JP5557105B2 - Lamp with lamp and lighting equipment - Google Patents

Lamp with lamp and lighting equipment Download PDF

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Publication number
JP5557105B2
JP5557105B2 JP2010202707A JP2010202707A JP5557105B2 JP 5557105 B2 JP5557105 B2 JP 5557105B2 JP 2010202707 A JP2010202707 A JP 2010202707A JP 2010202707 A JP2010202707 A JP 2010202707A JP 5557105 B2 JP5557105 B2 JP 5557105B2
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light
lamp
heat
light source
cap
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JP2012059589A (en
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鉄也 大野
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Priority to JP2010202707A priority Critical patent/JP5557105B2/en
Priority to CN201190000702XU priority patent/CN203215308U/en
Priority to PCT/JP2011/069383 priority patent/WO2012032951A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02—Combinations of only two kinds of elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

本発明の実施形態は、発光ダイオード等の固体発光素子を光源とした口金付ランプおよび照明器具に関する。   Embodiments described herein relate generally to a lamp with a base and a lighting fixture that use a solid light emitting element such as a light emitting diode as a light source.

近年、フィラメント電球に代わって、寿命が長く、また消費電力の少ない固体発光素子である発光ダイオードを光源とした電球形ＬＥＤランプ等の口金付ランプが各種照明器具の光源として採用されるようになっている。この種の発光ダイオードを光源とする口金付ランプは、省エネや電球の長寿命化をはかることから既存の一般白熱電球に代替が可能になるように構成され、一般白熱電球に近い配光特性が要求されている。   In recent years, lamps with caps such as bulb-type LED lamps that use light-emitting diodes, which are solid-state light-emitting elements that have a long life and low power consumption, have been adopted as light sources for various lighting fixtures in place of filament bulbs. ing. Lamps with caps that use this type of light emitting diode as the light source are designed to be able to replace existing general incandescent bulbs because they save energy and extend the life of the bulbs. It is requested.

特開２００８−０３４１４０号公報JP 2008-034140 A 特開２００８−２０４６７１号公報JP 2008-204671 A

しかしながら、この種の口金付ランプは、発光ダイオードを実装した平面状の発光モジュールを光源部とし、ランプ本体は発光ダイオードの熱を放熱させることから熱伝導性の良好なアルミニウム製の円筒体で構成し、ランプ本体の一端部側に光源部が配設され、光源部を覆うようにグローブが設けられている。このため、発光する部分が電球の頂部側のみに集中し、放射される光のほとんどは頂部から前面側に放出され、電球の側面から背面側にかけて光量が減少する問題がある。一方、光源部の発光源として用いられる発光ダイオード等の固体発光素子は、発光効率を向上させるために、点灯時に発生する熱を効果的に放熱させる必要がある。このため、この種の口金付ランプにおいては、固体発光素子の放熱性能を高め、かつ一般白熱電球に近似した配光特性を如何にして達成するかが重要な課題となっている。   However, this type of lamp with a base uses a flat light emitting module mounted with a light emitting diode as a light source part, and the lamp body dissipates the heat of the light emitting diode, so it is composed of a cylindrical body made of aluminum with good thermal conductivity. And the light source part is arrange | positioned at the one end part side of the lamp | ramp main body, and the glove | globe is provided so that a light source part may be covered. For this reason, there is a problem that the light emitting part is concentrated only on the top side of the bulb, and most of the emitted light is emitted from the top to the front side, and the light quantity decreases from the side of the bulb to the back side. On the other hand, a solid light emitting element such as a light emitting diode used as a light emitting source of a light source unit needs to effectively dissipate heat generated during lighting in order to improve luminous efficiency. For this reason, in this type of lamp with a cap, it is an important issue how to improve the heat radiation performance of the solid light emitting element and achieve the light distribution characteristic approximate to that of a general incandescent bulb.

本発明は、上記の課題に鑑みてなされたもので、固体発光素子の放熱性能を高め、かつ一般白熱電球等既存の光源の配光特性に近づけることが可能な口金付ランプおよび照明器具を提供しようとするものである。   The present invention has been made in view of the above problems, and provides a lamp with a cap and a luminaire that can improve the heat dissipation performance of a solid state light emitting device and can approximate the light distribution characteristics of an existing light source such as a general incandescent bulb. It is something to try.

本発明の実施形態における口金付ランプは、固体発光素子からなる光源部を有し、熱伝導性を有する放熱体は、光源部を頂部に配設し、光源部からの光を頂部と逆方向に向けて放射するように、光軸に対し放射方向に突出して設けられる放熱部を形成する。透光性のカバー部材は、放熱体の放熱部を外気に向けて露出させる開放部を有し、光源部および放熱体を覆うように設けられる。口金部材は光源部に電源を供給する。   The lamp with a cap in the embodiment of the present invention has a light source unit made of a solid light emitting element, and a heat-radiating body has a light source unit arranged at the top, and the light from the light source unit is reverse to the top. A heat dissipating part is formed so as to project in the radial direction with respect to the optical axis so as to radiate toward. The translucent cover member has an open portion that exposes the heat radiating portion of the heat radiating body toward the outside air, and is provided so as to cover the light source portion and the heat radiating body. The base member supplies power to the light source unit.

本実施形態によれば、固体発光素子の放熱性能を高め、かつ一般白熱電球等既存の光源の配光特性に近づけることが可能な口金付ランプおよび照明器具を提供することができる。   According to the present embodiment, it is possible to provide a lamp with a cap and a lighting fixture that can improve the heat dissipation performance of a solid light emitting element and can be close to the light distribution characteristics of an existing light source such as a general incandescent light bulb.

本発明の第１の実施形態である口金付ランプを示し、（ａ）は分解して示す斜視図、（ｂ）は光源部の断面図。The lamp | ramp with a nozzle | cap | die which is the 1st Embodiment of this invention is shown, (a) is a disassembled perspective view, (b) is sectional drawing of a light source part. 同じく口金付ランプの縦断面図。The longitudinal cross-sectional view of a lamp with a base similarly. 同じく口金付ランプを透視して示す斜視図。The perspective view which shows through similarly the lamp | ramp with a nozzle | cap | die through. 同じく本実施形態の口金付ランプを装着した照明器具を示し、（ａ）はダウンライトを天井に設置した状態を概略的に示す断面図、（ｂ）はブラケットを壁面に設置した状態を概略的に示す断面図。Similarly, it shows a lighting fixture equipped with a lamp with a cap of the present embodiment, (a) is a cross-sectional view schematically showing a state in which a downlight is installed on a ceiling, (b) is a schematic diagram showing a state in which a bracket is installed on a wall surface. FIG. 同じく口金付ランプの変形例を示し、（ａ）は第１の変形例の口金付ランプを透視して示す斜視図、（ｂ）は第２の変形例の口金付ランプを透視して示す斜視図、（ｃ）は第３の変形例におけるカバー部材の開放部と放熱フィンの接合部を示す断面図。The modification with a lamp | cap | die with a nozzle | cap | die similarly is shown, (a) is a perspective view which sees through and shows the lamp | ramp with a cap of 1st modification, and (b) is the perspective view which sees through and shows the lamp | ramp with caps of a 2nd modification. FIG. 9C is a cross-sectional view showing the joint portion between the opening portion of the cover member and the radiation fin in the third modified example. 同じく口金付ランプの変形例を示し、（ａ）は第４の変形例の口金付ランプの縦断面図、（ｂ）は第５の変形例の口金付ランプを透視して示す斜視図。The modification with a lamp | cap | die with a nozzle | cap | die similarly is shown, (a) is a longitudinal cross-sectional view of the lamp | ramp with a nozzle | cap | die of a 4th modification, (b) is a perspective view seeing through the lamp | ramp with a nozzle | cap | die of a 5th modification.

以下、本発明に係る口金付ランプおよび照明器具の実施形態について説明する。   Hereinafter, an embodiment of a lamp with a cap and a lighting fixture according to the present invention will be described.

実施形態１Embodiment 1

図１〜図３に示すように、本実施形態は、一般白熱電球に代替が可能な電球形の口金付ランプ１０を構成するもので、固体発光素子からなる光源部１１と、光源部を配設した熱伝導性を有する放熱体１２と、光源部および放熱体を覆うように設けられる透光性のカバー部材１３と、光源部に電源を供給する口金部材１４で構成する。   As shown in FIGS. 1 to 3, the present embodiment constitutes a bulb-shaped lamp 10 with a cap that can be replaced with a general incandescent bulb. The light source unit 11 including a solid light emitting element and a light source unit are arranged. The heat-radiating body 12 having heat conductivity, a light-transmitting cover member 13 provided so as to cover the light source section and the heat-radiating body, and a base member 14 for supplying power to the light source section.

光源部１１は、図１（ｂ）に示すように、固体発光素子１１ａを面状に配設した発光モジュール１１ｂと、発光モジュールを配設する基板１１ｃからなる。固体発光素子１１ａは、本実施形態では発光ダイオード（以下「ＬＥＤ」と称す）で構成し、同一性能を有する青色ＬＥＤチップからなる高輝度・高出力の複数個のＬＥＤからなり、各ＬＥＤ１１ａを配線基板１１ｂ１に実装することにより発光モジュール１１ｂが構成される。   As shown in FIG. 1B, the light source unit 11 includes a light emitting module 11b in which the solid light emitting elements 11a are arranged in a planar shape, and a substrate 11c on which the light emitting modules are arranged. The solid-state light emitting element 11a is composed of a light emitting diode (hereinafter referred to as “LED”) in the present embodiment, and is composed of a plurality of high-luminance and high-power LEDs composed of blue LED chips having the same performance, and each LED 11a is wired. The light emitting module 11b is configured by mounting on the substrate 11b1.

発光モジュール１１ｂは、次のようにして構成される。すなわち、配線基板１１ｂ１は、略正方形をなし熱伝導性が良好な部材、本実施形態では、アルミニウムからなる基板上に絶縁層を形成した薄い平板で構成され、その一面側（表面側）の中央部分に内周面が略正方形をなす土手部を形成して浅い正方形の凹部を形成し、この凹部にＣＯＢ技術を使用して複数のＬＥＤ１１ａ（青色ＬＥＤチップ）が略マトリックス状に実装され、さらに、黄色蛍光体を分散・混合した封止部材が塗布または充填されＬＥＤ１１ａが正方形で面状をなすように配設された発光モジュール１１ｂが構成される。この発光モジュールは、上述した青色ＬＥＤチップから放射される青色光を透過させると共に、青色光によって黄色蛍光体を励起して黄色光に変換し、透過した青色光と黄色光が混光して白色の光を放射する。   The light emitting module 11b is configured as follows. That is, the wiring board 11b1 is a member having a substantially square shape and good thermal conductivity, in this embodiment, a thin flat plate in which an insulating layer is formed on a substrate made of aluminum, and the center on one surface side (front surface side). A shallow square concave portion is formed by forming a bank portion whose inner peripheral surface is substantially square in the portion, and a plurality of LEDs 11a (blue LED chips) are mounted in a substantially matrix shape using the COB technology in the concave portion, A light emitting module 11b is configured in which a sealing member in which a yellow phosphor is dispersed and mixed is applied or filled, and the LEDs 11a are arranged in a square shape. This light emitting module transmits the blue light emitted from the blue LED chip described above, excites the yellow phosphor with the blue light and converts it into yellow light, and the transmitted blue light and yellow light are mixed to produce white light. Emits light.

上記に構成された発光モジュール１１ｂは、基板１１ｃに配設されて光源部１１を構成する。基板１１ｃは、放熱部材を兼ねるもので、熱伝導性の良好な部材、本実施形態では、比較的に肉厚の板状をなすアルミニウムで、光軸ｘ−ｘを中心として直交する放射方向に向けて突出した略十文字形をなすように構成する。そして基板１１ｃの交差する平坦な中央部に対して、発光モジュール１１ｂがネジ等の固定手段によって密着して固定され、各ＬＥＤ１１ａから発生する熱を、配線基板１１ｂ１から基板１１ｃに伝達させるように構成する。なお、配線基板１１ｂ１は、基板１１ｃと一体に形成してもよく、この場合には、熱伝導性がより良好になって一層放熱性がよくなる。これにより、固体発光素子であるＬＥＤ１１ａが正方形の面状をなすように配設された光源部１１が構成される。なお、基板１１ｃには、ＬＥＤ１１ａに接続されたコネクタ１１ｃ１が設けられる。上記に構成された光源部１１は、放熱体１２の頂部に配設される。   The light emitting module 11b configured as above constitutes the light source unit 11 by being disposed on the substrate 11c. The substrate 11c also serves as a heat radiating member, and is a member having good thermal conductivity, which is aluminum having a relatively thick plate shape in the present embodiment, in a radiation direction orthogonal to the optical axis xx. It is configured so as to form an approximately cross shape projecting toward. The light emitting module 11b is fixed in close contact with a flat central portion where the substrate 11c intersects by a fixing means such as a screw, and heat generated from each LED 11a is transmitted from the wiring substrate 11b1 to the substrate 11c. To do. The wiring board 11b1 may be formed integrally with the board 11c. In this case, the thermal conductivity becomes better and the heat dissipation is further improved. As a result, the light source unit 11 is configured in which the LEDs 11a, which are solid-state light emitting elements, are arranged so as to form a square surface. The board 11c is provided with a connector 11c1 connected to the LED 11a. The light source unit 11 configured as described above is disposed on the top of the radiator 12.

放熱体１２は、本実施形態では、熱伝導性の良好な金属であるアルミニウム板で一体に構成されたベース部１２ａと放熱部１２ｂからなる。ベース部１２ａは、内部に空間部を有する略円盤状をなすように構成される。放熱部１２ｂは、光軸ｘ−ｘに対し放射方向に突出して設けられ、本実施形態では光軸ｘ−ｘに対して直交する放射方向、すなわち、光軸を中心として９０°の角度で等間隔に配設された４枚の板状をなす放熱フィン１２ｂ１で構成される。この放熱フィン１２ｂ１は、アルミニウムからなる４枚の板材を、その角がＲ形状をなすようにして略直角に折り曲げ、それぞれの板面の背面側を小さな所定の間隔ａを有して対向させる。   In this embodiment, the heat radiator 12 includes a base portion 12a and a heat radiating portion 12b that are integrally formed of an aluminum plate that is a metal having good thermal conductivity. The base portion 12a is configured to have a substantially disk shape having a space portion therein. The heat radiating portion 12b is provided so as to protrude in the radial direction with respect to the optical axis xx, and in this embodiment, the radial direction is orthogonal to the optical axis xx, that is, at an angle of 90 ° about the optical axis, etc. It is composed of four heat dissipating fins 12b1 arranged at intervals. The heat radiating fins 12b1 bend four plate members made of aluminum so that their corners form an R shape, and bend each plate surface substantially at a right angle with a small predetermined interval a.

これにより、光軸ｘ−ｘを中心にして直交する方向に向けて連続し、幅が小さく奥行きの長い空洞をなし、かつその側方の開放部分が光軸ｘ−ｘと略平行する長手方向に向けて開放する２本の連続した空洞部１２ｂ２が形成される。この２本の連続した空洞部１２ｂ２は、光軸の中心で交差して連続している。また、空洞部の側方の開放部分、すなわち、放熱フィン１２ｂ１の外周に面する端面１２ｂ３の長手方向の形状は、後述するカバー部材１３の湾曲したネック部の外周面と連続させるように湾曲させて形成し、外観が一般白熱電球におけるネック部のシルエットに近似させた形状になるように構成する（図３）。   As a result, a longitudinal direction in which the cavity is continuous in a direction orthogonal to the optical axis xx, forms a cavity with a small width and a long depth, and a laterally open portion thereof is substantially parallel to the optical axis xx. Two continuous cavities 12b2 are formed that open toward. The two continuous cavities 12b2 intersect and continue at the center of the optical axis. Further, the open portion on the side of the cavity, that is, the shape of the end surface 12b3 facing the outer periphery of the radiating fin 12b1 is curved so as to be continuous with the outer peripheral surface of the curved neck portion of the cover member 13 described later. The external appearance is configured to approximate the silhouette of the neck portion of a general incandescent bulb (FIG. 3).

上記のように構成された放熱部１２ｂは、放熱フィン１２ｂ１の下端部を外方に向けて湾曲させて固着部１２ｂ４を一体に形成し、円盤状をなすベース部１２ａ上面に溶接等の手段によって固着する。ベース部１２ａと一体に形成してもよい。これにより、放熱体１２の放熱部１２ｂは、外気に連通する空洞部１２ｂ２を有して構成され、外気が空洞部を介して光軸ｘ−ｘを中心とした直交する放射方向の２方向にわたり流通するように構成される。   The heat dissipating part 12b configured as described above is formed by integrally forming a fixing part 12b4 by curving the lower end part of the heat dissipating fin 12b1 outward, and by means such as welding on the upper surface of the base part 12a forming a disk shape. Stick. You may form integrally with the base part 12a. Thereby, the heat radiating portion 12b of the heat radiating body 12 is configured to have a hollow portion 12b2 communicating with the outside air, and the outside air extends through the hollow portion in two orthogonal radial directions centered on the optical axis xx. Configured to circulate.

さらに、上記のように構成された放熱体１２は、放熱部１２ｂの頂部に上述の光源部１１が配設される。すなわち、十文字形に形成された光源部１１の基板１１ｃを、放熱フィン１２ｂ１によって形成された直交する空洞部１２ｂ２における上面の開放部分を塞ぐようにして嵌合させ溶接等の手段によって固定する。これにより、空洞部１２ｂ２の上面が基板１１ｃによって塞がれるとともに、基板１１ｃの中央部、換言すれば、放熱体１２の頂部に光源部１１が配設され、光源部１１の光軸ｘ−ｘに放熱体１２の軸心が合致する。   Further, in the heat dissipating body 12 configured as described above, the light source unit 11 described above is disposed on the top of the heat dissipating unit 12b. That is, the substrate 11c of the light source portion 11 formed in a cross shape is fitted and fixed by means such as welding so as to close the open portion of the upper surface of the orthogonal cavity portion 12b2 formed by the radiation fins 12b1. Thus, the upper surface of the cavity 12b2 is blocked by the substrate 11c, and the light source unit 11 is disposed at the center of the substrate 11c, in other words, the top of the radiator 12, and the optical axis xx of the light source unit 11 is obtained. The axial center of the radiator 12 matches.

上記のように光源部１１と放熱体１２が構成されることによって、各４枚の放熱フィン１２ｂ１の間には、放熱フィンで４等分に仕切られ、上方および外側方が開放された４個の広く大きな空間部Ｓが形成される。この空間部Ｓによって、光源部１１からの光は、幅が薄い放熱体１２によって殆んど遮られることなく、放熱体の頂部と逆方向、換言すれば、電球の側面および背面側に向けて放射させることができる（図２）。   By configuring the light source unit 11 and the heat radiating body 12 as described above, the four radiating fins 12b1 are divided into four equal parts by the radiating fins, and the upper and outer sides are opened. A large and large space S is formed. The light from the light source unit 11 is hardly blocked by the thin radiator 12 by the space S, and is directed in the opposite direction to the top of the radiator, in other words, toward the side and back of the bulb. Can be emitted (FIG. 2).

図中１５は、放熱体１２を保持し後述する点灯装置１７を支持し収納するためのホルダで、耐熱性の合成樹脂、本実施形態では、ポリブチレンテレフタレート（ＰＢＴ）で、円盤状をなすベース部１５ａと保持部１５ｂを一体に形成する。ベース部１５ａは、放熱体１２のベース部１２ａの空間部に嵌合できる大きさに形成し、保持部１５ｂは、４枚の放熱フィン１２ｂ１によって形成された光軸ｘ−ｘを中心として直交する放射方向に設けられた２本の空洞部１２ｂ２に対してそれぞれ対応し、ホルダ１５の軸心を中心として直交する放射方向に４個の保持片１５ｂ１が一体に形成される。保持片１５ｂ１の形状および大きさは、空洞部１２ｂ２内に嵌合できる形状および寸法に構成する。保持片１５ｂ１の上面は一体に閉塞され、内部には後述する点灯装置１７の回路基板１７ｂが挿入できるように空洞になっている。   In the figure, reference numeral 15 denotes a holder for holding the radiator 12 and supporting and storing the lighting device 17 to be described later, and is a heat-resistant synthetic resin, in this embodiment, a polybutylene terephthalate (PBT) base that forms a disk shape. The part 15a and the holding part 15b are integrally formed. The base portion 15a is formed to have a size that can be fitted into the space portion of the base portion 12a of the radiator 12, and the holding portion 15b is orthogonal to the optical axis xx formed by the four heat radiating fins 12b1. Four holding pieces 15b1 are integrally formed in the radial direction orthogonal to each other with respect to the two hollow portions 12b2 provided in the radial direction. The shape and size of the holding piece 15b1 are configured to have a shape and size that can be fitted into the cavity 12b2. The upper surface of the holding piece 15b1 is integrally closed and is hollow so that a circuit board 17b of the lighting device 17 described later can be inserted therein.

そして、各保持片１５ｂ１は、放熱体１２の２本の空洞部１２ｂ２に対し、放熱体のベース部１２ａから挿入され空洞部１２ｂ２に嵌合される。このとき、ホルダ１５のベース部１５ａが放熱体１２のベース部１２ａの空間部内に嵌合される。これにより、放熱体１２は保持部１５ｂによって内面側から保持される。なお、保持片１５ｂ１が空洞部１２ｂ２に嵌合される高さは、外気に連通する空洞部を塞がないように、空洞部の高さの略中間部分までの高さにする（図２）。また、保持片１５ｂ１と空洞部１２ｂ２は、耐熱性のシリコーン樹脂やエポキシ樹脂等からなる接着剤を塗布して固着してもよい。   And each holding piece 15b1 is inserted from the base part 12a of a heat sink with respect to the two cavity parts 12b2 of the heat radiator 12, and is fitted in the cavity part 12b2. At this time, the base portion 15 a of the holder 15 is fitted into the space portion of the base portion 12 a of the heat radiator 12. Thereby, the heat radiator 12 is held from the inner surface side by the holding portion 15b. The height at which the holding piece 15b1 is fitted into the cavity portion 12b2 is set to a height up to a substantially middle portion of the cavity portion so as not to block the cavity portion communicating with the outside air (FIG. 2). . Further, the holding piece 15b1 and the cavity 12b2 may be fixed by applying an adhesive made of a heat-resistant silicone resin or epoxy resin.

また、保持片１５ｂ１の一体に閉塞された上面には、電線挿通部１５ｂ２が形成される。電線挿通部は、電線ｗ１を内部に挿通することができる内径の細く長いパイプ状をなし、保持片１５ｂ１の上面に一体に上方に延びるように形成される。そして、パイプの下端が保持片１５ｂ１の空洞に連通し、上端が放熱部１２ｂの空洞部１２ｂ２を貫通し、光源部の基板１１ｃに設けられたコネクタ１１ｃ１に臨む位置となるように構成される。上記に構成された放熱体１２およびホルダ１５は、その各ベース部１２ａ、１５ａの下端が、後述する連結体１６の開口部１６ａに嵌合されて固着される。   Further, a wire insertion portion 15b2 is formed on the upper surface of the holding piece 15b1 that is integrally closed. The electric wire insertion portion has a long and narrow pipe shape with an inner diameter through which the electric wire w1 can be inserted, and is formed so as to integrally extend upward on the upper surface of the holding piece 15b1. The lower end of the pipe communicates with the cavity of the holding piece 15b1, and the upper end passes through the cavity 12b2 of the heat radiating part 12b and is positioned so as to face the connector 11c1 provided on the substrate 11c of the light source part. The heat dissipating body 12 and the holder 15 configured as described above are fixed by fitting lower ends of the base portions 12a and 15a into openings 16a of the connecting body 16 described later.

カバー部材１３は、本実施形態におけるランプ部品としてのグローブを構成するもので、例えば、厚さが薄いガラスや合成樹脂などの材質で構成され、透明または光拡散性を有する乳白色などの半透明、本実施形態では乳白色のポリカーボネート（ＰＣ）樹脂で構成した。そして、本実施形態のカバー部材１３は、光源部１１を主として覆う上側カバー部１３ａと、放熱体１２を主として覆う下側カバー部１３ｂの２つに分割して発光面積を増やすように構成した。上側カバー部１３ａと下側カバー部１３ｂの分割線は、放熱体１２の頂部に配設された光源部１１を略通過する水平方向の線ｙ−ｙ、換言すれば、グローブの略最大径部付近で光軸ｘ−ｘに直交する線ｙ−ｙを境にして２分割する。   The cover member 13 constitutes a globe as a lamp part in the present embodiment. For example, the cover member 13 is made of a material such as thin glass or synthetic resin, and is transparent or translucent such as milky white having light diffusibility. In this embodiment, it is made of milky white polycarbonate (PC) resin. And the cover member 13 of this embodiment was comprised so that it might divide | segment into two, the upper side cover part 13a which mainly covers the light source part 11, and the lower side cover part 13b which mainly covers the heat radiator 12 and increases a light emission area. The dividing line between the upper cover portion 13a and the lower cover portion 13b is a horizontal line yy that substantially passes through the light source portion 11 disposed on the top of the radiator 12, in other words, the substantially maximum diameter portion of the globe. In the vicinity, it is divided into two with a line yy orthogonal to the optical axis xx as a boundary.

上側カバー部１３ａは、図１（ａ）に示すように下方に開放した開口部１３ａ１を有する略半球面状をなし、その球面の形状は、一般白熱電球のボール部分のシルエットに近似させた滑らかな曲面状に形成する。下側カバー部１３ｂは、上方に上側カバー部１３ａの開口部１３ａ１に合致する開口部１３ｂ１を有し、下方に径の小さい開口部１３ｂ２を有し、その外側面が、下方に向けて緩やかに湾曲させることにより、外観が一般白熱電球におけるネック部のシルエットに近似させた形状になるように形成する。なお、上側カバー部１３ａと下側カバー部１３ｂは、これらの開口部１３ａ１、１３ｂ１同士の突合せ面が超音波溶接等の手段により固着されて一体化され、一つのグローブとして構成される。   As shown in FIG. 1A, the upper cover portion 13a has a substantially hemispherical shape having an opening 13a1 opened downward, and the shape of the spherical surface is a smooth shape approximating the silhouette of the ball portion of a general incandescent bulb. A curved surface is formed. The lower cover portion 13b has an opening portion 13b1 that matches the opening portion 13a1 of the upper cover portion 13a on the upper side, and has an opening portion 13b2 with a small diameter on the lower side, and its outer surface is gently lowered downward. By bending, the external appearance is formed so as to approximate the neck silhouette of a general incandescent bulb. The upper cover portion 13a and the lower cover portion 13b are integrated as a result of the abutting surfaces of these openings 13a1 and 13b1 being fixed by means such as ultrasonic welding to form a single glove.

そして、下側カバー部１３ｂ外周面に、上述した放熱体１２の放熱部１２ｂを露出させるための開放部１３ｂ３を形成する。この開放部は、縦長の下端が開放した長孔（図１（ａ））からなり、この長孔は、光軸ｘ−ｘを中心として直交する放射方向に設けられた４枚の放熱フィン１２ｂ１に対してそれぞれ対応し、カバー部材１３の軸心を中心として直交する放射方向に４個が形成される。そして、長孔からなる開放部１３ｂ３に対して、各放熱フィン１２ｂ１の端面１２ｂ３、すなわち、空洞部１２ｂ２の側方の開放部分を嵌合し、端面１２ｂ３が外気に向けて露出するように設けられる。   And the open part 13b3 for exposing the thermal radiation part 12b of the thermal radiation body 12 mentioned above is formed in the lower cover part 13b outer peripheral surface. The open portion is formed of a long hole (FIG. 1A) having a vertically long lower end opened, and the long hole has four radiating fins 12b1 provided in a radial direction orthogonal to the optical axis xx. Are formed in a radial direction orthogonal to the axis of the cover member 13 as a center. And it is provided so that end surface 12b3 of each radiation fin 12b1, ie, the open part of the side of cavity 12b2, may be fitted to open portion 13b3 formed of a long hole, and end surface 12b3 may be exposed to the outside air. .

この際、開放部１３ｂ３の長孔は、下端が開放されているので、各放熱フィン１２ｂ１の端面１２ｂ３は、下方から開放した部分を通して差し込むことができる。なお、長孔からなる開放部１３ｂ３に、放熱フィン１２ｂ１の端面１２ｂ３を嵌合させた合わせ目は、透明なシリコーン樹脂やエポキシ樹脂等からなる接着剤を塗布して固着し、合わせ目を塞ぐようにしてもよい。   At this time, since the lower end of the long hole of the opening portion 13b3 is opened, the end surface 12b3 of each radiating fin 12b1 can be inserted through a portion opened from below. The joint where the end face 12b3 of the heat radiating fin 12b1 is fitted to the open portion 13b3 made of a long hole is fixed by applying an adhesive made of a transparent silicone resin, epoxy resin, or the like, thereby closing the joint. It may be.

これにより、カバー部材１３の開放部１３ｂ３から露出する放熱フィン１２ｂ１の端面１２ｂ３と、カバー部材１３の外周面が連続して一体化し、全体として、外観が一般白熱電球におけるネック部のシルエットに近似させた形状に構成される（図３）。   As a result, the end surface 12b3 of the radiating fin 12b1 exposed from the open portion 13b3 of the cover member 13 and the outer peripheral surface of the cover member 13 are continuously integrated, and the overall appearance approximates the silhouette of the neck portion of a general incandescent bulb. (Fig. 3).

また、カバー部材１３は、光源部１１を覆う上側カバー部１３ａの光透過率が、放熱体１２を覆う下側カバー部１３ｂの光透過率より低くなるように構成する。本実施形態では、上側カバー部１３ａにおける光拡散剤の含有量を、下側カバー部１３ｂの光拡散剤の含有量より多くすることによって、上側カバー部１３ａの光透過率が下側カバー部１３ｂの光透過率より低くなるように構成した。上記に構成されたカバー部材１３は、下側カバー部１３ｂの下方の開口部１３ｂ２が、連結体１６の開口部１６ａに嵌合されて固着される。   Further, the cover member 13 is configured such that the light transmittance of the upper cover portion 13 a that covers the light source unit 11 is lower than the light transmittance of the lower cover portion 13 b that covers the radiator 12. In this embodiment, the light transmittance of the upper cover portion 13a is reduced by making the content of the light diffusing agent in the upper cover portion 13a greater than the content of the light diffusing agent in the lower cover portion 13b. It was configured to be lower than the light transmittance. The cover member 13 configured as described above is fixed by fitting the opening 13b2 below the lower cover part 13b into the opening 16a of the connector 16.

連結体１６は、図２に示すように耐熱性の合成樹脂、本実施形態では、ポリブチレンテレフタレート（ＰＢＴ）樹脂で、横断面形状が略円形をなし上方に径の大きな開口部１６ａを、下方に径の小さな開口部１６ｂを形成し、内部に収納凹部１６ｃを形成した筒状をなし、外周面が一端部から他端部に向かい順次直径が小さくなる略円錐状のテーパー面をなすようにして、外観が一般白熱電球におけるネック部の下端部付近のシルエットに近似させた形状に構成する。そして、上方の径の大きな開口部１６ａに、放熱体１２とホルダ１５の各ベース部１２ａ、１５ａが嵌合されてシリコーン樹脂やエポキシ樹脂等からなる耐熱性の接着剤によって固着される。さらに、放熱体１２を覆うようにしてカバー部材１３の下方の開口部１３ｂ２が嵌合され、シリコーン樹脂やエポキシ樹脂等からなる耐熱性の接着剤によって固着される。また、下方の径の小さい開口部１６ｂに口金部材１４が固着される。なお、連結体１６の外表面は、メタリックシルバー色、または、白色の塗装が施されている。   As shown in FIG. 2, the coupling body 16 is a heat-resistant synthetic resin, which in this embodiment is a polybutylene terephthalate (PBT) resin. An opening 16b having a small diameter is formed on the inside, and a cylindrical recess having an accommodation recess 16c formed therein is formed. The outer peripheral surface forms a substantially conical tapered surface whose diameter decreases gradually from one end to the other end. Thus, the appearance is configured to approximate a silhouette near the lower end of the neck of a general incandescent bulb. Then, the base 12a and 15a of the radiator 12 and the holder 15 are fitted into the opening 16a having a large upper diameter and fixed by a heat-resistant adhesive made of silicone resin, epoxy resin, or the like. Further, the opening 13b2 below the cover member 13 is fitted so as to cover the heat radiating body 12, and is fixed by a heat-resistant adhesive made of silicone resin, epoxy resin, or the like. Further, the base member 14 is fixed to the opening 16b having a small diameter below. The outer surface of the connection body 16 is painted with metallic silver or white.

次に、口金部材１４は、エジソンタイプのＥ２６形で、ねじ山を備えた導電性を有する金属、本実施形態では銅板からなる筒状のシェル部１４ａとこのシェル部の下端の頂部に絶縁部１４ｂを介して設けられたアイレット部１４ｃを備えている。シェル部１４ａの開口部が連結体１６下方の開口部１６ｂの外周に嵌め込まれ、カシメ、若しくはシリコーン樹脂やエポキシ樹脂等からなる耐熱性の接着剤によって固着され、アルミニウムからなる放熱体１２と口金部材１４との電気絶縁がなされる。   Next, the base member 14 is an Edison type E26 type, which is an electrically conductive metal having a screw thread, in this embodiment, a cylindrical shell portion 14a made of a copper plate and an insulating portion at the top of the lower end of the shell portion. The eyelet part 14c provided via 14b is provided. The heat sink 12 and the base member made of aluminum, the opening of the shell portion 14a being fitted into the outer periphery of the opening 16b below the connecting body 16 and fixed by caulking or a heat-resistant adhesive made of silicone resin, epoxy resin or the like 14 is electrically insulated.

点灯装置１７は、図１に示すように、各ＬＥＤ１１ａの点灯回路を構成する回路部品１７ａと、回路部品を実装した回路基板１７ｂからなる。点灯回路は、交流電圧１００Ｖを２４Ｖ程度の直流電圧に変換して各ＬＥＤ１１ａに定電流の直流電流を供給するように構成される。回路基板１７ｂは十字形の短冊状をなすガラスエポキシ材からなり、片面または両面に電子部品が実装され、この回路基板１７ｂを縦方向にし、上半分程度がホルダ１５のベース部１５ａから保持片１５ｂ１の空洞内に挿入され、下半分程度が連結体１６の収納凹部１６ｃ内に配置されて支持される（図２）。回路基板１７ｂは、シリコーン樹脂やエポキシ樹脂等の熱伝導性を有する接着剤によって、保持片１５ｂ１や連結体１６の内面に固着してもよい。   As shown in FIG. 1, the lighting device 17 includes a circuit component 17a constituting a lighting circuit for each LED 11a and a circuit board 17b on which the circuit components are mounted. The lighting circuit is configured to convert the AC voltage 100V into a DC voltage of about 24V and supply a constant DC current to each LED 11a. The circuit board 17b is made of a glass epoxy material having a cross-shaped strip shape, and electronic components are mounted on one side or both sides thereof. The circuit board 17b is in a vertical direction, and the upper half is from the base portion 15a of the holder 15 to the holding piece 15b1. The lower half is disposed and supported in the storage recess 16c of the connector 16 (FIG. 2). The circuit board 17b may be fixed to the inner surface of the holding piece 15b1 or the coupling body 16 with an adhesive having thermal conductivity such as silicone resin or epoxy resin.

そして、回路基板１７ｂの出力端子には電線ｗ１が接続され、この電線ｗ１がホルダ１５の電線挿通部１５ｂ２を挿通して基板１１ｃのコネクタ１１ｃ１に接続される。また、回路基板１７ｂの入力端子には口金部材１４に接続される入力線（図示せず）が接続される。なお、点灯装置１７は、上記のように、電球内に内蔵させて、一般白熱電球とそのまま代替ができるように構成することが好適であるが、コンパクト形蛍光ランプのように点灯装置はランプを装着する器具側に別置きにして設け、電球側には内蔵させないように構成してもよい。   And the electric wire w1 is connected to the output terminal of the circuit board 17b, and this electric wire w1 penetrates the electric wire insertion part 15b2 of the holder 15, and is connected to the connector 11c1 of the board | substrate 11c. An input line (not shown) connected to the base member 14 is connected to the input terminal of the circuit board 17b. As described above, it is preferable that the lighting device 17 is built in a light bulb so that it can be replaced with a general incandescent light bulb as it is. However, the lighting device has a lamp like a compact fluorescent lamp. It may be configured so that it is provided separately on the side of the appliance to be mounted and is not built in the bulb side.

上記により、一般白熱電球と同様に、頂部の前面側から側面周囲にわたって発光面積を増やすようにグローブが形成されたＰＳ形状のカバー部材１３を有し、他端側にＥ２６形の口金部材１４が設けられ、全体の外観形状が一般白熱電球全体のシルエットと略同様の外観形状をなした電球形の口金付ランプ１０が構成される。   By the above, like a general incandescent lamp, it has the PS-shaped cover member 13 in which the glove is formed so as to increase the light emitting area from the front side of the top part to the periphery of the side surface, and the E26-type cap member 14 is provided on the other end side A light bulb-shaped lamp 10 with a cap is provided which is provided and has an overall external shape substantially the same as the silhouette of the general incandescent bulb.

次に、上記に構成された口金付ランプ１０の作動につき説明する。口金付ランプ１０に口金部材１４を介して電源を供給し点灯させると、図２に示すように、光源部１１の正方形の面状をなす発光部から光が放射される。放射された光Ａは、上側カバー部１３ａの内面に向かって放射されて透過し頂部の前面側を主として照射する。また、一部の光Ｂは上側カバー部１３ａの光拡散剤によって側方から背面方向に向けて反射され、下側カバー部１３ｂを透過して電球の側面から背面側に光が回り込むように放射される。この際、放熱体１２には、上方および外側方が開放された４個の広く大きな空間部Ｓが形成されているので、この空間部Ｓによって、光源部１１から放射される光Ｂが幅の薄い放熱体１２によって殆んど遮られることなく、電球の側面および背面側の略全周に対して、略均等（側面および背面側の略全体が光るように）に透過させることができる。   Next, the operation of the cap-equipped lamp 10 configured as described above will be described. When power is supplied to the lamp with cap 10 via the cap member 14 to light it, light is emitted from the light emitting portion having a square surface shape of the light source portion 11 as shown in FIG. The emitted light A is emitted toward and transmitted through the inner surface of the upper cover portion 13a, and mainly irradiates the front side of the top portion. Further, a part of the light B is reflected from the side toward the back by the light diffusing agent of the upper cover part 13a, and is transmitted through the lower cover part 13b so that the light wraps around from the side of the bulb to the back side. Is done. At this time, since the heat dissipating body 12 is formed with four wide and large space portions S whose upper and outer sides are opened, the light B emitted from the light source portion 11 has a width by the space portion S. The light can be transmitted substantially evenly (so that substantially the entire side and back sides shine) with respect to the entire circumference of the side and back sides of the bulb without being interrupted by the thin heat radiating body 12.

また、カバー部材１３は、上側カバー部１３ａにおける光拡散剤の含有量を、下側カバー部１３ｂの光拡散剤の含有量より多くすることによって、上側カバー部１３ａの光透過率が下側カバー部１３ｂの光透過率より低くなるように構成したので、上側カバー部１３ａの光拡散剤によって内面で反射される光Ｂが多くなり、逆に、上側カバー部１３ａを透過する光Ａが少なくなる。   Further, the cover member 13 increases the light transmittance of the upper cover portion 13a by making the content of the light diffusing agent in the upper cover portion 13a larger than the content of the light diffusing agent in the lower cover portion 13b. Since it is configured to be lower than the light transmittance of the portion 13b, the light B reflected on the inner surface by the light diffusing agent of the upper cover portion 13a increases, and conversely, the light A that passes through the upper cover portion 13a decreases. .

そして内面で反射される多くなった光Ｂが、光透過率の高い下側カバー部１３ｂを透過して電球の側面から背面側に光が回り込むように放射される。これにより、電球から放射される光は、４個の広く大きな空間部Ｓによる電球の側面および背面側へ略均等に光Ｂを透過させる作用と相まって、カバー部材１３の全面にわたって略均等に放射されて電球の全面が略均等に光って発光面積を増やすことができ、一般白熱電球と近似した略同様の配光特性を得ることができる。   The increased amount of light B reflected from the inner surface passes through the lower cover portion 13b having a high light transmittance, and is emitted so that the light wraps around from the side surface of the bulb to the back side. Thereby, the light radiated from the light bulb is radiated substantially uniformly over the entire surface of the cover member 13 in combination with the action of transmitting the light B substantially uniformly to the side surface and the back side of the light bulb by the four large spaces S. Thus, the entire surface of the light bulb can shine substantially evenly to increase the light emitting area, and light distribution characteristics similar to those of a general incandescent light bulb can be obtained.

同時に、口金付ランプ１０が点灯されると、ＬＥＤ１１ａの温度が上昇し熱が発生する。その熱は、アルミニウムからなる配線基板１１ｂ１から、同様にアルミニウムからなる基板１１ｃに伝達され、さらに基板１１ｃが固着されたアルミニウムからなる放熱体１２の放熱フィン１２ｂ１に伝達される。放熱フィン１２ｂ１に伝達された熱は、放熱フィン１２ｂ１によって形成された空洞部１２ｂ２内に流通する外気と熱交換されて外部に放熱される。   At the same time, when the lamp with cap 10 is turned on, the temperature of the LED 11a rises and heat is generated. The heat is transmitted from the wiring board 11b1 made of aluminum to the board 11c made of aluminum, and further to the heat radiation fins 12b1 of the heat radiating body 12 made of aluminum to which the board 11c is fixed. The heat transmitted to the heat radiating fins 12b1 is radiated to the outside through heat exchange with the outside air flowing in the hollow portions 12b2 formed by the heat radiating fins 12b1.

この際、空洞部１２ｂ２は、放射方向に直交して連通する２本の空洞部で構成されており、外気が空洞部を形成する一方の端面１２ｂ３から導入され、熱くなった放熱フィン１２ｂ１の面積の広い板面に接触して熱交換され、熱交換された空気が他方の端面１２ｂ３から外部に放出される（図３中矢印Ａ）。この熱交換作用が、直交する２本の空洞部で同時に行われ効果的な放熱が行われる。特に、光源部が近く熱の篭り易い光軸近辺の中心部においては、直交する２本の空洞部が交差し両方の空洞部から導入された外気によって熱交換が行われることからより効果的な放熱が行われる。また、光軸近辺の中心部には、断面が菱形をなす広い空間が形成されており、一層効果的な熱交換が行われる。   At this time, the cavity 12b2 is composed of two cavities that communicate perpendicularly to the radial direction, and the area of the radiating fin 12b1 that is heated by the outside air introduced from one end face 12b3 that forms the cavity. Heat is exchanged in contact with the wide plate surface, and the heat-exchanged air is discharged to the outside from the other end surface 12b3 (arrow A in FIG. 3). This heat exchanging action is simultaneously performed in the two orthogonal cavity portions to effectively dissipate heat. In particular, in the central part near the optical axis where the light source part is close and heat is easily generated, the two orthogonal cavity parts intersect and heat exchange is performed by the outside air introduced from both the cavity parts. Heat dissipation is performed. In addition, a wide space having a diamond-shaped cross section is formed at the center near the optical axis, so that more effective heat exchange is performed.

さらに、カバー部材１３から露出する放熱フィン１２ｂ１の端面１２ｂ３と、カバー部材１３の外周面が連続して一体化し、全体として、外観が一般白熱電球におけるネック部のシルエットに近似させた形状に構成されているので、図３中に矢印Ｂで示すように、外気がネック部の湾曲した傾斜に沿いガイドされて空洞部１２ｂ２に吸い込まれることから、より多くの外気を空洞部に導入することができ一層効果的な放熱が行われる。これらの効果的な放熱作用によりＬＥＤ１１ａの温度上昇が抑制される。これは、幅が小さく奥行きの長い空洞部１２ｂ２による煙突効果によって、外気が次々と一方の端面１２ｂ３から吸い込まれ、他方の端面１２ｂ３から次々と放出されることから、点灯中において常に継続した熱交換が行われ継続的な放熱が行われる。   Furthermore, the end surface 12b3 of the heat radiating fin 12b1 exposed from the cover member 13 and the outer peripheral surface of the cover member 13 are continuously integrated, and the overall appearance is configured to approximate the neck silhouette of a general incandescent bulb. Therefore, as indicated by an arrow B in FIG. 3, since the outside air is guided along the curved slope of the neck portion and sucked into the cavity portion 12b2, more outside air can be introduced into the cavity portion. More effective heat dissipation is performed. These effective heat dissipation actions suppress the temperature rise of the LED 11a. This is because the outside air is sucked from one end face 12b3 one after another and discharged one after another from the other end face 12b3 due to the chimney effect of the hollow portion 12b2 having a small width and a long depth. Is performed and continuous heat dissipation is performed.

また、同時に点灯装置１７の回路基板１７ｂが挿入されたホルダ１５の保持片１５ｂ１が、空洞部１２ｂ２の略中間の高さに位置しているので、空洞部に吸い込まれた外気によって保持片１５ｂ１が冷却され、内蔵された回路基板１７ｂも冷却されることから、回路部品１７ａの温度上昇も抑制することができ、電子部品の信頼性を高めることもできる。   At the same time, since the holding piece 15b1 of the holder 15 into which the circuit board 17b of the lighting device 17 is inserted is located at a substantially middle height of the cavity 12b2, the holding piece 15b1 is caused by the outside air sucked into the cavity. Since the cooled circuit board 17b is also cooled, the temperature rise of the circuit component 17a can be suppressed, and the reliability of the electronic component can be improved.

次に、上記のように構成された電球形の口金付ランプ１０を光源とした照明器具の構成を説明する。図４（ａ）に示すように、２０は店舗等の天井面Ｘに埋め込み設置され、Ｅ２６形の口金を有する一般白熱電球を光源としたダウンライト式の既存の照明器具で、下面に開口部２１ａを有する金属製の箱状をなした器具本体２１と、開口部に嵌合される金属製の反射体２２と、一般白熱電球のＥ２６形の口金をねじ込むことが可能なソケット２３で構成されている。反射体２２は、例えばステンレス等の金属板で構成し、反射体２２の上面板の中央部にソケット２３が設置される。   Next, the structure of the lighting fixture which used as a light source the lamp | ramp 10 with a bulb | ball-shaped cap comprised as mentioned above is demonstrated. As shown in FIG. 4 (a), 20 is an existing downlight-type lighting fixture that is embedded in a ceiling surface X of a store or the like and uses a general incandescent bulb having an E26-type base as a light source. It comprises a metal box-like instrument body 21 having 21a, a metal reflector 22 fitted into the opening, and a socket 23 into which an E26-type base of a general incandescent bulb can be screwed. ing. The reflector 22 is made of, for example, a metal plate such as stainless steel, and a socket 23 is installed at the center of the top plate of the reflector 22.

上記に構成された一般白熱電球用の既存の照明器具２０において、省エネや長寿命化などのために一般白熱電球に替えて、上述したＬＥＤを光源とする電球形の口金付ランプ１０を装着する。すなわち、電球形の口金付ランプは、口金部材１４をＥ２６形に構成してあるので、上記照明器具２０の一般白熱電球用のソケット２３にそのまま差し込むことができる。   In the existing lighting fixture 20 for a general incandescent light bulb configured as described above, a light bulb shaped cap lamp 10 using the above-described LED as a light source is mounted instead of the general incandescent light bulb for energy saving and long life. . That is, in the bulb-shaped lamp with the cap, since the cap member 14 is formed in the E26 shape, it can be inserted into the socket 23 for the general incandescent bulb of the lighting fixture 20 as it is.

また、口金付ランプ１０は、外観が一般白熱電球におけるネック部のシルエットに近似させた形状に構成されているので、ネック部がソケット周辺の反射体２２等に当たることなくスムーズに差し込むことができ、電球形の口金付ランプ１０における既存照明器具への適合率が向上する。これにより、既存のダウンライトを、ＬＥＤを光源とした電球形の口金付ランプ１０が設置された省エネ形のダウンライトに簡単に変えることができる。勿論、既存器具のみでなく、新規構成の照明器具も同様にして構成することができる。  In addition, since the lamp with cap 10 is configured in a shape that approximates the silhouette of the neck portion of a general incandescent bulb, the neck portion can be smoothly inserted without hitting the reflector 22 around the socket, The adaptation rate to the existing lighting fixture in the bulb-shaped lamp with cap 10 is improved. Thereby, the existing downlight can be easily changed to an energy-saving downlight in which the light bulb-shaped lamp with cap 10 using LEDs as a light source is installed. Of course, not only existing fixtures but also newly constructed lighting fixtures can be constructed in the same manner.

次に、上記に構成された口金付ランプ１０を光源としたダウンライト２０の作動につき説明する。上記に構成されたダウンライトに電源を投入すると、ソケット２３から口金付ランプ１０に対し、口金部材１４を介して商用電源が供給され、点灯装置１７が動作して２４Ｖの直流電圧が出力される。この直流電圧は点灯装置１７から各ＬＥＤ１１ａに印加され、定電流の直流電流が供給されて全てのＬＥＤが同時に点灯して白色の光が放射される。  Next, the operation of the downlight 20 using the lamp with cap 10 configured as described above as a light source will be described. When power is turned on to the downlight configured as described above, commercial power is supplied from the socket 23 to the cap-mounted lamp 10 via the cap member 14, and the lighting device 17 operates to output a DC voltage of 24V. . This direct current voltage is applied to each LED 11a from the lighting device 17, and a constant direct current is supplied to turn on all the LEDs simultaneously to emit white light.

各ＬＥＤ１１ａから放射された白色の光は、上述したようにカバー部材１３の全面にわたって略均等に放射され電球の側面から背面側に光が回り込み、電球の側面から背面側にかけて光量が減少することない。これは、発光面積を増やし一般白熱電球と近似した略同様の配光特性を得ることができることで、照明器具２０内に配置されたソケット２３近傍の反射体２２への光の照射量が増大し、一般白熱電球用として構成された反射体２２の光学設計通りの器具特性を得ることが可能となり、一般白熱電球に近似した略同様の配光特性をもった照明を行うことができる。   The white light radiated from each LED 11a is radiated substantially evenly over the entire surface of the cover member 13 as described above, and the light circulates from the side surface of the bulb to the back side, and the amount of light does not decrease from the side surface of the bulb to the back side. . This is because the light emitting area can be increased and a light distribution characteristic similar to that of a general incandescent bulb can be obtained, so that the amount of light applied to the reflector 22 in the vicinity of the socket 23 arranged in the lighting fixture 20 increases. Thus, it becomes possible to obtain the fixture characteristics according to the optical design of the reflector 22 configured for a general incandescent lamp, and it is possible to perform illumination having substantially the same light distribution characteristic as that of a general incandescent lamp.

同時に、電球形の口金付ランプ１０が点灯されると、ＬＥＤ１１ａの温度が上昇し熱が発生するが、上述のように放熱体１２の放熱フィン１２ｂ１および空洞部１２ｂ２によって効果的に放熱され、ＬＥＤの発光効率の低下を抑制することができ、長期にわたり明るさが低下することなく、さらに電子部品の信頼性も高めることができ、長寿命の照明器具を提供することが可能となる。   At the same time, when the bulb-shaped lamp with cap 10 is turned on, the temperature of the LED 11a rises and heat is generated, but as described above, the heat is effectively radiated by the radiation fins 12b1 and the cavity 12b2 of the radiator 12, and the LED Thus, it is possible to suppress a decrease in light emission efficiency, to improve the reliability of electronic components without lowering the brightness over a long period of time, and to provide a long-life lighting apparatus.

また、照明器具は、ダウンライトに限らず、図４（ｂ）に示すように、壁面Ｘに設置されるブラケット形の照明器具を構成するようにしてもよい。このブラケット２０は、上方を開放した透明なグローブ２４を有し、本実施形態の口金付ランプ１０がソケット２３により上方に向けて設置される。これにより、口金付ランプ１０からの光が上方、側方さらに下方に向けて放射され壁面等を均等に照らすことができる。また、口金付ランプ１０は、電球の側面から背面側に光が回り込み、電球の側面から背面側にかけて光量が減少することないため、特に水平方向の明るさを生かした照明を行うことができるブラケット形の照明器具を提供することが可能になる。   Further, the lighting fixture is not limited to the downlight, but may be a bracket-type lighting fixture installed on the wall surface X as shown in FIG. The bracket 20 has a transparent globe 24 that is open upward, and the lamp with cap 10 of the present embodiment is installed upward by a socket 23. Thereby, the light from the lamp | ramp 10 with a nozzle | cap | die is radiated | emitted toward upper direction, a side further downward, and a wall surface etc. can be illuminated equally. In addition, the lamp with cap 10 has light that circulates from the side surface of the bulb to the back side and does not decrease the amount of light from the side surface of the bulb to the back side. It becomes possible to provide a shaped luminaire.

以上、本実施形態によれば、ＬＥＤの放熱性能を高め、かつ一般白熱電球等既存の光源の配光特性に近づけることが可能な口金付ランプおよび照明器具を提供することができるとともに、次のような作用効果を奏することが可能となる。   As described above, according to the present embodiment, it is possible to provide a lamp with a cap and a lighting fixture that can improve the heat dissipation performance of an LED and can be close to the light distribution characteristics of an existing light source such as a general incandescent bulb. Such operational effects can be achieved.

本実施形態によれば、カバー部材１３を最大径部で２分割して構成したので、放熱体１２の直径寸法を略最大径部まで大きく構成することができ、放熱フィン１２ｂ１の面積を広くすることが可能となり、一層効果的な放熱を行うことができる。なお、カバー部材１３は、最大径部で２分割することなく、光軸ｘ−ｘに沿って縦方向に２分割してもよい。この場合も、放熱体１２の直径をカバー部材１３の略最大径部まで大きくすることが可能になる。また、これら構成によれば、放熱フィン１２ｂ１の面積を広くすることができるだけでなく、光源部１１の大きさも、より大きく構成することも可能になり、より高出力の口金付ランプを構成することも可能になる。   According to the present embodiment, since the cover member 13 is divided into two at the maximum diameter portion, the diameter of the radiator 12 can be increased to the substantially maximum diameter portion, and the area of the radiation fin 12b1 can be increased. Therefore, more effective heat dissipation can be performed. Note that the cover member 13 may be divided into two in the vertical direction along the optical axis xx without being divided into two at the maximum diameter portion. Also in this case, it is possible to increase the diameter of the radiator 12 to the substantially maximum diameter portion of the cover member 13. In addition, according to these configurations, not only can the area of the radiating fins 12b1 be increased, but also the size of the light source unit 11 can be increased, and a lamp with a higher output can be configured. Will also be possible.

また、放熱体１２は、アルミニウムの板材によって空洞部１２ｂ２を構成して効果的な放熱を行うようにしたので、電球の軽量化が可能になる。特に、本実施形態においては、肉厚のアルミニウム等からなる本体ケースを用いることなく、ＬＥＤの放熱を行うことができるので、一層の軽量化が可能になるとともに、コスト的にも有利となる。また、カバー部材１３は、放熱フィン１２ｂ１を露出するための開放部１３ｂ３を形成し、外気をカバー部材内に取り込むことも可能になり、カバー部材の温度上昇も抑制することが可能になり、消灯直後等に手で電球を触っても熱くないため、電球の取り扱いをし易くすることも可能になる。これは、開放部１３ｂ３と放熱フィン１２ｂ１の端面１２ｂ３を熱伝導性の良好なシリコーン樹脂等の接着剤で固着した場合にも、カバー部材１３の熱を放熱フィン１２ｂ１で放熱させることもできる。   Further, since the radiator 12 has the cavity portion 12b2 made of aluminum plate material for effective heat dissipation, the light bulb can be reduced in weight. In particular, in the present embodiment, since the heat radiation of the LED can be performed without using a main body case made of thick aluminum or the like, it is possible to further reduce the weight and to be advantageous in terms of cost. Further, the cover member 13 forms an open portion 13b3 for exposing the radiating fins 12b1, and it is possible to take outside air into the cover member, and it is also possible to suppress the temperature rise of the cover member and turn off the light. Even if the light bulb is touched by hand immediately afterwards, it is possible to make the light bulb easier to handle. Even when the open portion 13b3 and the end face 12b3 of the radiation fin 12b1 are fixed with an adhesive such as a silicone resin having good thermal conductivity, the heat of the cover member 13 can be radiated by the radiation fin 12b1.

また、空洞部１２ｂ２は、直交する放射方向に２本形成したので、放熱のための空気流通路がカバー部材１３の長手方向に直交して位置しているので、口金付ランプをどのような向きに装着しても、電球の周囲全体から外気を取り込むことが可能になる。また、特に、電球を水平方向に装着した場合には、電球が回転方向の如何なる位置で装着が停止されても、いずれか一方の空洞部は必ず略上下方向に位置して向かせることができ、下方から外気を吸い込み上方から放出される煙突効果によって、より効果的な放熱作用を行わせることが可能になる。   In addition, since the two hollow portions 12b2 are formed in the orthogonal radial directions, the air flow passage for heat dissipation is positioned orthogonal to the longitudinal direction of the cover member 13, so that the lamp with cap is oriented in any direction. It is possible to take in outside air from the entire periphery of the light bulb even if it is attached to. In particular, when the light bulb is mounted in a horizontal direction, one of the cavities can always be positioned in a substantially vertical direction and faced regardless of the position at which the light bulb is stopped. The chimney effect of sucking outside air from below and releasing it from above enables more effective heat dissipation.

以上、本実施形態において、放熱体１２は直交する放射方向に２本の空洞部１２ｂ２を形成したが、低出力の口金付ランプの場合等においては、放射方向に１本の空洞部を形成したものであってもよい。さらに、より高出力の口金付ランプに場合には、放射方向に３本、４本等、空洞部の本数を増やすように構成してもよい。さらに、放熱フィン１２ｂ１の板面に多数の突起やピン等を形成し、表面積をさらに増大させるようにしてもよい。   As described above, in the present embodiment, the radiator 12 has the two hollow portions 12b2 formed in the orthogonal radial directions. However, in the case of a lamp with a low output cap, etc., one hollow portion is formed in the radial direction. It may be a thing. Furthermore, in the case of a lamp with a higher output, it may be configured to increase the number of hollow portions such as three or four in the radial direction. Furthermore, a large number of protrusions, pins, and the like may be formed on the plate surface of the radiating fin 12b1 to further increase the surface area.

さらには、図５（ａ）に示すように、空洞部１２ｂ２を放射方向に連通することなく、光軸ｘ−ｘから半径方向に連通する空洞部を形成するようにしてもよい。この場合、外気を光軸ｘ−ｘと略平行する方向（上下方向）から取り込めるように、カバー部材１３の開放部１３ｂ３から放熱フィン１２ｂ１の端面１２ｂ３を外方に突出させて設けるとよい。   Furthermore, as shown in FIG. 5A, a cavity that communicates in the radial direction from the optical axis xx may be formed without communicating the cavity 12b2 in the radial direction. In this case, the end face 12b3 of the heat radiating fin 12b1 may be provided so as to protrude outward from the opening 13b3 of the cover member 13 so that the outside air can be taken in from a direction (vertical direction) substantially parallel to the optical axis xx.

また、空洞部１２ｂ２は、側方の開放部分、すなわち、端面１２ｂ３が光軸ｘ−ｘと略平行する長手方向に向けて開放するように形成したが、図５（ｂ）に示すように、光軸ｘ−ｘと略直交する方向に横に長い開放部分が形成されるようにしてもよい。これによれば、開放部分が横縞模様となってカバー部材１３の外面に形成され、外観的により良好な口金付ランプを構成することが可能になる。   Further, the hollow portion 12b2 is formed so that the side open portion, that is, the end surface 12b3 opens in the longitudinal direction substantially parallel to the optical axis xx, but as shown in FIG. An open portion that is long in the direction substantially perpendicular to the optical axis xx may be formed. According to this, an open part becomes a horizontal stripe pattern, is formed in the outer surface of the cover member 13, and it becomes possible to comprise a lamp | ramp with a nozzle | cap | die with a more favorable external appearance.

また、カバー部材１３の開放部１３ｂ３と放熱フィン１２ｂ１の端面１２ｂ３は、図５（ｃ）に示すように、放熱フィンの端面の内側に小さい鍔状部１２ｂ４を形成して、開放部１３ｂ３との合わせ目を塞ぐようにしてもよい。この場合、合わせ目を透明で熱伝導性の良好なシリコーン樹脂等の接着剤で固着してもよい。また、開放部１３ｂ３と放熱フィンの端面１２ｂ３との合わせ目は面一に形成したが、図６（ａ）に示すように、放熱フィンの端面１２ｂ３を開放部１３ｂ３の内面側に凹ませて設けるようにしてもよい。これによれば、カバー部材１３内への外気の取り込みをより効果的に行うことが可能になる。   Moreover, as shown in FIG.5 (c), the opening part 13b3 of the cover member 13 and the end surface 12b3 of the radiation fin 12b1 form the small hook-shaped part 12b4 inside the end surface of a radiation fin, and are the opening part 13b3. The seam may be closed. In this case, the seam may be fixed with an adhesive such as a silicone resin that is transparent and has good thermal conductivity. Further, the joint between the opening 13b3 and the end surface 12b3 of the radiating fin is formed flush, but as shown in FIG. 6A, the end surface 12b3 of the radiating fin is recessed on the inner surface side of the opening 13b3. You may do it. According to this, it becomes possible to take in outside air into the cover member 13 more effectively.

また、図６（ｂ）に示すように、比較的肉厚のアルミニウムからなる放熱体１２を構成し、その外面に多数の放熱フィン１２ｂ１を形成し、この放熱フィンをカバー部材の開放部１３ｂ３から外気に向けて露出させるように構成してもよい。   Further, as shown in FIG. 6B, a heat dissipating body 12 made of relatively thick aluminum is formed, a large number of heat dissipating fins 12b1 are formed on the outer surface thereof, and the heat dissipating fins are formed from the opening 13b3 of the cover member. You may comprise so that it may expose toward the open air.

また、カバー部材１３を分割して構成したが、真空成形等によって一体に形成し、上側と下側で光拡散剤等の配合を変えるようにしてもよい。また、カバー部材１３は、同一の材質で一体または別体に構成し、上側カバー部１３ａの板厚を厚く、下側カバー部１３ｂの板厚を薄く形成して光透過率を変えるように構成してもよい。光透過率は、蛍光体等の波長変換部材の配合を変えるようにしてもよい。また、カバー部材１３をＰＣ樹脂で構成したが、アクリル樹脂で構成してもよい。さらには、透光性を有するセラミックスで構成してもよい。この場合、セラミックスは熱伝導性が比較的良好なため、カバー部材自体の温度上昇を抑制することができ、さらに、カバー部材からもＬＥＤの熱を放熱することも可能になり、より取り扱いに優れ、さらに放熱性の優れた口金付ランプを提供することができる。以上、変形例を示す図５〜図６には、図１〜図４と同一部分に同一の符合を付し、詳細な説明は省略した。   Moreover, although the cover member 13 is divided and configured, it may be integrally formed by vacuum forming or the like, and the composition of the light diffusing agent or the like may be changed on the upper side and the lower side. In addition, the cover member 13 is formed integrally or separately from the same material, and is configured to change the light transmittance by forming the upper cover portion 13a thick and the lower cover portion 13b thin. May be. The light transmittance may be changed by mixing the wavelength conversion member such as a phosphor. Moreover, although the cover member 13 was comprised with PC resin, you may comprise with an acrylic resin. Furthermore, you may comprise with the ceramics which have translucency. In this case, since ceramic has relatively good thermal conductivity, it is possible to suppress the temperature rise of the cover member itself, and furthermore, it is possible to dissipate the heat of the LED from the cover member, and it is excellent in handling. Furthermore, it is possible to provide a lamp with a base that is further excellent in heat dissipation. As mentioned above, the same code | symbol was attached | subjected to FIG. 5-6 which shows a modification, and the same part as FIGS. 1-4, and detailed description was abbreviate | omitted.

また、本実施形態において、口金付ランプ１０は、一般白熱電球の形状に近似させた電球形（Ａ形またはＰＳ形）、レフ形（Ｒ形）、ボール形（Ｇ形）、円筒形（Ｔ形）などに構成してもよい。また一般白熱電球の形状に近似させた口金付ランプに限らず、その他各種の外観形状、用途をなす口金付ランプに適用することができる。   In the present embodiment, the lamp with cap 10 is a light bulb shape (A shape or PS shape), a reflex shape (R shape), a ball shape (G shape), or a cylindrical shape (T) that approximates the shape of a general incandescent light bulb. Shape) or the like. Further, the present invention is not limited to a lamp with a cap approximated to the shape of a general incandescent bulb, but can be applied to lamps with a cap having various other external shapes and uses.

また、固体発光素子１１ａは、発光ダイオードに限らず、有機ＥＬまたは半導体レーザなどを発光源とした固体発光素子が許容される。固体発光素子は複数個で構成されていることが好ましいが、照明の用途に応じて必要な個数は選択され、例えば、４個程度の素子群を構成し、この群１個、若しくは複数の群をなすように構成してもよい。さらには１個の固体発光素子で構成されるものであってもよい。固体発光素子は、ＣＯＢ技術を用いて構成されたものが好ましいが、ＳＭＤ形構成されたものであってもよい。固体発光素子は、白色で発光するように構成することが好ましいが、使用される照明器具の用途に応じ、赤色、青色、緑色等でも、さらには各種の色を組み合わせて構成してもよい。   Further, the solid light emitting element 11a is not limited to a light emitting diode, and a solid light emitting element using an organic EL or a semiconductor laser as a light source is allowed. It is preferable that a plurality of solid-state light emitting elements are configured. However, the necessary number is selected according to the use of illumination. For example, about four element groups are formed, and one or more groups are formed. You may comprise so that. Furthermore, it may be composed of a single solid state light emitting device. The solid light emitting device is preferably constructed using the COB technology, but may be constructed of SMD type. The solid light-emitting element is preferably configured to emit white light, but may be configured to be red, blue, green, or a combination of various colors depending on the use of the luminaire used.

基板１１ｃおよび配線基板１１ｂ１は、熱伝導性の良好なアルミニウムで構成したが、銅、ステンレス等の金属で構成したものであってもよい。さらには、例えば、エポキシ樹脂等の合成樹脂やガラスエポキシ材、紙フェノール材等の非金属性の部材で構成されてもよい。さらにセラミックスで構成されたものであってもよい。また、光源部１１のＬＥＤ１１ａを面状に配設した発光部の形状は、点または面モジュールを構成するために円形、四角形、六角形などの多角形状、さらには楕円形状等をなすものであってもよく、目的とする配光特性を得るための全ての形状が許容される。   The board 11c and the wiring board 11b1 are made of aluminum having good thermal conductivity, but may be made of a metal such as copper or stainless steel. Furthermore, for example, you may be comprised with non-metallic members, such as synthetic resins, such as an epoxy resin, a glass epoxy material, and a paper phenol material. Further, it may be made of ceramics. In addition, the shape of the light emitting unit in which the LEDs 11a of the light source unit 11 are arranged in a plane shape is a polygonal shape such as a circle, a quadrangle, a hexagon, or an ellipse to form a point or a plane module. All the shapes for obtaining the desired light distribution characteristics are acceptable.

放熱体１２は、熱伝導性の良好なアルミニウムで構成したが、銅（Ｃｕ）、鉄（Ｆｅ）、ニッケル（Ｎｉ）の少なくとも一種を含む金属で形成してもよい。この他に、窒化アルミニウム（ＡｌＮ）、シリコーンカーバイト（ＳｉＣ）などの工業材料で構成しても、さらに高熱伝導樹脂等の合成樹脂で構成してもよい。   Although the heat radiator 12 is made of aluminum having good thermal conductivity, it may be made of a metal containing at least one of copper (Cu), iron (Fe), and nickel (Ni). In addition, it may be made of an industrial material such as aluminum nitride (AlN) or silicone carbide (SiC), or may be made of a synthetic resin such as a high thermal conductive resin.

点灯装置１７は、固体発光素子１１ａを調光するための調光機能や調色機能を有するものであってもよい。点灯装置は放熱体１２内に全てが収容され配設されたものでも、口金部材１４に一部が収容されるものであってもよい。   The lighting device 17 may have a dimming function or a toning function for dimming the solid light emitting element 11a. The lighting device may be entirely accommodated in the radiator 12 or may be partially accommodated in the base member 14.

口金部材１４は、一般白熱電球が取付けられるソケットに装着可能な全ての口金が許容されるが、一般的に最も普及しているエジソンタイプのＥ２６形やＥ１７形等の口金が好適である。また、材質は口金全体が金属で構成されたものでも、電気的接続部分を銅板等の金属で構成し、それ以外の部分を合成樹脂で構成した樹脂製の口金であっても、さらには、ピン形の端子を有する口金でも、Ｌ字形の端子を有する口金でもよく、特定の口金には限定されない。   The base member 14 may be any base that can be attached to a socket to which a general incandescent light bulb is attached, but a base such as Edison type E26 type or E17 type that is most widely used is preferable. In addition, even if the material is a metal base as a whole, the electrical connection part is made of a metal such as a copper plate, and the other part is a plastic base made of a synthetic resin. It may be a base having a pin-shaped terminal or a base having an L-shaped terminal, and is not limited to a specific base.

また、本実施形態において、照明器具は天井埋込形、直付形、吊下形、さらには壁面取付形等が許容され、器具本体に制光体としてグローブ、セード、反射体などが取付けられるものであっても光源となる口金付ランプが露出するものであってもよい。また、器具本体に１個の口金付ランプを取付けたものに限らず、複数個が配設されるものであってもよい。さらに、オフィス等、施設・業務用の大型の照明器具などを構成してもよい。以上、本発明の好適な実施形態を説明したが、本発明は上述の実施形態に限定されることなく、例えば、ＧＸ５３形の口金を備える光源やコンパクト形蛍光ランプに代替が可能なＬＥＤを光源とする口金付ランプを構成するなど、本発明の要旨を逸脱しない範囲内において、種々の設計変更を行うことができる。   In the present embodiment, the lighting fixture can be a ceiling-embedded type, a direct-attached type, a suspended type, or a wall-mounted type, and a glove, a shade, a reflector, etc. can be attached to the fixture body as a light control body. Even if it is a thing, the lamp | ramp with a nozzle | cap | die used as a light source may be exposed. Moreover, not only what attached the lamp | ramp with one nozzle | cap | die to the instrument main body, A plurality may be arrange | positioned. Furthermore, you may comprise large luminaires for facilities and business, such as offices. The preferred embodiment of the present invention has been described above. However, the present invention is not limited to the above-described embodiment. For example, a light source including a GX53-type base or an LED that can be substituted for a compact fluorescent lamp is used as a light source. Various design changes can be made without departing from the gist of the present invention, such as a lamp with a cap.

１０ 口金付ランプ
１１ 光源部
１１ａ 固体発光素子
ｘ−ｘ 光軸
１２ 放熱体
１２ｂ 放熱部
１２ｂ２ 空洞部
１３ カバー部材
１３ａ 上側カバー部
１３ｂ 下側カバー部
１３ｂ３ 開放部
１４ 口金部材
２０ 照明器具
２１ 器具本体
２３ ソケット
DESCRIPTION OF SYMBOLS 10 Lamp with a base 11 Light source part 11a Solid light emitting element xx Optical axis 12 Radiator 12b Heat sink 12b2 Cavity part 13 Cover member 13a Upper cover part 13b Lower cover part 13b3 Opening part 14 Base member 20 Lighting fixture 21 Appliance main body 23 socket

Claims (4)

固体発光素子からなる光源部と；
光源部を頂部に配設し、光源部からの光を頂部と逆方向に向けて放射するように、光軸に対し放射方向に突出して設けられる放熱部を形成した熱伝導性を有する放熱体と；
放熱体の放熱部を外気に向けて露出させる開放部を有し、光源部および放熱体を覆うように設けられる透光性のカバー部材と；
光源部に電源を供給する口金部材と；
を具備していることを特徴とする口金付ランプ。 A light source unit comprising a solid state light emitting device;
A heat-dissipating body having a heat conductivity in which a light source part is arranged at the top and a heat-radiating part is provided so as to project in the radial direction with respect to the optical axis so as to emit light from the light source part in a direction opposite to the top part. When;
A translucent cover member having an open portion that exposes the heat dissipating part of the heat dissipating member to the outside air, and is provided so as to cover the light source part and the heat dissipating member;
A base member for supplying power to the light source unit;
A lamp with a base, characterized by comprising: 前記放熱体の放熱部は、外気に連通する空洞部を有して構成され、外気が空洞部を介して流通するようにしたことを特徴とする請求項１に記載の口金付ランプ。 2. The lamp with cap according to claim 1, wherein the heat dissipating part of the heat dissipating member is configured to have a hollow part communicating with the outside air, and the outside air flows through the hollow part. 前記カバー部材は、光源部を覆う上側カバー部の光透過率が、放熱体を覆う下側カバー部の光透過率より低くなるように構成したことを特徴とする請求項１または２に記載の口金付ランプ。 The said cover member was comprised so that the light transmittance of the upper cover part which covers a light source part might become lower than the light transmittance of the lower cover part which covers a heat radiator. Lamp with cap. ソケットが設けられる器具本体と；
器具本体のソケットに装着される請求項１ないし３いずれか一に記載の口金付ランプと；
を具備していることを特徴とする照明器具。
An instrument body provided with a socket;
A lamp with a cap according to any one of claims 1 to 3, which is mounted on a socket of a device body;
The lighting fixture characterized by comprising.
JP2010202707A 2010-09-10 2010-09-10 Lamp with lamp and lighting equipment Expired - Fee Related JP5557105B2 (en)

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JP2010202707A JP5557105B2 (en) 2010-09-10 2010-09-10 Lamp with lamp and lighting equipment
CN201190000702XU CN203215308U (en) 2010-09-10 2011-08-29 Lamp provided with lamp holder and luminaire
PCT/JP2011/069383 WO2012032951A1 (en) 2010-09-10 2011-08-29 Metal base lamp and lighting equipment

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JP6497015B2 (en) * 2013-09-27 2019-04-10 三菱電機株式会社 Lighting lamp and lighting device
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