M430595 五、新型說明： 【新型所屬之技術領域】 本創作涉及一種散熱模組，尤係涉及一種對發熱電子元件 散熱之散熱模組。 【先前技術】M430595 V. New Description: [New Technology Field] This creation involves a heat dissipation module, especially a heat dissipation module that dissipates heat from electronic components. [Prior Art]
散熱模組中最重要之兩個熱傳機制是熱傳導及熱對流。熱 傳導是指分子間之能量交換’能量較少的分子與能量較多的分 子接觸後獲得能量（通過物理性的直接接觸），如果兩者間不 存在溫差（如一片獨立散熱片），則無法實現熱傳導。傳統之 散熱模組通常會於散熱片與熱源（半導體集成元件）之間增加 一導熱係數較高之熱介面材料，即TIM(Thermal interface terial)，使半導體集成元件所產生之熱能更有效地被傳導 到散熱片上。 ^對流係指透· f運動來實触傳遞，熱絲自於被氣 所包圍之熱源，並且透過分子移絲實現熱能傳遞於 傳i到ί:Φ半導體集成元件所產生之熱量最終會通過散熱片 中，依靠對流現象將熱能帶走。 數個散熱置除了複數個熱導管以外，其構成尚包括複 熱導管則《一 :固定座，散熱片通常採用鋁質或銅質材料， 座採銘的金屬f ’其内部填裝有工作液，固定 熱導管：因此又俗稱「銘底」或「銅底」。 熱部位貼觸，^Ί設計主要是以111定座與半導體元件的散 座傳導至熱導管斑f體几件的熱溫先傳導至固定座，再由固定 s /、散熱片，而達到散熱目的，因此，其熱溫傳 3 導係採間接方式，先通 效率較為緩慢。 …導^與散熱片，故 熱導=接絲置設計係由 熱段上形成二觸’熱導管於管身的受 作直接的面与龍2 U㈣讀表Φ之散熱區域 放熱段緊密接觸，通過散熱片將熱傳 2達到散熱目的。其中，固定座與熱導管的結合方式係在固定 ίίΙΤ議個與熱導管呈相互匹配的開放狀嵌槽，使執 導g匹配嵌入嵌槽，實施上係使賴具將熱 入嵌槽，將解管半裸包覆於_座，使熱導管的 於固定座底面’藉錢面與半導體元件的散熱部位的直接貼 觸’故不需離傳遞散熱，其散紐率非常快速。 又’因為熱導管與固定座材質不同’故焊結前必須事 ，鎳處理’以致整體加工複雜、成本增加、組裝不便，也不符 環保:尤其是所述散熱模_固定座均為—實心、金屬塊，故不 ，重量沉、體積大，且造成金屬耗量大、導致製造成本一直居 尚不下，因此已有產品省掉固定座，而直接將熱導管與散熱片 組合，形成無底座的散熱裝置。 然而，不管是熱導管匹配固定座嵌槽之散熱結構，或熱導 管與散熱片做組合，在實際使用上仍存在下述問題點。電腦上 最常見的發熱元件如顯示晶片（VGA)和中央處理器（CPU)，因為 製程的進步及材料成本的商業考量，發熱元件越來越薄，所以 當發熱元件設置於電路板時，周圍設有凸起且圍繞該發熱元件 的防壓元件。然而，如前面所述現有散熱模組中熱導管的受熱 段係一平的受熱面，如此，該熱導管上受熱段的受熱面將因為 ^95 防愿元件:=:::熱元件直接接觸。如再透過符合該 導熱塊與熱導管的受^熱元件表面接觸，再由該 以固定座與發熱元件熱模組設計 遞至教導管盥散敎Η道…、採間接方式先通過固定座再傳 ”…、片’導致熱傳導效能不彰，使散熱效率緩慢。 【新型内容】 播4献=為解決上述之缺點’本創作之主要目的在於提供一 且，，發熱元件周圍設有凸起之防 元件接觸之目的二熱達：^ 上述之目的，本創作提供一種散熱模組，其至少包括 成凸I的在於該些熱導管之受熱段的受熱面表面分別形 -接觸平二:’在该些受熱面緊密並排時，所有平台拼構成 接觸千σ，透職接觸平台貼合於—發熱元件表面。 中4些平σ拼構成之接觸平台的表面形狀與所述發孰 形’該些平台拼構成之接觸平台的表面康 所述發熱7L件表面積’或所述發熱元件表面積。 其中、亥些平台拼構成之接觸平台在所述發熱元件該周圍 二所==壓元件時’該接觸平台的表面積小於所述防壓元 本創作的優點在於，透過受熱面表面分別形成凸出的一平 ί，且所有平㈣構成—接觸平台朗述發熱元件表面接合， 虽發熱7G件周圍設有凸起之防壓元件圍繞時，每支熱導管都能 充分發揮效兴，遠 的，充分發ϊ轉 1鱗管百分之百直接與發熱元件接觸之目 、吟導的效能0 【實施方式】 下 關本創作之詳細說明及技術内容，現配合圖式說明如 5月參閱圖1为闻π 熱模組100,至=本創作實施例之示意圖。本創作之散 該些熱導管丨^ I括複數散熱鰭片110及複數個熱導管120, 與散i缺ί ί有受熱段121及放熱段122，其放熱段122 排用⑽’且受餘121機_緊密並 121可直接隨，、，、疋件（圖中未示）進行熱傳導。其中受熱段 110^® 1,^), 銅質材料;二2鄰併列而形成，實施上通常採用銘質或 121 .爲埶政‘、、、則U〇在底側成形凹部容設該些受熱段 散熱鰭m1亦1固接於—固定座i3G的凹部内，而該些 122與散熱韓片:相連接(如圖2所示)。而放熱段 :該些並列的散熱歸片U。上，或固接於固定座13=; 與方法，為已知技術，且非本專利重點，在此不多加上^式 本創作之特徵在於該些熱導管120之受熱段121的受執面 m表面分別形成凸出的一平台，在該些受熱自⑵緊密 並排時，所有平台1231拼構成一接觸平台124與所述發埶元 件表面接合。 μ 請再參照圖3，散熱模組1〇0在實際應用上，當所述發埶 元件200設置於電路板_時，為了保護發熱元件·，該^ M430595 熱元件200周圍設有凸起之防壓元件31〇。透過本創作之受熱 面123表面分別形成凸出的平台1231，且透過所有平台1231 拼構成的接觸平台124與所述發熱元件2〇〇表面接合，當發熱 π件200周圍設有凸起之防壓元件31〇圍繞時，不管受熱段 121並列後的受熱面丨23有多大，藉由該接觸平台124，每支 熱導管120都能充分發揮效益’達到熱導管百分之百直接與發 熱元件接觸之目的，充分發揮熱傳導的效能。 應用上，該些平台1231拼構成的接觸平台124表面形狀 • 與所述發熱元件表面形狀相同，且該些平台1231拼構成之接 觸平台124的表面積等於所述發熱元件2〇〇表面積，或該些平 台1231拼構成之接觸平台124的表面積大於所述發熱元件2〇〇 表面積，但該接觸平台124的表面積小於所述防壓元件31〇所 圍面積。 本創作在上文中已以較佳實施例揭露，然熟習本項技術者 應理解的是，該實施例僅用於描繪本創作，而不應解讀為限制 本創作之範圍。應注意的是，舉凡與該實施例等效之變化與置 鲁 換，均應設為涵蓋於本創作之範缚内。因此，本創作之保護範 圍當以下文之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為本創作實施例之示意圖。 圖2為本創作另一實施例之示意圖。 圖3係本創作實施之剖面示意圖。 【主要元件符號說明】 1〇〇 :散熱模組 7 M430595 110 :散熱鰭片 120 :熱導管 121 :受熱段 122 :放熱段 123 :受熱面 1231 :平台 124:接觸平台 130 :固定座 φ 200 :發熱元件 300 :電路板 310 :防壓元件The two most important heat transfer mechanisms in the thermal module are heat transfer and thermal convection. Heat conduction refers to the exchange of energy between molecules. 'Low-energy molecules get energy after contact with more energetic molecules (through physical direct contact). If there is no temperature difference between the two (such as a separate heat sink), then Achieve heat transfer. The conventional heat dissipation module usually adds a thermal interface material with a higher thermal conductivity between the heat sink and the heat source (semiconductor integrated component), that is, TIM (Thermal interface terial), so that the heat generated by the semiconductor integrated component is more effectively Conducted to the heat sink. ^The convection system refers to the transmission of the f·f motion to the real touch. The hot wire is from the heat source surrounded by the gas, and the heat transfer is transmitted through the molecular transfer wire. The heat generated by the Φ semiconductor integrated component will eventually pass through the heat dissipation. In the film, the heat is taken away by the convection phenomenon. A number of heat sinks are provided in addition to a plurality of heat pipes, and the composition includes a reheating pipe. "One: a fixed seat, the heat sink is usually made of aluminum or copper material, and the metal f of the seat is filled with a working fluid. , fixed heat pipe: it is also commonly known as "Ming Bottom" or "Bronze Bottom". The hot part is in contact with the hot part, and the design is mainly to conduct the heat conduction of the fixed part of the semiconductor component to the heat pipe spot, and then to the fixed seat, and then fix the s /, heat sink to achieve heat dissipation. Therefore, the heat-transfer 3 guide system adopts an indirect method, and the first pass efficiency is relatively slow. ... guides and heat sinks, so the thermal conductivity = wire design is formed by the two-touch 'heat pipe on the hot section of the tube directly contact with the dragon 2 U (four) reading table Φ heat dissipation area of the heat release section, Heat transfer 2 through the heat sink for heat dissipation purposes. Wherein, the fixing seat and the heat pipe are combined in a fixed manner, and an open fitting groove matching the heat pipe is matched, so that the guiding g is matched with the embedded groove, and the upper system is configured to make the heat sink into the groove, and the solution is solved. The tube is semi-naked and covered on the _ seat, so that the heat pipe is directly contacted with the heat-dissipating portion of the semiconductor component on the bottom surface of the fixed seat, so that the heat dissipation is not required, and the scatter rate is very fast. 'Because the heat pipe is different from the material of the fixed seat, so it must be done before welding, nickel treatment' so that the overall processing is complicated, the cost is increased, the assembly is inconvenient, and it is not environmentally friendly: especially the heat-dissipating mold _ fixed seat is - solid, Metal blocks, so no, heavy weight, large volume, and large metal consumption, resulting in manufacturing costs have not been maintained, so the existing products save the fixed seat, and directly combine the heat pipe and the heat sink to form a baseless Heat sink. However, whether the heat pipe is matched with the heat sink structure of the fixing bracket or the heat pipe is combined with the heat sink, the following problems still exist in practical use. The most common heating components on a computer, such as display chips (VGA) and central processing unit (CPU), are hotter and thinner due to advances in process and commercial considerations of material costs, so when the heating elements are placed on the board, around A pressure-proof member that is raised and surrounds the heat generating component is provided. However, as in the prior art, the heat receiving section of the heat pipe is a flat heating surface, and thus, the heat receiving surface of the heat receiving section of the heat pipe will be directly contacted by the ^95 anti-wear component: =::: heat element. If the contact between the heat-conducting block and the heat-conducting component of the heat-conducting component is in contact with the heat-conducting block, the thermal module is designed to be transferred to the teaching tube, and the indirect method is first passed through the fixing seat. Passing "..., film" leads to poor heat transfer efficiency, making heat dissipation slow. [New content] Broadcast 4 offer = to solve the above shortcomings' The main purpose of this creation is to provide a bump around the heating element. The purpose of preventing contact with the element is: 2, the purpose of the present invention is to provide a heat dissipating module which comprises at least a convex I in the surface of the heated surface of the heated section of the heat pipe, respectively, in contact with the flat surface: When the heated surfaces are closely arranged side by side, all the platforms are assembled to form a contact sigma, and the through-contact platform is attached to the surface of the heating element. The surface shape of the contact platform formed by the four flat sigma and the hairpin shape are The surface of the contact platform formed by the platform is composed of the surface area of the heat generating 7L or the surface area of the heating element. Among them, the contact platform formed by the platform of the sea is surrounded by the heating element. In the case of the component, the surface area of the contact platform is smaller than that of the pressure-proof component. The advantage of the creation of the heat-receiving surface is that a flat embossing is formed through the surface of the heat-receiving surface, and all the flat (four) constituent-contacting platforms describe the surface of the heating element, although the heat is 7G. When there are raised pressure-proof components around the parts, each heat pipe can fully exert its effect, far, fully turn the 1 scale pipe to 100% direct contact with the heating element, the efficiency of the guide 0 [implementation] The following is a detailed description of the creation and technical content of the present creation. Now, please refer to Figure 1 for a description of the π thermal module 100 in May, to the schematic diagram of the present creation embodiment. ^ I includes a plurality of heat-dissipating fins 110 and a plurality of heat pipes 120, and a heat-receiving section 121 and a heat-dissipating section 122, the heat-dissipating section 122 is arranged with (10)' and the remaining 121 machine_tight and 121 can directly follow , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The heat-dissipating fins m1 are also fixed in the recess of the fixing seat i3G, and the 122s are connected to the heat-dissipating film: as shown in Fig. 2. The heat-dissipating section: the parallel heat-dissipating pieces U. Up, or fixed to the fixed seat 13=; and the method, which is a known technique, and which is not the focus of this patent, is not limited here. The present invention is characterized by the acceptance of the heated section 121 of the heat pipes 120. The m surfaces respectively form a protruding platform. When the heat is tightly side by side (2), all the platforms 1231 are formed to form a contact platform 124 to be bonded to the surface of the hairpin element. μ Referring again to FIG. 3, the heat dissipation module 1〇 0 In practical applications, when the hairpin element 200 is disposed on the circuit board _, in order to protect the heat generating component, the M430595 thermal component 200 is provided with a raised pressure-proof component 31〇. A convex platform 1231 is formed on the surface of the heated surface 123 of the present invention, and a contact platform 124 formed by all the platforms 1231 is joined to the surface of the heating element 2, and a protrusion is provided around the heating element π. When the pressing member 31 is surrounded, no matter how large the heating surface 23 after the heat receiving portion 121 is juxtaposed, each of the heat pipes 120 can fully utilize the contact platform 124 to achieve the purpose of directly contacting the heat pipe with the heat generating component. Give full play to the effectiveness of heat transfer. In application, the surface shape of the contact platform 124 formed by the platforms 1231 is the same as the surface shape of the heating element, and the surface area of the contact platform 124 formed by the platforms 1231 is equal to the surface area of the heating element 2, or The surface area of the contact platform 124 formed by the platforms 1231 is larger than the surface area of the heating element 2, but the surface area of the contact platform 124 is smaller than the area enclosed by the pressure-proof element 31. The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and modifications that are equivalent to the embodiment are intended to be within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application below. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of an embodiment of the present invention. 2 is a schematic diagram of another embodiment of the present creation. Figure 3 is a schematic cross-sectional view of the present implementation. [Main component symbol description] 1〇〇: heat dissipation module 7 M430595 110: heat dissipation fin 120: heat pipe 121: heat receiving section 122: heat release section 123: heat receiving surface 1231: platform 124: contact platform 130: fixing seat φ 200 : Heating element 300: circuit board 310: pressure-proof element