixed with a preset ratio in the material. Therefore, the light from the light shield 24 can be refracted through the light adhered to the inner wall 254 of the base 25. Diffusion particles 27 further light The wire is refracted, reflected, or diffracted in the base 25 and the lamp cover 24, so that the base 25 formed of the light-transmitting material can also be in a state of being illuminated, so that the front and rear ends of the LED light bulb 2 are Both the projection end of the lamp cover 24 and the base 25 can simultaneously emit light, so as to achieve the effect that the traditional bulb-shaped bulb will illuminate the entire bulb.
該電路板26至少包括一控制電路261，設置於該底座25並位於該中空柱體252之內，進而與該導電螺紋251做電性連接，且透過所連接之一導線3經由該中空柱體252中央處並穿過該基板23上之該貫孔231與該基板23上所結合之該LED單元21做電性連接，當然，亦可透過另一導線3’使該電路板26與該導電螺紋251之間做電性連接。The circuit board 26 includes at least one control circuit 261 disposed in the base 25 and located in the hollow cylinder 252, and electrically connected to the conductive thread 251, and through the hollow cylinder through one of the connected wires 3. The through hole 231 at the center of the 252 and the through hole 231 of the substrate 23 is electrically connected to the LED unit 21 coupled to the substrate 23. Of course, the circuit board 26 can be electrically connected to the conductive line through another wire 3'. Electrical connections are made between the threads 251.
於本創作較佳實施例中，該底座25之該導電螺紋251係構成符合一般常見之傳統鎢絲燈泡的金屬螺旋轉接頭的規格，其種類大致有：E10、E12、E14、E26、E27、E40等不同之規格，於此處字母E後面的數字表示的是該導電螺紋251的直徑(例如家用燈泡通常為E27規格，也就是說燈泡的金屬螺旋轉接頭之螺紋處直徑為27mm=2.7cm)。In the preferred embodiment of the present invention, the conductive thread 251 of the base 25 constitutes a metal spiral adapter conforming to a conventional conventional tungsten filament bulb, and the types thereof are roughly: E10, E12, E14, E26, E27. Different specifications such as E40, the number after the letter E here indicates the diameter of the conductive thread 251 (for example, the household bulb is usually E27, that is, the diameter of the thread of the metal spiral adapter of the bulb is 27 mm = 2.7cm).
綜上所述，本創作本創一種LED燈泡2係包括有：至少一LED單元21、一散熱模組22、一基板23、一燈罩24、一底座25、一電路板26、以及複數個光擴散粒子27所組合而成。該散熱模組22係由複數個散熱鰭片221呈放射狀間隔環形串接所構成，其中央具有一中空處220。該複數散熱鰭片221分別各具有一外緣邊2211、一 內緣邊2212、以及一頂邊2213。該基板23係具有一貫孔231並結合於該散熱模組22之上，且提供該LED單元21予以結合。該燈罩24係卡合於該散熱模組24之上。該底座25係為具有一導電螺紋251之殼體，並可將該散熱模組22容納入該底座25之內，且該導電螺紋251上方具有一中空柱體252伸入於該散熱模組22之該中空處220，並於該底座25且位於各別兩散熱鰭片221間隔處設有貫穿之一導流槽253，以加強該散熱模組22與該底座25外冷空氣之熱對流，使該散熱模組22的散熱速率加快。該電路板26至少包括一電路迴路261，設置於該中空柱體252之內，進而與該導電螺紋251做電性連接，且該導電螺紋251利用另一導線3’與該電路板26電性連接，而該電路板26則利用該導線3並透過該中空柱體252經由該基板23之該貫孔231與該基板23上所結合之該LED單元21做電性連接。In summary, the present invention creates an LED bulb 2 comprising: at least one LED unit 21, a heat dissipation module 22, a substrate 23, a lamp cover 24, a base 25, a circuit board 26, and a plurality of lights. The diffusion particles 27 are combined. The heat dissipation module 22 is composed of a plurality of heat dissipation fins 221 arranged in a radial interval and has a hollow portion 220 at the center. The plurality of heat dissipation fins 221 each have an outer edge 2211, a The inner edge 2112 and the top edge 2213. The substrate 23 has a uniform hole 231 and is coupled to the heat dissipation module 22, and the LED unit 21 is provided for bonding. The lamp cover 24 is engaged with the heat dissipation module 24 . The base 25 is a housing having a conductive thread 251, and the heat dissipation module 22 is received in the base 25. The conductive thread 251 has a hollow cylinder 252 extending into the heat dissipation module 22. The hollow portion 220 is disposed at a space between the two heat dissipation fins 221 at the bottom of the base 25 and is provided with a flow guiding groove 253 for reinforcing the heat convection of the cooling module 22 and the cold air outside the base 25. The heat dissipation rate of the heat dissipation module 22 is increased. The circuit board 26 includes at least one circuit circuit 261 disposed in the hollow cylinder 252 to electrically connect with the conductive thread 251, and the conductive thread 251 is electrically connected to the circuit board 26 by using another wire 3'. The circuit board 26 is electrically connected to the LED unit 21 on the substrate 23 through the through hole 231 of the substrate 23 through the wire 3 and through the hollow cylinder 252.
於該底座25之一內壁254之上、下緣處分別相對設有一環形陣列之複數個上、下嵌槽255、256，且分別藉由相對應之該上、下嵌槽255、256各別將該些散熱鰭片221之該外緣邊2211固定於該內壁254之上。於該燈罩24以及該底座25之材質內混合有預設比例之複數個光擴散粒子27，透過該LED單元21並利用該光擴散粒子27所產生之折射、反射、或繞射，令該燈罩24與該底座25將該LED單元21所投射之光線予以擴大且發散呈現。且由於該LED單元21之光線經由該燈罩24之該內側面242上所設之該些光擴散粒子27部分折射至該底座25內，並 透過該底座25上所設置之該些光擴散粒子27進一步將光線於該底座25之該內壁254上進行折射，使透光材質所構成之該底座25也可達到發光的效果。An upper and lower embedded grooves 255 and 256 are respectively disposed on the upper and lower edges of one of the inner walls 254 of the base 25, and are respectively corresponding to the upper and lower embedded grooves 255 and 256. The outer edge 2211 of the heat dissipation fins 221 is not fixed on the inner wall 254. The light cover 24 and the material of the base 25 are mixed with a plurality of light diffusing particles 27 of a predetermined ratio, and transmitted through the LED unit 21 and refracted, reflected, or diffracted by the light diffusing particles 27 to make the lampshade The light projected by the LED unit 21 is enlarged and diverged by the base 25 and the base 25. And the light of the LED unit 21 is partially refracted into the base 25 via the light diffusing particles 27 disposed on the inner side surface 242 of the lamp cover 24, and The light diffusing particles 27 disposed on the base 25 further refract light on the inner wall 254 of the base 25, so that the base 25 formed of the light transmissive material can also achieve the effect of emitting light.
唯以上所述之實施例不應用於限制本創作之可應用範圍，本創作之保護範圍應以本創作之申請專利範圍內容所界定技術精神及其均等變化所含括之範圍為主者。即大凡依本創作申請專利範圍所做之均等變化及修飾，仍將不失本創作之要義所在，亦不脫離本創作之精神和範圍，故都應視為本創作的進一步實施狀況。The embodiments described above are not intended to limit the scope of application of the present invention. The scope of protection of the present invention should be based on the technical spirit defined by the content of the patent application scope of the present invention and the scope thereof. That is to say, the equal changes and modifications made by Dafan in accordance with the scope of application for patent creation will not lose the essence of this creation, nor will it deviate from the spirit and scope of this creation, so it should be regarded as the further implementation of this creation.
1‧‧‧習用之LED投射燈泡1‧‧‧Used LED projection bulb
11‧‧‧LED單元11‧‧‧LED unit
12‧‧‧導熱柱12‧‧‧ Thermal Conductive Column
121‧‧‧頂端121‧‧‧Top
122‧‧‧底端122‧‧‧ bottom
1211‧‧‧貫穿孔1211‧‧‧through holes
13‧‧‧散熱模組13‧‧‧ Thermal Module
131‧‧‧散熱鰭片131‧‧‧heat fins
132‧‧‧凹階132‧‧‧ concave steps
14‧‧‧金屬基板14‧‧‧Metal substrate
15‧‧‧蓋體15‧‧‧ cover
16‧‧‧護套16‧‧‧ sheath
17‧‧‧底座17‧‧‧Base
18‧‧‧電路板18‧‧‧ boards
2‧‧‧LED燈泡2‧‧‧LED bulb
21‧‧‧LED單元21‧‧‧LED unit
22‧‧‧散熱模組22‧‧‧ Thermal Module
220‧‧‧中空處220‧‧‧ hollow
221‧‧‧散熱鰭片221‧‧‧Heat fins
2211‧‧‧外邊緣2211‧‧‧ outer edge
22111‧‧‧卡槽22111‧‧‧ card slot
2212‧‧‧內邊緣2212‧‧‧ inner edge
2213‧‧‧頂邊2213‧‧‧ top side
22131‧‧‧串接部22131‧‧‧ tandem
2215‧‧‧凹階2215‧‧‧ concave order
2216‧‧‧通孔2216‧‧‧through hole
23‧‧‧基板23‧‧‧Substrate
231‧‧‧貫孔231‧‧‧through holes
24‧‧‧燈罩24‧‧‧shade
241‧‧‧結合端241‧‧‧Binding end
242‧‧‧內側面242‧‧‧ inside
25‧‧‧底座25‧‧‧Base
251‧‧‧導電螺紋251‧‧‧Electrical thread
252‧‧‧中空柱體252‧‧‧ hollow cylinder
253‧‧‧導流槽253‧‧‧Drainage trough
254‧‧‧內壁254‧‧‧ inner wall
255‧‧‧上嵌槽255‧‧‧Upper slot
256‧‧‧下嵌槽256‧‧‧ undercut slot
26‧‧‧電路板26‧‧‧ Circuit board
261‧‧‧控制電路261‧‧‧Control circuit
27‧‧‧光擴散粒子27‧‧‧Light diffusing particles
3、3’‧‧‧導線3, 3'‧‧‧ wires
圖一為習用LED投射燈之立體分解示意圖。Figure 1 is a perspective exploded view of a conventional LED projection lamp.
圖二為習用LED投射燈之立體組合示意圖。Figure 2 is a three-dimensional combination diagram of a conventional LED projection lamp.
圖三為本創作LED燈泡之立體分解示意圖。Figure 3 is a three-dimensional exploded view of the LED bulb.
圖四為本創作LED燈泡之立體組合示意圖。Figure 4 is a three-dimensional combination diagram of the LED bulbs.
圖五為本創作LED燈泡之A-A剖面示意圖。Figure 5 is a schematic cross-sectional view of the A-A of the LED bulb.
圖六為本創作LED燈泡之部分剖面放大示意圖。Figure 6 is an enlarged schematic cross-sectional view of a portion of the LED bulb of the present invention.
2‧‧‧LED燈泡2‧‧‧LED bulb
21‧‧‧LED單元21‧‧‧LED unit
22‧‧‧散熱模組22‧‧‧ Thermal Module
220‧‧‧中空處220‧‧‧ hollow
221‧‧‧散熱鰭片221‧‧‧Heat fins
2211‧‧‧外邊緣2211‧‧‧ outer edge
22111‧‧‧卡槽22111‧‧‧ card slot
2212‧‧‧內邊緣2212‧‧‧ inner edge
2213‧‧‧頂邊2213‧‧‧ top side
22131‧‧‧串接部22131‧‧‧ tandem
2215‧‧‧凹階2215‧‧‧ concave order
2216‧‧‧通孔2216‧‧‧through hole
23‧‧‧基板23‧‧‧Substrate
231‧‧‧貫孔231‧‧‧through holes
24‧‧‧燈罩24‧‧‧shade
241‧‧‧結合端241‧‧‧Binding end
242‧‧‧內側面242‧‧‧ inside
25‧‧‧底座25‧‧‧Base
251‧‧‧導電螺紋251‧‧‧Electrical thread
252‧‧‧中空柱體252‧‧‧ hollow cylinder
253‧‧‧導流槽253‧‧‧Drainage trough
254‧‧‧內壁254‧‧‧ inner wall
255‧‧‧上嵌槽255‧‧‧Upper slot
26‧‧‧電路板26‧‧‧ Circuit board
261‧‧‧控制電路261‧‧‧Control circuit
27‧‧‧光擴散粒子27‧‧‧Light diffusing particles
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101220024U TWM446274U (en) | 2012-10-17 | 2012-10-17 | LED light bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101220024U TWM446274U (en) | 2012-10-17 | 2012-10-17 | LED light bulb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM446274U true TWM446274U (en) | 2013-02-01 |
Family
ID=48193716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101220024U TWM446274U (en) | 2012-10-17 | 2012-10-17 | LED light bulb |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM446274U (en) |
-
2012
- 2012-10-17 TW TW101220024U patent/TWM446274U/en not_active IP Right Cessation
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