TWM433058U - Conductive vias of three-dimensional curved surface and metal layer structure - Google Patents
Conductive vias of three-dimensional curved surface and metal layer structureInfo
- Publication number
- TWM433058U TWM433058U TW100223463U TW100223463U TWM433058U TW M433058 U TWM433058 U TW M433058U TW 100223463 U TW100223463 U TW 100223463U TW 100223463 U TW100223463 U TW 100223463U TW M433058 U TWM433058 U TW M433058U
- Authority
- TW
- Taiwan
- Prior art keywords
- metal layer
- curved surface
- layer structure
- conductive vias
- dimensional curved
- Prior art date
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100223463U TWM433058U (en) | 2011-12-13 | 2011-12-13 | Conductive vias of three-dimensional curved surface and metal layer structure |
CN2012200490153U CN202535641U (en) | 2011-12-13 | 2012-02-15 | Three-dimensional curved surface lead through hole and metal layer structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100223463U TWM433058U (en) | 2011-12-13 | 2011-12-13 | Conductive vias of three-dimensional curved surface and metal layer structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM433058U true TWM433058U (en) | 2012-07-01 |
Family
ID=47136790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100223463U TWM433058U (en) | 2011-12-13 | 2011-12-13 | Conductive vias of three-dimensional curved surface and metal layer structure |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN202535641U (en) |
TW (1) | TWM433058U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9499911B2 (en) | 2013-11-01 | 2016-11-22 | Industrial Technology Research Institute | Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure |
TWI561148B (en) * | 2012-07-24 | 2016-12-01 | Hon Hai Prec Ind Co Ltd | Housing and method for manufacturing the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108925048A (en) * | 2018-07-18 | 2018-11-30 | 盐城维信电子有限公司 | A kind of production method and products thereof being avoided that COF flexible base board empty in through-hole |
CN112996265A (en) * | 2021-02-09 | 2021-06-18 | 盐城维信电子有限公司 | Fine circuit board manufacturing method without compensation |
-
2011
- 2011-12-13 TW TW100223463U patent/TWM433058U/en not_active IP Right Cessation
-
2012
- 2012-02-15 CN CN2012200490153U patent/CN202535641U/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561148B (en) * | 2012-07-24 | 2016-12-01 | Hon Hai Prec Ind Co Ltd | Housing and method for manufacturing the same |
US9499911B2 (en) | 2013-11-01 | 2016-11-22 | Industrial Technology Research Institute | Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure |
US9683292B2 (en) | 2013-11-01 | 2017-06-20 | Industrial Technology Research Institute | Metal circuit structure |
Also Published As
Publication number | Publication date |
---|---|
CN202535641U (en) | 2012-11-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2731783A4 (en) | Methods of fabricating electronic and mechanical structures | |
TWI560746B (en) | Topography minimization of neutral layer overcoats in directed self-assembly applications | |
TWI560047B (en) | Surface treated copper foil | |
HK1203474A1 (en) | Surface modified nanoparticles | |
GB201104675D0 (en) | Methods of forming bonded structures and bonded structures formed thereby | |
EP2534684A4 (en) | Methods of forming contact structures including alternating metal and silicon layers and related devices | |
GB2505788B (en) | Structure and method of making graphene nanoribbons | |
HK1187964A1 (en) | Insulated metal substrate | |
EP2823079A4 (en) | Corrosion resistant and electrically conductive surface of metal | |
EP2695197A4 (en) | Recessed termination structures and methods of fabricating electronic devices including recessed termination structures | |
PL2780294T3 (en) | Sioc barrier layer to alkali metals and process of making | |
SG10201605299VA (en) | Anisotropy Reduction In Coating of Conductive Films | |
HK1203173A1 (en) | Multilayer film not comprising a metal layer and having a low surface weight | |
EP2525634A4 (en) | Substrate and method of manufacturing substrate | |
TWI563885B (en) | Transfer substrate for forming metallic wiring and method for forming metallic wiring with the use of the transfer substrate | |
EP2925378A4 (en) | Multi-functional surface coating of implants | |
EP2711177A4 (en) | Coating layer and method for forming coating layer | |
EP2724833A4 (en) | Surface structure of article | |
EP2661766A4 (en) | Conductive particle and method of manufacturing the same | |
EP2744460A4 (en) | Surface modification of medical devices to enhance endothelial adhesion and coverage | |
EP2660802A4 (en) | Three-dimensional metallic character and manufacturing method thereof | |
HUP1200447A1 (en) | Surface structure of enhanced friction for sports shoes and method for manufacturing it | |
EP2727134A4 (en) | Semiconductor substrate and method of forming | |
GB2495451B (en) | Method and structure to improve the conductivity of narrow copper filled vias | |
EP2882577A4 (en) | Single layer scattering of powder surfaces |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4K | Expiration of patent term of a granted utility model |