TWM445217U - Touch module signal transmission structure - Google Patents
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- TWM445217U TWM445217U TW101213397U TW101213397U TWM445217U TW M445217 U TWM445217 U TW M445217U TW 101213397 U TW101213397 U TW 101213397U TW 101213397 U TW101213397 U TW 101213397U TW M445217 U TWM445217 U TW M445217U
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Description
本創作是有關於一種觸控模組中訊號傳輸的構造，可應用在電子產品的觸控面板，或直接製成電子產品上包含觸控面板的上蓋。The present invention relates to a signal transmission structure in a touch module, which can be applied to a touch panel of an electronic product, or directly formed into an upper cover of an electronic product including a touch panel.
近年來，觸控面板逐漸取代傳統的實體按鍵，廣泛應用於手機、數位相機、平板電腦等電子產品上，並且也應用在許多電器的控制面板上。隨著觸控面板之產製技術日漸成熟，觸控靈敏度已大幅提升，加上多點觸控的應用，使其在使用上更加便利，市場上對於觸控面板的需求仍持續攀升。In recent years, touch panels have gradually replaced traditional physical buttons, which are widely used in electronic products such as mobile phones, digital cameras, and tablet computers, and are also applied to control panels of many electrical appliances. As the production technology of touch panels has matured, touch sensitivity has been greatly improved, and the application of multi-touch has made it more convenient to use. The demand for touch panels in the market continues to rise.
前述觸控面板主要是由基板與感應薄膜貼合而成觸控模組，該基板位於觸控面板外側，用以接受使用者觸摸，該感應薄膜則設於基板內面，且感應薄膜上設有複數層觸控感應電路，以及一輸出訊號用的電連接區，當觸控感應電路感應到來自使用者的觸控動作之後，即通過電連接區輸出訊號至電子產品之電路板，以達到觸控之目的。The touch panel is mainly composed of a substrate and an inductive film, and the substrate is disposed outside the touch panel for receiving a touch. The sensing film is disposed on the inner surface of the substrate, and the sensing film is disposed on the sensing film. There are a plurality of layers of touch sensing circuits, and an electrical connection area for outputting signals. When the touch sensing circuit senses a touch action from the user, the output signal is outputted to the circuit board of the electronic product through the electrical connection area. The purpose of touch.
由於上述觸控面板在實務運用時尚需與電子產品結合，而且感應薄膜的電連接區與電子產品的電路板之間必須通過一軟性電路板電性連接；然而感應薄膜裸露在觸控面板的內面，因此在感應薄膜上設置軟性電路板、或觸控面板與電子產品結合組立的過程中，容易碰觸到感應薄膜 而增加損壞的機率，因此本創作人乃設想在感應薄膜內面披覆一基底層，除了能夠保護感應薄膜而提高觸控面板的良率以外，基底層可設計諸如卡扣等構造，以便後續安裝在電子產品時，直接卡扣於電子產品下蓋，讓整體觸控模組可以取代傳統電子產品的上蓋。Since the touch panel is practically used in combination with an electronic product, the electrical connection area of the sensing film and the circuit board of the electronic product must be electrically connected through a flexible circuit board; however, the sensing film is exposed in the touch panel. Therefore, in the process of providing a flexible circuit board on the sensing film or combining the touch panel and the electronic product, it is easy to touch the sensing film. In addition to increasing the probability of damage, the present author conceived to cover a base layer on the inner surface of the sensing film. In addition to protecting the sensing film and improving the yield of the touch panel, the substrate layer can be designed such as a buckle for subsequent use. When installed in an electronic product, it is directly attached to the lower cover of the electronic product, so that the overall touch module can replace the upper cover of the traditional electronic product.
惟，在感應薄膜內面披覆一基底層時，仍須在感應薄膜內面保留電連接區，以供後續感應薄膜與電子產品的電路板電性連接。有鑑於此，本創作人乃進一步提出了本創作觸控模組訊號傳輸構造，以同時克服前述感應薄膜內面裸露、以及感應薄膜與電路板電性連接的問題。However, when the inner surface of the sensing film is covered with a base layer, the electrical connection area must remain on the inner surface of the sensing film for electrically connecting the subsequent sensing film to the circuit board of the electronic product. In view of this, the present author further proposes the signal transmission structure of the present touch module to simultaneously overcome the problem of the exposed inner surface of the sensing film and the electrical connection between the sensing film and the circuit board.
又，目前業界已存在有一種曲面狀電容式觸控面板之技術，例如美國專利第US20100103138A1號、以及台灣專利第I3200073號，可直接將觸控面板製成電子產品之外殼，進而節省生產成本；惟該等先前技術不具有基底層，亦未提供與電子產品之電路板電性連接的解決方案，在實務運用上仍有待改進。Moreover, there is a technology of a curved capacitive touch panel in the industry, such as US Patent No. US20100103138A1 and Taiwan Patent No. I3200073, which can directly form a touch panel into an outer casing of an electronic product, thereby saving production costs; However, the prior art does not have a base layer, nor does it provide a solution for electrically connecting the circuit board of the electronic product, and there is still room for improvement in practical application.
因此，本創作之目的，即在於提供一種觸控模組之訊號傳輸構造，特別是在觸控模組鄰近電子產品的電路板之內側設置一基底層，並且預留一可供外接電路板的窗口或轉接元件，藉以簡化製程，並節省產製成本。Therefore, the purpose of the present invention is to provide a signal transmission structure of a touch module, in particular, a base layer is disposed on the inner side of the circuit board of the touch module adjacent to the electronic product, and an external circuit board is reserved. Window or adapter components to simplify the process and save on production costs.
為達成上述目的，本創作一種觸控模組訊號傳輸構造，包含：一感應薄膜，具有一用以感測外界觸摸的外表面，以 及一相反於該外表面的內表面，且內表面上具有一感應訊號之電連接區；一保護蓋，佈設於該感應薄膜內表面的電連接區；一基底層，以射出成型方式結合在該感應薄膜內表面，使電連接區被隔離在該保護蓋內，不被基底層所包覆；及一窗口，以切割去除該保護蓋方式形成於該基底層上，使電連接區裸露而得以通過該窗口電性連接一訊號傳輸元件。In order to achieve the above object, a touch module signal transmission structure is provided, comprising: an inductive film having an outer surface for sensing an external touch, And an electrical connection region opposite to the inner surface of the outer surface and having an inductive signal on the inner surface; a protective cover disposed on the inner connecting surface of the sensing film; and a base layer bonded in an injection molding manner The inner surface of the sensing film is such that the electrical connection region is isolated in the protective cover and is not covered by the base layer; and a window is formed on the base layer by cutting and removing the protective cover to expose the electrical connection region A signal transmission component can be electrically connected through the window.
實施時，所述之訊號傳輸元件可以採用任何一種可與前述感應薄膜之電連接區相對應電性連接的電子元件，俾能通過該訊號傳輸元件電性連接一外來電子產品之電路板，例如：軟性電路板、電連接器等。或者，訊號傳輸元件實施時，亦可採用較先進的雷射(激光)建構成型轉接頭，例如：LDS連接器(Laser Direct Structure Connector)和LSP連接器(Laser selective plating Connector)，然後利用導電膠(ACF，Anisotropic Conductive Film)與感應薄膜的電連接區相連；此等電連接器係屬於現有技術，在此不另贅述。In the implementation, the signal transmission component can be any electronic component that can be electrically connected to the electrical connection region of the sensing film, and can be electrically connected to the circuit board of the external electronic product through the signal transmission component, for example, : Flexible circuit boards, electrical connectors, etc. Alternatively, when the signal transmission component is implemented, a more advanced laser (laser) construction type adapter, such as an LDS connector (Laser Direct Structure Connector) and a LSP connector (Laser selective plating connector), may be used, and then conductive The adhesive (ACF, Anisotropic Conductive Film) is connected to the electrical connection region of the sensing film; these electrical connectors are prior art and will not be further described herein.
實施時，該保護蓋包含一埋設於該基底層上且貼合該內表面的邊框，以及一位於該邊框內且遮蓋該電連接區的遮蓋部，所述遮蓋部與電連接區之間具有一空隙，且遮蓋部接受切割去除而形成所述位於該邊框內的窗口；所述遮蓋部周邊與邊框內壁之間環設有至少一利於切割的環溝。In implementation, the protective cover includes a bezel embedded on the base layer and conforming to the inner surface, and a cover portion disposed in the bezel and covering the electrical connection region, the cover portion and the electrical connection region having A gap is formed, and the cover portion is subjected to cutting and removing to form the window located in the frame; and the ring between the periphery of the cover portion and the inner wall of the frame is provided with at least one annular groove for facilitating cutting.
此外，本創作觸控模組訊號傳輸構造的另一種實施方式，係包含： 一感應薄膜，具有一用以感測外界觸摸的外表面，以及一相反於該外表面的內表面，且內表面上具有一感應訊號之電連接區；一轉接元件，具有相互導通之一第一連接電路及一第二連接電路，該轉接元件設置於該感應薄膜內表面的電連接區外部，且該第一連接電路電性連接於該電連接區，第二連接電路則顯露於該感應薄膜內表面上；以及一基底層，以射出成型方式結合在該感應薄膜內表面使該轉接元件之第二連接電路顯露於該基底層上，以供電性連接一訊號傳輸元件，俾能通過該訊號傳輸元件很方便地與一外來電子產品之電路板電性連接。In addition, another implementation manner of the signal transmission structure of the created touch module includes: An inductive film having an outer surface for sensing an external touch, and an inner surface opposite to the outer surface, and an electrical connection region having an inductive signal on the inner surface; an switching element having one of mutual conduction a first connecting circuit and a second connecting circuit, the switching element is disposed outside the electrical connection region of the inner surface of the sensing film, and the first connecting circuit is electrically connected to the electrical connection region, and the second connecting circuit is exposed An inner surface of the sensing film; and a base layer coupled to the inner surface of the sensing film by injection molding to expose a second connecting circuit of the switching component on the substrate layer to electrically connect a signal transmission component, The signal transmission component can be conveniently electrically connected to the circuit board of an external electronic product.
藉由上述構造，該感應薄膜之電連接區即可經由轉接元件的第一連接電路以及顯露於基底層上之第二連接電路，很方便地通過訊號傳輸元件與外來電子產品之電路板電性連接。With the above configuration, the electrical connection region of the sensing film can be conveniently passed through the first connection circuit of the switching element and the second connection circuit exposed on the substrate layer, and is conveniently electrically transmitted through the signal transmission component and the circuit board of the foreign electronic product. Sexual connection.
實施時，所述之轉接元件可以為一般公規的電連接器，例如：軟性電路板連接器(FPC Connector)、板對板連接器(Board to Board，BTB Connector)等等，亦可以採用較先進的雷射(激光)建構成型連接器，例如：LDS連接器(Laser Direct Structure Connector)和LSP連接器(Laser selective plating Connector)，然後用導電膠(ACF，Anisotropic Conductive Film)與感應薄膜的電連接區相連。When implemented, the switching component can be a general-purpose electrical connector, such as a flexible circuit board connector (FPC Connector), a board to board connector (BTB Connector), etc., and can also be used. More advanced laser (laser) built-in connectors, such as: LDS connector (Laser Direct Structure Connector) and LSP connector (Laser selective plating connector), and then using conductive adhesive (ACF, Anisotropic Conductive Film) and induction film The electrical connection areas are connected.
配合本實施例，所述之訊號傳輸元件則可以是任何一種可與前述各種轉接元件相對應電性連接之電子元件，例如：軟性電路板、電連接器或與前述雷射(激光)建構成 型連接器相對應的轉接頭等。或者，該轉接元件是由一支架以及一彎曲貼附於該支架上的軟性電路板所組成，其中該軟性電路板預設有前述相互導通之一第一連接電路及一第二連接電路分別延伸至該支架的正反兩面，且第一連接電路貼觸於該電連接區而電性連接，第二連接電路則在設置基底層後顯露於該基底層上，俾能藉由第二連接電路通過訊號傳輸元件與電子產品之電路板電性連接。With the embodiment, the signal transmission component can be any electronic component that can be electrically connected to the foregoing various switching components, such as a flexible circuit board, an electrical connector, or the aforementioned laser (laser). Composition The corresponding connector of the type connector, etc. Or the switching component is composed of a bracket and a flexible circuit board attached to the bracket, wherein the flexible circuit board is pre-configured with one of the first connecting circuit and the second connecting circuit respectively Extending to the front and back sides of the bracket, and the first connecting circuit is electrically connected to the electrical connection region, and the second connecting circuit is exposed on the base layer after the base layer is disposed, and the second connection is The circuit is electrically connected to the circuit board of the electronic product through the signal transmission component.
除此之外，本創作並包含：所述感應薄膜之外表面與內表面呈平面或往外突出型態，且感應薄膜之外表面疊合固定在一相同平面或往外突出型態的基板內面；所述基板與感應薄膜的外表面之間經由一黏膠層相互黏固。In addition, the present invention includes: the outer surface and the inner surface of the sensing film are in a planar or outwardly protruding shape, and the outer surface of the sensing film is superposed and fixed on the same plane or the outer surface of the protruding substrate. The substrate and the outer surface of the sensing film are adhered to each other via an adhesive layer.
該感應薄膜為奈米碳管薄膜或氧化銦錫薄膜；其中，奈米碳管薄因具有良好的導電性、耐高溫、高拉伸強度、高結構強度、可透光、易於製造等優點之特色，因此特別適用在感應薄膜疊合固定在基板內面後，再一體壓製成往外突出型態的製程。The sensing film is a carbon nanotube film or an indium tin oxide film; wherein the carbon nanotube thin has good electrical conductivity, high temperature resistance, high tensile strength, high structural strength, light transmission, and easy manufacture. The special feature is therefore particularly suitable for the process in which the inductive film is laminated and fixed on the inner surface of the substrate, and then integrally pressed into an outwardly protruding type.
該訊號傳輸元件係為一軟性電路板或電連接器。The signal transmission component is a flexible circuit board or an electrical connector.
該基底層周圍適當位置設置一個或一個以上的卡扣件，以便後續整體觸控模組安裝在電子產品時，直接卡扣於電子產品下蓋。One or more snap members are disposed at appropriate positions around the base layer, so that when the entire touch module is mounted on the electronic product, the electronic product cover is directly buckled.
相較於先前技術，本創作實具有如下之優點：Compared with the prior art, this creation has the following advantages:
1.在感應薄膜鄰近電子產品的電路板之內側設置一基底層，若應用在電子產品的觸控面板而將觸控模組組立在電子產品之液晶顯示器(LCD)上方時，該基底層可對感應 薄膜或液晶顯示器起保護作用，不但可以提高整體觸控模組的良率，而且在日後使用時，也可對感應薄膜被觸摸按壓時的壓力予以支持，同時防止感應薄膜及液晶顯示器相互碰觸造成損壞。1. A substrate layer is disposed on the inner side of the circuit board adjacent to the electronic product. If the touch panel is applied to the liquid crystal display (LCD) of the electronic product, the base layer can be Induction The film or liquid crystal display protects the overall touch module, and can also support the pressure when the sensing film is touched and pressed during the future use, while preventing the sensing film and the liquid crystal display from touching each other. Cause damage.
2.感應薄膜之外表面疊合固定在一基板內面，且基底層以射出成型方式結合在該感應薄膜內表面時，該基底層可以在一體成型時設置諸如卡扣件等構造，以便後續安裝在電子產品時，直接卡扣於電子產品下蓋，讓整體觸控模組可以取代傳統電子產品的上蓋。2. When the outer surface of the sensing film is superposed and fixed on the inner surface of the substrate, and the base layer is bonded to the inner surface of the sensing film by injection molding, the base layer may be provided with a structure such as a snap member when integrally formed, so as to be subsequently When installed in an electronic product, it is directly attached to the lower cover of the electronic product, so that the overall touch module can replace the upper cover of the traditional electronic product.
3.後續觸控模組組立於電子產品時，該感應薄膜的電連接區經由窗口或轉接元件，可以很方便地通過訊號傳輸元件外接電路板以傳輸訊號。3. When the subsequent touch module is set in the electronic product, the electrical connection area of the sensing film can be conveniently transmitted through the signal transmission component through the window or the switching component to transmit the signal.
然而，為能明確且充分揭露本創作，併予列舉較佳實施之圖例，以詳細說明其實施方式如後述：However, in order to clearly and fully disclose the present invention, and to illustrate the preferred embodiment, the detailed description of the embodiments will be described as follows:
請參閱圖1，揭示出本創作之觸控模組100可以設置在類似手機等外來之電子產品200上，且所述觸控模組100與電子產品200內部電路板(未繪製)之間具有一液晶顯示器(LCD，圖略)，並配合圖2至圖5說明本創作一種觸控模組訊號傳輸構造，包含一感應薄膜11、一保護蓋20、一基底層12及一窗口21；其中：該感應薄膜11具有一用以感測外界觸摸的外表面111，以及一相反於外表面111的內表面112，且內表面112 上具有一用以輸出觸控感應訊號之電連接區113。Referring to FIG. 1 , it is disclosed that the touch module 100 of the present invention can be disposed on an external electronic product 200 such as a mobile phone, and the touch module 100 and the internal circuit board (not drawn) of the electronic product 200 have A liquid crystal display (LCD), and with reference to FIG. 2 to FIG. 5, illustrates a touch module signal transmission structure, comprising an inductive film 11, a protective cover 20, a base layer 12 and a window 21; The sensing film 11 has an outer surface 111 for sensing an external touch, and an inner surface 112 opposite to the outer surface 111, and the inner surface 112 There is an electrical connection area 113 for outputting a touch sensing signal.
該感應薄膜11為可透光的導電薄膜，例如奈米碳管薄膜、氧化銦錫薄膜或其他具有類似性質的薄膜，所述奈米碳管薄膜具有良好的導電性、耐高溫、高拉伸強度、高構造強度、可透光、易於製造等優點，因此適合作為觸控模組100中的透明導電膜，且感應薄膜11上設有觸控感應電路圖形構造。The sensing film 11 is a light transmissive conductive film, such as a carbon nanotube film, an indium tin oxide film or other film having similar properties, and the carbon nanotube film has good electrical conductivity, high temperature resistance and high tensile strength. The utility model has the advantages of high strength, high structural strength, light permeable, easy manufacturing, and the like, and is therefore suitable as a transparent conductive film in the touch module 100, and the sensing film 11 is provided with a touch sensing circuit graphic structure.
該保護蓋20以黏貼方式設置在感應薄膜11內表面112的電連接區113外部。The protective cover 20 is disposed on the outside of the electrical connection region 113 of the inner surface 112 of the sensing film 11 in an adhesive manner.
該基底層12以射出成型(injection molding)方式結合在感應薄膜11內表面112，使電連接區113被隔離在保護蓋20內，不被基底層12所包覆，該基底層12具有一貼觸感應薄膜11內表面112之接合面121，以及一相反於接合面121且鄰近電子產品200之液晶顯示器與電路板的底面122。The base layer 12 is bonded to the inner surface 112 of the sensing film 11 by injection molding, so that the electrical connection region 113 is isolated in the protective cover 20 and is not covered by the base layer 12. The base layer 12 has a sticker. The bonding surface 121 of the inner surface 112 of the touch sensitive film 11 and a bottom surface 122 opposite to the bonding surface 121 and adjacent to the liquid crystal display of the electronic product 200 and the circuit board.
該基底層12是由可透光的樹脂材料製成，例如聚碳酸酯(polycarbonate,PC)，且基底層12為上方感應薄膜11的支持構造，作為整個觸控模組100被觸摸按壓時的支持，同時也可以保護感應薄膜11，尤其是在觸控模組100安裝在電子產品200上時，還可以保護安裝於感應薄膜11下方的液晶顯示器，使液晶顯示器不會碰觸到感應薄膜11，減少感應薄膜11或液晶顯示器在使用時損壞的機率。The base layer 12 is made of a light transmissive resin material, such as polycarbonate (PC), and the base layer 12 is a supporting structure of the upper sensing film 11 as the entire touch module 100 is touch pressed. The support film can also protect the sensing film 11 , especially when the touch module 100 is mounted on the electronic product 200 , and also protect the liquid crystal display mounted under the sensing film 11 so that the liquid crystal display does not touch the sensing film 11 . , reducing the probability of damage of the sensing film 11 or the liquid crystal display during use.
該窗口21是採用CNC數控切割去除該保護蓋20方式形成於基底層12之底面122上，使感應薄膜11的電連接區113通過窗口21而裸露，則電連接區113即得以通過窗口 21以膠合方式電性連接一外來之訊號傳輸元件40。The window 21 is formed on the bottom surface 122 of the base layer 12 by CNC cutting to remove the protective cover 20, so that the electrical connection region 113 of the sensing film 11 is exposed through the window 21, and the electrical connection region 113 passes through the window. 21 is electrically connected to an external signal transmission component 40 by gluing.
該訊號傳輸元件40可以採用任何一種可與前述電連接區113電性連接之電子元件，例如：軟性電路板、電連接器或轉接頭等，且訊號傳輸元件40另一端可電性連接電子產品200之電路板，使電連接區113得以通過窗口21電性連接訊號傳輸元件40，並透過訊號傳輸元件40電性連接外來電子產品200之電路板。The signal transmission component 40 can be any electronic component that can be electrically connected to the electrical connection region 113, such as a flexible circuit board, an electrical connector or a connector, and the other end of the signal transmission component 40 can be electrically connected to the electronic device. The circuit board of the product 200 enables the electrical connection area 113 to be electrically connected to the signal transmission component 40 through the window 21 and electrically connected to the circuit board of the foreign electronic product 200 through the signal transmission component 40.
此外，該訊號傳輸元件40亦可以採用較先進的雷射(激光)建構成型轉接頭，例如：LDS連接器(Laser Direct Structure Connector)和LSP連接器(Laser selective plating Connector)，然後利用導電膠(ACF，Anisotropic Conductive Film)與感應薄膜11的電連接區113相連；此等電連接器係屬於現有技術，在此不另贅述。In addition, the signal transmission component 40 can also be constructed using a more advanced laser (laser) construction type adapter, such as an LDS connector (Laser Direct Structure Connector) and a LSP connector (Laser selective plating connector), and then using a conductive adhesive. (ACF, Anisotropic Conductive Film) is connected to the electrical connection region 113 of the sensing film 11; these electrical connectors are prior art and will not be further described herein.
在更加具體的實施上，本創作並包含：所述感應薄膜11之外表面111與內表面112可呈平面或往外突出型態，且感應薄膜11之外表面111疊合固定在一相同平面或往外突出型態的基板13內面。In a more specific implementation, the present invention includes: the outer surface 111 and the inner surface 112 of the sensing film 11 may be in a planar or outwardly protruding shape, and the outer surface 111 of the sensing film 11 is superposed on a same plane or The inner surface of the substrate 13 is protruded outward.
該基板13具有一用以接受人手觸摸的觸控面131，以及一相反於觸控面131的基面132，在所述基板13之基面132與感應薄膜11的外表面111之間經由一黏膠層14相互黏固。The substrate 13 has a touch surface 131 for receiving human touch, and a base surface 132 opposite to the touch surface 131, between the base surface 132 of the substrate 13 and the outer surface 111 of the sensing film 11 The adhesive layers 14 are adhered to each other.
該基板13是由可透光的材質製成薄膜形式，例如聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)，該基板13的材料沒有特殊限制，只要可透光，受熱後可塑形即可；該黏膠層14的材料可為光學膠(Optical Clear Adhesive, OCA膠)。The substrate 13 is made of a light-transmissive material, such as polyethylene terephthalate (PET). The material of the substrate 13 is not particularly limited as long as it can transmit light and can be shaped after being heated. The material of the adhesive layer 14 can be an optical adhesive (Optical Clear Adhesive, OCA glue).
當基板13之之觸控面131受到一觸控體(例如使用者的手指或其他觸控物)觸摸時，該感應薄膜11受到觸摸位置會因為電容值變化而產生感應，進而產生觸控感應訊號。When the touch surface 131 of the substrate 13 is touched by a touch object (such as a user's finger or other touch object), the touched position of the sensing film 11 is sensed due to a change in capacitance value, thereby generating touch sensing. Signal.
所述基底層12之射出成型方式，是將所述相互黏固之基板13與感應薄膜11置入一個具有預定形狀的模具(未繪製)中，接著在模具中利用射出成型的方式形成該基底層12，而使基底層12一體式地結合在感應薄膜11內表面112。The base layer 12 is formed by inserting the mutually adhered substrate 13 and the sensing film 11 into a mold (not drawn) having a predetermined shape, and then forming the substrate by injection molding in the mold. The layer 12 is integrally bonded to the inner surface 112 of the sensing film 11.
該保護蓋20包含一埋設於基底層12之底面122上且貼合該感應薄膜11內表面112的矩形邊框22，以及一位於邊框22內且遮蓋電連接區113的矩形遮蓋部23，該邊框22可有效間隔出電連接區113，而有利於成型基底層12上之窗口21。The protective cover 20 includes a rectangular frame 22 embedded on the bottom surface 122 of the base layer 12 and attached to the inner surface 112 of the sensing film 11, and a rectangular cover portion 23 located in the frame 22 and covering the electrical connection region 113. The frame 22 can effectively separate the electrical connection regions 113 to facilitate shaping of the window 21 on the substrate layer 12.
所述遮蓋部23與電連接區113之間具有一空隙300，該空隙300的設計可防止射出成型基底層12之過程中，造成模具壓傷電連接區113之觸控感應電路圖形構造的狀況。A gap 300 is formed between the covering portion 23 and the electrical connection region 113. The gap 300 is designed to prevent the state of the touch sensing circuit pattern of the mold from being damaged during the process of injecting the base layer 12. .
所述遮蓋部23周邊與邊框22內壁之間環設有至少一利於切割的環溝24，該遮蓋部23可沿著環溝24接受數控切割去除而形成所述位於邊框內的窗口，該環溝24的設計有利於切割刀具在不傷害電連接區113的情況下切除遮蓋部23。At least one annular groove 24 for cutting is provided around the periphery of the cover portion 23 and the inner wall of the frame 22. The cover portion 23 can be removed by the NC cutting along the ring groove 24 to form the window in the frame. The design of the annular groove 24 facilitates cutting of the covering portion 23 without damaging the electrical connection region 113.
或者，請參閱圖6及圖7，說明上述感應薄膜11與基板13之間係利用一黏膠層14相互黏貼固定後，再對所述利用黏膠層14相互貼合之基板13與感應薄膜11一體加熱，使基板13及感應薄膜11適度地軟化以方便塑形，並利 壓製成平面或往電子產品200外側突出型態，而形成立體化之觸控模組100a；此實施例之感應薄膜11特別適合使用前述具有良好的導電性、耐高溫、高拉伸強度、高結構強度、可透光、易於製造等優點的奈米碳管薄。Alternatively, referring to FIG. 6 and FIG. 7, the substrate 13 and the sensing film are adhered to each other by the adhesive layer 14 after the adhesive film 11 and the substrate 13 are adhered to each other by an adhesive layer 14. 11 integrated heating, the substrate 13 and the sensing film 11 are moderately softened to facilitate shaping, and benefit Pressing into a flat surface or protruding to the outside of the electronic product 200 to form a three-dimensional touch module 100a; the sensing film 11 of this embodiment is particularly suitable for using the foregoing with good electrical conductivity, high temperature resistance, high tensile strength, and high The carbon nanotubes are structurally thin, light-transmissive, and easy to manufacture.
由於感應薄膜11a呈往電子產品200外側突出型態，因此所述基底層12a於射出成型後，該基底層12a之接合面121a也隨著感應薄膜11a呈往電子產品200外側突出型態，且感應薄膜11a之外表面111a與內表面112a呈往外突出型態。Since the sensing film 11a is protruded toward the outside of the electronic product 200, after the base layer 12a is injection-molded, the bonding surface 121a of the base layer 12a also protrudes toward the outside of the electronic product 200 along with the sensing film 11a, and The outer surface 111a and the inner surface 112a of the sensing film 11a are protruded outward.
該立體化觸控模組100a之基板13a的觸控面131a，可由左、右兩側及/或前、後兩端往中央逐漸地朝外弧凸呈彎曲型態，因此感應薄膜11a及基底層12a之接合面121a都是朝外弧凸的彎曲型態，且觸控面131a中央區域呈弧面狀態。The touch surface 131a of the substrate 13a of the stereoscopic touch module 100a can be gradually curved outwardly from the left and right sides and/or the front and rear ends toward the center, so that the sensing film 11a and the substrate are formed. The joint faces 121a of the layer 12a are curved in a convex shape toward the outer arc, and the central portion of the touch face 131a is in a curved state.
或者，如圖8及圖9所示，該立體化觸控模組100b之基板13b的觸控面131b，亦可由左、右兩側及/或前、後兩端往中央逐漸地朝外延展呈直線彎折型態，因此感應薄膜11b及基底層12b之接合面121b都是朝外朝外延展的直線彎折型態，且基板13b的觸控面131b中央區域呈平面狀態，且感應薄膜11b之外表面111b與內表面112b呈往外突出型態。Alternatively, as shown in FIG. 8 and FIG. 9 , the touch surface 131 b of the substrate 13 b of the stereoscopic touch module 100 b may be gradually extended toward the center by the left and right sides and/or the front and rear ends. The curved surface of the sensing film 11b and the base layer 12b is bent outwardly toward the outer surface, and the central portion of the touch surface 131b of the substrate 13b is in a planar state, and the sensing film is The outer surface 111b and the inner surface 112b of the outer surface 11b are protruded outward.
請參閱圖10至圖16，說明本創作觸控模組訊號傳輸構造的另一種實施方式，包含一感應薄膜11、一轉接元件3及一基底層12；其中：該感應薄膜11具有一用以感測外界觸摸的外表面 該感應薄膜11具有一用以感測外界觸摸的外表面111，以及一相反於該外表面111的內表面112，且內表面112上具有一感應訊號之電連接區113。Referring to FIG. 10 to FIG. 16 , another embodiment of the signal transmission structure of the touch control module includes an inductive film 11 , an adapter element 3 and a base layer 12 . The sensing film 11 has a function. To sense the outer surface touched by the outside world The sensing film 11 has an outer surface 111 for sensing an external touch, and an inner surface 112 opposite to the outer surface 111, and an electrical connection region 113 having an inductive signal on the inner surface 112.
該轉接元件3具有相互導通之一第一連接電路33及一第二連接電路34，該轉接元件3設置於感應薄膜11內表面112的電連接區113外部，而使第一連接電路33與電連接區113電性連接，且第二連接電路34顯露於感應薄膜11內表面112上。The switching element 3 has a first connecting circuit 33 and a second connecting circuit 34 which are electrically connected to each other. The switching element 3 is disposed outside the electrical connection region 113 of the inner surface 112 of the sensing film 11, and the first connecting circuit 33 is provided. The electrical connection region 113 is electrically connected, and the second connection circuit 34 is exposed on the inner surface 112 of the sensing film 11.
該基底層12以射出成型方式結合在感應薄膜11內表面112，使第二連接電路34顯露於基底層12表面，則感應薄膜11之電連接區113即得以通過所述第一連接電路33與第二連接電路34電性連接一外來之訊號傳輸元件40，並透過該訊號傳輸元件40電性連接一外來電子產品200之電路板。實施時，該轉接元件3是由一支架31以及一彎折貼附於支架31正反兩面之軟性電路板32所組成，其中該支架31呈直板狀，且支架31斷面呈ㄈ字型，軟性電路板32則設置前述之第一連接電路33及一第二連接電路34，且支架31四周以射出成型方式結合一絕緣框35，使軟性電路板32固定於支架31上。The base layer 12 is bonded to the inner surface 112 of the sensing film 11 in an injection molding manner, so that the second connecting circuit 34 is exposed on the surface of the base layer 12, and the electrical connection region 113 of the sensing film 11 is passed through the first connecting circuit 33. The second connecting circuit 34 is electrically connected to an external signal transmitting component 40 and electrically connected to the circuit board of the foreign electronic product 200 through the signal transmitting component 40. In the implementation, the adapter component 3 is composed of a bracket 31 and a flexible circuit board 32 attached to the front and back sides of the bracket 31. The bracket 31 has a straight plate shape, and the bracket 31 has a U-shaped cross section. The flexible circuit board 32 is provided with the first connecting circuit 33 and the second connecting circuit 34, and an insulating frame 35 is integrally formed around the bracket 31 by injection molding to fix the flexible circuit board 32 to the bracket 31.
所述絕緣框35之射出成型方式，是將所述貼附軟性電路板32的支架31置入一個具有預定形狀的模具(未繪製)中，接著在模具中利用射出成型的方式形成該絕緣框35，而使絕緣框35一體式地結合在支架31四周。The injection frame 35 is formed by inserting the bracket 31 to which the flexible circuit board 32 is attached into a mold (not drawn) having a predetermined shape, and then forming the insulating frame by injection molding in the mold. 35, and the insulating frame 35 is integrally joined around the bracket 31.
或者，所述之轉接元件3a亦可以為一般公規的電連接器，例如：軟性電路板連接器(FPC Connector)、板對板連 接器(Board to Board，BTB Connector)等等；此外，亦可以採用較先進的雷射(激光)建構成型連接器，例如：LDS連接器(Laser Direct Structure Connector)和LSP連接器(Laser selective plating Connector)，然後用導電膠(ACF，Anisotropic Conductive Film)將其第一連接電路33與感應薄膜11的電連接區113固定並且電性連接。Alternatively, the switching component 3a may also be a general-purpose electrical connector, such as a flexible circuit board connector (FPC Connector) or a board-to-board connector. Board to Board (BTB Connector), etc. In addition, more advanced laser (laser) can be used to construct the connector, such as: LDS connector (Laser Direct Structure Connector) and LSP connector (Laser selective plating) Connector, and then the first connection circuit 33 and the electrical connection region 113 of the sensing film 11 are fixed and electrically connected by an ACF (Anisotropic Conductive Film).
相對於本實施例，所述之外來訊號傳輸元件40則可以為任何一種可與前述轉接元件3a之第二連接電路34電性連接之電子元件，例如：軟性電路板、電連接器或轉接頭等等。The external signal transmission component 40 can be any electronic component that can be electrically connected to the second connection circuit 34 of the foregoing switching component 3a, such as a flexible circuit board, an electrical connector, or a turn. Joints and so on.
依據上述，該感應薄膜11、11a、11b之電連接區113於射出成型基底層12、12a、12b後，仍然可以很方便地通過轉接元件3、3a電性連接外來訊號傳輸元件40，並通過訊號傳輸元件40電性連接一外來電子產品200之電路板。According to the above, the electrical connection region 113 of the sensing film 11, 11a, 11b can be electrically connected to the external signal transmission component 40 through the switching elements 3, 3a after the injection molding of the substrate layer 12, 12a, 12b. The circuit board of the foreign electronic product 200 is electrically connected through the signal transmission component 40.
此外，圖15中揭示基底層12b周圍適當位置設置有一個或一個以上的卡扣件123，該卡扣件123是用來方便後續整體觸控模組安裝在電子產品時，得以直接卡扣於電子產品下蓋(圖略)，讓整體觸控模組可以取代傳統電子產品的上蓋。至於其餘構件組成及實施方式係等同於上述實施例，在此不另贅述。In addition, one or more latching members 123 are disposed at appropriate positions around the base layer 12b, and the latching members 123 are used to facilitate the subsequent mounting of the entire touch module to the electronic product. The lower cover of the electronic product (not shown) allows the overall touch module to replace the upper cover of traditional electronic products. The remaining component components and implementation manners are equivalent to the above embodiments, and are not described herein.
惟以上所述者，僅為本創作之較佳實施例而已，當不能以此限定本創作實施之範圍，舉凡依本創作申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本創作專利涵蓋之範圍內，謹此聲明。However, the above is only the preferred embodiment of the present invention. When it is not possible to limit the scope of the creative implementation, the simple equivalent changes and modifications made by the scope of the patent application and the description of the invention are all It is still within the scope of this creation patent and I hereby declare it.
100、100a、100b‧‧‧觸控模組100, 100a, 100b‧‧‧ touch module
200‧‧‧電子產品200‧‧‧Electronic products
300‧‧‧空隙300‧‧‧ gap
11、11a、11b‧‧‧感應薄膜11,11a, 11b‧‧‧Inductive film
111、111a、111b‧‧‧外表面111, 111a, 111b‧‧‧ outer surface
112、112a、112b‧‧‧內表面112, 112a, 112b‧‧‧ inner surface
113‧‧‧電連接區113‧‧‧Electrical connection area
12、12a、12b‧‧‧基底層12, 12a, 12b‧‧‧ basal layer
121、121a、121b‧‧‧接合面121, 121a, 121b‧‧‧ joint surface
122‧‧‧底面122‧‧‧ bottom
123‧‧‧卡扣件123‧‧‧Card fasteners
13、13a、13b‧‧‧基板13, 13a, 13b‧‧‧ substrate
131、131a、131b‧‧‧觸控面131, 131a, 131b‧‧‧ touch surface
132‧‧‧基面132‧‧‧ base
14‧‧‧黏膠層14‧‧‧Adhesive layer
20‧‧‧保護蓋20‧‧‧ protective cover
21‧‧‧窗口21‧‧‧ window
22‧‧‧邊框22‧‧‧Border
23‧‧‧遮蓋部23‧‧‧ Covering Department
24‧‧‧環溝24‧‧‧Circle
3、3a‧‧‧轉接元件3, 3a‧‧‧Transfer components
31‧‧‧支架31‧‧‧ bracket
32‧‧‧軟性電路板32‧‧‧Soft circuit board
33、33a‧‧‧第一連接電路33, 33a‧‧‧ first connection circuit
34、34a‧‧‧第二連接電路34, 34a‧‧‧second connection circuit
35‧‧‧絕緣框35‧‧‧Insulation frame
40‧‧‧訊號傳輸元件40‧‧‧Signal transmission components
圖1是本創作之一觸控模組的立體圖；圖2是本創作一種觸控模組的仰視立體分解圖；圖3是圖2實施例之一剖面示意圖；圖4是圖2實施例之另一剖面示意圖；圖5是圖2之使用狀態的局部放大立體圖；圖6是本創作之另一觸控模組的立體圖；圖7是圖4實施例之一附加實施型態的剖面示意圖；圖8是本創作之又一觸控模組的立體圖；圖9是圖4實施例之另一附加實施型態的剖面示意圖；圖10是本創作另一種觸控模組的剖面示意圖；圖11是圖10實施例之轉接元件之配置步驟立體圖；圖12是圖10實施例之仰視立體分解圖；圖13是圖12之使用狀態的局部放大立體圖；圖14是圖10實施例之一附加實施型態的剖面示意圖；圖15是圖10實施例之另一附加實施型態的剖面示意圖；圖16是圖10實施例之又一附加實施型態的剖面示意圖。1 is a perspective view of a touch module of the present invention; FIG. 2 is a bottom perspective exploded view of the touch module; FIG. 3 is a cross-sectional view of the embodiment of FIG. 2; Figure 5 is a partially enlarged perspective view of the use state of Figure 2; Figure 6 is a perspective view of another touch module of the present invention; Figure 7 is a cross-sectional view of an additional embodiment of the embodiment of Figure 4; 8 is a perspective view of another touch module of the present invention; FIG. 9 is a cross-sectional view of another embodiment of the embodiment of FIG. 4; FIG. 10 is a cross-sectional view of another touch module of the present invention; FIG. 12 is a perspective exploded view of the embodiment of FIG. 10; FIG. 13 is a partially enlarged perspective view of the use state of FIG. 12; FIG. 14 is an additional view of the embodiment of FIG. FIG. 15 is a cross-sectional view showing another embodiment of the embodiment of FIG. 10; FIG. 16 is a cross-sectional view showing still another embodiment of the embodiment of FIG.
100‧‧‧觸控模組100‧‧‧ touch module
11‧‧‧感應薄膜11‧‧‧Inductive film
111‧‧‧外表面111‧‧‧ outer surface
112‧‧‧內表面112‧‧‧ inner surface
113‧‧‧電連接區113‧‧‧Electrical connection area
12‧‧‧基底層12‧‧‧ basal layer
121‧‧‧接合面121‧‧‧ joint surface
122‧‧‧底面122‧‧‧ bottom
13‧‧‧基板13‧‧‧Substrate
131‧‧‧觸控面131‧‧‧ touch surface
132‧‧‧基面132‧‧‧ base
14‧‧‧黏膠層14‧‧‧Adhesive layer
20‧‧‧保護蓋20‧‧‧ protective cover
21‧‧‧窗口21‧‧‧ window
22‧‧‧邊框22‧‧‧Border
40‧‧‧訊號傳輸元件40‧‧‧Signal transmission components
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101213397U TWM445217U (en) | 2012-07-11 | 2012-07-11 | Touch module signal transmission structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101213397U TWM445217U (en) | 2012-07-11 | 2012-07-11 | Touch module signal transmission structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM445217U true TWM445217U (en) | 2013-01-11 |
Family
ID=48090906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101213397U TWM445217U (en) | 2012-07-11 | 2012-07-11 | Touch module signal transmission structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM445217U (en) |
-
2012
- 2012-07-11 TW TW101213397U patent/TWM445217U/en not_active IP Right Cessation
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