TWM433058U - Conductive vias of three-dimensional curved surface and metal layer structure - Google Patents

Conductive vias of three-dimensional curved surface and metal layer structure

Info

Publication number
TWM433058U
TWM433058U TW100223463U TW100223463U TWM433058U TW M433058 U TWM433058 U TW M433058U TW 100223463 U TW100223463 U TW 100223463U TW 100223463 U TW100223463 U TW 100223463U TW M433058 U TWM433058 U TW M433058U
Authority
TW
Taiwan
Prior art keywords
metal layer
curved surface
layer structure
conductive vias
dimensional curved
Prior art date
Application number
TW100223463U
Other languages
English (en)
Inventor
Hui-Hsiung Chen
Original Assignee
3D Circuit Taiwan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3D Circuit Taiwan filed Critical 3D Circuit Taiwan
Priority to TW100223463U priority Critical patent/TWM433058U/zh
Priority to CN2012200490153U priority patent/CN202535641U/zh
Publication of TWM433058U publication Critical patent/TWM433058U/zh

Links

TW100223463U 2011-12-13 2011-12-13 Conductive vias of three-dimensional curved surface and metal layer structure TWM433058U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100223463U TWM433058U (en) 2011-12-13 2011-12-13 Conductive vias of three-dimensional curved surface and metal layer structure
CN2012200490153U CN202535641U (zh) 2011-12-13 2012-02-15 立体曲面的导穿孔以及金属层结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100223463U TWM433058U (en) 2011-12-13 2011-12-13 Conductive vias of three-dimensional curved surface and metal layer structure

Publications (1)

Publication Number Publication Date
TWM433058U true TWM433058U (en) 2012-07-01

Family

ID=47136790

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100223463U TWM433058U (en) 2011-12-13 2011-12-13 Conductive vias of three-dimensional curved surface and metal layer structure

Country Status (2)

Country Link
CN (1) CN202535641U (zh)
TW (1) TWM433058U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9499911B2 (en) 2013-11-01 2016-11-22 Industrial Technology Research Institute Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure
TWI561148B (en) * 2012-07-24 2016-12-01 Hon Hai Prec Ind Co Ltd Housing and method for manufacturing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108925048A (zh) * 2018-07-18 2018-11-30 盐城维信电子有限公司 一种能避免通孔内空洞的cof柔性基板的制作方法及其产品
CN112996265A (zh) * 2021-02-09 2021-06-18 盐城维信电子有限公司 一种无需补偿的精细线路板制作方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561148B (en) * 2012-07-24 2016-12-01 Hon Hai Prec Ind Co Ltd Housing and method for manufacturing the same
US9499911B2 (en) 2013-11-01 2016-11-22 Industrial Technology Research Institute Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure
US9683292B2 (en) 2013-11-01 2017-06-20 Industrial Technology Research Institute Metal circuit structure

Also Published As

Publication number Publication date
CN202535641U (zh) 2012-11-14

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