TWM433058U - Conductive vias of three-dimensional curved surface and metal layer structure - Google Patents
Conductive vias of three-dimensional curved surface and metal layer structureInfo
- Publication number
- TWM433058U TWM433058U TW100223463U TW100223463U TWM433058U TW M433058 U TWM433058 U TW M433058U TW 100223463 U TW100223463 U TW 100223463U TW 100223463 U TW100223463 U TW 100223463U TW M433058 U TWM433058 U TW M433058U
- Authority
- TW
- Taiwan
- Prior art keywords
- metal layer
- curved surface
- layer structure
- conductive vias
- dimensional curved
- Prior art date
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100223463U TWM433058U (en) | 2011-12-13 | 2011-12-13 | Conductive vias of three-dimensional curved surface and metal layer structure |
CN2012200490153U CN202535641U (zh) | 2011-12-13 | 2012-02-15 | 立体曲面的导穿孔以及金属层结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100223463U TWM433058U (en) | 2011-12-13 | 2011-12-13 | Conductive vias of three-dimensional curved surface and metal layer structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM433058U true TWM433058U (en) | 2012-07-01 |
Family
ID=47136790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100223463U TWM433058U (en) | 2011-12-13 | 2011-12-13 | Conductive vias of three-dimensional curved surface and metal layer structure |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN202535641U (zh) |
TW (1) | TWM433058U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9499911B2 (en) | 2013-11-01 | 2016-11-22 | Industrial Technology Research Institute | Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure |
TWI561148B (en) * | 2012-07-24 | 2016-12-01 | Hon Hai Prec Ind Co Ltd | Housing and method for manufacturing the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108925048A (zh) * | 2018-07-18 | 2018-11-30 | 盐城维信电子有限公司 | 一种能避免通孔内空洞的cof柔性基板的制作方法及其产品 |
CN112996265A (zh) * | 2021-02-09 | 2021-06-18 | 盐城维信电子有限公司 | 一种无需补偿的精细线路板制作方法 |
-
2011
- 2011-12-13 TW TW100223463U patent/TWM433058U/zh not_active IP Right Cessation
-
2012
- 2012-02-15 CN CN2012200490153U patent/CN202535641U/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561148B (en) * | 2012-07-24 | 2016-12-01 | Hon Hai Prec Ind Co Ltd | Housing and method for manufacturing the same |
US9499911B2 (en) | 2013-11-01 | 2016-11-22 | Industrial Technology Research Institute | Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure |
US9683292B2 (en) | 2013-11-01 | 2017-06-20 | Industrial Technology Research Institute | Metal circuit structure |
Also Published As
Publication number | Publication date |
---|---|
CN202535641U (zh) | 2012-11-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4K | Expiration of patent term of a granted utility model |